TAS5612L-TAS5614LDDEVM (Rev. A) - Farnell element14 · 5.2 TAS5612L-TAS5614LDDVEVM PCB ... They require only a passive demodulation filter to deliver efficient high ... • Double-sided

User's GuideSLAU375A–May 2012–Revised September 2013

TAS5612L-TAS5614LDDVEVM

This user’s guide provides specifications for the evaluation module (EVM) for TAS5612L and TAS5614LDigital Input Class-D Power Stages with the TAS5558 Digital Audio Processor with PWM output fromTexas Instruments. The user’s guide also describes operation of the EVM and provides design informationincluding schematic, bill of materials, and PCB layout.

Contents1 Introduction .................................................................................................................. 3

1.1 TAS5612L-TAS5614LDDVEVM Features ...................................................................... 61.2 EVM Physical Structure ........................................................................................... 7

2 Quick Setup Guide .......................................................................................................... 82.1 Electrostatic Discharge Warning ................................................................................. 82.2 Unpacking the EVM ................................................................................................ 82.3 Power Supply Setup ............................................................................................... 82.4 Speaker Connection ............................................................................................... 92.5 Output Configuration BTL and PBTL ............................................................................ 9

3 GUI Software Installation and Startup .................................................................................. 103.1 Software Installation .............................................................................................. 103.2 Software Quick-Start Guide ..................................................................................... 103.3 Using the EVM Software ........................................................................................ 113.4 Self-Protection and Fault Reporting ............................................................................ 14

4 Related Documentation from Texas Instruments ..................................................................... 144.1 Additional Documentation ....................................................................................... 14

5 Design Information ........................................................................................................ 155.1 EVM Custom Component Vendors ............................................................................ 185.2 TAS5612L-TAS5614LDDVEVM PCB SPECIFICATION .................................................... 185.3 EVM PCB Layers ................................................................................................. 195.4 EVM and Input-USB Board 3 Schematics .................................................................... 20

List of Figures

1 TAS5612L-TAS5614LDDVEVM .......................................................................................... 42 Input-USB Board3........................................................................................................... 53 Integrated PurePath Digital Amplifier System ........................................................................... 64 Physical Structure of the TAS5612L-TAS5614LDDVEVM (Approximate Layout).................................. 75 PBTL Mode Configuration................................................................................................ 106 Main Tab.................................................................................................................... 117 Process Flow Tab ......................................................................................................... 128 Direct I2C Access .......................................................................................................... 139 Registers Tab (Selecting Biquad GUI).................................................................................. 1410 Top Composite PCB Layer............................................................................................... 1911 Bottom Composite PCB Layer........................................................................................... 1912 TAS5612L-TAS5614LDDV Evaluation Board Digital Audio Processor I/O ........................................ 2013 TAS5612L-TAS5614LDDV Evaluation Board Power Amplifier...................................................... 2114 TAS5612L-TAS5614LDDV Evaluation Board Power Supply, Status Monitors, On and Off Control ........... 2215 TAS5612L-TAS5614LDDV Evaluation Board Revision History ..................................................... 23

PurePath is a trademark of Texas Instruments.

1SLAU375A–May 2012–Revised September 2013 TAS5612L-TAS5614LDDVEVMSubmit Documentation Feedback

Copyright © 2012–2013, Texas Instruments Incorporated

http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLAU375A

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16 TAS5612L-TAS5614LDDV Evaluation Board Disclaimer ............................................................ 2417 Input - USB Board Schematic, USB Interface Reset ................................................................. 2518 Input - USB Board Schematic, SPDIF Interface....................................................................... 2619 Input - USB Board Schematic, PSIA Inputs, Data Select, and EVM Connector .................................. 2720 Input - USB Board Schematic, Power Inputs and Supplies.......................................................... 2821 Input - USB Board Schematic, Revision History ...................................................................... 2922 Input - USB Board Revision History .................................................................................... 3023 USB Board Schematic Disclaimer....................................................................................... 31

List of Tables

1 TAS5612L-TAS5614LDDVEVM Specification .......................................................................... 32 Recommended PVDD Power Supply Voltages ........................................................................ 83 Related Documentation from Texas Instruments ..................................................................... 144 Bill of Materials for TAS5614LDDVEVM ............................................................................... 16

2 TAS5612L-TAS5614LDDVEVM SLAU375A–May 2012–Revised September 2013Submit Documentation Feedback


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www.ti.com Introduction

1 IntroductionThe TAS5612L-TAS5614LDDVEVM PurePath™ EVM demonstrates the current version of TAS5612LDDVor TAS5614LDDV integrated circuit power stage with TAS5558 from Texas Instruments (TI).

The TAS5612L and TAS5614L are high-performance, integrated Stereo Feedback Digital Amplifier PowerStages designed to drive 4-Ω speakers at up to 150 W per channel for TAS5614LDDV and 125 W perchannel for TAS5612LDDV. They require only a passive demodulation filter to deliver efficient high qualityaudio amplification.

The TAS5558 is a high-performance 32-bit (24-bit input) multi channel PurePath Digital Pulse WidthModulator (PWM) with fully symmetrical AD modulation scheme. The device also has Digital AudioProcessing (DAP) that provides 48 bit signal processing, advanced performance and a high level ofsystem integration.

This EVM can be configured as 2 BTL channels for stereo evaluation or 1 PBTL (parallel BTL) channel forsubwoofer evaluation. Together with a TI Input-USB Board 3, it provides a complete stereo digital audioamplifier system which includes digital input (S/PDIF), analog inputs, interface to PC and DAP featureslike digital volume control, input and output mixers, automute, tone controls, loudness, EQ filters anddynamic range compression (DRC). There are configuration options for power stage failure protection.

NOTE: TAS5612L-TAS5614LDDVEVM is shipped with the current version of the TAS5614Linstalled. Evaluate the current version of TAS5612L by visiting the product folder atwww.ti.com and requesting a free sample. Replace the TAS5614L with the TAS5612L.

Table 1. TAS5612L-TAS5614LDDVEVM Specification

Key Parameters ValuesTAS5614L Power Supply Voltage 12–38 VdcTAS5612L Power Supply Voltage 12–34 Vdc

Number of Channels 2 × BTL or 1 × PBTLLoad Impedance BTL 4–8 Ohm

Load Impedance PBTL 2–4 OhmTAS5614L Output power BTL 150 W / 4 Ohm / 10% THD+N

TAS5614L Output power PBTL 300 W / 2 Ohm / 10% THD+NTAS5612L Output power BTL 125 W / 4 Ohm / 10% THD+N

TAS5612L Output power PBTL 250 W / 2 Ohm / 10% THD+NDynamic Range (DNR) > 105 dB

PWM Processor TAS5558Output Stage TAS5614LDDV or TAS5612LDDV

NOTE: The heatsink in TAS5612L-TAS5614LDDVEVM is designed to comply with timerequirements of the “Amplifier Rule”, US Federal Trade Commission 16 CFR 432, when theEVM is operated at power levels specified above. If continuous operation at specified outputpower is required it is necessary to provide forced air flow through the heatsink.

(The FTC regulation specifies operation in 25°C ambient temperature for one hour at 1/8specified output power (18.75W per channel for TAS5614LDDVEVM, 15.63W per channelfor TAS5612LDDVEVM) and then for 5 minutes at specified output power (150W per channelfor TAS5614LDDVEVM, 125W per channel for TAS5612LDDVEVM). Then distortion vs.output power can be measured. TAS5612L-TAS5614LDDVEVM provides specified outputpower for several minutes or more without thermal shutdown. THD is not specified for thistest but is typically near 10%.)



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√

Introduction www.ti.com

Figure 1. TAS5612L-TAS5614LDDVEVM



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Figure 2. Input-USB Board3

Gerber (layout) files are available at: http://www.ti.com.

The EVM is delivered with cables and a TI Input-USB Board 3 to connect to an input source and to a PCfor control. Refer to the section "Unpacking the EVM" below.



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I2S Bus

I2C Bus

Example:

TI Input - USB Board 3

8 ChannelAnalogInput

USBInterface

Opticaland

CoaxialS/PDIFInput

Control Interface

Power Supply

Stereo/MonoChannel

Speaker OutputTAS5612L-TAS5614LDDVEVM

Introduction www.ti.com

1.1 TAS5612L-TAS5614LDDVEVM Features• Stereo PurePath Digital evaluation module.• Self-contained protection system (overcurrent, overtemperature, undervoltage and missing PWM

input).• Standard I2S and I2C / Control connector for TI input board• Double-sided plated-through PCB layout.

