Top Banner
PCB Symposium Raleigh 2011 ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1 , Michael Haag 2 , Joe Kuczynski 3 , Markus Schmidt 2 , Michael Wahl 4 , Johannes Windeln 2 1 IBM Systems & Technology Group, 9000 S Rita Rd, Tucson AZ 85744-0002, [email protected] 2 IBM Deutschland MBS GmbH, Hechtsheimer Str. 2, D-55131 Mainz, [email protected] 3 IBM Systems & Technology Group, 3605 Hwy 52 N, Rochester MN 55901-1407, [email protected] 4 IFOS GmbH, Trippstadter Straße 120, D-67663 Kaiserslautern, [email protected]
20

ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

Jul 27, 2018

Download

Documents

vuongquynh
Welcome message from author
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
Page 1: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

ToF-SIMS analysis of glass fiber clothsfor PCB manufacturing

Dylan Boday1, Michael Haag2, Joe Kuczynski3, Markus Schmidt2, Michael Wahl4, Johannes Windeln2

1 IBM Systems & Technology Group, 9000 S Rita Rd, Tucson AZ 85744-0002, [email protected] IBM Deutschland MBS GmbH, Hechtsheimer Str. 2, D-55131 Mainz, [email protected] IBM Systems & Technology Group, 3605 Hwy 52 N, Rochester MN 55901-1407, [email protected] IFOS GmbH, Trippstadter Straße 120, D-67663 Kaiserslautern, [email protected]

Page 2: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 2

content

• PCB (Printed Circuit Board) structure

• glass cloth conditioning

• motivation for ToF-SIMS analysis

• analytical setup

• ToF-SIMS results

• summary and outlook

Page 3: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 3

PCB structure

prepregs

cores

copper lines

heat, pressure

heat, pressure

prepregs: glass fiber cloth pre-impregnated with resin matrix

cores: cured glass cloth/resin composite with structured copper layer(s)

multi-functionality of composite (glass cloth, resin and optional filler)- mechanical properties (strength, CTE...)- dielectric properties (insulation, impedance...)

pictures source: www.lpkf.de

Page 4: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 4

glass cloth conditioning

glass fibers pre-treated with Silanes for- improved surface wetting (contact angle reduction)- improved matrix adhesion (organofunctional group R to match matrix resin)

Page 5: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 5

process steps critical with regard to Silanation:- starch size required for yarn processing- pyrolytic de-sizing (thorough?)- Silanation process

source: JPS Composite Materials(wet) application of Silanes

application of starch sizing

pyrolytic de-sizing

glass cloth conditioning

Page 6: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 6

motivation for ToF-SIMS analysis

CAF: Copper Anodic FilamentThermal cracks:

pictures source: Dynamic Details Inc.

SEM micrograph: IBM

challenges for modern high performance boards- increasing # of copper layers (�40 and above)- decreasing line width and spacing (� 50µm and below)- RoHS (Pb-free solder; solder process + 20K, new resins)

���� known sporadic failures become epidemic!

Page 7: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 7

motivation for ToF-SIMS analysis

TGA and SEM/EDX results of analysed glass clothindicate presence of undesired material

expected weight loss < 0.1%!

organic debris

TGA analysis and SEM micrographs: IBM

Page 8: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 8

ToF-SIMS

Time-of-Flight Secondary Ion Mass Spectrometry

(Sample)

extractor accelerates secondary ions to:

mass dispersion via ion flight time:

UqE ⋅=

Uq2

ms

v

st

m

Uq2

m

E2v

⋅==⇒

==

Page 9: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 9

analytical setup

Method: ToF-SIMS static and dynamic mode

Tool: ION-TOF IV at , Germany

Primary ions: 25keV Bi3+ (clusters to promote molecular secondary ions)

Samples: various samples of glass cloth –supposedly de-sized and coated with coupling agent

2116C6

0106C5

2113C4

1080C3

1080B2

2116A1#

clothsuppliersample

Page 10: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 10

ToF-SIMS - static mode

raw spectra

significant differences especially in the hi-mass region

#6 #6#6

Page 11: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 11

dynamic mode to distinguish between signals from

surface coverage and bulk material

surface coverage

glass bulk

sputter

removal

sputter

removal

ToF-SIMS - dynamic mode

Page 12: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 12

ToF-SIMS – first results

� ToF-SIMS imaging capability(microscopic picture 300µmx300µm „in the light of an ion mass“)

