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HCD-GNX660Mexican ModelSERVICE MANUAL
MINI HI-FI COMPONENT SYSTEM
SPECIFICATIONS
Ver. 1.2 2007.12
– Continued on next page –
• HCD-GNX660 is the Amplifier,CD player, tape deck and tunersection in MHC-GNX660.
Model Name Using Similar Mechanism HCD-GNX880
CD CD Mechanism Type CDM74KFS-F1BD84
Section Base Unit Name BU-F1BD84
Optical Pick-up Name KSM-215DCP/C2NP
TAPE Model Name Using Similar Mechanism HCD-GNX880
Section Tape Transport Mechanism Type CWN42FF601
Amplifier sectionThe following are measured at 127 V AC, 60 HzFront speakersDIN power output (rated) 130 + 130 watts
(6 ohms at 1 kHz, DIN)Continuous RMS power output (reference)
160 + 160 watts(6 ohms at 1 kHz, 10% THD)
Sub wooferContinuous RMS power output (reference)
200 watts(4 ohms at 100 Hz, 10% THD)
TV (AUDIO) IN (phono jack) voltage 250 mV,impedance 47 kiloohms
MIC (phone jack) sensitivity 1 mV,impedance 10 kiloohm
VIDEO OUT (phono jack) max. output level1 Vp-p, unbalanced, Syncnegative, load impedance75 ohms
PHONES (stereo mini jack) accepts headphones o8 ohms or more
FRONT SPEAKER/SUB WOOFER OUTUse only the suppliedspeaker
Disc player sectionSystem Compact disc and digital
audio systemLaser Semiconductor laser
(λ=780 nm)Emission duration:continuous
Laser Output Max. 44.6 µW** This output is the valuemeasured at a distance of200 mm from the objectivelens surface on the OpticalPick-up Block with 7 mmaperture.
Frequency response 2 Hz – 20 kHz (±0.5 dB)Wave length 780 – 790 nmSignal-to-noise ratio More than 90 dBDynamic range More than 90 dB
Notes on chip component replacement• Never reuse a disconnected chip component.• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing• Keep the temperature of soldering iron around 270˚C
during repairing.• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTIONUse of controls or adjustments or performance of proceduresother than those specified herein may result in hazardousradiation exposure.
This appliance is classified asa CLASS 1 LASER product.This label is located on the rearexterior.
Unleaded solderBoards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.(Caution: Some printed circuit boards may not come printed withthe lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.Ordinary soldering irons can be used but the iron tip has to beapplied to the solder joint for a slightly longer time.Soldering irons using a temperature regulator should be set toabout 350°C.Caution: The printed pattern (copper foil) may peel away ifthe heated tip is applied for too long, so be careful!
• Strong viscosityUnleaded solder is more viscous (sticky, less prone to flow)than ordinary solder so use caution not to let solder bridgesoccur such as on IC pins, etc.
• Usable with ordinary solderIt is best to use only unleaded solder but unleaded solder mayalso be added to ordinary solder.
Tuner sectionFM stereo, FM/AM superheterodyne tunerFM tuner sectionTuning range 87.5 – 108.0 MHzAntenna FM lead antennaAntenna terminals 75 ohm unbalancedIntermediate frequency 10.7 MHzAM tuner sectionTuning range 530 – 1,710 kHz
(with the interval set at 10 kHz)531 – 1,710 kHz(with the interval set at 9 kHz)
Antenna AM loop antennaAntenna terminals External antenna terminalIntermediate frequency 450 kHz
Design and specifications are subject to changewithout notice.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITHMARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTSLIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESECOMPONENTS WITH SONY PARTS WHOSE PART NUMBERSAPPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTSPUBLISHED BY SONY.
2. GENERALLocating the Controls ...................................................... 5Setting the Clock ............................................................. 6
3. DISASSEMBLY3-1. Disassembly Flow ........................................................... 73-2. Side Case, Top Case ........................................................ 83-3. Loading Panel .................................................................. 83-4. Front Panel Assy .............................................................. 93-5. Tuner Pack ....................................................................... 93-6. Tape Mechanism Deck, MIC Board ................................ 103-7. PANEL Board, IR Board, VOL Board ............................ 103-8. CD Mechanism Deck ...................................................... 113-9. Back Panel, DC FAN (M891) ......................................... 113-10. MAIN Board, ADC Board ............................................... 123-11. POWER Board, SPEAKER Board .................................. 123-12. SMASTER Board ............................................................ 133-13. CDG Board, DRIVER Board, SW Board ....................... 133-14. BD84 Board, Optical Pick-up ......................................... 143-15. SENSOR Board ............................................................... 143-16. MOTOR (TB) Board ....................................................... 153-17. MOTOR (LD) Board ....................................................... 15
4. TEST MODE .............................................................. 16
8. EXPLODED VIEWS8-1. Case (Top), Back Panel Section ...................................... 638-2. Front Panel Section ......................................................... 648-3. Chassis Section ................................................................ 658-4. CD Mechanism Deck Section-1 ...................................... 668-5. CD Mechanism Deck Section-2 ..................................... 67
9. ELECTRICAL PARTS LIST ................................ 68
4
HCD-GNX660SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCKOR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostaticbreak-down because of the potential difference generated by thecharged electrostatic load, etc. on clothing and the human body.During repair, pay attention to electrostatic break-down and alsouse the procedure in the printed matter which is included in therepair parts.The flexible board is easily damaged and should be handled withcare.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused onthe disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission,observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION CHECK
Carry out the “S curve check” in “CD section adjustment” and checkthat the S curve waveform is output several times.
Ver. 1.2
CHANGE OF THE COMBINED BOARD SUFFIX
Suffix of the Main, Panel and Power combined board was changedfrom -12 to -13.Suffix of the SMASTER combined board was changed from -12 to-13 or -21 (-13 and -21 are the same patterns).
5
HCD-GNX660SECTION 2GENERAL This section is extracted
from instruction manual.
LOCATING THE CONTROLS
ALBUM + qkALBUM – qlCD esCD SYNC 8Deck A whDeck B qhDIRECTION wgDISC 1 ~ 3 qaDISC SKIP/EX-CHANGE qs Disc tray 6 DISPLAY 3Display 5
* Use the tactile dot as a reference when operating the system.
ALPHABETICAL ORDER
A – E
F – Z
SYMBOLS
7
5
q;
qg
qh
qj
qk
w;
ws
wd
wg
wh
qf
qd
qs
qa
9
8
6
4
31 2
ql
wa
wf
Use buttons on the remote for the operation.
1 Press ?/1 to turn on the system.
2 Press CLOCK/TIMER SET.
“CLOCK” appears in the display. Then, the hour indication flashes in the display.
3 Press –. or >+ repeatedly to set the hour.
4 Press ENTER.
The minute indication flashes in the display.
5 Press –. or >+ repeatedly to set the minute.
6 Press ENTER.
The clock starts functioning.
To adjust the clock
1 Press CLOCK/TIMER SET.“SET” appears in the display, then “PLAY SET” flashes in the display.
2 Press –. or >+ repeatedly to select “CLOCK SET”, then press ENTER.The hour indication flashes in the display.
3 Do the same procedures as step 3 to 6 above.
Notes The clock settings are canceled when you disconnect
the power cord or if a power failure occurs.
You cannot set the clock in Power Saving Mode (page 23).
Setting the clock
7
HCD-GNX660SECTION 3
DISASSEMBLY
• This set can be disassembled in the order shown below.
3-1. DISASSEMBLY FLOW
3-2. SIDE CASE, TOP CASE(Page 8)
3-3. LOADING PANEL(Page 8)
3-4. FRONT PANEL ASSY(Page 9)
3-5. TUNER PACK(Page 9)
3-10. MAIN BOARD, ADC BOARD
(Page 12)
3-8. CD MECHANISM DECK(Page 11)
3-7. PANEL BOARD, IR BOARD,
VOL BOARD(Page 10)
3-6. TAPE MECHANISM DECK,MIC BOARD
(Page 10)
3-13. CDG BOARD DRIVER BOARD,
SW BOARD (Page 13)
3-11. POWER BOARD, SPEAKER BOARD
(Page 12)
3-16. MOTOR (TB) BOARD(Page 15)
3-17. MOTOR (LD) BOARD(Page 15)
3-15. SENSOR BOARD(Page 14)
3-12. SMASTER BOARD, (Page 13)
3-9. BACK PANEL, DC FAN (M981)
(Page 11)
3-14. BD84 BOARD, OPTICAL PIC-UP
(Page 14)
SET
8
HCD-GNX660
Note: Follow the disassembly procedure in the numerical order given.
3-2. SIDE CASE, TOP CASE
3-3. LOADING PANEL
2 screw (case 3 TP2) (3×12)
1 screw (case 3 TP2) (3×8)
4
9
qd
3 screw (+BVTP 3×8)
5 case (side-R)
6 screw (case 3 TP2) (3×8)
7 screw (case 3 TP2) (3×12) 8 screw
(+BVTP 3×8)
0 case (side-L)
qs two screws (+BVTP 3×8)
qa two tapping screws
qf case (top)
CD mechanism deck (CDM74KFS-F1BD84)1 Turn the pulley to the arrow direction.
