TLV320AIC3268EVM-U Evaluation Module (Rev. A)

User's GuideSLAU564A–February 2014–Revised February 2014

TLV320AIC3268EVM-U Evaluation Module

This User’s Guide describes the operation, use, and features of the TLV320AIC3268EVM-U. Forquestions and support go to the E2E forums (e2e.ti.com).

The main contents of this document are:• Hardware descriptions and implementation• Start up procedure using PurePath™ Console 2 (PPC2) software with the AIC3268 plug-in

Table 1. Related DocumentsDocument Title Literature Number

TLV320AIC3268 Data Sheet SLAS953PurePath Graphic Development Suite PurePath Console

Contents1 Features ...................................................................................................................... 22 Introduction .................................................................................................................. 2

2.1 Electrostatic Discharge Warning ................................................................................. 22.2 Unpacking the EVM ................................................................................................ 3

3 Getting Started .............................................................................................................. 44 PurePath Console 2 Software ............................................................................................. 4

4.1 Installation ........................................................................................................... 44.2 Graphical User Interface (GUI) ................................................................................... 5

5 TLV320AIC3268EVM-U Default Jumper Locations .................................................................... 76 TLV320AIC3268EVM-U EVM Schematics .............................................................................. 87 TLV320AIC3268EVM-U EVM Board Layout ........................................................................... 178 TLV320AIC3268EVM-U Bill of Materials ............................................................................... 199 Writing Scripts .............................................................................................................. 22

List of Figures

1 TLV320AIC3268EVM-U Top Board Photo .............................................................................. 32 TLV320AIC3268EVM-U Bottom Board Photo........................................................................... 33 Main Panel ................................................................................................................... 54 Register Inspector Window ................................................................................................ 65 TLV320AIC3268RGC Block Diagram .................................................................................... 86 TAS1020BPFB USB Controller ........................................................................................... 97 Sample Rate Converters for ASIs ....................................................................................... 108 GPIO and MCLK for AIC3268 ........................................................................................... 119 LDO Supplies and Analog Outputs ..................................................................................... 1210 TLV320AIC3268 Schematic.............................................................................................. 1311 Audio Connectors ......................................................................................................... 1412 I2C Translation and Selection ............................................................................................ 1513 Breakout Board Connections ............................................................................................ 1614 Top Xray View ............................................................................................................. 17

PurePath is a trademark of Texas Instruments.Windows is a registered trademark of Microsoft Corporation.

1SLAU564A–February 2014–Revised February 2014 TLV320AIC3268EVM-U Evaluation ModuleSubmit Documentation Feedback

Copyright © 2014, Texas Instruments Incorporated

http://e2e.ti.com

http://www.ti.com/lit/pdf/SLAS953

http://www.ti.com/tool/purepathconsole

http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU564A

Features www.ti.com

15 Silkscreen Top ............................................................................................................. 1716 Silkscreen Bottom ......................................................................................................... 18

1 Features• Full featured EVM with the TLV320AIC3268 Audio Codec• USB connection to PC provides power, control and streaming audio for quick evaluation• Easy-to-use PurePath Console 2 software provides graphical user interface to configure and control

AIC3268

2 IntroductionThis specific evaluation module (EVM) is a programmable USB audio device that features theTLV320AIC3268 Audio Codec with miniDSP.

2.1 Electrostatic Discharge WarningMany of the components on the EVM are susceptible to damage by electrostatic discharge (ESD). Usersare advised to observe proper ESD handling precautions when unpacking and handling the EVM,including the use of a grounded wrist strap at an approved ESD workstation.

CAUTIONFailure to observe ESD handling procedures can result in damage to EVMcomponents.

2 TLV320AIC3268EVM-U Evaluation Module SLAU564A–February 2014–Revised February 2014Submit Documentation Feedback


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www.ti.com Introduction

2.2 Unpacking the EVMOn opening the TLV320AIC3268EVM-U package, ensure that the following item is included:• One TLV320AIC3268EVM-U board using one TLV320AIC3268 (Figure 1 and Figure 2)

If either of the board or the TLV320AIC3268 device is missing, contact the Texas Instruments ProductInformation Center to inquire about a replacement.

Figure 1. TLV320AIC3268EVM-U Top Board Photo

Figure 2. TLV320AIC3268EVM-U Bottom Board Photo



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Getting Started www.ti.com

3 Getting Started

1. Request and download the PPC2 software located in the EVM product folder on the web.2. Connect the EVM to USB port, LED lights LED1 and LED2 should illuminate once the EVM is detected

by Windows® PC. Also, in the Windows Device Manager, the EVM should be recognized as a USBcomposite device, a USB audio device and an HID-compliant device.

3. Connect headphones to jack J7, labeled HP OUT.4. Open PPC2 and in the Command Buffer Interface select Open.5. Download the most up-to-date scripts from the product folder. Navigate to that folder and select script

1.1 and click Execute.6. Play audio through any media tool. Make sure that the playback (and recording) device is USB-

AudioEVM in the Windows control panel.• To adjust playback volume, open Sound in control panel, select the USB-AudioEVM device and

click Properties.• Similarly, the other example configurations can be tried and sound can be recorded using the

microphone available on the board.7. Install jumpers on the EVM as per the requirements to make the right signal connections.

4 PurePath Console 2 Software

4.1 Installation

1. Request and download the PPC2 software located in the TLV320AIC3268 product folder.2. Open the self-extracting installation file, and extract contents to a known folder.3. Install the software by double clicking the setup executable and follow the directions.4. Connect the EVM to a USB port using a micro-USB cable and open PurePath Console 2. If prompted,

select the appropriate EVM name.



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www.ti.com PurePath Console 2 Software

4.2 Graphical User Interface (GUI)

4.2.1 Main panel windowThe main panel, shown in Figure 3, provides direct access to the I2C settings of the AIC3268. On themain panel, users can configure the registers through the single byte write and read or through theCommand Buffer Interface. The analog setup, digital setup, audio inputs, audio outputs, DRC, AGC, SARand headset detection can be configured through this interface.

The EVM status, which reflects the hardware connection of the EVM, is shown on the bottom left of themain panel.

Figure 3. Main Panel

4.2.2 Typical ConfigurationIn the product folder there are example scripts for typical playback and record applications. Theseconfigurations are used through the Command Buffer Interface.

4.2.3 I2C LoggerThe Command Buffer Interface communicates with the TLV320AIC3268 using a simple scripting language(described in Section 9). The TAS1020B USB controller handles all communication between the PC andthe codec. A script is loaded into the command buffer, either by loading a script file using the Open buttonor by pasting text from the clipboard. Click Run to execute the command buffer.

To record the I2C communication between the PC and the device, there is an I2C Logger in the bottomright of the GUI. The I2C Logger records all register writes sent to the codec when the Logging box ischecked. The recorded register values along with their page numbers are displayed in the I2C LoggerWindow. Pressing the Clear button clears the content of the logger.



http://www.ti.com


PurePath Console 2 Software www.ti.com

4.2.4 Register Inspector

Figure 4. Register Inspector Window

The contents of the TLV320AIC3268 register map can be accessed through the Registers tab in PPC2.The Page number control selects the page to be displayed in the register table. The register table containsinformation such as register name, current register value and the bit field of the current register value.Specify the page number when using the register inspector table. Once the page is specified, the registervalue can then be inspected or changed by either entering the hex value of the register or changing thecorresponding bits for that register.



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www.ti.com TLV320AIC3268EVM-U Default Jumper Locations

5 TLV320AIC3268EVM-U Default Jumper Locations

Table 2 displays the default jumper location information.

