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Sony CorporationPersonal Audio DivisionPublished by Sony Techno Create Corporation
Model Name Using Similar Mechanism NEW
MD Mechanism Type MT-MZRH1-181
Optical Pick-up Name ABX-U2
US ModelCanadian Model
AEP Model
SPECIFICATIONS
– Continued on next page –
Audio playing systemMiniDisc digital audio system
SystemsMiniDisc system, Hi-MD system
Laser diode propertiesEmission duration: continuousLaser output: less than 44.6 µW(This output is the value measured at a distance of 200 mm from the lens surface on the optical pick-up block with 7 mm aperture.)
US and foreign patents licensed from Dolby Laboratories.
• SonicStage is a trademark or registered trademark of Sony Corporation.• MD Simple Burner, OpenMG, “MagicGate”, “MagicGate Memory
Stick”, “Memory Stick”, Hi-MD, Net MD, ATRAC, ATRAC3,ATRAC3plus and their logos are trademarks of Sony Corporation.
• Microsoft, Windows, Windows NT and Windows Media are trademarksor registered trademarks of Microsoft Corporation in the United Statesand /or other countries.
• IBM and PC/AT are registered trademarks of International BusinessMachines Corporation.
• Macintosh is a trademark of Apple Computer, Inc.• Pentium is a trademark or registered trademark of Intel Corporation.• MPEG Layer-3 audio coding technologyand patents licensed from
Fraunhofer IIS and Thomson.• All other trademarks and registered trademarks are trademarks or
registered trademarks of their respective holders.• ™ and ® marks are omitted in this manual.• CD and music-related data from Gracenote, Inc., copyright ˝ 2000-2004
Gracenote. Gracenote CDDB® Client Software, copyright 2000-2004Gracenote. This product and service may practice one or more of thefollowing U.S. Patents: #5,987,525; #6,061,680; #6,154,773,#6,161,132, #6,230,192, #6,230,207, #6,240,459, #6,330,593, and otherpatents issued or pending. Services supplied and/or device manufacturedunder license for following Open Globe, Inc. United States Patent6,304,523.Gracenote is a registered trademarks of Gracenote. The Gracenote logoand logotype, and the “Powered by Gracenote” logo are trademarks ofGracenote.
Recording and playback timeList of the recording time for each disc (Approx.)The recording time is varied depending on disc type, disc mode, codec, and bit rate.
When using a disc in Hi-MD mode
When recording on the recorder Recording time1)
Codec/ Bit rate
Recording mode on the recorder
1GB Hi-MD disc
80-minute standard disc
74-minute standard disc
60-minute standard disc
LinearPCM/ 1.4 Mbps
PCM 1 hour and 34 minutes
28 minutes 26 minutes 21 minutes
ATRAC
ATRAC3plus/ 256 kbps
Hi-SP 7 hours and 55 minutes
2 hours and 20 minutes
2 hours and 10 minutes
1 hour and 40 minutes
ATRAC3plus/ 64 kbps
Hi-LP 34 hours 10 hours and 10 minutes
9 hours and 20 minutes
7 hours and 40 minutes
When transferring from the computer Recording time1)
Codec/Bit rate 1GB Hi-MD disc
80-minute standard disc
74-minute standard disc
60-minute standard disc
LinearPCM/1.4 Mbps 1 hour and 34 minutes
28 minutes 26 minutes 21 minutes
ATRAC
ATRAC3plus/352 kbps 5 hours and 30 minutes
1 hour and 35 minutes
1 hour and 30 minutes
1 hour and 10 minutes
ATRAC3plus/256 kbps 7 hours and 55 minutes
2 hours and 20 minutes
2 hours and 10 minutes
1 hour and 40 minutes
ATRAC3plus/192 kbps 11 hours 3 hours and 10 minutes
3 hours 2 hours and 20 minutes
ATRAC3plus/64 kbps 34 hours 10 hours and 10 minutes
9 hours and 20 minutes
7 hours and 40 minutes
ATRAC3plus/48 kbps 45 hours 13 hours and 30 minutes
Power requirementsSony AC Power Adaptor DC 5 V AC 100 V - 240 V, 50/60 HzLithium-ion rechargeable batteryLIP-4WM, 3.7 V, 370 mAh, Li-ion
Operating temperature+5 °C (+41 °F) to +35 °C (+95 °F)
Battery operation time**
DimensionsApprox. 83.8 × 84.4 × 14.7 mm (w/h/d)(33/8 3/8 19/32 in.) (excluding projecting parts and controls)
MassApprox. 96 g (3.4 oz.) (the recorder only)Approx. 106 g (3.8 oz.) (including the rechargeable battery)* The LINE IN (OPT) jack is used to connect either a digital (optical) cable or a line (analog)
cable.** Measured in accordance with JEITA.
Design and specifications are subject to change without notice.
Battery life1)
This value varies depending on how the recorder is used.
When recording/playing continuously in Hi-MD mode (Unit: approx. hours)
When Disc type LinearPCM Hi-SP Hi-LP MP32)
Recording 1GB Hi-MD disc 6 9 10.5 —3)
60/74/80-minute standard disc
5 9 10.5 —3)
Playing 1GB Hi-MD disc 10 15.5 19 16.5
60/74/80-minute standard disc
8 14.5 18.5 16
When recording/playing continuously in MD mode (Unit: approx. hours)
When Disc type SP LP2 LP4Recording 60/74/80-minute standard disc 8.5 10.5 12
Playing 60/74/80-minute standard disc 15.5 17.5 19
Measured in accordance with the JEITA (Japan Electronics and Information Technology Industries Association) standard.1) Measured using a fully charged lithium-ion rechargeable battery with “EL Light” in the menu set to “Auto Off” 2) When transferring at 128 kbps3) The recorder cannot record in MP3 mode. Transfer MP3 audio data using the supplied SonicStage software
NoteRepeated recharging causes the capacity of the rechargeable battery to decrease over time. As a result, the battery life will become shorter as the battery is used. Please replace the battery when the battery life reaches about half the time listed above.
× 3 ×
Supplied accessories• AC power adaptor (100 V - 240 V) • AC power cord1)
• USB cable • Remote control2)
• Earphones• LIP-4WM Lithium-ion rechargeable battery• Rechargeable battery case • Optical cable (for the European model)• Carrying pouch• Ferrite core (small size)
− Three for the European model− Two for the North American model
• 1GB Hi-MD disc (except for the European model)
• CD-ROM3) (Windows: SonicStage/MD Simple Burner, Macintosh: Hi-MD Music Transfer for Mac)
• Operating Instructions (this manual)
• Operating Instructions (Hi-MD Music Transfer for Mac)
1) The shape of the plug differs according to the region where the recorder was purchased. Two cords with differently shaped plugs are supplied with the models for Europe, Asia and Chile. Use the one that corresponds with the outlet configuration in the region where it is used.
2) For the North American and Latin American models, remote with a ferrite core is supplied.3) Do not play a CD-ROM on an audio CD player.
For details on “Hi-MD Music Transfer for Mac”, refer to the instruction sheet supplied with this recorder.
Torsion Spring (Pop Up R) .............................................. 93-8. Gear (SA), Gear (SB) ...................................................... 93-9. OP Service Assy (ABX-U2) ............................................ 103-10. DC Motor SSM18D/C-NP (Spindle) (M701),
DC Motor (Sled) (M702),DC Motor Unit (Over Write Head Up/Down) (M703) ... 10
3-11. Holder Assy ..................................................................... 113-12. Position of Ferrite Core ................................................... 11
4. TEST MODE .............................................................. 12
8. ELECTRICAL PARTS LIST ................................ 58
Notes on chip component replacement• Never reuse a disconnected chip component.• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing• Keep the temperature of the soldering iron around 270 ˚C
during repairing.• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTIONUse of controls or adjustments or performance of proceduresother than those specified herein may result in hazardous radiationexposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINEWITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND INTHE PARTS LIST ARE CRITICAL TO SAFE OPERATION.REPLACE THESE COMPONENTS WITH SONY PARTS WHOSEPART NUMBERS APPEAR AS SHOWN IN THIS MANUAL ORIN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORTÀ LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SURLES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DESPIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DEFONCTIONNEMENT. NE REMPLACER CES COM- POSANTSQUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONTDONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTSPUBLIÉS PAR SONY.
4
MZ-RH1SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electrostaticbreak-down because of the potential difference generated by thecharged electrostatic load, etc. on clothing and the human body.During repair, pay attention to electrostatic break-down and alsouse the procedure in the printed matter which is included in therepair parts.The flexible board is easily damaged and should be handled withcare.
NOTES ON LASER DIODE EMISSION CHECKThe laser beam on this model is concentrated so as to be focused onthe disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission,observe from more than 30 cm away from the objective lens.
