SPECIFICATION OF ANALOG MEMS MICROPHONE - endrich.com · Microphone Technology Leadership V 1.0 1. INTRODUCTION This specification is for the SMD possible Analog MEMS (Top port) Microphone

BEST SOUND ELECTRONICS

Microphone Technology Leadership V 1.0

BSE CO., LTD

58B-4L, 626-3, GOZAN-DONG, NAMDONG-KUINCHON-SI. KOREATEL :(8232) 550-1780FAX :(8232) 554-6206

4 0 5 8 1 7-

SPECIFICATION OF ANALOG MEMS MICROPHONE

MODEL NO. : MOE-C110T42-K1DIRECTIVITY : OMNI-DIRECTIONALSOUND PORT : TOP PORT TYPE



1. INTRODUCTIONThis specification is for the SMD possible Analog MEMS (Top port) Microphone which has endurable reflow

temperature of up to 260 for over 15 seconds.

2. MODEL NO.MOE-C110T42-K1

3. ELECTRICAL CHARACTERISTICS

4. MEASUREMENT CIRCUIT

Temp. = 23 ± 2 Room Humidity = 65 ± 5 %

NO. Parameter Symbol ConditionLimits

UnitMin. Center Max.

1 Sensitivity SVdd=2.0V, f=1kHz, S.P.L=1Pa,0dB=1V/Pa

-45 -42 -39 dB

2 Output impedance ZOUT Vdd=2.0V 300 Ω

3 Current consumption IDSS Vdd=2.0V 50 250 uA

4 Signal to Noise Ratio S/N A-weighting at 1kHz 1Pa 55 59 dB

5 Sensitivity Change across Voltage Vdd=1.5V ~ 3.6V No Change dB

6 Operating Voltage Vdd 1.5 2.0 3.6 V

7 Total Harmonic Distortion THD

At 100dB SPL 1 %

At 115dB SPL 10 %

VP

MEMS Unit

AMP

Pin4

Pin1

Pin2, 3

1uF

Vdd:2.0V

Output

GND

MIC Case



5. TYPICAL FREQUENCY RESPONSE CURVE ( FAR FIELD )

Far Field Measurement ConditionTemperature : 23 ± 2 Supply Voltage : 2.0V Acoustic stimulus : 1Pa ( 94 SPL at 1 ) at 50 from the loud-speaker.

The loud-speaker must be calibrated to make a flat frequency response input signal. Position : The frequency response of microphone unit measured at 50 from the loud-speaker

6. MECHANICAL CHARACTERISTICS※ PCB design & Pin size can be changed by model No.

SMD Type

3.76

±0.

1

2.95±0.11.10±0.1

MOE-C110T42-K1

1 0 0 1 0 0 0 1 0 0 0 0- 2 0

- 1 5

- 1 0

- 5

0

5

1 0

1 5

2 0

[ Am

plitu

de ;

Dec

ibel

]

[ F r e q u e n c y ; H e r t z ]

F r e q u e n c y R e s p o n s e



Dimensions (Unit : mm)

- Mechanical dimensions, Land Pattern

OrientationMarking

Recommended

PCB land pattern (Unit : mm)

Recommended

solder stencil pattern (Unit : mm)

- thickness of metal mask: 0.10 mm



7. Packaging Specification

- Reel

• 13” reel for the mass production stage. (Unit : mm)



7. Packaging Specification

- Taping

Unit : mm

A0 4.06±0.10 E 1.75±0.10

B0 3.30±0.10 F 5.50±0.05

K0 1.30±0.10 T 0.30±0.05

D0 1.50±0.10 W 12.00±0.30

SECTION A-A'

T

K0

A'

A

P0

EF

W

B

D0

DETAIL B (2:1)

A0

B0

[ Note ]1. Direction of parts : See above pictures.2. Microphone total quantity (13” Reel) : 5,700pcs



8. RELIABILITY TEST CONDITIONS

9 . TEMPERATURE CONDITIONS

9.1 STORAGE TEMPERATURE : -40 ~ +100

9.2 OPERATING TEMPERATURE : -40 ~ +100

Note : After test conditions are performed, the sensitivity of the microphoneshall not deviate more than ±3dB from its initial value.

TEST DESCRIPTION

TEMPERATURESTORAGE

[High Temperature Storage]+70±2 environment for 200 hours.(The measurement to be done after 2 hours of conditioning at room temperature)

[Low Temperature Storage]-25±2 environment for 200 hours.(The measurement to be done after 2 hours of conditioning at room temperature)

HUMIDITY +70±2 and 95±2%RH environment for 200 hours.(The measurement to be done after 2 hours of conditioning at room temperature)

TEMPERATURECYCLE

5 cycles of temperature change.+70±2 for 1hr, at 20±2 for 30 min, at -25±2 for 1hr(The measurement to be done after 2 hours of conditioning at room temperature)

THERMAL SHOCK

32 cycles of temperature change.from –40 to 85 for 1hr Changing time about 5 min(The measurement to be done after 2 hours of conditioning at room temperature)

HIGH TEMPERATURE AND HUMIDITY

+85±2 and 85±2%RH environment for 120 hours.(The measurement to be done after 2 hours of conditioning at room temperature)

ESD(Electrostatic

Discharge)

HBM (Human Body Model) : 2kV Expose 10 Times.MM (Machine Model) : 0.2kV Expose 10 Times.CDM (Charged Device Model) : 0.5kV Expose 10 Times.

VIBRATION To be no interference in operation after vibrations.10 to 55 for 1 minute full amplitude 1.52 , for 2 hours at three axes

DROP To be no interference in operation after dropped to steel floor12 times from 1.5 meter height in state of packing

REFLOWSENSITIVITY 3 reflow cycles. Refer to reflow profile from specification item 11.



10. MEASUREMENT SYSTEM

11. REFLOW PROFILE (Guaranteed Maximum Reflow Condition)

Parameter Specification Parameter Specification

Average temp. gradientin preheating

2.5/s Time above 250 Max. 10 s

Soak time 2-3 minutes Peak temp. in reflow 255(-0/+5)

Time above 217 Max. 60 s Temp. gradient in cooling Max. –5/ s

Time above 230 Max. 50 s



12. Recommended Pick-up nozzle

12.2 Nozzle position : MIC Center- Nozzle inner diameter size : Max. Ø1.0

12.1 Nozzle position : The opposite side of sound hole- Nozzle inner diameter size : Max. Ø1.5- position : 0.63mm away from the MIC center

3.76

2.9

5

( 0.7)0.20

0.7 (slit hole)

1.18

Max. Ø1.50 (Nozzle inner diameter)

0.63 (Nozzle position)

3.76

2.9

5

( 0.7)

Max. Ø1.00 (Nozzle inner diameter)

0.20

0.7 (slit hole)

1.18

SPECIFICATION OF ANALOG MEMS MICROPHONE - endrich.com · Microphone Technology Leadership V 1.0 1. INTRODUCTION This specification is for the SMD possible Analog MEMS (Top port) Microphone

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