-
ZXMP S325SDH Based Multi-Service Node Equipment
Product Description
Version 2.20
ZTE CORPORATIONNO. 55, Hi-tech Road South, ShenZhen,
P.R.ChinaPostcode: 518057Tel: +86-755-26771900Fax:
+86-755-26770801URL: http://ensupport.zte.com.cnE-mail:
[email protected]
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LEGAL INFORMATIONCopyright 2012 ZTE CORPORATION.
The contents of this document are protected by copyright laws
and international treaties. Any reproduction or
distribution of this document or any portion of this document,
in any form by any means, without the prior written
consent of ZTE CORPORATION is prohibited. Additionally, the
contents of this document are protected by
contractual confidentiality obligations.
All company, brand and product names are trade or service marks,
or registered trade or service marks, of ZTE
CORPORATION or of their respective owners.
This document is provided as is, and all express, implied, or
statutory warranties, representations or conditions
are disclaimed, including without limitation any implied
warranty of merchantability, fitness for a particular purpose,
title or non-infringement. ZTE CORPORATION and its licensors
shall not be liable for damages resulting from the
use of or reliance on the information contained herein.
ZTE CORPORATION or its licensors may have current or pending
intellectual property rights or applications
covering the subject matter of this document. Except as
expressly provided in any written license between ZTE
CORPORATION and its licensee, the user of this document shall
not acquire any license to the subject matter
herein.
ZTE CORPORATION reserves the right to upgrade or make technical
change to this product without further notice.
Users may visit ZTE technical support website
http://ensupport.zte.com.cn to inquire related information.
The ultimate right to interpret this product resides in ZTE
CORPORATION.
Revision History
Revision No. Revision Date Revision Reason
R1.1 2012-07-30 Updated the documentation architecture.
R1.0 2012-03-30 ZXMP S325(V2.20) Issued.
Serial Number: SJ-20120320184105-002
Publishing Date: 2012-07-30(R1.1)
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Table of ContentsAbout This Manual
.........................................................................................
I
Chapter 1 System
Functions.....................................................................
1-11.1 Service
Functions...............................................................................................
1-1
1.1.1 Service Access
Types...............................................................................
1-1
1.1.2 Service Access Capacity
..........................................................................
1-2
1.1.3 Multi-Service Functions
............................................................................
1-2
1.2 System Control and Communication Functions
.................................................... 1-3
1.3 Power Supply
Function.......................................................................................
1-4
1.4 Overhead Processing Function
...........................................................................
1-4
1.5 Timing and Synchronization Output Function
....................................................... 1-4
1.6 Alarm Input/Output Function
...............................................................................
1-5
1.7 Alarm Concatenation Function
............................................................................
1-5
1.8 Tandem Connection Monitoring Function
.............................................................
1-5
1.9 Cross-connect
Capacity......................................................................................
1-6
1.10 Protection
Function...........................................................................................
1-7
1.10.1 Equipment Level
Protections...................................................................
1-7
1.10.2 Network Level
Protections.......................................................................
1-9
Chapter 2 Technical Specifications
.......................................................... 2-12.1
Dimension and
Weight........................................................................................
2-1
2.1.1 Cabinet Dimensions and Weights
..............................................................
2-1
2.1.2 Dimensions and Weight of Components
.................................................... 2-2
2.1.3 Dimensions and Weight of
Boards.............................................................
2-3
2.2 Bearing Requirement of Equipment Room
........................................................... 2-8
2.3 Power Supply Requirements
...............................................................................
2-8
2.3.1 Power Supply
Range................................................................................
2-8
2.3.2 Power Consumption
Specifications............................................................
2-8
2.3.3 Power Consumptions of Typical System Configurations
............................ 2-12
2.4 Environment
Requirements...............................................................................
2-14
2.4.1 Grounding Requirements
........................................................................
2-14
2.4.2 Temperature and Humidity Requirements
................................................ 2-15
2.4.3 Cleanness
Requirements........................................................................
2-15
2.4.4 Application Environment
Requirements....................................................
2-16
2.5 EMC Requirements
..........................................................................................
2-16
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2.5.1
EMS......................................................................................................
2-16
2.5.2 EMI
.......................................................................................................
2-19
2.6 Optical Interface Specifications
.........................................................................
2-19
2.6.1 Transmission Code
Pattern.....................................................................
2-19
2.6.2 Optical Modules
.....................................................................................
2-19
2.6.3 Eye Diagram of Optical Transmit Signals
................................................. 2-21
2.6.4 Mean Optical Launched
Power................................................................
2-22
2.6.5 Extinction Ratio
......................................................................................
2-22
2.6.6 Receiver Sensitivity
................................................................................
2-22
2.6.7 Receiver
Overload..................................................................................
2-23
2.6.8 Mean Optical Received Power
................................................................
2-23
2.6.9 Permitted Frequency Deviation of Optical Input Interfaces
........................ 2-23
2.6.10 AIS Rate of Optical Output Interfaces
.................................................... 2-23
2.7 Electrical Interface Specifications
......................................................................
2-23
2.7.1 Code Patterns of Electrical
Interface........................................................
2-23
2.7.2 Permitted Attenuation of Input Interfaces, Frequency
Deviation of InputInterfaces and Bit Rate Tolerance of Output
Interfaces ............................ 2-24
2.7.3 Reflection Attenuation of Input/Output Interfaces
...................................... 2-24
2.7.4 Anti-Interference Capability of Input Interfaces
......................................... 2-25
2.7.5 Waveform of Output
Interfaces................................................................
2-25
2.8 Interface Jitter
Specifications.............................................................................
2-30
2.8.1 Jitter and Wander Tolerance of PDH Input Interfaces
................................ 2-30
2.8.2 Jitter and Wander Tolerance of SDH Input Interfaces
................................ 2-31
2.8.3 STM-N Interface Inherent Output Jitter
.................................................... 2-33
2.8.4 Mapping Jitter of PDH
Tributary...............................................................
2-34
2.8.5 Combined
Jitter......................................................................................
2-34
2.8.6 Jitter Transfer Characteristic of Regenerator
............................................ 2-36
2.9 Clock Specifications
.........................................................................................
2-37
2.10 OA Board Specifications
.................................................................................
2-39
2.11 Ethernet Performance Specifications
...............................................................
2-41
2.11.1 Transparent Transmission Performance
Specifications............................ 2-41
2.11.2 VLAN Specifications
.............................................................................
2-42
2.11.3 L2 Switching Specifications
...................................................................
2-43
2.12 RPR Performance
Specifications.....................................................................
2-44
2.13 ATM
Characteristics........................................................................................
2-46
2.14 External Interface Standards
...........................................................................
2-49
Appendix A Standards and Recommendations
..................................... A-1
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Glossary
..........................................................................................................
I
III
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IV
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About This ManualPurpose
This manual is applicable to the Unitrans ZXMP S325 SDH based
multi-service nodeequipment.
Unitrans ZXMP S325 is a multi-service node equipment with the
highest transmission rateof 2.5 Gbit/s. It can apply to the access
network.
Intended Audience
This manual is intended for:
l Planning engineerl Maintenance engineer
What Is in This Manual
This manual contains the following chapters:
Chapter Summary
Chapter 1, System Functions Explains about the system
functions.
Chapter 2, Technical Specifications Discusses about the
technical specifications.
Appendix A, Standards and
Recommendations
Gives the standards and recommendations that ZXMP
S325 complies with.
Related Documentation
The following documentation is related to this manual:
l Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node
Equipment SystemDescription
l Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node
Equipment HardwareDescription
l Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node
Equipment InstallationManual
l Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node
EquipmentMaintenance Manual
l Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node
Equipment OperationInstructions
Conventions
This document uses the following typographical conventions.
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Typeface Meaning
Italics Variables in commands. It may also refers to other
related manuals and documents.
Bold Menus, menu options, function names, input fields, option
button names, check boxes,
drop-down lists, dialog box names, window names, parameters and
commands.
CAPS Keys on the keyboard and buttons on screens and company
name.
Danger: Indicates an imminently hazardous situation, which if
not avoided, will result in
death or serious injury.
Warning: Indicates a hazard that, if not avoided, could result
in serious injuries,
equipment damages or interruptions of major services.
Caution: Indicates a potential hazard that, if not avoided,
could result in moderate
injuries, equipment damages or partial service interruption.
Note: Provides additional information about a certain topic.
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Chapter 1System FunctionsTable of Contents
Service
Functions.......................................................................................................1-1System
Control and Communication Functions
..........................................................1-3Power
Supply
Function...............................................................................................1-4Overhead
Processing Function
..................................................................................1-4Timing
and Synchronization Output
Function..............................................................1-4Alarm
Input/Output
Function.......................................................................................1-5Alarm
Concatenation Function
...................................................................................1-5Tandem
Connection Monitoring
Function....................................................................1-5Cross-connect
Capacity
.............................................................................................1-6Protection
Function
....................................................................................................1-7
1.1 Service Functions
1.1.1 Service Access TypesTable 1-1 lists the services types
supported by ZXMP S325.
