TIM - FRDen.frd.cn/Private/ProductFiles/1504cacd1f500fb9bff1.pdf · A：TIM is a material used between heat source and sink to accelerate the efﬁciency of heat dissipation. Generally

Total Solution for Thermal Interface Material

TIMT h e r m a l I n t e r f a c e M a t e r i a l

T h e r m a l l y C o n d u c t i v e S o l u t i o n P r o v i d e r

ISO 9001 : 2008 · ISO 14001 : 2004 · QC 080000 : 2012 · OHSAS 18001 : 2007 · ISO/TS 16949 : 2009

1

CONTENTS

Company Overview 2 Therm-Gap 2800 22

Basic Theory 3 Therm-Gap 3500 23

Selection Guide 4 Therm-Gap 5000 24

Typical Application 5 Therm-Filler™(Two-Part Thermally Conductive Liquid Gap Filling Material)

25

Therm-Pad®(Thermally Conductive Insulator) 6 Therm-Filler 1800 25

Therm-Pad 1000 6 Therm-Filler 3500 26

Therm-Pad 1300 7 Therm-Gel™(Single-Part Thermally Conductive Liquid Gap Filling Material)

27

Therm-Pad 1500 8 Therm-Gel 3500S 27

Therm-Pad 1600 9 Therm-Bond™(Thermally Conductive Adhesive Tape)

28

Therm-Gap®(Thermally Conductive Gap Filling Material)

10 Therm-Bond 900 28

Therm-Gap 1100SP05 10 Therm-Bond X25A 29

Therm-Gap 1200 11 Therm-Grease™(Thermally Conductive Grease Compound)

30

Therm-Gap 1300 12 Therm-Grease 1000 30

Therm-Gap 1300SF 13 Therm-Grease 2000 31

Therm-Gap 1300SP 14 Therm-Grease 3800 32

Therm-Gap 1500 15 Therm-Form™(Thermally Conductive Potting Gel) 33

Therm-Gap 1500BS40 16 Therm-Form 300H4 33

Therm-Gap 1800 17 Therm-Flow™(Thermally Conductive Phase Change Material)

34

Therm-Gap 2200 18 Therm-Flow 1000 34

Therm-Gap 2400 19 Therm-Flow 2000 35

Therm-Gap 2400S20 20 Therm-Flow 3700 36

Therm-Gap 2500BUS 21 TIM Thermal Property and Specification Summary 38

2

Established in Shenzhen, China, in 1993, FRD manufactures

a wide range of products including EMI Shielding Materials,

Thermal Interface Materials and other related electronic materials.

FRD is a registered National Hi-Tech Enterprise and certificate of

ISO9001, ISO14001, QC080000 and OHSAS18001.

FRD works to satisfy the needs of its customers and we excel in

speed and flexibility. FRD has long-term business relationships

with customers such as Huawei, ZTE, Cisco, Nokia, Alcatel-

Lucent, Juniper, Dell, H3C, Microsoft, Lenovo, Xiaomi, Samsung,

Foxconn, Flextronics, Jabil, PEGATRON, SANMINA-SCI, O-Film

Emerson, GREE, BYD, FUJI XEROX, TOSHIBA, etc.

As a leading manufacturer in its industry, FRD is growing

tremendously. We are willing to provide quality products

and services for more customers in various industries

than our competition. These industries include networks &

telecommunication equipment, consumer electronics, automotive,

power supplies, lighting, military, aerospace, etc.

In the future, FRD will continue to meet the challenge, to grow

the FRD brand name, and to strive to become a world-class

technology leader in new materials for all of our manufacturing

processes.

Company Overview

FRD Building ( Shenzhen )

New South China Base Shenzhen Guangming FRD New Materials Park

East China BaseKunshan FRD Electronic Materials Co.,Ltd.

North China Base Tianjin FRD Science & Technology Co.,Ltd

3

Fourier Equation：Heat conduction of uniform interface material, generally based on one

dimensional approach, can be described with Fourier Equation in the

process of heat transfer:

（1）

Q: heat flow, W

K: thermal conductivity, W/m·K

A: contact area, m²

T: temperature variation between the heat surfaces of inflows and

outflows, d: thickness of wall, m

Thermal conductivity: an inherent thermal property of the single material,

having nothing to do with the size or shape of material.

For the interface material reinforced by fiberglass or polyimide, the thermal

conductivity depends on the relative thickness and thermal direction

performance, and thus the relative thermal conductivity is more appropriate.

Thermal resistance: the opposition to the flow of heat through a unit area of

material across a unit thickness:

（2）

For the single material, the thermal resistance and thickness are in

direct proportion; and for the non-single material, the thermal resistance

increases with increasing thickness of the material totally, but not changes

in linear relation.

Thermal impedance: the sum of thermal resistance and thermal contact

resistance is described as thermal impedance. Thermal impedance is more

appropriate to represent thermal performance in some certain situation.

（3）

Surface perpendicularity, surface roughness, fastening force, stock

thickness and modulus of compression all affect the thermal contact

resistance. Because of the effect of practical application conditions, thermal

impedance also depends on the actual assembly condition actual assembly

condition.

Influencing factor:

Contact area A: the more contract area increases, the less thermal

contact resistance will be.

Thickness d: the more thickness of insulator increases, the more

thermal contact resistance will be.

Pressure of assembly: in ideal circumstances, the more pressure

of assembly increases, the less thermal resistance will be, and

thermal resistance will decrease little by little when pressure

increases into a certain value, which is the optimal pressure.

Besides, thermal contact resistance is also related to test

method.

Test method for thermal resistance:Test method: ASTM D5470

Test principle and methods:

Cylinder area ( Top tip of tester ): 1in²

Roughness: less than 1μm

Material: aluminum 6160 T6

Material of heat block and balancing heater: copper

Soft material: pressure can be as low as 0.069 MPa ( 10psi )

Hard material: pressure can reach up to 3.4 MPa ( 500psi )

Material easy to deformation, can be controlled thickness over by the

screw or liner brake.