Figure 3. Integrated PurePath Digital Amplifier System



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TA

S561

2L

DD

VE

VM

650

05

67

TA

S561

4L

DD

VE

VM

652

46

55

GND

PVDD

(+12 to

+36 Vdc)

+ LEFT SPEAKER OUTPUTS –

LOUT+ LOUT–

+ RIGHT SPEAKER OUTPUTS –

ROUT+ ROUT–

HEATSINK

LEFT CHANNEL

OUTPUT FILTERS

RIGHT CHANNEL

OUTPUT FILTERS

INPUT SIGNAL & CONTROLINTERFACE (J1)

TAS5558

TAS5612L

TAS5614L

MODE

PINS

S1

+3

.3V

dc

RE

GU

LA

TO

R

ResetLED

STATUSLEDs

RESET

NORMAL

PBTL – BTL


1.2 EVM Physical StructurePhysical structure of the TAS5612L-TAS5614LDDVEVM is illustrated in Figure 4.

Figure 4. Physical Structure of the TAS5612L-TAS5614LDDVEVM (Approximate Layout)



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Quick Setup Guide www.ti.com

2 Quick Setup GuideThis section describes the TAS5612L-TAS5614LDDVEVM power supplies and system interfaces. Itprovides information regarding handling and unpacking, absolute operating conditions, and switch andjumper positions. It also provides a step-by-step guide to setting up the TAS5612L-TAS5614LDDVEVM fordevice evaluation.

2.1 Electrostatic Discharge WarningMany of the components of the TAS5612L-TAS5614LDDVEVM are susceptible to damage by electrostaticdischarge (ESD). Customers are advised to observe proper ESD handling precautions when unpackingand handling the EVM, including the use of a grounded wrist strap at an approved ESD workstation.

CAUTIONFailure to observe ESD handling procedures can result in damage to EVMcomponents.

2.2 Unpacking the EVMUpon opening the TAS5612L-TAS5614LDDVEVM package, check to make sure that the following itemsare included:• 1 pc. TAS5612L-TAS5614LDDVEVM using 1 TAS5558 and 1 TAS5612LDDV or TAS5614LDDV.• 1 pc. TI Input-USB Board 3 for interfacing TAS5612L-TAS5614LDDVEVM to SPDIF/analog sources

and PC for control.• 1 pc. Signal and Control Interface IDC cable for connection to an I2S front-end like the Input-USB

Board 3.• 1 pc. cable for connecting Input-USB Board 3 to a USB port on a PC for TAS5558 control by software.• If any of these items are missing, contact the nearest Texas Instruments Product Information Center to

inquire about a replacement.

Connect the Input-USB Board 3 to the TAS5612L/14LDDVEVM using the delivered IDC cable.

2.3 Power Supply SetupTwo power supplies are needed to power the TAS5612L-TAS5614LDDVEVM. Voltage and currentrequirements for the PVDD power supply are shown in the table below. Connect this power supply to theEVM using banana cables or wires secured to the power supply binding posts PVDD and GND. A secondpower supply, 12Vdc at 500mA, is required to power Input-USB Board 3. Connect the 12V power supplyto the Input-USB Board 3 using banana cables or wires secured to the power supply binding posts +12Vand GND.

Table 2. Recommended PVDD Power Supply VoltagesDescription Voltage Range Current Requirements Binding Post

TAS5614L Power Supply Voltage 12–38 Vdc 16 A PVDDTAS5612L Power Supply Voltage 12–34 Vdc 14 A PVDD

CAUTIONNOTE: Applying voltages above specifications in Table 2 can cause permanentdamage to the hardware. Verify polarity of power supply connections beforepowering the EVM.



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www.ti.com Quick Setup Guide

NOTE: The length of the power supply cable must be minimized. Increasing length of PSU cable islikely to increase distortion for the amplifier at high output levels and low frequencies.

2.4 Speaker Connection

CAUTIONBoth positive and negative speaker outputs are floating and cannot beconnected to ground (that is, through an oscilloscope). To measure a BTLoutput connect an oscilloscope probe to each side of the output, connect bothground clips to EVM ground and use the oscilloscope math functions to showthe difference between the 2 probe signals.

2.5 Output Configuration BTL and PBTLWhen changing mode from BTL to PBTL, make sure that the AMP_RESET switch is set to RESET beforechanging shunts on Mode headers M3, D and C.

- For BTL mode place a shunt on pins 1 and 2 of each header, at the positions marked BTL.- For PBTL mode place a shunt on pins 3 and 2 of each header, at the positions marked PBTL.

In PBTL mode the load must be connected according to Figure 5:



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TA

S561

2L

DD

VE

VM

650

05

67

TA

S561

4L

DD

VE

VM

652

46

55

GND

PVDD

(+12 to

+36 Vdc)

+ LEFT SPEAKER OUTPUTS – + RIGHT SPEAKER OUTPUTS –

HEATSINK

LEFT CHANNEL

OUTPUT FILTERS

RIGHT CHANNEL

OUTPUT FILTERS

INPUT SIGNAL & CONTROL

INTERFACE (J1)

TAS5558

TAS5612L

TAS5614L

MODEPINS

S1

+3

.3V

dc

RE

GU

LA

TO

R

ResetLED

STATUSLEDs

RESET

NORMAL

PBTL – BTL

GUI Software Installation and Startup www.ti.com

Figure 5. PBTL Mode Configuration

3 GUI Software Installation and StartupThe TAS5612L-TAS5614LDDVEVM is controlled by the Input-USB Board 3 the PurePath Console GUIand TAS5612 plug-in. The TAS5612 GUI provides control of all registers in the TAS5558. Connect theUSB cable between the host PC and jack USB-IN on the Input-USB Board 3. Then turn on the 12-V powersupply and the PVDD power supply in that order.

3.1 Software InstallationDownload the PurePath Console GUI from the TI Web site (http://cc.ext.ti.com). The TI Web site alwayshas the latest release and any updates to versions of the GUI. A request must be submitted to downloadthe software.

Execute the GUI install program, setup_PurePathConsole_Main_vxx_revxx.exe. Once the program isinstalled, the program group and shortcut icon is created in Start → Program → Texas Instruments Inc →PurePathConsole → Choose Target. When the GUI comes up, select TAS5612.

3.2 Software Quick-Start GuideThe EVM is initialized upon PurePath Console GUI startup. Audio is streaming to the headphones ifWindow Media (or similar program) is playing and mini-USB EVM is selected in the sound playbackproperties. The following indicators show both PurePath Console GUI and EVM are operating correctly:



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www.ti.com GUI Software Installation and Startup

• On the EVM, the VALID LED (green) is on• On the PurePath Console GUI, both green LEDs on the bottom left corner are on

3.3 Using the EVM Software

3.3.1 Main TabFigure 6 illustrates the main tab when the GUI starts up. Clicking the TAS5612 icon directs you to thedevice block diagram.

Figure 6. Main Tab



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GUI Software Installation and Startup www.ti.com

3.3.2 Block Diagram TabThis tab shows major blocks of the device. To control the device, click on the digital audio processor(DAP) bringing up the TAS5558 process flow tab.

3.3.3 Process Flow TabThe process flow tab, Figure 7,controls the TAS5558 main functions: EQ, DRC, input and output mixing,tone, and volume.

Figure 7. Process Flow Tab



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www.ti.com GUI Software Installation and Startup

3.3.4 Direct I2C Access TabReading and writing I2C registers is performed on the tab illustrated in Figure 8.

Figure 8. Direct I2C Access

3.3.5 TAS5558 Registers TabThe TAS5558 registers tab, illustrated in Figure 9, shows the current I2C register values (hexadecimal anddecimal).



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Related Documentation from Texas Instruments www.ti.com

Figure 9. Registers Tab (Selecting Biquad GUI)

3.4 Self-Protection and Fault ReportingThe TAS5612L and TAS5614L are self-protecting devices that provide overtemperature, overcurrent,undervoltage and missing-PWM-input protection, with extensive fault reporting. For full descriptions ofthese functions consult data sheet SLAS847 for TAS5612LA and data sheet SLAS846 for TAS5614LA.

4 Related Documentation from Texas InstrumentsThe following table lists data sheets that provide detailed descriptions of integrated circuits from TI that areused in the TAS5612L-TAS5614LDDVEVM. These data sheets can be obtained at http://www.ti.com.

Table 3. Related Documentation from Texas Instruments

Part Number Literature NumberTAS5558 SLES273

TAS5612LA SLAS847TAS5614LA SLAS846TPS3825-33 SLVS165

TLV1117-33C SLVS561

4.1 Additional Documentation1. System Design Considerations for True Digital Audio Power Amplifiers (SLAA117)2. Digital Audio Measurements (SLAA114)3. PSRR for PurePath Digital Audio Amplifiers (SLEA049)



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http://www.ti.com/lit/pdf/SLES273

http://www.ti.com/lit/pdf/SLAS847

http://www.ti.com/lit/pdf/SLAS846

http://www.ti.com/lit/pdf/SLVS165

http://www.ti.com/lit/pdf/SLVS561

http://www.ti.com/lit/pdf/SLAA117

http://www.ti.com/lit/pdf/SLAA114

http://www.ti.com/lit/pdf/SLEA049


www.ti.com Design Information

4. Power Rating in Audio Amplifier (SLEA047)5. PurePath Digital AM Interference Avoidance (SLEA040)6. Click & Pop Measurements Technique (SLEA044)7. Power Supply Recommendations for DVD-Receivers (SLEA027)8. Implementation of Power Supply Volume Control (SLEA038)

5 Design InformationThis appendix includes design information for the TAS5612L-TAS5614LDDVEVM. This information ispresented in the following order.• Table 4 Bill of Materials for TAS5614LDDVEVM• Section 5.1 EVM Custom Component Vendors• Section 5.2 TAS5612L-TAS5614LDDVEVM PCB SPECIFICATION• Section 5.3 EVM PCB Layers• Section 5.4 EVM and Input-USB Board 3 Schematics



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Design Information www.ti.com

Table 4. Bill of Materials for TAS5614LDDVEVMManu Part No. Qty. Ref Des Vendor Part No. Description Vendor Manu.

