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TOSHIBA Bi-CMOS Digital Integrated Circuit Silicon Monolithic

TB2904HQ (o)Maximum Power 43 W BTL 4-ch Audio Power IC

The TB2904H (o) is 4-ch BTL au dio amp lifier for car a udio

applications.

This IC can generat e higher power: POU T MAX = 43 W as itincludes th e pur e complement ar y P-ch a nd N-ch DMOS outpu t

stage.

It is design ed to yield low distort ion r at io for 4-ch BTL au dio

power am plifier, built-in stan dby fun ction, m uting function, a nd

various kinds of protectors.

Additionally, Off-set det ector is bu ilt in.

Features High power outpu t

: POU T MAX (1) = 43 W (typ.)P (VCC = 14.4 V, f= 1 kHz, JE ITA max, RL= 4 )

: POU T MAX (2) = 39 W (typ.)(VCC = 13.7 V, f= 1 kHz, JE ITA max, RL= 4 )

: POU T (1) = 26 W (typ.)(VCC = 14.4 V, f= 1 kHz, THD = 10%, RL= 4 )

: POU T (2) = 23 W (typ.)(VCC = 13.2 V, f= 1 kHz, THD = 10%, RL= 4 )

Low distortion ratio: THD = 0.015% (typ.)(VCC = 13.2 V, f= 1 kHz, POU T= 5 W, RL= 4 )

Low noise: VNO = 90 Vrms (typ.)(VCC = 13.2 V, Rg = 0 , BW = 20 Hz to 20 kHz, RL= 4 )

Built-in standby switch function (pin 4)

Built-in m utin g function (pin 22)

Built-in Off-set det ection fun ction (pin 25)

Built-in various protection circuits:Therm al shu t down, overvoltage, out to GND, out to VCC , out to out sh ort, speaker burn ed

Operat ing supply volta ge: VCC (opr) = 9 t o 18 V (RL= 4 )

Note 1: Since this devices pins have a low withstanding voltage, please handle it with care.

Note 2: Install the product correctly. Otherwise, it may result in break down, damage and/or degradation to theproduct or equipment.

Note 3: These protection functions are intended to avoid some output short circuits or other abnormal conditions

temporarily. These protect functions do not warrant to prevent the IC from being damaged.

In case of the product would be operated with exceeded guaranteed operating ranges, these protection

features may not operate and some output short circuits may result in the IC being damaged.

Weight: 7.7 g (typ.)

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Block Diagram

Note: Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for

explanatory purpose.

RL

RL

RL

11

9

8

7

5

2

3

17

18

19

21

24

23

12

15

14

1 20 6

RL

IN1

IN2

IN3

IN4

13

C1

C1

C1

C1

PRE-GND

10 25 22

OUT1 (+)

PW-GND1

OUT1 ()

OUT2 (+)

PW-GND2

OUT2 ()

OUT3 (+)

PW-GND3

OUT3 ()

OUT4 (+)

PW-GND4

OUT4 ()

TAB VCC1 VCC2

C3

C4

C2

: PRE-GND

: PW-GND

STBYRIP MUTE

C5

16C6

4

OFF-SET

DET

MUTE

PLAY

5 V

R1

AC-GND

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Caution and Application Method (Description is made only on the single channel)

1. Voltage Gain Adjustment

This IC ha s no NF (negative feedback) Pins. Therefore, th e voltage gain can not be adjust ed, but it ma kes

the device a space and total costs sa ver.

The volta ge gain of am p.1 : GV1= 0d BThe volta ge gain of am p.2A, B : GV2= 20dBThe volta ge gain of BTL connection : GV (BTL)= 6dB

Ther efore, th e tota l volta ge gain is decided by expression below.

GV= GV1+ GV2+ GV (BTL)= 0 + 20 + 6 = 26dB

2. Standby SW Function (pin 4)

By mean s of cont rolling pin 4 (sta ndby pin ) to

High a nd Low, the power sup ply can be set t o ON

an d OFF. The thr eshold voltage of pin 4 is set at

about 3 VBE (typ.), and the power su pply curr ent is

about 2 A (typ.) in t he sta ndby sta te.

