PERANCANGAN DAN IMPLEMENTASI SISTEM TELEMETRI SUHU RUANGAN BERBASIS MIKROKONTROLER (DESIGN AND IMPLEMENTATION OF TELEMETRY SYSTEM FOR ROOM TEMPERATURE BASED ON MICROCONTROLLER) TUGAS AKHIR Diajukan untuk memenuhi salah satu syarat menyelesaikan program studi strata satu (S1) di Institut Teknologi Telkom Disusun oleh: MANIK ALIT WASTHARINI 111061033 FAKULTAS ELEKTRO DAN KOMUNIKASI INSTITUT TEKNOLOGI TELKOM BANDUNG 2010
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
PERANCANGAN DAN IMPLEMENTASI SISTEM TELEMETRI
SUHU RUANGAN BERBASIS MIKROKONTROLER
(DESIGN AND IMPLEMENTATION OF TELEMETRY SYSTEM FOR ROOM
TEMPERATURE BASED ON MICROCONTROLLER)
TUGAS AKHIR
Diajukan untuk memenuhi salah satu syarat menyelesaikan program studi strata satu
(S1) di Institut Teknologi Telkom
Disusun oleh:
MANIK ALIT WASTHARINI
111061033
FAKULTAS ELEKTRO DAN KOMUNIKASI
INSTITUT TEKNOLOGI TELKOM
BANDUNG
2010
ii
LEMBAR PENGESAHAN
PERANCANGAN DAN IMPLEMENTASI SISTEM TELEMETRI SUHU
RUANGAN BERBASIS MIKROKONTROLER
DESIGN AND IMPLEMENTATION OF TELEMETRY SYSTEM FOR ROOM
TEMPERATURE BASED ON MICROCONTROLLER
Telah diperiksa dan disetujui sebagai salah satu syarat untuk menyelesaikan program Strata 1
pada Fakultas Elektro dan Komunikasi
Institut Teknologi Telkom
Oleh :
Manik Alit Wastharini
111061033
Bandung, Juli 2010
Disahkan oleh :
Pembimbing I
Dharu Arseno,Ir.MT.
NIP : 02690271-1
Pembimbing II
Iswahyudi Hidayat, ST.MT.
NIP : 02770269-1
iii
HALAMAN PERNYATAAN ORISINALITAS
Tugas Akhir ini merupakan karya orisinal saya sendiri. Atas pernyataan ini, saya siap
menanggung resiko/sanksi yang dijatuhkan kepada saya apabila kemudian ditemukan adanya
pelanggaran terhadap kejujuran akademik atau etika keilmuan dalam karya ini, atau
ditemukan bukti yang menunjukan ketidakaslian karya ini.
Bandung, Juli 2010
Manik Alit Wastharini
iv
ABSTRACT
Telemetry is a process of measuring parameters of an object (i.e. a thing, space, or
environmental condition) and transferring the output to other media through wired-data-
transfer-mechanism or wireless communication. Then, it can be directly utilized or analyzed
first for specific purposes. In this final project, telemetry system will be used to design a
system that can measure room temperature. It is expected to enhance the, currently used,
temperature control system. Nowadays, the means of controlling temperature is still done
manually or by using remote control wherever the instrumentation is placed. With the
telemetry system, temperature control can be done from afar.
In this final project, RF (YS1020-UA) module is used to build the design and
implementation of telemetry-system-enhanced temperature measurement. Telemetry
instrumentations consist of hardware and software, which is located in both receiver and
transmitter. In the transmitter, there is a temperature sensor that is integrated with
microcontroller ATMega8535 and transmitted using YS1020-UA module. The YS1020-UA
module in receiver will accept the transmission and connects it to PC. Temperature
controlling is done in receiver by transmitting minimum standard temperature to activate the
fan.
The examination of telemetry system is done in power supply block, temperature
sensor, fan motor driver, microcontroller, RF module, and application in PC. The result of the
examination shows that system works well. The time average for one temperature data
transmission is 0.148 seconds in indoor condition. Failing rate that happens in 128 times
temperature data transmissions is 6.25% with the maximum distance of 70 meters.
Key words: telemetry, PWM, RF module, temperature sensor, microcontroller ATMega8535
v
ABSTRAKSI
Telemetri adalah proses pengukuran parameter suatu obyek (benda, ruang, kondisi
alam), yang hasil pengukurannya di kirimkan ke tempat lain melalui proses pengiriman data
baik dengan menggunakan kabel maupun tanpa menggunakan kabel (wireless), selanjutnya
data tersebut dapat dimanfaatkan langsung atau dianalisa untuk keperluan tertentu. Dalam
tugas akhir ini, akan dirancang sistem pengukuran suhu menggunakan telemetri. Dengan
menggunakan sistem telemetri diharapkan memberikan kemudahan bagi manusia dalam
sistem pengendalian suhu. Apalagi saat ini pengontrolan suhu masih dilakukan secara manual
atau menggunakan remote control, dimana pengontrolan dilakukan di tempat perangkat
berada. Dengan menggunakan sistem telemetri, pengontrolan suhu dapat dilakukan di tempat
berbeda.
Desain dan realisasi sistem pengukuran suhu ruangan menggunakan sistem telemetri,
dalam hal ini menggunakan modul RF (YS1020-UA). Perangkat telemetri terdiri dari
hardware dan software, dimana perangkat ini terdapat dibagian pengirim dan penerima. Di
bagian pengirim terdapat sensor suhu yang akan terintegrasi dengan mikrokontroler
ATMega8535 kemudian ditransmisikan menggunakan perangkat YS1020-UA. Setelah
ditransmisikan, di bagian penerima akan diterima oleh YS1020-UA dan dihubungkan dengan
PC. Pengontrolan suhu dilakukan dibagian penerima, dengan mengirimkan suhu standar
minimal untuk mengaktifkan kipas.
Pengujian sistem dilakukan mulai dari blok catu daya, sensor suhu, driver motor kipas,
mikrokontroler, RF modul, dan aplikasi pada PC. Hasil dari pengujian tersebut menunjukkan
bahwa sistem dapat bekerja dengan baik. Rata-rata waktu yang dibutuhkan untuk satu kali
pengiriman data suhu adalah 0.148 detik pada kondisi terdapat obstacle. Faktor kegagalan
yang terjadi dari 128 pengiriman data suhu adalah 6.25% dengan jarak maksimum 70 meter.
