Singularit University presentation Nanotechnology nextbigfuture.com

Latest Developments and Current Capabilities in Nanotechnology

Brian WangJuly 16, 2010

Overview of the Talk• 2D and 3D Nanoscale patterning and

manufacturing• Quantum dots• Self Assembly• Memristors• Sensors and electronics in living cells• Carbon nanotubes & graphene

Aerosol Jet Printing and Printable Electronics

Nanoimprint• metallic-glass molds with 3D features as small as 13 nanometers.• Theoretic size limit is the size of a single atom • carbon nanotubes templates in development

Fab in a Box

Fab in a Box

Nanotip Based Patterning• Current resolution of about 15 nm could go to 1nm• E-beam lithography systems cost up to $5 million• IBM’s Desktop nanotip system will cost $100,000.• extremely small silicon tip cantilevered like AFM• thermal energy at the tip break weak bonds within the material

Zyvex• Tip-Based Nanofabrication (DARPA funded) to make atomically precise quantum dots• Tip never physically contacts anything• Protection atoms leave into the gas phase• Building blocks arrive via gas phase• Is a scalable process• Extensible to many other material systems• Invariant STM tip technology

Zyvex APM• ALE growth in nanoscale patterned areas• Sub Angstrom closed loop nanopositioning systems• CMOS MEMS nanopositioners• Nano-Electronics/Photonics applications that exploit atomic precision• Nano-Bio applications that exploit atomic precision

Quantum Dots• the smaller the size of the dot, the larger the band gap• bigger gap more energy is needed to excite the dotmore

energy is released when returns to its resting state• Quantum dots for Quantum Film – better cameras (InVisage)• Quantum dots for better LED Lighting and LCD displays• QD laser 25 Gbps communication – Fujitsu• QD better infrared sensors (2X now, then20-40 times better)

Quantum Dot Devices

• Quantum dot solar cells• Quantum dot cameras• Quantum dot displays improve efficiency of

LCDs by 40%• QuantumFilm image sensors are the world’s

first commercial quantum dot-based image sensors, replacing silicon.

• InVisage delivers 4x higher performance, 2x higher dynamic range

Self Assembly• Guided Self-assembly• Surface topography• Surface wetting• Electrostatic force• Magnetic force

sawtooth ridges formed by cutting and heating a sapphire crystal serves to guide the self-assembly of nanoscale elements

HP now has 3 nm memristors• provide controllable resistance•1 nanosecond switching times •memcapacitors and meminductors too

Memristors for Memory

Nano-enhanced Regular Tech• Concrete and metal

– Research on the nanoscale that provides insight into improved control of the properties

– Nanograins for metal, almost no-creep concrete• Hydrophobic sand

– Desert sand made hydrophobic by additive SP-HFS 1609– The large rolls sandwich the sand between layers of polyethylene and

can be produced in lengths of up to 50 metres. “The coating is done in 30 or 45 seconds,” said Hareb. “We have the capacity of manufacturing 3,000 tonnes per day.”

• Engineering properties : composites, polymers, doping• Nanomembrane : Desalination and water purification

* Larger holes (4-5nm) in zeolite for more efficient oil refining.Crack larger molecules

* Cars, planes, buildings, subs

Nanomed today

Nanoshells –Optical Legos

• Gold nanoshells can be used for cancer treatment

• Nanoshells are about 20 times smaller than red blood cells

• Different sizes interact with different wavelengths of light

One Cubic Micron Devices, Sensors and Claytronics and chips in living cells

• Leading edge of today• Phoenix Processor consumes on average 29.6pW in standby

mode and 2.8pJ/cycle in active mode. Runs on cubic mm of battery

• 2000 instructions to be run once every 10 minutes for sensors• 3 micron X 3 micron by 0.5 micron chips were placed into

living cells

Carbon nanotubes• 500 ton/year factory : Cnano Technologies• 400 ton/ year Showa Denka, 200 ton/year Bayer• Context (carbon fiber, kevlar, copper, steel, cement)• CNT-reinforced aluminum is only around one third that of

steel, but is as hard as steel (Bayer Materials work)– Could become cheaper than alloy method for making strong

aluminum

Graphene• electrons in graphene 100 times faster than electrons in

silicon• Stronger than carbon nanotubes• Graphene Ultracapacitors with double energy density of

current ultracapacitors• Still in lab, not in mass production• Polymers with 0.1% graphene platelets were 40% stronger

