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The market for power modules will have a 7.6% compound annual growth rate (CAGR) from 2017 to 2023, reaching $5.5M in 2023. The power module market plays a key role in several industrial applications from electric and hybrid electric vehicles (EV/HEV) and motor drives, to megawatt (MW) solutions like converters for wind turbines, which have a standard power range from 100kW to 8MW.
The power module packaging material business is worth $1.2B, which represents about a third of the existing power module market.Yole predicts that this power module packaging material market will have a CAGR for 2017-2023 of 8.2%, approaching $2B in value by 2023.
Module packaging currently has several critical technical aspects, such as molding, high temperature die attach and connection. It must combine good thermal and electrical efficiency while keeping low mass and volume. Also, to remain competitive, power module makers must deliver high reliability while remaining cost efficient.
In the second quarter of 2017, ABB presented its new LinPak line that offers innovative solutions for all power conversion applications. It enables the design of converters with the lowest overall inductance. Fast, low switching loss chip-sets can therefore be used for the first time in high-current applications. ABB’s LinPak modules’ low inductance leads directly to their lowest switching losses and excellent robustness.
The 5SNG 1000X170300 is a unique LinPak 1700V IGBT module from ABB with ultra-low inductance, configured in a compact design, phase-leg topology. This module uses the latest ABB Soft Punch Through (SPT++) silicon IGBT and diode.
This report presents a deep technology analysis of the 5SNG 1000X170300 module and its cost. Supported by a full teardown of the module’s components and housing, this report reveals the innovative assets that enable ABB to assemble its SPT++ chipsets in the LinPak package.
This report provides insights into the structure, technical choices, design, processes, and supply chain positions. It also estimates manufacturing cost of all the module’s components and analyses its selling price. It also includes a detailed comparison with the CAS300M17BM2 1700V SiC power module from Cree. This comparison highlights differences in the electrical parameters, dies, packaging and production costs.
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
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Package Opening – Housing Removal Steps
Housing removal Steps – Tilted Optical Views
M3 Screw/Nut (x4)
M3 Screw (x6)
M8 Nuts (x6)
“ The connection to the auxiliary terminals for gate, emitter, collector and thermistor are realized with M3 screws.In addition, four molded M3 nuts are positioned in the corners to mechanically fix the adapter board for harsh environmental applications like traction or CAV. The adapter-board connects the modules’ gates and auxiliary emitters in parallel. Thus, many modules can be connected in parallel with just one gate-unit. “
Source: “LinPak – the new standard phase-leg module with exceptional low inductance”
ABB Article by R. Schnell et al.
Plastic Rivet (x6)
o The PCB is fixed to the Package by Snap-Riveting technique (6 Rivets are used)
The module manufacturing cost ranges from$xxx to $xxx according to yield variations.
By taking into account a gross margin of 31%for ABB (2018 results), the module sellingprice is estimated to range from $xxx to $xxxaccording to yield variations.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTABB LINPAK 1700V 2x1000A POWER MODULE
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