NOTES ON HANDLING THE OPTICAL PICK-UPBLOCK OR BASE UNIT
OPERATION CHECK WHEN THE MAIN BOARD ISREMOVEDIn making an operation check with the MAIN board removed fromthe set, short the SL463 of the MAIN board with the solder beforestarting the operation check.Note: Be sure to remove the solder used for shortcircuit after the repaire
completed.
– MAIN Board (Conductor Side) –
SL463
UNLEADED SOLDERBoards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead.(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARKUnleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higherthan ordinary solder.Ordinary soldering irons can be used but the iron tip has to beapplied to the solder joint for a slightly longer time.Soldering irons using a temperature regulator should be set toabout 350 °C.Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)than ordinary solder so use caution not to let solder bridgesoccur such as on IC pins, etc.
• Usable with ordinary solderIt is best to use only unleaded solder but unleaded solder mayalso be added to ordinary solder.
NOTES ON REPLACEMENT OF CSP (CHIP SIZEPACKAGE) ICReplacement of IC401, IC501, IC601 and IC701 on the MAIN boardused in this set requires a special tool.
NOTES ON REPLACEMENT OF IC801 ON THE MAINBOARDIC801 on the MAIN board can not be exchanged alone. When IC801on the MAIN board is damaged, exchange the complete MAINboard.
NOTES ON REPLACEMENT OF IC1 AND S8 ONTHE OLED BOARDIC1 and S8 on the OLED board can not be exchanged alone. WhenIC1 and S8 on the OLED board are damaged, exchange the completeOLED board.
System requirementsThe following system environment is required in order to use the SonicStage/MD Simple Burner software.
Computer IBM PC/AT or Compatible
• CPU: Pentium III 450 MHz or higher• Hard disk drive space: 200 MB or more (1.5 GB or more is recommended)
(The amount space will vary according to Windows version and the number of music files stored on the hard disk.)
• RAM: 128 MB or more
Others • CD drive (capable of digital playback by WDM) (A CD-R/RW drive is necessary for CD writing)
• Sound Board• USB port
Operating System
Factory installed:Windows XP Media Center Edition 2005/Windows XP Media Center Edition 2004/Windows XP Media Center Edition/Windows XP Professional/Windows XP Home Edition/Windows 2000 Professional (Service Pack 3 or later)/Windows Millennium Edition/Windows 98 Second Edition
Display High Color (16 bit) or higher, 800 better is recommended)
Others • Internet access for online registration and CDDB use• Internet access and Microsoft Internet Explorer (version 5.5 or higher) for use
of EMD services• Windows Media Player (version 7.0 or higher) installed for playing WMA
files
This software is not supported by operating systems other than those listed above, custom-built PCs, operating systems that are upgrades from the original manufacturer-installed system, multi-boot environments, multi-monitor environments, or Macintosh computers.
Notes
• We do not ensure trouble-free operation on all computers that satisfy the system requirements.• The NTFS format of Windows XP/Windows 2000 Professional can be used only with the standard (factory)
settings.• We do not ensure trouble-free operation of the system suspend, sleep, or hibernation function on all computers.
5
MZ-RH1SECTION 2GENERAL
This section is extracted frominstruction manual.
Guide to Parts and Controls
Recorder
Remote OPEN button
LINE IN (OPT) jack
MIC (PLUG IN POWER)* jack
(earphones)/LINE OUT jack
Recorder: VOL +*/− buttonsRemote: VOL +/− control
Recorder: • DISPLAY/ MENU button Remote: DISPLAY button
Recorder: Jog lever ( (play)/ENT*, FF (AMS, fast forward), FR (AMS, fast rewind))
Move (FF/FR) Push ( /ENT)
FF
FR
Remote: Jog lever ( (play, pause)/ENT, (AMS, fast rewind), (AMS, fast forward))
USB cable connecting jack
Battery compartment
(group) +/− button
Clip
P MODE/ (repeat) button
SOUND button* There is a tactile dot.
Locking the controls (HOLD)Slide the HOLD switch on the recorder or on the remote in the direction of the arrow.You can prevent accidental button presses while carrying the recorder by locking the controls. You can use the HOLD function for the recorder and the remote separately. For example, even if the HOLD function on the recorder is activated, you can operate the recorder by using the remote unless you set HOLD on the remote to on, too.
MZ-RH1
6
Note: Follow the disassembly procedure in the numerical order given.
3-2. PANEL (LOWER) SECTION
• This set can be disassembled in the order shown below.
3-1. DISASSEMBLY FLOW
SECTION 3DISASSEMBLY
6 panel (lower) section
S464
knob (hold)
2 two bosses
1 Open thebattery case lid.
3 battery case lid
4 screw (M1.4)
5 two screws(M1.4)
Note: On installation of panel (lower) section, adjust the position of switch (S464) and knob (hold).
5 two screws(M1.4)
knob (hold)
S464
3-2. PANEL (LOWER) SECTION(Page 6)
3-6. MECHANISM DECK(MT-MZRH1-181)(Page 8)
3-3. CABINET (FRONT) SECTION(Page 7)
3-4. MAIN BOARD(Page 7)
3-5. PANEL (UPPER) ASSY(Page 8)
SET
3-7. TORSION SPRING (POP UP L), TORSION SPRING (POP UP R)(Page 9)
3-8. GEAR (SA), GEAR (SB)(Page 9)
3-12. POSITION OF FERRITE CORE(Page 11)
3-9. OP SERVICE ASSY (ABX-U2)(Page 10)
3-10. DC MOTOR SSM18D/C-NP (SPINDLE) (M701),DC MOTOR (SLED) (M702),DC MOTOR UNIT (OVER WRITE HEAD UP/DOWN) (M703)(Page 10)
3-11. HOLDER ASSY(Page 11)
MZ-RH1
7
3-3. CABINET (FRONT) SECTION
3-4. MAIN BOARD
5 Remove the cabinet (front) section in the direction of arrow B.
2 flexible board(18core) (CN471)
panel (upper) assy
A
B
3 screw (M1.4)
4 Remove from the convex part of the screw hole.
convex part of screw hole
1 Push the knob (open) in the direction of arrow A and open the panel (upper) section.
convex part of screw hole
4 Remove from the convex part of the screw hole.
The screw fixing areas is cleaned.
3 Remove two solders of the flexible board (over write head (HR601)).
4 OP flexible board(CN501)
2 shield assy
7 MAIN board
1 three screws (M1.4)
6 two screws (M1.4)5 motor flexible
board (CN701)
Note: When mounting the MAIN Board, clean the screw fixing areas (5 places × both sides) of the MAIN Board with alcohol (ethanol), and then tighten the screws.Also, when tightening the screws, use a torque driver and tighten them to a torque range of 0.06 – 0.08N.(Excessive torque over 0.1N could bend the chassis.)(Without cleaning, or with the screws tightened loosely, the set may not start when the USB cable is inserted.)
Ver. 1.1
MZ-RH1
8
3-5. PANEL (UPPER) ASSY
3-6. MECHANISM DECK (MT-MZRH1-181)
1 two screws (M1.4)
1 two screws (M1.4)2 panel (upper) assy
3 mechanism deck (MT-MZRH1-181)
2 two step screws (MD)
1 case (batt)
MZ-RH1
9
3-7. TORSION SPRING (POP UP L), TORSION SPRING (POP UP R)
3-8. GEAR (SA), GEAR (SB)
HOW TO INSTALL THETORSION SPRING (POP UP L)
HOW TO INSTALL THETORSION SPRING (POP UP R)
hook
hook
hook
hook
hook
hook
2 torsion spring (POP UP R)
1 torsion spring (POP UP L)
1 Engage the coiltorsion spring (POP UP L)with the hook. 1 Engage the coil
torsion spring (POP UP R)with the hook.
2 Engage the endtorsion spring (POP UP L) with the hook.
2 Engage the endtorsion spring (POP UP R)with the hook.
3 Engage the endtorsion spring (POP UP L)with the hook.
3 Engage the endtorsion spring(POP UP R)with the hook.
1 self tap screw
2 thrust retainer spring
3 washer (0.8-2.5)
4 gear (SA)5 gear (SB)
MZ-RH1
10
3-9. OP SERVICE ASSY (ABX-U2)
3-10. DC MOTOR SSM18D/C-NP (SPINDLE) (M701), DC MOTOR (SLED) (M702) ,DC MOTOR UNIT (OVER WRITE HEAD UP/DOWN) (M703)
1 Lead screw block assy is turnedand it removes from OP service assy.
2 OP service assy (ABX-U2)
3 two screws (M1.4)
4 DC motor (sled)(M702)
1 Remove four solders of flexible board.
6 three self tap screws
7 DC motor SSM18D/C-NP(spindle) (M701)
5 motor base assy
9 DC motor unit (over write head up/down)(M703)
8 self tap screw
2 Remove two solders of flexible board.
MZ-RH1
11
3-11. HOLDER ASSY
3-12. POSITION OF FERRITE CORE
2 boss
2 boss
A
3 holder assy
1 Open the holder assy to the direction of the arrow A.
2. CONFIGURATION OF THE TEST MODEIt shifts from the display check mode to each mode as shown in thefigure below.
Flow of the test mode:
OUTLINEOperation in the test mode is performed with the set. A key havingno particular description in the text, indicates a set key. Also, Forthe display, the EL display on the set is shown.