Table 1-1 ZXMP S325 Service Access Types
Service Type Rate
STM-1 (optical/electrical) 155520 kbit/s
STM-4 622080 kbit/s
SDH services
STM-16 2488320 kbit/s
E3 34368 kbit/s
T3 44736 kbit/s
E1 2048 kbit/s
PDH services
T1 1544 kbit/s
FE 10 Mbit/s or 100 Mbit/sEthernet services
GE 1 Gbit/s
ATM services ATMSTM-1 155520 kbit/s
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1.1.2 Service Access CapacityThe ZXMP S325 provides abundant
service interfaces, including STM-4 or STM-1 opticalinterfaces,
STM-1 electrical interface, E3/T3/E1/T1 PDH electrical interfaces,
10/100Mbit/s Ethernet interfaces, and ATM interface. Table 1-2
lists the ZXMP S325 serviceaccess capability.
Table 1-2 Service Access Capacity of ZXMP S325
Board/InterfaceType
Number of BoardPorts (channelsper board)
MaximumAccess Capacityper Subrackwithout
BoardProtection(channel)
MaximumAccess Capacityper Subrack withBoard
Protection(channel)
Remarks
STM-16 1 5 - without Board
Protection
STM-4 123 or 4 13 - without BoardProtection
STM-1(optical) 123 or 4 26 - without BoardProtection
STM-1(electrical) 1 or 2 12 10 -
E3/T3 3 18 15 -
E1/T1 21 126 105 -
10/100 Mbps
Ethernet interface
(electrical)
6 36 30 -
100 Mbps
Ethernet interface
(optical)
8 48 - without Board
Protection
ATM interface 4 24 - without Board
Protection
GE optical
interface
2 16 - without Board
Protection
GE electrical
interface
2 16 - without Board
Protection
1.1.3 Multi-Service FunctionsThe ZXMP S325 can process Ethernet
service, ATM service and RPR service. It providesthe following
interfaces listed in Table 1-3 for multi-service function.
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Chapter 1 System Functions
Table 1-3 Multi-service Interfaces Provided by the ZXMP S325
Interface Type ProcessingBoard ID
Interface BoardID
ConnectorType
BoardIntegration(channel perboard)
MaximumAccess Capacityper Subrack(channel)
SFEx6SED OIS1x4OIS1x6
4 24FE optical
interface
TFEx8 EIFEx4EITFEx6
LC/PC
2 16
SFEx6SED EIFEx4EIFEx6 36FE electricalinterface TFEx8 EIFEx4
EITFEx6
RJ45 6
48
ATM service
optical interface
AP1x4 OIS1x4 LC/PC 4 24
GE optical
interface
RSEBSED - LC/PC 2 16
GE electrical
interface
SED - RJ45 2 16
1.2 System Control and Communication FunctionsThe system control
and communication functions are carried out by the NCP board.
Thefunctions include:
l Sending configuration commands to MCUs and collecting their
performance andalarm information.
l Exchanging network management information between NEs through
the embeddedcontrol channel (ECC), and supporting the selection of
DCCr, DCCm, and DCCr+m.
Note:
The ECC provides the function of transmitting network
maintenance informationthrough the data communication channel (DCC)
which is the physical layer of ECC.The DCC carries communication
data between NEs, including DCC bytes in theregenerator section
(DCCr) and DCC bytes in the multiplex section (DCCm).
l Implementing the connection of orderwire phones between NEs
through the sectionoverhead bytes E1 and E2 in the SDH frame.
l Through the Qx interface, it reports to SMCC (Subnet
Management Control Center)the alarm and performance information of
this NE and of the subnet which the NE
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belongs to, and receives commands and configurations sent from
the SMCC to theNE and subnet. The Qx interface works for
communication between NE and SMCC.
l Detecting fan status of the NE. Fan speed can be set to half
or full in the EMS. Ifthe fan stops running when equipment is
working, the EMS will report alarm.
l Monitoring the board-in-position status and over/under-voltage
of the power supplyboard.
1.3 Power Supply FunctionPower supply for the subracks of the
ZXMP S325 is supplied by the power boards.
Distributed power supply mode is employed in the ZXMP S325 to
supply power to eachsubrack separately. Each subrack is equipped
with two power supply boards (PWRA) for1+1 protection.
1.4 Overhead Processing FunctionThe overhead processing function
of ZXMP S325 is performed by NCP board and opticalline boards.
Optical line boards separate section overheads from payload in
SDH data frame andintegrate these overheads into an overhead bus.
All the boards (including OCS4 board,optical line board, and NCP
board) read or insert corresponding overhead bytes from orto the
overhead bus.
The ZXMP S325 supports the overhead cross-connect function. The
overhead can beconfigured to any port as required by the EMS.
1.5 Timing and Synchronization Output FunctionThemaster-slave
synchronizationmode is adopted between ZXMPS325 equipments.
TheOCS16 board or OCS4 board performs timing and synchronization
functions, including:clock source selection, clock source
switching, and clock exporting.
l Clock source selection
There are multiple ways to get the clock source, including:
Tracing external timing reference
Locking onto a line clock in a certain direction
Locking onto the internal clock
The system allows configuring ten line clock sources and two
external clock sourcesat the same time.
l Clock source switching
The clock source switching occurs under any of the following
three cases:
The current clock source is lost
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A clock source of higher quality level recovers
The current clock source deteriorates
The system clock supports the synchronous priority switching and
SSMalgorithm-based automatic switching.
In complex networks, the application of SSM algorithm-based
automatic switchingcan optimize the timing and synchronization
distribution of the network, reduce thedifficulty of
synchronization planning, and avoid timing loops, thus ensuring the
optimalnetwork synchronization.
l Clock exporting
ZXMP S325 supports the export of two channels of 2 Mbit/s or 2
MHz externalreference clock signals. The output interface of
external reference clock is suppliedby SAIA or SAIB board (system
auxiliary interface board).
1.6 Alarm Input/Output Functionl External alarm input
interface
The ZXMP S325 supports the function of external alarm Boolean
value input, and thecorresponding physical interface is provided by
the SAIA board or SAIB board. Theequipment can access at most four
channels of external alarms to detect the alarmsof fans, access
control, and ambient temperature.
l Alarm output interface
The ZXMP S325 supports two channels of alarm output, and the
correspondingphysical interface is provided by the SAIA or SAIB
board. The equipment outputsthe alarm signal via the touch point
switch, and outputs the alarm ringing signals,critical alarm, major
alarm, and minor alarm signals to the column head cabinet inthe
equipment room.
1.7 Alarm Concatenation FunctionThe ZXMP S325 supports the
function of alarm concatenation, and the correspondingphysical
interface is provided by the SAIA or SAIB board. The subrack
alarmconcatenation output interface (i.e. the alarm output
interface) can directly connect tothat of another ZXMP S325 subrack
to implement alarm concatenation of multiple ZXMPS325
equipments.
1.8 Tandem Connection Monitoring FunctionThe OCS16 or OCS4 board
of ZXMP S325 supports the newly added HP-TCM(Higher-order Path
Tandem Connection Monitoring) function.
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As specified in ITU-T G.707 Recommendation, the tandem
connection layer locatesbetween the multiplex section and the path
section. Tandem connection mainly applies tointer-office
communication, especially at the border between different network
carriers.
This function is implemented by N1 higher-order path overhead
byte. It can detect thenumber of B3 block errors received in a
carriers networks and the number of B3 blockerrors transferred to
next carriers network.
1.9 Cross-connect CapacityOptical line boards and/or electrical
tributary boards of ZXMP S325 can cross-connectsignals at AU-4,
TU-3, TU-12, and TU-11 levels. In addition, they implement
protectionswitching via cross-connect matrix.
Configured with OCS16 board, ZXMP S325 can implement
higher-order cross-connect of128128 VC-4, and lower-order
cross-connect of 3232 VC-4. Configured with OCS4board, ZXMP S325
can implement higher-order cross-connection of 6464 VC-4,
andlower-order cross-connect of 3232 VC-4.
OCS16 or OCS4 board of ZXMP S325 can perform the functions of a
DXC (DigitalCross Connect) equipment to implement the pass-through,
broadcast, add/drop, andcross-connect of services.
The pass-through, broadcast, and add/drop modes are subsets of
the cross-connectfunction. In the equipment, both the tributary
electrical interfaces and optical line interfacesare connected to
the cross-connect network and their connections are
equivalent.Therefore, the inter-interface services can be
cross-connected in any form, as illustratedin Figure 1-1.
Figure 1-1 Interfaces of the ZXMP S325 DXC Equipment
As shown in Figure 1-2, the service interworking between the NE
T1 and NE T2 can beachieved on the backbone network through NE A.
It can also be implemented throughforming a direct service route
through NE A without establishing another line between T1and T2 or
adding equipment.
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Chapter 1 System Functions
Figure 1-2 Application of Cross-Connect between Tributaries
The cross-connect function of ZXMP S325 also supports network
maintenance and testduring networking and operation.
1.10 Protection Function
1.10.1 Equipment Level Protections
Power Protection
l Out-of-cabinet power protection
Two groups of -48 V power supplies in the equipment room are
connected to theZXMP S325 equipment. The external power supply 1+1
protection ensures that theequipment operates normally when either
power group fails.
The power distribution box can provide up to 12 channels of
power supply to thesubrack, each two channels as a group. Each
group can provide power supply inthe active/standby mode. At most
six groups of active/standby power supply can beprovided.
l Inside-cabinet power protection
Each subrack of the ZXMP S325 can be configured with two power
supply boards,connected to the active power supply and the standby
power supply respectively for1+1 protection. When the active or
standby power supply fails, the power alarm willbe reported to the
EMS.
