SiD General Meeting Welcome & News 14/April/2014 14/April/2014 Andy White & Marcel Stanitzki.

SiD General Meeting

Welcome & News 14/April/2014

Andy White & Marcel Stanitzki

Welcome Everybody

● This is the second SiD General Meeting● Purpose:

– Updates and News for everybody between workshops● Agenda

– Some brief updates – ongoing R&D– News from Japan (Harry Weerts)– ILC Parameters Working Group (Jim Brau)– Kitakami Site News (Tom Markiewicz)– Spokeperson's question time

** AWLC 2014 Meeting at Fermilab, May12-16,2014 **

SiD/ILC It has been a long road to realizing the ILC !

We have seen major developments in Japan.

There have been ongoing multi-lateral conversations on the ILC in the context of the global HEP program.

We are at a major branch point – P5 ! SID provided input at the BNL P5 meeting.

We hope for a favorable result from P5 …but a positive result will come with issues of timescales and budget profiles~One month until we know the P5 outcome !

>>> Now let’s catch up on recent developments.

The LCC structureICFA

Linear Collider BoardProgram Advisory Committee

Directorate Lyn Evans

Deputy (Physics) Hitoshi Murayama

ILC Mike Harrison

Physics & Detectors Hitoshi Yamamoto

CLIC Steinar Stapnes

Regional DirectorsBrian Foster

Harry Weerts

FALC

Marcel Stanitzki and Jim Brau

SiD Detector R&D

• The last year has been a very difficult time for detector work related to the ILC in the U.S.

• There has been very limited support while we wait for the outcome of the P5 deliberations

• Requests have been made to DoE for support for both ILC accelerator and detector work – follow-up after P5 result is known (May 22 HEPAP Meeting)

• Nevertheless there has been activity in several areas…

SiD Detector R&DOngoing areas of R&D:

- Vertex detector development - Chronopixel* - 3-D* - Electromagnetic calorimeter - mechanical design* - prototype testing – test beam results* - new design for improved shielding* - Hadron calorimeter – continued activity in CALICE - Forward calorimeter (FCal/T506) - Rate calculations* - Magnetic Field calculations*

Just some brief examples today – much more at AWLC 2014 !

Chronopixel progress• Sarnoff is going to submit

prototype3 design for fabrication by the end of April ( I just got information that they are submitting it today, April 14). They did a lot of improvements in power supplies to decrease crosstalk from digital to analog part. And the main thing – new sensor. On the right the recent layout is shown. There will be few pixel options differing by sensor design (see next slide). Different pixel options will be implemented on the same chip in fractions of total pixels. One of the options will be prototype 2 type sensor – just for comparison.

U. Oregon

Proto3 vs proto2 sensor

At the top is shown prototype 2 sensor, and problem with it – it sits inside very highly doped p++ implant. On the right – top is what we hoped Sarnoff can do, using “Natural diode” element, which allows blocking p++ well. However, on the bottom right is what is only allowed – “natural transistor”. Here the problem may be with the size of n+ diffusions (no control on it), and with capacitance between gate and n+ diffusions. We will have 2 options – 1 with gates connected to source and drain and so forming sensor, and another – with gate connected to external bias, while sensor is formed only by source and drain diodes. They will try to sneak with upper right option also, but it violates design rules and may be rejected.

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SiD - 3D Electronics R&D

Final 3D wafers were delivered July 2013. DBI bonded wafers have good yield and high quality.• VIPIC (x-ray) and VICTR (CMS)

chips tested and work wellVIP (ILC) testing just started due to lack of funding and manpower• Initial tests are encouraging –

see token pass through all 36864 pixels, correct pixel addresses in read all mode

• Analog testing will begin next weekR. Lipton

DBI = Direct Bond Interconnect

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In March, 2014 we received the first 3D chips oxide (DBI) bonded to sensors – 3 tiers of bonded devices. Chips are 25 microns thick DBI bonded to the sensor on the bottom and contacted through top TSVs. Testing will start soon

R. Lipton

VICTR VIPVIP

VIPIC

We are now processing a variant which utilizes wafer-to-wafer bonds and a non-TSV scheme to build large area tiled arrays with SOI-based active edge sensors and DBI bonded interconnects. Wafers are complete.

