Fairchild Semiconductor – Smart Power Module SMART POWER MODULES for Low-Power Variable Speed Motor Drive Applications June, 2002 Application Engineering Group Fairchild Semiconductor
Fairchild Semiconductor – Smart Power Module
SMART POWER MODULESfor Low-Power Variable Speed Motor Drive Applications
June, 2002
Application Engineering GroupFairchild Semiconductor
Fairchild Semiconductor – Smart Power ModuleJune 2002
SPIM Series
SPM Products
SPM Series
ConsumerAir-conditionerWashing MachineRefrigeratorKitchen Fan
IndustrialCommercial inverter.Fan motor controlAuto door controlAC servo , DC servoSewing machineWire bonding machine
SPM Markets
Fairchild Semiconductor – Smart Power ModuleJune 2002
! The use of inverters in low-power motor drive, in particular,home appliances applications has been increasing due tohigh efficiency, high performance and so on.
! SPMs are becoming more and more obvious choice for
inverter makers because of their many attractive advantages:- Compact system design- Protective functions- Less parts counts- High reliability- Good noise Immunity
! Fairchild-SPMs have achieved optimum cost-performance ratios
using the following distinctive technology:- Multi-chip assembly on common lead-frame- Ceramic-based isolation packaging
Why do we need Smart Power Modules?
Fairchild Semiconductor – Smart Power ModuleJune 2002
SPMs give the following benefits
! Reduced system design time:SPM frees customers from the job of power circuit design.
This allows them to launch new products faster.
! Reduced manufacturing time:All the necessary “Power” parts are inside the SPM. Customers need not worry about “Power”
part assemblies. Enhanced productivity in comparison to a discrete IGBT solution.
! High-yields in manufacturing:Simplified manufacturing as all the diverse components are combined in the SPM.
! Less components to order & stock:You can order and stock the SPM as just one device. Minimized inventory levels and costs.
! More compact system:The compact and thin outline of the SPM enables the design of smaller appliances.
In addition to a smaller size it also results in cost reduction.
! Reduced field failure ratio:The internal protection circuit of the SPM prevents failures in the IGBT-chips.
This is effective in minimizing the failure of the “Power” part in the field.
Fairchild Semiconductor – Smart Power ModuleJune 2002
Integrated Function of SPM
! For inverter high-side IGBTs :Gate driving circuit
High voltage isolated high-speed level shifting
Control supply under-voltage(UV) protection
! For inverter low-side IGBTs :Gate driving circuit
Short-circuit protection with soft shut-down control
Control supply under-voltage(UV) protection
! Temperature monitoring :Over-temperature monitoring using built-in thermistor
! Fault signaling :Corresponding to a SC fault(low-side IGBTs) or a UV fault(low-side supply)
! Input interface :5V/3.3V CMOS/LSTTL compatible,Schmitt trigger input
Fairchild Semiconductor – Smart Power ModuleJune 2002
UnitPFCor
ctifierReDiode
ModulesIGBT
UnitIsolation
CPUControlfor
SupplyPower
DrivingGatefor
SupplyPower
MultiIsolated
DriversGate
UnitIsolation
UnitgsinSen
Capacitors
LinkDC −
Variable Voltage &Variable Frequency
MotorsACSourceAC
Constant Voltage &Constant Frequency
Discrete or Conventional Module Solution
High Performanceac Drive System
100~264V
Trend of SPM Technology
Fairchild Semiconductor – Smart Power ModuleJune 2002
Conventional IPM Solution
DrivingGatefor
SupplyPower
MultiIsolated
Controlfor
SupplyPower
Capacitors
LinkDC −
CPU
Variable Voltage &Variable Frequency
MotorsACSourceAC
Constant Voltage &Constant Frequency IGBTs
UnitIsolation
UnitgsinSen
DriversGate
UnitPFCor
ctifierReDiode
Higher Performanceand Compact Designbut Higher Cost
100~264V
Trend of SPM Technology
Fairchild Semiconductor – Smart Power ModuleJune 2002
SupplyPowerSingleCommon
CPUUnitgsinSen
Capacitors
LinkDC −
LVIC ControllerGate
HVIC ControllerGate
IGBTsprovedIm
Variable Voltage &Variable Frequency
MotorsACSourceAC
Constant Voltage &Constant Frequency
UnitPFCor
ctifierReDiode
Transfer-Molded Type IPM Solution (From 1999/2000)
Higher PerformanceCompact DesignLower Cost
100~264V
Trend of SPM Technology
Fairchild Semiconductor – Smart Power ModuleJune 2002
SPM : Smart Power ModuleSPIM : Smart Power Integrated Module
SupplyPowerCommon
CPU
Variable Voltage &Variable Frequency
MotorsAC
LVIC ControllerGate
HVIC ControllerGate
Sensing Unit
IGBTsSense −
IGBTsPerformanceHigh
SourceAC
Constant Voltage &Constant Frequency
PFC orDB Unit
ctifierReDiode
100~264V
Tip, Dip, Mini-Dip, Tiny-Dip-SPM
SPIM
Fairchild-SPM Series
TIP-SPM : Triple in- line package type of SPM.DIP-SPM : Dual in- line package type of SPM.Mini-DIP-SPM : Mini-DIP type of SPM.Tiny-DIP-SPM : Tiny-DIP type of SPM.
