8/13/2019 Thermal Management 2003 Final http://slidepdf.com/reader/full/thermal-management-2003-final 1/29 1 Thermal Management Electronics Cooling Paper By: 1. Prof. Kiran D. Devade (Lecturer, Mech Dept.) 2. Prof. Avinash M. Patil (Professor, Mech Dept.) 3. Prof. Sunil B. Ingole (Assistant Professor, Mech Dept) 1 Thermal Management- Electronic Cooling
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Due to the advantages of high local heat and mass transferrate and a relatively easy control of areas to be cooledor heated, impinging jets are widely used in manyindustrial applications such as,
• cooling of hot steel plates.• annealing of glass and sheet metals.
• drying of papers, films , textiles.
• cooling of turbine blades.
• electronic components.• most recently manufacturing of TFT-LCD plate.
• Yam Lai, Nicolás Cordero, Frank Barthel, Frank Tebbe,Jörg Kuhn, Robert Apfelbeck, Dagmar Würtenbergein 2009 performed experiments with Led’s and with
liquid cooling the thermal design from device toboard to system level has been carried out in thisresearch. Air cooling and passive liquid coolingmethods were investigated and excluded asunsuitable, and therefore an active liquid coolingsolution was selected. Several configurations of theactive liquid cooling system were studied and
optimization work was carried out to find anoptimum thermal performance.
• Jemmy S. Bintoro, Aliakbar Akbarzadeh, and Masataka Mochizuki in 2005 carriedout experiments with single jet and heat exchangers and reported that thesystem has the cooling capacity of 200 W over a single chip with a hydraulicdiameter of 12 mm. The equivalent heat flux is 177 W/cm2. The cooling systemmaintains the chip’s surface temperature below 95 °C maximum when theambient temperature is 30 °C. De-ionized water is the working fluid of thesystem. For the impinging jet, two different nozzles are designed and tested. Thehydraulic diameters (d N) are 0.5 mm and 0.8 mm. The corresponding volumeflow rates are 280 mL/min and 348 mL/min. Mini channels heat exchanger has 6(six) copper tubes with the inner diameter of 1.27 mm and the total length ofabout 1 m. The cooling system has a mini diaphragm pump and a DC electric fanwith the maximum power consumptions of 8.4 W and 0.96 W respectively. The
coefficient of performance of the system is 21.4• A.M. Kiper in 1984 used water sprays for VLSI circuit cooling new method of
cooling of planar Very Large Scale Integrated (VLSI) circuits which allows one toobtain chip heat fluxes in excess of 500 W/cm2 with acceptable temperaturerises. It is shown that by scaling impinging fluid jet heat transfer technology tosmall geometrical dimensions, and by using water as the coolant, a high-performance cooling system can be designed. The convective heat transfer
coefficients obtained in this method are significantly greater than that obtainedin the convectional liquid cooling technology used for microelectronic devices,including the immersion cooling.
• B.Q. Li, T. Cader, J. Schwarzkopf, K. Okamoto, B. Ramaprian An experimentaland inverse computational study is presented of spray cooling ofmicroelectronics with an emphasis on the spray angle effects on cooling
performance. A thermal test chip provides the heated target, and is cooledby a single pressure swirl atomizer. Thermal readings were taken at thespray angles of 0 –60°, at a fixed distance of 1.4 cm from the heated diesurface. An inverse heat transfer computational algorithm is developed tocalculate the unknown spray cooling heat fluxes using the measuredtemperature data inside the die. The computational scheme is acombination of the finite element method and the truncated single value
decomposition with the discrepancy principle for determining the optimaltruncation threshold value. Good agreement is obtained between theexperimental measurements and calculated results. For this particularsystem, a direct estimate using temperature readings at two adjacentpoints would produce incorrect heat flux results and an inverse algorithm isdeemed essential if an accurate heat flux is to be obtained from the
measurements. It is found that a major cause for the drop-off is thereduction in spray volumetric flux delivered to the die at the greater sprayangles.
• Number of solutions have been used till date for electronicscooling problem, as the working demands are higher andheat flux being induced is increasing with time still asatisfactory solution can be put into action
• For electronics cooling with jet impingement experiments
can be performed by varying the nozzle shapes and to breaklaminar boundary layer various flow patterns can be used toenhance the heat transfer rates.
• Some fin geometries are in practice till date a compromisebetween cost and efficiency can be attained by varying the
• for spray cooling the pressurized air and liquid mixture ca beused as mist to spray and combinations of air and liquid canbe studied at various flow rates to determine the best suitedflow-mixture combination.
• parabolic droplets of various cooling fluids can be studied forthis to remove the heat generated
• From the graph it is also clear that a lot of scope is there for
work in jet impingement cooling area.• Cross cutting of flat fins into multiple sections is also suggested
to improve heat transfer coefficient.
• Augmentation of the fins can also improve the performance.
• Jet impingement cooling using high speed blow directedtowards the base of the fin arrangement is effective.
References1. Michroelectromechanical system – based evaporative thermal management of high heat flux electronics,
Journal of heat and mass transfer, Volume 127,January 2005, Pages 66-75, Cristina H. Amon, S.C. Yao, C. F.Wu,C.C. Hseih.
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11. Impinging water jet cooling of VLSI circuits International Communications in Heat and Mass Transfer , Volume 11, Issue 6, November-December 1984, Pages 517-526 A.M. Kiper
12. Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling Microelectronics Journal , Volume 39, Issue 7 , July 2008, Pages 966-974 H. Oprins, J. Danneels, B. Van Ham, B. Vandevelde, M. Baelmans
13. Spray angle effect during spray cooling of microelectronics: Experimental measurements andcomparison with inverse calculations
Applied Thermal Engineering, Volume 26, Issue 16, November 2006, Pages 1788-1795 B.Q. Li, T. Cader, J. Schwarzkopf, K. Okamoto, B. Ramaprian
14. Intermittent spray cooling: A new technology for controlling surface temperature International Journal of Heat and Fluid Flow , Volume 30, Issue 1, February 2009, Pages 117-130,Miguel R.O. Panão, António L.N. Moreira