STEP at SEMICON West 2006

1SEMICON West 2006 STEPJuly 12, 2006

Productivity/Performance Specifications Overview

Dr. Vallabh H. DhudshiaQ&R Consultant

Standards Technology Group

[email protected]

SEMICON West 2006 STEPMethods to Measure/Improve

Equipment Productivity


NA Metrics Committee Charter

To explore, evaluate, discuss, and formulate consensus-based standard measurement methods, specifications, guidelines, and practices that, through voluntary compliance, will promote mutual understanding and improved communication between users and suppliers of manufacturing equipment and materials to enhance the manufacturing capability of the semiconductor and related industries.

Its scope includes liaison with other technical committees for the development of metrics-related standards. Its scope is limited to exploring and developing standards and associated training that pertain to common criteria, guidelines, methods, or approaches to be used as the basis for comparative performance measurements of equipment, materials, components, or manufacturing operations.


SEMI E10SEMI E79SEMI E35SEMI E58 (co-owned with I&C Committee)SEMI E116 (co-owned with I&C Committee)SEMI E124

Metrics Committee Specifications / Standards


Reliability

Availability

To Understand SEMI Standards

Maintainability

Need to Understand (RAMP):

Productivity


What is Reliability?

One of the important equipment characteristics

Longevity measure of failure-free operation interval

Probability of performing intended functions for a specified time under the stated operational conditions


Reliability metrics can be divided into four main categories:

Categories of Reliability Metrics

1. Metrics based on probabilities

2. Metrics based on mean life

3. Metrics normalized by life units

4. Metrics expressed in percentages

Commonly used in the SC manufacturing industry


What is Maintainability?

Maintainability deals with the time it takes to restore the equipment operations after it stops performing its intended functions.

Maintainability is the probability that the equipment will be restored to a specific operational condition (able to perform its intended functions) within a specified period of time, when the maintenance is performed by personnel having specified skill levels and using prescribed procedures, resources, and tools.

Maintenance can be either unscheduled or scheduled.

The most commonly used maintainability metric is Mean Time to Repair (MTTR).

Notes: According to SEMI E10, Repair Time is sum of downtimes for diagnosis, corrective action, equipment test, and verification runs.


Availability is a joint measure of reliability and maintainability.

What is Availability?

It is defined as the probability that the equipment will be in a condition to perform its intended functions when required.


Availability = Uptime / (Uptime + Downtime)

Where Downtime includes Unscheduled and Scheduled (Preventive Maintenance) downtimes

One of the most widely used parameters of the availability is % Uptime, which is defined as

% Uptime = Availability x 100

Three variations in the availability calculations are defined in SEMI E10.

Availability


What is Productivity?

Productivity as implied in SEMI E79:

Good units Production Rate in relation to the theoretical (available) capacity

Widely Used Metric: Overall Equipment Efficiency (OEE)


Hierarchy of Equipment Performance Metrics

Ref: “Hi-Tech Equipment Reliability” by Dr. Vallabh H. Dhudshia

QualitySafety Time

Reliability (MTBF)

Maintainability (MTTR)

Availability (Uptime)

Production Speed

Efficiency

Productivity / Overall

Equipment Efficiency

(OEE)

Operations Cost

Life Cycle Cost (LCC)

Production Volume Waste Costs

Quality/Defect Rate

Consumable Taxes, Insurance

and Interest Costs

Cost of Ownership

(COO)

Acquisition Cost

Scrap Cost

Metrics Supported by

SEMI E10, E116, E58


SEMI E79


SEMI E35



SEMI E10 is a Semiconductor Equipment & Materials International (SEMI) Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM).

What is SEMI E10?

Developed by a task force under the SEMI Metrics Committee.

First issued in 1986, and revised in 1990, 1992, 1996, 1999, 2001 and 2004 (SEMI E10-0304E).


Underlying Assumptions:1. Repairable System2. Interval between two successive failures

follows Exponential Distribution

SEMI E10: Underlying Assumptions & Scope

Scope:1. Non-Cluster tool (entire equipment or subsystem level)2. Single Path Cluster tool3. Multi-Path Cluster tool at subsystem level


Failure: Any unscheduled downtime event that changes the equipment to a condition where it cannot perform its intended function.

Any part failure, software or process recipe problem, facility or utility supply malfunction, or human error could cause the failure.

Equipment-Related Failure: Any unplanned event that changes the equipment to a condition where it cannot perform itsintended function solely caused by the equipment.

