Telecommunication Innovative Platforms for Next Generation SDN/NFV Infrastructure Volume 17.1 www.lannerinc.com Singel 3 | B-2550 Kontich | Belgium | Tel. +32 (0)3 458 30 33 | [email protected] | www.alcom.be Rivium 1e straat 52 | 2909 LE Capelle aan den Ijssel | The Netherlands | Tel. +31 (0)10 288 25 00 | [email protected] | www.alcom.nl V. 7/17
24
Embed
Telecommunication · 12V 3A 36/60W Power Adapter 90W or 96W power adapter (By SKU) Input AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
Telecommunication Innovative Platforms for Next Generation SDN/NFV Infrastructure
Redundant Power SuppliesMany top-of-the-line network appliances utilize
dual power supplies to ensure a constant flow of
power. These appliances need to run 24/7 and
every failure can cost tremendously. Therefore,
smart network maintenance experts utilize dual
power supplies to make sure these appliances
never fail.
Rack Mounting KitsFor mounting flexibility, Lanner vCPE gateway are
compatible with rack mount options for suitable
installation in any environment setting.
8 www.lannerinc.com
Carrier-grade NFV Solutions
Case Study: Virtual Network Security in Carrier-grade NFV Lanner’s carrier-grade HTCA-series platforms are pre-intergated with Wind River Titanium Server NFV
infrastructure (NFVI) software platform and Trend Micro’s Virtual Network Function Suite, to present high
availability, scale-on-demand network security function for CSPs from premise, edge to core network.
To ensure carrier-grade up-time and the high levels of reliability mandated by telecom networks, Lanner’s
NFV-ready platforms have undergone a comprehensive testing and validation process with the Wind River
Titanium Cloud NFV infrastructure (NFVI) software solution. The validation process was conducted as part
of the Wind River Titanium Cloud ecosystem program dedicated to accelerate the time-to-deployment
of carrier-grade NFV solutions. Through the validation and pre-integration of industry-leading NFV ready
hardware and software, Lanner is able to deliver carrier-grade network platforms optimized for NFV
deployment, and service providers and TEMs can also be confident in selecting validated vendors in the
Full Redundancy and High AvailabilityAll CPU blade, network I/O blades, N+1 cooling
fans and power supply units are in full-redundancy
design to ensure carrier-grade high-availability
and 99.9999% uptimes.
NEBS ComplianceLanner appliances are compliant with NEBS
design to meet the key carrier-grade requirements
required for telecom network.
PCI-Express and Storage OptionsTo meet the requirements for open compute
architecture, Lanner appliances can support up to
6 3.5” or 12 2.5” HDD/SSD storage drives and 6
PCIe slots for expansion with acceleration cards.
Multiple Computing BladesOffering extreme performance and processing
power, Lanner’s advanced network appliances
can host up to 6 CPU blades, supporting up to
12 dual Intel® Xeon® processor E5-2699v4 CPUs
with a total of 264 cores.
Fully Modular Network I/O BladesLanner’s advanced network appliances feature up
to 6 front-cabling, swappable network I/O blades.
The top 2 blade slots are reserved for switch or
Ethernet NI blades, while the other 4 slots are
solely used for Ethernet NI blades.
High-speed Switching Capacity To meet the requirement of carrier-grade
network traffic, Lanner leverages the latest
packet processors to offer 100GbE high speed
throughputs with capacity up to 1.2Tbps.
10 www.lannerinc.com
Virtual Edge Routing
The driving force of the network by moving VNF’s from the core infrastructure towards the edge and the
introduction of packaged services introduces specific requirements to sustain the control and data plane
traffic with reduced latency at the edge deployment.
The edge computing and intelligent gateway architecture require the capabilities to tremendous volume
of traffic for real-time pre-processing, data analytics, policy control, communication and messaging to
connect, collect and manage the devices to the network. Therefore, the edge routing platform requires
the following layers:
1) Control Layer
2) Infrastructure Layer
3) Application Layer
With the rollout of the CORD network infrastructure, the Virtual Edge Routing Platform requires to:
- Perform L3 unicast routing to and from the Central Office and participate in dynamic routing protocols
- Multicast signaling and forwarding
- Apply Quality of Service (QoS) policies
- Support and apply NAT functionalities
Lanner Solution on Virtual Edge RoutingThe architecture of the HTCA-1000 platform contains the framework of all three elements for edge routing
in a form factor suitable for edge deployments. Furthermore, the high switching and routing capacity in
combination of the control and infrastructure processing architecture makes it the ideal platform for
Virtual Edge Routing towards the deployment of a SDN foundation to the future of 5G telecom.
HTCA-1000• Carrier-grade Switch Based on BCM StrataDNX™• Intel Atom™ C2758 Processor (Rangeley)• BCM8867x (Jericho) with 720G~1.2Tbps Capacity• 4 x NIM Module Slots, Max. 32 x 10G or 6 x 100G Cages
Current
Access Network Core Network
CRCE
CE
PEAccess
NetworkPE
CE
CE
CR
CR
CR
SDN ControllerFuture
Access Network Core Network
Access Network
Router
Router
Router
Router
Router
Router
Switch
SVR
NFV
Switch
SVR
NFV
Switch
Switch
Switch
Switch
• 1G, 10G and 100G I/F, 100G to 1T switching• IPv4/IPv6 Routing, ECMP, Multicast, NAT• MPLS LER (3 labels, IP-VPN, VPWS, VPLS,FRR)• High performance QoS and OAM• Other service functions (Firewall, IPS/IDS, DPI, etc.)