TI-SEMICONDUCTORS

TAS5614LDDV 1 U1 TAS5614LDDV 150W-STEREO/300W-MONO PUREPATH DIGITAL AMP HTSSOP44- Texas Instruments Texas InstrumentsDDV ROHS

TAS5558 1 U2 TAS5558 8 CHANNEL HD COMPATIBLE AUDIO PROCESSOR TAS5558-DGG Texas Instruments Texas InstrumentsROHS

TPS3825-33DBVT 1 U3 296-2636-1 PROCESSOR SUPERVISORY CIRCUITS 2.93V 200ms SOT23-DBV5 Digi-Key Texas InstrumentsROHS

TLV1117-33CDCYR 1 VR1 296-21112-1-ND VOLT REG LDO 3.3V 800mA SOT223-DCY ROHS Digi-Key Texas Instruments

SEMICONDUCTORS

2N7002 4 Q1, Q2, Q3, Q4 2N7002NCT N-FET 60V 115mA 200mW 7.5 OHM@10V SOT23-DBV3 ROHS Digi-Key Fairchild

SML-LXT0805SRW-TR 3 125C, FAULT, 67-1555-1 LED, RED 2.0V SMD0805 ROHS Digi-Key Lumex OptoAMP_RESET

SML-LXT0805YW-TR 1 CLIP 67-1554-1 LED, YELLOW 2.0V SMD0805 ROHS Digi-Key Lumex Opto

CAPACITORS

C1206C102K1RACTU 4 C21, C24, C27, C30 399-1222-1 CAP SMD1206 CERM 1000PFD 100V 1% C0G ROHS Digi-Key Kemet

GRM188R71H472KA01D 2 C54, C55 490-1506-1 CAP SMD0603 CERM 4700PFD 50V 10% X7R ROHS Digi-Key Murata

GRM21BR72A103KA01L 5 C22, C25, C28, C31, C70 490-1652-1 CAP SMD0805 CERM 0.01UFD 100V 10% X7R ROHS Digi-Key Murata

GRM188R71H333KA61D 4 C16, C17, C18, C19 490-3286-1-ND CAP SMD0603 CERM 0.033UFD 50V 10% X7R ROHS Digi-Key Murata

GRM188R71C473KA01D 2 C56, C57 490-1529-1 CAP SMD0603 CERM 0.047UFD 16V 10% ROHS Digi-Key Murata

GRM188R71C104KA01D 17 C2, C3, C4, C7, C32, C50, 490-1532-1-ND CAP SMD0603 CERM 0.1UFD 16V 10% X7R ROHS Digi-Key MurataC52, C53, C59, C60, C62,C63, C64, C65, C74, C76,C77

MKP4 -.68/250/20 4 C20, C23, C26, C29 MKP4 -0.68/250/20 CAP POLYPRO FILM MKP4 0.68UFD 250V 20% ROHS WIMA WIMA

C1608X7R1C105K 2 C5, C6 445-1604-1 CAP SMD0603 CERM 1.0UFD 16V 10% X7R ROHS Digi-Key TDK

GRM21BR71H105KA12L 5 C8, C9, C10, C11, C71 490-4736-1-ND CAP SMD0805 CERM 1.0UFD 50V 10% X7R ROHS Digi-Key Murata

GRM21BR61C106KE15L 3 C58, C61, C66 490-3886-1 CAP SMD0805 CERM 10UFD 16V 10% X5R ROHS Digi-Key Murata

CAPACITORS

EEU-FC1C470 4 C1, C51, C73, C75 P11196 CAP 47UFD 16V RAD ALUM ELEC FC ROHS Digi-Key Panasonic

UKZ1H470MPM 1 C72 493-3194 CAP ALUM ELEC KZ RADIAL 47UFD 50V 20% ROHS Digi-Key Nichicon

EEU-FC1H102 2 C12, C14 P10333-ND CAP ALUM ELEC FC RADIAL 1000UFD 50V 20% ROHS Digi-Key Panasonic

RESISTORS

RMCF0402ZT0R00 2 R12, R13 RMCF0402ZT0R00CT ZERO OHM JUMPER SMT 0402 0 OHM 1/16W,5% ROHS Digi-Key Stackpole Electronics

ERJ-3GEY0R00V 1 R51 P0.0GCT RESISTOR SMD0603 0.0 OHM 5% THICK FILM 1/10W ROHS Digi-Key Panasonic

ERJ-3GEYJ1R0V 1 R50 P1.0GCT RESISTOR SMD0603 1.0 OHMS 1% THICK FILM 1/10W ROHS Digi-Key Panasonic

ERJ-3GEYJ3R3V 8 R1, R7, R8, R9, R10, R11, P3.3GCT RESISTOR SMD0603 3.3 OHMS 5% 1/10W ROHS Digi-Key PanasonicR14, R60

ERJ-3GEYJ470V 19 R27, R28, R29, R30, R31, P47GCT RESISTOR SMD0603 47 OHMS 5% 1/10W ROHS Digi-Key PanasonicR32, R33, R34, R35, R36,R37, R38, R39, R40, R54,R55, R56, R57, R58

CRCW0603100RFKEA 3 R4, R5, R6 541-100HCT RESISTOR SMD0603 100 OHM 1/10W 1% ROHS Digi-Key Vishay

ERJ-3GEYJ471V 2 R48, R49 P470GCT RESISTOR SMD0603 470 OHMS 5% 1/10W ROHS Digi-Key Panasonic

ERJ-3GEYJ472V 4 R61, R62, R63, R65 P4.7KGCT RESISTOR SMD0603 4.7K OHMS 5% 1/10W ROHS Digi-Key Panasonic



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Table 4. Bill of Materials for TAS5614LDDVEVM (continued)Manu Part No. Qty. Ref Des Vendor Part No. Description Vendor Manu.

ERJ-3EKF1002V 14 R20, R21, R22, R23, R24, P10.0KHCT RESISTOR SMD0603 10.0K 1% THICK FILM 1/10W ROHS Digi-Key PanasonicR25, R26, R41, R42, R43,R44, R45, R46, R47

RMCF0603FT15K0 1 R52 RMCF0603FT15K0CT RESISTOR SMD0603 15.0K OHMS 1% 1/10W ROHS Digi-Key Stackpole Electronics

RC0603FR-0718KL 1 R53 311-18.0KHRCT RESISTOR SMD0603 THICK FILM 18.0K OHMS 1% 1/10W ROHS Digi-Key Yageo

RC0603FR-0730KL 1 R2 311-30.0KHRCT RESISTOR SMD0603 THICK FILM 30.0K 1% 1/10W ROHS Digi-Key Yageo

ERJ-3GEYJ473V 1 R3 P47KGCT RESISTOR SMD0603 47K OHMS 5% 1/10W ROHS Digi-Key Panasonic

INDUCTORS

MA5172-AE 4 L1, L2, L3, L4 MA5172-AE SHIELDED POWER INDUCTOR 10uH 10A ROHS Coil Craft Coil Craft

HEADERS

N2526-6002-RB 1 J1 MHC26K-ND HEADER SHROUDED 100LS MALE GOLD 2X13 PINS ROHS Digi-Key 3M

PBC02SAAN 1 JP1 S1011E-02-ND HEADER THRU MALE 2 PIN 100LS GOLD ROHS Digi-Key Sullins

PBC03SAAN 3 C, D, M3 S1011E-03-ND HEADER THRU MALE 3 PIN 100LS GOLD ROHS Digi-Key Sullins

TESTPOINTS AND SWITCHES

5003 1 ET2 5003K PC TESTPOINT, ORANGE, ROHS Digi-Key Keystone Electronics

G12AP-RO 1 S1 360-1758 SWITCH THRU SPDT STRAIGHT ULTRA MINIATURE ROHS Digi-Key NKK

BINDING POSTS

5018-0 3 GND, LOUT-, ROUT- 565-5018-0 BINDING POST, BLACK 60V 30A GOLD ROHS Mouser Pomona

5018-2 3 PVDD, LOUT+, ROUT+ 565-5018-2 BINDING POST, RED 60V 30A GOLD ROHS Mouser Pomona

SHUNTS

SPC02SYAN 4 JP1, C(1-2), S9001 SHUNT, BLACK AU FLASH 0.100LS Digi-Key SullinsD(1-2), M3(1-2)

