TiAu based micro-calorimeters for the XEUS space mission by Bob Dirks on behalf of the Sensor Research and Development Division Depicts: artist's impression of the XEUS spacecraft Copyright: ESA
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TiAu based micro-calorimeters for the XEUS space mission
by Bob Dirks
on behalf of the Sensor Research and Development Division
Depicts: artist's impression of the XEUS spacecraftCopyright: ESA
2
Outline:1. XEUS
-satellite and instruments-detector specifications
2. Transition Edge Sensors (TESs)- Detection principle- Pixel and array development
3. EURECA
4. Measurement results (highlights)- RT-measurements- X-ray resolution with Cu/Bi absorbers- Cross-talk
5. Conclusions
6. Perspective and future plans
3
1. X-ray Evolving Universe Spectroscopy (XEUS)Satellite and instruments:
detector spacecraft
~35 m
• Formation flying mission• Detector spacecraft:
1. high spectral resolution imager 2. wide field imager3. hard X-ray imager4. non-imaging high time-resolution spectrometer5. imaging X-ray polarimeter
mirror spacecraft
Transition Edge Sensors in 32x32 array (SRON)
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1. X-ray Evolving Universe Spectroscopy (XEUS)
Characteristics:
energy range 0.1 – 20 keV
energy resolution 2 eV @ 2 keV5 eV @ 6 keV
pixel size (μm2) 240x240
filling factor > 92%
Detector specifications: high spectral resolution imager
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2. Transition Edge Sensors (TESs)Detection principle
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2. Transition Edge Sensors (TESs)
Testing:- different detector geometries - different absorber-TES couplings
SRON in-house capabilities: -detector production (clean room)-characterization (cryogenic facilities)
Pixel development
2.5 eV @ 6 keV
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2. Transition Edge Sensors (TESs)
“Paddo” (mushroom shaped absorber) 5x5 prototype produced and under test
top viewside view
Array development
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2. Transition Edge Sensors (TESs)
32x32 array produced, prototype for XEUSArray development
8 mm1.25 mm
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3. EURECA (EURopean-JapanEse Calorimeter Array) project
Vb
Rs TES
L
C
SQUID
t
I
3.66 eV@320 kHz
Frequency Domain Multiplexing read-out
Technological readiness of 5x5 pixel array with read-out
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4. Measurement results: RT measurements on arrays
-0.02
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.095 0.1 0.105 0.11 0.115 0.12 0.125
Res
ista
nce
(ohm
)
Themperature (K)
RT TT086-26-chip19
pix 21pix 13pix 1
pix 10pix 15pix 19pix 20pix 25pix 5pix 7
Critical temperature (112 mK) homogeneousin array!!
“Paddo” prototype array
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4. Measurement results: X-ray resolution Cu/Bi absorbers
2.5 eV @ 6 keV (FWHM)100 μs falltime
Cu: 1 μm, Bi: 2.64 μm
Bi
K-Alpha spectrum with Holzer fit
increase stopping power
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Max. amplitude (thermal) black/ red signal: @ 20 keV
nearest neighbor ~5x10-4 10 eV
diagonal neighbor ~7x10-6 0.14 eV
4. Measurement results: cross-talk
thermal
electronic
trigger threshold:
150 eV
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5. Conclusions
- Central absorber coupling most promising
- Homogeneous Tc in arrays
- Adding bismuth to absorber no influence on detector performance (energy resolution)
- Cross-talk: << 150 eV, no problem for astrophysics applications
- Promising results with Frequency Domain Multiplexing:3.7 eV (FWHM) @ 6 keV
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6. Perspective and future plans
CuBi
“Paddo”
2.5 eV @ 6 keV
Bi
Bi
Cu
Cu
Pixel development:
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6. Perspective and future plansArray development:Frequency Domain Multiplexing Read-out
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Thank you for your attention.
Questions?
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3. Experimental setup and measurement methods
Adiabatic Demagnetisation Refrigeration
ADR Kelvinox
dilution fridge
Completely automated!
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Complex Impedance:
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SQUID feedback circuit:
Bias circuit:
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TES-based Single Pixel Microcalorimeters; X-ray
• TES: superconducting thin film with Tc = 100 mK (TiAu)
• Silicon-Nitride micromachining
0 2000 4000 6000 8000Energy (eV)
0
20
40
60
Cou
nts
5870 5880 5890 5900 5910 5920Energy (eV)
0
20
40
60
Cou
nts
FWHM = 3.9 eV
ΔE = 2.5 eV at 6 keV; 100 μs(state of the art performance)
0.0
0.4
0.8
1.2
1.6
0.1057 0.1059 0.1061 0.1063Temperature (K)
Res
ista
nce
(Ohm
) ΔT= 200 μK
Supercon-ducting
Normal
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• Integrate 5 x 5 TES-array and FDM read-out in an ADR coolersynchrotron testing
• Development AC-bias electronics, MUX/de-MUX,acquisition and command and control electronics (ASICs)
• Flexible set-up: testing of different detectors and FDM concepts
• SRON-lead effort with EU and Japanese partners; a strong EU consortium develops
• Test-bed for XEUS TRL
EURECA Prototype X-ray Instrument
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EURECA test set-up at PTB-BESSY
• Measurement run at BESSYSXR700 beam line April 2007
• Energy range: 0.2 – 1.8 keV
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EURECA test set-up at PTB-BESSY
High count rate (250 eV) dE = 1.55 eV @ 50 cpsdE = 1.72 eV @ 500 cps
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• Arrays need multiplexed read-out (because of limited cooling power, electronics power budget, mass budget)
• Multiplexing is done in the frequency domain (FDM)
Multiplexed Read-out of TES-based Arrays
Vb
Rs TES
L
C
SQUID
t
I
Vb
Vbf1
f2
NBF
f
columnSQUID
columnSQUID
AC and DC performance similar; FDM concept validated
320 kHz3.66 eV
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SRON clean room
Large in-house clean room facility at Utrecht (upgraded in 2007)- Lithography: development and production 300 m2 class 100- Assembly and instrumentation test area 600 m2 class 10000
Profile of the activitiesLithography, thin film technology, silicon-micromachining
Development of novel (superconducting) sensors and components for future space instruments for which no commercial production route is available
The choice of materials (and their combination) is unique The dedicated in-house facilities allow for short turn around times in research, performance optimization and final production
Collaborations with MESA+, Philips, Delft University when needed
SRON facilities also available for external parties
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The SRON clean room
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