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1FEATURES
LP PACKAGE(TOP VIEW)
CATHODE
ANODE
REF
FK PACKAGE(TOP VIEW)
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
NCNCNCANODENC
NCNCNCNCNC
NC
CA
TH
OD
EN
CN
CN
CR
EF
NC
NC
NC
NC
1
2
3
4
8
7
6
5
CATHODEANODEANODE
NC
REFANODEANODENC
D PACKAGE(TOP VIEW)
NC – No internal connectionANODE terminals are connected internally.
1
2
3
4
8
7
6
5
CATHODENCNCNC
REFNCANODENC
JG OR PW PACKAGE(TOP VIEW)
NC – No internal connection
KTP PACKAGE(TOP VIEW)
CATHODE
ANODE
REF
AN
OD
E
DESCRIPTION/ORDERING INFORMATION
TL1431PRECISION PROGRAMMABLE REFERENCE
SLVS062L–DECEMBER 1991–REVISED OCTOBER 2007www.ti.com
2• 0.4% Initial Voltage Tolerance • Sink Current Capability…1 mA to 100 mA• 0.2-Ω Typical Output Impedance • Low Reference Current (REF)• Fast Turnon…500 ns • Adjustable Output Voltage…VI(ref) to 36 V
The TL1431 is a precision programmable reference with specified thermal stability over automotive, commercial,and military temperature ranges. The output voltage can be set to any value between VI(ref) (approximately 2.5 V)and 36 V with two external resistors (see Figure 16). This device has a typical output impedance of 0.2 Ω. Activeoutput circuitry provides a very sharp turnon characteristic, making the device an excellent replacement for Zenerdiodes and other types of references in applications such as onboard regulation, adjustable power supplies, andswitching power supplies.
The TL1431C is characterized for operation over the commercial temperature range of 0°C to 70°C. TheTL1431Q is characterized for operation over the full automotive temperature range of –40°C to 125°C. TheTL1431M is characterized for operation over the full military temperature range of –55°C to 125°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TL1431PRECISION PROGRAMMABLE REFERENCESLVS062L–DECEMBER 1991–REVISED OCTOBER 2007
ORDERING INFORMATION (1)
TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKINGPowerFLEX™ – KTP Reel of 3000 TL1431CKTPR OBSOLETE
Tube of 75 TL1431CDSOIC – D 1431C
Reel of 2500 TL1431CDR0°C to 70°C Bulk of 1000 TL1431CLP
TO-226 / TO-92 – LP TL1431CReel of 2000 TL1431CLPRTube of 150 TL1431CPW
TSSOP – PW T1431Reel of 2000 TL1431CPWRTube of 75 TL1431QD
SOIC – D TL1431QDReel of 2500 TL1431QDR
–40°C to 125°CTube of 150 TL1431QPW
TSSOP – PW T1431QPWReel of 2000 TL1431QPWR
CDIP – JG Tube of 50 TL1431MJG TL1431MJG–55°C to 125°C
LCCC – FK Tube of 55 TL1431MFK TL1431MFK
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIweb site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
TJ Operating virtual junction temperature 150 °CLead temperature 1,6 mm (1/16 in) from case for 10 s 260 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to ANODE, unless otherwise noted.(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.(4) The package thermal impedance is calculated in accordance with JESD 51-7.(5) Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) – TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.(6) The package thermal impedance is calculated in accordance with MIL-STD-883.
Ioff Off-state cathode current VKA = 36 V, VI(ref) = 0 Figure 3 μAFull range 2
VKA = VI(ref), f ≤ 1 kHz,|zKA| Output impedance (3) 25°C Figure 1 0.2 0.4 ΩIKA = 1 mA to 100 mA
(1) Full range is 0°C to 70°C for C-suffix devices.(2) The deviation parameters VI(dev) and II(dev) are defined as the differences between the maximum and minimum values obtained over the
rated temperature range. The average full-range temperature coefficient of the reference input voltage αVI(ref) is defined as:
αVI(ref) is positive or negative, depending on whether minimum VI(ref) or maximum VI(ref), respectively, occurs at the lower temperature.
Off-state cathodeIoff VKA = 36 V, VI(ref) = 0 Figure 3 μAFullcurrent 2 2rangeVKA = VI(ref), f ≤ 1 kHz,|zKA| Output impedance (4) 25°C Figure 1 0.2 0.4 0.2 0.4 ΩIKA = 1 mA to 100 mA
(1) Full range is –40°C to 125°C for Q-suffix devices and –55°C to 125°C for M-suffix devices.(2) The deviation parameters VI(dev) and II(dev) are defined as the differences between the maximum and minimum values obtained over the
rated temperature range. The average full-range temperature coefficient of the reference input voltage αVI(ref) is defined as:
αVI(ref) is positive or negative, depending on whether minimum VI(ref) or maximum VI(ref), respectively, occurs at the lower temperature.(3) On products compliant to MIL-PRF-38535, this parameter is not production tested.
TL1431PRECISION PROGRAMMABLE REFERENCESLVS062L–DECEMBER 1991–REVISED OCTOBER 2007
Figure 1. Test Circuit for V(KA) = Vref Figure 2. Test Circuit for V(KA) > Vref
Figure 3. Test Circuit for Ioff
Data at high and low temperatures are applicable only within the recommended operating free-air temperatureranges of the various devices.