Cross-connect Protection and Clock Protection
Configured with one active OCS16 or OCS4 board and one standby
OCS16 or OCS4board, ZXMP S325 can implement the 1+1 protection for
cross-connect and clock. In caseof fault, the system can control
the switching between the two OCS16 or OCS4
boardsautomatically.
The two OCS16 or OCS4 boards can work in 1+1 hot backup mode.
The ZXMP S325 canalso be equipped with one OCS16 or OCS4 board.
When configured with one active and one standby OCS16 or OCS4
boards, and they areboth in position and work normally, only the
clock of the active OCS16 or OCS4 board is
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exported to the motherboard. If one OCS16 or OCS4 board fails,
the clock is switched tothe other OCS16 or OCS4 board.
1:N Protection for Electrical Service Processor Boards
ZXMP S325 can implement the 1:N (N6) protection for E1/T1
service processor board,1:N (N5) protection for FE service
processor board, and 1:N (N5) protection forE3/T3/STM-1 electrical
service processor board. The system can support at most twogroups
of 1:N protections.
l 1:N protection for E1/T1 service processor board
The ZXMPS325 can support at most 1:6 protection for E1/T1
service processor board.The active board can choose any slot among
the six tributary board slots, while thestandby board slot has two
choices:
The standby board can choose any slot among the six tributary
slots
Using this method, the system can implement at most 1:5
tributary protection;meanwhile, the interface board slot
corresponding to the standby board slot needto be configured with
the BIE1x21 board (E1/T1 electrical interface bridge board).
The standby board can choose the dedicated slot for E1/T1
standby board
Using this method, the system can implement at most 1:6
tributary protection;meanwhile, there is no need to install the
BIE1x21 board.
l 1:N protection for FE service processor board
The ZXMP S325 can support at most 1:5 protection for FE service
processor board.The standby board can choose slot 5/6.
l 1:N protection for E3/T3/STM-1 (electrical) service processor
board
The ZXMP S325 can support at most 1:5 protection for E3/T3/STM-1
(electrical)service processor board. The standby board can only
occupy slot 1, i.e. the first slotof the six tributary board
slots.
Note:
The protection for E1/T1/FE service processor board belongs to
the same protectiontype, while the protection for E3/T3/STM-1
(electrical) service processor board belongsto another protection
type. One ZXMP S325 subrack can simultaneously support twogroups of
protections with different protection types, but cannot
simultaneously supportmultiple groups of service protections with
the same protection type. For example, onesubrack does not
simultaneously support two groups of 1:N protections for E1
serviceprocessor board; however, it supports 1:N protection for E1
service processor board andfor E3 service processor board
simultaneously.
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Chapter 1 System Functions
1.10.2 Network Level ProtectionsZXMP S325 supports the following
network protection modes:
l MS chain 1+1 protectionl MS chain 1:1 protectionl 2-fiber
unidirectional path protection ringl 2-fiber bidirectional path
protection ringl 2-fiber bidirectional MS protection ring with
extra servicel 2-fiber bidirectional MS protection ring without
extra servicel STM-4/STM-16 4-fiber bidirectional MS protection
ringl DNI (Dual Node Interconnection) protectionl Subnet Connection
Protection (SNCP), including SNC (I) which is subnet connection
protection with inherent monitoring, and SNC (N) which is subnet
connectionprotection with no interfered monitoring.
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Chapter 2Technical SpecificationsTable of Contents
Dimension and Weight
...............................................................................................2-1Bearing
Requirement of Equipment
Room..................................................................2-8Power
Supply Requirements
......................................................................................2-8Environment
Requirements
......................................................................................2-14EMC
Requirements
..................................................................................................2-16Optical
Interface Specifications
................................................................................2-19Electrical
Interface Specifications
.............................................................................2-23Interface
Jitter
Specifications....................................................................................2-30Clock
Specifications
.................................................................................................2-37OA
Board
Specifications...........................................................................................2-39Ethernet
Performance
Specifications........................................................................2-41RPR
Performance
Specifications..............................................................................2-44ATM
Characteristics
.................................................................................................2-46External
Interface Standards
....................................................................................2-49
2.1 Dimension and Weight
2.1.1 Cabinet Dimensions and WeightsTable 2-1 describes
dimensions and weights of ZXMP S325 cabinets.
Table 2-1 Dimensions and Weights of ZXMP S325 Cabinets
Dimensions (Height Width Depth) (Unit: mm) Weight (Unit: kg)
2000 600 300 59
2200 600 300 65
The weight refers to the weight of an empty cabinet. If a 2600
mm-high cabinet is required on site, you can mount a top box on the
top of the cabinet.
Figure 2-1 illustrates the outline dimensions of the 300 mm-deep
cabinet.
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Figure 2-1 Dimensions of ZTE Transmission Equipment Cabinet (300
mm Deep)
2.1.2 Dimensions and Weight of ComponentsThe dimensions and
weights of the ZXMP S325 components are listed in Table 2-2.
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Chapter 2 Technical Specifications
Table 2-2 Dimensions and Weights of ZXMP S325 Components
Component Dimensions (Height Width Depth) (Unit: mm)
Weight (Unit: kg) Remarks
2000 600 300 59.00 Weight of an empty
cabinet
ZXMP unified 300 mm deep
cabinet
2200 600 300 65.00 Weight of an empty
cabinet
Transmission multifunctional
box
752 608 520 52.20 -
Outdoor Power cabinet 800 600 600 51.00 -
Wall-mounted subrack 245 512 255 3.00 -
Desktop installation
components
244.5 495.8 230.0 2.80 -
ZXMP S325 subrack 221.5 482.6 270 9.00 Includes motherboard,
fan plug-in box,
dustproof unit)
Power distribution box 132.5 482.6 269.5 7.00 With
electronic
components
AC power lightning protection
unit
88.1 482.6 75.0 2.50 -
DC power lightning protection
unit
88.1 482.6 75.0 2.00 -
Rectifier unit 43.7 436.0 240.0 5.00 -
Lightning-proof unit 43.7 445.0 197.8 2.50 -
Motherboard 214.6 438.4 4.5 1.50 -
PCB90 79 1.6Fan box
Size after assembly:
21.5 139.6 244.8
0.52 Includes structural
parts and hardware
circuits
Dustproof unit 13.1 279.6 253 Accounted in
subrack weight
-
2.1.3 Dimensions and Weight of BoardsThe dimensions and weight
of boards of ZXMP S325 are listed in Table 2-3.
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Table 2-3 Dimensions and Weight of Boards
Board ID Board Name Dimension (mm) Weight (kg)
NCP NE control processor PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.430
SAIA System auxiliary
interface board (type
A)
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.160
SAIB System auxiliary
interface board (type
B)
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.130
PWRA Power supply board PCB: 2 (height) 72 (width) 170
(depth)
Front panel: 25 (height) 74 (width)
0.160
PWRB Power supply board PCB: 2 (height ) 72 (width) 170
(depth)
Front panel: 25 (height) 74 (width)
0.690
FAN Fan board PCB: 90 (height) 79 (width) 1.6
(thickness)
Size after assembly:
21.5 (height) 139.6 (width) 244.8
(depth)
0.520
OCS4 STM-1/4 optical line,
cross-connect, and
synchronous-clock
board
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.550
OCS16 STM-16 optical line,
cross-connect, and
synchronous-clock
board
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.460
OL1/4x44xSTM-1
0.485
OL1/4x43xSTM-1
0.465
OL1/4x42xSTM-1
0.445
OL1/4x41xSTM-1
0.425
4-channel STM-
1/STM-4 optical line
board
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
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Board ID Board Name Dimension (mm) Weight (kg)
OL1/4x44xSTM-4
0.485
OL1/4x43xSTM-4
0.465
OL1/4x42xSTM-4
0.445
OL1/4x41xSTM-4
0.425
OL16x1 1-channel STM-16
optical line board
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height )25.4
(width)
0.410
LP1x1 1-channel STM-1 line
processor
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height )25.4
(width)
0.355
OIS1x1 1-channel STM-1
optical interface
board
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.125
LP1x2 2-channel STM-1 line
processor
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.375
OIS1x2 2-channel STM-1
optical interface
board
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.145
LP4x1 1-channel STM-4 line
processor
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.360
OIS4x1 1-channel STM-4
optical interface
board
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.125
LP4x2 2-channel STM-4 line
processor
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.380
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Board ID Board Name Dimension (mm) Weight (kg)
OIS4x2 2-channel STM-4
optical interface
board
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.145
OIS1x4 4-channel STM-1
optical interface
board
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.185
OIS1x6 6-channel STM-1
optical interface
board
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.250
OBA12 Optical booster
amplifier OBA12
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.490
OBA14 Optical booster
amplifier OBA14
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.490
BIS1 STM-1 bridge
interface board
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.105
ESS1x2 2-channel STM-1
electrical interface
switching board
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.140
EPE1x2175
EPE1x21120
21-channel E1
electrical processor
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.420
EPT1x21 21-channel T1
electrical processor
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.400
EP1EBx21 21-channel E1/T1
electrical processor
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.420
BIE1x21 21-channel E1/T1
bridge interface
board
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.090
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Board ID Board Name Dimension (mm) Weight (kg)
ESE1x2175 21-channel E1electrical interface
switching board (75
)
ESE1x21120 21-channel E1/T1electrical interface
switching board
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.160
EP3x3 3-channel E3/T3
electrical processor
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.400
BIE3x3 3-channel E3/T3
electrical bridge
interface board
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.115
ESE3x3 3-channel E3/T3
electrical interface
switching board
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.145
SFEx6PPP
SFEx6GFP
Smart fast Ethernet
board
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.430
EIFEx4 4-channel electrical
interface board of
fast Ethernet
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.150
EIFEx6 6-channel electrical
interface board of
fast Ethernet
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.140
EITFEx6 6-channel switching
board of smart and
fast Ethernet
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.190
BIFE Bridge interface
board of fast Ethernet
PCB: 160 (height) 80 (depth) 2
(thickness)
Front panel: none
0.090
AP1x4 ATM processor with
4 STM-1 ports
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.430
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Board ID Board Name Dimension (mm) Weight (kg)
RSEB Ethernet processor
with RPR function
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.735
SED Enhanced smart
Ethernet board
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.640
TFEx8 8-channel
transparent board
of fast Ethernet
PCB: 160 (height) 210 (depth) 2
(thickness)
Front panel: 181.5 (height) 25.4
(width)
0.380
2.2 Bearing Requirement of Equipment RoomWhen only ZXMP S325 is
taken into consideration, the bearing of the equipment roomshould
be greater than 450 kg/m2.