Fairchild Semiconductor – Smart Power ModuleJune 2002
SPMs and SPIM Development Status and Plan
57 ×××× 55 60 ×××× 30 44 ×××× 26 34 ×××× 21
600V-50A 600V-30A 600V-10A 600V-3A
50 ×××× 75.7
- Doing Mass-Productionup to 600V-30A
- 50A rated productwill be developedat the same PKGby July of 02
- Doing Mass-Production up to 600V-20A
- The 30A-product will befinished by July of 02
- Development will be finishedby August, 02 up to 600V-30A
- Another PKG will be usedfor 600V- 50A and 1200V rated products
600V-50A / 1200V-25A
Smart Power Modules
SPMSPIM
• 3-phase IGBT Inverter• Gate driving and protection
with built-in HVIC
• 3-phase IGBT Inverter• Built-in rectifying diodes and
dynamic-braking or PFC circuit• Gate driving and protection
with built-in HVIC
TipDip Mini-Dip Tiny-Dip
- 10A ER sample : July of 02
- 3A ER sample: August of 02
41% 38% 38%
Fairchild Semiconductor – Smart Power ModuleJune 2002
Smartsolutions
Applicablemotor ratings
( KW)
Additionalfeatures
Air-conditionerWashing machine
Air-conditionerWashing machine
Kitchen Fan motorRefrigeratorWashing Machine(BLDC)
Brushless BLDC Fan motor
Industrial - DC serve motor- Sewing machine- Elevator
- Current protection.- Sensorless available - Over temperature
monitoring.- Short circuit protection
-Compact solution.(Reduce board space)
-Sensorless available(Remove hall sensor)
- DBC substrate structure - Including bridge diode- Current sensing- Sensorless available - Over temperature
monitoring.- Short circuit protection
0.4 - 3.7
0.4 - 2.2
0.15 - 0.4
- 0.15
0.4 - 2.2
Major Application
TIP-SPM
DIP-SPM
Mini-DIP-SPM
Tiny-DIP-SPM
SPIM
Common features
- Low-loss efficient IGBTs FRDs .
- 3 Phase IGBT inverter bridgeIncluding control IC for gateDriving and protection.
- Low leakage current andHigh isolation voltagedue to ceramic-based substrate.
- Single-ground power supplyDue to built-in HVIC.