Edge Router Function:
www.lannerinc.com 11
Mobile Edge Computing
As the European Telecommunications Standards Institute (ETSI) led initiative in its adoption phase, the
requirements to roll out new services to the edge in the network have coined and there are several
deployments and business models for the Mobile Edge Computing (MEC) platforms. Ultimately, processing,
storage, media streaming and security functions have been migrated to the edge for mobile deployments.
With the introduction of IoT consisting of multiple vertical networks within the core network infrastructure,
Mobile Edge Computing defines a set of requirements to roll out new services. Since form factor, processing
and storage capabilities are the key elements in mobile network, Network Service Chaining and Service
Chain Provisioning are becoming the new business model with NFV deployments.
Lanner Solution on Mobile Edge ComputingWith its modularity and capability to meet the edge requirements, the Lanner portfolio is combining
multiple functionalities within the same platforms. Therefore the platforms are not only limited for general
compute but also optimized for media processing, storage and switching. The variants cover in-door edge
deployments, NEBS qualified and rugged gateway platforms.
HTCA-6200• 2U HybridTCA™ Carrier-grade SDN/NFV Appliance• 2 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® E5-2690 v3/v4 CPUs and 16x DDR4• BCM StrataXGS™ Trident-II/II+ BCM56854/56860 Switch Fabric with 720/1280 Gbps• 2 x Blade Slots in the Front (Switch blade or NIC blade)• N+1 Redundant PSUs & 5x Heavy-duty Swappable Fans• NEBS Design Compliance
LOMI/O Interface N/A N/A N/A N/A N/A N/A 1 x RJ45 (Optional) *Share with ETH0
OPMA Slot N/A N/A N/A N/A N/A N/A Yes
I/O Interface
Reset Button 1 1 1 1 1 1 1
LED Power/Status/Storage Power LED on power button Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage
Power Button 1 1 1 1 1 1 1
Console 1 x RJ-45 1 x RJ45 1 x RJ-45 1 x RJ-45 1 x RJ45 1 x RJ45 1 x RJ45
USB 2 x USB 2.0 1 x USB 2.0, 1 x USB 3.0 2 x USB 3.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 3.0
LCD Module N/A N/A N/A N/A N/A N/A N/A
Display 1 x VGA (By Project) 1 x HDMI 1 x HDMI N/A N/A N/A N/A
Power Input 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack
StorageHDD/SSD Support 1 x 2.5” Bay - SSD Only (Optional) 1 x 2.5” Bay - SSD Only (By SKU) 1 x 2.5” Bay - SSD Only (Optional) 1 x 2.5” Bay (Optional) 1 x 2.5” Bay - SSD Only (By SKU/Optional) 1 x 2.5” Bay (Optional) 1 x 2.5” Bay - SSD Only (By SKU/Optional)
Onboard Storage 1 x mSATA mini 1 x mSATA mini 1 x mSATA 1 x SATA DOM 1 x Type II CF 1 x Type II CF (Optional) 1 x 16GB EMMC
ExpansionPCIe N/A N/A N/A N/A N/A N/A N/A
mini-PCIe N/A 1 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe (By SKU) 2 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe Half Size (PCIe/USB2.0)(By SKU) 2 x Mini-PCIe (PCIe/USB2.0)
Miscellaneous
Watchdog Yes Yes Yes Yes Yes Yes Yes
Internal RTC with Li Battery Yes Yes Yes Yes Yes Yes Yes
CoolingProcessor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passisve CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink
System Fanless Fanless 1 x cooling fan or fanless 1 x cooling fan or fanless (By Project) Fanless 1 x cooling fan with smart fan 3 x cooling fans with smart fan
Environmental Parameters
Temperature0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~50ºC Operating-20~70ºC Non-Operating
Humidity (RH)5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
SystemDimensions
(WxHxD) 230 x 44 x 170 mm 137 x 36 x 120 mm 230 x 44 x 170 mm 185 x 44 x 137 mm 177 x 44 x 146 mm 231 x 44 x 200 mm 275 x 44 x 310 mm
Weight 1.2 kg 0.5 kg 1.2 kg 1 kg 1.5 kg 1.2 kg 5 kg
PackageDimensions
(WxHxD) 518 x 264 x 391 mm 426 x 252 x 282 mm 518 x 264 x 391 mm 312 x 280 x 140 mm 270 x 250 x 120 mm 325 x 305 x 120 mm 325 x 305 x 120 mm
Weight 10 kg (4 in 1) 8.5kg (10 in 1) 10 kg (4 in 1) 1.8 kg 2 kg 2.2 kg 6 kg
PowerType / Watts 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 36W or 60W power adapter (By SKU) 12V 3A 36/60W Power Adapter 90W or 96W power adapter (By SKU)
Input AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240 V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240 V @ 50~60 Hz