Nanocomp Technologies• Bulk Carbon Nanotubes.• Better for radiation and electromagnetic shielding• EM shielding at one third the weight of copper• Superior electrical properties already exist for antennas• Can tune multiple properties in their carbon nanotube sheets. • University Dayton 500 feet of 12-inch-wide fabric per day

at a pilot plant (Fuzzy Fiber)• Next 60 inch wide sheets

Lunar Cement and Concrete• 2.4-metre mirror like Hubble's

• 600 kilograms (1300 pounds) of Moon dust• 60 kg (130 pounds) of epoxy• 6 kg (13 pounds) of carbon nanotubes• less than a gram of aluminium

– Built a 30-centimetre disc in 2008

Properties

• Strength of materials• Conductance • Electron mobility• Thermal properties• Do more or better with less material

(stronger, electrical properties)• Do something completely new

Q & A

• Open for Questions

Nanostructured Nickel Magnesium Oxide

• the engineers added metal nickel to magnesium oxide, a ceramic. The resulting material contained clusters of nickel atoms no bigger than 10 square nanometers, a 90 percent size reduction compared to today’s techniques

• Enables terabyte computer storage• By introducing metallic properties into ceramics, engineers could develop

a new generation of ceramic engines able to withstand twice the temperatures of normal engines and achieve fuel economy of 80 miles per gallon.

Non epitaxial growth to interface incompatible material

• University of Maryland has created a new way to produce high quality semiconductor materials critical for advanced microelectronics and nanotechnology.

• No clean room is needed• Previously incompatible material can be interfaced• no lattice matching needed• no thickness constraints• simpler and cheaper than epitaxy process

Designer Materials – inorganic nanocomposites

• nanocomposites with desired properties can be designed and fabricated by first assembling nanocrystals and nanorods coated with short organic molecules, called ligands.

• These ligands are then replaced with clusters of metal chalcogenides, such as copper sulfide. As a result, the clusters link to the nanocrystal or nanorod building blocks and help create a stable nanocomposite. The team has applied this scheme to more than 20 different combinations of materials, including close-packed nanocrystal spheres for thermoelectric materials and vertically aligned nanorods for solar cells

Billions of self-assembled, light-sensing, DNA nanostructures

• foundation for molecular-scale logic system

• Can absorb and react to light

• Can trigger release of another wavelength

Reconfigurable Metamaterials Terahertz Lens

• ultimate metamaterial lens change all of its properties

• spacing and the rotation of the split-ring resonators• Split ring resonators – gold ring with small cut• Heating or cooling changes how lens bends light• Can flip direction light bends

Nanopantography• Nanopantography uses microlenses placed on a substrate (the surface that is being

written upon) to divide a single ion beam into billions of smaller beams, each of which writes a feature on the substrate for nanotech device production

• simultaneous impingement of an Ar+ beam and a Cl2 effusive beam on an array of 950-nm-diam lenses can be used to etch 10-nm-diam features into a Si substrate, a reduction of 95x.

• Simulations indicate that the focused “beamlet” diameters scale directly with lens diameter, thus a minimum feature size of 1 nm should be possible with 90-nm-diam lenses that are at the limit of current photolithography.

• We expect nanopantography to become a viable method for overcoming one of the main obstacles in practical nanoscale fabrication: rapid, large-scale fabrication of virtually any shape and material nanostructure. Unlike all other focused ion or electron beam writing techniques, this self-aligned method is virtually unaffected by vibrations, thermal expansion, and other alignment problems that usually plague standard nanofabrication methods. This is because the ion focusing optics are built on the wafer.