2.3 Power Supply Requirements
2.3.1 Power Supply RangeRated working voltage of ZXMP S325: -48
V DC
Range: -40 V DC to -57 V DC
2.3.2 Power Consumption SpecificationsTable 2-4 lists power
consumptions and weights of boards in the ZXMP S325. The
powerconsumption of the whole system depends on system
configuration. It is less than 250 Wwith full configuration.
Table 2-4 Power Consumptions of Boards in ZXMP S325
Board ID Board Name Max PowerConsumption(25 C) (W)
Max PowerConsumption (45C) (W)
Remarks
NCP NE control processor 4.37 4.50 -
SAIA System auxiliary
interface board
2.16 2.22 The impedance of
clock input/ output
interface is 75
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Board ID Board Name Max PowerConsumption(25 C) (W)
Max PowerConsumption (45C) (W)
Remarks
SAIB System auxiliary
interface board
0.97 1.00 The impedance of
clock input/ output
interface is 120
PWRA -48 V power supply
board
3.00 3.09 -
PWRB +24 V power supply
board
15.80 16.60 -
FAN Fan board 8.04 8.28 -
- SFP optical module 0.80 0.82 -
16.17 16.66 STM-1 applicationOCS4 STM-4 optical line,
cross-connect, and
synchronous clock
board
16.95 17.46 STM-4 application
OCS16 STM-16 optical line,
cross-connect, and
synchronous clock
board
20.88 21.51 -
OL1/4x44xSTM-1
9.60 9.89 -
OL1/4x43xSTM-1
7.71 7.94 -
OL1/4x42xSTM-1
6.74 6.94 -
OL1/4x41xSTM-1
5.78 5.95 -
OL1/4x44xSTM-4
11.76 12.11 -
OL1/4x43xSTM-4
10.04 10.34 -
OL1/4x42xSTM-4
8.32 8.57 -
OL1/4x41xSTM-4
4-channel STM-
1/STM-4 optical line
board
6.56 6.76 -
OL16x1 1-channel STM-16
optical line board
14.11 14.39 -
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Board ID Board Name Max PowerConsumption(25 C) (W)
Max PowerConsumption (45C) (W)
Remarks
LP1x1 1-channel STM-1 line
processor
OIS1x1 1-channel STM-1
optical interface board
5.75 (LP1x1 and
OIS1x1)
5.92 (LP1x1 and
OIS1x1)
-
LP1x2 2-channel STM-1 line
processor
OIS1x2 2-channel STM-1
optical interface board
6.96 (LP1x2 and
OIS1x2)
7.17 (LP1x2 and
OIS1x2)
-
LP4x1 1-channel STM-4 line
processor
OIS4x1 1-channel STM-4
optical interface board
8.26 (LP4x1 and
OIS4x1)
8.51 (LP4x1 and
OIS4x1)
-
LP4x2 2-channel STM-4 line
processor
OIS4x2 2-channel STM-4
optical interface board
13.06 (LP4x2 and
OIS4x2)
13.45 (LP4x2 and
OIS4x2)
-
OIS1x4 4-channel STM-1
optical interface board
2.16 2.22 Provides optical
interface for SFEx6,
RSEB, AP1x4 boards
OIS1x6 6-channel STM-1
optical interface board
3.05 3.14 Provides optical
interface for SED
board
OBA12 Optical booster amplifier
OBA12
3.98 8.98 Use EDFA module with
no cooling
OBA14 Optical booster amplifier
OBA14
4.94 9.94 Use EDFA module with
no cooling
BIS1 STM-1 interface bridge
board
2.59 2.67 -
ESS1x2 2-channel STM-1
electrical interface
switching board
2.20 (4.62) 2.26 (4.76) The numbers in
parentheses are
consumptions after
switching
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Board ID Board Name Max PowerConsumption(25 C) (W)
Max PowerConsumption (45C) (W)
Remarks
EPE1x2175 4.42 4.55 The interfaceimpedance is 75
EPE1x21120
21-channel E1 electrical
processor
6.12 6.30 The interface
impedance is 120
EPT1x21 21-channel T1 electrical
processor
6.10 6.28 The interface
impedance is 100
EP1EBx21 21-channel E1/T1
electrical processor
7.39 7.61 -
BIE1x21 21-channel E1/T1
interface bridge board
0 0 Has no active devices
and consumption can
be ignored
ESE1x2175 21-channel E1 electricalinterface switching
board
The interface
impedance is 75
The numbers in
parentheses are
consumptions after
switching
ESE1x21120 21-channel E1/T1electrical interface
switching board
0.50 (6.29) 0.51 (6.48)
The interface
impedance is 120
or 100
The numbers in
parentheses are
consumptions after
switching
EP3x3 3-channel E3/T3
electrical processor
6.96 7.17 -
BIE3x3 3-channel E3/T3
electrical interface
bridge board
3.00 3.09 -
ESE3x3 3-channel E3/T3
electrical interface
switching board
2.13 (4.13) 2.19 (4.25) The numbers in
parentheses are
consumptions after
switching
SFEx6PPP 19.54 20.13 -
SFEx6GFP
Smart fast Ethernet
board 21.27 21.91 -
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Board ID Board Name Max PowerConsumption(25 C) (W)
Max PowerConsumption (45C) (W)
Remarks
EIFEx4 4-channel Ethernet
electrical interface
board
0.43 (2.28) 0.44 (2.35) The numbers in
parentheses are
consumptions after
switching
EIFEx6 6-channel Ethernet
electrical interface
board
0.05 0.05 Provides electrical
interface for SED
board
EITFEx6 6-channel FE handover
board
0.46 (2.90) 0.47 (3.00) The value in the
parentheses is the
value after handover
BIFE Ethernet interface
bridge board
0 0 Has no active devices
and consumption can
be ignored
AP1x4 4-channel ATM
processor
16.52 17.02 -
RSEB Ethernet Processor with
RPR Function
26.83 27.63 -
SED Enhanced smart
Ethernet board
20.88 21.51 -
TFEx8 8-channel fast
Ethernet transparent
transmission board
16.80 17.65 -
The weights of OCS4, OCS16, optical line boards, and optical
interface boards include the weights of SFP modules. Power
consumptions of boards shall be higher during equipment startup and
in low temperature environment. The
refore, the power capacity provided by the equipment should be
1.5 to 1.8 times the power consumptions listed inthe table.
2.3.3 Power Consumptions of Typical System ConfigurationsTable
2-5, Table 2-6 and Table 2-7 list the power consumptions of three
typical ZXMP S325configurations.
Table 2-5 ZXMP S325 Power Consumptions (Typical Configuration
1)
S.N. Board/Part Unit Quantity
1 NCP Piece 1
2 SAIA Piece 1
3 PWRA Piece 1
4 OCS4 (S-4.1) Piece 2
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S.N. Board/Part Unit Quantity
5 LP41 Piece 2
6 OIS4x1 (S-4.1) Piece 2
7 EPE1x21 (75) Piece 2
8 ESE1x21 (75) Piece 2
9 SFEx6 (GFP) Piece 1
10 EIFEx4 Piece 1
11 FAN Piece 2
12 3U power distribution box Set 1
13 ZJ-Front (Front fixed
subrack including MB
and fan)
Set 1
14 Tested Power Consumption: 109.38W
Table 2-6 ZXMP S325 Power Consumptions (Typical Configuration
2)
S.N. Board/Part Unit Quantity
1 NCP Piece 1
2 SAIA Piece 1
3 PWRA Piece 2
4 OCS16 Piece 2
5 OL1/4x4 (4xS-1.1,LC) Piece 2
6 OL1/4x4 (4xS-4.1,LC) Piece 2
7 EPE1x21 (75) Piece 2
8 ESE1x21 (75) Piece 2
9 SED Piece 2
10 EIFEx6 Piece 2
11 FAN Piece 2
12 3U power distribution box Set 1
13 ZJ-Front (Front fixed
subrack including MB and
fan)
Set 1
14 Tested Power Consumption: 124.23W
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Table 2-7 ZXMP S325 Power Consumptions (Typical Configuration
3)
S.N. Board/Part Unit Quantity
1 NCP Piece 1
2 SAIA Piece 1
3 PWRA Piece 2
4 OCS16 Piece 2
5 OL16 (L-16.2,LC) Piece 3
6 OL1/4x4 (4xS-1.1,LC) Piece 1
7 OL1/4x4 (4xS-4.1,LC) Piece 1
8 EPE1x21 (75) Piece 2
9 ESE1x21 (75) Piece 2
10 SED Piece 1
11 EIFEx6 Piece 1
12 FAN Piece 2
13 3U power distribution box Set 1
14 ZJ-Front (Front fixed
subrack including MB and
fan)
Set 1
15 Tested Power Consumption: 160.26 W
2.4 Environment Requirements
2.4.1 Grounding Requirementsl If separate grounding is adopted
in the equipment room, the grounding resistance
should meet the following requirements:
The ground resistance of -48 V GND: 4 .