Fairchild Smart Solutions
Fairchild Semiconductor – Smart Power ModuleJune 2002
Maj
or
Ap
pli
cati
on
Industrial
5A 10A 15A 20A 50A30A3AH M L
W/M
Mass Production
Refrigerator
A/C
Current rating
X
X
XX
XX
X
Frequency
Fan motor
In development
2A1A
SPM Line-up Status & Plan by Application
Fairchild Semiconductor – Smart Power ModuleJune 2002
50 ×××× 75.7
- Development will be finishedby , August 02 up to 600V-30A
- Another PKG will be usedfor 600V- 50A and 1200Vrated products
600V-50A / 1200V-25A
SPIM
COM(L)
VCC
IN(UL)
IN(VL)
IN(W L)
VFO
C(FOD)
C(SC)
OUT(UL)
OUT(VL)
OUT(W L)
NU (29)
NV (28)
NW (27)
U (32)
V (31)
W (30)
P (33)
(17) VS(W )
(16) VB(W )
(19) VS(V)
(18) VB(V)
(4) CSC
(5) CFOD
(6) VFO
(7) IN(W L)
(8) IN(VL)
(9) IN(UL)
(10) COM
(11) VCC
(3) RSC
VTH (2)
VCC
VB
OUTCOM
VSIN
VB
VS
OUT
IN
COM
VCC
VCC
VB
OUTCOM
VSIN
(12) IN(W H)
(13) IN(VH)
(21) VS(U)
(20) VB(U)
(14) IN(UH)
THERMISTOR
VCC
IN
OUT
COM
(22) R(23) S(24) T
B (35)
NB (26)
NR (25)
PR (25)
(15) IN (DB)
RTH (1)
Introduction to SPIM
•DBC (Direct Bonding Copper)
Substrate Structure
• Gate Driving Circuit using HVIC
for the Use of Single-power Supply
•Built-in Thermistor for internal
Temperature Detection
•Short-circuit Protection using
Low-side Sense-IGBTs
•Optional Single-phase Application
•Small Size of Packaging using
Multi-layer Technology
•Three N-terminals for Current
Control Application
Fairchild Semiconductor – Smart Power ModuleJune 2002
W V U N
(14) (15) (16) (17)
P
(1) VCC(L)
(2) COM(L)
(3) IN(UL)
(4) IN(VL)
(5) IN(WL)
(6) VFO
(7) CFOD
(8) CSC
(12) RTH
(11) VTH
(13)
THERMISTOR
(29) VB(U)
(22) COM(H)
(27) IN(UH)
(30) VS(U)
(28) VCC(UH)
(25) VB(V)
(23) IN(VH)
(24) VCC(VH)
(26) VS(V)
(20) VB(W)
(18) IN(WH)
(19) VCC(WH)
(21) VS(W)(10) NC
(9) RSC
VCC
Wout
Uout
Vout
C(SC)
C(FOD)
V(FO)
IN(WL)
IN(VL)
IN(UL)
COM(L)
Vcc
IN
COM
VB
HO
VS
Vcc
IN
COM
VB
HO
VS
Vcc
IN
COM
VB
HO
VS
COM(L)
VCC
IN(UL)
IN(VL)
IN(W L)
VFO
C(FOD)
C(SC)
OUT(UL)
OUT(VL)
OUT(W L)
(26) NU
(27) NV
(28) NW
(29) U
(30) V
(31) W
(32) P(23) VS(W )
(22) VB(W )
(19) VS(V)
(18) VB(V)
(9) CSC
(8) C FOD
(7) VFO
(5) IN(W L)
(4) IN(VL)
(3) IN(UL)
(2) CO M(L)
(1) VCC(L)
(10) RSC
(25) RT H
(24) VT H
(6) CO M(L)
VB
VS
OUT
INCOM
VCC
VB
VS
OUT
INCOM
VCC
VBVS
OUT
IN
COMVCC
(21) VCC(W H)
(20) IN(WH)
(17) VCC(W H)
(16) COM(H)
(15) IN(WH)
(14) VS(U)
(13) VB(U)
(12) VCC(UH)
(11) IN(UH)
THERMISTO R
57 ×××× 55 60 ×××× 30
600V-50A 600V-30A
- Doing Mass-Production up to 600V-30A- The 50A rated product will be developedat the same PKG by July of 02
- Doing Mass-Production up to 600V-20A- The 30A-product will be finished by July of 02
• Ceramic-based Transfer-
Molded-Type Packaging
• Gate Driving Circuit using
HVIC for the Use of Single-
power Supply
• Optional Built-in
Thermistor
• Short-circuit Protection