Approvals and Compliance RoHS, CE/FCC Class B RoHS, CE/FCC Class B RoHS RoHS, CE/FCC Class B RoHS, CE/FCC Class B, UL RoHS, CE/FCC Class B, UL RoHS, CE/FCC Class B
LOMI/O Interface N/A N/A N/A N/A N/A N/A 1 x RJ45 (Optional) *Share with ETH0
OPMA Slot N/A N/A N/A N/A N/A N/A Yes
I/O Interface
Reset Button 1 1 1 1 1 1 1
LED Power/Status/Storage Power LED on power button Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage
Power Button 1 1 1 1 1 1 1
Console 1 x RJ-45 1 x RJ45 1 x RJ-45 1 x RJ-45 1 x RJ45 1 x RJ45 1 x RJ45
USB 2 x USB 2.0 1 x USB 2.0, 1 x USB 3.0 2 x USB 3.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 3.0
LCD Module N/A N/A N/A N/A N/A N/A N/A
Display 1 x VGA (By Project) 1 x HDMI 1 x HDMI N/A N/A N/A N/A
Power Input 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack 1 x DC Jack
StorageHDD/SSD Support 1 x 2.5” Bay - SSD Only (Optional) 1 x 2.5” Bay - SSD Only (By SKU) 1 x 2.5” Bay - SSD Only (Optional) 1 x 2.5” Bay (Optional) 1 x 2.5” Bay - SSD Only (By SKU/Optional) 1 x 2.5” Bay (Optional) 1 x 2.5” Bay - SSD Only (By SKU/Optional)
Onboard Storage 1 x mSATA mini 1 x mSATA mini 1 x mSATA 1 x SATA DOM 1 x Type II CF 1 x Type II CF (Optional) 1 x 16GB EMMC
ExpansionPCIe N/A N/A N/A N/A N/A N/A N/A
mini-PCIe N/A 1 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe (By SKU) 2 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe (PCIe/USB2.0) 1 x Mini-PCIe Half Size (PCIe/USB2.0)(By SKU) 2 x Mini-PCIe (PCIe/USB2.0)
Miscellaneous
Watchdog Yes Yes Yes Yes Yes Yes Yes
Internal RTC with Li Battery Yes Yes Yes Yes Yes Yes Yes
CoolingProcessor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passisve CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink
System Fanless Fanless 1 x cooling fan or fanless 1 x cooling fan or fanless (By Project) Fanless 1 x cooling fan with smart fan 3 x cooling fans with smart fan
Environmental Parameters
Temperature0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~50ºC Operating-20~70ºC Non-Operating
Humidity (RH)5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
SystemDimensions
(WxHxD) 230 x 44 x 170 mm 137 x 36 x 120 mm 230 x 44 x 170 mm 185 x 44 x 137 mm 177 x 44 x 146 mm 231 x 44 x 200 mm 275 x 44 x 310 mm
Weight 1.2 kg 0.5 kg 1.2 kg 1 kg 1.5 kg 1.2 kg 5 kg
PackageDimensions
(WxHxD) 518 x 264 x 391 mm 426 x 252 x 282 mm 518 x 264 x 391 mm 312 x 280 x 140 mm 270 x 250 x 120 mm 325 x 305 x 120 mm 325 x 305 x 120 mm
Weight 10 kg (4 in 1) 8.5kg (10 in 1) 10 kg (4 in 1) 1.8 kg 2 kg 2.2 kg 6 kg
PowerType / Watts 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 12V 3A 36W Power Adapter 36W or 60W power adapter (By SKU) 12V 3A 36/60W Power Adapter 90W or 96W power adapter (By SKU)
Input AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240 V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 100~240 V @ 50~60 Hz
Approvals and Compliance RoHS, CE/FCC Class B RoHS, CE/FCC Class B RoHS RoHS, CE/FCC Class B RoHS, CE/FCC Class B, UL RoHS, CE/FCC Class B, UL RoHS, CE/FCC Class B
Socket 4 x 288pin DIMM 2 x 288pin DIMM 2 x 288pin DIMM 4 x 288pin DIMM 8 x 288pin DIMM
Networking
Ethernet Ports1 x GbE RJ45 Intel® i2104 x GbE RJ-45 Intel® i350-AM44 SFP+ Intel® Denverton Integrated (By SKU)
8 x GbE RJ45 Intel® i2108 x GbE RJ45 Intel® i350-AM4 (By SKU)2 x 10G SFP+ Broadwell-DE SOC (By SKU)
6 x GbE RJ45 Intel® i2102 x GbE SFP Intel® i210-IS (SKU B/C)8 x GbE RJ45 Intel® i210 (SKU C)
1 x GbE RJ45 Intel® i210 / 8 x GbE RJ45 Intel® i210 (SKU A) 12 x GbE RJ45 Intel® i350-AM4 + 4 x GbE SFP Intel® i350-AM4 (SKU B)4 NIC modules (SKU C)
1 x GbE RJ45 Intel® i210
Bypass 2 pairs Gen3 (By SKU) 3 or 7 pairs Gen3 (By SKU) 2 pairs Gen3 (By SKU) up to 6 pairs Gen3 (By SKU) Depends on NIC module specifications
NIC Module Slot 1 1 1 2 or 4 (By SKU) 4
LOMI/O Interface 1 x RJ45 (By SKU) 1 x RJ45 (By Project) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0
OPMA Slot N/A Yes (By Project) Yes Yes Yes
I/O Interface
Reset Button 1 1 1 1 1
LED Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage
Power Button 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch
Console 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45
USB 2 x USB 3.0 2 x USB 2.0 2 x USB 3.0 2 x USB 3.0 2 x USB 2.0
LCD Module 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads
Display From OPMA slot (Optional) From OPMA slot (By Project) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional)