Balanced judgement: temperature variation within 10 minutes is less

than 1Test diagram is as shown in the following figure:

Note: refer to ASTM D5470 test standard

Calculation method:

1. Calculate the heat flow from the applied electrical power

（4）

Q: heat flow, W

V: electrical potential applied to the heater, V

I: electrical current flow in the heater, A

2. Derive the temperature of the hot meter bar

surface in contact with the sample

（5）

TH: temperature of the hot meter bar surface in

contact with the sample, K

T1: warmer temperature of the hot meter bar, K

T2: cooler temperature of the hot meter bar, K

dA: distance between T1 and T2, m

dB: distance from T2 to the surface of the hot

meter bar in contact with the sample, m

3. Derive the temperature of the cold meter bar surface in contact with the

sample

（6）

TC: temperature of the cold meter bar surface in contact with the

sample, K

T3: warmer temperature of the cold meter bar, K

T4: cooler temperature of the cold meter bar, K

dC: distance between T3 and T4, m

dD: distance from T3 to the surface of the cold meter bar in contact

with the sample, m

4. Calculate the thermal impedance from Eq 7 and express it in units of

m²·K/W

（7）

5. Thermal conductivity is calculated by the slope of thickness and its

thermal resistance tested by single layer and multilayer.

The reciprocal of the straight slope with thickness of sample as X axis and

thermal resistance as Y axis is thermal conductivity, and the intersection

of zero thickness represents thermal resistance Ri, which depends on the

sample, pressures on the sample and the surface situation.

Heat Sink

Cold Meter Bar

Hot Meter Bar

Thermal Properties and Testing

4

Frequently asked questions

① Q：What is the thermal interface material ?

A：TIM is a material used between heat source and sink to accelerate

the efficiency of heat dissipation. Generally good thermal conductivity

and surface wettability are important for TIM.

② Q：May TIM cause short circuit between electronic components?

A：No. TIM of FRD are all electric-insulating.

③ Q：Is TIM offered with a customized size?

A：Yes. Any size and shape in the certain range listed in the datasheet

are available.

④ Q：Is TIM offered with an adhesive?

A：Currently, Therm-Pad serious are offered with and without

an adhesive shaped into any forms according to requirements of

customers.

Therm-Gap series have the natural inherent tack.

⑤ Q：Are there any differences between silicone-free and silicious

thermally conductive pads?

A：Silicone-free thermally conductive pad, pad without silicone oil

when use, which ensures no pollution.

Silicone thermally conductive pad remains the good properties (e.g.

mechanical property, weatherability, etc.) and good adaptability in use

temperature and mechanical when in use; Silicone-free thermally

conductive pad has lower use temperature with the specific process.

⑥ Q：How to select TIM?

A：Type of TIM may be determined first for your application; then

select appropriate TIM according to the parameters (e.g. thermal

conductivity, size, thickness, density, hardness, dielectric breakdown

voltage, use temperature, etc.)

The selection of thickness is related with the aim position and gap

size, as well as the parameters of product (e.g. density, hardness,

compression rate, etc.)

Sample tests before decision are suggested.

The selection of thermal conductivity is determined by the product heat

power and cooling capacity of heat sink.

Each application has specific characteristics that determine which TIM

will optimize thermal performance. Select a match of two TIM that best

fit the application, then conduct testing to determine which material

performs the best.

⑦ Q：What do the applications of TIM include?

A：Telecommunication, network equipment, data communication,

LED, automotive electronic, consumer electronic, medical equipment

military, aerospace, etc.

TIM building a part number

TIM Selection Guide

Therm-Pad 1000 A1

Gumming

Thermal conductivity

Thermally conductive insulator series

Thermally conductive material

Therm-Bond 100

Thermal conductivityThermally conductive adhesive tape series


Therm-Filler 1800

Thermal conductivityTwo-Part thermally conductive liquid gap filler series


Therm-Gel 3500S


Single-Part

One-Part thermally conductive liquid gap filler seriesThermally conductive material

Therm-Grease 1000

Thermal conductivityThermally conductive grease compound series


Therm-Form 300H4

Thermal conductivityCuring time

Thermally conductive potting gel seriesThermally conductive material

Therm-Flow 2000

Thermal conductivityThermally conductive phase change material series


Therm-Gap 2400S20 DC1Single-Face hardening

Hardness


Thermally conductive gap filling material series


5

TIM Application

Therm-Pad Thermally conductive insulator series

Therm-Gap Thermally conductive gap filling material series

Therm-Bond Thermally conductive adhesive tape seriesTherm-Filler Thermally conductive two-part liquid gap filler material series

Therm-Gel Thermally conductive single-part liquid gap filler material series

Therm-Grease Thermally conductive grease compound series

Therm-Flow Thermally conductive phase change material series

Therm-Form Thermally conductive potting gel series

SHENZHEN FRD SCIENCE & TECHNOLOGY CO., LTD.FRD Building, 8# Gaofa Industrial Park, Beihuan Blvd, Nanshan District, Shenzhen, China.

Tel: 86-755-8608-1680 Fax: 86-755-8608-1689 Web: www.frd.cn E-mail: [email protected]

6

TIM Total Solution

Therm-Pad 1000 Typical PropertiesProperty Typical Value Test MethodColor Pink Visual Inspection

Thickness ( mm ) 0.15 ASTM D374

Reinforcement Carrier Polyimide /

Hardness ( Shore A ) 92 ASTM D2240

Elongation at Break ( % ) 20 ASTM D412

Tensile Strength ( MPa ) 30 ASTM D412

Continuous Use Temperature ( ) -60~180 /

ElectricalDielectric Breakdown Voltage ( kV ) ≥ 7 ASTM D149

Volume Resistivity ( Ω·cm ) 1.3x1012 ASTM D257

Flame Rating V-0 UL94

ThermalThermal Conductivity ( W/m·K ) 1.0 ASTM D5470

Thermal Impedance VS. Pressure ( Reference Sample: 0.15mm / Thickness )Pressure ( psi ) 5 10 25 50 60

Thermal Impedance ( ·in2/W ) 1.10 0.97 0.67 0.42 0.40

Compression Rate ( % ) 3% 7% 11% 14% 15%

Therm-Pad ® 1000 High-Performance,

Thermally Conductive Insulator

Features and Benefits• Good thermal conductivity, low thermal impedance• High dielectric breakdown voltage• Smooth, good surface compliance• Low mounting pressure• UL94-V0 Flame Rating• RoHS, Halogen-Free

SpecificationTherm-Pad 1000 is a thermally conductive insulator made from thermally conductive silicone rubber with polyimide as the reinforcement carrier, which has good thermal conductivity and high dielectric strength. Therm-Pad 1000 is mainly used between a power semiconductor component and its heat sink, where requires high thermal conductivity and insulating property. Therm-Pad 1000 is soft and smooth, also has quite good surface compliance upon kinds of metal and ceramic components. Therm-Pad 1000 is able to achieve low interfacial thermal resistance and high-efficiency heat dissipation of power components under lower pressures with its high thermal conductivity.