The ground resistance of the system working ground: 1 .
The ground resistance of the lightning protection ground: 3
.
l If combined grounding is employed in the equipment room, the
ground resistanceshould meet the following requirements:
The ground resistance: 1 .
The voltage differences among the lightning protection ground,
the systemworking ground, and the -48 V GND should be less than 1
V.
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2.4.2 Temperature and Humidity RequirementsThe requirements
regarding the working temperature and relative humidity of the
ZXMPS325 are given in Table 2-8.
Table 2-8 Temperature/Humidity Requirements
Index Specification
Working Temperature (inside desktop,mounted
on wall or transmission cabinet )
-5 C ~ +45 C
Working Temperature inside transmissionmultifunctional box
-5 C ~ +45 C
Working Temperature (inside outdoor power
cabinet)
-40 C ~ +45 C
Relative Humidity 5% ~ 95%
In normal conditions, the temperature and humidity are measured
at 1.5 m above the floor and 0.4 mnear the equipment.
2.4.3 Cleanness RequirementsCleanness requirements include
requirements for dust and harmful gases in the air. TheZXMP S325
equipment should operate in the equipment room that meets the
cleannessrequirements described below:
l The equipment room should be free of explosive, conductive,
magnetic-conductive orcorrosive dust.
l The density of dust particles with the diameter greater than
5m is no more than 3104particles/m3.
l There should be no corrosive metal or insulation-destructive
gas in the equipment,such as SO2, H2S, NH3, NO2, and so on. The
detailed information are listed in Table2-9.
Table 2-9 Density Limit of Hazardous Gases in the Equipment
Gas Average (mg/m3) Maximum (mg/m3)
SO2 0.2 1.5
H2S 0.006 0.030
NO2 0.04 0.15
NH3 0.05 0.15
Cl2 0.01 0.30
l The equipment room should be always kept clean, with doors and
windows tightlysealed.
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2.4.4 Application Environment RequirementsAccording the
application scope of GB 4798 and ZXMP S325, the application
environmentrequirements are listed as follows:
l Product storage environment: 1K5, 1Z1, 1B2, 1C2, 1S3, or 1M3.
The storage durationis 180 days.
l Product transportation environment: 2K4P, 2B2, 2C2, 2S3, or
2M3. The transporta-tion duration is 30 days.
l Product usage environment: 3K5, 3Z2, 3Z7, 3B2, 3C2, 3S2, or
3M3. The usageduration is 10 years.
2.5 EMC RequirementsThe requirements for electromagnetic
compatibility (EMC) include two aspects:requirements for
electromagnetic susceptibility (EMS) and electromagnetic
interference(EMI).
The following three criteria should be followed to judge the
test result:
l Performance A: Continuous phenomenon. Neither error nor alarm
is allowed. Afterelectromagnetic interference, the number of error
bits does not exceed the maximumvalue of the normal
requirement.
l Performance B: Transient phenomenon. During the course of an
electromagneticinterference, the degradation of function is allowed
and the equipment can work asexpected without the operators
intervention.
No loss of frame and synchronization is allowed, and neither
pattern out-of-sync, norAIS alarm is allowed. The equipment shall
work normally after the electromagneticinterference.
The above does not apply to surge testing where some loss of
frame alignment maybe expected. For this test, the EUT shall
operate as intended following the cessationof the exposure.
l Performance R: Resistive phenomenon. The interference imposed
on the equipmentduring the test can cause action of the fuse or
other specified device which need tobe replaced or reset so that
the equipment can work properly.
2.5.1 EMS
ESD Resistivity
The Electrical Static Discharge (ESD) resistivity indexes of
ZXMP S325 are listed in Table2-10.
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Table 2-10 ESD Resistivity
Contact Discharge Air Discharge Criterion
6 kV 8 kV Performance criterion B
Be sure to wear an antistatic wrist strap during operating in
interface areas.
RF Electromagnetic Field Radiation Resistivity
The indexes of the RF electromagnetic field radiation
resistivity of the ZXMP S325 arelisted in Table 2-11.
Table 2-11 RF Electromagnetic Field Radiation Resistivity
Test Frequency: 80 MHz ~ 1000 MHz, 1400 MHz ~ 2000 MHz
Electric Field Intensity Amplitude Modulation Criterion
10 V/m 80% AM1 kHz Performance criterion A
Electrical Transient Burst Resistivity
The indexes of the electrical transient burst resistivity at
different ports of ZXMP S325 arelisted in Table 2-12, Table 2-13,
and Table 2-14.
Table 2-12 Electrical Transient Burst Resistivity at DC
PowerPort
Generator Waveform: 5 ns/50 ns
Test Voltage Repetition Frequency Criterion
1 kV 5 kHz Performance criterion B
Table 2-13 Electrical Transient Burst Resistivity at AC
PowerPort
Generator Waveform: 5 ns/50 ns
Test Voltage Repetition Frequency Criterion
2 kV 5 kHz Performance criterion B
Table 2-14 Electrical Transient Burst Resistivity at Signal
Cable and ControlCablePorts
Generator Waveform: 5 ns/50 ns
Test Voltage Repetition Frequency Criterion
1 kV 5 kHz Performance criterion B
Surge Resistivity
The surge resistivity indexes of ZXMP S325 are listed in Table
2-15 to Table 2-18.
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Table 2-15 Surge Resistivity of DC Power Supply
Generator Waveform: 1.2 s/50 s (8 s/20 s); Internal Impedance:
12
Test Mode Test Voltage Criterion
Line to line 0.5 kV Performance criterion B
Line to ground 1 kV Performance criterion B
Table 2-16 Surge Resistivity of AC Power Supply
Generator Waveform: 1.2 s/50 s (8 s/20 s); Internal Impedance:
12
Test Mode Test Voltage Criterion
Line to ground 1 kV Performance criterion B
Line to ground 2 kV Performance criterion R
Table 2-17 Surge Resistivity of Outdoor Signal Cable
Generator Waveform: 10 s/700 s; Internal Impedance: 40
Test Mode Test Voltage Criterion
Line to line
Line to ground
2 kV Performance criterion B
Table 2-18 Surge Resistivity of Indoor Signal Cable (10 m)
Generator Waveform: 1.2 s/50 s (8 s/20 s); Internal Impedance:
42
Test Mode Test Voltage Criterion
Line to line
Line to ground
1 kV Performance criterion B
RF Field Conductivity Resistivity
The indexes of the RF field conductivity resistivity of ZXMP
S325 arelisted in Table 2-19.
Table 2-19 RF Field Conductivity Resistivity
Test Frequency: 0.15 MHz ~ 80 MHz
Test Intensity Amplitude Modulation Criterion
3 V 80% AM1 kHz Performance criterion A
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2.5.2 EMI
Conductive Emission Electromagnetic Interference
The indexes of conductive emission electromagnetic interference
of the ZXMP S325 arelisted in Table 2-20.
Table 2-20 Conductive Emission Electromagnetic Interference
Threshold (dBV)Test Frequency (MHz)
Quasi-Peak Value Mean Value
0.15~0.5 79 66
0.5~30 73 60
These indexes satisfy the requirements specified in the
international standard of CISPR 22 CLASSA.
Radiated Emission Electromagnetic Interference
The indexes of radiated emission electromagnetic interference of
the ZXMPS325 are listedin Table 2-21.
Table 2-21 Radiated Emission Electromagnetic Interference
Quasi-Peak Wave Detection Limit (dBV/m)Test Frequency (MHz)
Test Distance: 10 m Test Distance: 3 m
30~230 40 50
230~1000 47 57
These indexes satisfy the requirements specified in the
international standard of CISPR 22 CLASSA.
2.6 Optical Interface Specifications
2.6.1 Transmission Code PatternZXMP S325 employs the NRZ
scramble code. Specification for the scramble complieswith the
7-class synchronous scrambler specified in the ITU-T Recommendation
G.707.
2.6.2 Optical Modulesl Table 2-22 lists the STM-16 optical
modules supported by ZXMP S325.
