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Texas Instruments

Distributed Telemetry Solutions for Next-Gen Spacecraft

October 2017

• Space Portfolio

• Radiation Reports

• Support & Training

Most Popular Space Links:

Sriram Narayanan, PhD

Systems Engineer // Space & Hi-Reliability

Telemetry, Tracking & Command

• Telemetry, tracking and

command subsystem

– Receives:

Control signals from ground

– Sends back:

telemetry information,

housekeeping data

measurements from equipment,

sensors

Source: Rajan Bedi, Tech Report

Telemetry, Tracking & Command

• Telemetry, tracking and

command subsystem

– Receives:

Control signals from ground

– Sends back:

telemetry information,

housekeeping data

measurements from equipment,

sensors

Source: Rajan Bedi, Tech Report

ADC128S102QML-SP

12-bit ADC

Precision Op Amps

Interface Parts

Power Management

Integrated Sensors

HiRel Space Signal Chain

• Distributed Telemetry

4

Signal Conditioning

New: INA203 (in development) New: TMP112/461 (in dev) OPA4277, LMP2012

Mux + ADC

SAR (ADC128S102) Delta-Sigma (ADS1282)

New: CAN(SN65HVD233) (in development)

Reference

LM4050

Supply Interface

New: MSP430FR6969 (in development)

FPGA

DSP

Power Management

TPS7H1101A, TPS50501 TPS50601A/2 (in dev)

Interface

TLK2711

• Texas Instruments (TI) leadership portfolio

in data acquisition signal chain

Space Qualified Standard Op-Amps

LM124-SP Low-Power Op-Amp 1.0

MHz BW 40kRad

Gain Bandwidth (MHz)

Su

pp

ly C

urr

en

t (m

A)

0.92

4

1.8

1

0.25

0.18

3

LM158QML-SP Dual Op-Amp 1.0 MHz BW

100kRad RHA 100kRad RHA

LM124AQML-SP Low-Power Op-Amp 1.0

MHz BW 100kRad RHA

LMP2012QML-SP Dual, Precision Op-Amp

3.0 MHz BW 50kRad RHA

LF411QML-SP JFET Input Op-Amp

4.0 MHz BW 100kRad RHA

LM101AQML-SP Op-Amp

1.0 MHz BW 50kRad RHA

Released

Development

Released

Features

• Eight Input Channels • Split Supplies • VA 2.7V to 5.25V • VD 2.7V to VA • Only 2.3mW of Power at 3V • Power down 0.06 µW • DNL – -0.2 to +0.4 LSB typical • INL – +/- 0.4 LSB typical • SPI Digital Output • ADC addressing through CS decoder • SPI/QSPI/MICROWIRE/DSP compatible • Temperature Range: -55°C to +125°C • Available in 16-pin Ceramic SOIC

Applications

Benefits

• Eight sensors can be monitored with one ADC

• All ADC serialized data shares the same input bus to onboard FPGA/ASIC

• Ultra low power consumption

• RHA Qualified For Space Applications

• TID and SEU characterization data available for faster design in

• Orderable as SMD:

– 5962R0722701VZA

• Sensors

• Thermistors

• Motor control

Radiation Performance

• TID = 100kRad(Si)

• SEL and SEFI Immune > 120MeV-cm2/mg

EVM PART # ADC128S102CVAL

ADC128S102QML-SP 8-Channel, 12-Bit, 50 KSPS to 1MSPS, ADC

• Same die as ADC12D1600QML-SP with improved analog performance

by redesigning internal package routing

• Configurability:

• 1-ch 12-bit 3.2Gsp or 2-ch 12-bit 1.6 Gsps

• < 800MSPS Low Sampling Power Saver Mode (LSPSM)

• Low Power: 3.8 W (LSPSM mode 2.7W)

• Buffered Inputs: -3 dB Bandwidth of 3 GHz

• Input Fullscale: 800 mVpp (0.6-1.0Vpp programmable)

• IMD3 at fin = 2GHz: -63dBc (@ -13dBFS)

• Spare Support: Cold Sparing Capable

• Digital Interface: LVDS 1:1, 1:2 or 1:4

• Package: 28x28mm (1.27mm pitch)

• Column attached and no-column attached available

• Power supplies: Single 1.9V

• Temperature: -55 to 125C

• Single Event Latch-up (SEL) 120 MeV cm2/mg, SEFI tested

• Total Ionizing Dose (TID) 300 krad (Si)

Features

ADC12D1620QML-SP Dual 12-Bit 1.6 GSPS ADC Low-Power, LVDS

Input Frequency (1.6Gsps, -0.5dBFS)) 250MHz 1.5GHz

SNR (dBFS, typ) 60 57

ENOB (bits, typ) 9.3 9.0

SFDR (dBc, typ) 63 63

PCB Temperature Monitoring

9

• Payload for Antimatter Exploration

and Light nuclei Astrophysics

• Placed on Russian Resurs DK-1

satellite, 350—600 km altitude

Source: The Anticoincidence System of the PAMELA Satellite Experiment, 2005

TMP461-SP: Monitoring Die Temp

10

TMP461-SP

Temp Sensor

ADC12DJ3200QML

LMH5401

-SP

TMP112-SP

Temp Sensor

LMH5401

-SP

TMP112-SP

Temp Sensor

I

Q FM

C C

on

ne

cto

r

Clocking

LMK04832QML-SP

Power

EXT

CLK

Op

tio

na

l D

ua

l D

DC

+ N

CO

JE

SD

20

4B

ADC

ADC

TI ADC12DJ3200QML: Space Grade ADC

• Increasing on-chip temperatures can lead

to thermal stress on the chip

• Use temperature reading to balance

computation load.