Power Input AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU
StorageHDD/SSD Support 2 x 2.5” bays 2 x 2.5” bays 2 x 2.5” bays 2 x 2.5” bays 1 x 3.5” or 2 x 2.5” bays
Onboard Storage 1 x mSATA 1 x mSATA 1 x mSATA 1 x mSATA 1 x CFast
ExpansionPCIe 1 x PCI-E*8 HH/HL (Optional) 1 x PCI-E*8 FH/HL (Optional) 1 x PCI-E*8 FH/HL (By Project) 1 x PCI-E*8 FH/HL (By Project) 1 x PCI-E*8 FH/HL (Optional)
CoolingProcessor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink
System 2 x cooling fans with smart fan 2 x cooling fans with smart fan 2 x cooling fans with smart fan 4 x cooling fans with smart fan 4 x individual hot-swappable cooling fans with smart fan
Environmental Parameters
Temperature0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
Humidity (RH)5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
SystemDimensions
(WxDxH) 438 x 321 x 44 mm 438 x 321 x 44 mm 438 x 321 x 44 mm 438 x 525 x 44 mm 438 x 580 x 44 mm
Weight 7 kg 7.5 kg 7.5 kg 15 kg 16.5 kg
PackageDimensions
(WxDxH) 540 x 500 x 230 mm 540 x 500 x 230 mm 540 x 500 x 230 mm 790 x 600 x 220 mm 790 x 600 x 220 mm
Weight 8 kg 8.5 kg 8.5 kg 16 kg 18 kg
PowerType / Watts 220W ATX Single PSU 220W ATX Single PSU 220W ATX Single PSU 300W 1+1 ATX Redundant PSUs 300W 1+1 ATX Redundant PSUs
Input AC 90~264V @ 47~63Hz AC 90~264V @ 47~63Hz AC 90~264V @ 47~63Hz AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz
Approvals and Compliance RoHS RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL
Socket 4 x 288pin DIMM 2 x 288pin DIMM 2 x 288pin DIMM 4 x 288pin DIMM 8 x 288pin DIMM
Networking
Ethernet Ports1 x GbE RJ45 Intel® i2104 x GbE RJ-45 Intel® i350-AM44 SFP+ Intel® Denverton Integrated (By SKU)
8 x GbE RJ45 Intel® i2108 x GbE RJ45 Intel® i350-AM4 (By SKU)2 x 10G SFP+ Broadwell-DE SOC (By SKU)
6 x GbE RJ45 Intel® i2102 x GbE SFP Intel® i210-IS (SKU B/C)8 x GbE RJ45 Intel® i210 (SKU C)
1 x GbE RJ45 Intel® i210 / 8 x GbE RJ45 Intel® i210 (SKU A) 12 x GbE RJ45 Intel® i350-AM4 + 4 x GbE SFP Intel® i350-AM4 (SKU B)4 NIC modules (SKU C)
1 x GbE RJ45 Intel® i210
Bypass 2 pairs Gen3 (By SKU) 3 or 7 pairs Gen3 (By SKU) 2 pairs Gen3 (By SKU) up to 6 pairs Gen3 (By SKU) Depends on NIC module specifications
NIC Module Slot 1 1 1 2 or 4 (By SKU) 4
LOMI/O Interface 1 x RJ45 (By SKU) 1 x RJ45 (By Project) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0
OPMA Slot N/A Yes (By Project) Yes Yes Yes
I/O Interface
Reset Button 1 1 1 1 1
LED Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage
Power Button 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch
Console 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45
USB 2 x USB 3.0 2 x USB 2.0 2 x USB 3.0 2 x USB 3.0 2 x USB 2.0
LCD Module 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads
Display From OPMA slot (Optional) From OPMA slot (By Project) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional)
Power Input AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU
StorageHDD/SSD Support 2 x 2.5” bays 2 x 2.5” bays 2 x 2.5” bays 2 x 2.5” bays 1 x 3.5” or 2 x 2.5” bays
Onboard Storage 1 x mSATA 1 x mSATA 1 x mSATA 1 x mSATA 1 x CFast
ExpansionPCIe 1 x PCI-E*8 HH/HL (Optional) 1 x PCI-E*8 FH/HL (Optional) 1 x PCI-E*8 FH/HL (By Project) 1 x PCI-E*8 FH/HL (By Project) 1 x PCI-E*8 FH/HL (Optional)
CoolingProcessor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink
System 2 x cooling fans with smart fan 2 x cooling fans with smart fan 2 x cooling fans with smart fan 4 x cooling fans with smart fan 4 x individual hot-swappable cooling fans with smart fan
Environmental Parameters
Temperature0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
Humidity (RH)5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
SystemDimensions
(WxDxH) 438 x 321 x 44 mm 438 x 321 x 44 mm 438 x 321 x 44 mm 438 x 525 x 44 mm 438 x 580 x 44 mm
Weight 7 kg 7.5 kg 7.5 kg 15 kg 16.5 kg
PackageDimensions
(WxDxH) 540 x 500 x 230 mm 540 x 500 x 230 mm 540 x 500 x 230 mm 790 x 600 x 220 mm 790 x 600 x 220 mm
Weight 8 kg 8.5 kg 8.5 kg 16 kg 18 kg
PowerType / Watts 220W ATX Single PSU 220W ATX Single PSU 220W ATX Single PSU 300W 1+1 ATX Redundant PSUs 300W 1+1 ATX Redundant PSUs
Input AC 90~264V @ 47~63Hz AC 90~264V @ 47~63Hz AC 90~264V @ 47~63Hz AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz