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Table 2-22 STM-16 Optical Modules Supported by ZXMP S325
Optical ModuleType
Light NominalWavelength(nm)
TransmissionDistance (km)
Connector Type ServiceCapacity(Channel perboard)
S-16.1 1310 15 LC/PC 1
S-16.2 1550 15 LC/PC 1
L-16.1 1310 40 LC/PC 1
L-16.2 1550 80 LC/PC 1
L-16.2U 1550 150 LC/PC 1
CWDM nS1-2XX Compliant with
the ITU-T Rec-
ommendation
G.695
40 LC/PC 1
CWDM nL1-2XX Compliant with
the ITU-T Rec-
ommendation
G.695
80 LC/PC 1
l Table 2-23 lists the STM-4 optical modules supported by ZXMP
S325.
Table 2-23 STM-4 Optical Modules Supported by ZXMP S325
Optical ModuleType
Light NominalWavelength(nm)
TransmissionDistance (km)
Connector Type ServiceCapacity(Channel perboard)
S-4.1 1310 15 LC/PC or SC/PC 123 or 4
L-4.1 1310 40 LC/PC or SC/PC 123 or 4
L-4.2 1550 80 LC/PC or SC/PC 123 or 4
Single-fiber
bidirectional
optical module
S-4.1
1310/1550 15 LC/PC or SC/PC 123 or 4
Single-fiber
bidirectional
optical module
L-4.1
1310/1550 40 LC/PC or SC/PC 123 or 4
l Table 2-24 lists the STM-1 optical modules supported by ZXMP
S325.
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Table 2-24 STM-1 Optical Modules Supported by ZXMP S325
Optical ModuleType
Light NominalWavelength(nm)
TransmissionDistance (km)
Connector Type ServiceCapacity(Channel perboard)
S-1.1 1310 15 LC/PC or SC/PC 123 or 4
L-1.1 1310 40 LC/PC or SC/PC 123 or 4
L-1.2 1550 80 LC/PC or SC/PC 123 or 4
Single-fiber
bidirectional
optical module
S-1.1
1310/1550 15 LC/PC or SC/PC 123 or 4
Single-fiber
bidirectional
optical module
L-1.1
1310/1550 40 LC/PC or SC/PC 123 or 4
2.6.3 Eye Diagram of Optical Transmit SignalsThe ZXMP S325 eye
diagram conforms to the eye diagram mask of optical transmit
signalas shown in Figure 2-2.
Figure 2-2 Mask of Eye Diagram for Optical Transmit Signal
General transmitter pulse shape characteristics include rise
time, fall time, pulseovershoot, pulse undershoot, and ringing. All
these may deteriorate the sensitivity of thereceiver and therefore
should be restricted.
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To prevent excessive deterioration of the receivers sensitivity,
the waveform of transmitsignal should be limited. Therefore, the
eye diagram mask sent at the transmit point S isspecified to
regulate the pulse shape of optical transmit signal.
Systems at different STM levels should meet corresponding
requirements for different eyediagram mask shapes. The eye diagram
mask parameters are listed in Table 2-25.
Table 2-25 Parameters of Eye Diagram Mask for Optical Transmit
Signal
Coordinate Relations of EyeDiagram Mask
STM-1 STM-4 STM-16
x1/x4 0.15/0.85 0.25/0.75 -
x2/x3 0.35/0.65 0.40/0.60 -
y1/y2 0.20/0.80 0.20/0.80 0.25/0.75
x3x2 - - 0.2
2.6.4 Mean Optical Launched PowerThe mean optical launched power
parameters of the ZXMP S325 STM-N (N=1, 4, 16) arelisted in Table
2-26.
Table 2-26 STM-N Mean Optical Launched Power (dBm)
STM-1 STM-4 STM-16Index
S-1.1/
S-1.2
L-1.1/
L1.2
S-4.1/
S-4.2
L-4.1/L-
4.2
S-16.1/
S-16.2
L-16.1/L-16.2
/L-16.2U
nS1-2XX/
nL1-2XX
Mean opticallaunched power(dBm)
-15~-8 -5~0 -15~-8 -3~+2 -5~0 -2~+3 0~+5
2.6.5 Extinction RatioThe extinction ratios of the ZXMP S325 are
listed in Table 2-27.
Table 2-27 Extinction Ratio of STM-N Optical Interfaces
STM-1 STM-4Index
S-1.1/S-1.2 L-1.1/L1.2 S-4.1/S-4.2 L-4.1/L-4.2
STM-16
Extinction ratio(dB)
8.2 10 8.2 10 8.2
2.6.6 Receiver SensitivityThe STM-N receiver sensitivities of
ZXMP S325 are listed in Table 2-28.
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Table 2-28 STM-N Receiver Sensitivity (Unit: dBm)
STM-1 STM-16Index
S-1.1/S-1.2 L-1.1/L-1.2/L-
1.3
STM-4
S-16.1/S-
16.2/nS1-2XX
L-16.
1
L-16.2/L-16.2U/
nL1-2XX
Receiver sensitivity(dBm)
-28 -34 -28 -18 -27 -28
BER=110-10
2.6.7 Receiver OverloadThe receiver overloads of ZXMP S325 are
described in Table 2-29.
Table 2-29 STM-N Receiver Overload
STM-1 STM-16Index
S-1.1/S-1.2 L-1.1/L-1.2/L-1.3
STM-4
S-16.1/ S-16.2/
nS1-2XX
L16.1/L-16.2/L-
16.2U/ nL1-2XX
Overload (dBm) -8 -10 -8 0 -9
BER=110-10
2.6.8 Mean Optical Received PowerThe mean optical received power
should be greater than the worst sensitivity and less thanthe
overload of relevant optical boards.
ZXMP S325 conforms to the above specifications.
2.6.9 Permitted Frequency Deviation of Optical Input
InterfacesThe permissible frequency deviation of the ZXMP S325
optical input interface is within 20 ppm (1 ppm=110-6).
2.6.10 AIS Rate of Optical Output InterfacesThe AIS rate
deviation of the ZXMP S325 optical output interface is within 20
ppm (1ppm=110-6)
2.7 Electrical Interface Specifications
2.7.1 Code Patterns of Electrical InterfaceTable 2-30 lists the
code patterns of electrical interface supported by the ZXMP
S325.
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Table 2-30 Code Patterns of Electrical Signal
ElectricalSignal Type
Bit Rate (kbit/s) Code PatternAbbreviation
Code Pattern Full Name
E0 64 AMI Alternate Mark Inversion
T1 1544 B8ZS Bipolar with 8-Zero Substitution
T3 44736 B3ZS Bipolar with 3-Zero Substitution
E1 2048
E3 34368
HDB3 High Density Bipolar of order 3
STM-1 (E) 155520 CMI Code Mark Inversion
2.7.2 Permitted Attenuation of Input Interfaces,
FrequencyDeviation of Input Interfaces and Bit Rate Tolerance of
OutputInterfaces
The permissible attenuation/frequency deviation of input
interface and bit rate tolerancesof the ZXMP S325 output interface
signals are listed in Table 2-31.
Table 2-31 Permitted Attenuation/Frequency Deviation of Input
Interface, and Signal BitRate Tolerance of Output Interface
Interface Rate(kbit/s)
Permitted Attenuationof Input Interface (dB) (regular square
rootattenuation)
Permitted FrequencyDeviation of InputInterface (ppm)
Permitted Bit ErrorTolerance of OutputInterface (ppm)
1544 0~6, 772 kHz Within 32 Within 32
2048 0~6, 1024 kHz Within 50 Within 50
34368 0~12, 17184 kHz Within 20 Within 20
44736 0~20, 22368 kHz Within 20 Within 20
155520 0~12.7, 78 MHz Within 20 Within 20
1 ppm=110-6
2.7.3 Reflection Attenuation of Input/Output InterfacesThe
requirements on the reflection attenuation index of an input/output
interface of theZXMP S325 are described in Table 2-32.
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Table 2-32 Requirements on the Reflection Attenuation Index of
an Input/OutputInterface
Interface bit rate (kbit/s) TestFrequencyRange(kHz)
Reflection Attenuation(dB)
51.2~102.4 12
102.4~2048 18
Input interface
2048~3072 14
51~102 6
2048
Output interface
102~3072 8
860~1720 12
1720~34368 18
Input interface
34368~51550 14
1720~51550 6
34368
Output interface
102~3072 8
860~1720 12
1720~34368 18
Input interface
34368~51550 14
1720~51550 6
44736
Output interface
102~3072 8
155520 Input/output
interface
8000~240000 15
2.7.4 Anti-Interference Capability of Input InterfacesTable 2-33
lists the anti-interference capability of ZXMP S325.
Table 2-33 Anti-interference Capability of ZXMP S325
Interface bit rate (Unit: kbit/s) Signal-to-noise Ratio (S/N)
(Unit: dB)
2048 18
34368 20
2.7.5 Waveform of Output InterfacesThe waveforms of various
electrical output interfaces of ZXMP S325 satisfy the
templaterequirement of ITU-T G.703 Recommendation.
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1544 kbit/s Electrical Interface
The output pulse mask of the 1544 kbit/s electrical interface is
shown in Figure 2-3.
Figure 2-3 Output Pulse Mask at the 1544 kbit/s Electrical
Interface
2048 kbit/s Electrical Interface
The output pulse mask of the 2048 kbit/s electrical interface is
shown in Figure 2-4.