1. OPERATION IN SETTING THE TEST MODE• When the test mode becomes active, first the Display Check
mode is selected.• Other mode can be selected from the Display Check mode.• When the test mode is set, the EL repeats the following display.• When the x key is pressed and hold down, the display at that
time is held so that display can be checked.
Display check mode:
SECTION 4TEST MODE
Display Check Mode
Version display → All lit→ All off → Version display...
[VOL +] key
x key
x key
x key
x key
x key
N/ENT key
> key
[REC/T MARK] key
[DISPLAY/MENU] key
[VOL --] key
Open theupper panel
Manual Mode
Sound Skip Check ResultDisplay Mode (Play)
Self-Diagnosis Result Display Mode
Sound Skip Check ResultDisplay Mode (REC)
Key Check Mode
Overall Adjustment Mode
Key Count Mode
[DISPLAY/MENU] key(press a fewseconds)
Remote commander[DISPLAY] key(press a few seconds)
(Not used in servicing. Return to the display check mode when entering by mistake)
Ver 1.000 BEr******
0000 Manual
0000 AdjF**
0100 10
0000 1 0000
0000 P00r00
0000 p00R00
0000
Ver 1.000 BEr******
All lit
All off
Microcomputerversion display
13
MZ-RH1
3. MANUAL MODEThis is mode to adjust or check the operation of the set by function.
Operation of The Manual Mode1. Enter the test mode (Display Check mode).2. Press the [VOL+] key to activate the Manual mode where the
EL displays as shown below.
3. During Manual mode, the optical pick-up moves outward orinward while the > or . key is pressed for severalseconds respectively.
4. Each test item is assigned with a four-digit item number; 1000thplace is a top item, 100th place is a major item, 10th place is amedium item, and unit place is a minor item.
Flow of manual mode operation:
x key> key
> key
> key
Top item switching
Major item switching
x key
[VOL +] key: 1000th place of itemnumber increase.
[VOL --] key: 1000th place of itemnumber decrease.
[VOL +] key: 100th place of itemnumber increase.
[VOL --] key: 100th place of itemnumber decrease.
Medium item switching
x key
[VOL +] key: 10th place of itemnumber increase.
[VOL --] key: 10th place of itemnumber decrease.
> key: 1st place of itemnumber increase.
. key: 1st place of itemnumber decrease.
Minor item switching
[VOL +] key: Increases the adjusted value.
[VOL --] key: Decreases the adjusted value.
Adjusted value variation
Adjusted value write
[ ]key: Adjusted value is written.X
5. The display changes a shown below each time the[DISPLAY/MENU] key is pressed.
*1) It is skipped excluding the item number 5000 less than 8000.
6. To release the Manual mode, press the x key to return to theDisplay Check mode.
• Address & Adjusted Value Display
item numberitem title
adjusted value
• Jitter Value & Adjusted Value Display
• Block/Bite Error Value & Adjusted Value Display
• ADIP Error Value & Adjusted Value Display
• Focus Drive Value & Adjusted Value Display
• Item Title Display
• Bite Error LPF Value & Adjusted Value Display *1)
• CEMAX Value & Adjusted Value Display *1)
XXXX * * * * * * # #
item numberaddress
adjusted value
XXXX * * * S # #
item numberjitter value
adjusted value
XXXX * * * J # #
item numberblock/bite error value
adjusted value
XXXX * * * B # #
item numberbite error LPF value
adjusted value
XXXX * * * B # #
item numberCEMAX value
adjusted value
XXXX * * * B # #
item numberADIP error value
adjusted value
XXXX * * * B # #
item numberfocus drive voltage value
adjusted value
XXXX * * * B # #
0000 Manual
14
MZ-RH1
5. SELF-DIAGNOSIS RESULT DISPLAY MODEThis set uses the self-diagnostic function system in which if an erroroccurred during the recording or playing, the mechanism controlblock and the power supply control block in the microcomputerdetect it and record its cause as history in the nonvolatile memory.By checking this history in the test mode, you can analyze a faultand determine its location.Total recording time is recorded as a guideline of how long theoptical pick-up has been used, and by comparing it with the totalrecording time at the time when an error occurred in the self-diagnosis result display mode, you can determine when the erroroccurred.Clear the total recording time, if the optical pick-up was replaced.
5-1. Operation of The Self-Diagnosis Result DisplayMode
1. Enter the test mode (Display Check mode).2. Press the > key to activate the Self-Diagnosis Result Display
mode where the LCD displays as shown below.
“****” : Error display code“$$” : Error revision history code“####” : Addition information when error occurs
3. To release the Self-Diagnosis Result Display mode, press the x keyand return to the Display Check mode.
Flow of Self-diagnosis Result Display mode operation:
4. OVERALL ADJUSTMENT MODEOperation of The Overall Adjustment Mode
1. Enter the test mode (Display Check mode).2. Press the [VOL--] key to activate the Overall Adjustment mode
where the EL displays as shown below.
“**”:If “DF” or “FF” is displayed, it mean that completed the servooverall adjustment.
3. To release the Overall Adjustment mode, press the x key andreturn to the Display Check mode.
0000 AdjF**
**** $$####
The first error
[VOL +] key [VOL --] key
The last error
One error beforethe last
Two error beforethe last
Total recording time
[VOL +] key [VOL --] key
[VOL +] key [VOL --] key
[VOL +] key [VOL --] key
[VOL +] key [VOL --] key
**** 1 ####
**** N ####
**** N1####
**** N2####
**** R_####
15
MZ-RH1
5-2. Error Code of The Self-Diagnosis Result DisplayMode
“##” : Key voltage of remote commander. (Hexadecimal number)
3. To release the Key Check mode, open the upper panel andreturn to the Display check mode.
16
MZ-RH1
3. ADJUSTMENT OF THE EACH ITEM3-1. Initialize The Adjustment ValueProcedure:
1. In the test mode (Display Check mode), press the [VOL--] keyto enter the Overall adjustment mode.
2. Press the [T MARK] key and display “1911 ResOK?”.3. Press the X key to display “1911 Reset!” and initialize the
adjustment values.4. Press the x key and back to Display Check mode.
3-2. Power Supply Voltage AdjustmentAdjustment must be done with the following order.
3-2-1. SettingProcedure:
1. Apply the voltage of 3.7 V to W401 (BATT+) and W402(BATT–), and enter the test mode (Display Check mode).
2. Press the [VOL+] key to enter the Manual mode.3. Press the [VOL+] key twice to display as follows.
4. Press the > key once, press the [VOL+] key once, and pressthe > key once again to display as follows.
5. Repeat the next procedures (3-2-2. PwrAdj Adjustments), andadjust all contents of “table 3-2-1. PwrAdj Specifications”.
3-2-2. PwrAdj adjustmentsRepeat the following procedures and adjust all contents of “table 3-2-1. PwrAdj Specifications”.
Example Display (Item No. 2211)
Procedure:1. Connect the digital voltmeter to measuring point (refer to the
following table 3-2-1) and CL965 (GND).2. Press the > key to change the item number to 2211.3. Adjust with [VOL+]/[VOL--] keys so that the value of digital
voltmeter becomes specification value.4. Press the X key to write the adjusted value. (Shifts to the
next item automatically)5. Repeat adjustment from step 3 until item number 2234.
2000 POWER
SECTION 5ELECTRICAL ADJUSTMENTS
1. PRECAUTIONS FOR ADJUSTMENT1. Adjustment must be done in the test mode only. After adjusting,
release the test mode. A key having no particular descriptionin the text, indicates a set key. Also, for the display, the ELdisplay on the set is shown.
2. Use the following tools and measuring instruments.• Digital voltmeter• Regulated dc power supply (two sets)• Laser power meter• CD adjustment disc TDYS-1 (Part No. : 4-963-646-01)• MD1/HiMD1 hybrid adjustment disc MDW-74/GA2
(Part No. : 8-892-388-38) *1• USB cable, AC power adapter and AC cord in accessories
*1) Hi-MD3 adjustment disc (HMD1GSDJ) is consumable.Therefore if it is used 400 times, exchange it for a new.