HEAT SINKS AND HARDWARE

ATSTI1OP-563-C1-R0 1 HS1 ATSTI1OP-563-C1-R0 HEATSINK ALUMINUM ATS 36x54mm 36.8mm PITCH ROHS ATS ATS

92000A118 2 HS1 92000A118 PHILIPS PANHEAD SCREW M3x8mm STAINLESS STEEL ROHS McMaster- Carr McMaster- Carr

92148A150 2 HS1 92148A150 SPLIT WASHER M3 STAINLESS STEEL ROHS McMaster- Carr McMaster- Carr

STANDOFFS AND HARDWARE

94868A178 4 NA 94868A178 STANDOFF M3x25mm 4.5mm DIA HEX STAINLESS STEEL F-F McMaster- Carr McMaster- CarrROHS

92000A118 4 NA 92000A118 PHILIPS PANHEAD SCREW M3x8mm STAINLESS STEEL ROHS McMaster- Carr McMaster- Carr

92148A150 4 NA 92148A150 SPLIT WASHER M3 STAINLESS STEEL ROHS McMaster- Carr McMaster- Carr

Component Count: 163

COMPONENTS NOT ASSEMBLED

CR1, CR2, CR3, CR4, L+, L-, OA, OB, OC, OD, R+, R-, PVDD_AB, PVDD_CD, M1, M2, GNDx2, PSVC



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5.1 EVM Custom Component VendorsTAS5612LDDVEVM and TAS5614LDDVEVM include inductors and heatsinks from 2 custom componentvendors designed specifically for the EVMs. These vendors carry stock for small orders on their shelves.

Advanced Thermal Solutions (ATS), in Norwood, MA, USA, provide a heatsink optimized for these EVMs,ATS-TI1OP-563-C1. Information on this heatsink can be obtained from Leonard Alter at [email protected] design and manufacture a large line of off-the-shelf and patented high performance heatsinks. Theyalso design and manufacture research quality thermal test and measurement equipment and offer thermalevaluation and design services. Information about their products and services is available atwww.qats.com.

Coilcraft, in Cary, IL, USA, provide a 10µH inductor optimized for these EVMs, MA5172-AE. Informationon this component can be found in the data sheet for the MA5172 inductor family at www.coilcraft.com.Coilcraft make a variety of other inductors for Class D amplifiers, most of which are AEC-Q200 Grade 1certified for automotive applications. Free evaluation samples and on-line ordering are available atwww.coilcraft.com.

5.2 TAS5612L-TAS5614LDDVEVM PCB SPECIFICATION

PCB IDENTIFICATION: TAS5612L-TAS5614LDDVEVM_RevAPCB TYPE: DOUBLE-SIDED PLATED-THROUGHPCB SIZE: 142 x 96 mmLAMINATE TYPE: FR4LAMINATE THICKNESS: 1.6mmCOPPER THICKNESS: 70 μm (2 ounce) (INCLUDING PLATING EXTERIOR LAYER)COPPER PLATING IN HOLES: 70 μm (2 ounce)MINIMUM HOLE DIAMETER: 0.3 mm (12 mils)SILKSCREEN: WHITE - REMOVE SILKSCREEN FROM SOLDER & PRE-TINNED

AREASSOLDER MASK: BLUEAPPROX. HOLE COUNT: 570PROTECTIVE COATING: ENIG (ELECTROLESS NICKEL / IMMERSION GOLD)ELECTRICAL TEST: PCB MUST BE ELECTRICAL TESTEDCOMMENTS: FAB NOTES ARE IN THE DRILL DRAWING FILE



http://www.ti.com

http://[email protected]

http://www.qats.com

http://www.coilcraft.com

http://www.coilcraft.com



5.3 EVM PCB Layers

Figure 10. Top Composite PCB Layer

Figure 11. Bottom Composite PCB Layer



http://www.ti.com


PWM_P_2

PWM_M_2

PWM_P_1

PWM_M_1

INPUT_A

INPUT_C

INPUT_D

INPUT_B

VALID

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

J1

10.0K0603

R41

GND

470603

R27

10.0K0603

R20

10.0K0603

R21

10.0K0603

R22

10.0K0603

R23

10.0K0603

R24

10.0K0603

R25

10.0K0603

R26

470603

R28

470603

R29

470603

R30

470603

R33

470603

R35

470603

R38

470603

R39

470603

R40

47ufd/16VFC

C51+

0.1ufd/16V0603 X7R

C52

GND

0.1ufd/16V0603 X7R

C53

GNDGND

10.0K0603

R4210.0K0603

R4310.0K0603

R4410.0K0603

R4510.0K0603

R4610.0K0603

R47

GND

470603

R37

470603

R36

470603

R34

200msSOT23-DBV5

U3

TPS3825-33DBVT

5

4

32

1

GND

470603

R31

470603

R32

0.1ufd/16V0603 X7R

C50

GND

0.1ufd/16V0603 X7R

C59

0.00603

R51

18.0K0603

R53

4700pfd/50V0603 X7R

C54

4700603

R48

0.047ufd/16V0603 X7R

C56

4700pfd/50V0603 X7R

C55

4700603

R49

0.047ufd/16V0603 X7R

C57

GND

GND

GND

10ufd/16V0805 X7R

C61

0.1ufd/16V0603 X7R

C62

0.1ufd/16V0603 X7R

C63

GND

GND GND

0.1ufd/16V0603 X7R

C65

GND

10ufd/16V0805 X7R

C66

GND

120TAIL100LS

PSVC1

2

0.1ufd/16V0603 X7R

C60

GND

10ufd/16V0805 X7R

C58

TSSOP56-DGG

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28 29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

U2

TAS5558DGG

GND 15.0K0603

R52

1.00603

R50

GND

0.1ufd/16V0603 X7R

C64

GNDOrange

ET2

470603

R56

470603

R54

470603

R55

470603

R57

120TAIL100LS

JP1

0.1ufd/16V0603 X7R

C32

GND

470603

R58

+12V

+3.3V

+3.3V

+5V

AVDD

AVSS

+3.3V

+3.3V

+3.3V

+3.3V

STEPHEN CRUMP TAS5612L-6500567 / TAS5614L-6524655

MARCH 7, 2012

TAS5612L-TAS5614LDDVEVM_RevA.sbk LDN

5

A

A

TI DESIGN LEAD

PAGE INFO:

FILENAME

DATE

DRAWN BY

SHEET

PCB REV

SCH REV

OF

EDGE #

DNP

TAS5612LDDV/TAS5614LDDV EVALUATION BOARD

1DIGITAL AUDIO PROCESSOR I/O

TO

TAS5612L

TAS5614L

A842

INPUT-USB

BOARD 2


5.4 EVM and Input-USB Board 3 SchematicsThe EVM and Input-USB Board 3 schematics are illustrated in Figure 12 through Figure 22.

Figure 12. TAS5612L-TAS5614LDDV Evaluation Board Digital Audio Processor I/O



http://www.ti.com


INPUT_D

INPUT_C

OUT_B

OUT_C

OUT_A

OUT_D

OUT_D

OUT_C

OUT_A

OUT_B

INPUT_B

INPUT_AGND

1000pfd/100V1206 COG

C21

GND

0.68ufd/250VMKP4-15

C20

GND

GND

1000pfd/100V1206 COG

C24

GND

0.68ufd/250VMKP4-15

C23

GND

GND

1000pfd/100V1206 COG

C27

GND

0.68ufd/250VMKP4-15

C26

GND

GND

1000pfd/100V1206 COG

C30

GND

0.68ufd/250VMKP4-15

C29

GND

Red

LOUT+

Black

LOUT-

Red

ROUT+

Black

ROUT-

1000ufd/50VFC

C12+

GND

1.0ufd/50V0805 X7R

C8

1.0ufd/50V0805 X7R

C9

0.033ufd/50V0603 X7R

C17

10uH/10A

MA5172-AE

L121

0.033ufd/50V0603 X7R

C16

10uH/10A

MA5172-AE

1 2

L2

10uH/10A

MA5172-AE

L321

1000ufd/50VFC

C14+

GND

1.0ufd/50V0805 X7R

C10

0.033ufd/50V0603 X7R

C18

0.033ufd/50V0603 X7R

C19

GND

10uH/10A

MA5172-AE

1 2

L4

1.0ufd/50V0805 X7R

C11

0.1ufd/16V0603 X7R

C7

GND

GND

47K0603

R3

GND

GND

GNDGND

PVDD_AB

GND

GND

60V/790mV@3ASMC

30BQ060CR1

GND

60V/790mV@3ASMC

CR230BQ060

GND

60V/790mV@3ASMC

CR330BQ060

GND

60V/790mV@3ASMC

30BQ060CR4

GND

OA

OB

OC

OD

PVDD_CD

L-

L+

R-

R+

100 0603

R5100 0603

R4

100 0603

R6

GND 30.0K0603

R2

0.1ufd/16V0603 X7R

C4

1.0ufd/16V0603 X7R

C5

GND

1.0ufd/16V0603 X7R

C6

GND

120TAIL100LS

C1

2

3

120TAIL100LS

D

3

2

1

GND

M1

M2

120TAIL100LS

M31

2

3

0.0 0402

R12

0.0 0402

R13GND

0.01ufd/100V0805 X7R

C22

0.01ufd/100V0805 X7R

C25

3.30603

R8

3.30603

R9

3.30603

R10

3.30603

R11

0.01ufd/100V0805 X7R

C28

0.01ufd/100V0805 X7R

C31

3.30603

R1

0.1ufd/16V0603 X7R

C3

0.1ufd/16V0603 X7R

C2

GND

3.30603

R14

GND

3.30603

R7

47ufd/16VFC

C1+

GND

HS112

GND

PVDD

PVDD

+12V

+3.3V

+3.3V

+12V

+12V

+12V


MARCH 7, 2012

TAS5612L-TAS5614LDDVEVM_RevA.sbk LDN

5

A

A

TI DESIGN LEAD

PAGE INFO:

FILENAME

DATE

DRAWN BY

SHEET

PCB REV

SCH REV

OF

EDGE #

HTSSOP44-DDVTAS5612LDDV/TAS5614LDDV

16

18

20

U144

43

42

38

35

32

31

24

23

19

17

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

21

22

25

26

27

28

29

30

33

34

36

37

39

40

41

1-2 = BTL2-3 = PBTL

1. MOUNT CR1-CR42. CHANGE ROC = 22K Ohms (R2)

3 OHM LOAD OPERATION:

FROMMODULATOR

2POWER AMPLIFIER

RIGHTOutput

LEFTOutput


TOSTATUS

MONITOR

FROM ON/RESETCONTROL

1-2 = BTL2-3 = PBTL

GNDGND


Figure 13. TAS5612L-TAS5614LDDV Evaluation Board Power Amplifier



http://www.ti.com


VALID

GND

4.7K0603

R63

GND

Red/2,0V0805

FAULT

GND

4.7K0603

R62

GND

Yellow/2,0V0805

CLIP

Red

PVDD

Black

GND

GND

1.0ufd/50V0805 X7R

C71

GND

GND

47ufd/50VKZ

C72+

GND

0.1ufd/16V0603 X7R

C74

0.1ufd/16V0603 X7R

C76

GND GND GND GND

0.1ufd/16V0603 X7R

C77

GND

GND

60V/115mA

SOT23-DBV3

2N7002Q2

SG

D

60V/115mA

SOT23-DBV3

2N7002Q3

SG

D

GND

4.7K0603

R61

GND

60V/115mA

SOT23-DBV3

2N7002Q1

SG

D

47ufd/16VFC

C73+

GND

3.3V 800mA

SOT223-DCY

VR1

1

23TLV1117-33

GND

VIN VOUT

Red/2,0V0805

125C

47ufd/16VM

C75+

GND

4.7K0603

R65

GND

Red/2,0V0805

AMP_RESET

60V/115mA

SOT23-DBV3

Q42N7002

SG

D

G12AP3

2

1 S1

3.30603

R60

0.01ufd/100V0805 X7R

C70

+12V+12V

PVDD

+3.3V

+5V

+12V +12V


MARCH 7, 2012

TAS5612L-TAS5614LDDVEVM_RevA.sbk

A

A

5

LDNTI DESIGN LEAD

PAGE INFO:

FILENAME

DATE

DRAWN BY

SHEET

PCB REV

SCH REV

OF

EDGE #

GND

M3x25

M3M3x8

GND

M3x25

GND

M3x25

GND

M3x25

M3 M3 M3

M3 M3

M3x8 M3x8 M3x8

M3x8 M3x8

AMP

RESET

ONRESET

1-2/6-53-2/4-5

S3 SETTINGS

TO U1

FROM

MODULATOR

5V TO 3.3V DC-DC CONVERTERMAIN POWER IN

PVDD RANGE= xxV-38V

ON/RESET CONTROL

STATUS

MONITORS

CLIP FAULT

POWER SUPPLY, STATUS MONITORS, ON/OFF CONTROL 3


FROM U1

OTW

HARDWARE

STANDOFFS WASHERS SCREWS

HEAT

SINK

STAND

OFFS


Figure 14. TAS5612L-TAS5614LDDV Evaluation Board Power Supply, Status Monitors, On and Off Control



http://www.ti.com


LDN

5

A

A

TAS5612L-TAS5614LDDVEVM_RevA.sbkTAS5612L-6500567 / TAS5614L-6524655STEPHEN CRUMP

MARCH 7, 2012

EDGE #

OF

SCH REV

PCB REV

SHEET

DRAWN BY

DATE

FILENAME

PAGE INFO:

DESIGN LEADTI


4REVISION HISTORY

REVISION HISTORY

REVISION DESCRIPTION DATE APPROVAL

A INITIAL RELEASE MARCH 7, 2012 SC


Figure 15. TAS5612L-TAS5614LDDV Evaluation Board Revision History



http://www.ti.com


(a) modify the Materials (including any associated warranties, conditions, limitations ornotices) or use them for any commercial purpose, or any public display, performance, sale orrental;(b) decompile, reverse engineer, or disassemble software Materials except and only to theextent permitted by applicable law;(c) remove any copyright or other proprietary notices from the Materials;(d) transfer the Materials to another person. You agree to prevent any unauthorized copyingof the Materials. TI may terminate this license at any time if you are in breach of the termsof this Agreement. Upon termination, you will immediatelydestroy the Materials.

TEXAS INSTRUMENTS DISCLAIMER

TI

7.) Resale of TI's products or services with statements different from or beyond the parameters stated by TI for that product or service in official TI data books or data sheetsvoids all express and any implied warranties for the associated TI product or service, and is an unfair and deceptive businesspractice, and TI is not responsible for any such use.

6.) Performance tests and ratings, to the extent referenced in the Materials, are measured using specific computer systems and/or components and reflect the approximateperformance of TI products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers shouldconsult other sources of information to evaluate the performance of systems or components they are considering purchasing.

5.) No license is granted under any patent right or other intellectual property right of TI covering or relating to any combination, machine, or process in which such TI products orservices might be or are used. Except as expressly provided herein, TI and its suppliers do not grant any express or implied right to you under any patents, copyrights,trademarks, or trade secret information.

4.) TI currently deals with various customers for products, and therefore our arrangement with the user will not be exclusive. TI makes no representations regarding thecommercial availability of non-TI components that may be referenced in the Materials.

The information and materials ("Materials") provided here are provided by Texas Instruments Incorporated ("TI") as a service toits customers and/or suppliers,and may be used for informational purposes only, and only subject to the following terms. By downloading or viewing these Materials, you are signifying your assent to these terms.

1.) These preliminary evaluation schematics are intended for use for PRELIMINARY ENGINEERING DEVELOPMENT AND EVALUATION PURPOSES ONLY and are not considered byTexas Instruments to be fit as a basis for establishing production products or systems. This information may be incomplete in several respects, including but not limited to informationrelating to required design, marketing, and/or manufacturing-related protective considerations and product safety measures typically found in the end-product incorporating the goods.

2.) Accordingly, neither TI nor its suppliers warrant the accuracy or completeness of the information, text, graphics, links orother items contained within the Materials. TI may makechanges to the Materials, or to the products described therein, at any time without notice. TI makes no commitment to update the Materials.

3.) TI assumes no liability for applications assistance, customer product design, software performance, or services that may be described or referenced in the Materials. The userassumes all responsibility and liability for proper and safe design and handling of goods. Accordingly, the user indemnifies TI from all claims arising from its use of the Materials.

8.) The Materials are copyrighted and any unauthorized use may violate copyright, trademark, and other laws. You may only download one copy for your internal use only,unless you are specifically licensed to do otherwise by TI in writing. This is a license, not a transfer of title, and is subject to the following restrictions: You may not:

9.) THE MATERIALS ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED WARRANTY OF ANY KINDINCLUDING WARRANTIES OF MERCHANTABILITY, NONINF RINGEMENT OF INTELLECTUAL PROPERTY, ORFITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT SHALL TI OR ITS SUPPLIERS BE LIABLE FOR ANYDAMAGES WHATSOEVER (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESSINTERRUPTION, LOSS OF INFORMATION) ARISING OUT OF THE USE OF OR INABILITY TO USE THEMATERIALS, EVEN IF TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.