Typical Applications• Power Supply• LED• Automotive Electronics• Communication Equipment• Network Terminal• Storage Device• Consumer Electronics• Security Equipment

Packaging Related• Standard Roll Form• Packaging Specification

Size: ( Width * Thickness ) * Length( 505mm * 0.15mm ) * 60m

Storage• Shelf Life: 18 months• Storage Conditions:

Temperature: 15 < T < 30Relative Humidity: RH < 70%



7

TIM Total Solution

Therm-Pad 1300 Typical PropertiesProperty Typical Value Test MethodColor Yellow Visual Inspection


Reinforcement Carrier Polyimide /















SpecificationTherm-Pad 1300 is a thermally conductive insulator made from thermally conductive silicone rubber with polyimide as reinforcement carrier, which has good thermal conductivity and high dielectric strength. Therm-Pad 1300 is mainly used between a power semiconductor component and its heat sink, where requires high thermal conductivity and insulating property. Therm-Pad 1300 is soft and smooth, also has quite good surface compliance upon kinds of metal and ceramic components. Therm-Pad 1300 is able to achieve low interfacial thermal resistance and high-efficiency heat dissipation of power components under lower pressures with its high thermal conductivity.



Size: ( Width * Thickness ) * Length( 250mm * 0.15mm ) * 100m







8

TIM Total Solution



Reinforcement Carrier Fiberglass /


Elongation at Break ( % ) 2.5 ASTM D412













SpecificationTherm-Pad 1500 is a thermally conductive insulator made from thermally conductive silicone rubber with fiberglass as reinforcement carrier, which has good thermal conductivity and high dielectric strength. Therm-Pad 1500 is mainly used between a power semiconductor component and heat sink, where requires high thermal conductivity and insulating property.Therm-Pad 1500 is soft and smooth, also has quite good surface compliance upon kinds of metal and ceramic components. Therm-Pad 1500 is able to achieve low interfacial thermal resistance and high-efficiency heat dissipation of power components under lower pressures with its good thermal conductivity.



Size: ( Width * Thickness ) * Length( 305mm * 0.19mm ) * 76.2m





9

TIM Total Solution


Thermally Conductive InsulatorTherm-Pad ® 1600 High-Performance,



SpecificationTherm-Pad 1600 is a thermally conductive insulator made from thermally conductive silicone rubber with fiberglass as reinforcement carrier, which has good thermal conductivity and high dielectric strength. Therm-Pad 1600 is mainly used between a power semiconductor component and heat sink, where requires high thermal conductivity and insulating property. Therm-Pad 1600 is soft and smooth, also has quite good surface compliance upon kinds of metal and ceramic components. Therm-Pad 1600 is able to achieve low interfacial thermal resistance and high-efficiency heat dissipation of power components under lower pressures with its high thermal conductivity.




Reinforcement Carrier Fiberglass /













Size: ( Width * Thickness ) * Length( 305mm * 0.23mm ) * 76.2m



10SHENZHEN FRD SCIENCE & TECHNOLOGY CO., LTD.FRD Building, 8# Gaofa Industrial Park, Beihuan Blvd, Nanshan District, Shenzhen, China.


TIM Total Solution

Therm-Gap® 1100SP05 Good Performance, Thermally Conductive,

Composite Structure, Gap Filling Material

Features and Benefits• Good thermal conductivity, low thermal impedance• Composite structure, high dielectric breakdown strength• Highly soft, splendid surface compatibility• Excellent elasticity, high reliability in long-term work• Multiple choices of thickness for wide range of application

SpecificationTherm-Gap 1100SP05 is a composite material with good thermal conductivity. Therm-Gap 1100SP05 is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 1100SP05 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects.Therm-Gap 1100SP05 is resistant to high voltage and has good thermostability, which allows its safety and reliability.Therm-Gap 1100SP05 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips.

Typical Applications• Communication Equipment• Network Terminal• Storage Device• LED• Consumer Electronics• Power Components• Security Equipment

Packaging Related• Sheet Form • Packing Specification

Size: Length * Width ( Thickness ) 400mm * 300mm ( 0.5 ≤ T < 1.0mm )400mm * 290mm ( 1.0 ≤ T < 2.0mm )400mm * 200mm ( 2.0 ≤ T ≤ 5.0mm )



Therm-Gap 1100SP05 Typical PropertiesProperty Typical Value Test MethodColor White/Pink Visual InspectionThickness ( mm ) ( mil )

0.5~5.0 ( 20~200 )

ASTM D374

Single Reinforcement Carrier Thermally Conductive Insulator /

Density ( g/cc ) 2.10 ASTM D792

Hardness ( Shore OO ) 5 ASTM D2240


ElectricalDielectric Breakdown Strength ( kV/mm ) ≥ 10 ASTM D149




Thermal Impedance VS. Pressure ( Reference Sample: 1mm / Thickness )Pressure ( psi ) 2 5 10 20 30 40

Thermal Impedance ( ·in2/W ) 0.85 0.80 0.69 0.63 0.56 0.48

Compression Rate ( % ) 8% 21% 34% 45% 55% 63%



TIM Total Solution

Therm-Gap® 1100SP05 Good Performance, Thermally Conductive,

Composite Structure, Gap Filling MaterialTherm-Gap® 1200 Good Performance,

Thermally Conductive, Gap Filling Material

Features and Benefits• Good thermal conductivity, low thermal impedance• High dielectric breakdown strength • Soft, splendid surface compatibility• Excellent elasticity, high reliability in long-term work • Multiple choices of thickness for wide range of application

SpecificationTherm-Gap 1200 has excellent thermal conductivity, and can achieve low interfacial thermal resistance under lower pressures.Therm-Gap 1200 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects.Therm-Gap 1200 is resistant to high voltage and has good thermostability, which allows its safety and reliability.Therm-Gap 1200 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips.