� major signals assigned to one of 4 peak groups with commonappearance and behaviour

group A: group B: group C: group D:

Page 13: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 13

ToF-SIMS – peak groups

group A (glass constituents)

� laterally homogeneous signal

� glass constituents (Li, B, Mg, Al, Si, Ca, Ti, Na, K)

� signal increased after sputter removal of surface layer (≈30nm)� confirms glass constituent

different:

� Na and K: signal increase after sputter on #7,signal decrease on #1 � sizing component?

after sputter removalof surface layer:

Page 14: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 14

ToF-SIMS – peak groups

group B (inhomogeneity I)

� signal limited to prominent portions of single fibers

� Sulfate component

� signal decreased after sputter removal of surface layer (≈30nm) � confirms surface coverage

residues from sizing or just abrasion debris from plastic bag?

after sputter removalof surface layer:

Page 15: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 15

ToF-SIMS – peak groups

group C (homogeneous organics)

� laterally homogeneous signal

� mainly hydrocarbons (C7H7, C9H7, C9H9, C10H8)

� phosphate component

� signal decreased after sputter removal of surface layer (≈30nm) � surface coverage

coupling agent?

after sputter removalof surface layer:

Page 16: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 16

ToF-SIMS – peak groups

group D (inhomogeneity II)

� signal confined to small areas on single fibers

� fragmentation pattern match: Erucamide (m=337)

� signal decreased after sputter removal of surface layer (≈30nm) � surface coverage

coupling agent or residues from sizing?

after sputter removalof surface layer:

Page 17: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 17

ToF-SIMS – second run

Method: ToF-SIMS static and dynamic mode

Tool: ION-TOF IV at , Germany

Primary ions: 25keV Bi3+ (clusters to promote molecular secondary ions)

Samples: 1. 2116 glass cloth w/ Silane treatment (supplier‘s claim)

- as received- heat cleaned (matching pyrolytic de-sizing)

- UV-ozone cleaned (details undisclosed)

2. pellet of glass raw material (as used to pull fibers for 2116)

analyzed as a reference- as receiced- on freshly fractured surface- on sputter cleaned surface

Page 18: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 18

first results

NO SiCH3O+ as reported by Norrmann et al (J. Mass Spectrom. 2002, 37, 695-708)

NO other SiC complexes

potentially Silane related: CxHy+ and CxHyO

+

but no change after heat and UV ozone treatment!

Glass cloth

analyses

1,0E+01

1,0E+02

1,0E+03

1,0E+04

1,0E+05

CH

_3

+

C_

2H

_3

+

C_

2H

_5

+

C_

3H

_5

+

C_

3H

_7

+

C_

4H

_7

+

C_

4H

_9

+

C_

5H

_7

+

C_

5H

_9

+

C_

2H

_3

O+

C_

3H

_3

O+

C_

3H

_5

O+

element / fragment

sig

na

l

heat treated

UV ozone

as received

Page 19: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 19

first results

potentially Silane related species CxHy+ and CxHyO

+

also present on bulk reference sample!

����adsorbates from the ambient

Glass pellet

analyses

1,0E+00

1,0E+02

1,0E+04

1,0E+06

C_

2H

_3

+

C_

2H

_5

+

C_

3H

_5

+

C_

3H

_7

+

C_

4H

_7

+

C_

4H

_9

+

C_

5H

_7

+

C_

5H

_9

+

C_

2H

_3

O+

C_

3H

_3

O+

C_

3H

_5

O+

element/fragment

sig

na

l

fracture surface

sputter cleaned

as received

Page 20: ToF-SIMS analysis of glass fiber cloths for PCB manufacturing · ToF-SIMS analysis of glass fiber cloths for PCB manufacturing Dylan Boday 1, Michael Haag 2, Joe Kuczynski 3, Markus

PCB Symposium Raleigh 2011

11/11/11 20

summary and outlook

new ToF-SIMS application in reverse engineering:

Silane treatment of glass fibre cloth

first results on supplier samples:

NO Silane related secondary ions detected

� functionalized surface not as desired- Silanes either not present

- or only physisorbed instead of chemisorbed(due to insufficient fibre treatment)

next steps:

�work with supplier to improve Silanation process

�Is “pad cratering” part of the same problem?

�Is this the time to involve „computational materials science“?