using Low-side
Sense-IGBTs
• Very Low Thermal
Resistance
(TIP-SPM : <1.7 at 30A Rating)
• Three N-terminals for
Current Control Application
(DIP-SPM)
TIP-SPM DIP-SPM
Introduction to Tip-SPM & Dip-SPM
Fairchild Semiconductor – Smart Power ModuleJune 2002
COM(L)
VCC
IN(UL)
IN(VL)
IN(W L)
VFO
C(FOD)
C(SC)
OUT(UL)
OUT(VL)
OUT(W L)
NU (21)
NV (22)
NW
(23)
U (24)
V (25)
W (26)
P (27)
(21) VS(W )
(20) VB(W )
(17) VS(V )
(16) VB(V )
(8) CSC
(7) CFOD
(6) VFO
(5) IN(W L)
(4) IN(VL)
(3) IN(UL)
(2) CO M(L)
(1) VCC(L)
VCC
VB
OUTCOM
VSIN
VB
VS
OUT
IN
COM
VCC
VCC
VB
OUTCOM
VSIN
(19) VCC(W H)
(18) IN(W H)
(15) VCC(W H)
(13) IN(W H)
(12) VS(U)
(11) VB(U)
(10) VCC(UH)
(9) IN(UH)
COM(L)
VCC
IN(UL)
IN(VL)
IN(W L)
VFO
C(FOD)
C(SC)
OUT(UL)
OUT(VL)
OUT(W L)
P
V
VB(W )
V
VB(V)
CSC
CFOD
VFO
IN(W L)
IN(VL)
IN(UL)
COM(L)
VCC(L)
VCC
VB
OUTCOM
VSIN
VB
VS
OUT
IN
COM
VCC
VCC
VB
OUTCOM
VSIN
IN(W H)
IN(W H)
U
VB(U)
IN(UH)
N
Introduction to Mini & Tiny-Dip-SPM
44 ×××× 26
600V-10A 600V-3A
- 10A ER sample : July of 02
- 3A ER sample: August of 02
• Ceramic-based Transfer-
Molded-Type Packaging
• Gate Driving Circuit using
HVIC for the Use of Single-
power Supply
• Short-circuit Protection
using Link Shunt-resistor
• Available for TPIM
(Transfer-molded-type
power integrated module)
according to User requirement
(Just Including Power Devices)
• Tiny-Dip-SPM is very suitable for
Small Fan Drive Applications
using Induction/BLDC Motors
• Three N-terminals for
Current Control Application
(Mini-Dip-SPM)
Mini-Dip34 ×××× 21 Tiny-Dip
Fairchild Semiconductor – Smart Power ModuleJune 2002
Structure and Internal Block-Diagram of Tip-SPM
IGBTFRDIC IC
3.0
1.5
7.2
55mm
57mm
Vcc
IN
COM
VB
HO
VS
Vcc
Wout
Uout
Vout
COM
C(SC)
C(FOD)
V(FO)
IN(WL)
IN(VL)
IN(UL)
COM
Vcc
IN
COM
VB
HO
VS
Vcc
IN
COM
VB
HO
VS
THERMISTOR
VCC(L)
COM
IN(UL)
IN(VL)
IN(WL)
V(FO)
C(FOD)
C(SC)
COM
R(SC)
R(V+h)
VCC(V+h)
WVUNP
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(11)
(10)
(12)
(13)(14)(15)(16)(17)
VB(U)
COM
IN(UH)
VS(U)
(29)
(28) VCC(UH)
VB(V)
IN(VH)
VCC(VH)
VS(V)
VB(W)
IN(WH)
VCC(WH)
VS(W)
(27)
(30)
(25)
(24)
(23)
(22)
(26)
(20)
(19)
(18)
(21)
Internal Block-diagram
Ceramic Base
Fairchild Semiconductor – Smart Power ModuleJune 2002
Typical Application Circuit Example
Vcc
IN
COM
VB
HO
VS
Vcc
Wout
Uout
Vout
COM
C(SC
)
C(FOD
)
NC
V(FO)
IN(WL)
IN(VL)
IN(UL)
COM
Vcc
IN
COM
VB
HO
VS
Vcc
IN
COM
VB
HO
VS
THERMISTOR
Motor
C P U
5V Line
15V Line
5V Line
5V Line15V LineSPM1
Low-Pass Filter Part
Thermal Detecting Application
System Connection Diagram for Tip-SPM
Fairchild Semiconductor – Smart Power ModuleJune 2002
IGBTFRD IC
3.0
1.0
7.2
60mm
31mm
Structure and Internal Block-Diagram of Dip-SPM
C O M (L )
V C C
IN (U L )
IN (V L )
IN (W L )
V F O
C (F O D )