Approvals and Compliance RoHS RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL
CoolingProcessor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink
System 1 x cooling fan with smart fan 1 x cooling fan with smart fan 2 x cooling fan with smart fan 2 x cooling fan with smart fan 2 x cooling fan with smart fan
Environmental Parameters
Temperature0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
Humidity (RH)5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
SystemDimensions
(WxDxH) 431 x 305 x 44 mm 431 x 305 x 44 mm 431 x 305 x 44 mm 431 x 305 x 44 mm 431 x 366 x 44 mm
Weight 6 kg 6.5 kg 7 kg 7 kg 8.2 kg
PackageDimensions
(WxDxH) 540 x 510 x 215 mm 540 x 510 x 215 mm 540 x 500 x 230 mm 540 x 500 x 230 mm 554 x 485 x 215 mm
Weight 7 kg 7.5 kg 8 kg 8 kg 10 kg
PowerType / Watts 100W ATX Single PSU 150W ATX Single PSU 220W ATX Single PSU 220W ATX Single PSU 500W Single PSU(Redundant optional)
Input AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz AC 100~240V @ 50~60 Hz
Approvals and Compliance RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS
CoolingProcessor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink
System 1 x cooling fan with smart fan 1 x cooling fan with smart fan 2 x cooling fan with smart fan 2 x cooling fan with smart fan 2 x cooling fan with smart fan
Environmental Parameters
Temperature0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
Humidity (RH)5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
SystemDimensions
(WxDxH) 431 x 305 x 44 mm 431 x 305 x 44 mm 431 x 305 x 44 mm 431 x 305 x 44 mm 431 x 366 x 44 mm
Weight 6 kg 6.5 kg 7 kg 7 kg 8.2 kg
PackageDimensions
(WxDxH) 540 x 510 x 215 mm 540 x 510 x 215 mm 540 x 500 x 230 mm 540 x 500 x 230 mm 554 x 485 x 215 mm
Weight 7 kg 7.5 kg 8 kg 8 kg 10 kg
PowerType / Watts 100W ATX Single PSU 150W ATX Single PSU 220W ATX Single PSU 220W ATX Single PSU 500W Single PSU(Redundant optional)
Input AC 100~240V @ 50~60 Hz AC 100~240V @ 50~60 Hz AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz AC 100~240V @ 50~60 Hz
Approvals and Compliance RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS
BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS
System Memory
TechnologyDDR3 1333/1600MHz ECC(By CPU) or non-ECC UDIMM
DDR3 1333/1600MHz ECC(By CPU) or non-ECC UDIMM
DDR3 1333/1600MHz REG, ECC or non-ECC UDIMM
DDR4 2133/2400MHz REG DIMM
DDR3 1333/1600MHz REG or ECC DIMM
DDR4 2133/2400MHz REG DIMM
Max. Capacity 16GB 32GB 64GB 512GB 128GB 512GB
Socket 2 x 240pin DIMM 4 x 240pin DIMM 8 x 240pin DIMM 16 x 288pin DIMM 16 x 240pin DIMM 16 x 288pin DIMM
Networking
Ethernet Ports1 x GbE RJ45 Intel® i217 PHY7 x GbE RJ45 Intel® i210
8 x GbE RJ45 Intel® i210 1 x GbE RJ45 Intel® i210 1 x GbE RJ45 Intel® i210 1 x GbE RJ45 Intel® 82574L 1 x GbE RJ45 Intel® i210
Bypass 3 pairs Gen3 (By SKU) 3 pairs Gen3 (By SKU) Depends on NIC module specifications Depends on NIC module specifications Depends on NIC module specifications Depends on NIC module specifications
NIC Module Slot 1 2 (By SKU) 4 4 8 8
LOMI/O Interface 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0
OPMA Slot Yes (By Project) Yes Yes Yes Yes Yes
I/O Interface
Reset Button 1 1 1 1 1 1
LED Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage
Power Button 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch
Console 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45
USB 2 x USB 2.0 2 x USB 3.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0
LCD Module 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads
Display From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional)
Power Input AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU
StorageHDD/SSD Support 2 x 2.5” bays 2 x 2.5” bays 1 x 3.5” or 2 x 2.5” bay 1 x 3.5” or 2 x 2.5” bay 2 x 3.5” bay (SKU A/B) or 4 x 3.5” bay (SKU C/D)
1 x 3.5” or 2 x 2.5” internal bay (SKU A/B/C/D)2 x 2.5” external accessible tray (SKU E/F/G/H)
Onboard Storage 1 x Type II CF 1 x CFast 1 x Type II CF 1 x CFast 1 x Type II CF 1 x CFast
ExpansionPCIe 1 x PCI-E*8 FH/HL (optional) 2 x PCI-E*4 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional) N/A 1 x PCI-E*8 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional)
mini-PCIe N/A N/A N/A N/A N/A N/A
Miscellaneous
Watchdog Yes Yes Yes Yes Yes Yes
