27 10 10 19 3 0.54 2.61 HEAT SPREADER SEE DETAIL PAGE 7 A1 DUMMY DIE TOP VIEW 27 A A M. Hart 10/3/2016 10/3/2016 QA DAISY CHAIN DUMMY SHEET 1 OF 16 T.Au DATE CUST MFG ENG REVISED DRAWN A 512595 A SCALE REV DRAWING NO. SIZE TITLE DO NOT SCALE DRAWING APPROVALS SBGA625T1.0C-DC259D 2.5:1 R Z AD P T AB 5) PAD Cu DIAMETER: 0.635mm [25 mil]. 4) SOLDER MASK DEFINED PAD OPENING: 0.508mm [20mil]. 6) SUBSTRATE MATERIAL: FR4 (OPTIONAL BT). 8) DAISY CHAIN PATTERN (SEE PAGE 2). 7) DUMMY DIE: Si (SILICON). 9) MSL-3 RECOMMENDED BAKING 24 HOURS @ 125 REMOVE MOISTURE PRIOR TO SOLDERING TO PC BOARD. C TO Notes: (Unless Otherwise Specified). 3) BALL DIAMETER (BEFORE REFLOW) 0.635mm [25 mil]. 1) ALL DIMENSIONS ARE IN MM. 2) SOLDER BALL ALLOY: SEE PART NUMBER TABLE. PART NUMBER TABLE PART NUMBER BALL METAL BALL ALLOY RoHS Si DIE SBGA625T1.0C-DC259D Sn96.5/Ag3.0/Cu0.5 SAC305 YES YES SBGA625T1.0-DC259D Sn63/Pb37 Sn63 NO YES METAL TOP DUMMY DIE SECTION A-A 0.80 2.07 1.27 Ball Before Reflow 0.635 0.762 1.0 U AA 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 B C H G K M L N V 25 F J AC W A E D Y BALL VIEW 1.5 1.0 0.63 24 24 1.5
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27
10
10
19
3
0.54
2.61
HEAT SPREADERSEE DETAILPAGE 7
A1 DUMMY DIE
TOP VIEW
27
A A
M. Hart
10/3/2016
10/3/2016
QA
DAISY CHAIN DUMMY
SHEET 1 OF 16
T.Au
DATE
CUST
MFG
ENG
REVISED
DRAWN
A512595ASCALE REVDRAWING NO.SIZE
TITLE
DO NOT SCALE DRAWING
APPROVALS
SBGA625T1.0C-DC259D
2.5:1
R
Z
AD
P
T
AB
5) PAD Cu DIAMETER: 0.635mm [25 mil]. 4) SOLDER MASK DEFINED PAD OPENING: 0.508mm [20mil].
6) SUBSTRATE MATERIAL: FR4 (OPTIONAL BT).
8) DAISY CHAIN PATTERN (SEE PAGE 2). 7) DUMMY DIE: Si (SILICON).
9) MSL-3 RECOMMENDED BAKING 24 HOURS @ 125 REMOVE MOISTURE PRIOR TO SOLDERING TO PC BOARD.
1) ALL DIMENSIONS ARE IN MM. 2) SOLDER BALL ALLOY: SEE PART NUMBER TABLE.
PART NUMBER TABLE PART NUMBER BALL METAL BALL ALLOY RoHS Si DIE
SBGA625T1.0C-DC259D Sn96.5/Ag3.0/Cu0.5 SAC305 YES YESSBGA625T1.0-DC259D Sn63/Pb37 Sn63 NO YES
METAL TOP DUMMY DIE
SECTION A-A
0.80
2.07
1.27
Ball Before Reflow0.635
0.762
1.0
U
AA
12
34
56
78
910
1112
1314
1516
1718
1920
2122
2324
BC
HG
K
ML
N
V
25
F
J
AC
W
A
ED
Y
BALL VIEW
1.5
1.0 0.63
24
24 1.5
Notes: (Unless Otherwise Specified). 1) PCB BOARD DIMENSIONS ARE PRESENTED ONLY AS A GUIDELINE DESIGNERS SHOULD USE THEIR OWN KNOWLEDGE WHEN DESIGNING THE PCB. 2) PCB Cu BALL PAD DIAMETER: 0.450 [25 mil]. 3) PCB DAISY CHAIN TRACING LINE WIDTH: 0.152 [6mil]. 4) SMD (SOLDERMASK DEFINED) PAD OPENING: 0.508mm [20mil].