Therm-Gap 1200 Typical PropertiesProperty Typical Value Test MethodColor Black Visual InspectionThickness ( mm ) ( mil )

0.25~1.0 ( 1.0 is not included ) ( 10~40 )

1.0~5.0 ( 40~200 )

ASTM D374

Fiberglass Reinforcement Carrier Yes No /


Hardness ( Shore OO ) 78 55 ASTM D2240















TIM Total Solution

Therm-Gap® 1300 Good Performance,


Features and Benefits• Highly soft, splendid surface wettability • Good thermal conductivity, low thermal impedance• High dielectric breakdown strength• Low silicone oil leakage rate• Excellent elasticity, high reliability in long-term work

SpecificationTherm-Gap 1300 has excellent thermal conductivity, and can achieve low interfacial thermal resistance under lower pressures. Therm-Gap 1300 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects.Therm-Gap 1300 is resistant to high voltage and has good thermostability, which allows its safety and reliability.Therm-Gap 1300 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips.


Therm-Gap 1300 Typical PropertiesProperty Typical Value Test MethodColor Light green Visual InspectionThickness ( mm ) ( mil )

0.25~1.0 ( 1.0 is not included ) ( 10~40 )

1.0~5.0 ( 40~200 )

ASTM D374


















TIM Total Solution


Thermally Conductive, Gap Filling MaterialTherm-Gap® 1300SF High Performance Thermally Conductive,

Silicone-Free Gap Filling Material

Features and Benefits• Good thermal conductivity, low thermal impedance• No silicone outgassing, no silicone extraction• Medium hardness, splendid surface compatibility• Excellent elasticity, high reliability in long-term work • Multiple choices of thickness for wide range of application

SpecificationTherm-Gap 1300SF has excellent thermal conductivity, and can achieve low interfacial thermal resistance under lower pressures.Therm-Gap 1300SF is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects.Therm-Gap 1300SF is a thermal material with no silicone oil leakage, and has good thermostability, which allows its safety and reliability.Therm-Gap 1300SF possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips.

Typical Applications• Security Equipment• Network Terminal• Storage Device• LED• Consumer Electronics• Other Silicone-sensitive Devices

Therm-Gap 1300SF Typical PropertiesProperty Typical Value Test MethodColor White Visual InspectionThickness ( mm ) ( mil )

0.50~5.0 ( 20~200 )

ASTM D374

Fiberglass Reinforcement Carrier No /












Size: Length * Width ( Thickness ) 400mm * 400mm ( 0.5 ≤ T < 2.0mm )400mm * 200mm ( 2.0 ≤ T ≤ 5.0mm )





TIM Total Solution

Therm-Gap® 1300SP Good Performance, Thermally Conductive,

Composite Structure, Gap Filling Material

Features and Benefits• Good thermal conductivity, low thermal impedance• Composite structure, high dielectric breakdown strength• Highly soft, splendid surface compatibility• Excellent elasticity, high reliability in long-term work • Multiple choices of thickness for wide range of application

SpecificationTherm-Gap 1300SP is a composite material with good thermal conductivity. Therm-Gap 1300SP is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 1300SP is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects.Therm-Gap 1300SP is resistant to high voltage and has good thermostability, which allows its safety and reliability.Therm-Gap 1300SP possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips.


Therm-Gap 1300SP Typical PropertiesProperty Typical Value Test MethodColor Light green/Pink Visual InspectionThickness ( mm ) ( mil )

0.50~5.0 ( 20~200 )

ASTM D374

Single Reinforcement Carrier Thermally Conductive Insulator /













Storage• Shelf Life: 18 months• Storage Conditions: • Temperature: 15 < T < 30

Relative Humidity: RH < 70%



TIM Total Solution

Therm-Gap® 1300SP Good Performance, Thermally Conductive,

Composite Structure, Gap Filling MaterialTherm-Gap® 1500 Good Performance,


Features and Benefits• Good thermal conductivity, low thermal impedance• High dielectric breakdown strength• Highly soft, splendid surface compatibility• Excellent elasticity, high reliability in long-term work • Multiple choices of thickness for wide range of application

SpecificationTherm-Gap 1500 has excellent thermal conductivity, and can achieve low interfacial thermal resistance under lower pressures.Therm-Gap 1500 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects.Therm-Gap 1500 is a thermal material with no silicone oil leakage, and has good thermostability, which allows its safety and reliability.Therm-Gap 1500 possesses highly soft property and excellent elasticity to reduce the structure stress and protect microchips.


Therm-Gap 1500 Typical PropertiesProperty Typical Value Test MethodColor White Visual InspectionThickness ( mm ) ( mil )

0.25~1.0 ( 1.0 is not included ) ( 10~40 )

1.0~5.0 ( 40~200 )

ASTM D374


















TIM Total Solution

Therm-Gap 1500BS40 Typical PropertiesProperty Typical Value Test MethodColor Black Visual InspectionThickness ( mm ) ( mil )

0.5~5.0( 20~200)

ASTM D374









Thermal Impedance VS. Pressure ( Reference Sample: 1mm / Thickness )Pressure ( psi ) 5 10 20 30 40



Therm-Gap® 1500BS40 Good Performance,


Features and Benefits• Good thermal conductivity, low thermal impedance• High dielectric breakdown strength• Soft, splendid surface compatibility• Excellent elasticity, high reliability in long-term work• Multiple choices of thickness for wide range of application

SpecificationTherm-Gap 1500 has excellent thermal conductivity, and can achieve low interfacial thermal resistance under lower pressures.Therm-Gap 1500 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectivelyand achieve excellent fill effects.Therm-Gap 1500 is a thermal material with no silicone oil leakage, and has good thermostability, which allows its safety and reliability.Therm-Gap 1500 possesses highly soft property and excellent elasticity to reduce the structure stress and protect microchips.


Packaging Related• Sheet Form• Packing Specification

Size: Length * Width ( Thickness )400mm * 400mm ( 0.5 ≤ T < 2.0mm )400mm * 200mm ( 2.0 ≤ T ≤ 5.0mm )





TIM Total Solution



Features and Benefits• Good thermal conductivity, low thermal impedance• Composite structure, high dielectric breakdown strength• Highly soft, splendid surface compatibility• Excellent elasticity, high reliability in long-term work • Multiple choices of thickness for wide range of application

SpecificationTherm-Gap 1800 has good thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 1800 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects.Therm-Gap 1800 is resistant to high voltage and has good thermostability, which allows its safety and reliability.Therm-Gap 1800 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips.


