The NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond and Recent Radiation Highlights Kenneth A. LaBel Michael J. Sampson [email protected][email protected]301-286-9936 301-614-6233 Co- Managers, NEPP Program NASA/GSFC http://nepp.nasa.gov Open Access 1 To be presented by Kenneth LaBel at the 2015 Radiation Hardened Electronics Technology (RHET), Conference, Albuquerque, NM, November 16-18, 2015. Acknowledgment: This work was sponsored by: NASA Office of Safety & Mission Assurance https://ntrs.nasa.gov/search.jsp?R=20150023279 2018-07-12T16:50:05+00:00Z
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The NASA Electronic Parts and Packaging (NEPP) Program:
Roadmap for FY15 and Beyondand Recent Radiation Highlights
301-286-9936 301-614-6233Co- Managers, NEPP Program
NASA/GSFChttp://nepp.nasa.gov
Open Access1To be presented by Kenneth LaBel at the 2015 Radiation Hardened Electronics Technology (RHET), Conference, Albuquerque, NM, November 16-18, 2015.
Acknowledgment:This work was sponsored by:NASA Office of Safety & Mission Assurance
2To be presented by Kenneth LaBel at the 2015 Radiation Hardened Electronics Technology (RHET), Conference, Albuquerque, NM, November 16-18, 2015.
Sundown at SCRIPPS Proton Therapy Center,Ken LaBel
Acronyms
3To be presented by Kenneth LaBel at the 2015 Radiation Hardened Electronics Technology (RHET), Conference, Albuquerque, NM, November 16-18, 2015.
Acronym Definition FlexRay FlexRay communications busFPGA Field Programmable Gate Array FY Fiscal Year GaN Gallium Nitride Gb/s gigabyte per secondGen GenerationGIC Global Industry ClassificationGPU Graphics Processing UnitGSFC Goddard Space Flight Center HALT Highly Accelerated Life TestHAST Highly Accelerated Stress TestingHDIO High Density Digital Input/OutputHDR High-Dynamic-RangeHEMTs High-electron-mobility transistorsHP Labs Hewlett-Packard LaboratoriesHPIO High Performance Input/OutputHUPTI Hampton University Proton Therapy InstituteHW HardwareI2C Inter-Integrated CircuitIBM International Business MachinesIBM/GF International Business Machines/GlobalFoundariesIC Integrated CircuitI-Cache Instruction CacheIoT Internet of ThingsIP Intellectual PropertyIR InfraredIR/Infineon International Rectifier/Infineon TechnologiesIUCF Indiana University Cyclotron FacilityJPEG Joint Photographic Experts GroupKB KilobyteL2 Cache independent caches organized as a hierarchy (L1, L2, etc.)LCoS Liquid-Crystal-on-SiliconLET linear energy transferLinFlex Local Interconnect Network Flexible
LLUMC Slater Proton Treatment and Research Center at Loma Linda University Medical Center
L-mem Long-MemoryLP Low PowerM/L BIST Memory/Logic Built-In Self-TestMBSE Model-Based Systems EngineeringMEMS Micro Electrical-Mechanical SystemMGH Mass General Francis H. Burr Proton TherapyMIPI Mobile Industry Processor InterfaceMOSFETS Metal Oxide Semiconductor Field Effect TransistorsMPSoC Multi-Processor System on a ChipMRAM Magnetoresistive Random Access MemoryMsg Message
Acronym Definition 3D Three DimensionalADC analog-to-digital converterAES Advanced Encryption StandardAF SMC Air Force Space & Missile Systems CenterAFRL Air Force Research LaboratoryAMOLED Active Matrix Organic Light Emitting DiodeAMS Agile Mixed SignalARM ARM Holdings Public Limited CompanyCAN Controller Area NetworkCAN-FD Controller Area Network Flexible Data-RateCBRAM Conductive Bridging Random Access Memory CCI Correct Coding InitiativeCGA Column Grid ArrayCIGS Copper Indium Gallium SelenideCMOS Complementary Metal Oxide Semiconductor COTS Commercial Off The Shelf CPU Computer Processing UnitCRC Cyclic Redundancy CheckCREME Cosmic Ray Effects on Micro-ElectronicsCSE Computer Science and EngineeringCU Cu alloyD-Cache Data CacheDCU Display Controller UnitDDR Double Data RateDDR2 Double Data Rate TwoDDR3 Double Data Rate ThreeDDR4 Double Data Rate FourDMA Direct Memory AccessDNA Deoxyribonucleic AcidDoD Department of DefenseDRAM Dynamic Random Access MemoryDSP Digital Signal ProcessingdSPI Dynamic Signal Processing InstrumentDTRA Defense Threat Reduction AgencyDual Ch Dual ChannelECC Error-Correcting CodeEEE Electrical, Electronic, and Electromechanical EMAC Equipment Monitor And ControlEPC Efficient Power ConversionESL Electronic System LeveleTimers Event TimersFCCU Fluidized Catalytic Cracking UnitFeRAM Ferroelectric RAM