Table 2. Default Jumper LocationsJumper Position Jumper Position

JP1 Shorted JP31 Shorted

JP2 Shorted JP32 Shorted

JP3 Open JP33 1-2

JP4 2-3 JP34 1-2

JP5 2-3 JP35 Shorted


JP7 2-3 JP37 1-2

JP8 2-3 JP38 2-3


JP10 2-3 JP40 2-3


JP12 2-3 JP42 Open

JP13 2-3 JP43 Open

JP14 2-3 JP44 2-3


JP16 2-3 JP46 Open

JP17 2-3 JP47 Open



JP20 1-2 JP50 1-2

JP21 1-2 JP51 1-2

JP22 1-2 JP52 Open

JP23 1-2 JP53 Open

JP24 Shorted JP54 Open



JP27 Open JP57 Open

JP28 Open JP58 Open


JP30 Shorted



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AIP013C_Schematic.sbkDESIGN LEAD

PAGE INFO:

FILENAME

DATE OF

DRAWN BY

SHEET

PCB REV

SCH REV

TI

TLV320AIC3268RGC EVALUATION BOARD

1

I2S #3

AUDIO INTERFACE

I2S #2

AUDIO INTERFACE

B

A

I2S #1

AUDIO INTERFACE

OPTICAL

AUDIO OUTPUTSRC #1

OPTICAL

AUDIO INPUT

ANALOG

OUTPUTS

USB CONTROLLER

I2C & SPI

CONTROL INTERFACE

CONTROLAUDIO

I2C

I2C & SPI

ASI#1

ASI#2

SRC4392

TAS1020B

6 WIRE

AUDIO I/F

SRC4392

I2COPTICAL

AUDIO INPUT

SRC #2OPTICAL

AUDIO OUTPUT

A

B

ASI#3

ANALOG

INPUTS

TLV320AIC3268

QFN, Top View

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

3249

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

GP

IO3

IOV

DD

1_33

MIS

O

SP

I_S

ELE

CT

SD

A_M

OS

I

GP

IO5

I2C

_A

DD

R/S

CLK

SC

L_S

SZ

DV

DD

_18

IOV

DD

1_33

RE

SE

TZ

WC

LK

1

GP

IO2

DO

UT

1

DIN

1

GP

IO1

WCLK2

DIN2

IOVDD2_33

DVDD_18

GPIO4

BCLK2

DOUT2

DVSS

DVSS

DVDD_18

VBAT

SPK_V

SPKM

SVDD

SPKP

AVDD4_18

MIC

BIA

S_E

XT

MIC

BIA

S

RE

CP

RE

CV

DD

_33

RE

CM

AV

DD

2_18

HP

R

HV

DD

_18

HP

L

HP

VS

S_S

EN

SE

VN

EG

CP

FC

M

CP

FC

P

CP

VD

D_18

LO

L

LO

R

MICBIAS_VDD

MICDET

AVDD1_18

IN4L

IN4R

VREF_SAR

VREF_AUDIO

IN1L_AUX1

IN1R_AUX2

IN3L

IN3R

IN2R

IN2L

AVDD_18

MCLK

BCLK1

VSS

BLOCK DIAGRAM

333435363739 38404142434445464748

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

TLV320AIC3268EVM-U EVM Schematics www.ti.com

6 TLV320AIC3268EVM-U EVM SchematicsThe schematics for the TLV320AIC3268EVM-U are shown in Figure 5 through Figure 12.

Figure 5. TLV320AIC3268RGC Block Diagram



http://www.ti.com


RESETz

TAS_MCLK

TAS_WCLK

TAS_MISO

TAS_MOSI

TAS_SSz

TAS_SCLK

I2S_ENABLE

TAS_SDA

TAS_BCLK

TAS_DIN

TAS_SCL

ASI_S0

ASI_S1

I2S3_DOUT_SRC

DUT_RESETz

TAS_DOUT

I2S2_DOUT_SRC

I2S1_DOUT

+5V

GNDGND GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND GND

GND

GND

GND

1.50k

R1

27.4

R2

27.4

R3

47pF/50V

C1

47pF/50V

C2

100kR4

1.0uF/16V

C321

S4

0.1uF/16V

C4

0.1uF/16V

C5

LVC1G126DBVR

VCCOE

A

GND

1

2

4

5

3

U30.1uF/16V

C7

0.1uF/16V

C8

1 2S1

0.1uF/50V

C9

10kR5

10kR6

21S2

0.1uF/16V

C10

0.1uF/50V

C11

1 2S3

10kR7

LED1

Yellow

649R8

LED2

Yellow

649R9

10kR10

21

EE Program

JP2

0.1uF/16V

C13

R11

3.09k

1000pF/50V

C14

100pF/50V

C15

10kR12

2.7kR13

2.7kR14

1

2

JP3

0.1uF/50V

C16

10kR15

4.7kR16

1

JP12

GND

4.7kR17

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JOHN FEDAK IV

JANUARY 31, 2014


PAGE INFO:

FILENAME

DATE OF

DRAWN BY

SHEET

PCB REV

SCH REV

+3.3VIO

+3.3VIO

+3.3VIO +3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

FB5

220ohms/2A

FB6

220ohms/2A

1

2

3

4

5

J1

Data+

GND

ID_NC

5v

Data-

+3.3VIO

1

2 3

4Y1

6.0MHz

Vcc

OUT

OE

GND

+3.3VIO

GND

C6

0.1uF/16V

+3.3VIO

GND

U5

PowerPAD24FC512-I/MF

GND

GND

C12

0.1uF/16V

+3.3VIO

+3.3VIO

+3.3VIO

U4

CBTLV3253DBQ

1

2

3

4

5

6

7 10

11

12

13

14

15

16

24FC512-I/MF

1

2

3

4 5

6

7

8U5

GND

+3.3VIO

GND

TAS1020BPFB

U2

(ADC Data)

7

8

9

10

11

12

6

5

4

3

2

1

25

26

27

28

29

30

31

32

33

34

35

36

TAS1020B USB HOST ADAPTER


USB CONTROLLER 2

(DAC Data)

DUT RESET

APP

PATCH

USB RESET

USB INPUT

13 14 15 16 17 18 19 20 21 22 23 2413 14 15 16 17 18 19 20 21 22 23 24

373839404142434445464748

8 9

Y

TI

www.ti.com TLV320AIC3268EVM-U EVM Schematics

Figure 6. TAS1020BPFB USB Controller



http://www.ti.com


SRC1_RXCXO

SRC2_MCLK

SRC1_RDYz

TAS_SCL

TAS_SDA

RESETz

SRC1_MCLK

WCLK2

BCLK2

DIN2

SRC1_LOCKz

I2S2_DOUT_SRC

SRC2_RXCXO

SRC1_MCLK

SRC2_RDYz

SRC2_MCLK

DOUT3

WCLK3

BCLK3

DIN3

SRC2_LOCKz

TAS_DIN

TAS_WCLK

TAS_BCLK

DOUT2

WCLK1

BCLK1

DOUT1

DIN1I2S1_DOUT

I2S3_DOUT_SRC

GND

GNDGND

GNDGND

GND

GND GND GND

GND

GND

GND

GNDGND

GND

GND

GND GND

GND

GNDGND

GNDGND

GND

GND GND

GND

GND

GND

GNDGND

GND

GND

GND GND

C17

0.1uF/16V

C18

0.1uF/16V

C19

10uF/6.3V

C20

0.1uF/16V

C21

10uF/6.3V

C22

0.1uF/16V

C23

0.1uF/16V

C24

10uF/6.3V

C25

0.1uF/16V

C26

0.1uF/16V

C27

0.1uF/16V

C28

0.1uF/16V

R18

10k

R19

0

R20

0

C29

0.1uF/16V

C30

0.1uF/16V

C31

10uF/6.3V

C32

0.1uF/16V

C33

10uF/6.3V

C34

0.1uF/16V

C35

0.1uF/16V

C36

10uF/6.3V

C37

0.1uF/16V

C38

0.1uF/16V

C39

0.1uF/16V

C40

0.1uF/16V

R21

10k

R22

0

R230

R24

4.7k

R25

10k

R26

4.7k

C41

10uF/6.3V

C42

10uF/6.3V

1.00k

R27

1.00k

R28

GND

GND GND

C43

0.1uF/16V

C44

0.1uF/16V

R29

10k

L;DN

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JANUARY 31, 2014


PAGE INFO:

FILENAME

DATE OF

DRAWN BY

SHEET

PCB REV

SCH REV

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

GND

SPDIF-OUT12

1

3

PLT133/T10W

SHIELD

GND

INPUT

VCC

1

2

3

SPDIF-IN1

PLR135/T10

Case

GND

VCC

OUT

GND

SPDIF-IN2

3

2

1

PLR135/T10

Case

GND

VCC

OUT

GND

GND

3

1

2SPDIF-OUT2

PLT133/T10W

SHIELD

GND

INPUT

VCC

IOVD1

+1.8VIO

IOVD2

+1.8VIO

IOVD1

+3.3VIO

1

2

3

4

5

6

78

9

10

11

12

13

14

TXS0104EPWR

U13

B4

NC

OE

NC

A4

B3

B2

B1

VCCB

A1

A2

A3

VCCA14

13

12

11

10

9

8 7

6

5

4

3

2

1U9

TXS0104EPWR

B4

NC

OE

NC

A4

B3

B2

B1

VCCB

A1

A2

A3

VCCA

1

2

3

4

5

6

78

9

10

11

12

13

14U14

TXS0104EPWR

B4

NC

OE

NC

A4

B3

B2

B1

VCCB

A1

A2

A3

VCCA

(DAC Data)

U6

Connect Pin44 to Pin10,pin 10 to ground plane

SRC #1

SRC4392IPFBR

i2c: 1110 000

13

1

2

3

4

5

6

7

8

9

10

11

12

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

U10

Connect Pin44 to Pin10,pin 10 to ground plane

SRC4392IPFBR

SRC #2

i2c: 1110 001

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

16

15

14

12

11

10

9

8

7

6

5

4

3

2

1

13


3

DATA, SAMPLE RATE CONVERTER

Use same IOVD for IOVD1 and IOVD2.

BCLK3 -> GPIO2 (IOVD1)

WCLK3 -> GPIO1 (IOVD1)

DIN3 -> GPIO3 (IOVD2)

DOUT3 -> GPIO4 (IOVD2)

SAMPLE RATE CONVERTERS FOR ASIsTI

GND

GNDGND


Figure 7. Sample Rate Converters for ASIs



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SRC1_LOCKz

SRC1_RDYz

SRC2_LOCKz

SRC2_RDYz

CLK2_DIV_S1

SRC2_MCLK_S0

CLK1_DIV_S0

CLK1_DIV_S1

SRC1_MCLK_S0

SRC1_MCLK

SRC2_MCLK

TAS_MCLK

MCLK_S0

MCLK_S1

MCLK_SEL

SRC2_MCLK_S1

SRC1_MCLK_S1

MCLK

SRC1_RXCXO

SRC2_RXCXO

SRC2_MCLK

SRC1_MCLK

TAS_SCL

TAS_SDA

RESETz

CLK1_DIV_S0

CLK1_DIV_S1

CLK2_DIV_S0

CLK2_DIV_S1

MCLK_S0

MCLK_S1

MCLK_SEL

SPI_SELECT

6Wire1_EN

I2C_ADDR_SEL

TAS_MCLK

ASI_S0

ASI_S1

SRC1_MCLK_S0

SRC1_MCLK_S1

SRC2_MCLK_S0

SRC2_MCLK_S1

CLK2_DIV_S0

GND

GND GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND GND

GND

GND

GND

GND GNDGND

GND

GND

GND

GND

GND

R30

357

LED6

Green

R31

357

LED3

Green

R32

357

LED4

Green

R33

357

LED5

Green

C45

0.1uF/16V

R34

10k

R35

10k

R36

10k

C46

0.1uF/16V

C47

0.1uF/16V

R37

10k

R38

10k

R39

10k

C48

0.1uF16V

C49

0.1uF/16V

R4010k

R4110k

C50

0.1uF/16V

1

2

3

4

5

6

7

8 9

10

11

12

13

14

15

16U19

CBTLV3253DBQ

16

15

14

13

12

11

10

98

7

6

5

4

3

2

1U20

CBTLV3253DBQ

R4210k

R4310k

R44

10k

R4510k

GND

R4610k

C51

0.1uF/16V

GND

C52

0.1uF/16V

C53

0.1uF/16V

GND

GND

SPI_SELECT is only information,

Never drive this pin.Use Jumper JP51 instead

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PAGE INFO:

FILENAME

DATE OF

DRAWN BY

SHEET

PCB REV

SCH REV

TI

+3.3VIO

+3.3VIO+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

IOVD1

+3.3VIO

8

7

6

54

3

2

1U17

ICS542MLFT

S1

OE

CLK/2

CLKICLK

VDD

GND

S0

24.576MHz

1

2 3

4OSC1

Vcc

OUT

OE

GND

22.5792MHz

1

2 3

4OSC2

Vcc

OUT

OE

GND

ICS542MLFT

1

2

3

4 5

6

7

8U18

S1

OE

CLK/2

CLKICLK

VDD

GND

S0

i2c: 1110 100

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

U22

TCA9539PW

1

2

3 4

5

6U15

LVC2G17DBV

2A

GND

1A6

5

43

2

1U16

LVC2G17DBV

2A

GND

1A

16

15

14

13

12

11

10

98

7

6

5

4

3

2

1U21

8

7

6

5

4

3

2

1

U11

+3.3VIO

TLV320AIC3268RGC EVALUATION BOARDCLOCKSDATA

4BOARD GPIO & MCLK FOR AIC3268

VCC

2Y

1Y

VCC

2Y

1Y


Figure 8. GPIO and MCLK for AIC3268



http://www.ti.com


AV_ENABLE

DV_ENABLE

AV_ENABLE

DV_ENABLE

DV_ENABLE

AV_ENABLE

BCLK1_DUT

WCLK1_DUT

DIN1_DUT

DOUT1_DUT

BCLK1

WCLK1

DIN1

DOUT1

MCLK_DUT

MCLK

BCLK2

WCLK2

DIN2

DOUT2

DOUT2_DUT

DIN2_DUT

WCLK2_DUT

BCLK2_DUT

TEST1

BCLK3

WCLK3

DIN3

DOUT3

GPIO1

GPIO2

GPIO3

GPIO3

GPIO4

GPIO4

TAS_WCLK

TAS_BCLK

6Wire1_EN

GPIO5

TEST2

+5V

GNDGND GND

+5V

GNDGND GND

+5V

GNDGND GND

+5V

GNDGND GND

+5V

GND

GNDGND GND

+5V

GNDGND GND

GND

0.1uF/16V

C54

10uF/6.3V

C55

10k

R47

0.1uF/16V

C56

10uF/6.3V

C57

10k

R48

0.1uF/16V

C58

10uF/6.3V

C59

10k

R49

0.1uF/16V

C60

10uF/6.3V

C61

10k

R50

0.1uF/16V

C62

10uF/6.3V

C63

10k

R51

0.1uF/16V

C64

10uF/6.3V

C65

10k

R52

47ufd/6.3V

C66

47uF/6.3V

C67

47uF/6.3V

C68

47uF/6.3V

C69

47ufd/6.3V

C70

47uF/6.3V

C71

TP69

TP1

TP2

JP221

2

3

JP23

3

2

1

TP62 TP63 TP64 TP65 TP66 TP67 TP68

TP3

TP4

TP5

GND

GND

GND

GND

TP6

TP7 TP8 TP9 TP10

GND

JP4

1 2 3

JP8

321

JP7

1 2 3

JP6

1 2 3

JP5

1 2 3

JP12

321

JP11

1 2 3

JP10

1 2 3

JP9

321

TP11TP12TP13TP14

GND

GND

GND

GND

DNP

J21 2

3 4

5 6

GND

TP15TP16

GND

0

R53

0

R54

GND

GND

GND

GND

JP13

1 2 3

JP14

321

JP15

321

JP16

1 2 3

gpio1/bclk3

TP17gpio2/wclk3

TP18gpio3/din3

TP19gpio4/dout3

TP20

JP20

1 2 3

JP21

3 2 1

GND GND

GND

GNDGND

0.1uF/16V

C72

0.1uF/16V

C73

10kR55

GND

DATACLOCK

SELECTVDD

MIC3

1

2

3

4

5

6

GND

GNDGND

GNDGNDGND

GND

0.1uF/16V

C91

0.1uF/16V

C90

SELECTCLOCKDATA

VDD

MIC2

6

5

4

3

2

1

JP19

3 2 1

JP18

123

JP17

3 2 1

GND GND GND

GND

GNDGND

GNDGNDGND

GND

0.1uF/16V

C74

0.1uF/16V

C75

DATACLOCK

SELECTVDD

MIC5

6

5

4

3

2

1

DATACLOCK

VDDSELECT

MIC4

1

2

3

4

5

6

L;DN

11

C

C

JOHN FEDAK IV

JANUARY 31, 2014


PAGE INFO:

FILENAME

DATE OF

DRAWN BY

SHEET

PCB REV

SCH REV

+1.8VA

+1.8VD

+3.3VA

+1.8V_CP

+3.3VIO

+3.3VIO

+3.3VIO+1.8VIO

+1.8VIO

+3.3VIO

IOVD2

IOVD1

IOVD2

GND

GND

GND

GND

GND

IOVD1

IOVD1

+1.8VIO

1.8V/400mA

VR31

2

3 4

5

TPS73618DBV

3.3V/400mA

VR51

2

3 4

5

TPS73633DBV

1.8V/400mA

VR15

43

2

1

TPS73618DBV

1.8V/400mA

VR21

2

3 4

5

TPS73618DBV

1.8V/400mA

VR41

2

3 4

5

TPS73618DBV

3.3V/400mA

VR65

43

2

1

TPS73633DBV

DNP

J3

SLIMbusSATA

7

6

5

4

3

2

1

GND

B+

B-

GND

A+

GND

A-

Case

U23

87654 3 2 1

TXB0102DCU

B2

A2

VC

CA

GN

D

B1

VC

CB

OE

A1


LDOs & AIC3268 ANALOG OUTPUTS 5

LDO SUPPLIES

IOVD1: GPIO1: Dig_Mic 1,2 Data and BCLK3GPIO2: ADC_MOD_CLK and WCLK3

GPIO5: Dig_Mic 3,4 DataIOVD2: GPIO3: DIN3

GPIO4: DOUT3

Use same IOVD for IOVD1 and IOVD2.BCLK3 -> GPIO2 (IOVD1)WCLK3 -> GPIO1 (IOVD1)

DIN3 -> GPIO3 (IOVD2)DOUT3 -> GPIO4 (IOVD2)

TI


Figure 9. LDO Supplies and Analog Outputs



http://www.ti.com


VSYS_EXT

HS_MIC

MICBIAS_EXT

IN4R

IN4L

MICBIAS_DUT MICBIAS

BCLK1_DUT

MCLK_DUT

IN2L

IN2R

IN3L

IN3R

VSYS_EXT

MICBIAS_EXT_DUT

MICBIAS_DUT

MICBIAS_EXT_DUT

IN1R

IN1L

VSYS_EXT

SPKM

SPKP

RECP

RECM

HPR

HPL

HPVSS_SENSE

RLOUT

LLOUT

GPIO1

DIN1_DUT

DOUT1_DUT

GPIO2

WCLK1_DUT

AIC_RESETZ

SCL_SSZ

ADDR_SCLK

GPIO5

SDA_MOSI

AIC_SPI_SELECT

MISO_GPO1

GPIO3

WC

LK

2_D

UT

DIN

2_D

UT

GP

IO4

BC

LK

2_D

UT

DO

UT

2_D

UT

TE

ST

1

TE

ST

2

GND

JP32

1

2

JP39

1

2

GND

JP37

3 2 1

GND

JP45

2 1

GND

GND GND

JP25

1 2

GND GND

JP48

21

JP24

1 2

+1.8VIO

JP47

321

TP21

vref

GND

TP22micdet

JP35

1

2

JP33

1 2 3

GND

TP23Ext_Aux1

TP24Ext_Aux2

0.1uF/16V

C76

0.1uF/16V

C77

0.1uF/16V

C78

0.1uF/16V

C79

0.1uF/16V

C80

1.0uF/16V

C81

0.1uF/16V

C83

10uF/10V

C84

C85

1.0uF/16VC86

1.0uF/16V

0.1uF/16V

C87

R56

200

R57

200

JP36

2

1

100

R58

R592.10k

TP25

in1l

JP34

321

0.1uF/16V

C88

GND

TP26

in1r

TP27Ext_In1R

C89

1.0uF/16V

TP28in4l

TP29in4r

CP90

1.0ufd/10V

CP91

1.0ufd/10V

GND

MIC11

2

JP31

2

1

R601.10k

TP30

100

R61

R621.00k

R632.10k

JP27

1 2

R642.10k

JP28

21

TP31in3l

TP32in3r

C92

1.0uF/16V

C93

1.0uF/16V

JP30

1 2

JP29

2 1

GNDTP33

in2r

TP34

in2l

C94

1.0uF/10V

C95

1.0uF/16V

GNDGND

1.0uF/16V

C96

0.1uF/16V

C97

JP26

21

1.0uF/16V

C98

GND

TP35vref_sar

R65200

0.1uF/16V

C99

GND

JP462

1

TP36

C100

2.2ufd/10V

GND

C101

2.2uF/10V

TP37Vneg

GND GND

0.1uF/16V

C102

10uF/10V

C103

GND

10uF/10V

C104

GND

0.1uF/16V

C105

JP40

123

JP41

2 1

GND GND

GND

GND

DNP

C106

DNP

C107

JP42 2

1

R66

1.00k

2200pfd/50V

C108

JP431

2R67

1.00K

2200pfd/50V

C109

TP38 TP39

120 OHMS/1.5A

FB1

21

1

120 OHMS/1.5A

FB22

6A/125V

J5

1

2

+

1.0uF/16V

C110

6A/125V

J6

2

1+

JP44

1 2 3

GND GND GND

GND

+5V

TP40spkm

TP41spkp

10uF/10V

C111

0.1uF/16V

C112

JP38

321

0.1uF/16V

C113

1.0uF/16V

C114

GND GND

GND GND

1.0uF/16V

C116

GND

0.1uF/16V

C117

GND

10uF/10V

C118

PowerPAD

U1

GND

0.1uF/16V

C115

L;DN

11

C

C

JOHN FEDAK IV

JANUARY 31, 2014


PAGE INFO:

FILENAME

DATE OF

DRAWN BY

SHEET

PCB REV

SCH REV

TI

+1.8VD

IOVD1

+1.8VA

+1.8VA

+1.8VD

+1.8V_CP

+1.8VA

+1.8VA

+1.8VA +3.3VA

+3.3VA

+1.8VA

FB4

220ohms/2A

2 1

U1

64 60 56 52

45

41

37

33

54 5355 51 495058 5759

44

43

42

46

47

48

40

39

38

25 26 2827 31 32302921 22 242319 2018

9

10

11

12

16

15

14

13

5

6

7

8

63 6162

17

34

35

36

4

3

2

1

GND

C140

0.1uF/16V

IOVD2

J4

LEFT

RIGHT

Sh

ield

2

4

1

3

6

5


TLV320AIC3268 6


Figure 10. TLV320AIC3268 Schematic



http://www.ti.com


HS_MIC

HPVSS_SENSE

HPL

HPL

HPR

HPR

RECP

RECP

RECM

RECM

LLOUT

LLOUT

RLOUT

RLOUT

hpl

TP42

hpr

TP43

vss_sns

TP44

GNDGND

GND

GNDGNDGND

GND

123

JP52

3 2 1

JP53

321

JP50

321

JP51

R68

1.00k R69

1.00k

16.0R70

32.4R71

16.0R90

2200pF/50V

C1212200pF/50V

C122

32.4R72

TP45

TP46

GND

2 1

JP49

DNP

R73

GND

GNDGND

1.0ufF16V

C123

1.0uF/16V

C124

llout

TP47

rlout

TP48

1 2

JP57

TP49

21

JP58

TP50R74

1.00k

2200pF/50V

C125

R75

1.00k

2200pF/50V

C126

GND

GND GND

21

JP54

R76

1.00k

2200pF/50V

C127

1 2

JP55

R77

1.00k

2200pF/50V

C128

TP51 TP52

32.4

R781

2

JP56recp

TP53

recm

TP54

L;DN

11

C

C

JOHN FEDAK IV

JANUARY 31, 2014


PAGE INFO:

FILENAME

DATE OF

DRAWN BY

SHEET

PCB REV

SCH REV

TI

J9

1

2

3

6A/125V

220ohms/2A

1 2FB3

J8

3

2

1

4

5

Sh

ield

J7

LEFT

RIGHT

Sh

ield

2

4

1

3

6

5

J10

LEFT

RIGHT

Shie

ld

2

4

1

3

6

5


AUDIO CONNECTORS 7

2-32-3

1-21-2

JP51JP50Configuration

L-R-G-M

L-R-M-G


Figure 11. Audio Connectors



http://www.ti.com


SCL_SSZ

SDA_MOSI

AIC_SCLK

AIC_ADDRESSADDR_SCLK

TAS_SSz

TAS_MOSI

TAS_SCL

TAS_SDA

DUT_RESETz AIC_RESETZAIC_RESETZ

TAS_SCLK

TAS_MISO

I2C_ADDR_SEL AIC_ADDRESS

AIC_SPI_SELECTAIC_SPI_SELECT

AIC_SCLK

SPI_SELECT

MISO_GPO1

ad/sclk

TP55scl/ssz

TP56sda/mosi

TP57

gpo1/miso

TP58spi_sel

TP59reset~

TP60

GND

GND0.1uF/16V

C129

GND

GND GND

GND

GND GND

0.1uF/16V

C130

0.1uF/16V

C131

GND

GND

GNDGND

GND

GND

+5V

GND

GND GND

GND

GND

0.1uF/16V

C132

2.7kR79

2.7kR80

0.1uF/16V

C133

200k

R81

R82806k

0.1uF/16V

C134

10k

R830.1uF/16V

C135

0.1uF/16V

C13610k

R84

0.1uF/16V

C137

GND

1

JP592

357R85

Green

LED7

R861.00k

GND

GND

GNDGND0.1uF/16V

C138

0.1uF/16V

C139

GND

GND GND0.1uF/16V

C119

0.1uF/16V

C120

10k

R87

GND

10k

R88

GND

TP61R891.00k

L;DN

11

C

C

JOHN FEDAK IV

JANUARY 31, 2014


PAGE INFO:

FILENAME

DATE OF

DRAWN BY

SHEET

PCB REV

SCH REV

TI

IOVD1

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO

+3.3VIO IOVD1

IOVD1+3.3VIO

+3.3VIO

IOVD1

IOVD1 +3.3VIO

1

2

3

4

5

6

7

8

U24

LVC2G157DCT

10

9

8

7 6

5

4

3

21 U25

AVC2T245RSW

1

2

3

45

6

7

8

U26

PCA9306DCT

SDA2

SCL2

VREF2

EN

SDA1

GND

VREF1

SCL1

1

2

3 4

5

6

U27

TXB0101DBV

OE

VCCB

B

GND

VCCA

A1

2

4

5

3

U28

LVC1G126DBV

1

2

34

5

6

U7

LVC2G04DBV

14

13

12

11

10

9

8 7

6

5

4

3

2

1

U8

TXS0104EPW

B4

NC

OE GND

NC

A4

B3

B2

B1

VCCB

A1

A2

A3

VCCA

U1212

3

4

5

6 7

8

9

10

AVC2T245RSW


I2C TRANSLATION AND SELECTION 8

Install this jumper touse DUT in SPImode


Figure 12. I2C Translation and Selection



http://www.ti.com


DV_ENABLE

TAS_SCL

TAS_SDA

MCLK

BCLK1

WCLK1

DOUT1

DIN1

TAS_MISO

TAS_MOSI

TAS_SSz

TAS_SCLK

I2S_ENABLE

RESETz

BCLK2

WCLK2

DOUT2

DIN2

BCLK2

WCLK2

DOUT2

DIN2

TAS_BCLK

TAS_WCLK

TAS_DOUT

TAS_DIN

GPIO3

GPIO4

IN1L IN1R

IN2L IN2R

IN3RIN3L

IN4L IN4R

MICBIAS

MICBIAS_EXT HS_MIC

SPKP

SPKM SPKM

SPKP

RECP RECM

LLOUT

RLOUT

HPL

HPR

AV_ENABLE

GPIO5

GPIO1

GPIO2

GND GND

VARVDVARVD

70

68

66

64

62

60

58

56

54

52

50

48

46

44

42

40

38

36

34

32

30

28

26

24

22

20

18

16

14

12

10

8

6

4

2

69

67

65

63

61

59

57

55

53

51

49

47

45

43

41

39

37

35

33

31

29

27

25

23

21

19

17

15

13

11

9

7

5

3

1

71

73

75

77

79

81

83

85

87

89

91

93

95

97

99

72

74

76

78

80

82

84

86

88

90

92

94

96

98

100

J11

mfg: JSTp/n: 100P-JMDSS-G-1-TF(LF)(SN)

100

98

96

94

92

90

88

86

84

76

74

72

70

68

66

64

62

60

58

56

54

52

50

48

46

44

42

40

38

36

34

32

30

28

26

24

22

20

18

16

14

12

10

8

6

4

2

99

97

95

93

91

89

87

85

83

73

71

69

67

65

63

61

59

57

55

53

51

49

47

45

43

41

39

37

35

33

31

29

27

25

23

21

19

17

15

13

11

9

7

5

3

1

75

77

79

81

78

80

82

J12

mfg: JSTp/n: 100P-JMDSS-G-1-TF(LF)(SN)

S03

0.5in0.5in

S02

0.5in0.5in

S05

0.5in0.5in

S04

0.5in0.5in

S07

0.5in0.5in

S01

0.5in0.5in

S06

0.5in0.5in

S08

0.5in0.5in

L;DN

11

C

C

JOHN FEDAK IV

JANUARY 31, 2014


PAGE INFO:

FILENAME

DATE OF

DRAWN BY

SHEET

PCB REV

SCH REV

TI

GND GND

+1.8V_CP +3.3VD

GND GND

+5V +5V

+1.8V +1.8V

+3.3VD +3.3VDGND

J12

Anchor

J11

Anchor


9

RESERVED

RESERVED

I2S_4

I2S_3

GPIO

DGND

I2S_ENABLE

DGND

I2S1

DGND

MCLK

I2C

RESERVEDRESERVED

DV_ENABLE

VARVD VARVD

+1.8VD +1.8IO

+3.3IO +3.0IO

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND+5VD+5VD

IN8-

IN7-

IN6-

IN5-

IN4-

IN3-

IN1-

IN2-

MICDETAGND

AGND

AGND

AGND

AGND

AGND

AGND

AGND

IN8+

IN7+

IN6+

IN5+

IN4+

IN3+

IN1+

IN2+

MICBIASAGND

AGND

AGND

AGND

AGND

AGND

AGND

AGND

AGND AGNDSPK1+SPK1-SPK2+SPK2-

CLASS-DSPEAKEROUTPUT

CLASS-DSPEAKEROUTPUT

SPK2-SPK2+SPK1-SPK1+

HEADSETGROUND

HPGNDHPGND

HPGNDHPGND

LINEOUTPUTS

OUT1GNDOUT1+

OUT2+OUT2GND

OUT3+OUT3GND

OUT4GNDOUT4+

AGND

HP2LHP2R

HP1R

OUT4-OUT4GND

HP1LHEADSETOUTPUTS

AGND

OUT3GNDOUT3-OUT2GNDOUT2-

OUT1-OUT1GND

LINEOUTPUTS

AGNDVARVA

BREAK-OUT CONNECTIONSBREAK-OUT CONNECTIONS

ANALOG INTERFACE CONNECTOR

STANDOFFS

+5VAAGND

+3.3VA

AGND+1.8V_CP

AGND

VARVAAGND

AGND+1.8VAAGND

+3.3VAAGND+5VA

BREAK-OUT CONNECTIONSBREAK-OUT CONNECTIONS

DIGITAL INTERFACE CONNECTOR

AV_ENABLEHPVDDHPGND

RESERVED

HPGNDHPVDD

SPKVDD SPKVDD

SPKGND SPKGND RESERVED

MCLK

SPI

RESET

I2S_2

RESERVED

BREAKOUT BOARD CONNECTIONS


Figure 13. Breakout Board Connections



http://www.ti.com


www.ti.com TLV320AIC3268EVM-U EVM Board Layout

7 TLV320AIC3268EVM-U EVM Board LayoutFigure 14 through Figure 16 illustrate the TLV320AIC3268EVM-U EVM board layouts.

Figure 14. Top Xray View

Figure 15. Silkscreen Top



http://www.ti.com


TLV320AIC3268EVM-U EVM Board Layout www.ti.com

Figure 16. Silkscreen Bottom



http://www.ti.com


www.ti.com TLV320AIC3268EVM-U Bill of Materials

8 TLV320AIC3268EVM-U Bill of MaterialsTable 3 contains the BOM for the TLV320AIC3268EVM-U.

Table 3. TLV320AIC3268EVM-U Bill of MaterialsItem MANU PART NUM MFG QTY REF DESIGNATORS DESCRIPTION

1 TLV320AIC3268IRGC TEXAS INSTRUMENTS 1 U1 STEREO AUDIO CODEC WITH DIRECT PATH HEADPHONE AND CLASS-D

2 TAS1020BPFB TEXAS INSTRUMENTS 1 U2 USB STREAMING CONTROLLER TQFP48-PFB ROHS

3 SN74LVC1G126DBVR TEXAS INSTRUMENTS 2 U3, U28 SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT SOT23-DBV5 ROHS

4 SN74CBTLV3253DBQR TEXAS INSTRUMENTS 4 U4, U19, U20, U21 LO VOLT DUAL 1OF4 FET MUX/DEMUX SSOP16-DB ROHS

5 24FC512-I/MF MICROCHIP 1 U5 512K I2C SERIAL EEPROM DFN8-MF ROHS

6 SRC4392IPFBR BURR-BROWN 2 U6, U10 2 CHAN,ASYNC,SAMPLE RATE CONV W/DIG AUDIO REC/XMTR ROHS

7 SN74LVC2G04DBVR TEXAS INSTRUMENTS 1 U7 DUAL INVERTER GATE SOT23-DBV6 ROHS

8 TXS0104EPWR TEXAS INSTRUMENTS 4 U8, U9, U13, U14 4-BIT BIDIR LEVEL TRANSLATOR TSSOP14-PW ROHS

9 SN74LVC2G157DCTR TEXAS INSTRUMENTS 2 U11, U24, MUX/DATA SELECTOR 2 TO 1 SSOP8-DCT ROHS

10 SN74AVC2T245RSWR TEXAS INSTRUMENTS 2 U12, U25 2BIT XCVR CONFIGURABLE TRANSLATION 3-STATE OUTS QFN10-RSW ROHS

11 SN74LVC2G17DBVR TEXAS INSTRUMENTS 2 U15, U16 DUAL SCHMITT-TRIGGER BUFFER SOT23-DBV6 ROHS

12 ICS542MLFT IDT 2 U17, U18 CLOCK DIVIDER,SOP8-D,ROHS

13 TCA9539PWR TEXAS INSTRUMENTS 1 U22 REMOTE 16B I2C SMBUS LO PWR IO EXPNDR INT OUT TSSOP24-PW ROHS

14 TXB0102DCUR TEXAS INSTRUMENTS 1 U23 2-BIT BIDIR LEVEL TRANSLATOR VSSOP8-DCU ROHS

15 PCA9306DCTR TEXAS INSTRUMENTS 1 U26 DUAL BIDIR I2C BUS AND SMBUS VOLT LEVEL TRANS SSOP8-DCT ROHS

16 TXB0101DBVR TEXAS INSTRUMENTS 1 U27 1-BIT BIDIR LEVEL TRANSLATOR SOT23-DBV6 ROHS

17 TPS73618DBVT TEXAS INSTRUMENTS 4 VR1, VR2, VR3, VR4 VOLT REG 1.8V 400MA LDO CAP FREE NMOS SOT23-DBV5 ROHS

18 TPS73633DBVT TEXAS INSTRUMENTS 2 VR5, VR6 VOLT REG 3.3V 400MA LDO CAP FREE NMOS SOT23-DBV5 ROHS

19 PLR135/T10 EVERLIGHT ELECTRONICS 2 SPDIF-IN1, SPDIF-IN2 PHOTOLINK FIBER OPTIC RECEIVER 2.4-5.5V 15MB PCB-RA SHUTTER ROHS

20 PLT133/T10W EVERLIGHT ELECTRONICS 2 SPDIF-OUT1, SPDIF-OUT2 PHOTOLINK FIBER OPTIC TRANSMITTER 2.4-5.5V 15MB PCB-RA SHUTTERROHS

21 SML-LXT0805YW-TR LUMEX OPTO 2 LED1, LED2 LED, YELLOW 2.0V SMD0805 ROHS

22 SML-LXT0805GW-TR LUMEX OPTO 5 LED3, LED4, LED5, LED6, LED7 LED, GREEN 2.0V SMD0805 ROHS

23 FXO-HC736R-22.5792 FOX ELECTRONICS 1 OSC1 OSCILLATOR SMT 3.3V 24.576MHz ROHS

24 625L3C024M57600 CTS FREQUENCY CONTROLS 1 OSC2 OSCILLATOR SMT 3.3V 22.5792MHz ROHS

25 625L3I006M00000 CTS FREQUENCY CONTROLS 1 Y1 OSCILLATOR SMT 6.0MHz 3.3V OUT-ENABLE ROHS

26 GRM1885C1H470JA01D MURATA 2 C1, C2 CAP SMD0603 CERM 47PFD 50V 5% COG ROHS

27 C1608X7R1C105K TDK 3 C3, C123, C124 CAP SMD0603 CERM 1.0UFD 16V 10% X7R ROHS

28 GRM155R71C104KA88D MURATA 77 C4, C5, C6, C7, C8, C10, C12, C13, C17, C18, C20, C22, C23, C25, C26, C27, CAP SMD0402 CERM 0.1UFD 16V X7R 10% ROHSC28, C29, C30, C32, C34, C35, C37, C38, C39, C40, C43, C44, C45, C46, C47,C48, C49, C50, C51, C52, C53, C54, C56, C58, C60, C62, C64, C72, C73, C74,C75, C76, C77, C79, C80, C83, C87, C88, C90, C91, C97, C99, C102, C112,C113, C115, C117, C119, C120, C129, C130, C131, C132, C133, C134, C135,C136, C137, C138, C139, C140

29 C1608X7R1H104K TDK 3 C9, C11, C16 CAP SMD0603 CERM 0.1UFD 50V 10% X7R ROHS

30 C1608C0G1H102J TDK CORP. 1 C14 CAP SMD0603 CERM 1000PFD 50V 5% COG ROHS

31 GRM1885C1H101JA01D MURATA 1 C15 CAP SMD0603 CERM 100PFD 50V 5% COG ROHS

32 GRM188R60J106ME47D MURATA 14 C19, C21, C24, C31, C33, C36, C41, C42, C55, C57, C59, C61, C63, C65 CAP SMD0603 CERM 10UFD 6.3V 20% X5R ROHS

33 JMK212BJ476MG-T TAIYO YUDEN 6 C66, C67, C68, C69, C70, C71 CAP SMD0805 CERM 47UFD 6.3V 20% X5R ROHS



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TLV320AIC3268EVM-U Bill of Materials www.ti.com

Table 3. TLV320AIC3268EVM-U Bill of Materials (continued)Item MANU PART NUM MFG QTY REF DESIGNATORS DESCRIPTION

