This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
TEA Systems ProductsTEA Systems Products
Critical Feature and Process Critical Feature and Process Tuning SoftwareTuning Software
Critical Feature and Process Critical Feature and Process Tuning SoftwareTuning Software
Weir PW
Weir PSFM Calibration
Weir PSFM Fixed-Focus65 Schlossburg St.Alburtis, PA 18011(+1) 610 682 4146
The Weir DM is a “stand-alone” program that can also be called from the Weir Engineering interface.
The analysis for a calibration uses the layout specified in the template.Current DM TemplatesCurrent DM Templates
Files in the data directory.
Sorted alphabetically.
Files in the data directory.
Sorted alphabetically.
Starts the calibration.Starts the calibration.
“One-Click”Analysis
• pre-selected templates in drop-down listings
• Data files, sorted and pre-selected in a drop-down listing.
2007 TEA Systems Products
8
TEA Systems
Astigmatism Trend Chart on Weir DMAstigmatism Trend Chart on Weir DMAstigmatism Trend Chart on Weir DMAstigmatism Trend Chart on Weir DM
• Astigmatism, also sensitive to lens heating, is shown to settle after the 8th wafer.
2007 TEA Systems Products
9
TEA Systems
Outline: Product FeaturesOutline: Product FeaturesOutline: Product FeaturesOutline: Product Features
• Products from TEA Systems• GeneralGeneral Product Features Product Features
– Data ImportData Import– Graphics FeaturesGraphics Features– 2D Graphics2D Graphics– 3D Graphics3D Graphics– General AnalysesGeneral Analyses– Data ToolsData Tools– Retention & ReportingRetention & Reporting
• Applications– As addressed by each product
• System Requirements• License Basis
• Products from TEA Systems• GeneralGeneral Product Features Product Features
– Data ImportData Import– Graphics FeaturesGraphics Features– 2D Graphics2D Graphics– 3D Graphics3D Graphics– General AnalysesGeneral Analyses– Data ToolsData Tools– Retention & ReportingRetention & Reporting
• Applications– As addressed by each product
• System Requirements• License Basis
2007 TEA Systems Products
10
TEA Systems
Data Import FeaturesData Import FeaturesData Import FeaturesData Import Features
• Import ANY metrology– If we don’t have the import
now, we will create it
• Focus-Exposure excel spreadsheets
• Overlay, film-thickness, profile, Cdsem, electrical test, etc.
• Open data format– Microsoft Excel Workbooks
• A unique Weir Workbook is created for each dataset
• Any number of variables• Any size dataset
• Weir imports data from any ASCII, Binary or database.
• After import, data is converted into a standard Weir format Excel Workbook.
• Workbook Stores– Intermediate analysis data,
– analysis reports,
– Graphics
– Derived datasets
• HTML delivery– Weir Worksheets can be
saved as HTM or HTML files for internet display
• Weir imports data from any ASCII, Binary or database.
• After import, data is converted into a standard Weir format Excel Workbook.
• Workbook Stores– Intermediate analysis data,
– analysis reports,
– Graphics
– Derived datasets
• HTML delivery– Weir Worksheets can be
saved as HTM or HTML files for internet display
2007 TEA Systems Products
11
TEA Systems
Graphics FeaturesGraphics FeaturesGraphics FeaturesGraphics Features
• Drill-down graphics• Any graphic:
– Easy user modification
• Mouse selected graphics– View sub-plots
– Save to spreadsheet data from sub-sections
– Cull specific data points/sites or areas of data.
• Single-click access to graphs, sub-graphics, data selection and culling.
2007 TEA Systems Products
12
TEA Systems
Viewing variations across wafer Viewing variations across wafer diameterdiameterViewing variations across wafer Viewing variations across wafer diameterdiameter
• Use mouse to drag and outline a section.
• Plot graphic by x column position
• Notice astigmatism and how it increases at wafer’s edge.
