Silicon Inner Layer Sensor PRR, 8 August 2003 1 G. Ginther Update on the D0 Run IIb Silicon Upgrade for the Inner Layer Sensor PRR 8 August 03 George Ginther University of Rochester On behalf of the Run IIb Silicon Group
Silicon Inner Layer Sensor PRR, 8 August 2003
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Update on the
D0 Run IIb Silicon Upgrade
for the
Inner Layer Sensor PRR
8 August 03
George Ginther
University of Rochester
On behalf of the Run IIb Silicon Group
Silicon Inner Layer Sensor PRR, 8 August 2003
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Detector Design Six layer silicon tracker, divided into two radial
groups and two barrels Inner layers: Layers 0 and 1
18mm < R < 39mm Axial readout only 50/58 m readout for L0/L1 Assembled into one unit Mounted on integrated support
Outer layers: Layers 2-5 53mm < R < 164 mm Axial and stereo readout 60 m readout pitch Stave support structure
Employs only single sided silicon Three sensor sizes L0 (2 chip) L1 (3 chip) L2-L5 (5
chip) All sensors have intermediate strips
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12 sided carbon
fiber support structures
Six sensors mounted on each side of the support structure
Inner Layers
Layer 0 pre-prototype with co-bonded grounding flex circuits
L1 Support Structure Assembly
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Readout SchematicsLayers 1-5: Hybrids mounted directly on silicon
Layer 0: Hybrids connected to sensors via analog cables (to address space and thermal constraints)
SVX4 chips mounted on hybrids; employed in SVX2 readout mode to facilitate reuse of Run IIa higher level readout infrastructure
Interface with current DAQ system
Sensor8’ Twisted Pair Cable
Adapter Card
Junction Card
2’ Digital Cable
Hybrid
Sensor8’ Twisted Pair Cable
Interface with current DAQ system
Junction Card
2’ Digital Cable
Analog
Cable
Hybrid
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Layer 1 Sensors Prototypes
10 prototype Hamamatsu sensors ordered April 2002 and delivered 21 Sept 2002
Three sensors irradiated at KSU Ordered the remaining 3 prototype L1 sensors that Hamamatsu
had on the shelf, and these arrived 16 July 2003 These sensors are of very high quality
144 production sensors installed in final assembly BOE includes 50% spare sensors --estimates based on 120 yen/$
– 60.5K$ NRE and 94.0K$ for 216 sensors (and 30% contingency)
Layer 0 Sensors Prototypes
Only ELMA sensors available 144 production sensors installed in
final assembly BOE includes 50% spare sensors
– 54.8K$ NRE and 59.6K$ for 216 sensors (and 75% contingency)
Inner Layer Sensors
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Update on Sensors
Sensor studies completed Electrical characteristics of prototype L1 sensors
and test structures Irradiation studies reviewed and completed Flux normalization verified via foil activation
Preparation for arrival of production sensors Certification of sensor probing sites
Fermilab Kansas State University Stony Brook Rochester (new probing site currently under development)
Visual and mechanical inspection prep Procedures and database setup
Outer layer sensor order placed 130 sensors arrived on 1 August 2003 QA evaluation in progress
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Advances in Other Areas
Second round SVX4 readout chip prototype approved, fabricated and currently under test
Yield appears to be high and chip appears fully functional Hybrid and module burn-in test stands completed Prototype analog cables delivered and tested Prototype L0 hybrids delivered and tested Grounding scheme on hybrids revised Grounding scheme for inner layer support structures
developed and being prototyped Fabrication fixtures prototyped and tested Mechanical grade pre-production stave fabricated Electrical grade pre-production stave in progress Carbon fiber (and autoclave) for stave shells ordered Bearings placed on z=0 prototype bulkhead
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Silicon Upgrade StatusFinal
Ordered Delivered Ordered Delivered Order
ELMA
HPK
ELMA
HPK
L2 Sensors HPK
Analogue Cable Dycx
L0 Hybrid Amitr.
L1 Hybrid
CPT
others
L2S Hybrid
Honey
Basic
J unction Card
Twisted Pr. Cable
Adapter Card
Purple Card
Test Stand Elctr.
First Prototype Second Prototype
Component Vendor Design
L0 Sensors
L1 Sensors
Digital Cable
L2A Hybrid
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Sensor Production Schedule
Hamamatsu provided a sensor production schedule which includes L0 and L1 sensors
Delivery of first batch of L2-5 sensors was almost on schedule
TYPE L1 L2-5 L0 TOTAL
QTY
3/4 0
3/5 0
3/6 0
3/7 130 130
3/8 130 130
3/9 270 270
3/10 110 270 380
3/11 270 50 320
3/12 270 50 320
4/1 106 270 60 436
4/2 270 56 326
4/3 400 400
4/4 400 400
4/5 55 55
4/6 0
4/7 0
TOTAL 216 2735 216 3167
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Sensor Delivery If delivery of L0 sensors is completed
after 14 Sept 04, project misses DOE milestone by 14 Sept 04 should not cause module production slip
If Hamamatsu L0 sensor production schedule just slips with the order date slip, then this order should be placed within 3 months to avoid module production slip
– Order for L2-L5 sensors took six weeks from PRR to release And, we have no prototype Hamamatsu L0 sensors, and would prefer
to get a few asap for studies after 16 Sept 04 puts L0 sensors on critical path
2 days slack relative to current silicon ready to move date
If delivery of L1 sensors is completed after 28 June 04, project misses DOE milestone by 24 June 04 should not cause module production slip
If Hamamatsu L1 sensor production schedule just slips with order date slip, then this order should be placed within a month to avoid module production slip
after 4 October 04 puts L1 sensors on critical path 14.2 weeks slack relative to current silicon ready to move date
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Summary
Excellent progress on prototyping and pre-production of the D0 Run IIb Silicon Upgrade
Prototypes of all components of the design are in hand Pre-production for most parts in progress Remaining technical challenges are being addressed Have started placing production orders
A strong, knowledgeable, experienced and very dedicated team is working hard (in a rather challenging climate) to produce the upgraded silicon detector that D0 needs to significantly enhance its performance throughout Run IIb
The constraints on the project dictate that we continue to push ahead in spite of the uncertainty
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Charge The Committee is requested to review the overall readiness for
placing the production order for the inner layer sensors for the DZero Run IIb silicon detector. In particular, the project is requesting that the Committee evaluate the following items:
Whether the sensor specifications meet the technical requirements for Run IIb, recommending any changes that may be necessary. This should include, but not be limited to, consideration of results from radiation testing.
The completeness and viability of the quality assurance program the project has in place to qualify the production-version inner layer sensors, including a review of:
Soundness of the logistics of the testing and qualification plans; Technical specifications and criteria for quality assurance; Adequacy of the resources, both labor and equipment, that have been requested in
the project plan for testing and QA. Included here should be an evaluation as to whether the throughput of qualified sensors will be adequate to maintain the project schedule;
The adequacy of the plans for logging data from sensor testing. The overall technical readiness for placing the order, and the
procurement readiness and strategy. If the Committee has any reservations here, it is requested that they describe what additional work should be done in order to meet proper readiness criteria.
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Inner Layer Sensor PRR
Thank you for the insights, constructive comments, and recommendations that resulted from your review of the Outer Layer Sensors
Thanks for taking the time to help us in this important endeavor