Internal RTC with Li Battery Yes Yes Yes Yes Yes Yes
Processor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink
System 3 x cooling fans with smart fan 3 x cooling fans with smart fan4 x individual hot-swappable cooling fans with smart fan
4 x individual hot-swappable cooling fans with smart fan 4 x individual hot-swappable cooling fans with smart fan 4 x individual hot-swappable cooling fans with smart fan
Environmental Parameters
Temperature0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
Humidity (RH)5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
SystemDimensions
(WxDxH) 431 x 415 x 44 mm 431 x 468 x 44 mm 438 x 580 x 44 mm 438 x 630 x 44 mm 444 x 600 x 88 mm 444 x 600 x 88 mm
Weight 11.5 kg 12.5 kg 16.5 kg 16.5 kg 24 kg 24 kg
PackageDimensions
(WxDxH) 570 x 530 x 240 mm 735 x 595 x 230 mm 790 x 600 x 220 mm 790 x 600 x 220 mm 825 x 600 x 270 mm 825 x 600 x 270 mm
Weight 12.5 kg 13.5 kg 18 kg 18 kg 26 kg 26 kg
PowerType / Watts
220W ATX Single PSU or 300W 1+1 ATX Redundant PSUs
Input AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz AC 100~240V @ 47~63 Hz AC 100~240V @ 47~63 Hz AC 100~240V @ 47~63 Hz
Approvals and Compliance RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL
BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS AMI SPI Flash BIOS
System Memory
TechnologyDDR3 1333/1600MHz ECC(By CPU) or non-ECC UDIMM
DDR3 1333/1600MHz ECC(By CPU) or non-ECC UDIMM
DDR3 1333/1600MHz REG, ECC or non-ECC UDIMM
DDR4 2133/2400MHz REG DIMM
DDR3 1333/1600MHz REG or ECC DIMM
DDR4 2133/2400MHz REG DIMM
Max. Capacity 16GB 32GB 64GB 512GB 128GB 512GB
Socket 2 x 240pin DIMM 4 x 240pin DIMM 8 x 240pin DIMM 16 x 288pin DIMM 16 x 240pin DIMM 16 x 288pin DIMM
Networking
Ethernet Ports1 x GbE RJ45 Intel® i217 PHY7 x GbE RJ45 Intel® i210
8 x GbE RJ45 Intel® i210 1 x GbE RJ45 Intel® i210 1 x GbE RJ45 Intel® i210 1 x GbE RJ45 Intel® 82574L 1 x GbE RJ45 Intel® i210
Bypass 3 pairs Gen3 (By SKU) 3 pairs Gen3 (By SKU) Depends on NIC module specifications Depends on NIC module specifications Depends on NIC module specifications Depends on NIC module specifications
NIC Module Slot 1 2 (By SKU) 4 4 8 8
LOMI/O Interface 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0 1 x RJ45 (Optional) *Share with ETH0
OPMA Slot Yes (By Project) Yes Yes Yes Yes Yes
I/O Interface
Reset Button 1 1 1 1 1 1
LED Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage Power/Status/Storage
Power Button 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch 1 x ATX Power switch
Console 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45 1 x RJ45
USB 2 x USB 2.0 2 x USB 3.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0 2 x USB 2.0
LCD Module 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads 2x20 character LCM 4 x keypads
Display From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional) From OPMA slot (Optional)
Power Input AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU AC power inlet on PSU
StorageHDD/SSD Support 2 x 2.5” bays 2 x 2.5” bays 1 x 3.5” or 2 x 2.5” bay 1 x 3.5” or 2 x 2.5” bay 2 x 3.5” bay (SKU A/B) or 4 x 3.5” bay (SKU C/D)
1 x 3.5” or 2 x 2.5” internal bay (SKU A/B/C/D)2 x 2.5” external accessible tray (SKU E/F/G/H)
Onboard Storage 1 x Type II CF 1 x CFast 1 x Type II CF 1 x CFast 1 x Type II CF 1 x CFast
ExpansionPCIe 1 x PCI-E*8 FH/HL (optional) 2 x PCI-E*4 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional) N/A 1 x PCI-E*8 FH/HL (optional) 1 x PCI-E*8 FH/HL (optional)
mini-PCIe N/A N/A N/A N/A N/A N/A
Miscellaneous
Watchdog Yes Yes Yes Yes Yes Yes
Internal RTC with Li Battery Yes Yes Yes Yes Yes Yes
Processor Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink Passive CPU heatsink
System 3 x cooling fans with smart fan 3 x cooling fans with smart fan4 x individual hot-swappable cooling fans with smart fan
4 x individual hot-swappable cooling fans with smart fan 4 x individual hot-swappable cooling fans with smart fan 4 x individual hot-swappable cooling fans with smart fan
Environmental Parameters
Temperature0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
0~40ºC Operating-20~70ºC Non-Operating
Humidity (RH)5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
5~90% Operating5~95% Non-Operating
SystemDimensions
(WxDxH) 431 x 415 x 44 mm 431 x 468 x 44 mm 438 x 580 x 44 mm 438 x 630 x 44 mm 444 x 600 x 88 mm 444 x 600 x 88 mm