Front side
Pulley
2 Pull out disc tray.
3
4 loading panel
9
HCD-GNX660
3-4. FRONT PANEL ASSY
3-5. TUNER PACK
1 four screws (+BVTP 3×8)
2 tapping screw
3 tapping screw
4 front panel assy
5 wire (flat type) (CN201)
6 wire (flat type) (CN509)
7 connector (CN121)
q; connector (CN503)
8 connector (CN131)
9 connector (CN205)
1 two screws (+BVTT 3×6)
2 wire (flat type) (CN1)
3 tuner pack
10
HCD-GNX660
3-6. TAPE MECHANISM DECK, MIC BOARD
3-7. PANEL BOARD, IR BOARD, VOL BOARD
1 six screws (+BVTP2.6)
8 four screws (+BVTP2.6)
qa three screws (+BVTP3×8)
09 bracket (pivot)
qs bracket (TC)
qd MIC board
2 tape mechanism deck
3 spring (R)
5 holder (TC-R)
7 three mic knobs
6 holder (TC-L)
4 splring (L)
front panel
lug
7 knob (vol)
9 knob jog assy
8 accessory nut
front panel
0 VOL board
5 PANEL board
2
6 IR board
7 four screws(+BVTP2.6)
1 eighteen screws(+BVTP2.6)
3 wire (flat type) (CN1402)
4 connector (CN1452)
11
HCD-GNX660
3-8. CD MECHANISM DECK
MAIN board
1 CD mechanism deck
3 wire (flat type) (CN701)
4 wire (flat type) (CN1001) (CDG board)
2 wire (flat type) (CN351)
5 connector (CN1003) (CDG board)
2 three screws (+BVTP 3×8)
3 three screws (+BVTP 3×8)
1 screw (+BVTP 3×8)
4 screw (+BVTP 3×8)
5 two screws (+BVTP 3×8)
7 two screws (+BVTP 3×8)9 connector
(CN580)
6 back panel
8 DC fan (M891)
3-9. BACK PANEL, DC FAN (M891)
12
HCD-GNX660
3-11. POWER BOARD, SPEAKER BOARD
3 two screws (+BVTT 3×6)
4 two screws (+BVTP 3×8)
2 connector (CN501)
7 connector (CN590)
8 board to board connector (CN381,CN01)
5 shield plate (TC MAIN)
6 MAIN board
9 ADC board
1 wire (flat type) (CN105)
wa two screws (+BVTP 3×8)
7 three screws (+BVTP 3×8)
9 two screws (+BVTP 3×8)
qa tapping screw
qg screw (+BVTP 3×8)
qh three screws (+BVTP 3×8)
qk three screws (+BVTP 3×8)
8 bracket (support top)
qs bracket (support pwb)
qj bracket (SMPS 5ch)ql bracket (SMPS -B5)
qf bracket (trans 5ch)
ws SPEAKER board
w; POWER board
qd two tapping screws
q; bracket (support front)
1 screw (+BVTT 3×6)
3
2 three screws (+BVTT 3×6)
4 connector (CNP1100)
6 connector (CN1200)5 connector
(CN1101)
3-10. MAIN BOARD, ADC BOARD
13
HCD-GNX660
3-13. CDG BOARD, DRIVER BOARD, SW BOARD
3-12. SMASTER BOARD
3 two screws (+BVTT 3×6)
1 two screws (+BVTT 3×6)
2 heat sink (SMAS)
5 SMASTER board
4 three screws (+BVTT 3×6)
7 connector (CN703)
4 cover (CDM)
8 DRIVER board
2 CDG board
0 SW board
6 wire (flat type) (CN702)
5 two screws (+BTTP (M2.6))
3 three screws (+BVTP 3×10)
1 two screws (+BVTP 3×10)
9 screw (+BTTP (M2.6))
14
HCD-GNX660
3-14. BD84 BOARD, OPTICAL PICK-UP
3-15. SENSOR BOARD
4 two coil springs (insulator)
7 two coil springs (insulator)
5 two insulators
8 two insulators
q; screw (+BVTP 2.6 (3CR))
2 holder (213) ASSY
qa Remove the four solderings of motor.
qs wire (flat type) (CN101)
qd BD84 board
qf optical pick-up (KSM-215DCP/C2NP)
1 floating screw (+PTPWH M2.6)
3 two floating screws (+PTPWH M2.6)
6 two floating screws (+PTPWH M2.6)
9
2 tray
3 belt (table)
5 pulley (table)
8 screw (+BTTP (M2.6))
0 SENSOR board
7 gear (geneva)
9 connector (CN731)
1 floating screw (+PTPWH M2.6)
6 floating screw (+PTPWH M2.6)
4 floating screw (+PTPWH M2.6)
15
HCD-GNX660
3-16. MOTOR (TB) BOARD
3-17. MOTOR (LD) BOARD
6 Remove the two solderings of motor.
8 MOTOR (TB) board
7 table motor assy (M741)
5 two screws (+BTTP (M2.6))
4
3 wire (flat type) 5 core (CN742)
1 stopper
2 stopper
4 Remove the two solderings of motor.
3 MOTOR (LD) board
1 belt (loading)
5 loading motor assy (M751)
2 two screws (+BTTP (M2.6))
16
HCD-GNX660
[COMMON TEST MODE]• This mode is used to check operations of the respective sections
of Amplifier and Tape.
Procedure:* To enter Common Test Mode
1. Press x button, [ILLUMINATION] button and [DISC 3]
button simultaneously.2. The CD ring indicators and line below CD ring indicator flash
synchronously on the fluorescent indicator tube. The functionis changed to TV.
* Check of Amplifier
1. Press [EQ BAND/MEMORY] button repeatedly until a message“GEQ MAX” appears on the fluorescent indicator tube. GEQincreases to its maximum.
2. Press [EQ BAND/MEMORY] button repeatedly until a message“GEQ MIN” appears on the fluorescent indicator tube. GEQdecreases to its minimum.
3. Press [EQ BAND/MEMORY] button repeatedly until a message“GEQ FLAT” appears on the fluorescent indicator tube. GEQis set to flat.
4. When the [MASTER VOLUME] knob is turned clockwise evenslightly, the sound volume increases to its maximum and amessage “VOLUME MAX” appears on the fluorescentindicator tube.
5. When the [MASTER VOLUME] knob is turned counter-clockwise even slightly, the sound volume decreases to itsminimum and a message “VOLUME MIN” appears on thefluorescent indicator tube.
* Tape function1. When a tape is inserted in Deck B and recording is started, the
function is changed to TV automatically. When [CD SYNC]
button is pressed during recording in function, ALC(Automatic Logic Control) is turned on.
2. During recording, press m button will stop the recordingand the function is changed to TAPE B and rewind the tape inDeck B until the recording start position and playback of thetape in Deck B is started. If the [REC PAUSE/ START] buttonis pressed for a pause and pressed again to resume recordingduring recording time, when the tape is rewind, the tape willbe rewind until the position where the pause is applied.
* To release from Common Test mode.
1. To release this mode, press ?/1 button.2. The cold reset is enforced at the same time.
[COLD RESET]• The cold reset clears all data including preset data stored in
the RAM to initial conditions. Execute this mode whenreturning the set to the customer.
Procedure:1. Press button to turn on the set.2. Press x button, [ILLUMINATION/SUB WOOFER LEVEL]
button, and ?/1 button simultaneously.3. The message “COLD RESET” appears on the fluorescent
indicator tube. then, the fluorescent indicator tube becomesblank for a while, and the set is reset.
[PANEL TEST MODE]• This mode is used to check the fluorescent indicator tube,
LEDs, buttons, MASTER VOLUME knob, model,destination, software version and VACS level.
Procedure:1. Press x button, [ILLUMINATION] button and [DISC 2]
button simultaneously.2. All LEDs and segments in fluorescent indicator tube are lighted
up. All LEDs are lighted up in red color except the SUBWOOFER ON/OFF LED (green).
3. When you want to enter to the software version display mode,press [DISC 1] button. The model infomation is displayed.Press [DISC 1] button again to view destination infomation.
4. Each time [DISC 1] button is pressed, the display changes fromMC version, SYS version, UI version, CD version, CDDMversion, CDMA version, CDMB version, BDA version, BDBversion, ST version, TA version, TM version, TC version inthis order, and returns to the model version display.
5. When [DISC 3] button is pressed while the version numbersare being displayed except model and destination, the date ofthe software creation appear. When [DISC 3] button is pressedagain, the display returns to the software version display. When[DISC 1] button is pressed while the date of the softwarecreation is being displayed, the date of the software creationis displayed in the same order of software version display.
6. Press [DISC 2] button, the key check mode is activated.7. In the key check mode, the fluorescent indicator tube displays
“K 0 V0”. Turn the [OPERATION DIAL] clockwise, “K” valueincreases by one. Turn the [OPERATION DIAL] counter-clockwise, “K” value increases by one. Each time a button ispressed, “K” value increases. Press other buttons on main unitto check whether the button is detected. However, once a buttonhas been pressed, it is no longer taken into account.“V” value increases in the manner of 0,1, 2, 3 ... if [MASTER
VOLUME] knob is turned clockwise, or it decreases in themanner of 0, 9, 8, 7 ... if [MASTER VOLUME] knob is turnedcounter-clockwise.
8. When [DISC 3] button is pressed after all LEDs and segmentsin fluorescent indicator tube light up, the fluorescent indicatortube displays “VACS A”. A is VACS level which is trigger bysignal level.
9. When [DISC SKIP/EX-CHANGE] button is pressed after allLEDs and segments in fluorescent indicator tube light up,alternate segments in fluorescent indicator tube would lightup. If you press [DISC SKIP/EX-CHANGE] button again, anotherhalf of alternate segments in fluorescent indicator tube wouldlight up. When [DISC SKIP/EX-CHANGE] button is pressedagain, all segments lights off. Press [DISC SKIP/EX-CHANGE]
button again would cause all segments lights up.10. To release from this mode, press three buttons in the same
manner as step 1, or disconnect the power plug.
SECTION 4TEST MODE
?/1
17
HCD-GNX660
[VACS ON/OFF]• This mode is used to switch ON and OFF the VACS (Variable
Attenuation Control System).
Procedure:1. Press ?/1 button to turn on the set.