Control Voltage of Pin 4: VSB

Stand-by Power VSB (V)

ON OFF 0 to 1.5

OFF ON 3.5 to 6 V

When changing the time constant of pin 4, check the

pop noise.

Advantage of Standby SW

(1) Since VCC can directly be controlled to ON or OFF by the microcomputer, the switching relay can be

omitted.

(2) Since the control current is microscopic, the switching relay of small current capacity is satisfactory

for swit ching.

Amp. 1

Input

Amp. 2A

Amp. 2B

Figure 1 Block Diagram

Figure 2 With pin 4 set to High,Power is turned ON

ON

4

OFF

10 k

to BIASCUTTING CIRCUIT

2 VBE

VCC

Power

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3. Muting Function (pin 22)

Audio mut ing fun ction is en abled when p in 22 is Low. When t he t ime consta nt of the mut ing function is

determ ined by R1 and C4, it should ta ke int o account the pop noise. The pop noise, which is genera ted when

the power or mu ting function is t urn ed ON/OFF, will vary according to th e time constan t. (Refer t o Figure 4

an d Figure 5.)

The pin 22 is designed to operate off 5 V so that the outside pull-up resistor R1 is determined on the basic

of th is value:

ex) When cont rol volta ge is chan ged in t o 6 V from 5 V.

6 V/5 V 47 k= 56 k

Additionally, as t he VCC is rapidly falling, th e IC intern al low voltage mut ing operat es to elimina te t he

lar ge pop n oise ba sically.

The low volta ge mut ing circuit pull 200 A current into the IC so tha t t he effect of the intern al lowvoltage muting does not become enough if the R1 is too sma ll value.

To obtain enough operation of the internal low voltage muting, a series resistor, R1 at pin 22 should be

47 k or more.

VCC

Small current capacity switch

Battery

Stand-By VCC

From microcomputer

Battery

Stand-By

Standby Switch Method

Figure 3

Conventional Method

VCC

Large current capacity switch

Battery

VCC Frommicrocomputer

Battery

Relay

Pin 22 control voltage: VMUTE (V)

ATT VMUTE

Muteattenuation

ATT

(dB)

0120

100

80

60

40

20

0

20

0.5 1 1.5 2 2.5 3.5

VCC= 13.2 Vf = 1 kHzRL= 4 Vout= 7.75 Vrms(20dBm)

3

Figure 5 Mute Attenuation VMUTE (V)

221 k

R1

5 V

Mute ON/OFFcontrol

C4

Figure 4 Muting Function

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4. Off-set detection function

In case of Appearing outpu t offset volta ge by Genera ting a La rge Leakage Cur rent on the inpu t

Capacitor etc.

Figure 6 Application and Detection Mechanism

Vref

Elec. vol

25

5 V

L.P.F. To CPU

+

V

Offset voltage (at leak or short)

DC Voltage () Amp (at short) (RS2)

DC Voltage (+) Amp (at leak) (RS1)

VCC/2 (normal DC voltage)Leak or short

VbiasVref/2

A B

RS2

RS1

(+) Amp output

Threshold level (RS1)

VCC/2

GND

GND

t

t

GND

Voltage ofpoint (A)

Voltage of

point (B)

Threshold level (RS2)

tRS2

Figure 7 Wave Form

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5. Prevention of speaker burning accident (in case of rare short circuit of speaker)

When the direct curr ent resistan ce between OUT+ and OUT term inal becomes 1 or less and out putcurrent over 4 A flows, this IC mak es a pr otection circuit operat e an d suppr esses the curr ent int o a speaker.

This system mak es the bur ning accident of the spea ker prevent as below mechanism.

Abnormal output offset voltage (voltage between OUT+ and OUT) over 4 V is ma de by the extern alcircuit failure.(Note 1)

The speaker imepedance becomes 1 or less as it is in a r are short circuit condition.

The current m ore than 4 A flows into the speaker an d the speak er is burned.

Note 1: It is appeared by biased input DC voltage

(For example, large leakage of the input capacitor, short-circuit between copper patterns of PCB.)