Xfocus
Yfocus and
Average
2007 TEA Systems Products
13
TEA Systems
Graph EditorGraph EditorGraph EditorGraph Editor
Graphic interface modification
Point-click adjustments
Graphs are mouse sensitive to show and highlight individual points
2007 TEA Systems Products
14
TEA Systems
2D Graphs2D Graphs2D Graphs2D Graphs
• Histograms– 1 & 2 variable
• XY Plots– Line and scatter plots– BoxPlots, Fitted Curves and notes
can be added to any plot
• BoxPlots– Can be added to ANY XY plot
• Population Density Plots• Field & Wafer Contour• Radial Variation • Range Plots• 1D and 2D Vector Plots• Variable Covariance plots• Plus all Excel –based graphics
Raw Photoresist Thickness from Ellipsometer
2007 TEA Systems Products
15
TEA Systems
3D Graphs3D Graphs3D Graphs3D Graphs
• Field 3D surface graphics• General response surface
graphics
2007 TEA Systems Products
16
TEA Systems
General AnalysesGeneral AnalysesGeneral AnalysesGeneral Analyses
• Plots and statistics– For Raw, Modeled and Residual data.
• Reticle data at true(4x) and final (1x) size– Mask Error Function (MEF) plotting– Removal of Reticle data from wafer for true process
response
• Optimum or “Best Focus”– From PSFM and other specialty reticles– From variable Feature profiles for reticle design &
• View raw, modeled and residual data• Model any wafer, field,lens, slit and scan systematic errors
– For any variable– View individual wafer, field, slit,etc modeled, residual data
• Multiple field models– Weir custom and scanner vendor emulated
• View data as astigmatic, average, max/min data variations.– Field Mean, max, minimum, MinMax, IFD, Range MEF etc.
• Stepper as well as scanner oriented models– Also hotplate, etch symmetric and asymmetric models
• Exposure Layouts– Across wafer & Lot variations for Focus, Dose, Numeric Aperture,
Partial Coherence, Scan Direction are stored with data.– Layouts can be imported from the data– Graphic, mouse-driven utility for easy manual entry of the layout– Layout library is maintained for easy updating of new datasets with a
single click of the mouse
2007 TEA Systems Products
18
TEA Systems
Data RetentionData RetentionData RetentionData Retention
• Data is imported and stored in an open format– Easily adapted to other software analyses or user analysis
using Excel – native tools
• Data is stored in the same workbook for:– Raw data– Recipe and measurement notes– Site locations– Analysis reports and graphics– All intermediate modeling surfaces– All calculated data surface
– Map wafer flatness and derive the influence of substrate films on autofocus sensitivity.
– Model lens-slit and reticle-scan static and dynamic performance signatures.
– Extract wafer-edge and edge-bead effects.
– Calculate classic lens aberrations through their influence on feature focus.
2007 TEA Systems Products
21
TEA Systems
BottomCD vs FocusBottomCD vs FocusBottomCD vs FocusBottomCD vs Focus
Up + SCAN
Down - SCAN
Scanner AScanner "B"
Isofocal region on Scanner A vs B
2007 TEA Systems Products
22
TEA Systems
Photomask Process ControlPhotomask Process ControlPhotomask Process ControlPhotomask Process Control
• Weir PW– Metrology from any data source or manual entry– Process Windows, Bossung Plots etc.– Model etch uniformity from scatterometry– Model feature profiles and etch depth
• Correlate to wafer response across the process window
– Encapsulate data • standard format for the wafer-fabrication engineer
• Provides a valuable commodity by giving the wafer engineer a reticle signature library entry for:
– Reticle design qualification– Reticle use re-validation– Wafer process setup thru reticle signature removal– Tool setup for thermal bake and exposure-tool reticle bending
• diffractive optical metrology (scatterometry) - outputs spectral intensity changes of 0th order diffracted light intensity
Weir PW Software from TEA Systems
2007 TEA Systems Products
35
TEA Systems
Metrology & Process Independent Metrology & Process Independent CharacteristicsCharacteristicsMetrology & Process Independent Metrology & Process Independent CharacteristicsCharacteristics
• Weir PW– Evaluate film thickness and feature profiles– Correlate data with outputs from Prolith, Sigma C etc.– Calculate simulator variables to improve simulations– Determine influence of the full process window on
Grating( PGM), End-of-Line, and Z-spin Reticles.– Apply reticle calibrations to whole-wafer focus uniformity
analyses.– Calculate both wafer and field tilt, bow and random errors– Calculate the effects of thermal heating during exposure– Effects of film, trench-etch, wafer and and scanner stage– Wafer edge-bead and edge-die influence– Measure wafer flatness.– Analyze ASML FOCAL focus data
• Offsets follow programmed values (above) very closely.