Key Definitions of SEMI E10


SEMI E10 Breakdown of TimeTotal Time

Non-Scheduled Time

Operations Time

Uptime Downtime

Manufacturing Time

Engineering Time

Standby Time

Productive Time

Unscheduled Downtime

Scheduled Downtime

- Maintenance delay - Production test - Preventive maintenance - Change of consumables/chemical - Setup - Facilities related

- Maintenance delay - Repair time - Change of consumables/chemicals - Out of spec Input - Facilities related

- No operator - No product - No support tool - Associated cluster module down

- Regular production - Work for 3rd party - Rework - Engineering runs

- Unworked shifts, days - Installation, modification, rebuild or upgrade - Off-line Training - Shutdown/startup

- Process experiments - Equipment experiments - Software qualification


Total Equipment Cycles Total Equipment CyclesMCBF = E-MCBF =

N NE

PT PT

MTBFP = E-MTBFp = N NE

SEMI E10 Reliability Metrics

E-MCBF = Mean Cycles Between Equipment-Related FailuresE-MTBFP = Mean Productive Time Between Equipment-Related FailuresMCBF = Mean Cycles Between FailuresMTBFP = Mean Productive Time Between FailuresN = Number of Total FailuresNE = Number of Total Equipment-Related FailuresPT = Productive Time


SEMI E10 Maintainability Metrics

Total Repair Time MTTR =

N

Total Repair Time Includes:• Diagnosis Time

• Corrective Action Time

• Equipment Test and Verification Time

Repair Time does not include maintenance delays.


Equipment-Dependent Uptime % =

Uptime x 100

(Uptime + Equipment Caused Downtime)

SEMI E10 Availability Metrics

Supplier-Dependent Uptime % =

Uptime x 100

(Uptime + Equipment and Supplier Caused Downtime) Uptime

Operational Uptime % = x 100 Operations Time


SEMI E10 Utilization Metrics

Productive Time Operational Utilization % = x 100

Operations Time

Productive Time Total Utilization % = x 100

Total Time


Other SEMI E10 Metrics

• Multi-path Cluster tool RAM metrics

• Confidence limits for reliability metrics

• Rate of reliability growth/degradation



SEMI E79 is a SEMI Specification for Definition and Measurement of Equipment Productivity.

What is SEMI E79?


First issued in 1999, and revised in 2000 and 2004 (SEMI E79-0304).

Changed Effectiveness to Efficiency in 2000 revision.


Underlying Assumptions:1. Repairable System2. Using SEMI E10 RAM terms and definitions3. Equipment of the same design have the

same theoretical production time per unit4. Subjectivity in Determining Theoretical

Production Time (THT)

SEMI E79: Underlying Assumptions & Scope

Scope:1. Non-Cluster tool 2. Module Level3. Fixed Sequence (Single Path) Cluster tool4. Flexible-Sequence (Multi-Path) Cluster tool


Total Time

Operations Time

Engineering Time

Uptime

Manufacturing Time

Productive Time Standby Time • Regular production • Work for 3rd party • Engineering runs

• Rework • Scrap

• No operator • No product • No support tool • Associated cluster module down

Operational Efficiency

Quality Efficiency

Non-Scheduled Time • Unworked shifts, days • Installation, modification rebuild, or upgrade • Off-line training • Shutdown/Startup

Downtime

Unscheduled Downtime Scheduled Downtime • • Repair time • • •

Maintenance delay Change of consumables/ chemicals Out of spec input Facilities related

•

• Maintenance delay • Production tests • Preventive maintenance • Change of consumables chemicals Setup • Facilities related

Availability

Efficiency

Rate Efficiency Not specified in SEMI E10 but occurs during Productive Time

• Process experiments • Equipment experiments Software qualification •

Mapping with SEMI E10 States


Overall Equipment Efficiency (OEE) = (Theoretical Production Time for Effective Units)

/ (Total Time)

= (Availability Efficiency) x (Performance Efficiency) x (Quality Efficiency)

The fraction of total time that equipment is producing effective units at theoretically efficient rates.

SEMI E79 OEE MetricsIndividual Process Modules or Fixed-Sequence Cluster Tools

Availability Efficiency = (Equipment Uptime) / (Total Time)

The fraction of total time that the equipment is in a condition to perform its intended function.


Performance Efficiency = (Operational Efficiency) x (Rate Efficiency)

The fraction of equipment uptime that the equipment is processing actual units at theoretically efficient rates.

Operational Efficiency = (Production Time) / (Equipment Uptime)

The fraction of equipment uptime that the equipment is processing actual units.

Rate Efficiency = (Theoretical Production Time for Actual Units) / (Production Time)

The fraction of production time that equipment is processing actual units at theoretically efficient rates.