C (S C )
O U T (U L )
O U T (V L )
O U T (W L )
NU
(2 6 )
NV
(27 )
NW
(2 8 )
U (29 )
V (30 )
W (3 1 )
P (32 )
(23 ) VS (W )
(22 ) VB (W )
(19 ) VS (V )
(18 ) VB (V )
(9 ) CS C
(8 ) CF O D
(7 ) VF O
(5 ) IN(W L )
(4 ) IN(V L )
(3 ) IN(U L )
(2 ) C O M(L )
(1 ) VC C (L )
(10 ) RS C
RT H
(2 5 )
V T H (2 4 )
(6 ) C O M(L )
V C C
V B
O U TC O M
V SIN
V B
V S
O U T
IN
C O M
V C C
V C C
V B
O U TC O M
V SIN
(21) VC C (W H )
(20 ) IN(W H )
(17 ) VC C (W H )
(15 ) IN(W H )
(16 ) C O M(H )
(14 ) VS (U )
(13 ) VB (U )
(12 ) VC C (U H )
(11 ) IN(U H )
T H E R M IS T O R
Internal Block-diagram
Fairchild Semiconductor – Smart Power ModuleJune 2002
System Connection Diagram for Dip-SPM
COM(L)
VCC
IN(UL)
IN(VL)
IN(W L)
VFO
C(FOD)
C(SC)
OUT(UL)
OUT(VL)
OUT(W L)
NU (26)
NV (27)
N W (28)
U (29)
V (30)
W (31)
P (32)
(23) V S(W )
(22) V B(W )
(19) V S(V)
(18) V B(V)
(9) C SC
(8) CFO D
(7) V FO
(5) IN (W L)
(4) IN (VL )
(3) IN (UL )
(2) CO M (L)
(1) V CC(L)
(10) R SC
VTH (24)
RTH (25)
(6) CO M (L)
VCC
VB
OUTCOM
VSIN
VB
VS
OUT
IN
COM
VCC
VCC
VB
OUTCOM
VSIN
(21) V CC(W H)
(20) IN (W H)
(17) V CC(VH)
(15) IN (VH)
(16) CO M (H)
(14) VS(U)
(13) V B(U)
(12) VCC(UH)
(11) IN (UH)
Fault
15V line
CBS C
BSC
RBS
DBS
CBS CBSC
RBS
DBS
CBS
CBSC
RBS
DBS
CSP15CSPC15
CFOD
5V line
RP
CPL
CBPF
RP
RP
RP
CPL
CPL
5V line
CPH
RP
CPH
RP
CPH
RP
RS
RS
RS
RS
RS
RS
RS
M
VdcCDCS
5V line
RTH
CSP05
CSPC05
THER MISTOR
Temp. Monitoring
Gating UH
Gating VH
Gating W H
Gating W L
Gating VL
Gating UL
CPF
CCCCPPPPUUUU
RFU
RFV
RFW
RSU
RSV
RSW
CFUC
FVC
FW
U-Phase Current
V-Phase CurrentW-Phase Current
RF
CSC
RSC
Inverter output current sensing application
Fairchild Semiconductor – Smart Power ModuleJune 2002
Comparisons – Dip-SPM
60××××3079××××31
up to 600V- 30A
• 27%-Smaller Size
• 20%-Lower Thermal
Resistance
• Optional built-in Thermistor
• Three N-terminals for
current control applications
• Short-circuit protection
using Sense-IGBTs
• Lower Thermal Resistance
• Reduced System Design Time
• Reduced Manufacturing Time
• High-yield in Manufacturing
• More Compact System
• Reduced Field Failure Ratio
• Fewer components to Order
and Stock
Fairchild Semiconductor – Smart Power ModuleJune 2002
Comparisons – Mini-Dip-SPM
up to 600V- 10A • 25%-Smaller Size
• Much Lower Thermal
Resistance
• Available for TPIM Structure
• Three N-terminals for
current control applications
• Lower Thermal Resistance
• Reduced System Design Time
• Reduced Manufacturing Time
• High-yield in Manufacturing
• More Compact System
• Reduced Field Failure Ratio
• Fewer components to Order
and Stock
44××××2649××××31
Fairchild Semiconductor – Smart Power ModuleJune 2002
0.0 0.1 0.2 0.3 0.4 0.50
5
10
15
20
25
I C [A
]
VSC
[V]
4.5㎲
Ic
Vce
Vsc
Linear Operation Region
Sensing Waveform
[0.2V/div.]