34 GRM188R71C104KA01D MURATA 2 C78, C105 CAP SMD0603 CERM 0.1UFD 16V 10% X7R ROHS

35 EMK107B7105KA-T TAIYO YUDEN 6 C81, C96, C98, C110, C114, C116 CAP SMD0603 CERM 1.0UFD 16V 10% X7R ROHS

36 GRM21BR71A106KE51L MURATA 5 C84, C103, C104, C111, C118 CAP SMD0805 CERM 10UFD 10V10% X7R ROHS

37 GRM188R71A105KA61D MURATA 9 C85, C86, C89, C92, C93, C94, C95, CP90, CP91 CAP SMD0603 CERM 1.0UFD 10V 10% X7R ROHS

38 GRM188R71A225KE15D MURATA 2 C100, C101 CAP SMD0603 CERM 2.2UFD 10V 10% X7R ROHS

39 NA NA 0 C106, C107 CAP SMD1206 VALUE TBD

40 GRM188R71H222KA01D MURATA 8 C108, C109, C121, C122, C125, C126, C127, C128 CAP SMD0603 CERM 2200PFD 50V 10% X7R ROHS

41 ERJ-3EKF1501V PANASONIC 1 R1 RESISTOR SMD0603 1.50K OHM 1% THICK FILM 1/10W ROHS

42 ERJ-3EKF27R4V PANASONIC 2 R2, R3 RESISTOR SMD0603 27.4 OHMS 1% 1/10W ROHS

43 ERJ-3EKF1003V PANASONIC 1 R4 RESISTOR SMD0603 100K OHM 1% THICK FILM 1/10W ROHS

44 ERJ-3GEYJ103V PANASONIC 34 R5, R6, R7, R10, R12, R15, R18, R21, R25, R29, R34, R35, R36, R37, R38, RESISTOR SMD0603 10K 5% 1/10W ROHSR39, R40, R41, R42, R43, R44, R45, R46, R47, R48, R49, R50, R51, R52, R55,R83, R84, R87, R88

45 RC0603FR-07649RL YAGEO 2 R8, R9 RESISTOR SMD0603 THICK FILM 649 OHMS 1% 1/10W ROHS

46 ERJ-3EKF3091V PANASONIC 1 R11 RESISTOR SMD0603 3.09K OHM 1% THICK FILM 1/10W ROHS

47 ERJ-3GEYJ272V PANASONIC 4 R13, R14, R79, R80 RESISTOR SMD0603 2.7K OHMS 5% 1/10W ROHS

48 ERJ-3GEYJ472V PANASONIC 4 R16, R17, R24, R26 RESISTOR SMD0603 4.7K OHMS 5% 1/10W ROHS

49 ERJ-3GEY0R00V PANASONIC 6 R19, R20, R22, R23, R53, R54 RESISTOR,SMT,0603,ZERO OHM,5%,,1/10W,ROHS

50 RC0603FR-071KL YAGEO 13 R27, R28, R62, R66, R67, R68, R69, R74, R75, R76, R77, R86, R89 RESISTOR SMD0603 THICK FILM 1.00K OHM 1% 1/10W ROHS

51 ERJ-3EKF3570V PANASONIC 5 R30, R31, R32, R33, R85 RESISTOR SMD0603 357 OHM 1% THICK FILM 1/10W ROHS

52 CRCW0603200RFKEA VISHAY 3 R56, R57, R65 RESISTOR SMD0603 200 OHMS 1% 1/10W ROHS

53 ERJ-3EKF1000V PANASONIC 2 R58, R61 RESISTOR SMD0603 100 1% THICK FILM 1/10W ROHS

54 ERJ-3EKF2101V PANASONIC 3 R59, R63, R64 RESISTOR SMD0603 2.10K OHMS 1% THICK FILM 1/10W ROHS

55 ERJ-3EKF1101V PANASONIC 1 R60 RESISTOR SMD0603 1.10K OHMS 1% THICK FILM 1/10W ROHS

56 CRCW120616R0JNEA VISHAY 2 R70, R90 RESISTOR,SMT,1206,16.0 OHM,5%,1/4W,ROHS

57 RC1206FR-0732R4L YAGEO 3 R71, R72, R78 RESISTOR SMD1206 32.4 OHMS 1% 1/4W ROHS

58 ERJ-3GEY0R00V PANASONIC 0 R73 RESISTOR,SMT,0603,ZERO OHM,5%,,1/10W,ROHS

59 ERJ-3GEYJ204V PANASONIC 1 R81 RESISTOR SMD0603 200K OHMS 5% 1/10W ROHS

60 ERJ-2RKF8063X PANASONIC 1 R82 RESISTOR SMD0402 THICK FILM 806K OHMS 1/10W 1% ROHS

61 BLM15EG121SN1D MURATA 2 FB1, FB2 FERRITE BEAD SMD0402 120 OHMS 1.5A ROHS

62 MPZ1608S221A TDK 4 FB3, FB4, FB5, FB6 FERRITE CHIP, 220 OHMS 2A 100MHZ SMD 0603 ROHS

63 ZX62WD1-B-5PC HIROSE 1 J1 JACK USB FEMALE TYPEB MICRO SMT-RA 5PIN ROHS

64 75869-131LF FCI 0 J2 HEADER SHROUDED 100LS MALE GOLD 2x3 PINS ROHS

65 5607-4200-SH 3M 0 J3 CONNECTOR-SATA 7 PIN SMT-RA SERIES 5607 ROHS

66 SJ-43516-SMT CUI STACK 3 J4, J7, J10 JACK AUDIO-STEREO MINI(3.5MM ,4-COND SMT-RA ROHS

67 ED555/2DS ON SHORE TECHNOLOGY 2 J5, J6 TERMINAL BLOCK 2PIN 6A/125V GRAY 3.5mm PITCH 16-28AWG ROHS

68 SJ-435105 CUI STACK 1 J8 JACK AUDIO MINI(3.5MM ,4-COND SMT-RA ROHS

69 ED555/3DS ON SHORE TECHNOLOGY 1 J9 TERMINAL BLOCK 3PIN 6A/125V GRAY 3.5mm PITCH 16-28AWG ROHS

70 100P-JMDSS-G-1- JST 2 J11, J12 PLUG SMD 2x50 FEMALE JMDSERIES 0.5MM LS GOLD ROHSTF(LF)(SN)



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www.ti.com TLV320AIC3268EVM-U Bill of Materials

Table 3. TLV320AIC3268EVM-U Bill of Materials (continued)Item MANU PART NUM MFG QTY REF DESIGNATORS DESCRIPTION

71 PBC02SAAN SULLINS 28 JP1, JP2, JP3, JP24, JP25, JP26, JP27, JP28, JP29, JP30, JP31, JP32, JP35, HEADER THRU MALE 2 PIN 100LS 120 TAIL GOLD ROHSJP36, JP39, JP41, JP42, JP43, JP45, JP46, JP48, JP49, JP54, JP55, JP56,JP57, JP58, JP59

72 PBC03SAAN SULLINS 31 JP4, JP5, JP6, JP7, JP8, JP9, JP10, JP11, JP12, JP13, JP14, JP15, JP16, JP17, HEADER THRU MALE 3 PIN 100LS 120 TAIL GOLD ROHSJP18, JP19, JP20, JP21, JP22, JP23, JP33, JP34, JP37, JP38, JP40, JP44,JP47, JP50, JP51, JP52, JP53

73 WM-63PRT PANASONIC 1 MIC1 MICROPHONE ELECTRET OMNIDIRECTIONAL DUAL BAND 2PIN ROHS

74 SPM0423HD4H-WB KNOWLES 4 MIC2, MIC3, MIC4, MIC5 MIC DIGITAL MIMI-SISONIC HALOGEN FREE 6PIN ROHS

75 5000 KEYSTONE ELECTRONICS 11 TP1, TP2, TP3, TP4, TP5, TP21, TP30, TP35, TP36, TP37, TP69 PC TESTPOINT, RED, ROHS

76 5002 KEYSTONE ELECTRONICS 30 TP22, TP23, TP24, TP25, TP26, TP27, TP28, TP29, TP31, TP32, TP33, TP34, PC TESTPOINT, WHITE, ROHSTP38, TP39, TP40, TP41, TP42, TP43, TP44, TP45, TP46, TP47, TP48, TP49,TP50, TP51, TP52, TP53, TP54, TP61

