THERMO-MECHANICAL RELIABILITY MODELS FOR LIFE PREDICTION OF AREA ARRAY ELECTRONICS IN EXTREME ENVIRONMENTS

THERMO-MECHANICAL RELIABILITY MODELS FOR LIFE PREDICTION OF AREA ARRAY ELECTRONICS IN EXTREME ENVIRONMENTS Except where reference is made to the work of others, the work described in this thesis is my own or was done in collaboration with my advisory committee. This thesis does not include proprietary or classified information. __________________________________________ Naveen Chandra Singh Certificate of Approval: ____________________________ __________________________ Jeffrey C. Suhling Pradeep Lall, Chair Quina Distinguished Professor Associate Professor Mechanical Engineering Mechanical Engineering ___________________________ __________________________ Roy W. Knight Stephen L. McFarland Assistant Professor Dean Mechanical Engineering Graduate School

THERMO-MECHANICAL RELIABILITY MODELS FOR LIFE PREDICTION OF AREA ARRAY ELECTRONICS IN EXTREME ENVIRONMENTS

Documents

finite element analysis

thermomechanical fatigue

microelectronics

microscopic observation