[5A/div.]
[20A/div.]
[100V/div.]
Protected Short-circuit Current
[10us/div.]
[1us/div.]
0.5V
[1V/div.]
• Low cost & small space solution• Highly precise :
≤≤≤≤ 8% of sensing resolution• Auto-reset function after
the fault-out duration time
Short-circuit Protection TechnologyUsing the Sense-IGBT
Fairchild Semiconductor – Smart Power ModuleJune 2002
0 5 10 1540
50
60
70
80
90
100
110
120
130
Irm s [A]
Ma
x.
He
at
Sin
k T
em
p [˚
C]
Irm s & He a t S ink Te m pe ra tu re
S P M2
TO -220F
0 5 10 1530
40
50
60
70
80
90
100
110
120
130
Irm s [A]
Ma
x.
He
at
Sin
k T
em
p [˚
C]
Irm s & He a t S ink Te m pe ra ture
S P M2
TO-220F
VDC = 300[V], fsw = 15kHz, Tj = 125[ºC]) VDC = 400[V], fsw = 15kHz, Tj = 125[ºC])
Comparing to a discrete approach using TO220fullpack device,at the same Tc condition of 80 °°°°C• Can increase the motor current (power) by around 33 %
and at the same motor current (power) condition (7A of rms value)• Can get the temperature margin by around 11 °°°°C
Note: General datasheet for TO220F device is considered for the comparison.
31%
10 °°°°C
33%
11 °°°°C
Comparison of Operation power RatingDip-SPM vs. Discrete IGBT
Fairchild Semiconductor – Smart Power ModuleJune 2002
High Frequency : H seriesHigh Frequency : H series
≤≤≤≤ 4 Khz
≥≥≥≥ 8 Khz
3,4 Khz
Washing Machine
Air-conditioner
3 – 9 Khz
Low Frequency : L seriesLow Frequency : L series
Low,Medium Frequency Low,Medium Frequency
Medium Frequency : M seriesMedium Frequency : M series
SPM Frequency
Fairchild Semiconductor – Smart Power ModuleJune 2002
Tip-SPM Line-up
Product Motor Rating Frequency [ Khz ] Isolation Voltage applicationFPAL10SH60FPBL10SH60FPAL15SH60FPBL15SH60FPAL15SL60
FPAL15SM60
FPBL15SL60
FPBL15SM60
FPAL20SL60FPAL20SM60
FPBL20SL60
FPBL20SM60
FPAL30SL60
FPBL30SL60
W/M
Aircon
2500Vrms
0.4KW
AC100 - 264V
0.75KW
AC100 - 264V
1.5KW
AC100 - 264V
2.2KW
AC100 - 264V
≥≥≥≥ 8
≥≥≥≥ 8
≥≥≥≥ 8
≤≤≤≤ 4
3 ~ 9
3 ~ 9
3 ~ 9
≤≤≤≤ 4
≤≤≤≤ 4
3 ~ 9
≤≤≤≤ 4
≤≤≤≤ 4
≤≤≤≤ 4
Fairchild Semiconductor – Smart Power ModuleJune 2002
Product Motor Rating Frequency [ Khz ] Isolation Voltage applicationFSAM10SH60FSBM10SH60FSAM15SH60FSBM15SH60FSAM15SL60
*FSAM15SM60
FSBM15SL60
*FSBM15SM60
FSAM20SL60*FSAM20SM60
FSBM20SL60
*FSBM20SM60
*FSAM30SL60
*FPBL30SL60
W/M
Aircon
2500Vrms
0.4KW
AC100 - 264V
0.75KW
