STANFORD High-Power High-Speed Photodiode for LIGO II David Jackrel Ph.D. Candidate- Dept. of Materials Science & Eng. Advisor- Dr. James S. Harris March 15 th , 2001 LIGO-G010122-00- Z
STANFORD
High-Power High-Speed Photodiode for LIGO II
David Jackrel
Ph.D. Candidate- Dept. of Materials Science & Eng.
Advisor- Dr. James S. Harris
March 15th, 2001
LIGO-G010122-00-Z
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Outline
Introduction Photodiode Specifications &
Development Device Structure & Materials
Diode Electrical Characterization Contact Resistance I-V Characteristics C-V Characteristics
Future Plans
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Photodiode Specifications
Parameter LIGO I LIGO II (old) LIGO II (new)
Steady-State Power
0.6 W ~10 W ~1 W
Operating Frequency
29 MHz ~100 MHz ~100 kHz
Quantum Efficiency
80% 90% 90%
Transient Damage
3 Joules / 10 ms
100 Joules /10 ms (?)
100 Joules /10 ms (?)
Signal/Noise 1.4e10 Hz 3.1e10 Hz 3.1e10 Hz
Spatial Uniformity
1% RMS 0.1% RMS 0.1% RMS
Surface Backscatter
1e-4 / sr 1e-6 / sr 1e-6 / sr
Detector Design
Bank of 6(+) PDs
1 PD(~3 mm dia.)
1 PD(1-3 mm dia.)
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Photodiode Development
June 1999- Came on the project Passed Quals Began Training on MBE Machine and Processing
Procedure
March 2000: 1st Round Wafers Materials Analysis Electronic Properties Not Good
June 2000: 2nd Round Wafers Materials Analysis (Transmission, XRD, TEM, SEM) Electronic Properties Characterized (TLM, I-V, C-V)
March 2001- Future: 3rd Round Wafers Electronic Properties Optoelectronic Properties (Bandwidth, QE, Power
Response)
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P-I-N Device Characteristics
Large E-field in I- region
Depletion Width Width of I- region
Frequency response
max (sat/WI)
RC time constant
Tuned to a specific
1
IW
IsJ
Js
WAKC
CR
/0
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Band Gap Diagram w/ Heterojunctions
InAlAs Optically transparent to 1.06m radiation
Absorption occurs in i-region
N-layer:
In.22Al.78As
Eg2=2.0eV
P-layer:
In.22Al.78As
Eg2=2.0eV
I-layer:
In.22Ga.78As
Eg1=1.1eV
n-
i-
p-
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InGaAs/GaAs PD Structure
•P-I-N structure
•InGaAs for i-layer
•InAlAs for the n- and p- layers
•MBE
•Grading layer
•AR coating & Au/Pt contacts
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Rear-Illuminated PD Advantages
High Power Linear
Response High Speed
Proposed PD (Rear-Illuminated)Conventional PD
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MBE Surface Kinetics
Adsorption Physisorption Chemisorption
Surface migration
Incorporation Thermal
desorption
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III-V Lattice Constants and Band Gaps
InAlAs and InGaAs well lattice matched
InAlAs much wider band gap
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Lattice Mismatched Growth
Lattice Constant for InxGa(1-x)As:
a=5.6536+0.4054x
In.4Ga.6As: hc 100Å
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TEM Images of Confined Dislocations
Device Layers:
-few dislocations
Graded Buffer:
-many dislocations
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Graded Buffer Dislocations
Biaxial stress in film causes dislocations to glide
Misfit growth often results in surface striations
Hsu, et al. (1992)
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P- and N- Contacts
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TLM (Transmission Line Model)
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TLM Measurements: P-Contact
Short d, R, Slope Long d, R, Slope
#673, n-12, lengths 1-7
-0.1
-0.05
0
0.05
0.1
-6 -4 -2 0 2 4 6
V (volts)
I (A
mp
s)
