www.smthelp.com Why need Automatic Optical Inspection System ? Circuit board production Common defect after wave soldering process Wave soldering process Function Test Customer end 1. THT Dual Sided AOI Specs 2. Optional functions 3. Machine model seletive
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
– Before or after Wave solder , use high speed in-line AOI solution
– Applicable for
• Before or after Wave solder THT/DIP component insertion check (DIP
through hole component)
• Optional: Press-fit inspection ability of pressing parts
• Optional: SMD component placement test ability
www.smthelp.com
1. THT Dual Sided AOIFeaturesBest Pre & Post Wave AOI Inspection System providing the highest Return on Investment,(ROI) in the industry by eliminating the need for human inspection◆ Extra Large 10cm Depth of Field eliminates the effects of component height◆ Extreme high speed (both sides 45 sec, Server board 600 x 600 mm2)◆ Innovative vision algorithms eliminate PCB/Placement variation and detects defects perfectly
Application for◆Post wave, Leaded components, DIP, Axial leaded and metal can Dimension & Weight◆PCI-770 Model– 900 L x 1000 W x 1950 H (mm) / 450 Kg( Inspection area 330 L x 250 W (mm))◆PCI-770M Model– 1410 L x 1345 W x 1875 H (mm) / 800 Kg( Inspection area 510 L x 510 W (mm))◆PCI-770L Model– 1410 L x 1345 W x 1875 H (mm) / 800 Kg( Inspection area 610 L x 610 W (mm))
www.smthelp.com
Typical Defect Types
◆THT/DIP Components
–Missing / Wrong Components
*Optical shape recognition
*Color and Band Inspection
–Polarity Check
*Electrolytic Capacitors, Resistors & Diodes
*All components w/ text including IC's (character verification)
*Connectors and other components w/ polarity requirements
– SMD Inspection (down to 0603 package)* Drop / Wrong parts / Polarity check* Solder bridge* Missing components (down to 0402 package)
www.smthelp.com
2.Optional Functions
– OCR word identification
Function: the use of wildcards "?" instead of any character identification "ABC?" Pass condition = ABC + arbitrary two characters
www.smthelp.com
– Click on the substrate surface check
2.Optional Functions
PCB surface checking component drop Cop layer leakage
Checking ability ,minimum down to 0.5x0.5mm2
www.smthelp.com
– CPU lead socket ad lead's checking function
- high efficiency CPU lead socket for wave soldering or functional testing , lead check function
• X/Y direction shifting (± 200 UM)• Lead tip missing
X/Y direction shifting (± 200 UM)
Lead tip missing
2.Optional Functions
www.smthelp.com
3.Machine model seletive
Model Defect types can be checkedTop of Substrate Bottom of substrate
S-760 M / W / P -S-770 M / W / P / L SS-780 - S
Checking type of M/W/P/L/S = >• M: missing pieces• W: wrong piece• P: polarity reverse• L: parts float high (part height)• S: tin point short circuit
www.smthelp.com
Top of PCB checkingn Enable checking type of defect
-DIP component*Drop / Wrong parts / Polarity opposite direction(PCB top side)*Lead bend(PCB top side)-Press-fit component(Minimum down to 0.5mm spacing)*Component floating high (PCB top side, Z axis resolution ratio:100μm)*Lead shifting (PCB top side)-SMD component(minimum down to 0603 package)
*Drop / Wrong parts / Polarity opposite direction(PCB top side)
THT AOI (DIP AVI) S-760
www.smthelp.com
THT AOI (DIP AVI) S-770
Double side of PCB checking and height checking abilityn Enable checking type of defect
-DIP component*Drop / Wrong parts / Polarity opposite direction(PCB top side)*Lead bend(PCB top side)/ tin solder point short circuit(PCB bottom side)-Press-fit component(Minimum down to 0.5mm spacing)*Component floating high (PCB top side, Z axis resolution ratio:100μm)*Lead shifting (PCB top side)*Lead not insert or on lead(PCB bottom side)-SMD component(minimum down to 0603 package)
*Drop / Wrong parts / Polarity opposite direction(PCB top/bottom side)
www.smthelp.com
THT AOI (DIP AVI) S-780
Bottom side of PCB checking n Enable checking type of defect
-DIP component*Tin solder point short circuit(PCB bottom side)-Press-fit component(Minimum down to 0.5mm spacing)*Lead not insert or on lead(PCB bottom side)-SMD component(minimum down to 0603 package)
*Drop / Wrong parts / Polarity opposite direction(PCB top/bottom side)*Tin solder point short circuit(PCB bottom side)