2. ADJUSTMENT SEQUENCEAdjustment must be done with the following order.
Adjustment order:1. Entering the test modeNote: Enter the test mode with a key.2. Initialize the adjustment value3. Power supply voltage adjustment4. Charge function check5. Laser power check6. Setting the adjustment values7. Servo Overall adjustment8. Resume clear9. Releasing the test mode
2210 PwrAdj
adjustment value (hexadecimal)
2211 VC1 **
17
MZ-RH1
Item No. Display Specification value Measuring point
2211 VC1 ** 2.05V + 0.02V TP8065
2212 VC1H N ** 2.25V ± 0.01V TP8065
2213 VC2L ** 1.50V + 0.01V CL8001
2214 VC2H ** 1.50V + 0.01V CL8001
2217 REG1 L ** 3.02V ± 0.02V CL954
2218 REG1 H ** 3.02V ± 0.02V CL954
2219 REG2 1 ** 2.275V ± 0.01V CL951
2221 REG2 2 ** 2.480V ± 0.01V CL951
2222 REG2 3 ** 2.740V ± 0.01V CL951
2223 REG2 4 ** 2.985V ± 0.01V CL951
2224 REG3 ** 2.52V ± 0.02V CL947
2225 VREC 1 ** 0.75V ± 0.02V CL601
2226 VREC 2 ** 0.80V ± 0.02V CL601
2227 VREC 3 ** 1.52V ± 0.02V CL601
2228 VREC 4 ** 2.17V ± 0.02V CL512
2229 VREC 5 ** 2.78V ± 0.02V CL512
2231 VREC 6 ** 0.75V ± 0.02V CL601
2232 VREC 7 ** 0.90V ± 0.02V CL601
2233 VREC 8 ** 2.10V ± 0.02V CL601
2234 VREC 9 ** 2.70V ± 0.02V CL601
Note1: “**” is adjustment value (hexadecimal number).Note2: Ground point of all measuring points is CL965.Note3: Item number 2228, 2229 are adjusted with the mechanism deck
connected.Table 3-2-1. PwrAdj Specifications
3-2-3. VBsAdj adjustmentsProcedure:
1. In the “3-2-2. PwrAdj Adjustments” completed status, displayas follows.
2. Apply the voltage of 5 V to CL441 (VBUS 5V) and CL445(VBUS GND).
3. Press the > key to change the item number to 2241.4. Adjust with [VOL+]/[VOL--] keys so that the value of digital
voltmeter becomes specification value. (Refer to “table 3-2-2. VBsAdj Specifications”)
5. Press the X key to write the adjusted value.6. Repeat adjustments to item number 2242 at the same manner
as step 4 to step 5.7. Select the item number 2244, and turn off the power supply of
applying to W401 (BATT+) and W402 (BATT–).8. Repeat adjustments to item number 2244, 2245 and 2246 at
the same manner as step 4 to step 5.9. Apply the voltage of 3.7 V to W401 (BATT+) and W402
(BATT–) again.10. Turn off the voltage of 5 V to CL441 (VBUS 5V) and CL445
(VBUS GND).11. Press the x key three times and back to the Display Check
mode.
CL441CL445
CL601
TP8065CL8001
CL512
CL947
CL965 CL954
CL964
CL951
W402
W401
– MAIN Board (Conductor Side) –
SL802
Adjustment Location:
2240 VBsAdj
18
MZ-RH1
Item No. Display Specification value Measuring point
2241 REG4 ** 1.13 V ± 0.01 V CL8001
2242 REG5 ** 2.05 V + 0.02 V TP8065
2244 DDC5 N ** 4.20 V – 0.02 V CL964
2245 DDC5 C ** 4.45 V – 0.02 V CL964
2246 DDC5 L ** 4.20 V – 0.02 V CL964Note1: “**” is adjustment value (hexadecimal number).Note2: Ground point of all adjustment points is CL965.Note3: Refer to page 17 for adjustment location.
Table 3-2-2. VBsAdj Specifications
3-3. Charge Function CheckNote1: When perform this check, don’t apply a voltage to battery terminals.Note2: Be sure to turn the power off when connecting the resistor. Doing
so with the power supply connected causes a trouble.
Procedure:1. Connect the resistor (10Ω, more than 3W) to battery terminals.2. Connect the USB cable, AC adapter and AC cord, and turn the
power on.3. Enter the test mode (Display Check mode).4. Press the [VOL+] key to enter the Manual mode.5. Press the [VOL+] key twice, press the > key once, press the
[VOL+] key once.6. Press the > key once, press the [VOL+] key twice to display
as follows.
7. Press the > key to select the item number 2251.
8. Press the X key to check the “ADJ OK” that is displayed.9. Press the x key four times and back to the Display Check
mode.
3-4. Laser Power CheckProcedure:
1. Enter the test mode (Display Check mode).2. Press the [VOL+] key to enter the Manual mode.3. Open the upper panel and press the . key continuously
until the optical pick-up moves to the most inward track.4. Press the [VOL--] key once to display as follows.
5. Press the > key three times to select the item number 9111and display as follows.
6. Set the laser power meter so that the laser beam from the opticalpick-up aims at the objective lens of laser power meter at rightangle. (Confirm it with the disc not inserted)
7. Confirm that the value of laser power meter is 0.860 mW ±19.2%.
8. Press the > key to select the item number 9112.9. Confirm that the value of laser power meter is 0.763 mW ±
18.2%.10. Press the > key to select the item number 9113.11. Confirm that the value of laser power meter is 6.87 mW ±
12%.12. Press the x key four times and back to the Display Check
mode.
2250 ChrgLi
adjustment value (hexadecimal)
2251 ChrChk **
9000 DESIGN
9111 LrefPw **
19
MZ-RH1
3-5. Setting The Adjustment Values3-5-1. Hi-MD3 settingPreparation:
1. Perform calculation every item based on the data given by theHi-MD3 adjustment disc by referring to the following table.(Round off the value in decimal place)
2. Convert the calculated value into hexadecimal number.
Note: The Hi-MD3 adjustment parameters vary depending on the disc,and therefore use the parameters of the disc used when performingthe adjustment.
Item No. Calculating formula (*3)
0211 Pr_nominal / 0.05
(*1) Por / 0.05
0212 Kr × (−100)
0213 Pw_nominal / 0.05
(*2) Ppw / 0.05
0214 Kw × (−100)
0215 Prmin / 0.05
0216 Pwmin / 0.05
*1) If the “Pr_nominal” value is indicated, use the “Pr_nominal” valueand not used “Por” value.
*2) If the “Pw_nominal” value is indicated, use the “Pw_nominal” valueand not used “Ppw” value.
*3) Round off after the decimal point.Table 3-5-1. Hi-MD3 adjustment parameter
Example of Calculation:
Item No. ParameterResult
Decimal Hexadecimal
0211 Pr_nominal 2.50 mW 50 32h
0212 Kr −0.3 %/°C 30 1Eh
0213 Pw_nominal 7.35 mW 147 93h
0214 Kw −0.4 %/°C 40 28h
0215 Prmin 1.9 mW 38 26h
0216 Pwmin 5.8 mW 116 74h
Procedure:1. Enter the test mode (Display Check mode).2. Press the [VOL+] key to enter the Manual mode.3. Press the > key once, press the [VOL+] key once, and press
the > key once again to display as follows.
4. Press the > key once to select the item number 0211.5. Adjust with [VOL+]/[VOL--] keys so that the adjustment value
of EL becomes calculated value.6. Press the X key to write the adjusted value.7. Press the > key to next item.8. Repeat adjustment from step 4 until item number 0216.
3-5-2. Destination settingProcedure:
1. Enter the test mode (Display Check mode).2. Press the [VOL+] key to enter the Manual mode.3. Press the > key five time to select the item number 0113
and display as follows.
4. Adjust with [VOL+]/[VOL--] keys so that the adjustment valueof EL becomes “01” (US, Canadian models) or “81” (AEPmodel).
5. Press the X key to write the adjusted value.6. Press the x key four times and back to the Display Check
mode.
0210 DiscPr
adjustment value (hexadecimal)
0113 ******
20
MZ-RH1
3-6. Servo Overall Adjustment3-6-1. Operation of the overall adjustment modeNote1: Be sure to adjustment so that the set is horizontal and the upper
panel is upside. Unless performed in that state, it is not adjustedcorrectly.
Note2: If NG is displayed in the middle of this adjustments, perform “3-1.Initialize The Adjustment Value” and “3-5. Setting The AdjustmentValues” again, then retry this adjustments from step 1.