Figure 8

Current into a speaker

Speaker Impedance

Less than 4A

About 1 4

Operating point of protector

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6. Pop Noise Suppression

Since the AC-GND pin (pin 16) is used as t he NF pin for a ll amps, the r atio between th e input

capacita nce (C1) an d t he AC-to-GND capacita nce (C6) should be 1:4.

Also, if the power is tu rned OFF before the C1 an d C6 bat teries h ave been completely charged, pop noise

will be generated because of the DC inpu t u nbalan ce.

To countera ct the noise, it is recomm ended th at a longer charging time be used for C2 a s well as for C1

an d C6. Note tha t th e time which audio outpu t ta kes to start will be longer, since the C2 makes t he mu ting

time (the time from when th e power is tur ned ON to when au dio output star ts) is fix.

The pop noise which is genera ted when the m uting function is tu rned ON /OFF will vary according to the

time constan t of C4.

The greater the capa citan ce, the lower th e pop noise. Note th at t he time from when th e mut e contr ol

signal is applied to C4 to when t he m uting function is t urn ed ON/OFF will be longer.

7. External Component Constants

EffectComponent

Name

Recommended

ValuePurpose Lower than recommended

value

Higher than recommended

value

Notes

C1 0.22 F To eliminate DCCut-off frequency is

increased Cut-off frequency is reduced

Pop noise is

generated whenVCC is ON

C2 10 F To reduce ripple Powering ON/OFF is fasterPowering ON/OFF takeslonger

C3 0.1 FTo providesufficientoscillation margin

Reduces noise and provides sufficient oscillation margin

C4 1 FTo reduce popnoise

High pop noise. Duration untilmuting function is turnedON/OFF is short

Low pop noise. Duration untilmuting function is turnedON/OFF is long

C5 3900 F Ripple filter Power supply ripple filtering

C6 1 F NF for all outputs Pop noise is suppressed when C1:C6 = 1:4Pop noise isgenerated when

VCC is ON

Note: If recommended value is not used.

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Offset detection

Detection threshold voltage Voff-set Rpull-up = 47 k, +V = 5.0VBased on output DC voltage

1.0 1.5 2.0 V

Test Circuit

Components in th e test circuits ar e only used to obtain an d confirm the device cha racteristics.

These components and circuits do not warra nt to prevent th e application equipment from m alfunction or failure.

RL

RL

RL

11

9

8

7

5

2

3

17

18

19

21

24

23

12

15

14

1 20 6

RL

IN1

IN2

IN3

IN4

13

C1

C1

C1

C1

PRE-GND

10 25 22

OUT1 (+)

PW-GND1

OUT1 ()

OUT2 (+)

PW-GND2

OUT2 ()

OUT3 (+)

PW-GND3

OUT3 ()

OUT4 (+)

PW-GND4

OUT4 ()

TAB VCC1 VCC2

C3

C4

C2

: PRE-GND

: PW-GND

STBYRIP MUTE

C5

16C6

0.22 F

0.22 F

1 F

3

0.22 F

10F

3900F

0.1F

1F

4

0.22 F

OFF-SET

DET

MUTE

PLAY

5 V

R1

47 k

AC-GND

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0.1 1000.001

0.3 1 300.5 103 5 50

0.01

0.1

0.003

0.005

0.03

0.05

1

0.3

0.5

10

30

100

50

3

5

VCC= 13.2 V

RL= 4

Filter

100 Hz : ~30 kHz

1kHz : 400 Hz~30 kHz

10 kHz : 400 Hz~

20 kHz : 400 Hz~

f = 100 Hz

1 kHz

10 kHz

20 kHz

Output power POUT (W)

THD POUT (ch1)

Totalharmonicdistortion

THD

(%)

Output power POUT (W) Output power POUT (W)


THD POUT (ch2)


THD

(%)

THD POUT (ch4)


THD

(%)

THD POUT (ch3)


THD

(%)

