Heterogeneou s Technology Alliance Template HTA General Assembly November 12 – 13, 2013
Template HTA General Assembly November 12 – 13, 2013
Feb 24, 2016
Template HTA General Assembly November 12 – 13, 2013. Contact : Fraunhofer ENAS [email protected] Phone: +49-371-45001 412 / 220. Project Idea: Reliability Assessment with Qualified Material Data Sets EU Call: e.g. ICT Calls in LEIT ( e.g . ICT1-3), photonics KETs. - PowerPoint PPT Presentation
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HeterogeneousTechnology
Alliance
TemplateHTA General AssemblyNovember 12 – 13, 2013
The Heterogeneous Technology Alliance HTA Project Idea: Reliability Assessmentwith Qualified Material Data Sets
EU Call: e.g. ICT Calls in LEIT (e.g. ICT1-3),photonics KETs
Project Idea short description:Reliability aligned technology development for highly miniaturized products (MEMS, ICs, photonics, )
Short Description (ref. to the reliability part): Challenging reliability assessment (manufacturing process & endurance) by physics of failure approaches (main obstacle for micro / nano scale components - used input data sets for FEA) measurement of material properties from components as manufactured (new techniques, e.g. FIB based) advanced validation strategies for complex material behavior and/or data sets of material property demonstration of improved failure avoidance strategies by accompanying process/product developm.IP situation and commercial viability:- Finite Element Analysis (FEA) is increasingly substantial part of process and device development- most limiting factor for FEA reliability assessment – quality of input data set (material properties, stress)Potential Applications:
-devices / systems with thin films / film stacks / micro&nano scale structures (e.g. BEoL stacked IC, 3D integration systems, sensors, smart systems, photonics systems)Potential Consortium/Competences needed:Firm 1: manufacturers of systems with dedicated need for accompanying failure avoidance analysisFirm 2: testing tool manufacturerRTO: material characterization (mechanical properties), device and system testing
Contact: Fraunhofer [email protected]: +49-371-45001 412 / 220
The Heterogeneous Technology Alliance HTA
HMT solder
PI layer
Soldermask
Boardpad
Underfill
LJT solder
Ni layerBEoL stack region
gap
Failure avoidanceby appropriate design rules Local residual stress
measurementby FIB milling
0 20 40 60 80 100 1200
20406080
100120140160
E [G
Pa]
h[nm]
Area influenced by the Si substrate
Berkevitch indenter
Local material properties
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