Procedure:1. Enter the test mode (Display Check mode).2. Press the [VOL--] key to enter the Overall Adjustment mode.3. Insert the CD adjustment disc (TDYS-1).4. Put the main unit horizontal so that the upper panel becomes
upside, and press the . key.5. Wait until “CD OK” is displayed on the EL.6. Insert the MD1/HiMD1 hybrid adjustment disc
(MDW-74/GA2).7. Put the main unit horizontal so that the upper panel becomes
upside, and press the > key.8. Wait until “MD1 OK” is displayed on the EL.9. Insert the Hi-MD3 adjustment disc (HMD1GSDJ).10. Put the main unit horizontal so that the upper panel becomes
upside, and press the [VOL+] key.11. Wait until “HMD3OK” is displayed on the EL.12. Eject the disc and close the upper panel.13. Put the main unit horizontal so that the upper panel becomes
upside, and press the [VOL--] key.14. Wait until “OfstOK” is displayed on the EL.15. Press the x key and back to the Display Check mode.
Flow of overall adjustment mode:
3-6-2. Error message in the overall adjustment modeIn the Overall Adjustment mode, if an error occurred, it displays asfollowing table.
Display Description
Close! Dose not close the lid
DfDis! Unsuitableness disc was inserted
NoChg! Does not finish the check of charge function yet
NotCD! Does not complete the CD Overall adjustment before the
MD1 Overall adjustment
NotM1! Does not complete the MD1 Overall adjustment before the
Hi-MD3 Overall adjustment
NotH3! Does not complete the Hi-MD3 Overall adjustment before
the Stray Light Offset Overall adjustment
****NG Error of item number “****”
3-7. Resume ClearProcedure:
1. Enter the test mode (Display Check mode).2. Press the [VOL+] key to enter the Manual mode.3. Press the [VOL+] key once, press the > key once, press the
[VOL--] key once, press the > key once, and press the [VOL+]
key twice, press the > key three times to select the itemnumber 1933.
4. Press the X key to resume clear.5. Press the x key four times and back to the Display Check
mode.
3-8. Releasing The Test ModeNote: When the power supply is switched on in the state where all
electrical adjustments have not finished, it is displayed on EL as“Error EE’’ and the usual operation can’t be performed. When apower supply is accidentally turn off in the middle of electricaladjustments, it is again set as test mode and electrical adjustmentsis mode to complete.
• Note For Printed Wiring Boards and Schematic Diagrams
• MAIN board is multi-layer printed board.However, the patterns of intermediate-layer have not been in-cluded in this diagrams.
• Lead Layouts
Note on Schematic Diagram:• All capacitors are in µF unless otherwise noted. (p: pF)
50 V or less are not indicated except for electrolytics andtantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specified.• f : internal component.• C : panel designation.
• A : B+ Line.• Power voltage is dc 3.7 V and fed with regulated dc power
supply from battery terminal.• Voltages and waveforms are dc with respect to ground
under no-signal conditions.no mark : PLAYBACK( ) : REC
∗ : Impossible to measure• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-tion tolerances.
• Waveforms are taken with a oscilloscope.Voltage variations may be noted due to normal produc-tion tolerances.
• Circled numbers refer to waveforms.• Signal path.E : PLAYBACKj : RECJ : OPTICAL INF : LINE INd : USB input from PCG : USB output to PCN : MIC IN
Note on Printed Wiring Board:• X : parts extracted from the component side.• Y : parts extracted from the conductor side.• f : internal component.• : Pattern from the side which enables seeing.(The other layers' patterns are not indicated.)
Caution:Pattern face side: Parts on the pattern face side seen from(Conductor Side) the pattern face are indicated.Parts face side: Parts on the parts face side seen from(Component Side) the parts face are indicated.
Lead layout of conventional IC CSP (chip size package)
• The voltage and waveform of CSP (chip size package)cannot be measured, because its lead layout is differentform that of conventional IC.
* Replacement of IC401, IC501, IC601 and IC701 on theMAIN board used in this set requires a special tool.
* Replacement of IC401, IC501, IC601 and IC701 on theMAIN board used in this set requires a special tool.
surface
Note:The components identi-fied by mark 0 or dottedline with mark 0 are criti-cal for safety.Replace only with partnumber specified.
Note:Les composants identifiés parune marque 0 sont critiquespour la sécurité.Ne les remplacer que par unepièce por tant le numérospécifié.
2 IC451 8 (OSCOUT)
500 mV/DIV, 20 µs/DIV
30.6 µs
1 Vp-p
5.7 µs
2,4 Vp-p
1 IC901 yd (CLT)
500 mV/DIV, 2 µs/DIV
• AbbreviationCND : Canadian model
MZ-RH1
2525MZ-RH1
6-4. SCHEMATIC DIAGRAM – MAIN Section (1/7) – • See page 36 for IC Block Diagrams.
C702
R7
05
R7
06
R7
07
L701 22µH
22µH
R708
L703
R709
CL
74
9
CL
75
0
CL
75
1
CL760
CL761
C716
R702 R703 R704
CL722
CL723
CL724
CL725
CL726
CL727
CL728
CL729
CL730
CL731
CL732
CL
73
3
CL
73
4
CL
73
5
CL
73
6
CL
73
7
CL
73
8
CL
73
9
CL
74
0
CL
74
1
CL
74
2
CL
74
3
C705
C706
CL705
CL706
R5
05
R5
06
CL
53
2
CL
53
3
CL
53
4
CL
53
9
CL
53
8
CL541 R508
C526
C527
C528
C532C524
CL545
CL543
CL544
R501 R502
C512
C5
02
C5
03
C5
04
C505
C534C523C522
C514
C513
R503
R504
C515
CL527
C508
C506
C5
07
C509
CL546
CL540
C518
C516
CL528
CL529
CL530
BP701
C717
CL501
CL502
CL503
CL504
C540
C543
CL507
CL508
CL509
CL510
CL513
CL514
CL515
CL516
CL517
CL518
CL519
CL520
CL521
CL522
CL523
CL524
CL525
CL526
TP512
C501
R515
R517
R516
R514
Q503
R511
R510
R513
R512
CL547 C546 C547
R701
C536
C537
L50210µH
L50110µH
CN501
L504 10µH
10µH
10µH
L505
L503
L50610µH
CN701
C535
C542
C5
20
C5
19
CL531
C510
C5
11
IC501
C708
C710
C712
CL
74
5
CL
74
7
C715
C714
C713 CL752
CL757
CL756
CL755
CL754
CL753
FB501
IC701
Q502
C538
CL512
Q501
C541
CL
53
7
CL
53
5
CL
53
6
0.1
2.2
k
2.2
k
2.2
k
0
0
1
10k 10k 10k
