ADHESIVES FOR OEM APPLICATIONS EP21FRNS-2 Two part epoxy that meets UL 94V-0 specifications. Used primarily for potting and encapsulation applications with excellent resistance to fuels and lubricants. EPOXIES FOR ELECTRONICS EP21TDCHT Toughened epoxy featuring superior dimensional stability, thermal cycling resistance and dependable electrical insulation properties. COMPOUNDS FOR THE OPTICAL INDUSTRY UV15LV Low viscosity, high strength epoxy featuring enhanced temperature resistance for bonding, sealing and coating applications. ADHESIVES FOR CHEMICAL PROCESSING EP62-1 Two part epoxy featuring high thermal stability and excellent chemical resistance properties. Cures at moderately elevated temperatures. COMPOUNDS FOR AEROSPACE APPLICATIONS Two part, thermally conductive, heat resistant epoxy. Meets NASA low outgassing tests and develops a high bonding strength. The Maximus Bond of INDUSTRIES REVIEW PART EP21TCHT-1
The Adventures of Maximus Bond - Industries Review
May 24, 2015
With the help of Max Bond, Master Bond presents popular industries served by our adhesive, sealants and coatings, such as electronic, OEM, chemical processing, aerospace and optical.
Welcome message from author
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
ADHESIVES FOR OEM APPLICATIONS
EP21FRNS-2Two part epoxy that meets UL 94V-0specifications. Used primarily for pottingand encapsulation applications with excellent resistance to fuels and lubricants.
EPOXIES FOR ELECTRONICS
EP21TDCHTToughened epoxy featuring superiordimensional stability, thermal cyclingresistance and dependable electricalinsulation properties.
COMPOUNDS FOR THE OPTICAL INDUSTRY
UV15LVLow viscosity, high strength epoxyfeaturing enhanced temperature resistancefor bonding, sealing and coating applications.
ADHESIVES FOR CHEMICAL PROCESSING
EP62-1Two part epoxyfeaturing high thermalstability and excellent chemical resistance properties. Cures at moderately elevated temperatures.
COMPOUNDS FOR AEROSPACE APPLICATIONS
Two part, thermally conductive, heat resistant epoxy. MeetsNASA low outgassing tests and develops a high bonding strength.
TheMaximus BondofINDUSTRIES REVIEW
PART
EP21TCHT-1
Related Documents