Private Sub but_setsuhu_Click(ByVal sender As System.Object, ByVal e As
System.EventArgs) Handles but_setsuhu.Click
Dim input As String
Dim i As Integer = CInt(input_suhu.Text)
Dim bu10() As Byte = &HA
Dim bu11() As Byte = &HB
Dim bu12() As Byte = &HC
Dim bu13() As Byte = &HD
Dim bu14() As Byte = &HE
Dim bu15() As Byte = &HF
Dim bu16() As Byte = &H10
Dim bu17() As Byte = &H11
Dim bu18() As Byte = &H12
Dim bu19() As Byte = &H13
Dim bu20() As Byte = &H14
Dim bu21() As Byte = &H15
Dim bu22() As Byte = &H16
Dim bu23() As Byte = &H17
Dim bu24() As Byte = &H18
Dim bu25() As Byte = &H19
Dim bu26() As Byte = &H1A
Dim bu27() As Byte = &H1B
Dim bu28() As Byte = &H1C
Dim bu29() As Byte = &H1D
Dim bu30() As Byte = &H1E
Dim bu31() As Byte = &H1F
Dim bu32() As Byte = &H20
Dim bu33() As Byte = &H21
Dim bu34() As Byte = &H22
Dim bu35() As Byte = &H23
Dim bu36() As Byte = &H24
Dim bu37() As Byte = &H25
Dim bu38() As Byte = &H26
Dim bu39() As Byte = &H27
Dim bu40() As Byte = &H28
If i = 10 Then
sport.Write(bu10)
ElseIf i = 11 Then
sport.Write(bu11)
ElseIf i = 12 Then
sport.Write(bu12)
ElseIf i = 13 Then
sport.Write(bu13)
ElseIf i = 14 Then
sport.Write(bu14)
ElseIf i = 15 Then
sport.Write(bu15)
ElseIf i = 16 Then
sport.Write(bu16)
ElseIf i = 17 Then
sport.Write(bu17)
ElseIf i = 18 Then
sport.Write(bu18)
ElseIf i = 19 Then
sport.Write(bu19)
ElseIf i = 20 Then
sport.Write(bu20)
ElseIf i = 21 Then
sport.Write(bu21)
ElseIf i = 22 Then
sport.Write(bu22)
ElseIf i = 23 Then
sport.Write(bu23)
ElseIf i = 24 Then
sport.Write(bu24)
ElseIf i = 25 Then
sport.Write(bu25)
ElseIf i = 26 Then
sport.Write(bu26)
ElseIf i = 27 Then
sport.Write(bu27)
ElseIf i = 28 Then
sport.Write(bu28)
ElseIf i = 29 Then
sport.Write(bu29)
ElseIf i = 30 Then
sport.Write(bu30)
ElseIf i = 31 Then
sport.Write(bu31)
ElseIf i = 32 Then
sport.Write(bu32)
ElseIf i = 33 Then
sport.Write(bu33)
ElseIf i = 34 Then
sport.Write(bu34)
ElseIf i = 35 Then
sport.Write(bu35)
ElseIf i = 36 Then
sport.Write(bu36)
ElseIf i = 37 Then
sport.Write(bu37)
ElseIf i = 38 Then
sport.Write(bu38)
ElseIf i = 39 Then
sport.Write(bu39)
ElseIf i = 40 Then
sport.Write(bu40)
End If
box_suhulama.Text = i
box_normal.Text = i
End Sub
End Class
LAMPIRAN
Datasheet
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Featuring Unitrode L293 and L293DProducts Now From Texas Instruments
Wide Supply-Voltage Range: 4.5 V to 36 V
Separate Input-Logic Supply
Internal ESD Protection
Thermal Shutdown
High-Noise-Immunity Inputs
Functionally Similar to SGS L293 andSGS L293D
Output Current 1 A Per Channel(600 mA for L293D)
Peak Output Current 2 A Per Channel(1.2 A for L293D)
Output Clamp Diodes for InductiveTransient Suppression (L293D)
description/ordering information
The L293 and L293D are quadruple high-currenthalf-H drivers. The L293 is designed to providebidirectional drive currents of up to 1 A at voltagesfrom 4.5 V to 36 V. The L293D is designed toprovide bidirectional drive currents of up to600-mA at voltages from 4.5 V to 36 V. Bothdevices are designed to drive inductive loads suchas relays, solenoids, dc and bipolar steppingmotors, as well as other high-current/high-voltageloads in positive-supply applications.
All inputs are TTL compatible. Each output is acomplete totem-pole drive circuit, with aDarlington transistor sink and a pseudo-Darlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4enabled by 3,4EN. When an enable input is high, the associated drivers are enabled, and their outputs are activeand in phase with their inputs. When the enable input is low, those drivers are disabled, and their outputs areoff and in the high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or bridge)reversible drive suitable for solenoid or motor applications.
ORDERING INFORMATION
TA PACKAGE † ORDERABLEPART NUMBER
TOP-SIDEMARKING
HSOP (DWP) Tube of 20 L293DWP L293DWP
0°C to 70°CPDIP (N) Tube of 25 L293N L293N
0°C to 70°C
PDIP (NE)Tube of 25 L293NE L293NE
PDIP (NE)Tube of 25 L293DNE L293DNE
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
HEAT SINK ANDGROUND
HEAT SINK ANDGROUND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1,2EN1A1Y
2Y2A
VCC2
VCC14A4Y
3Y3A3,4EN
L293 . . . N OR NE PACKAGEL293D . . . NE PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1,2EN1A1YNCNCNC
NCNC2Y2A
VCC2
VCC14A4YNCNCNC
NCNC3Y3A3,4EN
L293 . . . DWP PACKAGE(TOP VIEW)
HEAT SINK ANDGROUND
HEAT SINK ANDGROUND
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
On the L293, external high-speed output clamp diodes should be used for inductive transient suppression.
A VCC1 terminal, separate from VCC2, is provided for the logic inputs to minimize device power dissipation.
The L293and L293D are characterized for operation from 0°C to 70°C.
block diagram
10
3
4
5
6
7
8 9
10
11
12
13
14
15
161
210
1
10
2
4
3
M
M
M
10
10
10
VCC2
VCC1
NOTE: Output diodes are internal in L293D.
FUNCTION TABLE(each driver)
INPUTS† OUTPUTA EN
OUTPUTY
H H H
L H L
X L Z
H = high level, L = low level, X = irrelevant,Z = high impedance (off)† In the thermal shutdown mode, the output is
in the high-impedance state, regardless ofthe input levels.
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram
ÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁ
2
1
7
10
9
15
3
6
11
14
1A
1,2EN
2A
3A
3,4EN
4A
1Y
2Y
3Y
4Y
schematics of inputs and outputs (L293)
Input
VCC2
Output
GND
TYPICAL OF ALL OUTPUTSEQUIVALENT OF EACH INPUT
VCC1
CurrentSource
GND
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
schematics of inputs and outputs (L293D)
Input
VCC2
Output
GND
TYPICAL OF ALL OUTPUTSEQUIVALENT OF EACH INPUT
VCC1
CurrentSource
GND
absolute maximum ratings over operating free-air temperature range (unless otherwise noted) †
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, andfunctional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is notimplied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to the network ground terminal.2. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/JA. Operating at the absolute maximum TJ of 150°C can affect reliability.3. The package thermal impedance is calculated in accordance with JESD 51-7.