Table of GraphsGRAPH FIGURE
Reference voltage vs Free-air temperature 4Reference current vs Free-air temperature 5Cathode current vs Cathode voltage 6, 7Off-state cathode current vs Free-air temperature 8Ratio of delta reference voltage to delta cathode voltage vs Free-air temperature 9Equivalent input-noise voltage vs Frequency 10Equivalent input-noise voltage over a 10-second period 11Small-signal voltage amplification vs Frequency 12Reference impedance vs Frequency 13Pulse response 14Stability boundary conditions 15
A. The areas under the curves represent conditions that may cause the device to oscillate. For curves B, C, and D, R2 and V+ areadjusted to establish the initial VKA and IKA conditions, with CL = 0. VBATT and CL then are adjusted to determine the ranges ofstability.
Orderable Device Status (1) Package Type PackageDrawing
Pins Package Qty Eco Plan (2) Lead/Ball Finish
MSL Peak Temp (3) Samples
(Requires Login)
TL1431CPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM Contact TI Distributoror Sales Office
TL1431MFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type Purchase Samples
TL1431MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type Purchase Samples
TL1431MJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type Purchase Samples
TL1431MJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type Purchase Samples
TL1431QD ACTIVE SOIC D 8 75 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/Level-1-235C-UNLIM
Contact TI Distributoror Sales Office
TL1431QDG4 ACTIVE SOIC D 8 75 Green (RoHS& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM Request Free Samples
TL1431QDR ACTIVE SOIC D 8 2500 Green (RoHS& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM Purchase Samples
TL1431QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM Purchase Samples
TL1431QLP OBSOLETE TO-92 LP 3 TBD Call TI Call TI Samples Not Available
TL1431QLPR OBSOLETE TO-92 LP 3 TBD Call TI Call TI Samples Not Available
TL1431QPWR ACTIVE TSSOP PW 8 2000 TBD CU NIPDAU Level-1-250C-UNLIM Purchase Samples
TL1431QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM Purchase Samples
(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TL1431, TL1431-SP, TL1431M :
NOTES: A. All linear dimensions are in inches (millimeters).B. This drawing is subject to change without notice.C. This package can be hermetically sealed with a ceramic lid using glass frit.D. Index point is provided on cap for terminal identification.E. Falls within MIL STD 1835 GDIP1-T8
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358(9,09)
MAX
(11,63)
0.560(14,22)
0.560
0.458
0.858(21,8)
1.063(27,0)
(14,22)
ANO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342(8,69)
MIN
(11,23)
(16,26)0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)0.938
(28,99)1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)0.064 (1,63)
(7,80)0.307
(10,31)0.406
(12,58)0.495
(12,58)0.495
(21,6)0.850
(26,6)1.047
0.045 (1,14)
0.045 (1,14)0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
121314151618 17
11
10
8
9
7
5
432
0.020 (0,51)0.010 (0,25)
6
12826 27
19
21B SQ
A SQ22
23
24
25
20
0.055 (1,40)0.045 (1,14)
0.028 (0,71)0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).B. This drawing is subject to change without notice.C. This package can be hermetically sealed with a metal lid.D. The terminals are gold plated.E. Falls within JEDEC MS-004
NOTES: A. All linear dimensions are in inches (millimeters).B. This drawing is subject to change without notice.C. The center lead is in electrical contact with the thermal tab.D. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).E. Falls within JEDEC TO-252 variation AC.
PowerFLEX is a trademark of Texas Instruments.
MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LP (O-PBCY-W3) PLASTIC CYLINDRICAL PACKAGE
4040001-2/C 10/01
STRAIGHT LEAD OPTION
0.016 (0,41)
0.014 (0,35)
0.157 (4,00) MAX
FORMED LEAD OPTION
0.104 (2,65)
0.210 (5,34)0.170 (4,32)
0.050 (1,27)
0.016 (0,41)
0.022 (0,56)
0.500 (12,70) MIN
SeatingPlane
0.175 (4,44)0.205 (5,21) 0.165 (4,19)
0.125 (3,17)DIA
D
C
0.105 (2,67)0.095 (2,41)
0.135 (3,43) MIN
0.080 (2,03)
0.055 (1,40)0.045 (1,14)
1
0.105 (2,67)
2 3
0.080 (2,03)0.105 (2,67)
NOTES: A. All linear dimensions are in inches (millimeters).B. This drawing is subject to change without notice.
C. Lead dimensions are not controlled within this area
D. FAlls within JEDEC TO -226 Variation AA (TO-226 replaces TO-92)E. Shipping Method:
Straight lead option available in bulk pack only.Formed lead option available in tape & reel or ammo pack.
MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LP (O-PBCY-W3) PLASTIC CYLINDRICAL PACKAGE
4040001-3/C 10/01
0.094 (2,40)0.114 (2,90)
0.460 (11,70)0.539 (13,70)
TAPE & REEL
0.335 (8,50)0.384 (9,75)
0.020 (0,50) MIN
0.217 (5,50)0.748 (19,00) 0.748 (19,00)
0.689 (17,50)
0.098 (2,50)
0.433 (11,00)0.335 (8,50)
0.610 (15,50)0.650 (16,50)
1.260 (32,00)0.905 (23,00)
0.234 (5,95)0.266 (6,75)
0.512 (13,00)0.488 (12,40)
0.114 (2,90)0.094 (2,40) 0.146 (3,70)
0.169 (4,30)DIA
NOTES: A. All linear dimensions are in inches (millimeters).B. This drawing is subject to change without notice.C. Tape and Reel information for the Format Lead Option package.
NOTES: A. All linear dimensions are in millimeters.B. This drawing is subject to change without notice.C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.D. Falls within JEDEC MO-153
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