• simple solution to monitor die temperature

of FPGA’s, ADC’s & ASIC’s Source: A Systematic Study of Heat Generators

Source: Microsemi RTG4 temperature sensing

Monitored Device

Anode & Cathode

External access

Integrated Thermal

Diode/Transistor

FPGA/ASIC/ADC

Device being

monitored

Readout Circuit

Xilinx Virtex-5 FPGA: Chip

temp swing 34 C

Using only 21%

computational resources

In 100’s of seconds!

TMP461-SP 1.8V, High-Accuracy, Low-Power Remote Temp Sensor

V2

RTM: Dec 2017

• Remote diode accuracy: +/- 1.5 C (50 kRad)

• Local temp accuracy: +/- 2 C (50 kRad)

• Resolution: Temp changes to 0.0625ºC

• Vs=1.7 V to 3.6V, 35 uA operating current

• Programmable non-ideality factor

• Alert pin: over-temperature trip signal

• Ceramic 10-lead HKU package.

• 7.02 mm × 6.86 mm

• Radiation

– SEL (60 MeV.cm2/mg at 125 C)

– Total dose: 50 kRad

SCL

V+

D+

D-

THERM

SDA

Alert

GND

A0

FPGA or ASIC

SMBus Controller

Host Processor

A1

Overtemperature Shutdown

Built-in Thermal

Transistor or Diode

1.7 V to 3.6 V 1.7 V to 3.6 V

TMP

46

1-S

P

Payload

Microcontroller: Remote Terminal/Telemetry Unit

Memory

Management

Unit

Payload

Command & Data

Management Unit

Power Control

and Distribution

Unit

Remote

Terminal Unit

Load

Actuator

Sensor

Sensor

Payload Bus

Pla

tfo

rm B

us

Power Bus

• RTU Functions: – Gather from sensors

(temp, pressure, digital status)

– Signal conditioning for sensor data

– Control AOCS actuators and sensors

– Distribute power to heaters

• Example shown may be in an AOCS

subsystem – Acquires sensor data, control actuators

– Distribute power to a load

• MCU’s enable “smart” RTU. – Reusable architecture across subsystems

RTU interfacing to sensors and actuators, and controlling a load

MSP430FR5969-MLS Radiation Tolerant MSP430 with FRAM

Features

• Ruggedized for space and radiation environments

• 16 MHz, 16-bit RISC CPU

• Wide Supply Voltage Range 1.8V to 3.6V

• Ultra low power consumption: Shutdown Mode (LPM4.5): 0.32 uA

• Wake up from Standby Mode in 7μs

• 64KB FRAM with free program code / data memory partitioning

– Nearly infinite (1015) write cycles

– 160x faster than Flash (>2MB/s)

– 250x less power in writes

• 2 KB SRAM

• Signal conditioning – ADC 12 bit, 16 channel: 200 ksps and 150uA consumption

– PWM output

– Analog comparator 15 channels, voltage hysteresis, reference generator

• Package: 48-pin TQFP AND QFN

Applications

Benefits

• Key component of distributed sensing & control

• Unique capabilities in small form factor design

• Integrated signal conditioning & nonvolatile memory

• Guaranteed TID and SEL performance

• Spacecraft distributed sensing & control

Radiation Performance

• TID = 50kRad(Si)

• SEL Immune to LET = 72 MeV.cm2/mg at 125 C

32x32 Multiplier

DMA (3 Ch), CRC16

Comp_D / Vref ADC12(up to 16 ch)

64KB FRAM

Real Time JTAG ,

Embedded emulation, BSL 2 UARTs or SPI

1 I2C or SPI

Up to 3 1x8 + 1 1x3 I/O Ports

w/ Interrupt / wake up

Power on Reset Brownout Reset

Low Power Vreg (1.5V) XT1, VLO

DCO (±2%), Real Time Clock

Watch Dog Timer, Timer 0_A3, Timer1_B3, Timer2_A3, Timer 3_B3, Timer 4_B3

MSP430FR5969-MLS Ultra Low Power 16 – bit MCU 16MHz

RTM Dec 2017

SN55LVDS31-SP 3.3 V Quad LVDS Driver

100kRad

SN55LVDS32-SP 3.3V Quad LVDS Receiver

100kRad

SN55LVDS33-SP 3.3V Quad LVDS Rec w/ -4 to

5V CM 50kRad

TLK2711-SP 2.5 Gbps SerDes

Transceiver 25kRad

SN55LVCP22-SP 1 Gbps 2x2 Cross-point Switch

100kRad

CDCM7005-SP 2.2 GHz Clock Synchronizer

& Jitter Cleaner 50kRad

SE555-SP Precision Timer Oscillator

25kRad

SN55182-SP Dual Differential Line

Receiver 40kRad

SN55183-SP Dual Differential Line Driver

40kRad

DS26F31MQML-SP RS422 Quad High-Speed Diff.