0.1 1000.001

0.3 1 300.5 103 5 50

0.01

0.1

0.003

0.005

0.03

0.05

1

0.3

0.5

10

30

100

50

3

5

VCC= 13.2 V

RL= 4

Filter

100 Hz : ~30 kHz


10 kHz : 400 Hz~

20 kHz : 400 Hz~

f = 100 Hz

1 kHz

10 kHz

20 kHz

0.1 1000.001

0.3 1 300.5 103 5 50

0.01

0.1

0.003

0.005

0.03

0.05

1

0.3

0.5

10

30

100

50

3

5

VCC= 13.2 V

RL= 4

Filter

100 Hz : ~30 kHz


10 kHz : 400 Hz~

20 kHz : 400 Hz~

f = 100 Hz

1 kHz

10 kHz

20 kHz

0.1 1000.001

0.3 1 300.5 103 5 50

0.01

0.1

0.003

0.005

0.03

0.05

1

0.3

0.5

10

30

100

50

3

5

VCC= 13.2 V

RL= 4

Filter

100 Hz : ~30 kHz


10 kHz : 400 Hz~

20 kHz : 400 Hz~

f = 100 Hz

1 kHz

10 kHz

20 kHz

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0.1 1000.001

0.3 1 300.5 103 5 50

0.01

0.1

0.003

0.005

0.03

0.05

1

0.3

0.5

10

30

100

50

3

5

VCC= 13.2 V

RL= 4

ch

f = 1 kHz

Filter

400 Hz~30 kHz

VCC= 9.0 V

13.2 V

16.0 V


THD POUT (ch1)


THD

(%)

Output power POUT (W) Output power POUT (W)


THD POUT (ch2)


THD

(%)

THD POUT (ch4)


THD

(%)

THD POUT (ch3)


THD

(%)

0.1 1000.001

0.3 1 300.5 103 5 50

0.01

0.1

0.003

0.005

0.03

0.05

1

0.3

0.5

10

30

100

50

3

5

VCC= 13.2 V

RL= 4

f = 1 kHz

Filter

400 Hz~30 kHz

VCC= 9.0 V

13.2 V

16.0 V

0.1 1000.001

0.3 1 300.5 103 5 50

0.01

0.1

0.003

0.005

0.03

0.05

1

0.3

0.5

10

30

100

50

3

5

VCC= 13.2 V

RL= 4

f = 1 kHz

Filter

400 Hz~30 kHz

VCC= 9.0 V

13.2 V

16.0 V

0.1 1000.001

0.3 1 300.5 103 5 50

0.01

0.1

0.003

0.005

0.03

0.05

1

0.3

0.5

10

30

100

50

3

5

VCC= 13.2 V

RL= 4

f = 1 kHz

Filter

400 Hz~30 kHz

VCC= 9.0 V

13.2 V

16.0 V

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VCC= 13.2 V

RL= 4

Vrip = 0.775 Vrms (0dBm)

0.10.01 10080

1 10

60

40

20

0

3ch

4ch

2ch

1ch

frequency f (Hz)

muteATT f

Muteattenuation

muteATT

(dB)

frequency f (Hz)

R.R. f

Ripplerejectionratio

R.R.

(dB)

frequency f (Hz)

GV f

Voltagegain

GV

(dB)

TotalharmonicdistortionTHD

(%)

frequency f (Hz)

THD f

VCC= 13.2 V

RL= 4

POUT= 5 W

No filter

0.10.01 1000.001

1 10

0.003

0.01

0.03

0.1

0.3

1

3

3ch

4ch

1ch

2ch

VCC= 13.2 V

RL= 4

VOUT= 0.775 Vrms (0dBm)

0.10.01 1000

1 10

10

20

30

40

1 ch ~4ch

VCC= 13.2 V

RL= 4

VOUT= 7.75 Vrms (20dBm)

10010 100 k120

1 k 10 k

100

80

60

40

20

0

1 ch ~4ch

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Outputpower

POUT

(W)

Input voltage VIN (Vrms)

VIN POUT (ch1)

Outputpower

POUT

(W)


VIN POUT (ch2)

Outputpower

POUT

(W)


VIN POUT (ch3)

Outputpower

POUT

(W)


VIN POUT (ch4)

(1)

(2)

(3)