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions
MIN MAX UNIT
Supply voltageVCC1 4.5 7
VSupply voltageVCC2 VCC1 36
V
VIH High-level input voltageVCC1 ≤ 7 V 2.3 VCC1 V
VIH High-level input voltageVCC1 ≥ 7 V 2.3 7 V
VIL Low-level output voltage −0.3† 1.5 V
TA Operating free-air temperature 0 70 °C† The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage levels.
electrical characteristics, V CC1 = 5 V, VCC2 = 24 V, TA = 25°CPARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOKH High-level output clamp voltage L293D: IOK = −0.6 A VCC2 + 1.3 V
VOKL Low-level output clamp voltage L293D: IOK = 0.6 A 1.3 V
IIH High-level input currentA
VI = 7 V0.2 100
AIIH High-level input currentEN
VI = 7 V0.2 10
µA
IIL Low-level input currentA
VI = 0−3 −10
AIIL Low-level input currentEN
VI = 0−2 −100
µA
All outputs at high level 13 22
ICC1 Logic supply current IO = 0 All outputs at low level 35 60 mAICC1 Logic supply current IO = 0
All outputs at high impedance 8 24
mA
All outputs at high level 14 24
ICC2 Output supply current IO = 0 All outputs at low level 2 6 mAICC2 Output supply current IO = 0
All outputs at high impedance 2 4
mA
switching characteristics, V CC1 = 5 V, VCC2 = 24 V, TA = 25°C
PARAMETER TEST CONDITIONSL293NE, L293DNE
UNITPARAMETER TEST CONDITIONSMIN TYP MAX
UNIT
tPLH Propagation delay time, low-to-high-level output from A input 800 ns
tPHL Propagation delay time, high-to-low-level output from A inputCL = 30 pF, See Figure 1
400 ns
tTLH Transition time, low-to-high-level outputCL = 30 pF, See Figure 1
300 ns
tTHL Transition time, high-to-low-level output 300 ns
switching characteristics, V CC1 = 5 V, VCC2 = 24 V, TA = 25°C
PARAMETER TEST CONDITIONS
L293DWP, L293NL293DN UNITPARAMETER TEST CONDITIONS
MIN TYP MAXUNIT
tPLH Propagation delay time, low-to-high-level output from A input 750 ns
tPHL Propagation delay time, high-to-low-level output from A inputCL = 30 pF, See Figure 1
200 ns
tTLH Transition time, low-to-high-level outputCL = 30 pF, See Figure 1
100 ns
tTHL Transition time, high-to-low-level output 350 ns
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
Output
CL = 30 pF(see Note A)
VCC1
Input
3 V
TEST CIRCUIT
tf tr3 V
0
tPHL
VOH
tTHL tTLH
VOLTAGE WAVEFORMS
tPLH
Output
Input
VOL
tw
NOTES: A. CL includes probe and jig capacitance.B. The pulse generator has the following characteristics: tr ≤ 10 ns, tf ≤ 10 ns, tw = 10 µs, PRR = 5 kHz, ZO = 50 Ω.
PulseGenerator
(see Note B)
5 V 24 V
VCC2
A
EN
Y90% 90%
50%
10%
50%
10%
90% 90%
50%
10%
50%
10%
Figure 1. Test Circuit and Voltage Waveforms
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
7POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
24 V5 V
10 kΩ
VCC1VCC2
Control A
Control B
4, 5, 12, 13
GND
ThermalShutdown
Motor
16 8
3
6
11
14
4Y
3Y
2Y
1Y
1,2EN
1A
2A
3,4EN
3A
4A
15
10
9
7
2
1
Figure 2. Two-Phase Motor Driver (L293)
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
24 V5 V
10 kΩ
VCC1 VCC2
16 8
1,2EN1
1A2
2A
7
3,4EN
9
3A10
4A15
Control A
Control B
4, 5, 12, 13
GND
ThermalShutdown
Motor
1Y
3
2Y
6
3Y
11
4Y
14
Figure 3. Two-Phase Motor Driver (L293D)
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
9POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
EN 3A M1 4A M2
H H Fast motor stop H Run
H L Run L Fast motor stop
L XFree-running motorstop
XFree-running motorstop
L = low, H = high, X = don’t care
EN 1A 2A FUNCTION
H L H Turn right
H H L Turn left
H L L Fast motor stop
H H H Fast motor stop
L X X Fast motor stop
L = low, H = high, X = don’t care
VCC2 SES5001
1/2 L293
4, 5, 12, 13
10
SES5001
VCC1
EN
1511 14
16
9
M2
M1
3A 4A
8
Figure 4. DC Motor Controls(connections to ground and to
supply voltage)
GND
2 × SES5001
1/2 L293
4, 5, 12, 13
367
8
1
216
VCC2
2 × SES5001
2A 1A
VCC1
EN
M
Figure 5. Bidirectional DC Motor Control
GND
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
3
4
5
6
7
8
1
2
9
10
11
12
13
14
15
16
+
+
+
+
D7
D8 D4
D3
L2 IL2
C1
D5 D1
D6 D2
VCC1L293
IL1/IL2 = 300 mA
0.22 µF
VCC2 L1 IL1
D1−D8 = SES5001
Figure 6. Bipolar Stepping-Motor Control
mounting instructions
The Rthj-amp of the L293 can be reduced by soldering the GND pins to a suitable copper area of the printedcircuit board or to an external heat sink.
Figure 9 shows the maximum package power PTOT and the θJA as a function of the side of two equal squarecopper areas having a thickness of 35 µm (see Figure 7). In addition, an external heat sink can be used (seeFigure 8).
During soldering, the pin temperature must not exceed 260°C, and the soldering time must not exceed 12seconds.
The external heatsink or printed circuit copper area must be connected to electrical ground.
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
11POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
Copper Area 35- µm Thickness
Printed Circuit Board
Figure 7. Example of Printed Circuit Board Copper Area (used as heat sink)
L293DDWPTR OBSOLETE SOIC DW 28 TBD Call TI Call TI
L293DN OBSOLETE PDIP N 16 TBD Call TI Call TI
L293DNE ACTIVE PDIP NE 16 25 Pb-Free(RoHS)
CU NIPDAU Level-NC-NC-NC
L293DNEE4 ACTIVE PDIP NE 16 25 Pb-Free(RoHS)
CU NIPDAU Level-NC-NC-NC
L293DSP OBSOLETE 16 TBD Call TI Call TI
L293DSP883B OBSOLETE 16 TBD Call TI Call TI
L293DSP883C OBSOLETE UTR TBD Call TI Call TI
L293DWP ACTIVE SOPower PAD
DWP 28 20 Green (RoHS &no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
L293DWPG4 ACTIVE SOPower PAD
DWP 28 20 TBD Call TI Call TI
L293DWPTR OBSOLETE SOPower PAD
DWP 28 TBD Call TI Call TI
L293N ACTIVE PDIP N 16 25 Green (RoHS &no Sb/Br)
Call TI Level-NC-NC-NC
L293NE ACTIVE PDIP NE 16 25 Pb-Free(RoHS)
CU NIPDAU Level-NC-NC-NC
L293NEE4 ACTIVE PDIP NE 16 25 Pb-Free(RoHS)
CU NIPDAU Level-NC-NC-NC
(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please checkhttp://www.ti.com/productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak soldertemperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to theaccuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis onincoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limitedinformation may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TIto Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 12-Sep-2005
Addendum-Page 2
MECHANICAL DATA
MPDI003 – OCTOBER 1994
1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
NE (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE20 PIN SHOWN
2016PINS **
0.780 (19,80)
0.240 (6,10)
0.260 (6,60)
Seating Plane
DIM
0.975 (24,77)
0.914 (23,22)
0.930 (23,62)
1.000 (25,40)
0.260 (6,61)
0.280 (7,11)
Seating Plane
0.010 (0,25) NOM
4040054/B 04/95
0.310 (7,87)0.290 (7,37)
0.070 (1,78) MAX
C
10
0.021 (0,533)0.015 (0,381)
A
11
1
20
0.015 (0,381)0.021 (0,533)
B
0.200 (5,08) MAX
0.020 (0,51) MIN
0.125 (3,17)0.155 (3,94)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.155 (3,94)0.125 (3,17)
M0.010 (0,25)
M0.010 (0,25)0.100 (2,54) 0°–15°
0.100 (2,54)
C
B
A
MIN
MAX
MIN
MAX
MIN
MAX
NOTES: A. All linear dimensions are in inches (millimeters).B. This drawing is subject to change without notice.C. Falls within JEDEC MS-001 (16 pin only)
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. To minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:
LM35/LM35A/LM35C/LM35CA/LM35DPrecision Centigrade Temperature SensorsGeneral DescriptionThe LM35 series are precision integrated-circuit tempera-
ture sensors, whose output voltage is linearly proportional to
the Celsius (Centigrade) temperature. The LM35 thus has
an advantage over linear temperature sensors calibrated in §Kelvin, as the user is not required to subtract a large con-
stant voltage from its output to obtain convenient Centi-
grade scaling. The LM35 does not require any external cali-
bration or trimming to provide typical accuracies of g(/4§Cat room temperature and g*/4§C over a full b55 to a150§Ctemperature range. Low cost is assured by trimming and
calibration at the wafer level. The LM35’s low output imped-
ance, linear output, and precise inherent calibration make
interfacing to readout or control circuitry especially easy. It
can be used with single power supplies, or with plus and
minus supplies. As it draws only 60 mA from its supply, it has
very low self-heating, less than 0.1§C in still air. The LM35 is
rated to operate over a b55§ to a150§C temperature
range, while the LM35C is rated for a b40§ to a110§Crange (b10§ with improved accuracy). The LM35 series is
available packaged in hermetic TO-46 transistor packages,
while the LM35C, LM35CA, and LM35D are also available in
the plastic TO-92 transistor package. The LM35D is also
available in an 8-lead surface mount small outline package
and a plastic TO-202 package.