Driver 300kRad RHA

DS90C032QML-SP 5V Quad LVDS

Receiver 50kRad RHA

DS90C031QML-SP 5V Quad.LVDS Driver

100kRad RHA

DS16F95QML-SP RS485 Differential Bus

Transceiver 300kRad RHA

DS96F174MQML-SP RS485 Quad High-Speed Diff.

Driver

DS96F175MQML-SP RS485 Quad High-Speed Diff. Driver

Space Qualified Interface and Clocking

AM26LS33A-SP RS422 Quad Diff. Receiver

25kRad

LVDS

SerDes /

CAN

RS422/

RS485

General

Purpose TTL

Clocking

Speed

SN55HVD233-SP 3.3V CAN Transceiver

50kRad

Samples: Now!

Released

Development

DS26F32MQML-SP RS422 Quad Diff. Receiver

100kRad RHA

Spacecraft CAN bus

• AOCS Sensors & Actuators, Payload, Thermal control, Command & Data, …

• CAN Bus: Reliable backplane with latency constraints

Source: F.T. Lopez and P.Roos, A VHDL implementation of CANopen Protocol for CAN Bus On Board Spacecraft

SN55HVD233-SP +3.3V CAN Transceiver

Features

• TID = 50kRad(Si) RHA (L-level)

• SEL Immune: LET 86 MeV.cm2/mg @ 125C

• QMLV certified

• Compatible with ISO 11898-2

• 5V tolerant I/O with 3.3V Supply

• Bus pin short-circuit protection to ±36V

• ESD protection exceeds 16kV

• Designed for signaling rates up to 1 Mbps

• Glitch free power up & power down protection

• Lowest standby current (600uA max)

• Low Propagation delay: 85 ns (LH), 120 ns (HL)

• Analog Slew Rate Control via RS pin

• -7V to 12V Common Mode Range

• 8-lead CFP. 6.48 mm × 6.48 mm

• ECCN: EAR99

• Release to market: December 2017

Performance

16

RTM Dec 2017

Differential Signaling

• RS-422/RS-485

– Data rates up to few Mbps

– Up to 1 km

– Differential voltage drive

– Industrial control application

– Multidrop: RS-485

17

DS16F95QML-SP RS-485 Differential Bus Transceiver

Features

Applications

• Internal satellite communication

• Defense Electronics

• Radar and Guidance Systems

Radiation Performance

• TID = 100kRad(Si)

Benefits

• Designed for multipoint transmission

• Wide positive and negative input/output bus voltage ranges

• Thermal shutdown protection

• Driver positive and negative current-limiting

• High impedance receiver input

• Receiver input hysteresis of 50 mV typical

• Operates from single 5.0V supply

• QMLQ or QMLV qualified

• Temperature Range: -55°C to +125°C

• Available in 10-pin Ceramic Flatpack

Released

• Meets EIA-485 and EIA-422A specifications

• Meets SCSI-1 (5 MHZ) specifications

• Radiation (RHA) and Space (QMLV) qualified

• Orderable as SMD RHA:

– 5962F8961501VxA

TPS50601A-SP 3-6.3 VIN, 6 A, Monolithic Point of Load DC-DC Converter

Features

• PVIN = 3 to 6.3 V

• Min Output Voltage to 0.8 V

• Integrated 58 mΩ High Side and 50 mΩ Low Side Power FETs

• Adjustable Frequency 100 kHz to 1 MHz

• Parallel operation 180° out of Φ with Sync pin

• Internal VREF 1.5% variation over line, load, temp and radiation

• Patented Dynamic Bias Functionality included

• Integrated tracking function

• Theta JC = 0.6C/W

• Packaged in thermally enhanced 20-pin Ceramic Flatpack (HKW)

Applications

Benefits

• SMD 5962R1022102VSC RHA in process

• 96.6% Peak Efficiency (VOUT=3.3 V)

• Minimizes solution size through small package

• Excellent for driving 12 A current through current share for improved efficiency

• Ease of implementing power sequencing schemes

• Best in class thermal performance

• WebBench™ and Pspice Models Available

• Satellite Point of Load Power Supply

• Satellite Bus and Payload

Radiation Performance

• TID = 100kRad(Si), RHA

• SEL/SEB/SEGR Immune to LET = 75MeV @ 125C

• SEFI/SET onset @ LET = 65MeV

Development

20

TPS50601A-SP Simple migration option from TPS50601-SP design

Development

TPS50601-SP TPS50601A-SP

• Minor BOM and slight Layout Change –470 nF capacitor for REF pin connected

to GND

• TPS50601-SP –Boot Cap is connected to switch node

• TPS50601A-SP –PMOS is used on high-side so boot cap

is not required –Boot pin changes functionality to REF

Thank you! www.ti.com/space