Therm-Gap 1800 Typical PropertiesProperty Typical Value Test MethodColor Pink Visual InspectionThickness ( mm ) ( mil )

1.0~5.0 ( 40~200 )

ASTM D374


















TIM Total Solution



Features and Benefits• Good thermal conductivity, low thermal impedance• High dielectric breakdown strength• Highly soft, splendid surface wettability• Excellent elasticity, high reliability in long-term work • Multiple choices of thickness for wide range of application

SpecificationTherm-Gap 2200 has good thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 2200 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects.Therm-Gap 2200 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 2200 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips.


Therm-Gap 2200 Typical PropertiesProperty Typical Value Test MethodColor Blue Visual InspectionThickness ( mm ) ( mil )

1.0~5.0 ( 40~200 )

ASTM D374


















TIM Total Solution


Thermally Conductive, Gap Filling MaterialTherm-Gap® 2400 High Performance,


Features and Benefits• High thermal conductivity, low thermal impedance• High dielectric breakdown strength• Highly soft, splendid surface wettability• Excellent elasticity, high reliability in long-term work • Multiple choices of thickness for wide range of application

SpecificationTherm-Gap 2400 has high thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 2400 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects.Therm-Gap 2400 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 2400 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips.


Therm-Gap 2400 Typical PropertiesProperty Typical Value Test MethodColor Orange Visual InspectionThickness ( mm ) ( mil )

1.0~5.0 ( 40~200 )

ASTM D374


















TIM Total Solution

Therm-Gap® 2400S20 High Performance,


Features and Benefits• High thermal conductivity low thermal impedance• High dielectric breakdown strength, splendid surface wettability• Highly soft, fiberglass reinforced• Excellent elasticity, high reliability in long-term work• Multiple choices of thickness for wide range of application

SpecificationTherm-Gap 2400S20 has high thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 2400S20 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 2400S20 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 2400S20 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips.


Therm-Gap 2400S20 Typical PropertiesProperty Typical Value Test MethodColor Light blue Visual InspectionThickness ( mm ) ( mil )

0.50~5.0 ( 20~200 )

ASTM D374

Fiberglass Reinforcement Carrier Yes /












Size: Length * Width ( Thickness ) 400mm * 200mm ( 0.5 ≤ T ≤ 5.0mm )





TIM Total Solution

Therm-Gap® 2400S20 High Performance,

Thermally Conductive, Gap Filling MaterialTherm-Gap® 2500BUS High Performance,


Features and Benefits• High thermal conductivity, low thermal impedance• High dielectric breakdown strength• Medium hardness, splendid surface compatibility• Excellent elasticity, high reliability in long-term work • Multiple choices of thickness for wide range of application

SpecificationTherm-Gap 2500BUS has high thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 2500BUS is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 2500BUS is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 2500BUS possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips.


Therm-Gap 2500BUS Typical PropertiesProperty Typical Value Test MethodColor Blue Visual InspectionThickness ( mm ) ( mil )

0.18~0.25 ( 0.25 is not included )( 7~10 )

0.25~1.0 ( 1.0 is not included ) ( 10~40 )

ASTM D374

Fiberglass Reinforcement Carrier Yes /








Thermal Impedance VS. Pressure ( Reference Sample: 0.25mm / Thickness )Pressure ( psi ) 2 5 10 20 30 40



Packaging Related• Sheet Form• Packing Specification






TIM Total Solution

Therm-Gap® 2800 High Performance,


Features and Benefits• High thermal conductivity, low thermal impedance• High dielectric breakdown strength• Splendid surface wettability• Excellent elasticity, high reliability in long-term work • Multiple choices of thickness for wide range of application

SpecificationTherm-Gap 2800 has high thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 2800 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects.Therm-Gap 2800 is resistant to high voltage and has good thermostability, which allows its safety and reliability.Therm-Gap 2800 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips.


Therm-Gap 2800 Typical PropertiesProperty Typical Value Test MethodColor Light blue Visual InspectionThickness ( mm ) ( mil )

0.25~1.0 ( 1.0 is not included ) ( 10~40 )

1.0~5.0 ( 40~200 )

ASTM D374


















TIM Total Solution


Thermally Conductive, Gap Filling MaterialTherm-Gap® 3500 High Performance,


Features and Benefits• High thermal conductivity, low thermal impedance • High dielectric breakdown strength• Highly soft, splendid surface wettability• Excellent elasticity, high reliability in long-term work • Multiple choices of thickness for wide range of application

SpecificationTherm-Gap 3500 has high thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 3500 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects.Therm-Gap 3500 is resistant to high voltage and has good thermostability, which allows its safety and reliability.Therm-Gap 3500 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips.



0.5~1.0 ( 1.0 is not included ) ( 20~40 )

1.0~5.0 ( 40~200 )

ASTM D374


















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Features and Benefits• Excellent thermal conductivity, extremely low thermal impedance• High dielectric breakdown strength• Splendid surface wettability• Excellent elasticity, high reliability in long-term work • Multiple choices of thickness for wide range of application

Specification Therm-Gap 5000 has high thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 5000 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects.Therm-Gap 5000 is resistant to high voltage and has good thermostability, which allows its safety and reliability.Therm-Gap 5000 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips.



0.5~1.0 ( 1.0 is not included ) ( 20~40 )

1.0~5.0 ( 40~200 )

ASTM D374


















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Features and Benefits• Two-Part 1:1, 100% solids• Curing at room or elevated temperatures• Resistant to high voltage, working well on the irregular structure gap• Excellent mechanical property and weather resistance

SpecificationTherm-Filler 1800 is a thermally conductive, liquid gap filling material, curing to a soft, highly thermally conductive, form-in-place elastomer at room or elevated temperatures. Therm-Filler 1800 possesses excellent structural applicability and ultra-conforming property, as well as fills the gaps fully, for components such as a heat sink, uneven ceramic or irregular cavity.Therm-Filler 1800 is resistant to high voltage and has good thermostability, which allows its safety and reliability.Therm-Filler 1800 flows under pressure like grease before cure and will not pump from the interface as a result of thermal cycling after cure. In addition, it can play the same role as the thermally conductive insulator after cure.