0.1
0.1
0 0
0
0.1
0.047
0.047
4700p
1000p
1k 2.2k
0.01
0.1
0.1
0.1
0.1
0.111
1000p
4700p
2.2k
4.7k
10p
4700p
10
p
10
p
0.1
0.1
0.01
0.47
0.1
4.76.3V
0.1
100k
100k
22k
100k
RT2C00M-TP
47k
10k
47k
10k
0.1 4.76.3V
1k
0.1
4.76.3V
26P
10P
4.76.3V
1000p
0.0
1
0.1
0.1
0.1
SN761060ZQLR
0.022
0.022
0.022
0.022
0.022
0.022
BD6608GLV-E2
2SC5383-TP-1F
0.1
(VREC(MDVCC))
2SA2018TL
4.76.3V
A1
A2
A3
B1
B2
B3
B4
A4
A5
B5
B6
SLD_MON_U
SLD_MON_V
SLD_MON_W
FFI
FRI
FCS+
FCS-
TRK+
TRK-
TFI
TRI
SL
D_
PW
M
SLD
_C
ON
_W
SLD
_C
ON
_V
SLD
_C
ON
_U
CLV
_M
ON
_W
CLV
_M
ON
_V
CLV
_M
ON
_U
CLVW
CLVV
CLVU
SLEDW
SLEDV
SLEDU
CLVW
CLVV
CLVU
TE FE
AB
CD
VR
EF_
MO
N
XR
ST_R
F
SS
B_
DA
TA
SS
B_C
LK
SS
EL
FS256OUT
ADIP
S_MON
F
APCREF_DA
IIN
DJX
JY
IYIXIX VC
VIN
VR
EF
D
A
B
C
JX
JY
IY A
OFTRK
PEAK
RFI
TRK-
TRK+
FCS-
FCS+
XLDOM
D
C
B
A
IX
IY
JX
JY
PD_SO
PD_SI
F
IIN
VREF
PLSE_XDC
MDVCC_CTL
BOTM
CLV
N
CLV_PWM
CLV_CON_W
CLV_CON_V
CLV_CON_U
HI_Z_SLD
HI_Z_SPDL
XRST_MTR_DRV
SLEDU
SLEDV
SLEDW
CLVN
CPUI2
CPVI2
CPWI2
COM2
CPUO2
CPVO2
CPWO2
FI1
RI1
FO1
RO1
FI2
RI2
NC
RO2
FO2
PG
ND
UV
1
PG
ND
W1
PG
ND
W2
PG
ND
W2
PG
ND
1
PG
ND
2
GN
D
VM
U1
VM
VW
1
VM
U2
VM
U2
VM
VW
2
VM
VW
2
VM
F1
PG
ND
UV
2
PG
ND
UV
2
WO
2
WO
2
VO
2
VO
2
UO
2
UO
2
PW
M2
WI2
VI2
UI2
CP
WO
1
CP
VO
1
CP
UO
1
CO
M1
CP
WI1
CP
VI1
CPUI1
WO1
VO1
UO1
PWM1
WI1
VI1
UI1
ST2
ST1
STALL
VG
VCC
VMR2
VMF2
VMR1
NC
NC
CLK
CCSL2
CDN
ADFG
WPP_LPF
SMON
PD_BUF
PD_NI
PD_I
PDO_SOURCE
PDO_SINK
A_C
TE FE
AB
CD
AD
IP_
IN VC
CIG
DG
ND
XR
ES
ET
VG
IN
SB
US
SC
K
SS
EL
NC
DV
CC
IX PS
EQ
AG
ND
OFC
_C
1
OFC
_C
2
VR
EF1
0
RF_
IX
RF_
IY
RF_JY
RF_
JX
D_
C
RFO
VR
EF09
NPPO
AVCC2
OFTRK
TON_C
PEAK
D
A
B
C
AVCC
JX
JY
IY
SLEDW
SLEDV
SLEDU
SLEDN
HD_DRV-
HD_DRV+
CLVW
CLVV
CLVU
TRK+
FCS-
FCS+
TRK-
L1
L2
CONT
PLSE_XDC
PVCC
IIN
LDK
MDVCC
GND
F
VREF
VCC
S1
JY
JX
IY
IX
A
B
C
D
SO
(1/7)
BOTM
RF AMP,FOCUS/TRACKING ERROR AMP
CLVN
-1-2
LD CONTROL
FOCUS/TRACKING COIL DRIVE,
SPINDLE/SLED MOTOR DRIVE
Q501,502
B+ SWITCH
V
U N
W
V
U N
W
(SPINDLE)
OVER WRITE
HEAD UP/DOWN
(SLED)
M702
M701
M703
∗
CSP
(Chip Size Package)
CSP
(Chip Size Package)
∗
(Page28)
(Page 26)
(Page 28)
(Page30)
(Page26)
MZ-RH1
2626MZ-RH1
6-5. SCHEMATIC DIAGRAM – MAIN Section (2/7) – • See page 36 for IC Block Diagrams.
R610
R635
L604100µH
R622 R623 R626
L6034.7µH
R630
R631
C604
C605
C606
D604
D602
IC681
C686C690
C681
C684
C682
CL683
CL601
TP601
C615
R602
IC602
R629
R624
Q611
Q609
Q612
D601
C618 C621C616C617
C639
C633
C634
C631
R634
C635
C601
C608
C609
R604
R605
C610
C611
C612
C613
R608
R606
FB683
FB684
FB685
FB686
Q681
D686
D682
D683 D684
R682 D685
FB692
FB681
L60110µH
Q601
C627
IC604
C629
R657
R656
R614
R617
R616
R649
R648
R647
R601
C649C646 C653C652
C647
C650
R645 R646
R643
R644Q610
R642
R641
R640
R639Q608
R652
R653 R637
R651
R650
Q682
R603
IC601
R681
D681
C687
CL
69
9
CL
69
8
CL696CL697
CL670
CL688
CL689
CL690
CL691
C642
IC605
IC608
R658
R654
CL
62
1
CL
62
2
CL624
CL625
CL626
CL619
CL628
CL629
CL630 D610
Q606
Q604
Q603R612
R613
CL607 CL
60
9
CL
60
8
CL
61
0
CL
61
8
CL602
CL603
C614C603
D605
CL612
CL671
CL681
C691
C685
W682
W681
D603
C607
D607
D608
IC606 IC607
IC682
Q613
R627
R615
1
0
10 1 1
2.2
2.2M
22 6.3V
22 6.3V
22 6.3V
MA2SD32008S0
MA2SD32008S0
SN74LVC541ARGYR
0.1100p
0.047
0.047
0.01
1010V
22k
XC61CN1702NR
220
1M
RT3WLMM-TP-1F
RT3WLMM-TP-1F
2SK354700LS0
MA2SD3100LS0
0.01 0.01147
6.3V
4.7
4700p
2210V
0.01
1M
4.7
2.2
0.1
0.1
470k
1M
0.1
0.1
0.1
1
10k
2.2M
CPH5614-TL-E
MA22D1700LS0
MA22D1700LS0
MA22D1700LS0 MA22D1700LS0
470k BAT54XV2T1
NTHC5513T1G
0.1
TC7SL32FU(TE85R)
0.1
0
0
100k
22k
470k
470k
47k
100k
22
11 0.010.01
1
1
470k 470k
470k
220kMTM232230LS0
100k
470k
470k
220kMTM232230LS0
1M
0 1M
470k
0
MCH6617-TL-E
220
SC901585VAR2
470k
BAT54XV2T1
0.1
1
BH12PB1WHFV-TR
XC6213B152NR
1M
0
NSR0320MW2T1G
RTQ035P02TR
2SC5383-TP-1F
2SC5383-TP-1F470k
470k
0.0220.01
MA2SD32008SD
100p
106.3V
MA2SD32008S0
0.1
MA2SD32008S0
MA2SD32008S0
BH15PB1WHFV-TR BH33PB1WHFV-TR
SN74LVC157ARGYR
2SK354700LS0
1k
100k
D11
A1
A2
A3
A4
A5
C1
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
3.3V_REG
1.5V_DVDD
1.5V_AVDD
VBUS_DET
XCS_REC_USB
HB
B
HA
B
HB
HA
XR
ST1
RS
T O
UT
XR
ST2
RST OUT
USBHOLD2
VBUS_VB_CTL
USB_WAKE
EFM
_S
EL
HN
L
HB
B
HN
H
HA
B
HB
HP
L
HA
HP
H
RE
G5
_R
EG
XC
E_EFM
_C
TL
USBDVDD_HI
REC
P
CH
OP
PE
RC
LK
EFM
O
FS
4
SO
0
SC
K0
XR
ST
REG F
USBHOLD
REG5_OSC
REG4_DVDD
XRST2
LIME SLEEP
RST CONT
REG5 REG
SUSPEND
REG5 TSBV
2.1VREG_IN
O7
O6
O5
O4
O3
O2
O1
O0
XOE2
VCC
GND
I7
I6
I5
I4
I3
I2
I1
I0
XOE1
ST
BY
/CE
GN
D
VIN
SEL
VO
UT
ST
BY
/CE
SEL
GN
D
VIN
VO
UT
GND
VCC
VOUT
VIN
VSS
NC
STBY/CE
GND
VIN
SEL
VOUT
VDD
VOUT
CE
GND
XA
/B
1A
1B
1Y
2A
2B
2Y
GN
D
VC
C
XG
4A
4B
4Y
3A
3B
3Y
OU
TA
VG
OU
TB
VR
EC
IN
VR
EC
IN
PG
ND
2
HA
HB
PG
ND
4
CL
VC
P
VG
2
GN
D
CH
HA
B
HB
B
GN
D
RE
CP
VG
3
PG
ND
4
VB
US
SEL2
EFM
_C
LK
EFM
VIF
CL
K
DA
TA
SC
K
NC
_M
12
LATCH
XWK0
VBUS
WAKEC
V33UO
VBUS_DET
VBUSREF
L5_2
PGND5
PGND5
L5_1
PGND5
VBUSSEL
CLM
POWP2
INP3
INP2
CLP
POWP1
VPDRV
RF2
DTC2
INM2
INM3
DTC3
RF3
NC_M1
HOLD_OUT
RST_OUT
PVBUS
CRST
DVDD_IN
OSC_OUT
SLEEP_IN
RST_IN
PGND2
DVDD_OUT
HOLDC
REG_IN
REG_OUT
SUS_IN
PGND2
TSBV_IN
TSBV_OUT
V33R
PGND1
VSTB_IN
VSTB_OUT
BATSEL
V33RO
RF1
INM1
VREC
NC
_A
1
DW
_1
B
DW
_1
T
VR
EC
O_
2
VR
EC
O_
1
L1
_2
L1
_1
INP
1
UP
_1
T
UP
_1
B
GN
D
PG
ND
1
VC
VC
PG
ND
3
PG
ND
1
UP
_3B
VR
EFIN
PG
ND
3
PG
ND
3
V3
O_
1
V3
O_
2
33U
SEL
L3
_1
L3
_2
DW
_3T
DW
_3B
V3FB
(2/7)
S
SS
VOLTAGE DETECT
OR GATE
+1.2V REGULATOR
+1.5V REGULATOR
POWFB
B+ SWITCH
B+ SWITCH
CONTROL
VBUS DETECT
DTC1
B+ SWITCH
S
S
NC_A12
OVER WRITE HEAD DRIVE,
POWER CONTROL
DRIVE SELECT
BUFFER
-1 -2
-1 -2
(VREC)
Q681,682
OVER WRITE HEAD DRIVE
Q612,613
WAKE UP SWITCH
S
S
S
S
-2-1
-1
-2
Q608,609
OSC B+ SWITCH
Q610,611
B+ SWITCH
+3.3V REGULATOR+1.5V REGULATOR
CSP(Chip Size Package)
∗
HR601
OVER WRITE
HEAD
(Page 25)
(Page 28)
(Page 30)
(Page 25)
(Page 30)
(Page 27)
MZ-RH1
2727MZ-RH1
6-6. SCHEMATIC DIAGRAM – MAIN Section (3/7) – • See page 36 for IC Block Diagrams.