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Figure 2-4 Output Pulse Mask at the 2048 kbit/s Electrical
Interface
34368 kbit/s Electrical Interface
Figure 2-5 illustrates the output pulse mask of the 34368 kbit/s
electrical interface.
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Figure 2-5 Output Pulse Mask at the 34368 kbit/s Electrical
Interface
44736 kbit/s Electrical Interface
illustrates the output pulse mask of 44736 kbit/s electrical
interface.
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Figure 2-6 Output Pulse Mask at the 44736 kbit/s Electrical
Interface
155520 kbit/s Electrical Interfaces
Masks of pulsescorresponding to a binary 0 and a binary 1 at the
155520 kbit/s electricalinterface are respectively shown in Figure
2-7 and Figure 2-8.
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Figure 2-7 Mask of a Pulse Corresponding to a Binary 0 at the
155520 kbit/s ElectricalInterface
Figure 2-8 Mask of a pulse Corresponding to a Binary 1 at the
155520 kbit/s ElectricalInterface
2.8 Interface Jitter Specifications
2.8.1 Jitter and Wander Tolerance of PDH Input InterfacesThe
jitter and wander tolerance of ZXMP S325 PDH input interface is
shown in Figure 2-9,and it meets the requirements listed in Table
2-34.
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Figure 2-9 Jitter and Wander Tolerance of PDH Input
Interface
Table 2-34 Jitter and Wander Tolerance of PDH Input
Interface
UIp-p Frequency (Hz)InterfaceRate(kbit/s)
A0 A1 A2 A3 f10 f9 f8 f1 f2 f3 f4
Pseudo-randomSignal
1544 18 5 0.1 1.2
10-5 10 120 6k 40k
2048 36.9 1.5 0.2 18 4.88
10-30.01 1.66
7
20 2.4k 18k 100k 215-1
34368 618.6 1.5 0.15 100 1k 10k 800k 223-1
44736 18 5 0.1 1.2
10-5 10 600 30k 400k
2.8.2 Jitter and Wander Tolerance of SDH Input InterfacesThe
input interfaces jitter and wander tolerance of the ZXMP S325 SDH
terminalmultiplexer satisfies the requirements described in Figure
2-10, Table 2-35, and Table2-36.
The input interfaces jitter and wander tolerance of the ZXMP
S325 SDH regeneratorsatisfies the requirements shown in Figure 2-11
and Table 2-37.
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Figure 2-10 Jitter Tolerance of STM-N Terminal Multiplexer Input
Interface
Table 2-35 Input Jitter and Wander Tolerance (UIP-P) of SDH
Terminal Multiplexer
Interface A0 A1 A2 A3 A4
STM-1 (E) 2800 311 39 1.5 0.075
STM-1 (O) 2800 311 39 1.5 0.15
STM-4 (O) 11200 1244 156 1.5 0.15
STM-16 (O) 44790 4977 622 1.5 0.15
Table 2-36 Frequency (Hz) of Input Jitter and Wander Tolerance
of SDH Terminal Multiplexer
Inter-face
f0 f12 f11 f10 f9 f8 f1 f2 f3 f4
STM-1
(E)
1.210-5 1.7810-4 1.610-3 1.5610-2 0.125 19.3 500 3.25k 65k
1.3M
STM-1
(O)
1.210-5 1.7810-4 1.610-3 1.5610-2 0.125 19.3 500 6.5k 65k
1.3M
STM-4
(O)
1.210-5 1.7810-4 1.610-3 1.5610-2 0.125 9.65 1000 25k 250k
5M
STM-16
(O)
1.210-5 1.7810-4 1.610-3 1.5610-2 0.125 12.1 5000 100k 1M
20M
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Figure 2-11 Input Jitter Tolerance of STM-N SDH Regenerator
Table 2-37 Input Jitter Tolerances of STM-1, STM-4 and STM-16
Regenerators
STM Interface f1 (kHz) f2 (kHz) A1 (UIP-P) A2 (UIP-P)
A 65 6.5 0.15 1.5STM-1
B 12 1.2 0.15 1.5
A 250 25 0.15 1.5STM-4
B 12 1.2 0.15 1.5
A 1000 100 0.15 1.5STM-16
B 12 1.2 0.15 1.5
2.8.3 STM-N Interface Inherent Output Jitterl STM-N interface
inherent output jitter of SDH equipment is defined as the jitter at
the
STM-N output interface of the equipment when there is no input
jitter. For the ADMand TM equipment of ZXMP S325, the STM-N
interface inherent output jitter satisfiesthe requirements listed
in Table 2-38.
Table 2-38 STM-N Interface Inherent Output Jitter Specifications
of SDH Equipment
STM Interface Test Filter Peak-peak Jitter (UI)
500 Hz ~ 1.3 MHz 0.3STM-1
65 kHz ~ 1.3 MHz 0.1
1 kHz ~ 5 MHz 0.3STM-4
250 kHz ~ 5 MHz 0.1
5 kHz ~ 20 MHz 0.5STM-16
1 MHz ~ 20 MHz 0.1
Due to the randomness of jitter, the test value might exceed the
specifications. It is acceptableas long as over 99% test values
satisfy the specifications during the test (about 1 to 2
minutes).
l The STM-N network interface output jitter of SDH equipment is
defined as the outputjitter value measured at the output interface
of any STM-N level in the SDH network.
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For ADM and TM equipment of ZXMP S325, the STM-N network
interface output jittersatisfies the requirements listed in Table
2-39.
Table 2-39 STM-N Network Interface Output Jitter Specifications
of SDH Equipment
STM Interface f1 (Hz) f3 (Hz) F4 (MHz) B1 (UIp-p) B2 (UIp-p)
STM-1 optical
interface
500 65 k 1.3 1.5 0.15
STM-1 electrical
interface
500 65 k 1.3 1.5 0.075
STM-4 optical
interface
1 k 250 k 5 1.5 0.15
STM-16 optical
interface
5 k 1 M 20 1.5 0.15
Due to the randomness of jitter, the test value might exceed the
specifications. It is acceptableas long as over 99% test values
satisfy the specifications during the test (about 1 to 2
minutes).
l For REG equipment, when the test filter employs a 12 kHz
high-pass filter, the rootmean square caused by jitter should be no
more than 0.01 UI.
2.8.4 Mapping Jitter of PDH TributaryZXMP S325 The mapping
jitter of the PDH tributary interface satisfies the
requirementslisted in Table 2-40.
Table 2-40 Mapping Jitter of PDH Tributary Interface
High-Pass Filter, 20 dB/10 Octaves Mapping Jitter of MaximumPeak
Value
G.703Interface(kbit/s)
Tolerance(ppm)
f1 (Hz) f3 (Hz) f4 (Hz) f1 ~ f4 f3 ~ f4
1544 22 10 8 k 40 k 0.7
2048 50 20 18 k 100 k To be
determined
0.075
34368 20 100 10 k 800 k To be
determined
0.075
44736 20 10 30 k 400 k 0.4 0.1
2.8.5 Combined JitterIn SDH system, generally there are both
mapping jitter and pointer adjustment jitter. Thecombined jitter of
these two jitters is called the combined jitter. The combined
jitter of ZXMPS325 got from various test sequences should satisfy
the specifications listed in Table 2-41,Table 2-42, and Table
2-43.
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Table 2-41 E1/E3 Combined Jitter Specifications
High-Pass Filter 20 dB/10Octaves
Maximum Peak-Peak Value Combined Jitter UIp-pPDH
In-terface(kbit/s)
Bit RateToler-ance(ppm)
f1 (Hz) f3 (Hz) f4 (Hz) UIp-p (f1 ~ f4) UIp-p (f3 ~ f4)
2048 50 20 18 k 100 k 0.4 0.4 0.4 0.075 0.075 0.075
34368 20 100 10 k 800 k 0.4 0.4 0.4 0.75 0.075 0.075 0.075
0.075
Test sequence a b c d a b c d
Table 2-42 T1 Combined Jitter Specifications
High-Pass Filter 20dB/10 Octaves
Maximum Peak-Peak Value Combined Jitter
UIp-pPDHInter-face(kbit/s)
BitRateToler-ance(ppm)
f1(Hz)
f3 (Hz) f4(Hz)
UIp-p (f1 ~ f4) UIp-p (f3 ~f4)
1544 32 10 8 k 40 k 1.3 1.3 1.9 1.9 To be de-
termined
Test sequence e h,
periodic
and
regular
h,
periodic
and
added
h, pe-
riodic
and can-
celled
Table 2-43 T3 Combined Jitter Specifications
High-PassFilter 20dB/10Octaves
Maximum Peak-Peak Value Combined Jitter
UIp-pPDHInter-face(kbit/s)
BitRateToler-ance(ppm) f1
(H-z)
f3(H-z)
f4 (Hz)
UIp-p (f1 ~ f4) UIp-p (f3 ~f4)
44736 20 10 30
k
40
0 k
0
.
7
1
.