Therm-Filler™ 1800 Two-Part, Thermally Conductive Liquid Gap Filling Material

Packaging Related• Supplied in syringe or canning form• Packing Specification

Manner: Two-Part 1: 1, Mixed syringeVolume: 50cc / 400cc

Storage• Shelf Life: 6 months• Temperature: 15 < T < 30• Relative Humidity: RH < 70%

Therm-Filler 1800 Typical PropertiesProperty Typical Value Test MethodPerformance before Mixture A Part B PartColor White Yellow Visual InspectionViscosity ( mPa·s ) 250x103 250x103 ASTM D2196Density ( g/cc ) 2.65 2.65 ASTM D792Mix Ratio 1:1 /Shelf Life @25 ( months ) 6 6 /Performance after MixtureColor Yellow Visual InspectionHardness ( Shore OO ) 60 ( 1:1 as cured ) ASTM D2240Thermal Conductivity ( W/m·K ) 1.8 ASTM D5470Dielectric Breakdown Strength ( kV/mm ) ≥ 6 ASTM D149Volume Resistivity ( Ω·cm ) 1.0x1013 ASTM D257Flame Rating V-0 UL94Surface Curing Time @25 ( H ) 1.0 /Continuous Use Temperature ( ) -45~200 /Cure Schedule25 ( H ) 5 /100 ( min ) 15 /Thermal Impedance VS. Pressure ( Reference Sample 1mm / Thickness )Pressure ( psi ) 2 5 10 20 30 40Thermal Impedance ( ·in2/W ) 1.10 1.03 0.91 0.83 0.80 0.75 Compression Rate ( % ) 2% 6% 13% 20% 24% 28%



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Therm-Filler ™ 3500 Two-Part, Thermally Conductive Liquid Gap Filling Material

Therm-Filler 3500 Typical PropertiesProperty Typical Value Test MethodPerformance before Mixture A Part B PartColor White Yellow Visual InspectionViscosity ( mPa·s ) 200x103 200x103 ASTM D2196Density ( g/cc ) 2.75 2.75 ASTM D792Mix Ratio 1:1 /Shelf Life @25 ( months ) 6 6 /Performance after MixtureColor Yellow Visual InspectionHardness ( Shore OO ) 60 ( 1:1 as cured ) ASTM D2240Thermal Conductivity ( W/m·K ) 3.5 ASTM D5470Dielectric Breakdown Strength ( kV/mm ) ≥ 6 ASTM D149Volume Resistivity ( Ω·cm ) 1.0x1013 ASTM D257Flame Rating V-0 UL94Surface Curing Time @25 ( H ) 1.0 /Continuous Use Temperature ( ) -45~200 /Cure Schedule25 ( H ) 15 /100 ( min ) 40 /Thermal Impedance VS. Pressure ( Reference Sample: 1mm / Thickness )Pressure ( psi ) 2 5 10 20 30 40Thermal Impedance ( ·in2/W ) 0.90 0.83 0.70 0.55 0.44 0.40Compression Rate ( % ) 2% 6% 11% 20% 25% 28%

Features and Benefits• Two-Part 1:1, 100% solids• Curing at room or elevated temperatures• Resistant to high voltage, working well on the irregular structure gap• Excellent mechanical property and weather resistance

SpecificationTherm-Filler 3500 is a thermally conductive, liquid gap filling material, curing to a soft, highly thermally conductive, form-in-place elastomer at room or elevated temperatures. Therm-Filler 3500 possesses excellent structural applicability and ultra-conforming property, as well as fills the gaps fully, for components such as a heat sink, uneven ceramic or irregular cavity.Therm-Filler 3500 is resistant to high voltage and has good thermostability, which allows its safety and reliability.Therm-Filler 3500 flows under pressure like grease before cure and will not pump from the interface as a result of thermal cycling after cure. In addition, it can play the same role as the thermally conductive insulator after cure.



Manner: Two-Part 1: 1, Mixed syringeVolume: 50cc / 400cc




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Therm-Gel ™ 3500S Single-Part, Thermally Conductive Liquid Gap Filling Material

Features and Benefits• Single-Part • No curing with high reliability • Working well on the irregular structure gap• Resistant to high strength• Excellent mechanical property and weather resistance

SpecificationTherm-Gel 3500S is a thermally conductive, form-in-place, liquid gap filling material.Therm-Gel 3500S possesses excellent structural applicability and ultra-conforming property, as well as fills the gaps fully, for components such as a heat sink, uneven ceramic or irregular cavity.Therm-Gel 3500S is resistant to high voltage and has good thermostability, which allows its safety and reliabilty.Therm-Gel 3500S flows under pressure like grease and will not cure as a result of thermal cycling.


Therm-Gel 3500S Typical PropertiesProperty Typical Value Test MethodColor Yellow Visual Inspection


Output ( g/min ) 40 2.54mm Needle under 90Psi Pressure (30cc canning)

Typical Minimum Thickness ( mm ) 0.1 /


ElectricalDielectric Breakdown Strength ( kV/mm ) ＞ 6 ASTM D149


Thermal Expansion ( ppm/K ) 150 ASTM E831




Manner: Single-PartVolume: 30cc / 300cc




TIM Total Solution

Therm-Bond ™ 900 Thermally Conductive Double-Sided Adhesive Tape

Features and Benefits• Soft, easy to paste and move• Resistance to heat aging• Good thermal conductivity• High bonding strength• Die-Cut into various shapes

SpecificationTherm-Bond 900 is a white, thermally conductive, double-sided adhesive tape, with fiber glass as baseband and thermally conductive pressure sensitive adhesive coated on both side, which has good double-sided thermally conductive performance and low thermal impedance. Therm-bond 900 is covered by release film on one side for die-cutting easily, and has high bonding strength for a variety of surfaces including many materials, which is intended for thermally conductive adhesive solutions of microwave components.Therm-Bond 900 maintains high cohesive strength in its bond layer, and will resist slipping or dripping while bearing the continuous shearing force at elevated temperature, in applications to paste on heat generating components.