FinFET Fin Field Effect Transistor (the conducting channel is wrapped by a thin silicon "fin")
Acronym Definition NASA National Aeronautics and Space Administration NAVY Crane Naval Surface Warfare Center, Crane, IndianaNEPP NASA Electronic Parts and Packaging NGSP Next Generation Space ProcessorNOR Not OR logic gateNSRL NASA Space Radiation LabOccam Open Conditional Content Access ManagementOKC Oklahoma CityOLED Organic Light Emitting DiodePBGA Plastic Ball Grid ArrayPCIe Peripheral Component Interconnect Express
PS-GTR Global Regulation on Pedestrian SafetyR&D Research and DevelopmentRAM Random Access Memory ReRAM Resistive Random Access Memory RF Radio FrequencyRGB Red, Green, and BlueRH RAD-HardSAR Successive-Approximation-RegisterSATA Serial Advanced Technology AttachmentSCU Secondary Control UnitSD/eMMC Secure Digital embedded MultiMediaCardSD-HC Secure Digital High CapacitySDRAM Synchronous Dynamic Random Access MemorySEE Single Event EffectSERDES Serializer/DeserializerSiC Silicon Carbide SMMU System Memory Management UnitSOC System on a chipSPI Serial Peripheral InterfaceSPU Synergistic Processor UnitTCM Tightly Coupled MemoryTI Texas Instruments TRIUMF Tri-University Meson FacilityTRL Technology Readiness LevelT-Sensor Temperature-SensorTSMC Taiwan Semiconductor Manufacturing CompanyUART Universal Asynchronous Receiver/Transmitter
UFHPTI University of Florida Health Proton Therapy Institute
USB Universal Serial BusVNAND Vertical NANDWBG Wide Band GapWDT Watchdog Timer
Technology Selection Criteria for NEPP Investigation
• The technologies should satisfy all or most of the following criteria:– Wide applicability,– Product level or in productization, and,– No distinction: COTS to hi-reliability aerospace.
• In general, we avoid:– Laboratory technologies, e.g., <TRL3,– Limited application devices with certain exceptions
(critical application or NASA center specialization).• Note: Partnering arrangements with other
organizations preferred.– Industry examples: Microsemi, Xilinx, Altera, TI– Other U.S. Government: AF SMC, AFRL, DTRA, Navy Crane
To be presented by Kenneth LaBel at the 2015 Radiation Hardened Electronics Technology (RHET), Conference, Albuquerque, NM, November 16-18, 2015. 4
Technology Investigation RoadmapDiscussion
• Technology assurance efforts are not explicitly included except on “Small Missions” chart.– Guidelines are a product of many technology evaluation
tasks.• Only major product categories shown.• Technology areas not on Roadmap but under
consideration include: – Electro-optics (fiber optics),– Advanced analog and mixed-signal devices,– Imaging sensors,– Modeling and simulation,– High-speed communication (SERDES, fast data switches), and,– Adjunct processors (eg., graphics, signal processing)
• Note 1: Advanced CMOS technologies not explicitly included:– NEPP leverages samples from ongoing DoD and/or commercial sources. – 14nm is current target (IBM/GF, INTEL).
• Note 2: “Reliability testing” may include product and/or package testing.
To be presented by Kenneth LaBel at the 2015 Radiation Hardened Electronics Technology (RHET), Conference, Albuquerque, NM, November 16-18, 2015. 5
Gartner Hype Cycle Concept
6To be presented by Kenneth LaBel at the 2015 Radiation Hardened Electronics Technology (RHET), Conference, Albuquerque, NM, November 16-18, 2015.