1/Slope vs. Length Indexy = 6.7862x + 8.2118
R2 = 0.9892
0
10
20
30
40
50
60
0 1 2 3 4 5 6 7 8
Length Index
Res
ista
nce
(O
hm
s)
Rc = 8.2/2 = 4.1
Rs = 6.8 / 10m = 0.68/m
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P-Contact Resistance (#673)
p-673, Before & After Anneal
6
8
10
12
0 5 10 15 20
Structure #
Rc
(Oh
ms)
Squares: Before Anneal
Circles: After Anneal
2
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P-Contact Resistance (#649)
p-649, Before & After Anneal
4
6
8
10
12
0 5 10 15 20
Structure #
Rc
(Oh
ms) Squares:
Before Anneal
Circles: After Anneal2
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N-Contact Character
#649, n-3, length-1
y = 0.0002x5 - 5E-05x4 + 0.0004x3 - 7E-05x2 - 0.0007x + 7E-05
R2 = 0.9998
-0.15
-0.1
-0.05
0
0.05
0.1
0.15
-4 -2 0 2 4
V (Volts)
I (A
mp
s)
n-#649, n-3, length-7y = 0.2513x + 0.0001
R2 = 0.9998
-0.15
-0.1
-0.05
0
0.05
0.1
0.15
-0.6 -0.4 -0.2 0 0.2 0.4 0.6
V (Volts)
I (A
mp
s)
Before Annealing:
Not Ohmic (Schottky)
After Annealing:
Ohmic
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N-Contact Resistance (After Anneal)
1/Slope vs/ Length Indexn-#649, n-3
y = -0.0312x + 4.3661
R2 = 0.0948
3.9
4
4.1
4.2
4.3
4.4
4.5
4.6
0 1 2 3 4 5 6 7 8
Length Index
Res
ista
nce
(O
hm
s)
Not very linear!
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N- and P- Contact Resistance
Resistance:
Test Pad
(1200 m2)
Resistance:
Actual Contacts
Resistivity
N - Contact
2.1 0.36 m 0.00175 /m2
P – Contact
4.5 2.8 m 0.00375 /m2
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I-V Characteristics
#673, n6Rear-up, Probe Station
-0.02
0
0.02
0.04
0.06
0.08
0.1
0.12
-4 -3 -2 -1 0 1 2 3
V (volts)
I (a
mp
s)
(-0.278mA @ -3V)
(#673 Rectified, #649 Did not…)
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I-V Characteristics: Reverse Bias
#673, n6, curve-aRear-up, Probe Station
-0.0025
-0.002
-0.0015
-0.001
-0.0005
0
-12 -10 -8 -6 -4 -2 0
V (volts)
I (a
mp
s)
(-2.1mA @ -10V)
Wrong shape (defects?)
Large Current Values
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I-V Characteristics: Semi-Log Plot
#673n6: ln (I) vs. V
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
2
0.03 0.53 1.03 1.53
V
ln (I
)
Ideal R-G
Ideal:
Slope = 11.4
q/kT = 38.6
n1 = 3.39
I01 = 0.83A
R-G:
Slope = 10.13
q/2kT = 19.3
n2 = 3.82
I02 = 2.26A
I0 = 3.09 A
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Possible Explanation: Carrier Hopping
Defects in the I-layer Alternative Transport Mechanism
Ev
Ec
+ -
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I-V Characteristics: Light vs. Dark
#673, n6, curves-d,eSoldered, Dark and Illuminted
-0.0014
-0.0012
-0.001
-0.0008
-0.0006
-0.0004
-0.0002
0
-6 -4 -2 0
V (Volts)
I (A
mp
s)
A, Dark
A, Illum.
I-layer not fully depleted at zero bias…
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C-V Characteristics (#673)
#673, n-?, trial-s
1.50E-09
1.70E-09
1.90E-09
2.10E-09
2.30E-09
2.50E-09
2.70E-09
2.90E-09
3.10E-09
3.30E-09
0 1 2 3 4 5 6 7Reverse Bias (-Volts)
C (
F)
2.09nF
3.05nF
Theoretical C 0.40nF
depletion width 0.39m
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Capacitance, WD, and ND
WD 0.5m
ND 1016cm-3
(@ 10V bias)
WD 2.0m
ND 1015cm-3
(@ 5V bias)
(Sze, S. M., Physics of Semiconductor Devices, 1969)
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Future Plans: InGaAs/InAlAs
Less defects Test QE
Buffer Layers
Defects Materials
Analysis
Front Illum.
Thin Substrate
Bandwidth TLM Test QE
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Future Plans: Nd:YAG & Nitrides
Nd:YAG LASER Testing Set-up at Stanford (w/ help from Mike
Z.) Compliment Faster Device Turn-Around
Nitride System: InGaNAs Quaternary No Graded Buffer But, Still Rear-Illuminated