Typical Applications• Communication Devices• Computer• Network Terminal• Automatic Control Equipment• Consumer Electronics• Mobile Telephone

Packaging Related• Whole Roll: Length * Width

1030mm * 25m or 50m


Therm-Bond 900 Typical PropertiesProperty Typical Value Test MethodColor White /

Total Thickness ( mm ) 0.15 ASTM D374

Baseband Type Glass Fiber Cloth /

180 Peel Strength ( N/100mm ) ≥ 90 ASTM D1000

70 Holding Power ( 1kg/25mm ) H ＞ 72 ASTM D3654


ElectricalDielectric Breakdown Voltage ( kV ) ＞ 3 ASTM D149


Thermal Impedance VS. Pressure Thermal Impedance ( ·in2/W ) 20psi 1.11

ASTM D5470 30psi 1.03

50psi 0.93



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Therm-Bond™ X25A Thermally Conductive, Double-Sided Transfer Adhesive Tape

Features and Benefits• Soft, easy to paste and transfer• Resistance to heat aging• Good thermal conductivity• High bonding strength• Die-Cut into various shapes

SpecificationTherm-Bond X25A is a white, thermally conductive, double-sided adhesive tape, with thermally conductive pressure sensitive adhesive coated on both side, which has soft tape and certain tensile strength.Therm-Bond X25A is covered by release film on two sides for die-cutting easily, and has high bonding strength for a variety of surfaces including many materials, which is intended for thermally conductive adhesive solutions of microwave components.Therm-Bond X25A maintains high cohesive strength in its bond layer, and will resist slipping or dripping while bearing the continuous shearing force at elevated temperature, in applications to paste on heat generating components.

Typical Applications• Communication Devices• Computer• Network Terminal• Automatic Control Equipment• Consumer Electronics• Mobile Telephone

Packaging Related• Whole Roll: Width * Length

520mm * 100m


Therm-Bond X25A Typical PropertiesProperty Typical Value Test MethodColor White Visual Inspection


Adhesive Type Ceramic powder filling pressure sensitive tape /

Release Liner Type PET /

Release Liner Thickness(mm) 0.050 / 0.036 /

Property180 Peel Strength ( N/100mm ) ＞ 60 GB/T 2792-1998

70 Holding Power ( 1kg/25mm ) H ＞ 24 GB/T 4851-1998


Thermal Impedance VS. Pressure Thermal Impedance ( ·in2/W ) 20psi 0.27

ASTM D5470 30psi 0.21

50psi 0.13



TIM Total Solution

Therm-Grease™ 1000 High Performance,

Thermally Conductive Grease Compound

Features and Benefits• Good thermal conductivity, low thermal impedance• Good thixotropy, operating easily • Low sedimentation, good chemical and mechanical stability• Good crumpling resistance, high reliability in long-term work• Suitable for silk-screen printing process

SpecificationTherm-Grease 1000 is a thermally conductive grease compound designed for use as a thermal interface material between a high-power electronic component and a heat sink. Therm-Grease 1000 compound wets-out the thermal interfaces and flows to produce very low thermal impedance. The compound is able to cool the electronic components quickly and efficiently, in order to extend their shelf life and improve reliability. Therm-Grease 1000 is highly stabile from -45 to 150 , and has good weatherability as well as dielectric properties, in addition to the good thermal conductivity, which will not produce the pressure when use. The compound meets the requirements of electronics industries as a thermally conductive interface material.

Typical Applications• Communication Equipment• Network Terminal• Storage Device• LED• Consumer Electronics• Power Components

Therm-Grease 1000 Typical PropertiesProperty Typical Value Test MethodColor White Visual Inspection

Volatilization Rate ( 24H@200 ) % ＜ 1.0 /

Penetration Rate ( 24H@150 ) % ＜ 0.05 /


Viscosity ( mPa·s ) 100~300 ( * 103 ) ASTM D2196



Thermal Impedance VS. PressurePressure ( psi ) 5 10 25 50 60 80


Packaging Related• Canning Form• Packing Specification

Weight: 1kg/can



Note: Stirring uniformly before use when finding any sedimentation



TIM Total Solution


Thermally Conductive Grease CompoundTherm-Grease™ 2000 High Performance,


Features and Benefits• Good thermal conductivity, low thermal impedance• Good thixotropy, operating easily• Low sedimentation, good chemical and mechanical stability• Good crumpling resistance, high reliability in long-term work• Suitable for silk-screen printing process



Therm-Grease 2000 Typical PropertiesProperty Typical Value Test MethodColor Gray Visual Inspection










Weight: 1kg/can






TIM Total Solution



Features and Benefits• Excellent thermal conductivity, low thermal impedance• Good thixotropy, operating easily • Low sedimentation, good chemical and mechanical stability• Good crumpling resistance, high reliability in long-term work• Suitable for silk-screen printing process



Therm-Grease 3800 Typical PropertiesProperty Typical Value Test MethodColor Gray Visual Inspection










Weight: 1kg/can






TIM Total Solution

Therm-Form™ 300H4 High Performance,

Thermally Conductive Potting Gel

Features and Benefits• Good thermal and insolating performance• Good aging resistance• Good flowability• Good mechanical property and weather resistance• Good ductility

SpecificationTherm-Form 300H4, thermal potting gel, is a two-part silicone rubber, which is designed to be used in electronic modules.Therm-Form 300H4 cures to a thermally conductive, elastic, and flame-retardant rubber at room or elevated temperature.Therm-Form 300H4 is usually used by manual or automatic dispensing way.

Typical Applications• Connection between automotive electronic components and PCB• Potting protection for car power supply module• communication Equipment• Consumer Electronics• Frequency Converter, Sensor

Therm-Form 300H4 Typical PropertiesProperty Typical Value Test MethodPerformance before Mixture A Part B Part /Color Black White Visual InspectionViscosity ( cps ) @25 920 1080 ASTM D2196Mix Ratio 1:1 /Shelf Life@25 ( months ) 12 /Performance after MixtureViscosity ( cps ) 1050 ASTM D2196Hardness ( Shore A ) 28 ASTM D2240Tensile Strength ( psi ) 70 ASTM D412Elongation at Break ( % ) 60 ASTM D412Density ( g/cm³ ) 1.20 ASTM D792Surface Curing Time @25 ( min ) 30 /ElectricalDielectric Breakdown Strength ( kV/mm ) ≥ 20 ASTM D149Volume Resistivity ( Ω·cm ) 4x1014 ASTM D257Flame Rating V-0 UL94Continuous Use Temperature ( ) -55~240 /Cure Schedule25 ( H ) 4 /100 ( min ) 10 /ThermalThermal Conductivity ( W/m·K ) 0.3 ASTM D5470Thermal Impedance VS. Pressure ( Reference Sample: 1mm / Thickness )Pressure ( psi ) 5 10 20 30 40Thermal Impedance ( ·in2/W ) 1.52 1.47 1.34 1.29 1.22

Structure• Two-Part• 1:1; 100% solids• Silicone Elastomer





TIM Total Solution

Therm-Flow™ 1000 Thermal Phase Change Material

Features and Benefits• High thermal conductivity, low thermal impedance• Thermal phase change material• Good compressibility• Good wettability• Good reliability

SpecificationTherm-Flow 1000 is a high-performance thermal change material with 58 of phase changing temperature.Therm-Flow 1000 is solid under room temperature, and fluid over phase changing temperature, having good wettability and compressibility.Therm-Flow 1000 is used to be attached between a heat sink and a power component to reduce thermal resistance with any sizes according to customer requirement.