77 5004 KEYSTONE ELECTRONICS 21 TP6, TP7, TP8, TP9, TP10, TP11, TP12, TP13, TP14, TP15, TP16, TP17, TP18, PC TESTPOINT, YELLOW, ROHSTP19, TP20, TP55, TP56, TP57, TP58, TP59, TP60

78 5011 KEYSTONE ELECTRONICS 7 TP62, TP63, TP64, TP65, TP66, TP67, TP68 PC TESTPOINT BLACK 063 HOLE ROHS

79 TL1015AF160QG E-SWITCH 4 S1, S2, S3, S4 SWITCH, MOM, 160G SMT 4X3MM ROHS

80 3480 KEYSTONE ELECTRONICS 8 STANDOFFS STANDOFF 4-40 0.5IN 0.220 DIA ALUM RND F-F ROHS

81 4862 KEYSTONE ELECTRONICS 8 STANDOFF SCREWS MACHINE SCREW 4-40 PHILIPS 0.25 LENGTH ROHS

82 INTLWSS 004 KEYSTONE ELECTRONICS 8 STANDOFF WASHERS WASHER INTERNAL TOOTH #4 STAINLESS STEEL ROHS

83 969102-0000-DA 3M 38 JP1, JP2, JP4, JP5, JP6, JP7, JP8, JP17, JP18, JP19, JP22, JP23, JP24, JP25, SHUNT BLACK AU FLASH 0.100LS OPEN TOP ROHSJP26, JP29, JP30, JP31, JP32, JP33, JP34, JP35, JP36, JP37, JP38, JP39,JP40, JP41, JP44, JP45, JP46, JP47, JP48, JP49, JP50, JP51, JP52, JP53

TOTAL 491

SPECIAL NOTES TO THIS BILL OF MATERIALS

SN1 These assemblies are ESD sensitive, ESD precautions shall be observed.

SN2 These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.

SN3 These assemblies must comply with workmanship standards IPC-A-610 Class 2.

SN4 Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components.



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Writing Scripts www.ti.com

9 Writing ScriptsA script is simply a text file that contains data to send to the serial control buses.

Each line in a script file is one command. No provision is made for extending lines beyond one line, exceptfor the > command. A line is terminated by a carriage return.

The first character of a line is the command. Commands are:

I— Set interface bus to use

r— Read from the serial control bus

w— Write to the serial control bus

>— Extend repeated write commands to lines below a w

#— Comment

b— Break

d— Delay

f— Wait for Flag

The first command, I, sets the interface to use for the commands to follow. This command must befollowed by one of the following parameters:

i2cstd— Standard mode I2C bus

i2cfast— Fast mode I2C bus

spi8— SPI bus with 8-bit register addressing

spi16— SPI bus with 16-bit register addressing

For example, if a fast mode I2C bus is to be used, the script begins with:

I i2cfast— A double-quoted string of characters following the b command can be added to provideinformation to the user about each breakpoint. When the script is executed, the software'scommand handler halts as soon as a breakpoint is detected and displays the string of characterswithin the double quotes.

The Wait for Flag command, f, reads a specified register and verifies if the bitmap provided with thecommand matches the data being read. If the data does not match, the command handler retries for up to200 times. This feature is useful when switching buffers in parts that support the adaptive filtering mode.The command f syntax follows:f [i2c address] [register] [D7][D6][D5][D4][D3][D2][D1][D0]

where 'i2c address' and 'register' are in hexadecimal format

and 'D7' through 'D0' are in binary format with values of 0,

1 or X for don't care.8

Anything following a comment command # is ignored by the parser, provided that it is on the same line.

The delay command d allows the user to specify a time, in milliseconds, that the script pauses beforeproceeding. Note: The delay time is entered in decimal format.

A series of byte values follows either a read or write command. Each byte value is expressed inhexadecimal, and each byte must be separated by a space. Commands are interpreted and sent to theTAS1020B by the program.



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www.ti.com Writing Scripts

The first byte following an r (read) or w (write) command is the I2C slave address of the device (if I2C isused) or the first data byte to write. (If SPI is used, note that SPI interfaces are not standardized onprotocols, so the meaning of this byte varies with the device being addressed on the SPI bus.) Thesecond byte is the starting register address that data will be written to (again, with I2C; SPI varies).Following these two bytes are data, if writing; if reading, the third byte value is the number of bytes toread, (expressed in hexadecimal).

For example, to write the values 0xAA 0x55 to an I2C device with a slave address of 0x30, starting at aregister address of 0x03, the user writes:#example script

I i2cfast

w 30 03 AA 55

r 30 03 02e

This script begins with a comment, specifies that a fast I2C bus is used, then writes 0xAA 0x55 to the I2Cslave device at address 0x30, writing the values into registers 0x03 and 0x04. The script then reads backtwo bytes from the same device starting at register address 0x03. Note that the slave device value doesnot change. It is unnecessary to set the R/W bit for I2C devices in the script; the read or write commandsdoes that.

If extensive repeated write commands are sent and commenting is desired for a group of bytes, the >command can be used to extend the bytes to other lines that follow. A usage example for the > commandfollows:#example script for '>' command

I i2cfast

# Write AA and BB to registers 3 and 4, respectively

w 30 03 AA BB

# Write CC, DD, EE and FF to registers 5, 6, 7 and 8, respectively

> CC DD EE FF

# Place a commented breakpoint

b "AA BB CC DD EE FF was written, starting at register 3"

# Read back all six registers, starting at register 3

r 30 03 06b

The following example demonstrates usage of the Wait for Flag command, f:#example script for 'wait for flag' command

I i2cfast

# Switch to Page 44

w 30 00 2C

# Switch buffer

w 30 01 05

# Wait for bit D0 to clear. 'x' denotes a don't care.

f 30 01 xxxxxxx0

Any text editor can be used to write these scripts; jEdit is an editor that is highly recommended for generalusage. For more information, go to: www.jedit.org.



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Writing Scripts www.ti.com

Once the script is written, it can be used in the command window by running the program, and thenselecting Open Script File... from the File menu. Locate the script and open it. The script then is displayedin the command buffer. The user also can edit the script once it is in the buffer and save it by selectingSave Script File... from the File menu.

Once the script is in the command buffer, it can be executed by pressing the Execute Command Bufferbutton. If breakpoints are in the script, the script executes to that point, and the user is presented with adialog box with a button to press to continue executing the script. When ready to proceed, the userpushes that button and the script continues.



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www.ti.com Revision History

Revision History

Changes from Original (February 2014) to A Revision .................................................................................................. Page

• Deleted link to the Application Reference Guide from the Related Documents table. .......................................... 1• Deleted section titled Operation. ....................................................................................................... 4

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

25SLAU564A–February 2014–Revised February 2014 Revision HistorySubmit Documentation Feedback


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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or

documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.Acceptance of the EVM is expressly subject to the following terms and conditions.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.

2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software

License Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatmentby an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in anyway by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications orinstructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or asmandated by government requirements. TI does not test all parameters of each EVM.

2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during thewarranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects torepair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shallbe warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.

3 Regulatory Notices:3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kitto determine whether to incorporate such items in a finished product and software developers to write software applications foruse with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unlessall required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not causeharmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit isdesigned to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority ofan FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.

FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.

Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.

Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur

3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law ofJapan to follow the instructions below with respect to EVMs:1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page


【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けていないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・イ

ンスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

SPACER4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOTLIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.

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SPACER6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THEDESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANYTHIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS ANDCONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANYOTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRDPARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANYINVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OFTHE EVM.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATIONSHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANYOTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITEDTO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODSOR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALLBE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATIONARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVMPROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDERTHESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCEOF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS ANDCONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2015, Texas Instruments Incorporated

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

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