Figure 16. TAS5612L-TAS5614LDDV Evaluation Board Disclaimer



http://www.ti.com


SDA-USB

SCL

SDA

SCL-USB

MCLK-USB

SDOUT-USB

SCLK-USB

LRCLK-USB

SDIN47pfd/50V0603

C105

47pfd/50V0603

C106

600 Ohms/2A

0805

FB1

27.40603

R104

27.40603

R105

27pfd/50V0603

C101

27pfd/50V0603

C102

100pfd/50V0603

C103

1000pfd/50V0603

C104

3.09K0603

R106

4.99K0603

R110

4.99K0603

R111

A0 2

1

0.1ufd/16V0603

C100

0.1ufd/16V0603

C116

0.1ufd/16V0603

C117

0.1ufd/16V0603

C118

0.1ufd/16V0603

C119

470603

R112

470603

R113

+3.3V-USB

+3.3V-USB

+3.3V-USB

+3.3V-USB

+3.3V-USB

+3.3V-USB

+3.3V-USB+3.3V-USB

+3.3V-USB

1.0ufd/25V0603

C109600 Ohms/2A

0805

FB2

10ufd/10V0805

C107

0.1ufd/16V0603

C108

S3

+3.3V-USB

S4

S5

0.1ufd/16V0603

C113

0.1ufd/16V0603

C114

0.1ufd/16V0603

C115

0.1ufd/16V0603

C112

15.0K0603

R102

1.50K0603

R103

USB MINIB

1

2

3

4

5

6

7

8

9

10

11

USB-IN

NC

NC

Case

Case

Case

Case

Data+

GND

ID_NC

5v

Data-

TQFP48-PFB

TAS1020BPFB

U6

47 46

3

48

1

2

45 44 43

5

6

7

9

10

11

12

4142

33

16

28

4

8

21

40 39 38 37

36

35

34

32

23 24

25

26

27

29

30

31

13 14 15 17 18 19 20 22

3.3V/400mASOT230DBV5

VR1

TPS73633DBVT

5

43

2

1

64KSOP8-D(SOIC)

EPROM8

7

6

54

3

2

1

GND

SOT23-DBV5

AND1

74LVC1G08

3

5

4

2

1

B

VCC

YGND

A

200msSOT23-DBV5

1

2 3

4

5

TPS3825-33DBV

U1

GND

4.99K0603

R108

S1

GND

GND0.1ufd/16V

0603

C122

Orange

RESET

GND GND GND

GND

GND

GND

GND

GNDGNDGNDGND

GND GND GND GND

GND

GND

GND

GND

GND GND GND

GND GND

GND

+3.3V-USBGND

1

2 WE

GND

A

A

7

LDNInputUsbBoard3.sbk

JULY 12, 2011

6527708TUAN LUU EDGE #

OF

SCH REV

PCB REV

SHEET

DRAWN BY

DATE

FILENAME

PAGE INFO:

DESIGN LEADTI

0.1ufd/16V0603

C123

GND

40V,1ASOT23-DBV3MMBT2222AQ1

4.7 1/4W0805

R10

10ufd/10V0805

C120

GND

0.1ufd/16V0603

C121

GND

+3.3V-USB

10ufd/10V0805

C110

GND

0.1ufd/16V0603

C111

GND

OrangeMCLK1

OrangeSCLK1

OrangeLRCLK1

OrangeDOUT1

+3.3VD

Yellow0805

I2C

SOT23-DBV3

Q34.7K

C

B

E

GND

3570603

R404

+3.3VD4

2

1

SDA

10.0K0603

R114+3.3VD

+3.3V

SCL1

2

10.0K0603

R100 10.0K0603

R101

10.0K0603

R107

10.0K0603

R109

47 0603

R115

47 0603

R116

47 0603

R117

R118

060347

R119

060347

ABMM

6.0 MHz

Y1

GN

D

GND

TO I2SSELECT

MCLK-USB

SDOUT-USB

SCLK-USB

LRCLK-USB

SYSTEM RESET

INPUT-USB BOARD #3

USB INTERFACE, RESET 1

MiniB USB INPUT

USB

TO EVMs

FROM EVMsSDIN

I2CACTIVITY


Figure 17. Input - USB Board Schematic, USB Interface Reset



http://www.ti.com


SCKO

BCKO

LRCKO

DOUT

MCLK-SPDIF

SCLK-SPDIF

LRCLK-SPDIF

DOUT-SPDIF

DOUT-SPDIF

3

2

1

TORX147PL(F,T)

J4

SHIELD

GND

Vcc

OUT

R206

0603470

R212

0603100

C212

06034700pfd/50V C213

06030.068ufd/16V

R217

0603680

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

U7

DIR9001PWTSSOP28-PW

21

27

28

26

25

24

23

22

C207

06030.1ufd/16V

C211

06030.1ufd/16V

C204

06030.1ufd/16V

C210

080510ufd/10V

C208

060318pfd/50V

C209

060318pfd/50V

Y2

ABM8G12.288 MHz

GND

R213

060347

GNDGND

GND GND

GND GND

GND GND

GND

GND GND GND

LDN

7

A

A

InputUsbBoard3.sbk

JULY 12, 2011


OF

SCH REV

PCB REV

SHEET

DRAWN BY

DATE

FILENAME

PAGE INFO:

DESIGN LEADTI

4.7KQ2SOT23-DBV3

C

B

E

SPDIF-LOCK0805Blue

R211

0603392

GND

GND

R200

0603751

3

2

J3

INV1

2

4

1 5

3

SN74LVC1GU04DBVSOT23-DBV5

R202

06031.0M

C201

06031.0ufd/10V

R203

06032.00K

C203

06031.0ufd/10V

R204

06037.50K

INV2

2

4

1 5

3

SN74LVC1GU04DBVSOT23-DBV5

C202

06030.047ufd/16V

R201

0603100

C200

06030.047ufd/16V

1

2

3

4

5

6

7

8MUX1

74LVC2G157DCT

VCC

GND

SSOP8-DCTGND

GND

S21

2

3

GND

GND GND

R207

060310.0K

R210

060310.0K

R208

0603DNP

R209

0603DNP

C205

06030.1ufd/16V

GND

GND

GND

GND

GND

GND

GND

GND

+3.3VD1

+3.3VD1

+3.3VD1

+3.3VD1

+3.3VD1

+3.3VD1+3.3VD1

+3.3VD1

+3.3VD1

MCLK2Orange

SCLK2Orange

LRCLK2Orange

DOUT2Orange

C206

06030.1ufd/16V

GND

+3.3VD1

R214

060347

R215

060347

R216

060347

R218

06030.0

R219

06030.0

Green0805

COAX

SOT23-DBV3

Q84.7K

C

B

E

GND

3570603

R220

OPTO

0805 Green

GND

R221

0603357

+3.3VD1R205

060349.9

+3.3VD1

2-3 = COAX1-2 = OPTO

FROMSYSTEMRESET

OPTICAL SPDIF

2SPDIF INTERFACE

INPUT-USB BOARD #3

SPDIF LOCK

TOADC MUXES

MCLK-SPDIF

SCLK-SPDIF

LRCLK-SPDIF

COAXSPDIF

SPDIF SELECTTO ADCs /

I2S SELECT

PSK Select

SPDIF SELECT LEDs


Figure 18. Input - USB Board Schematic, SPDIF Interface



http://www.ti.com


LRCLK-OUT

MCLK-USB

SCLK-USB

LRCLK-USB

MCLK-SPDIF

SCLK-SPDIF

LRCLK-SPDIF

SDOUT-USB

MCLK-MUX

SDOUT1

SDOUT1

SDIN

SCLK-OUT

SDATA1

SDATA2

SDATA3

SDATA4

SDA

SCL

SCLK-MUX

LRCLK-MUX

MCLK-OUT

SDOUT1-MUX

SDOUT2

SDOUT3

SDOUT4

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

J1

+5V

+12V

GND

GNDC410

06030.1ufd/16V

GND

C411

06030.1ufd/16V

OTW

0805 Red

4.7KQ4SOT23-DBV3

C

B

E

GND

R405

0603357

SHUTDOWN

0805 Red

Q54.7K

SOT23-DBV3

C

B

E

GND

R406

0603357

1

2

3

4 5

6

7

8

SN74LVC2G74DCT

FF1

SSOP8-DCT

A

A

7


JULY 12, 2011


OF

SCH REV

PCB REV

SHEET

DRAWN BY

DATE

FILENAME

PAGE INFO:

DESIGN LEADTI

74LVC1G14DBV

INV35

43

2

1

SOT23-DBV5

S6

GND

GND

GND

C403

06030.1ufd/16V

GND

R401

060310.0K

C402

06030.1ufd/16V

C404

06030.1ufd/16V

R400

060310.0K

C400

08054.7ufd/16V

C401

06030.1ufd/16V

GND GND

GND

VCC

74LVC2G157DCT

MUX68

7

6

5

4

3

2

1

SSOP8-DCT GND

GND

1

2

3

4

5

6

7

8MUX7

74LVC2G157DCT

VCC

GND

SSOP8-DCT GND

GND

GND

VCC

74LVC2G157DCT

MUX88

7

6

5

4

3

2

1

SSOP8-DCT GND

GND

1

2

3

4

5

6

7

8MUX9

74LVC2G157DCT

VCC

GND

SSOP8-DCT GND

GND

S7

3

2

1

GND

+3.3VD3

+3.3VD3

+3.3VD3

+3.3VD3

C405

06030.1ufd/16V

GND

+3.3VD3

C406

06030.1ufd/16V

GND

C407

06030.1ufd/16V

GND

+3.3VD3

C408

06030.1ufd/16V

GND

C409

06030.1ufd/16V

GND

SCLKOOrange

SDATA1Orange

SDATA2Orange

SDATA3Orange

SDATA4Orange

SDINOrange

J2

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

GND

+3.3V

+3.3V

GND

MCLKOOrange

LRCLKOOrange

GND GND

FAULT

0805 Red

4.7KQ6SOT23-DBV3

C

B

E

GND

R407

0603357

R403

0603357

GND

MUTE

0805 Yellow

+3.3VD4+3.3VD4

+3.3VD4+3.3VD4+3.3VD4+3.3VD4

PVDD

Red

4

2

MCLK1

3

4

2

3

1 SCLK

4

2

LRCLK1

3

4

2

3

1 ADC1

4

2

ADC21

3

4

2

ADC31

3

4

2

3

1 ADC4

GND

R411

06030.0

R410

060310.0K

+3.3VD4

R412

0603100K

+3.3VD4

R413

0603100K

+3.3VD4

R414

0603100K

+3.3VD4

PDN

0805 Yellow

Q74.7K

SOT23-DBV3

C

B

E

GND

R409

0603357

S8

GND

R408

060310.0K

+3.3VD4

+3.3VD4

SPDIF

0805 Green

4.7KQ10SOT23-DBV3

C

B

E

GND

R415

0603357

Green0805

USB

GND

3570603

R416

+3.3VD3

R402

060349.9

+3.3VD3

POWER

DOWN

SDOUT4

SDOUT3

SDOUT2

PSIA OUT = 1/2, PSIA IN = 3/4JUMPER 2-3 FOR PASS-THRU

PSIA DATA SELECT

PSIA CLOCK SELECT To EVMs

MUTE FAULT

TO USB

I2SSELECT

2-3 = SPDIF1-2 = USB

SDATA4

SDATA3

SDATA2

SDATA1

LRCLK-OUT

SCLK-OUT

MCLK-OUT


INPUT-USB BOARD #3

FROM ADC MUXES

FROM USBSCL

SDA

PSIA INPUT, DATA SELECT, EVM CONNECTOR 4

OTW SHUT

DOWNFROM

SYSTEM

RESET

FROM USB

FROM SPDIF

LRCLK-USB

MCLK-USB

SCLK-USB

SCLK-SPDIF

MCLK-SPDIF

LRCLK-SPDIF

SDOUT-USB

I2S-SEL

CTRL

I2S-SEL

I2S-SEL

I2S-SEL

I2S-SEL


Figure 19. Input - USB Board Schematic, PSIA Inputs, Data Select, and EVM Connector



http://www.ti.com


LRCLK-OUT

MCLK-USB

SCLK-USB

LRCLK-USB

MCLK-SPDIF

SCLK-SPDIF

LRCLK-SPDIF

SDOUT-USB

MCLK-MUX

SDOUT1

SDOUT1

SDIN

SCLK-OUT

SDATA1

SDATA2

SDATA3

SDATA4

SDA

SCL

SCLK-MUX

LRCLK-MUX

MCLK-OUT

SDOUT1-MUX

SDOUT2

SDOUT3

SDOUT4

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

J1

+5V

+12V

GND

GNDC410

06030.1ufd/16V

GND

C411

06030.1ufd/16V

OTW

0805 Red

4.7KQ4SOT23-DBV3

C

B

E

GND

R405

0603357

SHUTDOWN

0805 Red

Q54.7K

SOT23-DBV3

C

B

E

GND

R406

0603357

1

2

3

4 5

6

7

8

SN74LVC2G74DCT

FF1

SSOP8-DCT

A

A

7


JULY 12, 2011


OF

SCH REV

PCB REV

SHEET

DRAWN BY

DATE

FILENAME

PAGE INFO:

DESIGN LEADTI

74LVC1G14DBV

INV35

43

2

1

SOT23-DBV5

S6

GND

GND

GND

C403

06030.1ufd/16V

GND

R401

060310.0K

C402

06030.1ufd/16V

C404

06030.1ufd/16V

R400

060310.0K

C400

08054.7ufd/16V

C401

06030.1ufd/16V

GND GND

GND

VCC

74LVC2G157DCT

MUX68

7

6

5

4

3

2

1

SSOP8-DCT GND

GND

1

2

3

4

5

6

7

8MUX7

74LVC2G157DCT

VCC

GND

SSOP8-DCT GND

GND

GND

VCC

74LVC2G157DCT

MUX88

7

6

5

4

3

2

1

SSOP8-DCT GND

GND

1

2

3

4

5

6

7

8MUX9

74LVC2G157DCT

VCC

GND

SSOP8-DCT GND

GND

S7

3

2

1

GND

+3.3VD3

+3.3VD3

+3.3VD3

+3.3VD3

C405

06030.1ufd/16V

GND

+3.3VD3

C406

06030.1ufd/16V

GND

C407

06030.1ufd/16V

GND

+3.3VD3

C408

06030.1ufd/16V

GND

C409

06030.1ufd/16V

GND

SCLKOOrange

SDATA1Orange

SDATA2Orange

SDATA3Orange

SDATA4Orange

SDINOrange

J2

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

GND

+3.3V

+3.3V

GND

MCLKOOrange

LRCLKOOrange

GND GND

FAULT

0805 Red

4.7KQ6SOT23-DBV3

C

B

E

GND

R407

0603357

R403

0603357

GND

MUTE

0805 Yellow

+3.3VD4+3.3VD4

+3.3VD4+3.3VD4+3.3VD4+3.3VD4

PVDD

Red

4

2

MCLK1

3

4

2

3

1 SCLK

4

2

LRCLK1

3

4

2

3

1 ADC1

4

2

ADC21

3

4

2

ADC31

3

4

2

3

1 ADC4

GND

R411

06030.0

R410

060310.0K

+3.3VD4

R412

0603100K

+3.3VD4

R413

0603100K

+3.3VD4

R414

0603100K

+3.3VD4

PDN

0805 Yellow

Q74.7K

SOT23-DBV3

C

B

E

GND

R409

0603357

S8

GND

R408

060310.0K

+3.3VD4

+3.3VD4

SPDIF

0805 Green

4.7KQ10SOT23-DBV3

C

B

E

GND

R415

0603357

Green0805

USB

GND

3570603

R416

+3.3VD3

R402

060349.9

+3.3VD3

POWER

DOWN

SDOUT4

SDOUT3

SDOUT2


PSIA DATA SELECT

PSIA CLOCK SELECT To EVMs

MUTE FAULT

TO USB

I2SSELECT

2-3 = SPDIF1-2 = USB

SDATA4

SDATA3

SDATA2

SDATA1

LRCLK-OUT

SCLK-OUT

MCLK-OUT


INPUT-USB BOARD #3

FROM ADC MUXES

FROM USBSCL

SDA

PSIA INPUT, DATA SELECT, EVM CONNECTOR 4

OTW SHUT

DOWNFROM

SYSTEM

RESET

FROM USB

FROM SPDIF

LRCLK-USB

MCLK-USB

SCLK-USB

SCLK-SPDIF

MCLK-SPDIF

LRCLK-SPDIF

SDOUT-USB

I2S-SEL

CTRL

I2S-SEL

I2S-SEL

I2S-SEL

I2S-SEL


Figure 20. Input - USB Board Schematic, Power Inputs and Supplies



http://www.ti.com


GND

0.5in 0.5in

Green

0805

5V

GND

5600603

R2

0.5in 0.5in

GND

220ufd/16VM

C1+

GND

Red

+12V

Black

GND

Green

0805

3.3V

GND

3740603

R3

+5V +3.3V

+5V

10.0K0603

R4

3.16K0603

R5

0.01ufd/50V0603

C3

SOP8-D

1

2

3

4

5

6

7

8

TPS5410D

VR2

NC

VSENSE

PH

VIN

ENA

NC

GND

BOOT

47ufd/16VFC

C4+

2A 40VSMA

CR2B240A-13-F

4.7ufd/16V0805

C215uH

DG6045C

L1

+3.3V

3.3V/400mASOT230DBV5

VR3

TPS73633DBVT

5

43

2

1

0.1ufd/10V0603

C5

0.1ufd/10V0603

C8

+5V

GND

GND

GND GND

GND

GNDGND

GND GND

Green

0805

12V

GND

13.0K0603

R1

JULY 12, 2011

TUAN LUU 6527708 InputUsbBoard3.sbk

A

A

7

LDNTI DESIGN LEAD

PAGE INFO:

FILENAME

DATE

DRAWN BY

SHEET

PCB REV

SCH REV

OF

EDGE #

+12V

+12V

+12V

GND

2.2ufd/10V0603

C7

47ufd/16VFC

C6+

4.7 1/4W0805

R11

10ufd/10V0805

C11

GND

+3.3V

+3.3VD1

4.7 1/4W0805

R16

10ufd/10V0805

C12

GND

+3.3V

+3.3VD2

4.7 1/4W0805

R17

10ufd/10V0805

C13

GND

+3.3V

+3.3VD3

4.7 1/4W0805

R18

10ufd/10V0805

C14

GND

+3.3V

+3.3VD4

50V 2ASMA

ES2AA

CR1

PVDD TO 5V SWITCHER

5V TO 3.3V DC-DC CONVERTER

INPUT-USB BOARD #3

5POWER INPUTS AND SUPPLIES

MAIN POWER IN

BOM ONLY

STANDOFFS

ADCMUXES

SPDIF

I2SSELECTMUXES

SWITCHESANDLEDs


Figure 21. Input - USB Board Schematic, Revision History



http://www.ti.com


JULY 12, 2011

TUAN LUU 6527708 InputUsbBoard3.sbk

A

A

7

LDNTI DESIGN LEAD

PAGE INFO:

FILENAME

DATE

DRAWN BY

SHEET

PCB REV

SCH REV

OF

EDGE #

REVISION HISTORY 6

TLJULY 12, 2011INITIAL RELEASEA

APPROVALDATEDESCRIPTIONREVISION

REVISION HISTORY

INPUT-USB BOARD #3


Figure 22. Input - USB Board Revision History



http://www.ti.com


(a) modify the Materials (including any associated warranties, conditions, limitations ornotices) or use them for any commercial purpose, or any public display, performance, sale orrental;(b) decompile, reverse engineer, or disassemble software Materials except and only to theextent permitted by applicable law;(c) remove any copyright or other proprietary notices from the Materials;(d) transfer the Materials to another person. You agree to prevent any unauthorized copyingof the Materials. TI may terminate this license at any time if you are in breach of the termsof this Agreement. Upon termination, you will immediatelydestroy the Materials.

TEXAS INSTRUMENTS DISCLAIMER

TI

7.) Resale of TI's products or services with statements different from or beyond the parameters stated by TI for that product or service in official TI data books or data sheetsvoids all express and any implied warranties for the associated TI product or service, and is an unfair and deceptive businesspractice, and TI is not responsible for any such use.

6.) Performance tests and ratings, to the extent referenced in the Materials, are measured using specific computer systems and/or components and reflect the approximateperformance of TI products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers shouldconsult other sources of information to evaluate the performance of systems or components they are considering purchasing.

5.) No license is granted under any patent right or other intellectual property right of TI covering or relating to any combination, machine, or process in which such TI products orservices might be or are used. Except as expressly provided herein, TI and its suppliers do not grant any express or implied right to you under any patents, copyrights,trademarks, or trade secret information.

4.) TI currently deals with various customers for products, and therefore our arrangement with the user will not be exclusive. TI makes no representations regarding thecommercial availability of non-TI components that may be referenced in the Materials.

The information and materials ("Materials") provided here are provided by Texas Instruments Incorporated ("TI") as a service toits customers and/or suppliers,and may be used for informational purposes only, and only subject to the following terms. By downloading or viewing these Materials, you are signifying your assent to these terms.

1.) These preliminary evaluation schematics are intended for use for PRELIMINARY ENGINEERING DEVELOPMENT AND EVALUATION PURPOSES ONLY and are not considered byTexas Instruments to be fit as a basis for establishing production products or systems. This information may be incomplete in several respects, including but not limited to informationrelating to required design, marketing, and/or manufacturing-related protective considerations and product safety measures typically found in the end-product incorporating the goods.

2.) Accordingly, neither TI nor its suppliers warrant the accuracy or completeness of the information, text, graphics, links orother items contained within the Materials. TI may makechanges to the Materials, or to the products described therein, at any time without notice. TI makes no commitment to update the Materials.

3.) TI assumes no liability for applications assistance, customer product design, software performance, or services that may be described or referenced in the Materials. The userassumes all responsibility and liability for proper and safe design and handling of goods. Accordingly, the user indemnifies TI from all claims arising from its use of the Materials.

8.) The Materials are copyrighted and any unauthorized use may violate copyright, trademark, and other laws. You may only download one copy for your internal use only,unless you are specifically licensed to do otherwise by TI in writing. This is a license, not a transfer of title, and is subject to the following restrictions: You may not:

9.) THE MATERIALS ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED WARRANTY OF ANY KINDINCLUDING WARRANTIES OF MERCHANTABILITY, NONINF RINGEMENT OF INTELLECTUAL PROPERTY, ORFITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT SHALL TI OR ITS SUPPLIERS BE LIABLE FOR ANYDAMAGES WHATSOEVER (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESSINTERRUPTION, LOSS OF INFORMATION) ARISING OUT OF THE USE OF OR INABILITY TO USE THEMATERIALS, EVEN IF TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.


Figure 23. USB Board Schematic Disclaimer



http://www.ti.com


EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS

Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claimsarising from the handling or use of the goods.

Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days fromthe date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TOBUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OFMERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTHABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIALDAMAGES.

Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. Thisnotice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safetyprograms, please visit www.ti.com/esh or contact TI.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, orcombination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, andtherefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,software performance, or infringement of patents or services described herein.

REGULATORY COMPLIANCE INFORMATION

As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the FederalCommunications Commission (FCC) and Industry Canada (IC) rules.

For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumeruse. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computingdevices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequencyinterference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense willbe required to take whatever measures may be required to correct this interference.

General Statement for EVMs including a radio

User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency andpower limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with locallaws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate thisradio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited andunauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatoryauthorities, which is responsibility of user including its acceptable authorization.

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant

Caution

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not causeharmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate theequipment.

FCC Interference Statement for Class A EVM devices

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercialenvironment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with theinstruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely tocause harmful interference in which case the user will be required to correct the interference at his own expense.

http://www.ti.com/corp/docs/csr/environment/ESHPolicyandPrinciples.shtml

FCC Interference Statement for Class B EVM devices

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipmentgenerates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may causeharmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. Ifthis equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off andon, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

For EVMs annotated as IC – INDUSTRY CANADA Compliant

This Class A or B digital apparatus complies with Canadian ICES-003.

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate theequipment.

Concerning EVMs including radio transmitters

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) thisdevice may not cause interference, and (2) this device must accept any interference, including interference that may cause undesiredoperation of the device.

Concerning EVMs including detachable antennas

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gainapproved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain shouldbe so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.

This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximumpermissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gaingreater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.

Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité del'utilisateur pour actionner l'équipement.

Concernant les EVMs avec appareils radio

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation estautorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter toutbrouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gainmaximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique àl'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.

Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manueld’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus danscette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

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【【Important Notice for Users of EVMs for RF Products in Japan】】This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan

If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:

1. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs andCommunications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law ofJapan,

2. Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to thisproduct, or

3. Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan withrespect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please notethat if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.

Texas Instruments Japan Limited(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan

http://www.tij.co.jp

【無線電波を送信する製品の開発キットをお使いになる際の注意事項】

本開発キットは技術基準適合証明を受けておりません。

本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

　　　上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。

日本テキサス・インスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビルhttp://www.tij.co.jp

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EVALUATION BOARD/KIT/MODULE (EVM)WARNINGS, RESTRICTIONS AND DISCLAIMERS

For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finishedelectrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation inlaboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risksassociated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished endproduct.

Your Sole Responsibility and Risk. You acknowledge, represent and agree that:

1. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and DrugAdministration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.

2. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicableregulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents tominimize the risk of electrical shock hazard.

3. Since the EVM is not a completed product, it may not meet all applicable regulatory and safety compliance standards (such as UL,CSA, VDE, CE, RoHS and WEEE) which may normally be associated with similar items. You assume full responsibility to determineand/or assure compliance with any such standards and related certifications as may be applicable. You will employ reasonablesafeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail toperform as described or expected.

4. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.

Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per theuser guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, andenvironmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contacta TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of thespecified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/orinterface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to theload specification, please contact a TI field representative. During normal operation, some circuit components may have case temperaturesgreater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components includebut are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using theEVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, pleasebe aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeablein electronic measurement and diagnostics normally found in development environments should use these EVMs.

Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representativesharmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or inconnection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claimsarise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.

Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (suchas life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as deviceswhich are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separateAssurance and Indemnity Agreement.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2013, Texas Instruments Incorporated

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2013, Texas Instruments Incorporated

http://www.ti.com/audio

http://www.ti.com/automotive

http://amplifier.ti.com

http://www.ti.com/communications

http://dataconverter.ti.com

http://www.ti.com/computers

http://www.dlp.com

http://www.ti.com/consumer-apps

http://dsp.ti.com

http://www.ti.com/energy

http://www.ti.com/clocks

http://www.ti.com/industrial

http://interface.ti.com

http://www.ti.com/medical

http://logic.ti.com

http://www.ti.com/security

http://power.ti.com

http://www.ti.com/space-avionics-defense

http://microcontroller.ti.com

http://www.ti.com/video

http://www.ti-rfid.com

http://www.ti.com/omap

http://e2e.ti.com

http://www.ti.com/wirelessconnectivity

TAS5612L-TAS5614LDDEVM (Rev. A) - Farnell element14 · 5.2 TAS5612L-TAS5614LDDVEVM PCB ... They require only a passive demodulation filter to deliver efficient high ... • Double-sided

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