TEA Systems Corp. Confidential LithoWorks PEB On-Wafer analysis of two wafers August 8, 2003 Thermal analysis of two PEB plates: 093-08_peb_bake7.csv 093-08_peb_bake8.csv.

TEA Systems Corp. Confidential

LithoWorks PEBLithoWorks PEBLithoWorks PEBLithoWorks PEB

On-Wafer analysis of two wafers

August 8, 2003

Thermal analysis of two PEB plates:

093-08_peb_bake7.csv

093-08_peb_bake8.csv

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PEB #7

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PEB #7 overview

• Left graphic Details location of sensor points

• Right graphic Summary of rise/fall times vs temperature

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Sensor variation from wafer mean

• Each site contains a plot of delta-temp versus time

• Area product of (degrees * seconds), summed over

all sites. This is proportional to the energy entered into the wafer during the bake.

• Area Variance Energy variation across the wafer Summed deg-sec’s over all sites reporting

total variation from mean-temperature over time.

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Corresponding points on the graph

• Moving the mouse to a point on the temp-time curve will highlight the corresponding points on the delta-temp wafer plot

(50.1 sec, 113 C)

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On-Wafer thermal loading?

• Notice how the 7 wafer-center sites are the first to rise in temperature.• Note also the two sites located over the On-Wafer sensor packed lag in heading and also lag in

cooling. This area also does not reach uniformity until the end of the heading cycle. This is most probably due to the thermal-mass loading of the sensor packet.

• The red-dot on each plot marks the same relative point on each site.

Area of sensor packet

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PEB 7; Thermal Energy Delivered

• Plot of thermal area (deg-sec) across wafer.

• Notice that there is a range of 168,714 deg-sec with the upper left of the wafer receiving the most energy

• Thermal-package sensor area is relatively cool

• No activation threshold was set for this plot

thermal sensor area

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PEB 7; Thermal Energy Delivered

• Plot of area (deg-sec) integrated over time

• Notice that there is a range of 168,174 deg-sec with the upper left of the wafer receiving the most energy

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PEB 7: Thermal Energy Variance across wafer

• Variation in energy (integrated temperature*time) delivered

• Variation is greatest at wafer’s upper left corner, least in center & right.

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Thermal Energy Variance Across Wafer - Contour

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PEB 8 Data

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Plate PEB 8, Bake Curve• Top: PEB 8

• Bottom: PEB 7

• Curves appear very similar in shape.

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PEB 8; Delta-Temperature Response

(50.1 sec , 113 C)

• Same point is marked on the time-temp curve. Distribution in upper left of wafer

is now very uniform.

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Comparison PEB 8 vs PEB 7• Time-Temp Area

Differences

• PEB 8 has a higher energy

area. Exhibits greater

excursion range and variation across the plate.

PEB 8 PEB 7

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Comparison: Delta temperature with time

• PEB 8 exhibits more variation at the bottom of the wafer.

PEB 8 PEB 7

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PEB 8; Thermal energy delivered

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Thermal Energy Delivered – Bake 8 Contour

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Comparison: Thermal Energy Delivered – PEB 8/ PEB 7

• Both wafers as plotted on the same scale.• More thermal energy delivered to PEB 7

PEB 8 PEB 7

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Thermal Energy Variation – Bake 8 Contour

• Energy delivered as a delta from the wafer average temperature.• Energy = Sum((Temperature-Activation Temp.) * DeltaTime)

DeltaTime = time interval of sample

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PEB 8: Greatest variation in thermal energy

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Comparison: Thermal Energy Variation – PEB 8/ PEB 7

• Scales vary but characteristic is same• PEB 7 has has significantly better energy uniformity

PEB 8 PEB 7

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Comparison energy variation statistics

• PEB 8 exhibits A greater mean temperature, range and variance of temperature than PEB 7

PEB 8 PEB 7

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PEB 8/ PEB 7; thermal variation

• PEB 8 and 7 variations plotted to the same scale.

PEB 8 PEB 7

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Thermal range study Bake8

• Temperature range about the average temperature of the wafer at each time-slice.

• The cycled-temperature rose a total of 98.07 degrees.

• Steady state uniformity is 0.18 degree across wafer.

• Notice that the wafer at 121 degrees (max. temp at 134 sec.) did not reach steady-state uniformity.

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Thermal range study Bake7

• Same study with PEB 7

• This study shows a red square at each transition start/stop point on the curve.

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Range Uniformity Summary

• Plots exhibit the thermal range across the wafer at each time-slice• Both plates exhibit the same steady-state thermal resolution.

Thermal range and maximum temperatures differs by approximately one degree

• Neither plate reaches steady state while at the maximum temperature.• Bake 8 has

greater across-wafer variations (9.6 v 7.0 degrees) Greater range at the final temperature (0.9 v 0.6 degree) Smoother cooling curves than 7 Near identical rise/cool thermal slopes and time at the maximum temperature compared with Bake 7

• Conclusion: Bake 8 has more thermal variation across the wafer.

Bake 8 Bake 7

Bake 8

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Thermal Uniformity at any point in time• Generate single or matrix

graphics of all of the plots.

• A “movie” video will also be added to allow you to watch wafer heating.

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Thermal changes during the up-ramp

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Feature Analysis from older data sets.

These data sets are not necessarily tied in with the peb 7&8

This is an attempt to see if there is any obvious correlation in the hopes that they may have been processed on one of the plates.

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New Hotplate Top-CD

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New hotplate, PR2 variation

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BCD Response

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TCD Old

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Old Plate, TCD residuals to wafer

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Old Plate; TCD - IFD and Mean

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Old, PR2 Wafer

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Old PR2 Wafer Resids

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PR2 IFD and Mean for each field (wafer removed)

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SWA – PR1 Old Wafer

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SWA1 Old PEB - Wafer

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PR2 – SWA Wafer model

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PR2 – SWA Wafer Resids