FeaturesY Calibrated directly in § Celsius (Centigrade)Y Linear a 10.0 mV/§C scale factorY 0.5§C accuracy guaranteeable (at a25§C)Y Rated for full b55§ to a150§C rangeY Suitable for remote applicationsY Low cost due to wafer-level trimmingY Operates from 4 to 30 voltsY Less than 60 mA current drainY Low self-heating, 0.08§C in still airY Nonlinearity only g(/4§C typicalY Low impedance output, 0.1 X for 1 mA load
Connection DiagramsTO-46
Metal Can Package*
TL/H/5516–1
*Case is connected to negative pin (GND)
Order Number LM35H, LM35AH,
LM35CH, LM35CAH or LM35DH
See NS Package Number H03H
TO-92
Plastic Package
TL/H/5516–2
Order Number LM35CZ,
LM35CAZ or LM35DZ
See NS Package Number Z03A
SO-8
Small Outline Molded Package
TL/H/5516–21
Top View
N.C. e No Connection
Order Number LM35DM
See NS Package Number M08A
TO-202
Plastic Package
TL/H/5516–24
Order Number LM35DP
See NS Package Number P03A
Typical Applications
TL/H/5516–3
FIGURE 1. Basic Centigrade
Temperature
Sensor (a2§C to a150§C)
TL/H/5516–4
Choose R1 e bVS/50 mA
VOUTea1,500 mV at a150§Cea250 mV at a25§Ceb550 mV at b55§C
FIGURE 2. Full-Range Centigrade
Temperature Sensor
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
C1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.
Absolute Maximum Ratings (Note 10)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage a35V to b0.2V
Output Voltage a6V to b1.0V
Output Current 10 mA
Storage Temp., TO-46 Package, b60§C to a180§CTO-92 Package, b60§C to a150§CSO-8 Package, b65§C to a150§CTO-202 Package, b65§C to a150§C
(Note 3) 0sILs1 mA TMINsTAsTMAX g0.5 g3.0 g0.5 g3.0 mV/mA
Line Regulation TAea25§C g0.01 g0.05 g0.01 g0.05 mV/V
(Note 3) 4VsVSs30V g0.02 g0.1 g0.02 g0.1 mV/V
Quiescent Current VSea5V, a25§C 56 67 56 67 mA
(Note 9) VSea5V 105 131 91 114 mA
VSea30V, a25§C 56.2 68 56.2 68 mA
VSea30V 105.5 133 91.5 116 mA
Change of 4VsVSs30V, a25§C 0.2 1.0 0.2 1.0 mA
Quiescent Current 4VsVSs30V 0.5 2.0 0.5 2.0 mA
(Note 3)
Temperature a0.39 a0.5 a0.39 a0.5 mA/§CCoefficient of
Quiescent Current
Minimum Temperature In circuit of a1.5 a2.0 a1.5 a2.0 §Cfor Rated Accuracy Figure 1, ILe0
Long Term Stability TJeTMAX, for g0.08 g0.08 §C1000 hours
Note 1: Unless otherwise noted, these specifications apply: b55§CsTJsa150§C for the LM35 and LM35A; b40§sTJsa110§C for the LM35C and LM35CA; and
0§sTJsa100§C for the LM35D. VSea5Vdc and ILOADe50 mA, in the circuit of Figure 2. These specifications also apply from a2§C to TMAX in the circuit of
Figure 1. Specifications in boldface apply over the full rated temperature range.
Note 2: Thermal resistance of the TO-46 package is 400§C/W, junction to ambient, and 24§C/W junction to case. Thermal resistance of the TO-92 package is
180§C/W junction to ambient. Thermal resistance of the small outline molded package is 220§C/W junction to ambient. Thermal resistance of the TO-202 package
is 85§C/W junction to ambient. For additional thermal resistance information see table in the Applications section.
(Note 3) 0sILs1 mA TMINsTAsTMAX g0.5 g5.0 g0.5 g5.0 mV/mA
Line Regulation TAea25§C g0.01 g0.1 g0.01 g0.1 mV/V
(Note 3) 4VsVSs30V g0.02 g0.2 g0.02 g0.2 mV/V
Quiescent Current VSea5V, a25§C 56 80 56 80 mA
(Note 9) VSea5V 105 158 91 138 mA
VSea30V, a25§C 56.2 82 56.2 82 mA
VSea30V 105.5 161 91.5 141 mA
Change of 4VsVSs30V, a25§C 0.2 2.0 0.2 2.0 mA
Quiescent Current 4VsVSs30V 0.5 3.0 0.5 3.0 mA
(Note 3)
Temperature a0.39 a0.7 a0.39 a0.7 mA/§CCoefficient of
Quiescent Current
Minimum Temperature In circuit of a1.5 a2.0 a1.5 a2.0 §Cfor Rated Accuracy Figure 1, ILe0
Long Term Stability TJeTMAX, for g0.08 g0.08 §C1000 hours
Note 3: Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be
computed by multiplying the internal dissipation by the thermal resistance.
Note 4: Tested Limits are guaranteed and 100% tested in production.
Note 5: Design Limits are guaranteed (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are not used to
calculate outgoing quality levels.
Note 6: Specifications in boldface apply over the full rated temperature range.
Note 7: Accuracy is defined as the error between the output voltage and 10mv/§C times the device’s case temperature, at specified conditions of voltage, current,
and temperature (expressed in §C).
Note 8: Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device’s rated temperature
range.
Note 9: Quiescent current is defined in the circuit of Figure 1.
Note 10: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when
operating the device beyond its rated operating conditions. See Note 1.
Note 11: Human body model, 100 pF discharged through a 1.5 kX resistor.
Note 12: See AN-450 ‘‘Surface Mounting Methods and Their Effect on Product Reliability’’ or the section titled ‘‘Surface Mount’’ found in a current National
Semiconductor Linear Data Book for other methods of soldering surface mount devices.