2. Press x button and [DIRECTION] button and [DISC 1] buttonsimultaneously. The message “VACS OFF” or “VACS ON”appears on the fluorescent indicator tube.
[TUNER STEP CHANGE]• The step interval of AM channels can be toggled between 9
kHz and 10 kHz.
Procedure:1. Press ?/1 button to turn on the set.2. Press [TUNER/BAND] button repeatedly to select the “AM”.
3. Press ?/1 button to turn off the set.4. Press [ILLUMINATION/SUB WOOFER LEVEL] button and
?/1 button simultaneously. The system will turn onautomatically. The message “AM 9K STEP” or AM 10KSTEP” appears on the fluorescent indicator tube and thus thechannel step is changed.
[CD SERVICE MODE]• This mode let you move the CD sled motor freely. Use this
mode when you want to clean the optical pick-up.
Procedure:1. Press ?/1 button to turn on the set.2. Select CD function.
3. Press x button, [ILLUMINATION/SUB WOOFER LEVEL]
button and Z OPEN/CLOSE button simultaneously.4. The CD service mode is activated. The message “SERVICE
MODE” appears on the fluorescent indicator tube.
5. With the CD in stop status, press M button to move the
optical pick-up to outside track, or press m button to moveto inside track. The message “SLED OUT” or “SLED IN”appears on the fluorescent indicator tube.
6. To turn on or off the laser, press [GROOVE] button. Themessage “LD ON” or “LD OFF” appears on the fluorescentindicator tube.
7. To release from this mode, press ?/1 button.
[CD AGING MODE]This mode can be used for operation check of CD section.
• If an error occurs, the aging operation would stops and thestatus is displayed.
• If there were no error occurs, the aging operation wouldcontinue repeatedly.
Procedure:1. Press ?/1 button to turn on the set.2. Select CD function.3. Load three discs on the disc tray.4. Press [PLAY MODE] button on the remote repeatedly to select
the “ALL DISCS” mode, and press the [REPEAT] button onthe remote repeatedly to select “REPEAT OFF” mode.
5. Press x button, [ILLUMINATION/SUB WOOFER LEVEL]
button, and[DISC SKIP/EX-CHANGE] buttonsimultaneously.The CD ring indicator and line below CDring indicator turn on afternately to indicate aging mode.
6. Aging operation is started.
7. To release from this mode, press ?/1 button or disconnectthe power plug.
Aging mode sequence:
Start (from disc 1)
Disc chucking
TOC reading
Play first track for 2 seconds
Play last track for 2 seconds
EX-CHANGE open/close
Open the disc tray
Disc skip
Close the disk tray
Change to the next disc
18
HCD-GNX660
• Display when an error occurred (CD Error Code Mode)Procedure:
1. Press x button, [ILLUMINATION/SUB WOOFER
LEVEL] button and [DISC 1] button simultaneously toenter the error code display mode.
2. The fluorescent indicator tube displays the number of totalerror.
3. Each time m or M button is pressed, display change asbelow.
4. To clear the error record, operate the cold reset. (Refer to the“COLD RESET”)
5. To release from this mode, press the ?/1 button ordisconnect the power plug.
1) Display of total error
EM**: The number of mechanical errors.ED**: The number of no disc errors after chucking the disc.
2) Display of mechanical errors
M*: The number of mechanical error (“00” is latest one)
(Rotate >. knob in the direction of either to display nexterror)$$: Not used%%: Loading related error (Second figure is not used)
D: Stop by the problem other than mechanical problem whileclosing.
E: Stop by the problem other than mechanical problem whileopening.
C: Stop by the problem other than mechanical problem whilechucking up.
F: Stop by the problem other than mechanical problem whilechucking down.
&&: Emerging error01: Stop while chucking up.02: Stop while chucking up.03: Time-out of EX-CHANGE open.05: Time-out of EX-CHANGE close.
##: Not used
Display
M*$$%%&&##00
3) Display of no disc errors
D*: The number of no disc error (“00” is latest one)
(Rotate >. knob in the direction of either to display next
error)$$: Error type
01: Focus error02: GFS error03: Setup error
%%: Not used&&:
00: No disc judgment without chucking retry.01: No disc judgment after chucking retry.
##: The state when judged as no disc01: Stop02: Setup03: TOC reading04: Access05: Playback06: Pause07: Manual search (Play)08: Manual search (Pause)
[CD REPEAT 5 LIMIT OFF MODE]• The number of repeat for CD playback is 5 times when the
repeat mode is “REPEAT ALL”. This mode enables CD torepeat playback for limitless times.
Procedure:1. Press ?/1 button to turn on the set.2. Select CD function.
3. Press x button, [CD] button and [DISC 1] buttonsimultaneously to enter the CD repeat 5 limit off mode andthe fluorescent indicator tube displays “LIMIT OFF”.
4. To release from this mode, operate the cold reset. (Refer tothe “COLD RESET”)
[CD SHIP MODE (WITH MEMORY CLEAR)]• This mode moves the optical pick-up to the position durable
to vibration and clears all data including preset data stored inthe RAM to initial conditions. Use this mode when returningthe set to the customer after repair.
Procedure:1. Press ?/1 button to turn on the set.2. Select CD function.
3. Press x button, [DIRECTION] button and ?/1 buttonsimultaneously. The set will turn off automatically.
4. After the “STANDBY” blinking display finishes, a message“MECHA LOCK” is displayed on the fluorescent indicatortube and the CD ship mode is set.
Display
D*$$%%&&##00
Display
EM**ED**
Display of total error
M m
> Display of Mechanical errors .direction direction
M m
> Display of no disc errors .direction direction
19
HCD-GNX660
[CD TRAY LOCK MODE]• This mode let you lock the disc tray. When this mode is
activated, the disc tray will not open when Z OPEN/CLOSEbutton or [DISC SKIP/EX-CHANGE] button is pressed. Themessage “LOCKED” will be displayed on the fluorescentindicator tube.
Procedure:1. Press ?/1 button to turn on the set.2. Select CD function.
3. Press x button and Z OPEN/CLOSE buttonsimultaneously and hold down until “LOCKED” or“UNLOCKED” displayed on the fluorescent indicator tube(around 5 seconds).
[TCM OFFLINE MODE]• This mode prevents set from power off automatically when
TCM is not connected.Therefore, measurements can be done even when TCM is notconnected during production.
• Procedure:
1. When the set in turned off, press [EQ BAND/MEMORY]
button, [TAPE A/B] button and ?/1 button simultaneously.The set will turn on automatically.2. The message “TCM OFFLINE” will be displayed on the
fluorescent indicator tube.
[CD SHIP MODE (WITHOUT MEMORY CLEAR)]• This mode moves the optical pick-up to the position durable
to vibration. Use this mode when returning the set to thecustomer after repair.
Procedure:1. Press ?/1 button to turn on the set.2. Select CD function.
3. Press [CD] button and ?/1 button simultaneously. The setwill turn off automatically.
4. After the “STANDBY” blinking display finishes, a message“MECHA LOCK” is displayed on the fluorescent indicatortube and the CD ship mode is set.
[CD POWER MANAGE]• This mode let you switch on or off power supply to the BU
during TUNER function.• When CD POWER is set to OFF, the power supply to the BU
is cut off during TUNER function. It will increase the timetaken to access CD when function change from TUNER toCD but it will improve tuner reception.
• When CD POWER is set to ON, the power supply to the BUis not cut off during TUNER function. It will reduce the timetaken to access CD when function change from TUNER toCD but it will decrease tuner reception performance.
Procedure:1. Press ?/1 button to turn on the set.2. Select CD function.
3. Press ?/1 button to turn off the set.
4. Press x button and ?/1 button simultaneously. The setwill turn on automatically.
5. The message “CD POWER ON” or “CD POWER OFF” willbe displayed on the fluorescent indicator tube.
20
HCD-GNX660
SECTION 5MECHANICAL ADJUSTMENTS
SECTION 6ELECTRICAL ADJUSTMENTS
Precaution1. Clean the following parts with a denatured alcohol-moistened
swab:record/playback heads pinch rollerserase head rubber beltscapstan idlers
2. Demagnetize the record/playback head with a headdemagnetizer.
3. Do not use a magnetized screwdriver for the adjustments.4. After the adjustments, apply suitable locking compound to
the parts adjusted.5. The adjustments should be performed with the rated power
supply voltage unless otherwise noted.
Torque Measurement
2.9 mN • m to 6.9 mN • m
FWD CQ-102C 30 to 70 g • cm
(0.42 – 0.97 oz • inch)
FWD0.15 mN • m to 0.59 mN • m
back tensionCQ-102C 1.6 to 6 g • cm
(0.022 – 0.08 oz • inch)
4.8 mN • m to 16.7 mN • m
FF/REW CQ-201B 49 to 170 g • cm
(0.69 – 2.36 oz • inch)
Mode Torque meter Meter reading
0 dB=0.775 VDECK SECTION
1. Demagnetize the record/playback head with a headdemagnetizer.
2. Do not use a magnetized screwdriver for the adjustments.3. After the adjustments, apply suitable locking compound to the
parts adjust.4. The adjustments should be performed with the rated power
supply voltage unless otherwise noted.5. The adjustments should be performed in the order given in
this service manual. (As a general rule, playback circuitadjustment should be completed before performing recordingcircuit adjustment.)
6. The adjustments should be performed for both L-CH and R-CH.
7. Switches and controls should be set as follows unless otherwisespecified.
• Test Tape
RECORD/PLAYBACK HEAD AZIMUTH ADJUSTMENT
DECK A DECK B
Note: Perform this adjustments for both decksProcedure:
1. Mode: Playback
Tape Signal Used forP-4-A100 10 kHz, –10 dB Azimuth Adjustment
set
MAIN boardCN121Pin 3 (L-CH)Pin 1 (R-CH)
MAIN boardCN121Pin 2 (GND)
+–
level meter
test tapeP-4-A100(10 kHz, –10 dB)
21
HCD-GNX660
2. Turn the adjustment screw and check output peaks. If the peaksdo not match for L-CH and R-CH, turn the adjustment screwso that outputs match within 1dB of peak.