3
1 1.3 1.3 1 1.3 1.3 To be de-
termined
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High-PassFilter 20dB/10Octaves
Maximum Peak-Peak Value Combined Jitter
UIp-pPDHInter-face(kbit/s)
BitRateToler-ance(ppm) f1
(H-z)
f3(H-z)
f4 (Hz)
UIp-p (f1 ~ f4) UIp-p (f3 ~f4)
Test sequence e f h,
peri-
odic
and
reg-
u-
lar (
87-3
co-
de
pat-
tern)
h,
peri-
odic
and
reg-
u-
lar (
87-3
co-
de
pat-
tern)
h,
peri-
odic
and
can-
cel-
led (
87-3
code
pat-
tern)
h,
peri-
odic
and
reg-
ular
h,
peri-
odic
and
add-
ed
h,
peri-
odic
and
can-
cel-
led
-
2.8.6 Jitter Transfer Characteristic of RegeneratorThe jitter
transfer characteristic of the ZXMP S325 SDH regenerator is shown
in Figure2-12. The parameters of the jitter transfer characteristic
of regenerator are listed in Table2-44.
Figure 2-12 Jitter Transfer Characteristic of Regenerator
Table 2-44 Parameters of Jitter Transfer Characteristic of
Regenerator
STM-N fc (kHz) P (dB)
A 130 0.1STM-1
B 30 0.1
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STM-N fc (kHz) P (dB)
A 500 0.1STM-4
B 30 0.1
A 2000 0.1STM-16
B 30 0.1
2.9 Clock SpecificationsTiming Principles
The component closest to the SDH network synchronization
performance is the clock unit.ITU-T Recommendations specify three
types of clocks:
l ITU-T G.811 specifies the primary reference clock.l ITU-T
G.812 specifies slave clocks at different levels.l ITU-T G.813
specifies the slave clock of SDH equipment.
All the timings of SDH system should conform to the primary
reference clock (PRC)described in G.811.
Output Jitter
When there is no input jitter, the inherent jitter of the 2MHz
or 2Mbit/s clock output interfacein ZXMP S325 should not exceed
0.05 UIP-P. The test is conducted at the time interval of60 s,
using a single pole bandpass filter with 20 Hz and 100 kHz turnover
frequencies.
Permissible Input Interface Attenuation/Frequency Deviation and
Others
The specifications of permissible input interface
attenuation/frequency deviation of theZXMP S325 clock are listed in
Table 2-45.
Table 2-45 Specifications of Permissible Input Interface
Attenuation/FrequencyDeviation and Others
Item Specification
Permissible input
interface attenuation
The attenuation characteristic introduced by the input interface
signal
complies with the frequency square root rule. When using cables
with
attenuation range of 0 dB ~ 6 dB, no bit error or clock lock
loss occurs in
the equipment.
Permissible input
interface frequency
deviation
4.6 ppm
Signal bit rate tolerance of
the output interface
4.6 ppm
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Item Specification
Output interface
waveform
Conforms to the relevant templates specified in ITU-T G.703
1 ppm=110-6
Switching of Timing Reference SourcesZXMP S325 is equipped with
more than one external timing reference input. When theselected
timing reference fails, the SDH equipment can automatically switch
to anothertiming reference input using the S1 byte.
Note:
For 2 Mbit/s external timing source, the timing reference
failure refers to the signal loss ofsynchronous clock input
interface; for the timing recovery through STM-N line signals,
thetiming reference failure refers to the loss of STM-N signals
that bear timing signals, or theAIS occurrence.
Long-term Phase Variation in Locked ModeThe long-term phase
variation in the locked mode is generally expressed by the
MaximumTime Interval Error (MTIE) and Time Deviation (TDEV).
ZXMP S325 satisfies the requirements listed in Table 2-46, Table
2-47, and Table 2-48.
Table 2-46 Wander Limit at Constant Temperature (MTIE)
MTIE Limit Observation Interval
40 ns 0.1 s
-
Chapter 2 Technical Specifications
TDEV Limit Observation Interval
6.4 ns 100 s
-
ZXMP S325 Product Description
l OPA: 1-channel pre-amplifier
Table 2-49 lists the specifications of OBA board.
Table 2-49 Types and Specifications of OBA Board
Index Unit OBA12 OBA14 Remark
Working wavelength nm 1530~1562 1530~1562 -
Optical received power range dBm -12~+4 -12~+4 -
Optical launched power (typical
value)
dBm 12 14 -
Adjustment range of optical
launched power
dB 9~12.5 11~14.5 Can be directly
adjusted.
Output controllable precision dB 0.5 0.5 -
Optical launched power in
Eyesafe (APR) mode
dBm
-
Chapter 2 Technical Specifications
2.11 Ethernet Performance Specifications
2.11.1 Transparent Transmission Performance Specifications
Maximum and Minimum Frame Lengths
The frame lengths that can be processed by the smart fast
Ethernet board (SFEx6), theenhanced smart Ethernet board (SED), the
embedded RPR processor board (RSEB), andthe Ethernet transparent
transmission board (TFEx8) of ZXMPS325meet the requirementslisted
in Table 2-51.
Table 2-51 Specifications of Frame Length
Ethernet Board Minimum Frame Length (byte) Maximum Frame
Length(byte)
SFEx6 64 1522
SED 64 1522 (1600 with Jumbo frame
enabled)
RSEB 64 1522 (1600 with Jumbo frame
enabled)
TFEx8 64 1522 (1600 with Jumbo frame
enabled)
Board Throughput
l For the ZXMP S325, when the ports of smart fast Ethernet board
(SFEx6) areconfigured with 46 VC-12s, the port throughput can reach
the line speed of 100Mbit/s.
l When the enhanced smart Ethernet board (SED) is configured
with GE services, theport throughput can reach the line speed of 1
Gbit/s.
l When the RSEB board is configured with GE services, the port
throughput can reachthe line speed of 1 Gbit/s.
l When the ports of Ethernet transparent transmission board
(TFEx8) are configuredwith 63 VC-12s, the port throughput can reach
the line speed of 100 Mbit/s.
Note:
The flow control function of port must be disabled while testing
the port throughput.
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ZXMP S325 Product Description
Packet Loss Ratio
Packet loss ratio refers to the maximum acceptable packet loss
ratio under the prerequisitethat data is normally received. There
is no specific criterion for packet loss ratio. However,it should
be as low as possible and close to zero under certain
conditions.
Note:
The flow control function of port must be disabled when
conducting the packet loss ratiotest.
Delay
Delay refers to the maximum acceptable delay under the
prerequisite that data is normallyreceived. There is no specific
criterion for delay. However, it should be as small as
possibleunder certain conditions.
2.11.2 VLAN Specifications
Specification of VLAN Basic Function
The basic function of VLAN refers to the function of the
tag-based VLAN that complieswith the IEEE 802.1Q standard. Through
the network management configuration, theSmart Fast Ethernet board
(SFEx6), the enhanced smart Ethernet board (SED), and theembedded
RPR processor board (RSEB) of ZXMP S325 supports this function.
Trunk Specification
Trunk refers to the transmission of large-capacity Ethernet
services by binding multipleEthernet interfaces. The Ethernet ports
in the same Trunk group have the same VLANconfiguration attributes.
They cannot interwork with the Ethernet ports that do not belongto
the same Trunk group.
l The SFEx6 board supports two trunk groups at most at the user
side, and each groupcan support one to four Ethernet ports.
l The SED board supports ten trunk groups at most at the user
side, and each groupcan support one to four Ethernet ports. The SED
board supports eight trunk groupsat most at the system side, and
each group can support two, four, or eight Ethernetports.
l The RSEB board can support three trunk groups at most at the
user side. Whensupporting two trunk groups, one trunk group
supports tow Ethernet ports, and theother trunk group supports four
Ethernet ports; when supporting three trunk groups,each trunk group
supports two Ethernet ports.
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Chapter 2 Technical Specifications
Quantity of VLAN IDs
In IEEE 802.1Q standard, a header of four bytes is defined as a
VLAN ID. Each port canbelong to multiple VLANs.
The smart fast Ethernet board (SFEx6), the enhanced smart
Ethernet board (SED), andthe embedded RPR processor board are able
to recognize C-VLAN IDs that comply withIEEE 802.1Q standards. The
range of VLAN ID is 1 to 4094.
VLAN Priority
Under the prerequisite that the QoS function is enabled, when
services from multiplesources are converged at one transmit port,
the port can transmit these services accordingto the preset VLAN
priorities and bandwidths. Once the total traffic exceeds the
transmitbandwidth of the port, the port will discard the services
with lower priorities and overbandwidth limit, to ensure the normal
transmission of services with higher priorities.
The SFEx6 board, the SED board, and the RSEB board of ZXMP S325
support theconfigurations of VLAN priority and bandwidth
proportion.
2.11.3 L2 Switching Specifications
Security Filtering Characteristics
The security filtering characteristics include the static MAC
address setting, MAC addressfiltering, and broadcast address
filtering.
l Setting of static MAC address
Manually add a MAC address and the information of the
corresponding port into theMAC address list. Only the receive port
which has been set can receive the trafficnormally without any
packet loss.
The SFEx6 board and the RSEB board of ZXMP S325 support this
function by theconfiguration of EMS.
l MAC address filtering
Filter frames that have a MAC address as the source address or
the destinationaddress by adding the MAC address manually into the
MAC address list. The portthat has been set cannot receive any
traffic.
Through network management configurations, the SFEx6 board and
the RSEB boardof ZXMP S325 support this function.
l Broadcast address filtering
A broadcast address is a MAC address of all Fs. It may increase
network load andcause path congestion. Broadcast address filtering
can prevent path congestion.
Through network management configurations, the SFEx6 board, the
SED board andthe RSEB board of ZXMP S3