Gartner Hype Cycle for Emerging Technologies 2015
7To be presented by Kenneth LaBel at the 2015 Radiation Hardened Electronics Technology (RHET), Conference, Albuquerque, NM, November 16-18, 2015.
http://www.gartner.com/newsroom/id/3114217
Gartner Hype Cycle for Electronics 2013
8To be presented by Kenneth LaBel at the 2015 Radiation Hardened Electronics Technology (RHET), Conference, Albuquerque, NM, November 16-18, 2015.
Silicon PhotonicsSoftware-Defined Radio for Mobile Devices
Memristor MemoryNanotube Electronics
DNA LogicMolecular TransistorsOrganic/Polymer Solar CellsQuantum ComputingResistance Polymer MemoryTerahertz Waves
LCoSMagnetometerNetwork on Chip
CIGS Thin-Film Solar CellsCMOS RF Power AmplifierESL Design Tools and MethodologiesHW Reconfigurable DevicesIC Subsystem ReuseMulticore ProgrammingNanomaterial SupercapacitorsPost-193 nm LithographyPrinted SemiconductorsReusable Analog IPSilicon Anode Batteries
3D Photovoltaic Devices450 nm WafersBiochipsGaN ICsMicro Fuel CellsSpin Transfer Torque Magnetic Random-Access MemorySystem on a Package
AMOLEDElectronic PaperLithium Ion Phosphate BatteriesMEMS GyroscopesMetamaterial AntennasWireless Power
FPGA in SOCInstruction Set VirtualizationMEMS DisplaysOccam ProcessOLED LightingPhotonic Crystal DisplaysQuantum Dot DisplaysSilicon Thin-Film Solar Cells
Holographic Storage for Consumer Electronics
DDR4 DRAM
Benefit Tran
sfor
mat
iona
lH
igh
Mod
erat
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wYears to adopt: less than 2 years 2 to 5 years 5 to 10 years more than 10 years
After Gartner 2013 Electronics Hype Cycle Future NEPP Area or Tracking Developments
NEPP Task Area
NEPP and Gartner Electronics Hype Cycle 2013
To be presented by Kenneth LaBel at the 2015 Radiation Hardened Electronics Technology (RHET), Conference, Albuquerque, NM, November 16-18, 2015. 9
Field Programmable Gate Arrays (FPGAs)
10To be presented by Kenneth LaBel at the 2015 Radiation Hardened Electronics Technology (RHET), Conference, Albuquerque, NM, November 16-18, 2015.
FY14 FY15 FY16 FY17
Trusted FPGA- DoD Development
Altera- Stratix 5 (28nm TSMC process
commercial)- Max 10 (55nm NOR based
commercial – small mission candidate)
- Stratix 10 (14nm Intel process commercial)
Microsemi- RTG4 (65nm RH)
Xilinx- 7 series (28nm commercial)- Ultrascale (20nm commercial –
• TI Multicore DSP+ARM KeyStone II System-on-Chip (SoC)– Integrated “instruments”
• TI DLP2010NIR – near IR sensing and controller
21To be presented by Kenneth LaBel at the 2015 Radiation Hardened Electronics Technology (RHET), Conference, Albuquerque, NM, November 16-18, 2015.
Courtesy, TI
A Few Other Cool Tasks…• CubeSat mission success/failure root cause
analysis– Grant to Saint Louis University
• Using a model-based systems engineering (MBSE) approach to radiation assurance– Grant to Vanderbilt– Co-sponsored by NASA Reliability and Maintainability
Program– Uses a tool called “Goal Structured Notation”
• Keeping the CRÈME website alive– Support to Vanderbilt– Just standard maintenance and operation, no upgrades
• Proton fluence test levels– See next chart
22To be presented by Kenneth LaBel at the 2015 Radiation Hardened Electronics Technology (RHET), Conference, Albuquerque, NM, November 16-18, 2015.
Infrared micrograph of a portion of a 512 Mb SDRAM ~60×70 µm2
- Shows both memory cells and control logic (10 yr. old tech.)- Red spots are ion hits