Typical Applications• Communication Equipment• Computer• LED• Power Converter• Storage Device

Therm-Flow 1000 Typical PropertiesProperty Typical Value Test MethodStructure Ceramic particles filling non-silicon resin /

Color Gray Visual InspectionThickness ( mm ) ( mil )

0.127 / 0.2（5 / 8） ASTM D374



Phase Changing Temperature ( ) 58 DSC

ElectricVolume Resistance ( Ω·cm ) 3.0x1012 ASTM D257

Thermal ( @70 & 50psi )Thermal Conductivity ( W/m·K ) 1.4 ASTM D5470

Thermal Impedance ( ·in²/W ) 0.14 ASTM D5470





TIM Total Solution



SpecificationTherm-Flow 2000 is a high-performance thermal change material with 50 of phase changing temperature.Therm-Flow 2000 is solid under room temperature, and fluid over phase changing temperature, having good wettability and compressibility.Therm-Flow 2000 is used to be attached between a heat sink and a power component to reduce thermal resistance with any sizes according to customerrequirement.


Therm-Flow 2000 Typical PropertiesProperty Typical Value Test MethodStructure Thermal phase change material /


0.127 / 0.2 / 0.25（5 / 8 / 10） ASTM D374











TIM Total Solution


Therm-Flow 3700 Typical PropertiesProperty Typical Value Test MethodStructure Ceramic particles filling non-silicon resin /


0.127 / 0.2 / 0.25（5 / 8 / 10） ASTM D374








SpecificationTherm-Flow 3700 is a high-performance thermal change material with 50 of phase changing temperature.Therm-Flow 3700 is solid under room temperature, and fluid over phase changing temperature, having good wettability and compressibility.Therm-Flow 3700 is used to be attached between a heat sink and a power component to reduce thermal resistance with any sizes according to customerrequirement.




37

As a professional total solution provider for thermally conductive

interfacial material, we offer the full customized service upon

requests including thickness ( capacity ), size, color, shape,

package, as well as property of the products listed in the table.

Please inquire us for more information.

FOCUS · INNOVATION

38

TIM Thermal Property and Specification Summary

Type Thermal Conductivity ( W/m·K ) Thickness or Capacity

Therm-Pad®

Therm-Pad 1000 1.0 0.15mm




Therm-Gap®

Therm-Gap 1100SP05 1.1 0.50~5.0mm

Therm-Gap 1200 1.2 0.25~5.0mm

Therm-Gap 1300 1.3 0.25~5.0mm

Therm-Gap 1300SF 1.3 0.50~5.0mm

Therm-Gap 1300SP 1.3 0.50~5.0mm

Therm-Gap 1500 1.5 0.25~5.0mm

Therm-Gap 1500BS40 1.5 0.5~5.0mm

Therm-Gap 1800 1.8 1.0~5.0mm

Therm-Gap 2200 2.2 1.0~5.0mm

Therm-Gap 2400 2.4 1.0~5.0mm

Therm-Gap 2400S20 2.4 0.50~5.0mm

Therm-Gap 2500BUS 2.5 0.18~1.0mm

Therm-Gap 2800 2.8 0.25~5.0mm

Therm-Gap 3500 3.5 0.50~5.0mm

Therm-Gap 5000 5.0 0.50~5.0mm

Therm-Filler™

Therm-Filler 1800 1.8 50cc / 400cc

Therm-Filler 3500 3.5 50cc / 400cc

Therm-Gel™

Therm-Gel 3500S 3.5 30cc / 300cc

Therm-Bond™

Therm-Bond 900 0.8 0.15mm

Therm-Bond X25A -- 0.025mm

Therm-Grease™

Therm-Grease 1000 1.0 1kg



Therm-Form™

Therm-Form 300H4 0.3 2kg / 5kg / 25kg

Therm-Flow™

Therm-Flow 1000 1.4 0.127 / 0.2mm

Therm-Flow 2000 2.0 0.127 / 0.2 / 0.25mm

Therm-Flow 3700 3.5 0.127 / 0.2 / 0.25mm

FRD, logo of FRD, Thermal-Pad, Therm-Gap, Therm-Filler, Therm-Gel, Thermal-Bond, Therm-Grease, Therm-Form and Therm-Flow are all registered trademarks of FRD

TIM Total Solution

SHENZHEN FRD SCIENCE & TECHNOLOGY CO., LTD.FRD Building, 8# Gaofa Industrial Park, Beihuan Blvd,Nanshan District, Shenzhen, ChinaTel: 86-755-8608-1680 8608-1686Fax: 86-755-8608-1689

FRD ( HONG KONG ) CO., LTD.Unit 503, 5/F, Silvercord, Tower 2,30 Canton Road,Tsimshatsui, Kowloon Hong KongTel: 852-3519-5726Fax: 852-3013-7466

KUNSHAN FRD ELECTRONIC MATERIALS CO., LTD.FRD Industrial Park, 258 Dongping Road, Bacheng, Kunshan, ChinaTel: 86-512-5785-1188Fax: 86-512-5785-1199

TIANJIN FRD SCIENCE & TECHNOLOGY CO., LTD.FRD Industrial Park, 160 Xiangyuan Road, JINGJIN Science&Tech Valley,Wuqing District, Tianjin, ChinaTel: 86-22-5969-5716Fax: 86-22-5969-5718

www.frd.cn [email protected]

©2016 FRD0802-V1.1-Yang

BEIJING SHANGH XI'AN WUHAN TAIPEI US SAN JOSE US SEATTLE NETHERLANDS

TIM - FRDen.frd.cn/Private/ProductFiles/1504cacd1f500fb9bff1.pdf · A：TIM is a material used between heat source and sink to accelerate the efﬁciency of heat dissipation. Generally

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