3. Mode: Playback
4. After the adjustments, apply suitable locking compound tothe pats adjusted.
Adjustment Location: Playback Head (Deck A).Record/Playback Head (Deck B).
Screwposition
L-CHpeak
within1dB
Outputlevel
L-CHpeak
R-CHpeak
within1dB
Screwposition
R-CHpeak
MAINboardCN121set
test tapeP-4-A100(10 kHz, –10 dB)
pin 1
oscilloscope
L-CH
R-CH
V H
waveform of oscilloscope
in phase 45° 90° 135° 180°
good wrong
pin 2
pin 3
L
R
CDG SECTION
Note:1. CDG Block is basically designed to operate without
adjustment. Therefore, check each item in order given.2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.3. Use an oscilloscope with more than 10MΩ impedance.4. Clean the object lens by an applicator with neutral detergent
when the signal level is low than specified value with thefollowing checks.
S-curve CheckConnection:
Procedure:1. Connect an oscilloscope to test point JPO102 (FE1) and TP
117(VC) on the BD84 board.2. Turn the power on.3. Put the disc (YEDS-18) in and turned power switch on again
and actuate the focus search. (actuate the focus search whendisc table is moving in and out)
4. Check the oscilloscope waveform (S-curve) is symmetricalbetween A and B. And confirm peak to peak level within2.4 ± 1 Vp-p.
S-curve waveform
Note:• Try to measure several times to make sure than the ratio
of A : B or B : A is more than 10 : 7.• Take sweep time as long as possible and light up the
Procedure:1. Connect an oscilloscope to test point TP124 (RFAC) and TP
117(VC) on the BD84 board.2. Turn the power on.3. Put the disc (YEDS-18) in to playback the number five track.4. Confirm that oscilloscope waveform is clear and check RFAC
signal level is correct or not.Note: A clear RFAC signal waveform means that the shape “◊” can be
clearly distinguished at the center of the waveform.
Procedure:1. Connect an oscilloscpe to test point TPO103 (TE1) and TP117
(VC) on the BD84 board.2. Turn the power on.3. Select the function “CD”.
4. Press three buttons of [ENTER], M , and[SURRUUND MODE] simultaneously to set the CD servicemode.
5. Put the disc (YEDS-18) in to playback the number five track. 6. Press the . button. The message “TRAVERSE” is
displayed. (The tracking servo and the sledding servo areturned OFF)
7. Check the level B of the oscilliscope's waveform and the A(DC voltage) of the center of the Traverse waveform.Confirm the following :A/B x 100 = less than ± 22%
Traverse Waveform
8. Press the . button. The message “TRAVERSE” isdisplayed. (The tracking servo and sledding servo are turnedON)Confirm the C (DC voltage) is almost equal to the A (DCvoltage) is step 5.
9. To exit from this mode, perform as follows.1) Move the optical pick-up to the most inside track.
2) Press three buttons of x , [CLEAR], and [DISPLAY]
simultaneously. (cold reset)Notes:
• Always move the optical pick-up to most inside trackwhen exiting from this mode. Otherwise, a disc will notbe unloaded.• Do not run the sled motor excessively, otherwise the gear
can be chipped.
Traverse Waveform
Checking Location: BD84 board (SIDE B) (See page 23.)
+–
BD84 board
TP124 (RFAC)TP117 (VC)
oscilloscope
VOLT/DIV: 200 mVTIME/DIV: 500 ns
level: 0.9 ± 0.4 Vp-p
+–
BD84 board
JPO103 (TE1)TP117 (VC)
oscilloscope
0V
B
level: 1.0 ± 0.5 Vp-p
Center of the waveform
A (DC voltage)
0V
Tracking servoSled servo
ON
C (DC voltage)
Tracking servoSled servo
OFF
23
HCD-GNX660
Checking Location:
– BD84 BOARD (SIDE B) –
TP117 (VC)
TP124 (RFAC)
JPO103 (TE1)
JPO102 (FE1)IC101
24
HCD-GNX660
SECTION 7DIAGRAMS
For schematic diagrams.Note:• All capacitors are in µF unless otherwise noted. (p: pF)
50 V or less are not indicated except for electrolytics andtantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
• C : panel designation.• A : B+ Line.• B : B– Line.• Voltages and waveforms are dc with respect to ground
under no-signal conditions.BD84 board no mark: CD PLAYOther boards no mark: TUNER (FM/AM) ( ) : CD PLAY < > : TAPE PLAY [ ] : TAPE REC
* : Impossible to measure• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-tion tolerances.
• Waveforms are taken with a oscilloscope.Voltage variations may be noted due to normal produc-tion tolerances.
• Signal path.F : AUDIOf : TUNER (FM/AM)E : TAPE PLAY (DECK A)d : TAPE PLAY (DECK B)G : RECORDJ : CD PLAYN : MIC INPUTc : CDGg : VIDEO
Note: The components identified by mark 0 or dotted linewith mark ! are critical for safety.Replace only with part number specified.
(The other layers' patterns are not indicated.)
• Indication of transistor.
Caution:Parts face side: Parts on the parts face side seen from(Side A) the parts face are indicated.Pattern face side: Parts on the pattern face side seen from(Side B) the pattern face are indicated.
C
B
These are omitted.
E
Q
B
These are omitted.
C E
Q
B
These are omitted.
C E
Q
Note on Printed Wiring Boards:Note:• X : parts extracted from the component side.• : Pattern from the side which enables seeing.
HCD-GNX660
2525HCD-GNX660
• CIRCUIT BOARDS LOCATION
TUNER pack
MAIN board
SMASTER board
SPEAKER board
ADC board
MIC board
VOL board
PANEL board
POWER board
IR board
MOTOR (LD) boardSW board
SENSOR board
BD84 board
DRIVER board
CDG board
MOTOR (TB) board
• WAVEFORMS
– MAIN BOARD –– BD84 BOARD – – SMASTER BOARD –
0.15 Vp-p
0.2V/DIV, 0.2 msec/DIV
0.1V/DIV, 1 msec/DIV
0.9 ± 0.4 Vp-p
0.2V/DIV, 0.5 µsec/DIV
0.4 Vp-p
1 IC101 wa TEI
2 IC101 wd FEI
3 IC101 ra RFAC
0.5V/DIV, 20 nsec/DIV
0.8 Vp-p
20.3 nsec
1 IC800 2
2V/DIV, 50 nsec/DIV
4 Vp-p
81.3 nsec
1 IC03 1
– ADC BOARD –
2.7 Vp-p
30.5 µsec
3.3 Vp-p
2 µsec
1V/DIV, 10 µsec/DIV
1V/DIV, 1 µsec/DIV
10.5 µsec
50V/DIV, 10 µsec/DIV
50V/DIV, 10 µsec/DIV
67 Vp-p
10.5 µsec
82 Vp-p
1 IC401 qa XC-OUT
2 IC401 qd X-OUT
3 T101 5 TAPE REC only
4 T101 4 TAPE REC only
– CDG BOARD –
5.9 Vp-p
69.84 µsec
2V/DIV, 50 nsec/DIV
1 IC1001 tl XI1
HCD-GNX660
2626HCD-GNX660
7-1. BLOCK DIAGRAM – CDG SECTION –
AMAIN
SECTION(Page 28)
OPTICAL PICK-UPBLOCK
(KSM-215DCP/C2NP)
LDDRIVER
Q10
CD MUTEQ237,287
+3.3V
LD
GND
FOCUSCOIL
F+
F
T+
TTRACKING
COIL
IC251
X17116.9MHz
SL/SP MOTORDRIVER
12
6
11
13
14
VR
PD
15
16
17
18
4
26
23
2
20MUTE
CH2OUT-F
CH1FIN
OUTVREF
CH1RIN
CH2FIN
SFDR
OPIN+
CH2OUT-R
CH1OUT-R
CH1OUT-F
CH4OUT-R
CH4OUT-F
CH3OUT-F
CH3OUT-R
M
M
M101(SPINDLE)
M102(SLED)
S101(LIMIT)
VCC
VC
A
B
C
D
E
F
DETECTOR
A
B
E19
F20
LD36
PD37
TFDR11
FFDR13
CH3FIN 9
SSTP7
MDP6
95XTACN
100XRST
102DATA
104XLAT
105CLOCK
86AOUT2
81AOUT1
61PCMD1
62LRCKI
63LRCK
65PCMD
IC301MP3 DECODER
SYSTEMIC401 (1/5)
CONTROL
21
40
SDO011
LRCKIA16
SFSY/LRCK1B19
SDI014
77 XTAO
78 XTAI
55VDD
VDD
VDDM
26
25 VC
27
C28
D29
107SENS
XTACN
XRST
DATA
XLT
CLOCK
SENS
TRDR12
22 SRDRCH3RIN 10
CH2RIN FRDR14
XRST100
66BCK
60BCK1
BCKIA15
SBSY/BCK1B18
5
+3.3V
IC303
7
5 1
3
26
27
25
7
5
24
23
22
49
48
47
46
42
45
44
6
19
21
43
41
82
3
2
1
28
35
34
STANBY
36PO11/BUCK/AD14
8MIACK
7MICK
6MIDIO
4MICS
5MILP
2RESET
41SRMSTB
115SCORSCOR
REG
CD MUTE DRIVEQ307, 308
IC101RF AMP, DSP, DAC
IC1002DRAM
IC1001VIDEO D/A
IC1003+5V REG
IC1006VIDEO BUFFER
25,2
7,29
,30
VA0-7
15-2
2
VD0-3
144
2623RASCAS
A0-7
DQ1-4
X100214.31818MHz
60
XO1
59
XI1
+B SWITCHQ1007,1008
NO401
CN402
IIC-CLK
IIC-DATA
3
4
CNVSS
RESET
J1001
TXD1
RTS1 ON BOARDPROGRAMCLK1
RXD1
CN VSS
RESET
VIDEOOUT
VMUTE
133 WE
2822 CE
3
2
6
9
7
8
RASCAS
WECE
398 DATASBSO
5110 SFSYWFCK
299 CLCKEXCK
6MUTE
56PDOWN
1,2,
24,2
59-
12,1
4-17
9 854
Q1004SBSY
Q1005,10096
3 41 2
11 1013 12
IC1005
Q1010
VCC55SENTSC
54RESETQ1002,1006
52DEN
37GDET
MUTE DATA
HALT_CLK
PAL/_NTSC
CDG-RST
EVER+3.3VCDG-DET
CDG-DET
MUTE DATA
CDG-RST
44VDOUT
Q1001
33 31 32 12
MUT
E DA
TA
HALT
_CLK
VMUT
E
CDG-
POW
ER
CDG-
RST
CDG-
DET
RESE
T
VMUT
E
CDG-
POW
ER
CDG
RST
CDG-
DET
RESE
T
9
CNVS
SCN
VSS
VMUTE
CDG-POWER
1
43
2
PWRSAVE
VINVSAG
6VCC
VOUT
1 3VIN VOUT
: CD
: CDG
• SIGNAL PATH• R-CH is omitted due to same as L-CH.