3
Typical Performance Characteristics
Thermal Resistance
Junction to Air Thermal Time Constant
Thermal Response
in Still Air
Thermal Response in
Stirred Oil Bath
Minimum Supply
Voltage vs. Temperature
Quiescent Current
vs. Temperature
(In Circuit ofFigure 1.)
TL/H/5516–17
Quiescent Current
vs. Temperature
(In Circuit ofFigure 2.)
Accuracy vs. Temperature
(Guaranteed)
Accuracy vs. Temperature
(Guaranteed)
TL/H/5516–18
Start-Up ResponseNoise Voltage
TL/H/5516–22
4
ApplicationsThe LM35 can be applied easily in the same way as other
integrated-circuit temperature sensors. It can be glued or
cemented to a surface and its temperature will be within
about 0.01§C of the surface temperature.
This presumes that the ambient air temperature is almost
the same as the surface temperature; if the air temperature
were much higher or lower than the surface temperature,
the actual temperature of the LM35 die would be at an inter-
mediate temperature between the surface temperature and
the air temperature. This is expecially true for the TO-92
plastic package, where the copper leads are the principal
thermal path to carry heat into the device, so its tempera-
ture might be closer to the air temperature than to the sur-
face temperature.
To minimize this problem, be sure that the wiring to the
LM35, as it leaves the device, is held at the same tempera-
ture as the surface of interest. The easiest way to do this is
to cover up these wires with a bead of epoxy which will
insure that the leads and wires are all at the same tempera-
ture as the surface, and that the LM35 die’s temperature will
not be affected by the air temperature.
The TO-46 metal package can also be soldered to a metal
surface or pipe without damage. Of course, in that case the
Vb terminal of the circuit will be grounded to that metal.
Alternatively, the LM35 can be mounted inside a sealed-end
metal tube, and can then be dipped into a bath or screwed
into a threaded hole in a tank. As with any IC, the LM35 and
accompanying wiring and circuits must be kept insulated
and dry, to avoid leakage and corrosion. This is especially
true if the circuit may operate at cold temperatures where
condensation can occur. Printed-circuit coatings and var-
nishes such as Humiseal and epoxy paints or dips are often
used to insure that moisture cannot corrode the LM35 or its
connections.
These devices are sometimes soldered to a small light-
weight heat fin, to decrease the thermal time constant and
speed up the response in slowly-moving air. On the other
hand, a small thermal mass may be added to the sensor, to
give the steadiest reading despite small deviations in the air
temperature.
Temperature Rise of LM35 Due To Self-heating (Thermal Resistance)
TO-46, TO-46, TO-92, TO-92, SO-8 SO-8 TO-202 TO-202 ***no heat sink small heat fin* no heat sink small heat fin** no heat sink small heat fin** no heat sink small heat fin
Still air 400§C/W 100§C/W 180§C/W 140§C/W 220§C/W 110§C/W 85§C/W 60§C/W
Moving air 100§C/W 40§C/W 90§C/W 70§C/W 105§C/W 90§C/W 25§C/W 40§C/W
Still oil 100§C/W 40§C/W 90§C/W 70§C/W
Stirred oil 50§C/W 30§C/W 45§C/W 40§C/W
(Clamped to metal,
Infinite heat sink) (24§C/W) (55§C/W) (23§C/W)
* Wakefield type 201, or 1× disc of 0.020× sheet brass, soldered to case, or similar.
** TO-92 and SO-8 packages glued and leads soldered to 1× square of (/16× printed circuit board with 2 oz. foil or similar.
Typical Applications (Continued)
TL/H/5516–19
FIGURE 3. LM35 with Decoupling from Capacitive Load
TL/H/5516–20
FIGURE 4. LM35 with R-C Damper
CAPACITIVE LOADS
Like most micropower circuits, the LM35 has a limited ability
to drive heavy capacitive loads. The LM35 by itself is able to
drive 50 pf without special precautions. If heavier loads are
anticipated, it is easy to isolate or decouple the load with a
resistor; see Figure 3. Or you can improve the tolerance of
capacitance with a series R-C damper from output to
ground; see Figure 4.
When the LM35 is applied with a 200X load resistor as
shown in Figure 5, 6, or 8, it is relatively immune to wiring
capacitance because the capacitance forms a bypass from
ground to input, not on the output. However, as with any
linear circuit connected to wires in a hostile environment, its
performance can be affected adversely by intense electro-
magnetic sources such as relays, radio transmitters, motors
with arcing brushes, SCR transients, etc, as its wiring can
act as a receiving antenna and its internal junctions can act
as rectifiers. For best results in such cases, a bypass capac-
itor from VIN to ground and a series R-C damper such as
75X in series with 0.2 or 1 mF from output to ground are
often useful. These are shown in Figures 13, 14, and 16.
5
Typical Applications (Continued)
TL/H/5516–5
FIGURE 5. Two-Wire Remote Temperature Sensor
(Grounded Sensor)
TL/H/5516–6
FIGURE 6. Two-Wire Remote Temperature Sensor
(Output Referred to Ground)
TL/H/5516–7
FIGURE 7. Temperature Sensor, Single Supply, b55§ toa150§C
TL/H/5516–8
FIGURE 8. Two-Wire Remote Temperature Sensor
(Output Referred to Ground)
TL/H/5516–9
FIGURE 9. 4-To-20 mA Current Source (0§C to a100§C)
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National Semiconductor National Semiconductor National Semiconductor National Semiconductor National Semiconductores National SemiconductorCorporation GmbH Japan Ltd. Hong Kong Ltd. Do Brazil Ltda. (Australia) Pty, Ltd.2900 Semiconductor Drive Livry-Gargan-Str. 10 Sumitomo Chemical 13th Floor, Straight Block, Rue Deputado Lacorda Franco Building 16P.O. Box 58090 D-82256 F 4urstenfeldbruck Engineering Center Ocean Centre, 5 Canton Rd. 120-3A Business Park DriveSanta Clara, CA 95052-8090 Germany Bldg. 7F Tsimshatsui, Kowloon Sao Paulo-SP Monash Business ParkTel: 1(800) 272-9959 Tel: (81-41) 35-0 1-7-1, Nakase, Mihama-Ku Hong Kong Brazil 05418-000 Nottinghill, MelbourneTWX: (910) 339-9240 Telex: 527649 Chiba-City, Tel: (852) 2737-1600 Tel: (55-11) 212-5066 Victoria 3168 Australia
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
ShenZhen YiShi Electronic Technology Development Co., Ltd YS1020UA MANUAL
YS Ultra low power wireless data module http://www.yishi.net.cn 1/3
YS1020UA RF Data Transceiver
YS1020 series Low power RF modules designed for the professional wireless data transmission systems in short range. YS1020 adapt Chipcon CC1020 RF IC, works on ISM frequency band, half duplex integrated receiving and transmitting. Modules could directly connect with monolithic processors, PC, RS485 devices, and other UART components with RS232, RS485 and UART/TTL level interface port. Transparent data interface, nakedness, and wide temperature design handles most industrial application though indoor/outdoor environments.