– -0.24 field is shown by arrow for orientation
Background focus, no offsets
2007 TEA Systems Products
47
TEA Systems
Relative Measured Field OffsetsRelative Measured Field OffsetsRelative Measured Field OffsetsRelative Measured Field Offsets
• Restricted analysis wafer diameter to 85 mm radius
• Removed mean field• Relative offsets of each field is
clearer
2007 TEA Systems Products
48
TEA Systems
Recommended System RequirementsRecommended System RequirementsRecommended System RequirementsRecommended System Requirements
• Minimum recommended system:– Windows 2000 or XP Professional– Microsoft Excel version 9 or later– Pentium IV, 1.2 Gigahertz CPU– 256 Megabytes of RAM– Monitor 1024x780
• License formats– Licenses are software locks that are keyed to the hardware upon
which it is installed.– Licenses can be input manually or delivered via email text files.– License periods can be set from 1 to 365 days or as a permanent
license– Demonstration, lease and permanent licenses are available.
• Single-user node-locked license– License is locked to a computer’s disk– Only one user, on the target computer may use the license
• Floating node license– License is locked to a computer’s disk– Any user on the network can access and use the software– Only one user at a time may use the software– Software image shuts-down after 30 minutes of non-use
• Thereby freeing the license for the next user.
2007 TEA Systems Products
50
TEA Systems
Summary of Weir PWSummary of Weir PWSummary of Weir PWSummary of Weir PW
• Any metrology data can be imported– Weir PW contains a layout optimizer and basic metrology analysis capabilities– Any user-defined variable names may be used– Data is stored in Microsoft Excel® worksheet and workbooks
• Multiple data sets can be combined and data sub-sets selected for analysis– Point-and-click mouse interaction for data viewing and culling
• Spatial analysis of variables– Provides information on variation with scan direction and film thickness variation– Point-and-click drill down capability for sub-field graphics, data viewing and analysis– Remove critical systematic components to see the true exposure performance
• Process Window analysis and more!– Extend beyond the single feature/family analysis.– Examine process window performance variation across the full field of exposure.
• Automation– Weir DM can be used to automate process-monitor points for any variable series.
2007 TEA Systems Products
51
TEA Systems
Extra Wafer Maps of 6Extra Wafer Maps of 6thth order order parameter variationparameter variation
(next section)(next section)
Extra Wafer Maps of 6Extra Wafer Maps of 6thth order order parameter variationparameter variation
(next section)(next section)
These slides illustrate the variation of measured feature size across the wafer and field. More importantly, they illustrate that feature sizes can be modeled as systematic errors across each.
Note that when these systematic errors are removed, the residuals track the variation of underlying film thickness (such as.anti-reflective coatings) and thermal-variation (Post Exposure Bake) across the wafer during processing. Slide 34 is a good example.
Weir therefore provides a direct method of measuring both feature and film-variation influence on feature size.
2007 TEA Systems Products
52
TEA Systems
PhotoresistPhotoresistPhotoresistPhotoresist
All terms 4th & 6th only Residuals to all terms
2007 TEA Systems Products
53
TEA Systems
ARCARCARCARC
Residuals to Wafer ModelMean Field Removed
Wafer Model Residuals to all Wafer Coefs
2007 TEA Systems Products
54
TEA Systems
CD 95% ThresholdCD 95% ThresholdCD 95% ThresholdCD 95% Threshold