: VIDEO
R-CH
CD-L
MP3 STB
MP3 REQ
XTACN
MP3 REQ
MP3 STB
MP3 CLKMP3 CLK
MP3 ACKMP3 ACK
MP3 DATA OUTMP3 DATA
MP3 LPMP3 LP
MP3 CS
MP3 RST
MP3 CS
MP3 RST
MP3 DATA IN
SCOR
SENS
CD-CLK
XLAT
CD-DATA
XRST
XTACN
SCOR
SENS
CLOCK
XLT
DATA
XRST
CD MUTE
LM-R
LM-F
TM-R
TM-F
TBL_SENS
E-1
E-2
E-3
OPEN SW
30IIC-DATA
29IIC-CLK
IC701TABLE LOADINGMOTOR DRIVER
4
29
7
RIN
FIN
OUT1
OUT2
IC712TABLE MOTOR DRIVER
42
97
RIN
FIN
OUT1
OUT2
M751(TABLE LOADING)
M741(TABLE)
S751(OPEN)
ROTARYENCODER
INVERTER
M
M
IC731TBL ADDRESS
SENS
S711
E-3
E-2E-1
M+9V
Q731
HCD-GNX660
2727HCD-GNX660
7-2. BLOCK DIAGRAM – TAPE/TUNER SECTION –
E MAINSECTION(Page 28)
D MAINSECTION(Page 28)
C MAINSECTION(Page 28)
ST-L
REC-OUT-L
TAPEMECHANISM
DECK
75
A TRIGDRIVE
Q122, 123
: PLAYBACK (DECK B): PLAYBACK (DECK A)
R-CH
FM/AM TUNER UNIT
CN101
ANTENNA
ST-L
FM ANT
AM ANT
AM ANT
ST-R
TUNED
ST-DINST-DOUT
ST-CLKST-CE
FM 75 COAXIAL
CAP M+
BTRGM+
ATRGM+
AHALFBHALF
B SHUTA SHUT
REC(FWD)
CAPM-CNT
B-TRIG
A-TRIG
TC-RELAY
A-HALFB-HALF
B SHUTA SHUT
AM
EQ OUT1A
B
TUNED
ST-DOUTST-DIN
ST-CLKST-CE
76
78 79 80
15
26DI1 66 IO-EXP-DATA-OUT
2RESET 68 IO-EXP-RST
3CLK 69 IO-EXP-CLK
4LATCH
5TC-MUTE
70 IO-EXP-LAT
17
9089
9163
21
REC-MUTE7
REC BIAS20
17
19
18
40
3836
3937
PB OUT1TAI1
REC IN1
AIN1
BIN1
IC101(1/2)DECK A/B SELECT,
PB/REC EQUALIZER AMP
IC401(2/5) SYSTEM CONTROL
(CD/TAPE MECHANISM CONTROL)
IC403(1/2) SIGNAL IN/OUT CONTROL
REC-OUT1EQ
TC-PB-L
TESTCONNECTOR
CN111
R-CH
R-CH
R
L1
3
MUTEQ103
MUTE DRIVEQ303, 304
PBHEAD
DECK-A
DECK-B
BIAS OSCQ101
BIASTRAP
SWITCH DRIVEQ107, 108
SWITCH DRIVEQ110, 111
R-CH
R-CH
Q166
Q154, 155 Q109
L – CH
R – CH
R-CH
C174, L104
BIAS+9V
REC/PBHEAD
ERASEHEAD
Q113,114
T101
L – CH
R – CH
R-CHMUTEQ175
TC RECMUTE DRIVE
Q301, 302
: TUNER (FM/AM)
: RECORD
• SIGNAL PATH• R-CH is omitted due to same as L-CH.
B TRIGDRIVE
Q118, 119
CAP MOTORDRIVE
Q120, 121
Ver. 1.2
HCD-GNX660
2828HCD-GNX660
7-3. BLOCK DIAGRAM – MAIN SECTION –
AMPSECTION(Page 29)
B
TAPE/TUNERSECTION(Page 27)
D
(Page 26)ACDG SECTION
MCUINTERFACE
SURROUND
INPUTSELECTSWITCH
COMMAND
+
+
RV1402
IC1401MIC AMP
IC101(2/2)INPUT SELECT SWITCH,
GRAPHIC EQUALIZER CONTROL,ELECTRICAL VOLUME
IC401(3/5)SYSTEM CONTROL
DATA
CLK
REC-OUT-L
CD-L
J1400(1/3)
J1450(2/3)
59
3435
5
J501
R-CH
R-CH
+
R-CH
R-CH
FRONT-L
R-CH
L
R
AUDIOIN
MIC 1
ECHOLEVEL
RV1400MIC 1LEVEL
RV1401MIC 2LEVEL
14
23 24 28
30
31
29
MIC
3
MIC OUT
IC1400DIGTAL ECHO
MC1P
MC2P
VACS
IN
88
J1450(1/3)
J1400(2/3)
J1450(3/3)
J1400(3/3)
MIC 2 15
16
+ ++ PRELPF
POSTLPF
ADPCMENCODE
ADPCMDECODEADC DAC S/HDELAY
25
29
23
5 6 7
DA OUT
POOUT
AD IN
ALC
ALC
MIC VOLECHOVOL
MICVOL
VOLUMECONTROL
VOL1
VOL2
VOL3
M61
537-
CLK
84
M61
537-
DATA
83
3 7
FRONT-R37
SW
TONE
L +
R
53
J506
D-LIGHTSYNC OUT
L+R
D+4V 2
3
1
(Page 27)ETAPE/TUNER SECTION
ST-L
1C(Page 27)
TAPE/TUNER SECTIONTC-PB-L
4
: TUNER (FM/AM)
: CD: TAPE PLAY: RECORD: MIC
: AUDIO
• SIGNAL PATH• R-CH is omitted due to same as L-CH.