1. Products Main Features: * Carrier frequency: 433/450/868MHz or ISM others optional; * Interface: RS232/ RS485/ TTL optional; * Multichannels: 8 channels, expandable for 16/32 channels; * Baud rate in air: 1200/2400/4800/9600/19200/38400bps, set before delivery; * Transparent data transmission: What has been received is exactly what has been transmitted,
suitable for any standard or nonstandard user protocols; * Interface format: 8N1/8E1/801 userdefined, or customization for other format interface; * Modulation: GFSK. Based on the Gaussian Frequency Shift Keying (GFSK) modulation,
High antiinterference and Low BER (Bit error Rate); * Half duplex: Integration of receiver and transmitter,10ms auto change for receiving and sending; * Low power consumption and sleep function; * Widen Temperature: 35 ~+75 (31~167 F); * Working humidity: 10%~90% relative humidity without condensation; * Impedance:50Ω (SMA antenna port, multiple antenna options available); * Complying with EN 300220 and ARIB STDT67.
2. Application areas: * Automatic meter reading(AMR) and home automation ; * Wireless smart terminal: POS, PDA, * Wireless electronic display screen, LED display; * Wireless remote control, Environment monitor, telemetry system; * Check attendance system, Queuemanagement system and positioning in coal mine; * RS485 wire multidrop system changeover wireless system; * Industrial automatic data collection, Wireless Data Acquisition, Wireless sensor, SCADA.
ShenZhen YiShi Electronic Technology Development Co., Ltd YS1020UA MANUAL
YS Ultra low power wireless data module http://www.yishi.net.cn 1/3
120 dBm (@1200bps); * Size: 47mm×26mm×10mm (without antenna port ). * Range: ≤0.5m (BER=10 3 @9600bps,when antenna is 2m above ground in open area),
≤0.8m (BER=10 3 @1200bps,when antenna is 2m above ground in open area).
4. Installation dimension:
5. Interface definition: Pin No.
Pin name
Description Level Connection with terminal
Remands
1 GND Grounding of power supply Ground 2 Vcc Power supply DC +3.3~5.5V 3 RXD/TTL Serial data receiving end TTL TxD 4 TXD/TTL Serial data transmitting end TTL RxD 5 DGND Digital grounding 6 A(TXD) A of RS485 or TXD of
RS232 A(RxD)
7 B(RXD) B of RS485 or RXD of RS232
B(TxD)
8 Sleep Sleep control (input) TTL Sleep signal Low level sleep 9 Test Exfactory testing
NOTE: Generally the module is in receiving status, if the Sleep pin (No.8) continuously connects low level (>200millisecond), the module will be in sleep status, modules can not receive or transmit any data when sleep. Only when the Sleep pin set in the state of high level (VH<3.5V) or hangs/empty, module can be in receiving
ShenZhen YiShi Electronic Technology Development Co., Ltd YS1020UA MANUAL
YS Ultra low power wireless data module http://www.yishi.net.cn 1/3
status again. The delay time for conversion between sleeping and receiving is less than 150mS.
6. Setting of channel, interface, and data format: User can change or view the module’s parameter setting (interface baud rate and channel) by testing
software “YSPRG.EXE” in the CD (Free). Channel 6 is default value. 1) Corresponding frequency points at 433MHz of 1~8 channels
Channel Frequency Channel Frequency Channel Frequency Channel Frequency
7. Antenna configuration: Many appropriative antennas for low power RF modules are selected for meeting different user antenna configurations. Please ask our Sales office for further information about the antenna’s dimension and performance. The main options of antennas are exterior flagelliform rubber antenna with helical SMA joint, magnetic car antenna.
Standard: A0# Helical SMA antennas, L0# 9pin line
Notes: Modules can share DC power supply with other equipment, Ensure the supply is stable (ideally <10mVpk ripple). Keep the module away from other EMF generating components. Match 50Ω, 1/4wave antenna, high mount the antenna as close to the module as possible. Set antenna more than 2m above ground in open area to reach optimal range.
SEMICONDUCTORTECHNICAL DATA
Order this document by MC7800/D
D2T SUFFIXPLASTIC PACKAGE
CASE 936(D2PAK)
THREE–TERMINALPOSITIVE FIXED
VOLTAGE REGULATORS
STANDARD APPLICATION
A common ground is required between theinput and the output voltages. The input voltagemust remain typically 2.0 V above the outputvoltage even during the low point on the inputripple voltage.
XX,
MC78XXInput
Cin*0.33 µF
CO**
Output
Pin 1. Input2. Ground3. Output
T SUFFIXPLASTIC PACKAGE
CASE 221A
Heatsink surfaceconnected to Pin 2.
Heatsink surface (shown as terminal 4 incase outline drawing) is connected to Pin 2.
3
12
3
1 2
These two digits of the type number indicate nominal voltage.
Cin is required if regulator is located anappreciable distance from power supplyfilter.
CO is not needed for stability; however,it does improve transient response. Values of less than 0.1 µF could cause instability.
*
**
1MOTOROLA ANALOG IC DEVICE DATA
These voltage regulators are monolithic integrated circuits designed asfixed–voltage regulators for a wide variety of applications including local,on–card regulation. These regulators employ internal current limiting,thermal shutdown, and safe–area compensation. With adequate heatsinkingthey can deliver output currents in excess of 1.0 A. Although designedprimarily as a fixed voltage regulator, these devices can be used withexternal components to obtain adjustable voltages and currents.
• Output Current in Excess of 1.0 A
• No External Components Required
• Internal Thermal Overload Protection
• Internal Short Circuit Current Limiting
• Output Transistor Safe–Area Compensation
• Output Voltage Offered in 2% and 4% Tolerance
• Available in Surface Mount D2PAK and Standard 3–Lead TransistorPackages
• Previous Commercial Temperature Range has been Extended to aJunction Temperature Range of –40°C to +125°C
DEVICE TYPE/NOMINAL OUTPUT VOLTAGE
MC7805AC
5 0 V
MC7812C12 V
LM340AT–55 0 V
LM340T–1212 V
MC7805C5.0 V
MC7815AC
15 VLM340T–5 LM340AT–15
15 VMC7806AC
6 0 VMC7815C
15 V
MC7806C6.0 V
LM340T–15
MC7808AC8 0 V
MC7818AC18 V
MC7808C8.0 V
MC7818C18 V
MC7809C 9.0 V MC7824AC24 V
MC7812AC12 V
MC7824C24 V
LM340AT–1212 V
ORDERING INFORMATION
DeviceOutput Voltage
ToleranceOperating
Temperature Range Package
MC78XXACT
2%
T 40° 125°C
Insertion MountLM340AT–XX 2%
T 40° 125°C
Insertion Mount
MC78XXACD2TTJ = –40° to +125°C
Surface Mount
MC78XXCT
4%
TJ = –40° to +125°C
Insertion MountLM340T–XX 4%
Insertion Mount
MC78XXCD2T Surface Mount
XX indicates nominal voltage.
Motorola, Inc. 1997 Rev 5
MC7800, MC7800A, LM340, LM340A Series
2 MOTOROLA ANALOG IC DEVICE DATA
MAXIMUM RATINGS (TA = 25°C, unless otherwise noted.)
Rating Symbol Value Unit
Input Voltage (5.0 – 18 V) VI 35 VdcInput Voltage (24 V) 40
Dropout Voltage (IO = 1.0 A, TJ = 25°C) VI – VO – 2.0 – Vdc
NOTES: 1. Tlow = –40°C for MC78XXAC, C, LM340AT–XX, LM340T–XX Thigh = +125°C for MC78XXAC, C, LM340AT–XX, LM340T–XX
2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account separately. Pulse testing with low duty cycle is used.