IC401
R414
R405
R406
Q404
R411
R410
R409
R428
Q402
R402
R403
R401
Q401
R448
R447
Q405
R408
R407
R4
22
R4
23
R4
25
R4
27
R446
R445
Q442
R444
R442
R441
C4
41
D4
41
FB4401
FB4402
FB4442
C4441
C4
05
C4
06
C4
07
C4
08
C4
10
C415
CL413
CL414
CL408
C4
01
C4
02
CL
41
8
CL
42
2
C4
13
CL
42
3
C412
CL425
CL429
CL426
D401
CL448
CL433
Q441
R4442
CL442
CL443
CL446
CL447
CL444
TP441
TP445
TP446
TP447
TP401
TP402
R404
Q406
CL424
S401
D442
C442
CL441
CL445
W401
W402
CN441
R4441
MM1690LCBE 0
2.2k
0
MTM232230LS0
100k
2.2k
2.2k
2.2k
2SD1119-Q-TX
0.47
1
1M
MTM232230LS0
470k
1M
MUN5314DW1T1G
100k
100k
10
0k
10
0k
2.2
M
22
0k
2.2M
100k
RT3WLMM-TP-1F
220
10k
220k
0.1
MA
22
D2
80
0L
S0
2200p
0.1
0.1
0.0
1
0.1
0.1
0.1
22
10
V
22
10
V
0.1
0.1
NSR0320MW2T1G
RTQ035P02TR
0
(CHASSIS)
0.022
DTC144EET1
MA8056-L-TX
0.047
(VBUS 5V)
(VBUS GND)
(BATT+)
(BATT-)
7P
0
E6
C1
E1
E2
E3
E4
E5
IAMP_CTL
CHG_PWM
CHG_CTL
XI_
SE
NS
E
CH
G_M
ON
CH
G_
I_S
EL
I_S
EL2
IAMP_CAL
I_SEL1
BA
TT_M
INU
S_M
ON
XG
UM
_O
N
VBUS_MON
USB_CHARGE
VB_MON
UDM
UDP IAMP_CAL
BAT-
RF1
IAMP_CAL
AMP_SEL
I_CTL2
CHG_SW1
BAT+
VO
VI2
VG
PW
T
VI_
CT
L
CH
G_
SW
2
VI
CH
G_
CT
L
PW
R_W
AK
E
RS
I_C
TL
3
A/D
GN
D
I_C
TL
1
PG
ND
I_S
EL
AD
_S
EL
WDT
TYPE1
IN1-
A7CAL_SW
IAMP_CTL
CFB
TYPE2
LED_CTL
(3/7)
S
-2
-1Q404,405
USB CHANGE ON/OFF
CURRENT LIMITTER
CHARGE CONTROL
CHARGE CONTROL
CHARGE SWITCH
S
BATTERY INSERT
DETECT
-1-2
Q441,442
VBUS LIMITTER
(USB)
(Chip Size Package)
CSP∗
LITHIUM ION
RECHARGEBLE
BATTERY
(LIP-4WM)
1PC. 3.7V/370mAh
(Page 26)
(Page 30)
(Page 28)
MZ-RH1
2828MZ-RH1
6-7. SCHEMATIC DIAGRAM – MAIN Section (4/7) – • See page 24 for Waveforms. • See page 36 for IC Block Diagrams.
R920
R929
R9
21
R9
23
R9
25
R9
27
R928
C943
C944
CL963
CL958
CL959
CL960
CL954 TP954
C949
CL951
CL950
TP951
C950
CL947 TP947C942
C947
CL
94
4
CL
94
3
CL
94
0
C921C920
D905
C917
CL
93
4
CL932
C913
D904D901
C908
C909
CL920
C912
C911
D902
C905
C9
01
C9
02
CL
90
5
CL
90
4
CL
90
3
CL
90
2
CL
90
7
CL909
CL
91
0
CL911TP911
C962
C961
TP965CL965
TP964
CL961
C9
33
L905220µH
C9
31
C9
30
SL901
R937
R944
R948
R938R945
R941 R950
R951
R942
R943 R952
R953
R912
R913
L903220µH
R901
R903
R908
R906
R902
L901 220µH
R905
R907
R931
R930
R935 R936
R934
C9
28
R918
R9
16
R9
17
L904
IC961
R962
R961
IC901
Q901
R939
C955
C954
R949
C956
D906
CL924
Q902
D903
CL964
10k
470k
22
0k
47
0k
47
0k
10
0k
0
2.2
0.01
2.2
2.2
4700p
2.2
2210V
476.3V
HR
C0201A
TR
F-E
0.1
0.022
HRC0201ATRF-EHRC0201ATRF-E
0.1
0.1
0.022
0.1
HRC0201ATRF-E
11 10
16
V
1
1
10
00
p
0.1
22
10
V
2.2
47k
22k
2.2
100k
100k
47k
100k
0
47k
22k
47k47k
100k
100k
100k
10k
1M
470k
1M
100k
47k
47k
470k 0
47k
22
05
V
220k22
k
22
k
0
XC6213B312MR
1M
0
SC901584EPR2
RT3WLMM-TP-1F
4.7
1
1
220k
1
HRC0201ATRF-E
2SC5383-TP-1F
HRC0201ATRF-E
E6
F7
B1
B2
B3
B4
D1
D2
D3
D4
D5
D6
D7
D8
D9
E1
E2
E3
E4
F1
F2
F3
F5
F6
G1
D11
B6
G2
VG
VB
HA
LF_LO
CK
RM
C_
KE
Y
RE
C_
KE
Y
FS4
SCKO
XCS_PWR_IC
SO0
MUTEON
WK
_D
ET
XR
ST1
XR
ST2
RE
G5
TS
BV
REG03
XRST1
CRST1
XRST1ADJ
DTC1
RF1
INM1
CIL
VG
LG
PGND3
VB
VGSEL2
VGSEL1
INM2
RF2
DTC2
XR
ST
2
PG
ND
2
PG
ND
2
L2
L2
VO
2
VC
O2
VC
IN
VC
2
DW
_2
T
DW
_2
B
MU
TE
ON
PG
ND
1
PG
ND
1
L1
L1
VO
1
VC
O1
VC
1
VS
TB
HV
B
LV
B
VR
MC
XW
K1
XW
K2
XW
K3
XW
K4
FFC
LK
SLEEP
CLK
SEQSEL
WDT
SCL
STRB
DATA
VREF
GND
REGI1
REGO1
REGC1
REGO2
REG2G
REGC2
VDD
GND
CE
VOUT
NC
(4/7)
-1-2
POWER CONTROL
RE
GC
3
RE
GO
3
RE
GI3
REGI2
CR
ST
2
(REGO3)
(REGO1)
(REGO2)
(GND)
INVERTER
(VB/DDC5)
WAKE UP DETECT
+3.1V REGULATOR
(Page 30)
(Page 29)
(Page25)
(Page 27)
(Page 25)
(Page 31)
(Page 29)
(Page 26)
MZ-RH1
2929MZ-RH1
6-8. SCHEMATIC DIAGRAM – MAIN Section (5/7) – • See page 36 for IC Block Diagrams.