HCD-GNX660
2929HCD-GNX660
7-4. BLOCK DIAGRAM – AMP SECTION –
(+)
(–)
IC500STREAM PROCESSOR
31 DATA
36 XFSIIN30 BCK
23 SCLATCH27 INIT18 NSPMUTE
SOFTMUTE
21 SCDT
29 LRCK
22 SCSHIFTSCLATCH 1INITNSPMUTE
SCDTSCSHIFT
4OUTR2
11OUTL1
6OUTR1
9OUTL2
38FS0I
R
L
FRONTSPEAKER
(+)
(–)
FEED BACKSWITCH
Q101
FEED BACKSWITCH
Q151
IC401 (4/5)SYSTEM CONTROL
(+)
(–)
IC600STREAM PROCESSOR
31 DATA
36 XFSIIN30 BCK
23 SCLATCH27 INIT1819
NSPMUTESOFTMUTE
SCDT
29 LRCK
2221
SCSHIFT
4OUTR2
6OUTR1
38FS0I
48XFS0IN
48XFS0IN
DC DETECTQ865, 866
IC650POWER DRIVER
SD
4
14 PWM-B
6
5
PWM-A
RESET
OUTB
OUTA
4
IC530POWER DRIVER
SD
6 PWM-A
14
5
PWM-B
RESET
OUTA
OUTB
4
IC550POWER DRIVER
SD
14 PWM-B
6
5
PWM-A
RESET
OUTB
OUTA
72SM-SD
85HP-DET
86HP-MUTE
SUBWOOFER
TM1500
DOUT1 R
R
L
L
XFSIINBCK1LRCK1
SCLATCH1SCLATCH2
SCDTSCSHIFT
SCLATCH2INITNSPMUTE
SCDTSCSHIFT
DOUT2
XFSIINBCK1LRCK1
19
HPOU
TL2
43
HPOU
TR2
39
PROTECT DETECTQ840
IC800OSC
X80049.152MHz
78SM-DATA77SM-CLK76SM-LATCH-179SM-LATCH-2
65SM RESET
LPF
LPF
LPF
LPF
LPF
LPF
IC403 (2/2)SIGNAL IN/OUT CONTROL
INITSOFTMUTE
NSPMUTE9SM-NSP-MUTING
22ADC-RESET
12SM-INIT10SM-SOFT-MUTING
24FAN CTRL
FAN DRIVE
M891DC FAN
Q580,582,Q584,585
UNREG+12V
14XFS0OUT37FSOCKO
37FSOCKO
SOFTMUTE
SOFTMUTE
SW
SWIC12A/D CONVERTER
12
2
DOUTDOUT_2
LRCK
BCK
RIN10LRCK
SCKI
11BCK
7PDWN15
IC11A/D CONVERTER
121
2
DOUTDOUT_1
LRCK
BCK
LIN
RIN10LRCK
SCKI
FRONT-L
SW
FRONT-R
11BCK
7PDWN15
XFSIIN
28
30
25
27
28
30
25
27
25
27
28
30
1 7
IC03CLOCK GENERATOR
2 6
3 5 2 4
IC802
IC880
5 7
3 1
X00112.288MHz
BMAINSECTION(Page 28)
PHONESJ1401
DC DETECTQ855, 856
DC DETECTQ850, 851
HP MUTEQ1400,1401
HP MUTEQ1450,1451
MUTE SWITCHQ486
: AUDIO
• Signal Path
-13MAIN ON/OFF
DELAYQ156, 157
FDISPLAY/POWER
SECTION(Page 30)
Ver. 1.2
HCD-GNX660
3030HCD-GNX660
7-5. BLOCK DIAGRAM – DISPLAY/ POWER SECTION –
IC402LEVEL
DETECT
IC1101VOLTAGEDETECT
IC1102+12V REG
IC552+9V REG
IC01+5V REG
IC562+4V REG
T1100MAIN POWER
TRANSFORMERD1103
D1114
D1119
D1112
D1100
SMASTER G+12V
M+7V
M+9V
LED+9V
AUDIO A+9V
BIAS A+9V
ST A+9V
IC551+9V REG
IC1100POWER
SWITCHINGCONVERTER
AC IN
PHOTOCOUPLER
+8V REGQ1205, 1206
LED DRIVEQ1309
SUB WOOFERON/OFF
+3.3V REGQ560
+B SWITCHQ561
+4V REGQ1203, 1204
67
12
4
3 FB
VCC
CVIN
Q1102
D1101C1112
PC1100
PHOTOCOUPLER
PC1101
PHOTOCOUPLER
PC1102
IC1201VOLTAGEDETECT
T1200SUB POWER
TRANSFORMERD1212
D1213
D1211
D1207
D1204
D1118
+44V
IC1200PRIMARY
SWITCHING,MAIN
CONVERTER
PHOTOCOUPLER
MAIN ON/OFFSWITCH
Q1100, 1101
5
4
2
1 Z/C
F/B
VCC
D
Q1200
PC1200
A+5V
IC02+3.3V REG
IC810+1.8V REG
+1.8V
EVER +4V
FL+4V
D+4V
D+3.3V(1)D506
D+3.3V(2)
D394
D395
D594
D562 D561D563
+3.3V
EVER +3.3V
D393
D396
94,9
5,97
LED DRIVEQ1305-1307
D1310-1312
D1307-1309
LED+9V
Q1304Q1308
Q1303
Q1310
D1304
AD-KEY-1 |
AD-KEY-3
LED-ILLUMINATION-1 |
LED-ILLUMINATION-3
S1302,1306,1307,1309-1328,1331
74POWER-KEY
73DISPLAY-KEY
S1301
S1300DISPLAY
56 STBY-LED
D1313
EVER +4V
61
53 LED-CTRL
SW-LED
4 SIRCS
X4025MHz
15 X-IN
13 X-OUT
X40132.768kHz
10 XC-IN
11 XC-OUT
35CD-POWER
100MAIN ON/OFF
IC401 (5/5)SYSTEM CONTROL
12RESET
20AC-CUT
RESETSWITCH
Q213
IC1301REMOTE CONTROL
RECEIVER
54 VOL-A
55 VOL-B
ROTARYENCODER
S1305
MASTERVOLUME
1 2
T1300DC/DC
CONVERTER
RECTD1300-1303
OSCQ1300
LED +9V
FL1300FLUORESCENT
INDICATOR TUBE
DR17-35
DR5-14
2-6,
1850
-52
16–3
87-
13,1
5-17
DR0-4,15
1G,12G-16G
2G-11G
P1 – 20
F1 F2
40
IC1300FL DRIVER
BUFFERQ1311-1316
VFDP
49
SI
48
SCK
52
RSTb
57
FL-D
RIVE
R-DA
TA
58
FL-D
RIVE
R-CL
K
59
FL-D
RIVE
R-RE
SET
51
CSb
60
FL-D
RIVE
R-CS
D1102C1113
FAMP
SECTION(Page 29)
-13
Ver. 1.2
HCD-GNX660
3131HCD-GNX660
7-6. PRINTED WIRING BOARD – BD84 BOARD – • See page 25 for Circuit Boards Location. : Uses unleaded solder.
TP117(VC)
JPO103(TE1)
JPO102(FE1)
TP124(RFAC)
R412
R422
R406
R252
R251
R182
R181
R423
R151
R143
R142R141
R133
R132
R131
R114
R113
R112
R111
IC303
IC251
CN101
C252
C251
C194
C181
IC101
C162
C143
C142C141
C133
C132
C131
C124
C111
C122
C115
C114
C113
C112 C185
C186
R204
R203
C161
R161
C211
C317
R306
C212
IC301
C163
C320
C213
R421
C306
C307
C309
C310
C311
C313
R307
R163
R301
R303
R305
R351
R352
R353
R354
R401R402
R403R404
R405
R407 R4
08
R409
R410
R419
R411
CN201
S101(LIMIT)
M101(SPINDLE)
M102(SLED)
M
M
13
4 5
116
17
32
64
49
33 48
MAINBOARDCN351
(Page 35)
OPTICAL PICK-UPBLOCK
(KSM-215DCP)
C10
C260
C14
C15
C16
C18
C11
R253
R191
R172
R121
R171
R162
C209
X171
R12
R11
R10Q10
E
C116
C184
C183
C303
C302
C305
C259
C258
C257
C255
C203
C196
C195
C201 C182
C171
C172
C210
C151
C134
C125
C123
R165
R13
C17
FB30
1
R201
R173
R205
C174
C318
C314
C308
C312
R313C315
R302
C316
11(11)1-864-566-
BD84 BOARD (SIDE A) BD84 BOARD (SIDE B)
11(11)1-864-566-
Ref. No. Location
IC101 E-9IC251 C-7IC301 C-9IC303 B-10
Q10 F-4
• SemiconductorLocation
HCD-GNX660
3232HCD-GNX660
7-7. SCHEMATIC DIAGRAM – BD84 BOARD – • See page 53 and 54 for IC Block Diagrams. • See page 25 for Waveforms. • See page 56 for IC Pin Function Description
JPO004
JPO10
JPO102
JPO103
C307
C309
C308
R303
C310
C311
R306
C312 C313
C314
C316
C315
R313
C320
C306
R351
C305 C302
R182
R181 C183
C184
C162
C174
R173
C161
R203
R151
C151
C143 C142
R143
R132 R133
C133
C132
C124 C122
C125
C131
R131 R121
C123C134
C141
R142
R141
C111C112C113C114
R112
R114
R111
R113
C115
C195R191
C163
R165
C210R162 R163
C196
IC101
C185
C181
C182
C201C209C203
R204R423
R422
R421
C213
R411R410R409R408R407R406R412
C211C212
R205
CN201
R302
C318R301 R305
C317
R401
R402
R405R404
R419R403
C194
C17R12
R11
C16
R10
C18
C11 C10 C14
C15
CN101
R252
R251
R253
C258
C259
C257C252
C260 C255
M102
M101
IC301
C251
R13
R307
IC303
C171C172
R172
R171
IC251
Q10
S101
C116X171
R352
R354
R353
R161
C186
R201
0uHFB301
TP117
TP124
C303
MDP
APC
FEI
TEI
0.1
0.1
474V
100k
0.1
0.1
0
0.1 0.1
474V
0.0022
0.1
220
0.001
0.1
100
2204V
0.1
100
100 226.3V
226.3V
0.1
0.1
0
0.1
0
0
10010V
0.1 0.0015
3.3k
10k 180k
0.01
0.47
330p 0.1
0.1
100p
1M 15k
0.10.1
0.1
1k
4.7k
0.0033470p0.0033470p
15k
15k
1k
1k
0.1
0.10
0.1
0
0.147k 100
0.1
CXD3059AR
470p
0.1
0.1
10010V
0.0110010V
0UH 100
100
100
22p
100100100100100100100
220p22p
0
31P
10k
0.01100k 100k
0.01
100
100
100100
100100
0.1
2204V100k
0
1
3.3
0.001
10 10 0.1
0.1
16P
22k
10k
10k
0.1
0.1
0.10.1
22010V
0.1
TC94A34FG-002
0.0068
1
10k
BH15FB1WG
22p27p
1M
470
BA5947FM-E2
2SA2119KLD DRIVER
(LIMIT)
10010V
16.9344MHz
100
100
100
100
470p
0UH
(VC)
(RFAC)
0.1
EF
F
EDABC
MIACKMICK
MIDIOMILPMICS
SCOR
SENS
CLOC
K
DATA
XRST
XLTCLOCK
SENSSCOR
XRST
MP3REQ
DATA
MP3STB
XTACN
XTAC
N
MP3STBDCBA
MP3RST
XLT
MP3REQ
MIACKMICK
MIDIOMILPMICS
MP3RST
SBSO
EXCK
WFC
K
SBSOEXCK
WFCK
(SPINDLE)
(SLED)
DRIVESL/SP MOTOR
RF AMP, DSP, DAC
MP3 DECODER
REG
(1/3)
MAINBOARD
CN351(Page 36)
HCD-GNX660
3333HCD-GNX660
7-8. PRINTED WIRING BOARDS – CD MECHANISM SECTION – • See page 25 for Circuit Boards Location. : Uses unleaded solder.