SEMI E79 OEE MetricsIndividual Process Modules or Fixed-Sequence Cluster Tools

Quality Efficiency = (Theoretical Production Time for Effective Units) / (Theoretical Production Time for Actual Units


Other SEMI E79 Metrics

• Multi-Path (Flexible Sequence) Cluster tool OEE• Reference OEE (R-OEE)• Engineering OEE (E-OEE)• Value-Added In-Process OEE (VA-OEE)• Production Equipment Efficiency (PEE)• Demand Equipment Efficiency (DEE) • Intrinsic Equipment Efficiency (IEE)



SEMI E35 is a SEMI Guide to Calculate Cost Of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment.

What is SEMI E35?


First issued in 1995 and last revised in 2005 (SEMI E35-0305).


The Cost of Ownership (COO) is the full cost of embedding, operating, and decommissioning a manufacturing equipment in a factory environment that accommodates the required production volume.

What is COO?


(Fc + Rc + Yc) COO per good unit = (L x TP x Y x U) Where: Fc = Fixed costs Rc = Recurring costs Yc = Yield loss costs L = Life of equipment TP = Throughput Y = Composite yield U = Utilization

Simple and Basic COO Equation


Fixed Costs:

The fixed costs include amortized portion of purchase price, taxes and duties, transportation costs, installation cost, start-up cost, training cost, and decommission cost.

Recurring Costs:

The recurring costs for a piece of equipment are costs for consumables and materials, maintenance, parts, waste disposal, and operators.

Yield Loss Costs:

The yield loss costs are those costs associated with lost production units that are directly attributable to equipment performance.

Examples of COO Elements


Equipment Acquisition Cost Equipment Utilization

Equipment reliability Other downtimes

Recurring Cost Regular operations Maintenance Cost of consumables and waste disposal

Production Throughput Rate Yield Loss (Scrap) Cost

Product yield

COO Dependencies



SEMI E124 SEMI Provisional Guide for Definition and Calculation of Overall Factory Efficiency (OFE) and Other Associated Factory-Level Productivity Metrics.

What is SEMI E124?


First issued in July 2003, last revised in November 2003 (SEMI E124-1103).


Overall Factory Efficiency (OFE) shows how well a factory is operating compared to how well it could be operating for the given product mix.

Volume Efficiency is a measure of the total efficiency of the process with respect to the factory dynamics.

Yield Efficiency is a measure of overall material efficiency.

OFE = volume efficiency x yield efficiency

What is OFE?


Definition Tree for Factory-Level Productivity Metrics

av a ilab ilityef f ic ien cy

f in ish edun i ts o u t

av era gecycle t im e

go o d u n iteq u iv a len ts ou t

(1 2 )

W IPcapa city

th eoretica l pro ductiontim e per u n it

to ta lt im e

scrap p edun its ou t

o v era ll f a cto ryef f ic ien cy

( 1 )

yieldef f iciency

( 3 )

lineyield( 6 )

testyie ld(7 )

v o lu m eef f icien cy

( 2 )

no rm a lizin gexpon en t

(9 )

critica lW IP(1 0 )

best-ca secycle tim e

( 1 8 )

best-casethrou g h pu t ra te

(2 0 )

a v era geW IP( 1 5 )

theoretica lthro u gh pu t ra te

(2 1 )

W IPtu rn ov er

( 2 2 )

actua lth ro u gh pu t ra te

(1 9 )

theo retica lcycle t im e

( 1 6 )

bo ttlen eckthrou gh pu t ra te

( 1 7 )

th ro ug h pu t-ra te a n dcycle- tim e ef f iciency

(1 3 )

o p era tiona lef f icien cy

W IPef f ic ien cy

(1 4 )

p rod u ctionef f iciency

( 8 )

norm alizedpro du ctio n ef f ic ien cy

( 4 )

ba la nceef f ic ien cy

( 5 )

processcap acity

(11 )


Why SEMI Standards?Provides company-wide and industry-wide common language for terms, definitions, and calculations of SC Manufacturing Equipment performance/productivity metrics.

Provides a common framework for clear and accurate communications between IC Makers and their equipment suppliers.

Provides a standard for the design of automated RAM data collection system and Equipment Performance Tracking (E58 and E116).

Provides structure and hierarchy to equipment performance/productivity metrics.

Equipment Purchase Specifications may require that equipment performance/productivity measurements are based on SEMI Standards.

Equipment Evaluation Programs (EEP) and Joint Development Programs (JDP) may use SEMI Standards metrics.

STEP at SEMICON West 2006

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