AC100 - 264V
1.5KW
AC100 - 264V
2.2KW
AC100 - 264V
≥≥≥≥ 8
≥≥≥≥ 8
≥≥≥≥ 8
≤≤≤≤ 4
3 ~ 9
3 ~ 9
3 ~ 9
≤≤≤≤ 4
≤≤≤≤ 4
3 ~ 9
≤≤≤≤ 4
≤≤≤≤ 4
≤≤≤≤ 4
Dip-SPM Line-up
* Under development
Fairchild Semiconductor – Smart Power ModuleJune 2002
Motor Rating F a i r c h i l d M i t s u b i s h i S a n y o T o s h i b a application
0.4 KW
0.75 KW
1.5 KW
2.2 KW
FPAL10SH60 PM10CSJ060PS21353-GPS21553-GPM10CSJ060PS21353-GPS21553-GPS21254-EPS21454-EPS21254-EPS21454-EPM15CTMPS21244-EPS21444-EPM15CTMPS21244-EPS21444-EPM20CTMPS21245-EPS21445-EPM20CTMPS21245-EPS21445-EPM30CTJ060PS21246-EPM30CTJ060PS21246-E
FPBL10SH60
FPAL15SH60
FPBL15SH60
FPAL15SL60FPAL15SM60
FPBL15SL60FPBL15SM60
FPAL20SL60FPAL20SM60
FPBL20SL60FPBL20SM60
FPAL30SL60
FPBL30SL60
STK621-220STK621-051
STK621-320
STK621-320
STK621-400STK621-401
STK621-601 MIG30J501L
W/M
Aircon
Cross Reference
Fairchild Semiconductor – Smart Power ModuleJune 2002
F P A L 15 S H 60VOLTAGE RATING ( ×××× 10)
H: HIGH SWITCHING FREQUENCYM: MEDIUM SWITCHING FREQUENCYL: LOW SWITCHING FREQUENCY
S: SINGLE-POWER SUPPLYM: MULTI-POWER SUPPLYP: POWER DEVICES ONLY
CURRENT RATING
L: TIP TYPE OF SPMM : DIP TYPE OF SPMS : MINI DIP TYPE OF SPM U: TINY DIP TYPE OF SPMC: SPIM FOR ONE-PHASE INPUTD: SPIM FOR THREE-PHASE INPUT
A: BUILT-IN THERMISTORB: NO-THERMISTOR
P: COMMON N-TERMINALS: DIVIDED N-TERMINALS ( Sensorless )
FAIRCHILD SEMICONDUCTOR
Ordering Information
Fairchild Semiconductor – Smart Power ModuleJune 2002
Contact Points
조동휘조동휘조동휘조동휘(Group leader)[email protected] : 1833
이명호이명호이명호이명호(Manager)[email protected] : 1738
BJT/HV DIODE
양일수양일수양일수양일수(A. Manager)[email protected] : 1717Low to medium voltage BJTMosfet for Ballast
이정헌이정헌이정헌이정헌(A. Manager)[email protected] : 1738Horizontal deflection TRHV Diode(1.5/1.7kV)
임병철임병철임병철임병철(A.Manager)[email protected] : 1836
MOSFET
양성모양성모양성모양성모(A. Manager)[email protected] : 1836MOSFET/SUPER junction
조강희조강희조강희조강희(A. Manager)[email protected] : 1382Mosfet for PDP
김영주김영주김영주김영주(Manager)[email protected] : 1835
IGBT/SPM/TRIAC
김차광김차광김차광김차광(A. Manager)[email protected] : 1879SPM / SPIM
이용택이용택이용택이용택(A. Manager)[email protected] : 1835Discrete IGBT, TRIAC
오금심오금심오금심오금심(A. Manager)[email protected] : 1833Low voltage MOSFET
엄기주엄기주엄기주엄기주(A. Manager)[email protected] : 1879IGBT Module for Motor drive
* 032-680-*