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The SP3042 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC 61000-4-2 international standard (±30kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present and the low loading capacitance makes it ideal for protecting high speed data lines such as HDMI,USB2.0, USB3.0 and eSATA.
• ESD protection of ±30kV contact discharge, ±30kV air discharge, (IEC 61000-4-2)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
PPK Peak Pulse Power (tP=8/20µs) 20 W
IPP Peak Current (tp=8/20μs) 2.0 A
TOP Operating Temperature -40 to 125 °C
Thermal Information
Parameter Rating Units
Storage Temperature Range -55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature (Soldering 20-40s) 260 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM 5.3 V
Reverse Breakdown Voltage VBR 1R=1mA 7.8 V
Reverse Leakage Current ILEAK VR=5.3V 100 nA
Clamp Voltage1 VC IPP=1A, tp=8/20µs, Fwd 12.5 V
Dynamic Resistance2 RDYN TLP, tp=100ns, I/O to GND 0.5 Ω
ESD Withstand Voltage1 VESD
IEC 61000-4-2 (Contact) ±30 kV
IEC 61000-4-2 (Air) ±30 kV
Diode Capacitance1 CD Reverse Bias=0V 0.35 0.5 pF
8/20μS Pulse Waveform
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Note:1 Parameter is guaranteed by design and/or device characterization. 2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
Notes : 1. All dimensions are in millimeters2. Dimensions include solder plating.3. Dimensions are exclusive of mold flash & metal burr.4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.5. Package surface matte finish VDI 11-13.
Product Characteristics of 01005 Flipchip
Lead Plating Sn
Lead Material Copper
Lead Coplanarity 6µm(max)
Substrate material Silicon
Body Material Silicon
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TLP Voltage (V)
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Part Number Package Marking Min. Order Qty. Packaging Option P0/P1 Packaging Specification