Weight 11.5 kg 12.5 kg 16.5 kg 16.5 kg 24 kg 24 kg
PackageDimensions
(WxDxH) 570 x 530 x 240 mm 735 x 595 x 230 mm 790 x 600 x 220 mm 790 x 600 x 220 mm 825 x 600 x 270 mm 825 x 600 x 270 mm
Weight 12.5 kg 13.5 kg 18 kg 18 kg 26 kg 26 kg
PowerType / Watts
220W ATX Single PSU or 300W 1+1 ATX Redundant PSUs
Input AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz AC 90~264V @ 47~63 Hz AC 100~240V @ 47~63 Hz AC 100~240V @ 47~63 Hz AC 100~240V @ 47~63 Hz
Approvals and Compliance RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL RoHS, CE/FCC Class A, UL
NCS2-IGM806A 8 i350-AM4 4 Pairs Gen3 V V V V V V V
NCS2-IGM806B 8 i350-AM4 N/A V V V V V
NCS2-IGM808A 8 i210AT 4 Pairs Gen3 V V V V V
NCS2-IGM808B 8 i210AT N/A V
GbE Fiber Modules
NCS2-ISM405A 4 i350-AM4 Fiber Bypass V V V V V
NCS2-ISM406A 4 i350-AM4 N/A V V V V V V
NCS2-ISM802A 8 i350-AM4 N/A V V V V V V
GbE Copper/Fiber Mixed Modules
NCS2-IMM401 2+2 i350-AM4 N/A V V V V V V
NCS2-IMM802 4+4 i350-AM4 2 pair Gen 3 V V
10GbE Copper Modules
NCS2-ITM203B 2 X540 N/A V V V V V
10GbE Fiber Modules
NCS2-IXM204A 2 82599ES N/A V V V V V V
NCS2-IXM205A 2 82599ES 1 Pair Gen3 V V V V V
NCS2-IXM405A 4 82599ES N/A V V V V V V V
NCS2-IXM407 4 XL710-AM1 N/A V V V V V V V
40GbE Fiber Modules
NCS2-IQM201 2 XL710-AM2 N/A V V V V V V
100GbE Fiber Modules
NC2S-RRC01A 2 FM10420 N/A V
NC2S-MXH01A 2 ConnectX-4 N/A V
www.lannerinc.com 21
Networking I/O Blades
To meet the next-generation network requirements, Lanner has introduced HybridTCA network
appliances: HTCA-6600 and HTCA-6200. HTCA-6600 is ideal for NFV DPI Server which can afford
massive DPI parsing capability, while HTCA-6200 is ideal for Edge Router with NFV Application.
In order to enhance scalability of the HybridTCA appliances above, Lanner also announces its latest
HTCA-compatible and swappable HLM-series carrier-grade blades lineup that provides enhanced
redundancy, interoperability, flexibility, bandwidth and performance boosts. For instance, Lanner’s
HLM-1020 switching blade comes with dual 100GbE CXP ports and 20 10GbE SFP+ ports. These blades
also pave the way for seamless migration in the near future.
The rising adoption of SDN and NFV in telecommunication industry has driven the demands for
consolidated and integrated hardware architectures for networking purposes, including servers, switches
and routers. The software approaches are favored by telecommunication sectors as SDN and NFV help
reduce implementations of proprietary hardware equipments. By leveraging the benefits of SDN and NFV,
carriers are gaining lower TCO, higher efficiencies and increased flexibility in network managements.
Video Transcoding ModulesLanner provides front-facing, easily swappable video transcoding modules that transport high quality
streaming and bandwidth-hungry video content.
4K Video Transcoding Module - NCS2-VT02A• Video transport NIC module for Lanner network appliances• Onboard Intel® Xeon® E3-1565L v5 CPU with C236 chipset• Support 4K Ultra-HD resolution and H.265 compression• Built-in Intel® Iris Pro Graphics GT4e
The I/O blades or NIC modules shown in this material are not designed to operate independently without a compatible Lanner appliance. Please make sure a compatible Lanner appliance is in place before purchasing the modules.
OS Support Linux Kernel 2.6 or above Linux Kernel 2.6 or above Linux Kernel 2.6 or above, ONIE, Linux Kernel 2.6 or above Linux Kernel 2.6 or above Linux Kernel 2.6 or above
Max. Capacity 512GB 128 GB 256 GB 64 GB 512 GB (16 x 32GB) per M/B tray 512 GB (16 x 32GB) per M/B tray
Socket 16 x 240-pin DIMM 8 X 240-pin DIMM 8 x 288-pin DIMM Up to 2 x SODIMM 16 x 288-pin DDR4 DIMMs per M/B 16 x 288-pin DDR4 DIMMs per M/B
StorageHDD Bays 12 x 3.5” Swappable HDD drive bays 2 x 3.5” Swappable HDD drive bays 2 x 2.5” Swappable HDD drive bays 1 x SATA III, 1 x mSATA connectors 2 x 2.5” Swappable HDD drive bays 6 x 3.5” Swappable HDD drive bays
CF/SD 1 x CF card Type II 1 x CF card Type II 1 x mSATA connector 1 x mSATA 64GB 1 x CF per M/B tray 1 x CF per M/B tray
Networking
Ethernet Ports1x RJ-45 with LED for IPMI / Management port
Up to 36 x GbE SFP or 12 x 10GbE SFP+ via 3 network blades with onboard 1 man-agement port and 1 SFP+ dedicate port