Thermoelectric• Silicon nanowires. ZT

0.6-1.0• quantum wells that

get 4.5ZT• thallium-doped lead

telluride ZT 1.5 3.0

• Recover waste heat of cars and trucks

• Power passenger cooling and heating

Roadmap

Block Co-polymers• Block copolymersUCSB claims self assembly block

co-polymer features on silicon (5-20nm). Making improvements (like cross linking for faster manufacturing)

Advanced Lithography and BeyondMainstream: lithography, nanoparticles for medicine and more,

carbon nanotubes and other nanotech and nanostructured materials, Scanning Probe Microscopy and other microscopy, aerojet printing, arrays of dip pens, MEMS/NEMS, nano-enhanced regular tech, better sensors, detection devices and tests

Enabling: Computational Chemistry, Superlenses, Lab on a chipProgressing: DNA nanotechnology, self assembly, graphene

electronics, quantum dots, quantum computing, nanostructures for tissue engineering, nanomembranes/nanofiltration, nanophotonics, molecular electronics, spintronics, plasmonics

Basic capabilities and funded development: atomic layer expitaxy and deposition, mechanosynthesis

Other: RNA, DNA, proteins, avogadro scale computing, claytronics, synthetic life

Beyond CMOSEmerging Research Device

Technology Candidates are being evaluated. A list of devices being considered to go beyond CMOS.- Nano-electro Mechanical Switches- Collective Spin Devices- Spin Torque Transfer Devices- Atomic Switch / Electrochemical Metallization- Carbon-based Nanoelectronics- Single Electron Transistors- CMOL / Field Programmable Nanowire Interconnect (FPNI)

Microscopy

• STM• SPM• AFM• Superlenses• Hyperlens

Diamond• Switch higher frequencies (10-120 Ghz) and voltages for power chips (MESFET, rf, 100 watt x-

bands)• High power devices applications include satellite communications, telecoms base stations and

compact, high resolution phased-array radars• 2 tons of power electronics per railcar can be 50 pounds• Great thermal conductivity, reaching 2,000 Wm-1°C-1 for mono-crystal, which is the highest of

any solid material (4-5X higher than silicon carbide and copper)• diamond is vastly better substrate• Single crystal diamond across wafers much bigger than an inch and a half• polycrystalline diamond films (5 nm grains of carbon, 20-30 atoms across)• nanocrystalline diamond onto 300-mm (12-inch) wafers in lab• Commercially 50-100mm polycrystalline diamond wafers, 150mm soon• ADT’s ultrananocrystalline diamond (UNCD) is naturally insulating but can be made highly

conductive by doping it with nitrogen• Doping (change and control properties) and scaling problems solved• Silicon MEMS operate at megahertz• Diamond MEMS can be gigahertz

Computational Chemistry• Computational chemistry is a branch of chemistry that uses computers to

assist in solving chemical problems• Computing power and methods have advanced to where it is now

possible to use molecular simulations to predict important engineering properties of real materials with a high degree of accuracy.

• Anton Supercomputer, Nvidia Tesla• NanoEngineer-1 is an open-source (GPL) 3D multi-scale modeling and

simulation program for nano-composites with special support for structural DNA nanotechnology.

Nanoparticles• Nanoparticles for

diagnosis and delivery of medicine

• Tobacco mosaic virus is like a 18-nanometer wide straw, which can hold gene silencing RNA

• 2007 total market for nanotechnology-enabled drug delivery will rise to $26 billion by 2012 from its current size of $3.39 billion, representing a compound annual growth rate of 37%.

Advanced Lithography• Double, triple & quadruple patterning (down to 11 nm)• E-beam• IBM 3D Nanotip based patterning• EUV (with quadruple patterning down to 5 nm)• Nanoimprint (13nm now 1-2 nm with CNT)• Self assembly (down to 2 nm)• Plasmonic lithography• Resolution augmentation through photo-induced deactivation (RAPID)

lithography 40 nm now (10nm)• Ion beams• Through silicon via (other 3D techniques)• Different materials• Long List, Different Ways Forward, things will work down to 1-

2 nm eventually and at reasonable cost and volume (Intel plans for 8nm in 2017)

DNA Nanotechnology

• DNA origami• DNA movement and placement of

nanoparticles and carbon nanotubes• New bases and chemistry• DNA separation of carbon nanotubes• DNA factory (50 steps now)• All computer circuits made in DNA

3d DNA Nanotechnology

• DNA boxes

• DNA tubes and other shapes

Defining Nanotechnology

• Nanotech has many definitions• It has to do with very small things

HP Believes Memristor Memory could be better than Flash by 2013

Graphene Mass Production1. Rice University - Stronger superacids can

separate graphite into sheets of graphene and bring them into solution.

2. Graphene Synthesis on Cubic SiC/Si Wafers could make volume graphene electronics