250 1500

120

75

60

100

40

20

80

100

50 125

(1) INFINITE HEAT SINKRJC = 1C/W

(2) HEAT SINK (RHS = 3.5C/WRJC + RHS = 4.5C/W

(3) NO HEAT SINK

RJA = 39C/W

2000

00

RL=VIN= 0 V

5 10 15 20 25

40

80

120

160

Supply voltage VCC (V)

ICCQ VCC

QuiescentCurrent

ICCQ

(mA)

Ambient temperature Ta (C)

PDMAX Ta

Allowablepowerdissipation

PDMAX

(W

)

00 2 4 6 8 10

10

20

30

40

VCC= 13.2 V

RL= 4

No filter

f = 20 kHz

1 kHz10 kHz

100 Hz

00 2 4 6 8 10

10

20

30

40

VCC= 13.2 V

RL= 4

No filter

f = 20 kHz

1 kHz10 kHz

100 Hz

00 2 4 6 8 10

10

20

30

40

VCC= 13.2 V

RL= 4

No filter

f = 20 kHz

1 kHz10 kHz

100 Hz

00 2 4 6 8 10

10

20

30

40

VCC= 13.2 V

RL= 4

No filter

f = 20 kHz

1 kHz10 kHz

100 Hz

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00 5 10 15 20 30

20

40

60

80

f = 1 kHzRL= 4

4ch drive

9.0 V

13.2 V

16 V

18 V

25

VCC= 13.2 VRL= 4 VOUT= 0.775 Vrms (0dBm)RG= 620

0

8010

ch1

ch2

ch4

60

40

20

100 1 k 10 k 100 k


0

8010

ch1

ch3

ch4

60

40

20

100 1 k 10 k 100 k

Outputnoisevoltage

VNO

(Vrms)

Crosstalk

C.T.

(dB)

frequency f (Hz)

C.T. f (ch1)

Crosstalk

C.T.

(dB

)

frequency f (Hz)

C.T. f (ch2)

Crosstalk

C.T.(dB)

frequency f (Hz)

C.T. f (ch3)

Crosstalk

C.T.

(dB)

frequency f (Hz)

C.T. f (ch4)

Signal source resistance Rg ()

VNO Rg


PD POUT

Powerdissipation

PD

(W)

VCC= 13.2 VRL= 4

Filter:

20 Hz~20 kHz

10010 100 k0

1 k 10 k

100

200

300

1ch~4ch


0

8010

ch2

ch3

ch4

60

40

20

100 1 k 10 k 100 k


0

8010

ch2ch1

ch3

60

40

20

100 1 k 10 k 100 k

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Package Dimensions

Weight: 7.7 g (typ.)

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The information contained herein is subject to change without notice.

The information contained herein is presented only as a guide for the applications of our products. Noresponsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which

may result from its use. No license is granted by implication or otherwise under any patent or patent rights of

TOSHIBA or others.

TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physicalstress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of

safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of

such TOSHIBA products could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the Handling Guide for Semiconductor Devices, or TOSHIBA Semiconductor Reliability

Handbook etc..

The TOSHIBA products listed in this document are intended for usage in general electronics applications(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,

etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires

extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or

bodily injury (Unintended Usage). Unintended Usage include atomic energy control instruments, airplane orspaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,

medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this

document shall be made at the customers own risk.

The products described in this document are subject to the foreign exchange and foreign trade laws.

TOSHIBA products should not be embedded to the downstream products which are prohibited to be producedand sold, under any law and regulations.

This product generates heat during normal operation. However, substandard performance or malfunction maycause the product and its peripherals to reach abnormally high temperatures.

The product is often the final stage (the external output stage) of a circuit. Substandard performance or

malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the

product.

030619EBFRESTRICTIONS ON PRODUCT USE

About solderability, following conditions were confirmed

Solderability

(1) Use of Sn-63Pb solder Bath

solder bath temperature = 230C dipping time = 5 seconds the number of times = once use of R-type flux

(2) Use of Sn-3.0Ag-0.5Cu solder Bath

solder bath temperature = 245C dipping time = 5 seconds the number of times = once use of R-type flux

tb2904hq

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