2x RJ-45 with LED for IPMI / Management port, 1x RJ45 for console port
Up to 32 x 10GbE SFP+ ports or 6 x 100GbE QSFP ports Blade 1~2: Switch Fabric Blade or Ethernet I/O BladeBlade 1~2: Switch Fabric BladeBlade 3~6: Ethernet I/O Blade
Bypass Depends on NIC module specification Depends on blade specification N/A N/A N/A N/A
ControllersIntel Ethernet controller, depends on NIC module specification
Intel 82574L & 82599ES 1 x Intel i210Broadcom® StrataDNX BCM8867x (Jericho) packet processor with 720Gbps ~1.2Tbps capacity
Depends on blade specification (HLM series) Depends on blade specification (HLM series)
NIC Module Slot / Blade 2 x NIC Module Slots 3 x Blades N/A 4 x NIM Module Slots 2 x Blades 6 x Blades
IPMI Share with Management port 1 x IPMI port 1 x IPMI port 2 x onboard IPMI ports 1 x onboard IPMI ports 1 x onboard IPMI ports
Management Port 1 x Management port 1 x Management port 1 x Management port 2 x 10G SFP+ ports 1 x Management port 1 x Management port
I/O Interface
Reset Button Yes Yes Yes Yes Yes Yes
Console 1 x RJ-45 1 x RJ-45 1 x RJ-45 1 x RJ-45 1 x RJ-45 1 x RJ-45
USB 2 x USB 2.0 1 x USB 2.0 1 x USB 3.0 2 x USB 2.0 1 x USB 2.0 1 x USB 2.0
ExpansionPCIe
1 x PCI-E*8 full height PCI-E card in the front; 1 x PCI-E*8 in the rear via riser card
N/A2* PCI-E Gen 3 x 8 Removable slots 4* PCI-E Gen 3 x 16 Removable slots
N/A N/A N/A
PCI N/A N/A N/A N/A N/A N/A
CoolingProcessor CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct
System 3 x hot-swappable cooling fans 5 x hot-swappable cooling fans per M/B 8 x hot-swappable cooling fans 4 x hot-swappable cooling fans 5 x hot-swappable cooling fans per M/B 5 x hot-swappable cooling fans per M/B
OS Support Linux Kernel 2.6 or above Linux Kernel 2.6 or above Linux Kernel 2.6 or above, ONIE, Linux Kernel 2.6 or above Linux Kernel 2.6 or above Linux Kernel 2.6 or above
Max. Capacity 512GB 128 GB 256 GB 64 GB 512 GB (16 x 32GB) per M/B tray 512 GB (16 x 32GB) per M/B tray
Socket 16 x 240-pin DIMM 8 X 240-pin DIMM 8 x 288-pin DIMM Up to 2 x SODIMM 16 x 288-pin DDR4 DIMMs per M/B 16 x 288-pin DDR4 DIMMs per M/B
StorageHDD Bays 12 x 3.5” Swappable HDD drive bays 2 x 3.5” Swappable HDD drive bays 2 x 2.5” Swappable HDD drive bays 1 x SATA III, 1 x mSATA connectors 2 x 2.5” Swappable HDD drive bays 6 x 3.5” Swappable HDD drive bays
CF/SD 1 x CF card Type II 1 x CF card Type II 1 x mSATA connector 1 x mSATA 64GB 1 x CF per M/B tray 1 x CF per M/B tray
Networking
Ethernet Ports1x RJ-45 with LED for IPMI / Management port
Up to 36 x GbE SFP or 12 x 10GbE SFP+ via 3 network blades with onboard 1 man-agement port and 1 SFP+ dedicate port
2x RJ-45 with LED for IPMI / Management port, 1x RJ45 for console port
Up to 32 x 10GbE SFP+ ports or 6 x 100GbE QSFP ports Blade 1~2: Switch Fabric Blade or Ethernet I/O BladeBlade 1~2: Switch Fabric BladeBlade 3~6: Ethernet I/O Blade
Bypass Depends on NIC module specification Depends on blade specification N/A N/A N/A N/A
ControllersIntel Ethernet controller, depends on NIC module specification
Intel 82574L & 82599ES 1 x Intel i210Broadcom® StrataDNX BCM8867x (Jericho) packet processor with 720Gbps ~1.2Tbps capacity
Depends on blade specification (HLM series) Depends on blade specification (HLM series)
NIC Module Slot / Blade 2 x NIC Module Slots 3 x Blades N/A 4 x NIM Module Slots 2 x Blades 6 x Blades
IPMI Share with Management port 1 x IPMI port 1 x IPMI port 2 x onboard IPMI ports 1 x onboard IPMI ports 1 x onboard IPMI ports
Management Port 1 x Management port 1 x Management port 1 x Management port 2 x 10G SFP+ ports 1 x Management port 1 x Management port
I/O Interface
Reset Button Yes Yes Yes Yes Yes Yes
Console 1 x RJ-45 1 x RJ-45 1 x RJ-45 1 x RJ-45 1 x RJ-45 1 x RJ-45
USB 2 x USB 2.0 1 x USB 2.0 1 x USB 3.0 2 x USB 2.0 1 x USB 2.0 1 x USB 2.0
ExpansionPCIe
1 x PCI-E*8 full height PCI-E card in the front; 1 x PCI-E*8 in the rear via riser card
N/A2* PCI-E Gen 3 x 8 Removable slots 4* PCI-E Gen 3 x 16 Removable slots
N/A N/A N/A
PCI N/A N/A N/A N/A N/A N/A
CoolingProcessor CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct CPU heatsink with fan duct
System 3 x hot-swappable cooling fans 5 x hot-swappable cooling fans per M/B 8 x hot-swappable cooling fans 4 x hot-swappable cooling fans 5 x hot-swappable cooling fans per M/B 5 x hot-swappable cooling fans per M/B