C253
C364
C362
C361C359
CL151
CL251
C357
C356C353
CL352
CL353
CL354
CL355
C252C152
C153
TP351
TP352
TP353
TP354
TP355
TP151
TP251
TP356
C366
R3351
R310
R3301
TP302
TP303
TP304
TP305
C3306
TP301
R3
04
C3
11
C314
C313
C315
R306
R101
R201
C307 C308 C309 C101 C201R302
R305
C301
C302
R301
L10147µH
L20147µH
C202 C203 C102 C103
R308
C316
R203
R103
C205
C105
C317
CL313
TP101
TP201
C363
C360
C151
C251
C358
C3
55C354R361
R360
R351
R352
R353
C352
R151 R251
R152
R252
C154 C254
R358
R357
C3353
R359R354
R355
R356
C3360
FB3354
FB2251
FB1151
FB3352
FB3351
C255C155
C156 R153 R154 R253 R254
C3361
TP152
TP252
TP358
FB1152
FB2252
FB3353
TP357
C3302
C3304
IC301
FB3302
FB3303
FB3304
FB3305
FB3301
CL
31
0
CL
30
9
C310
CL
30
6
CL
30
7
CL
30
8
CL311
CL302
CL101
CL201
CL
30
3
C306 C303 C304 C305
CL
30
5
CL
30
4
CL301
C104
C204
Q201
Q101
CL203
CL103
Q302
R309
R284 R184
FB1101
FB2201
D3301D3302
J351
J352
J301
D3303
D201D101
Q301
C369 C368
IC351
Q351
R312 F301
IC302
C256
4.76.3V
10 6.3V
47 6.3V
47 6.3V2.26.3V
2.26.3V
476.3V
106.3V
474V
474V
4.76.3V
106.3V
100
1M
0
2200p
0
0.1
1
1
1
0
0
0
0.1 1 0.1 1 122k
22
1
1
0
0.1 0.22 0.1 0.22
1k
0.47
2.2k
2.2k
0.1
0.1
0.1
0.1
0.1
1
1
0.1
0.1
0.110
10
1k
1k
10
0.1
22k 22k
47k
47k
100p 100p
100k
10k
0.1
1k100
2.2k
2.2k
2200p
1000p1000p
0.1 22k 10k 10k 22k
2200p
1000p
0.01
CXD9847K
0
0
47
226.3V
106.3V
1006.3V
1006.3V
476.3V
4702.5V
4702.5V
2SC5585TL
2SC5585TL
US6K1TR
47k
2.2k 2.2k
MAZB068H0LS0MAZB068H0LS0
EDZTE616.8B
MA2S111-(K8).SOMA2S111-(K8).SO
RT1P441U-TP-1
100p 100p
AK5356VN-L
2SA2018TL
0 0.25A 125V
MM3035FULE
0.1
F7
F1
F2
F3
F5
F6
SGND
ADDT
XBCK
FS256
LRCK
SO3
SCK3
XCS_ADC
XPD_ADC
XMIC_DET
OPT_DET
VCO1
XOPT_CTL
DIN1
XJACK_DET
RMC_DTCK
RMC_KEY
FS
512
D_EN
1
D_
EN
2
D_
EN
RE
G
BEEP
DCLSOUTL
DCLSOUTR
D_VCONT_PWM
XM
UTE
MU
TE
ON
VC1
VCO1
BCLK
MCLK
LRCK
CDTI
CCLK
CSN
PDN
MIC
L
PR
EO
L
PR
EN
L
PR
EL
PR
ER
PR
EN
R
PR
EO
R
SD
TO
DV
DD
DV
SS
AV
SS
AV
DD
VC
OM
RIN
LIN
MPWR
MRF
MVCM
MVSS
MVDD
MICR
MODE_B
BEEP_IN
DIN2
DIN1
OUT_BEEP1
VSSO
OUT1
VD
DO
1
VR
EG
O
VC
ON
T
VR
EF
CFB
VD
DO
2
EN
3
EN
2
EN
1
VD
D
VS
S
TRGI
CG
VG
CVG
OUT_BEEP2
VSSO
OUT2
CE
VOUTGND
VDD
(5/7)
S
S
LINE IN
(OPT)
MIC
(PLUG IN POWER)
DVDD
DTCK
KEY_R
/LINE OUT
MUTING CONTROL
MUTING
MUTING
Q101,201
-1
-2
A/D CONVERTER,MIC AMP
B+ SWITCH
SWITCHING DRIVER,HEADPHONE AMP
MC
K
EN
REG
VR
EG
+5.5V REGULATOR
GND
R106
R1060 (US,CND)
22 (AEP)R205
∗
∗R205
0 (US,CND)10 (AEP)
∗
∗R105
(AEP) (AEP)
R20610 22
(Page28)
(Page 31)
(Page 28)
MZ-RH1
3030MZ-RH1
6-9. SCHEMATIC DIAGRAM – MAIN Section (6/7) – • See page 36 for IC Block Diagrams. • See page 42 for IC Pin Function Description.
IC301 6-706-745-01 IC CXD9847K (TE4)IC302 6-709-231-01 IC MM3035FULEIC351 6-702-894-01 IC AK5356VN-L
@ IC401 6-707-716-01 IC MM1690LCBEIC451 6-703-012-01 IC R2061K01-E2
IC452 6-703-011-01 IC TC7SZ126AFEIC471 6-706-640-01 IC BH25FB1WG-TRIC472 6-707-762-01 IC XC9103D092MR
@ IC501 6-708-542-01 IC SN761060ZQLR@ IC601 6-705-000-01 IC SC901585VAR2
IC602 6-702-590-01 IC XC61CN1702NRIC604 6-706-214-01 IC TC7SL32FU (TE85R)IC605 6-709-240-01 IC BH12PB1WHFV-TRIC606 6-709-241-01 IC BH15PB1WHFV-TRIC607 6-709-242-01 IC BH33PB1WHFV-TR
IC608 6-709-319-01 IC XC6213B152NRIC681 6-709-180-01 IC SN74LVC541ARGYRIC682 6-709-181-01 IC SN74LVC157ARGYR
@ IC701 6-708-355-01 IC BD6608GLV-E2IC801 (Not supplied) IC CXD2687-001GG
IC802 6-709-057-01 IC R1180N121C-TR-FAIC804 6-709-505-01 IC XC6213B232MRIC891 6-805-607-01 IC AK6508CU-LIC901 6-704-997-01 IC SC901584EPR2IC961 6-709-320-01 IC XC6213B312MR
IC981 8-759-664-89 IC XC61CN3102NRIC982 6-706-094-01 IC R1180Q221B-TR-FA
< JACK >
J301 1-816-944-11 JACK (i/LINE OUT)J351 1-816-946-21 JACK (LINE IN (OPT))J352 1-816-945-21 JACK (MIC (PLUG IN POWER))
2-677-198-21 MANUAL (FOR MAC), INSTRUCTION(Hi-MD Music Transfer for Mac) (FRENCH)
2-677-198-31 MANUAL (FOR MAC), INSTRUCTION(GERMAN) (Hi-MD Music Transfer for Mac)
(AEP)2-677-198-41 MANUAL (FOR MAC), INSTRUCTION
(Hi-MD Music Transfer for Mac) (SPANISH)2-677-198-61 MANUAL (for MAC), INSTRUCTION
(Hi-MD Music Transfer for Mac) (DUTCH)(AEP)
2-677-198-71 MANUAL (for MAC), INSTRUCTION(Hi-MD Music Transfer for Mac) (ITALIAN)
(AEP)
3-220-749-01 CASE, CARRYING
902901
903
905
906 907
908
909
904
AC POWER ADAPTOR(100V-240V)
AC POWER CORD
USB CABLE
FERRITE CORE
FERRITE CORE
REMOTE CONTROL
LIP-4WM LITHIUMIONRECHARGEABLEBATTERY
RECHARGEABLEBATTERY CASE
EARPHONES
(US, CND)
(AEP)
OLED
X-2108-572-2 CD-ROM (APPLICATION) ASSY(Windows: SonicStage/MD Simple Burner,Macintosh: Hi-MD Music Transfe for Mac)
0901 1-479-577-21 ADAPTOR, AC (AC-S508U) (US, CND)0901 1-479-577-31 ADAPTOR, AC (AC-S508U) (AEP)0902 1-823-935-61 CORD, AC POWER (for AC ADAPTOR) (AEP)
0902 1-824-910-41 CORD, POWER (for AC ADAPTOR) (AEP)0902 1-829-810-31 CORD, POWER (for AC ADAPTOR) (US, CND)
909 1-400-878-11 FILTER, CLAMP (FERRITE CORE)(for USB CABLE)
Note: IC1 and S8 on the OLED board can not be exchangedalone. When IC1 and S8 on the OLED board aredamaged, exchange the complete OLED board.
Note: For the installation position of ferrite core, see “POSITION OFFERRITE CORE)” (Page 11).
2
MZ-RH1
REVISION HISTORY
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