The MAPS-based ITS Upgrade for ALICE G. Contin (Università di Trieste – INFN Trieste) on behalf of the ALICE Collaboration VERTEX 2019 – The 28 th International Workshop on Vertex Detectors 13-18 October 2019 - Lafodia Sea Resort, Lopud Island, Croatia
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The MAPS -based ITS Upgrade for ALICE...Stave Readout Unit Inner-Barrel Assembly Outer-Barrel Assembly Installation Global commissioning Oct ‘19 Outer-Barrel Layer Assembly: >75%
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The MAPS-based ITS Upgrade for ALICE
G. Contin (Università di Trieste – INFN Trieste)on behalf of the ALICE Collaboration
VERTEX 2019 – The 28th International Workshop on Vertex Detectors13-18 October 2019 - Lafodia Sea Resort, Lopud Island, Croatia
The ALICE Upgrade for Run3
14/10/2019 2
“Old” ITS-1 … decommissioned and displayed in the ALICE exhibition at P2
• Reduction in material budget, pixel pitch and radius of the first layer will lead to a dramatic improvement in the detector performance, especially at low pT
See V. Raskina’s poster: “Radiation Hardness Studies of ALPIDE, the CMOS sensor for the ALICE ITS Upgrade”
MAPS produced using TowerJazz 0.18µm CMOS Imaging Process
Monolithic Active Pixel Sensor• Deep P-well allows in-pixel full CMOS • Low-power (40mW/cm2)• ~30 μm pitch high granularity• 50 μm thickness low material budget• >1 kΩ·cm resistivity p-type epitaxial
layer (25 μm) • Possibility of reverse biasing
• Integration time: < 20 µs• Read out up to 1.2 Gbit/s• Continuous or triggered read-out• Final testing yield: 64%
The Inner Barrel
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• 9x 50µm-thick ALPIDE chips • Aluminum Flexible Printed Circuit (FPC)• Each chip read out separately• 27 cm length• Hit density > 9.1 cm-2
• Global IB HIC yield: 75%
IB Hybrid Integrated Circuit (HIC)
Sensor-sideview
FPC-side view
• Clock, control, data, power pads wire-bonded to FPC
The Inner Barrel
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IB Hybrid Integrated Circuit (HIC)
Sensor-sideview
FPC-side view
Material thickness: ~ 0.35% X0
Readout speed: 1200 Mbps<radius> (mm): 23, 31, 39 Nr. staves: 12, 16, 20Nr. chips: 432Chips tested at CERNHICs and Staves assembled at CERNGlobal IB Stave yield: 97%
FPC-side viewIB Stave
• 9x 50µm-thick ALPIDE chips • Aluminum Flexible Printed Circuit (FPC)• Each chip read out separately• 27 cm length• Hit density > 9.1 cm-2
• Global IB HIC yield: 75%
• Clock, control, data, power pads wire-bonded to FPC
The Outer Barrel HIC production
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• 14x 100µm-thick ALPIDE chips (2 rows) • Data and control transferred through 1 master chip per row• Chip pads wire-bonded to copper-based FPC• Power delivered via 6 cross-cables soldered to FPC• Hit density < 2.8 cm-2
See M. Buckland’s poster: “Series production and test of hybrid modules for the ALICE ITS Upgrade”
1 2 3 4 5 6 714 13 12 11 10 9 8TAB
Sensor-sideview
FPC-sideview
Custom made Module Assembly Machine (MAM)
Production (cumulative) evolution
2017
2018 2019
Construction sites• CHIP test
• Yonsei, Pusan• FPC preparation/test
• Catania, Trieste• HIC production
• Bari, Liverpool, Pusan/Inha, Strasbourg, Wuhan
Production completed
OB HIC productionAssembled: 2592Detector-grade: 2180Global yield: 84%Installed on OB: 1698
See N. Valle’s poster: “Ageing tests of the Hybrid Modules for the ALICE ITS Upgrade”
• Adjustment of front-end parameters to equilibrate the charge thresholds• Achieving uniform response across the detector, verified on a spare IB half-layer• Very satisfying threshold stability over time
• The ALICE ITS Upgrade (ITS-2) is based on MAPS technology• It will dramatically improve the ALICE tracking capabilities at low momenta• Detector component production is completed, spare part production is ongoing• Commissioning progressing well, performance exceeding the expectations• The ITS will be installed in ALICE in June 2020 • 6 months of global commissioning with central systems before Run3 data taking• A further upgrade of the ITS Inner Barrel (ITS-3) for LHC Long Shutdown 3 has
been proposed and the R&D activities have already started
* revised numbers w.r.t. TDR** including a safety factor of 10, revised numbers w.r.t. TDR
THR
COMPAMP
Bias, Readout, Control
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ALPIDE and Detector Parameters (Vs. ITS1)
Chip size:30 mm x 15 mm
Pixel size:27 µm x 29 µm
14/10/2019
ITS Run1/Run2 ITS upgradeNumber of layers 6 (pixel, drift, μstrip) 7 (MAPS)Rapidity range |η| < 0.9 |η| < 1.3Material budget per layer 1.14% (SPD) 0.35% (IL)Distance to interaction point 39 mm 22 mmPixel size 50 x 425 μm2 29 x 27 μm2Spatial resolution (rφ x z) 12 μm x 100 μm (SPD) 5 μm x 5 μmMax. readout speed Pb-Pb 1 kHz 100 kHz
Material budget ITS-2 innermost layer
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Assembly and Quality Assurance workflow
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Assembly: HICs Half-staves StavesQA: Functional test at each step + HIC EnduranceMetrology: Align components and map the sensitive volume positions
Probe testedChips
Tested and sizedFlexible Printed Circuits
Chip alignment
FPC gluing
Functional test
Concurring processes
HIC wire bonding
Endurance test HIC rework
HIC: repeat wire bonding
~4 days
Rework procedures
Assembly and Quality Assurance workflow
Assembly: HICs Half-staves StavesQA: Functional test at each step + HIC EnduranceMetrology: Align components and map the sensitive volume positions 28
Probe testedChips
Tested and sizedFlexible Printed Circuits
Tested and sizedCold Plate
Chip alignment
FPC gluing
Interconnection soldering
Half-Stave metrologyFunctional test
Concurring processes
HIC wire bonding
Half-Stave assembly
Endurance testFunctional test Half-Stave
rework
HIC rework
HIC: repeat wire bondingHalf-Stave: replace HIC
Rework procedures
~4 days
Reception test
Assembly and Quality Assurance workflow
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Assembly: HICs Half-staves StavesQA: Functional test at each step + HIC EnduranceMetrology: Align components and map the sensitive volume positions
Probe testedChips
Tested and sizedFlexible Printed Circuits
Tested and sizedCold Plate
Chip alignment
Sized Carbon Fiber Space Frame
FPC gluing
Interconnection soldering
Half-Stave metrology
Tested Power Bus and Filter Board
Functional test
Final validation test
Stave assembly
Stave delivered to CERN
Concurring processes
HIC wire bonding
Half-Stave assembly
Power Bus soldering
Stave metrology
Endurance testFunctional test Half-Stave
rework
HIC rework
HIC: repeat wire bondingHalf-Stave: replace HIC Stave: Disconnect and rework Half-Stave