Ref. No. Location
D701 C-5D711 C-5
IC701 C-5IC712 B-5IC731 B-2
Q731 B-4
• SemiconductorLocation
M741(TABLE)
M751(TABLE LOADING)
1 3
CN721
IC731
CN731
CN741
CN742
C715
C731
C735
C736
R701
R711
R731
R721
R722
R723
R732
R733
R734
D701
D711
Q731
C751
IC712
IC701
CN704C7
37
R713
R712
C741
R702
JW70
2JW
703
JW70
4JW70
5JW
706
JW70
7
JW708
JW71
1
CN703
S711ROTARY
ENCODER
CN70
2
CN751
CN70
5
R751
C752
JW71
2
JW70
1
JW709
JW71
3
JW71
4
S751(OPEN)
CN701
JW71
0
R735
R736
BOARDMOTOR(LD)
12(12)1-687-133-
BOARDMOTOR(TB)
12(12)1-687-134-
BOARDSW
12(12)1-687-669-
BOARDSENSOR
12(12)1-687-132-
BOARDDRIVER
12(12)1-866-201-
M
M
14
12
12
E
1
1
9
9
GMAIN BOARD
CN511(Page 35)
1 2
12
2 3 4 5 6 7
A
1
B
C
D
E
HCD-GNX660
3434HCD-GNX660
7-9. SCHEMATIC DIAGRAM – CD MECHANISM SECTION – • See page 53 for IC Block Diagrams.
CN721
CN711
E1E2E3
CN742
CN741
CN731
C751CN704
CN703
IC731
IC701
R702
R701
IC712
R713
R712
R711
C741
C715 CN701
C731 R751
R731
R732
R733
R734
R736
CN702
CN705
CN751
R723 R722 R721
C736C737 C735
D711
D701
C752
M741
M751
Q731
S751
2P
4P
5P
3P
3P
0.012P
4P
RPI-576
BA6956AN
100
470
BA6956AN
22k
4.7k
1k
0.01
10016V 13P
1050V 4.7k
100
10k
1k
12k
390
5P
2P
2P
4.7k 4.7k 4.7k
0.10.1 0.1
MTZJ-T-77-3.6B
MTZJ-T-77-5.1A
0.1
(TABLE)
(TABLE LOADING)
DTC114ESAINVERTER
(OPEN)
(Page 36)
(1/3)BOARDMAIN
CN405
HCD-GNX660
3535HCD-GNX660
7-10. PRINTED WIRING BOARD – MAIN BOARD – • See page 25 for Circuit Boards Location. : Uses unleaded solder.
IC01 8-759-473-95 IC uPC2905T-E1IC02 8-759-583-47 IC uPC2933T-E2IC03 8-759-387-77 IC TC7WU04F (TE12R)IC11 6-707-608-01 IC PCM1803DBRIC12 6-707-608-01 IC PCM1803DBR
< JUMPER RESISTOR >
JR21 1-216-864-11 SHORT CHIP 0JR51 1-216-806-11 METAL CHIP 56 5% 1/10WJR52 1-216-806-11 METAL CHIP 56 5% 1/10W
R25 1-216-825-11 METAL CHIP 2.2K 5% 1/10WR27 1-216-845-11 METAL CHIP 100K 5% 1/10WR29 1-216-825-11 METAL CHIP 2.2K 5% 1/10WR31 1-216-845-11 METAL CHIP 100K 5% 1/10WR36 1-216-864-11 SHORT CHIP 0
R38 1-216-864-11 SHORT CHIP 0R40 1-216-821-11 METAL CHIP 1K 5% 1/10WR41 1-216-857-11 METAL CHIP 1M 5% 1/10WR50 1-216-864-11 SHORT CHIP 0R52 1-216-809-11 METAL CHIP 100 5% 1/10W
Ver. 1.1
69
HCD-GNX660
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
BD84ADC
R53 1-216-809-11 METAL CHIP 100 5% 1/10WR55 1-216-864-11 SHORT CHIP 0R57 1-216-864-11 SHORT CHIP 0R58 1-216-864-11 SHORT CHIP 0R59 1-216-864-11 SHORT CHIP 0
R60 1-216-864-11 SHORT CHIP 0R63 1-216-809-11 METAL CHIP 100 5% 1/10WR64 1-216-864-11 SHORT CHIP 0R65 1-216-864-11 SHORT CHIP 0R67 1-216-864-11 SHORT CHIP 0
FB514 1-414-235-22 INDUCTOR, FERRITE BEADFB555 1-216-864-11 SHORT CHIP 0
< IC >
IC101 6-705-667-01 IC M61537FP-RF0GIC401 6-807-073-01 IC M30622MGP-A54FPU0IC402 6-701-680-01 IC PST3629NRIC403 6-707-095-01 IC BH2210FV-E2IC551 6-703-550-01 IC TA7809LS
IC552 6-703-550-01 IC TA7809LSIC562 6-703-546-01 IC TA7804LS
Ver. 1.2
74
HCD-GNX660
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
JR001 1-216-296-11 SHORT CHIP 0JR002 1-216-864-11 SHORT CHIP 0JR003 1-216-864-11 SHORT CHIP 0JR004 1-216-864-11 SHORT CHIP 0JR005 1-216-864-11 SHORT CHIP 0
JR006 1-216-864-11 SHORT CHIP 0JR007 1-216-864-11 SHORT CHIP 0JR008 1-216-864-11 SHORT CHIP 0JR009 1-216-864-11 SHORT CHIP 0JR011 1-216-864-11 SHORT CHIP 0
JR012 1-216-864-11 SHORT CHIP 0JR013 1-216-296-11 SHORT CHIP 0JR014 1-216-296-11 SHORT CHIP 0JR015 1-216-864-11 SHORT CHIP 0JR016 1-216-864-11 SHORT CHIP 0
JR017 1-216-864-11 SHORT CHIP 0JR018 1-216-864-11 SHORT CHIP 0JR019 1-216-864-11 SHORT CHIP 0JR020 1-216-864-11 SHORT CHIP 0JR021 1-216-296-11 SHORT CHIP 0
JR022 1-216-864-11 SHORT CHIP 0JR024 1-216-296-11 SHORT CHIP 0JR026 1-216-864-11 SHORT CHIP 0JR027 1-216-864-11 SHORT CHIP 0JR028 1-216-864-11 SHORT CHIP 0
JR029 1-216-864-11 SHORT CHIP 0JR030 1-216-864-11 SHORT CHIP 0JR031 1-216-864-11 SHORT CHIP 0JR032 1-216-864-11 SHORT CHIP 0JR033 1-216-864-11 SHORT CHIP 0
JR036 1-216-864-11 SHORT CHIP 0JR037 1-216-864-11 SHORT CHIP 0JR042 1-216-864-11 SHORT CHIP 0JR043 1-216-864-11 SHORT CHIP 0JR044 1-216-864-11 SHORT CHIP 0
JR046 1-216-864-11 SHORT CHIP 0JR047 1-216-864-11 SHORT CHIP 0JR048 1-216-296-11 SHORT CHIP 0JR049 1-216-864-11 SHORT CHIP 0JR050 1-216-864-11 SHORT CHIP 0
JR051 1-216-864-11 SHORT CHIP 0JR056 1-216-296-11 SHORT CHIP 0JR057 1-216-296-11 SHORT CHIP 0JR059 1-216-296-11 SHORT CHIP 0JR126 1-216-864-11 SHORT CHIP 0
JR152 1-216-296-11 SHORT CHIP 0JR153 1-216-296-11 SHORT CHIP 0JR176 1-216-864-11 SHORT CHIP 0JR228 1-216-864-11 SHORT CHIP 0JR261 1-216-864-11 SHORT CHIP 0
JR267 1-216-864-11 SHORT CHIP 0JR318 1-216-864-11 SHORT CHIP 0
JR381 1-216-864-11 SHORT CHIP 0JR467 1-216-864-11 SHORT CHIP 0JR480 1-216-864-11 SHORT CHIP 0
JR481 1-216-864-11 SHORT CHIP 0JR487 1-216-864-11 SHORT CHIP 0JR550 1-216-864-11 SHORT CHIP 0JR555 1-216-864-11 SHORT CHIP 0
IC1400 6-709-116-01 IC TC9488FGIC1401 8-759-710-97 IC NJM4565M-D
< JACK >
J1400 1-817-629-11 JACK (LARGE TYPE) (MIC 1)J1401 1-794-702-11 JACK, HEADPHONE (PHONES)J1450 1-817-629-11 JACK (LARGE TYPE) (MIC 2)
< JUMPER RESISTOR >
JR1401 1-216-864-11 SHORT CHIP 0JR1403 1-216-296-11 SHORT CHIP 0JR1417 1-216-864-11 SHORT CHIP 0JR1427 1-216-864-11 SHORT CHIP 0JR1433 1-216-864-11 SHORT CHIP 0
0 IC1100 6-709-168-01 IC MR5060IC1101 6-707-743-01 IC TA76L431S (TPE6, Q)IC1102 6-701-021-01 IC SI-8120JF
0 IC1200 6-707-962-01 IC MR1722IC1201 6-707-743-01 IC TA76L431S (TPE6, Q)
< JUMPER RESISTOR >
JR1101 1-216-864-11 SHORT CHIP 0JR1103 1-216-864-11 SHORT CHIP 0JR1105 1-216-864-11 SHORT CHIP 0JR1106 1-216-296-11 SHORT CHIP 0JR1107 1-216-296-11 SHORT CHIP 0
0JR1108 1-216-296-11 SHORT CHIP 00JR1150 1-216-864-11 SHORT CHIP 0 (-13)
IC500 6-707-939-01 IC CXD9843ARIC530 6-709-087-01 IC CXD9879MIC550 6-709-087-01 IC CXD9879MIC600 6-707-939-01 IC CXD9843ARIC650 6-709-087-01 IC CXD9879M