Output Noise Voltage (TA = 25°C) Vn – 10 – µV/VO10 Hz ≤ f ≤ 100 kHz
Output Resistance (f = 1.0 kHz) rO – 0.9 – mΩ
Short Circuit Current Limit (TA = 25°C) ISC – 0.2 – AVin = 35 Vdc
Peak Output Current (TJ = 25°C) Imax – 2.2 – A
Average Temperature Coefficient of Output Voltage TCVO – –0.3 – mV/°C
NOTES: 1. Tlow = –40°C for MC78XXAC, C, LM340AT–XX, LM340T–XX Thigh = +125°C for MC78XXAC, C, LM340AT–XX, LM340T–XX
2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account separately. Pulse testing with low duty cycle is used.
Dropout Voltage (IO = 1.0 A, TJ = 25°C) VI – VO – 2.0 – Vdc
Output Noise Voltage (TA = 25°C) Vn – 10 – µV/VO10 Hz ≤ f ≤ 100 kHz
Output Resistance f = 1.0 kHz rO – 0.9 – mΩ
Short Circuit Current Limit (TA = 25°C) ISC – 0.2 – AVin = 35 Vdc
Peak Output Current (TJ = 25°C) Imax – 2.2 – A
Average Temperature Coefficient of Output Voltage TCVO – –0.3 – mV/°C
NOTES: 1. Tlow = –40°C for MC78XXAC, C Thigh = +125°C for MC78XXAC, C
2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into accountseparately. Pulse testing with low duty cycle is used.
MC7800, MC7800A, LM340, LM340A Series
5MOTOROLA ANALOG IC DEVICE DATA
ELECTRICAL CHARACTERISTICS (Vin = 11 V, IO = 1.0 A, TJ = Tlow to Thigh [Note 1], unless otherwise noted.)
MC7806AC
Characteristic Symbol Min Typ Max Unit
Output Voltage (TJ = 25°C) VO 5.88 6.0 6.12 Vdc
Output Voltage (5.0 mA ≤ IO ≤ 1.0 A, PD ≤ 15 W) VO 5.76 6.0 6.24 Vdc8.6 Vdc ≤ Vin ≤ 21 Vdc
Dropout Voltage (IO = 1.0 A, TJ = 25°C) VI – VO – 2.0 – Vdc
Output Noise Voltage (TA = 25°C) Vn – 10 – µV/VO10 Hz ≤ f ≤ 100 kHz
NOTES: 1. Tlow = –40°C for MC78XXAC, C Thigh = +125°C for MC78XXAC, C
2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into accountseparately. Pulse testing with low duty cycle is used.
Dropout Voltage (IO = 1.0 A, TJ = 25°C) VI – VO – 2.0 – Vdc
Output Noise Voltage (TA = 25°C) Vn – 10 – µV/VO10 Hz ≤ f ≤ 100 kHz
Output Resistance f = 1.0 kHz rO – 0.9 – mΩ
Short Circuit Current Limit (TA = 25°C) ISC – 0.2 – AVin = 35 Vdc
Peak Output Current (TJ = 25°C) Imax – 2.2 – A
Average Temperature Coefficient of Output Voltage TCVO – –0.4 – mV/°C
NOTES: 1. Tlow = –40°C for MC78XXAC, C Thigh = +125°C for MC78XXAC, C
2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into accountseparately. Pulse testing with low duty cycle is used.
Dropout Voltage (IO = 1.0 A, TJ = 25°C) VI – VO – 2.0 – Vdc
NOTES: 1. Tlow = –40°C for MC78XXAC, C, LM340AT–XX, LM340T–XX Thigh = +125°C for MC78XXAC, C, LM340AT–XX, LM340T–XX
2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into accountseparately. Pulse testing with low duty cycle is used.
Dropout Voltage (IO = 1.0 A, TJ = 25°C) VI – VO – 2.0 – Vdc
Output Noise Voltage (TA = 25°C) Vn – 10 – µV/VO10 Hz ≤ f ≤ 100 kHz
Output Resistance (f = 1.0 kHz) rO – 1.1 – mΩ
Short Circuit Current Limit (TA = 25°C) ISC – 0.2 – AVin = 35 Vdc
Peak Output Current (TJ = 25°C) Imax – 2.2 – A
Average Temperature Coefficient of Output Voltage TCVO – –0.8 – mV/°C
NOTES: 1. Tlow = –40°C for MC78XXAC, C, LM340AT–XX, LM340T–XX Thigh = +125°C for MC78XXAC, C, LM340AT–XX, LM340T–XX
2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into accountseparately. Pulse testing with low duty cycle is used.
Load Regulation (Note 2) Regload mV5.0 mA ≤ IO ≤ 1.5 A, TJ = 25°C – 1.8 255.0 mA ≤ IO ≤ 1.0 A – 1.5 25250 mA ≤ IO ≤ 750 mA – 1.2 15
Quiescent Current IB – 3.5 6.0 mA
Quiescent Current Change ∆IB mA17.5 Vdc ≤ Vin ≤ 30 Vdc, IO = 500 mA – – 0.817.5 Vdc ≤ Vin ≤ 30 Vdc, IO = 1.0 A, TJ = 25°C – – 0.85.0 mA ≤ IO ≤ 1.0 A – – 0.5
NOTES: 1. Tlow = –40°C for MC78XXAC, C, LM340AT–XX, LM340T–XX Thigh = +125°C for MC78XXAC, C, LM340AT–XX, LM340T–XX
2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into accountseparately. Pulse testing with low duty cycle is used.
Dropout Voltage (IO = 1.0 A, TJ = 25°C) ViI – VO – 2.0 – Vdc
Output Noise Voltage (TA = 25°C) Vn – 10 – µV/VO10 Hz ≤ f ≤ 100 kHz
Output Resistance f = 1.0 kHz rO – 1.3 – mΩ
Short Circuit Current Limit (TA = 25°C) ISC – 0.2 – AVin = 35 Vdc
Peak Output Current (TJ = 25°C) Imax – 2.2 – A
Average Temperature Coefficient of Output Voltage TCVO – –1.5 – mV/°C
NOTES: 1. Tlow = –40°C for MC78XXAC, C Thigh = +125°C for MC78XXAC, C
2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into accountseparately. Pulse testing with low duty cycle is used.
MC7800, MC7800A, LM340, LM340A Series
11MOTOROLA ANALOG IC DEVICE DATA
ELECTRICAL CHARACTERISTICS (Vin = 27 V, IO = 1.0 A, TJ = Tlow to Thigh [Note 1], unless otherwise noted.)
MC7818AC
Characteristic Symbol Min Typ Max Unit
Output Voltage (TJ = 25°C) VO 17.64 18 18.36 Vdc
Output Voltage (5.0 mA ≤ IO ≤ 1.0 A, PD ≤ 15 W) VO 17.3 18 18.7 Vdc21 Vdc ≤ Vin ≤ 33 Vdc
Load Regulation, (Note 2) Regload – 4.4 65 mV5.0 mA ≤ IO ≤ 1.5 A
Quiescent Current IB – 3.6 6.5 mA
Quiescent Current Change ∆IB mA27 Vdc ≤ Vin ≤ 38 Vdc – – 1.05.0 mA ≤ IO ≤ 1.0 A – – 0.5
NOTES: 1. Tlow = –40°C for MC78XXAC, C Thigh = +125°C for MC78XXAC, C
2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into accountseparately. Pulse testing with low duty cycle is used.
Dropout Voltage (IO = 1.0 A, TJ = 25°C) VI – VO – 2.0 – Vdc
Output Noise Voltage (TA = 25°C) Vn – 10 – µV/VO10 Hz ≤ f ≤ 100 kHz
Output Resistance (f = 1.0 kHz) rO – 1.4 – mΩ
Short Circuit Current Limit (TA = 25°C) ISC – 0.2 – AVin = 35 Vdc
Peak Output Current (TJ = 25°C) Imax – 2.2 – A
Average Temperature Coefficient of Output Voltage TCVO – –2.0 – mV/°C
NOTES: 1. Tlow = –40°C for MC78XXAC, C Thigh = +125°C for MC78XXAC, C
2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into accountseparately. Pulse testing with low duty cycle is used.
MC7800, MC7800A, LM340, LM340A Series
13MOTOROLA ANALOG IC DEVICE DATA
Figure 1. Peak Output Current as a Function ofInput/Output Differential Voltage (MC78XXC, AC)
Figure 2. Ripple Rejection as a Function ofOutput Voltages (MC78XXC, AC)
Figure 3. Ripple Rejection as a Function ofFrequency (MC78XXC, AC)
Figure 4. Output Voltage as a Function ofJunction Temperature (MC7805C, AC)
Figure 5. Output Impedance as a Function ofOutput Voltage (MC78XXC, AC)
Figure 6. Quiescent Current as a Function ofTemperature (MC78XXC, AC)
Design ConsiderationsThe MC7800 Series of fixed voltage regulators are
designed with Thermal Overload Protection that shuts downthe circuit when subjected to an excessive power overloadcondition, Internal Short Circuit Protection that limits themaximum current the circuit will pass, and Output TransistorSafe–Area Compensation that reduces the output shortcircuit current as the voltage across the pass transistor isincreased.
In many low current applications, compensationcapacitors are not required. However, it is recommendedthat the regulator input be bypassed with a capacitor if theregulator is connected to the power supply filter with long
wire lengths, or if the output load capacitance is large. Aninput bypass capacitor should be selected to provide goodhigh–frequency characteristics to insure stable operationunder all load conditions. A 0.33 µF or larger tantalum,mylar, or other capacitor having low internal impedance athigh frequencies should be chosen. The bypass capacitorshould be mounted with the shortest possible leads directlyacross the regulators input terminals. Normally goodconstruction techniques should be used to minimize groundloops and lead resistance drops since the regulator has noexternal sense lead.
IO5.0 V
R IB
Figure 7. Current Regulator Figure 8. Adjustable Output Regulator
Figure 9. Current Boost Regulator Figure 10. Short Circuit Protection
The MC7800 regulators can also be used as a current source whenconnected as above. In order to minimize dissipation the MC7805C ischosen in this application. Resistor R determines the current as follows:
For example, a 1.0 A current source would require R to be a 5.0 Ω,10 W resistor and the output voltage compliance would be the inputvoltage less 7.0 V.
IB 3.2 mA over line and load changes.
Input
0.33 µF R
IO
MC7805
ConstantCurrent toGroundedLoad
The addition of an operational amplifier allows adjustment to higher orintermediate values while retaining regulation characteristics. Theminimum voltage obtainable with this arrangement is 2.0 V greater than theregulator voltage.
InputMC7805
Output
0.33 µF
10 k
MC1741G
7
6
41.0 k
VO = 7.0 V to 20 VVIN = VO ≥ 2.0 V
0.1 µF
3
2
The MC7800 series can be current boosted with a PNP transistor. TheMJ2955 provides current to 5.0 A. Resistor R in conjunction with the VBEof the PNP determines when the pass transistor begins conducting; thiscircuit is not short circuit proof. Input/output differential voltage minimum isincreased by VBE of the pass transistor.
XX = 2 digits of type number indicating voltage.
MC78XX
Input
OutputR
1.0 µF
MJ2955 or Equiv.
1.0 µF
The circuit of Figure 9 can be modified to provide supply protection againstshort circuits by adding a short circuit sense resistor, RSC, and anadditional PNP transistor. The current sensing PNP must be able to handlethe short circuit current of the three–terminal regulator. Therefore, afour–ampere plastic power transistor is specified.
XX = 2 digits of type number indicating voltage.
1.0 µF
MC78XX
MJ2955or Equiv.
Output
RSC
R
2N6049or Equiv.
≥ 10 µF
RSource
0.33 µFInput
RSource
0.33 µF
≥ 10 µF
MC7800, MC7800A, LM340, LM340A Series
15MOTOROLA ANALOG IC DEVICE DATA
Figure 11. Worst Case Power Dissipation versusAmbient Temperature (Case 221A)
Figure 12. Input Output Differential as a Functionof Junction Temperature (MC78XXC, AC)
, PO
WER
DIS
SIPA
TIO
N (W
)D
20
16
12
8.0
4.0
0–50 –25 0 25 50 75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
P
θHS = 0°C/W
DIF
FER
ENTI
AL (V
)in
out,
INPU
T–O
UTP
UT
VOLT
AGE
0.5
0–75 –50 –25 0 25 50 75 100 125
TJ, JUNCTION TEMPERATURE (°C)
– V
V
IO = 0 mA
IO = 20 mA
IO = 1.0 A
IO = 500 mA
IO = 200 mA
∆VO = 2% of VO– – – Extended Curve for MC78XXB
θJC = 5°C/WθJA = 65°C/WTJ(max) = 150°C
θHS = 5°C/W
θHS = 15°C/W
No Heatsink
2.0
1.5
1.0
2.5
Figure 13. D 2PAK Thermal Resistance and MaximumPower Dissipation versus P.C.B. Copper Length
R, T
HER
MAL
RES
ISTA
NC
EJA θ JU
NC
TIO
N-T
O-A
IR (
C/W
)°
30
40
50
60
70
80
1.0
1.5
2.0
2.5
3.0
3.5
0 10 20 3025155.0
L, LENGTH OF COPPER (mm)
PD(max) for TA = 50°C
MinimumSize Pad
2.0 oz. CopperL
L
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Free AirMountedVertically
P D, M
AXIM
UM
PO
WER
DIS
SIPA
TIO
N (W
)
RθJA
DEFINITIONS
Line Regulation – The change in output voltage for achange in the input voltage. The measurement is made underconditions of low dissipation or by using pulse techniques suchthat the average chip temperature is not significantly affected.
Load Regulation – The change in output voltage for achange in load current at constant chip temperature.
Maximum Power Dissipation – The maximum totaldevice dissipation for which the regulator will operate withinspecifications.
Quiescent Current – That part of the input current that isnot delivered to the load.
Output Noise Voltage – The rms ac voltage at the output,with constant load and no input ripple, measured over aspecified frequency range.
Long Term Stability – Output voltage stability underaccelerated life test conditions with the maximum ratedvoltage listed in the devices’ electrical characteristics andmaximum power dissipation.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, andspecifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motoroladata sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights ofothers. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or otherapplications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injuryor death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorolaand its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney feesarising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges thatMotorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an EqualOpportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.How to reach us:USA/EUROPE/Locations Not Listed : Motorola Literature Distribution; JAPAN : Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4–32–1,P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488
Customer Focus Center: 1–800–521–6274
Mfax : [email protected] – TOUCHTONE 1–602–244–6609 ASIA/PACIFIC : Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,Motorola Fax Back System – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298