IC800 6-701-189-01 IC MC74VHC1GU04DFT1IC802 6-701-189-01 IC MC74VHC1GU04DFT1IC810 6-700-263-01 IC NJM2870F18 (TE2)IC880 8-759-422-21 IC NJM4580V (TE2)
R500 1-216-864-11 SHORT CHIP 0R501 1-216-864-11 SHORT CHIP 0R502 1-216-833-11 METAL CHIP 10K 5% 1/10WR503 1-216-809-11 METAL CHIP 100 5% 1/10WR505 1-216-817-11 METAL CHIP 470 5% 1/10W
R506 1-216-817-11 METAL CHIP 470 5% 1/10WR507 1-216-817-11 METAL CHIP 470 5% 1/10WR509 1-216-864-11 SHORT CHIP 0R510 1-216-864-11 SHORT CHIP 0R511 1-216-864-11 SHORT CHIP 0
R512 1-216-833-11 METAL CHIP 10K 5% 1/10WR515 1-216-806-11 METAL CHIP 56 5% 1/10WR516 1-216-809-11 METAL CHIP 100 5% 1/10WR517 1-216-809-11 METAL CHIP 100 5% 1/10WR519 1-216-821-11 METAL CHIP 1K 5% 1/10W
R520 1-216-821-11 METAL CHIP 1K 5% 1/10WR521 1-216-821-11 METAL CHIP 1K 5% 1/10WR523 1-216-864-11 SHORT CHIP 0R524 1-216-864-11 SHORT CHIP 0R526 1-216-864-11 SHORT CHIP 0
R529 1-216-864-11 SHORT CHIP 0R530 1-216-797-11 METAL CHIP 10 5% 1/10W
(-12)R530 1-216-864-11 SHORT CHIP 0 (-13, -21)R531 1-216-809-11 METAL CHIP 100 5% 1/10WR532 1-216-809-11 METAL CHIP 100 5% 1/10W
R533 1-216-809-11 METAL CHIP 100 5% 1/10WR535 1-216-839-11 METAL CHIP 33K 5% 1/10WR541 1-216-797-11 METAL CHIP 10 5% 1/10WR542 1-216-797-11 METAL CHIP 10 5% 1/10W
R562 1-216-864-11 SHORT CHIP 0 (-13, -21)R567 1-219-107-91 RES-CHIP 1.5 5% 1/8WR568 1-219-107-91 RES-CHIP 1.5 5% 1/8WR569 1-216-791-11 METAL CHIP 3.3 5% 1/10WR581 1-216-790-11 METAL CHIP 2.7 5% 1/10W
R583 1-216-790-11 METAL CHIP 2.7 5% 1/10WR591 1-216-790-11 METAL CHIP 2.7 5% 1/10WR593 1-216-790-11 METAL CHIP 2.7 5% 1/10WR600 1-216-864-11 SHORT CHIP 0R601 1-216-864-11 SHORT CHIP 0
R602 1-216-833-11 METAL CHIP 10K 5% 1/10WR603 1-216-809-11 METAL CHIP 100 5% 1/10WR605 1-216-817-11 METAL CHIP 470 5% 1/10WR606 1-216-817-11 METAL CHIP 470 5% 1/10WR607 1-216-817-11 METAL CHIP 470 5% 1/10W
R609 1-216-864-11 SHORT CHIP 0R610 1-216-864-11 SHORT CHIP 0R612 1-216-833-11 METAL CHIP 10K 5% 1/10WR615 1-216-806-11 METAL CHIP 56 5% 1/10WR616 1-216-809-11 METAL CHIP 100 5% 1/10W
R617 1-216-809-11 METAL CHIP 100 5% 1/10WR619 1-216-821-11 METAL CHIP 1K 5% 1/10WR620 1-216-821-11 METAL CHIP 1K 5% 1/10WR621 1-216-821-11 METAL CHIP 1K 5% 1/10WR623 1-216-864-11 SHORT CHIP 0
R624 1-216-864-11 SHORT CHIP 0R650 1-216-797-11 METAL CHIP 10 5% 1/10W (-12)R650 1-216-864-11 SHORT CHIP 0 (-13, -21)R651 1-216-809-11 METAL CHIP 100 5% 1/10WR652 1-216-809-11 METAL CHIP 100 5% 1/10W
R653 1-216-809-11 METAL CHIP 100 5% 1/10WR655 1-216-839-11 METAL CHIP 33K 5% 1/10WR657 1-216-142-00 RES-CHIP 4.7 5% 1/8WR658 1-216-142-00 RES-CHIP 4.7 5% 1/8WR661 1-216-797-11 METAL CHIP 10 5% 1/10W
R662 1-216-797-11 METAL CHIP 10 5% 1/10W (-12)R662 1-216-864-11 SHORT CHIP 0 (-13, -21)R667 1-219-107-91 RES-CHIP 1.5 5% 1/8WR668 1-219-107-91 RES-CHIP 1.5 5% 1/8WR669 1-216-791-11 METAL CHIP 3.3 5% 1/10W
R691 1-216-790-11 METAL CHIP 2.7 5% 1/10WR693 1-216-790-11 METAL CHIP 2.7 5% 1/10WR800 1-216-857-11 METAL CHIP 1M 5% 1/10WR801 1-216-809-11 METAL CHIP 100 5% 1/10WR802 1-216-806-11 METAL CHIP 56 5% 1/10W
R804 1-216-864-11 SHORT CHIP 0R805 1-216-864-11 SHORT CHIP 0R806 1-216-864-11 SHORT CHIP 0R807 1-216-864-11 SHORT CHIP 0R809 1-216-806-11 METAL CHIP 56 5% 1/10W
R811 1-216-845-11 METAL CHIP 100K 5% 1/10WR820 1-216-837-11 METAL CHIP 22K 5% 1/10WR821 1-216-823-11 METAL CHIP 1.5K 5% 1/10WR822 1-216-837-11 METAL CHIP 22K 5% 1/10WR823 1-216-837-11 METAL CHIP 22K 5% 1/10W
R840 1-216-845-11 METAL CHIP 100K 5% 1/10WR841 1-216-864-11 SHORT CHIP 0R850 1-216-845-11 METAL CHIP 100K 5% 1/10WR851 1-216-845-11 METAL CHIP 100K 5% 1/10WR852 1-216-845-11 METAL CHIP 100K 5% 1/10W
R855 1-216-845-11 METAL CHIP 100K 5% 1/10WR856 1-216-845-11 METAL CHIP 100K 5% 1/10WR857 1-216-845-11 METAL CHIP 100K 5% 1/10W
Ver. 1.2
85
HCD-GNX660
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
R858 1-216-841-11 METAL CHIP 47K 5% 1/10WR859 1-216-841-11 METAL CHIP 47K 5% 1/10W
R865 1-216-845-11 METAL CHIP 100K 5% 1/10WR866 1-216-845-11 METAL CHIP 100K 5% 1/10WR867 1-216-845-11 METAL CHIP 100K 5% 1/10WR868 1-216-841-11 METAL CHIP 47K 5% 1/10WR880 1-216-837-11 METAL CHIP 22K 5% 1/10W
R881 1-216-837-11 METAL CHIP 22K 5% 1/10WR882 1-216-837-11 METAL CHIP 22K 5% 1/10WR883 1-216-837-11 METAL CHIP 22K 5% 1/10WR884 1-216-837-11 METAL CHIP 22K 5% 1/10WR885 1-216-839-11 METAL CHIP 33K 5% 1/10W
R886 1-216-864-11 SHORT CHIP 0R887 1-216-837-11 METAL CHIP 22K 5% 1/10WR888 1-216-837-11 METAL CHIP 22K 5% 1/10WR889 1-216-837-11 METAL CHIP 22K 5% 1/10WR890 1-216-837-11 METAL CHIP 22K 5% 1/10W
R891 1-216-839-11 METAL CHIP 33K 5% 1/10WR892 1-216-864-11 SHORT CHIP 0R893 1-216-826-11 METAL CHIP 2.7K 5% 1/10WR894 1-216-825-11 METAL CHIP 2.2K 5% 1/10WR895 1-216-837-11 METAL CHIP 22K 5% 1/10W
< VIBRATOR >
X800 1-795-660-21 QUARTZ CRYSTAL UNIT (49.152MHz)************************************************************
M741 A-1108-965-A MOTOR ASSY, TABLE (TABLE)M751 A-1108-966-A MOTOR ASSY, LOADING (LOADING)M891 1-763-072-11 FAN, DC
S711 1-477-680-12 ENCODER, ROTARY
HCD-GNX660
REVISION HISTORY
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Ver. Date Description of Revision
1.0 2006.04 New
1.1 2006.10 Change of CN590 (Main board). (ECB-62427)
Change of C301,302, R585 and 587 (Main board). (ECB-63860)
Change of R1421 (MIC board). (ECB-64469)
Change of S1306 (Switch board). (ECB-67927)
Change of C528, 529, 629, R532, 552 and 652 (SMASTER board).
(ECB-70769)
Change of R515, 615 and 802 (SMASTER board). (ECB-70967)
Change of R1416 and 1417 (MIC board). (ECB-79325)
Change of IC401 microprocessor (Main board). (ECB-80690)
Change of C535, 550 and 582 (Main board). (ECB-82670)
1.2 2007.12 Suffix change of Main, Panel and Power combined board from -12 to -13.
Suffix change of SMASTER combined board from -12 to -13 or -21.