Handle wafer

sensortrenches

Buriedoxide

readoutIC and pads200 micron

SiD Electromagnetic Calorimeter

SiD Electromagnetic Calorimeter

Single electron event Two electron event

- Unphysical “monster events”: Likely cause some non-current limited elements in KPiX; fix has been identified but not implemented

- In-time crosstalk due to parasitic coupling on sensor: New design where metal layer 1 shield metal layer 2 is being developed

- Working on analysis of test beam data: focus on 2-electron separation- Developing new mechanical layout for SiD using rectangular sensors

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Basic change is with metal 1.

• Metal 1 covering of implant is reduced to small contact.• A shield trace runs from near this contact to near the connection pad array on metal 2. • The shield traces do not connect to the implant contact or the connection pads.• The shield traces are tied together, and a connection pad is brought out through metal 2 so

that the potential of the shields can be fixed.

Concept for SiD EMCal shielded sensor

• SLAC, University of Oregon, University of California Davis

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Metal 1

connection of implant to metal 2 trace to pad.

Shield trace running under Metal 2 signal trace.

All shield traces are tied together, and brought to a metal 2 pad.

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Metal 1 Shield Traces

Terraced View

Au pads

Packing issue- 31 layers of detector panels increase in width by small amounts-

First 20 layers each increase in width by 12.99mmNext 10 layers each increase in width by 21.65mm

Originally proposed hexagonal silicon detectors do not lend themselves well to the small, incremental increase in width- Many fractional detectors and complicated circuits would be needed to gain good coverage

SiD Electromagnetic Calorimeter design

Possible packing solution-Make detectors rectangular detectors-

Divide small side of trapezoid by an integer – this is one side of the rectangle XMake another size of rectangle X + increment

Add an extra large detector for each successive layerThis works until all in a row are replaced –

-Then add another rectangle and re-adjust the number of large detectorsManipulating exact sizes could make this work

Flex circuits which join the detectors are simply rectangular strips

Flex circuit with silicon

SiD Electromagnetic Calorimeter design

0 5 10 15 20 25 30 35 40 45 50

-110

010

110

210

310

410

510

Entries : 104496 Mean : 1.7147 Rms : 2.4406

LumiCalHitsoccupancy rates

0 5 10 15 20 25 30 35 40 45 50

-110

010

110

210

310

410

510

Entries : 62066 Mean : 1.0220 Rms : 0.15232

EcalEndcapHitsoccupancy rates

0 5 10 15 20 25 30 35 40 45 50

010

110

210

310

410

510

Entries : 20212 Mean : 1.0005 Rms : 0.023322

EcalBarrelHitsoccupancy rates

Have generated one train’s worth of pairs resulting from beam-beam interactions at 500GeV

1325 bunchesRepresent nominal ILC luminosity“high-luminosity” running would be x2Successfully processed ~1000 of these bunches through sidloi3

SiD Ecal Occupancy Study

Norman Graff, SLAC

Probably OK at this luminosity, will need to study Bhabhas

Looks OK for pairs, as expected in barrel region

Not OK

RECENT CHANGES

• Previous modelling did not have sufficient convergence for tracking simulations. It was good for magnet design.

• A totally new ANSYS mesh was completed. Now 17 million nodes

• Recently discovered reason for convergence difficulties.• PackMan has a very low field at the end. Error in BH curve discovered at

50 gauss range. Will be corrected and rerun.

• Will give results to Norm Graff in the tracking region.

SiD Brief Magnet UpdateSLAC

January 14, 2014Wes Craddock

SiD Magnetic Field

B(z)

B(x), B(y)

Bz Through the center horizontal plane of the tracking regions

SiD – Moving Forward The ILC will be a major component of the global HEP program for the next 10-20 years.

SiD is an excellent detector to address the full range of physics for the ILC.

BUT: - much work to be done!

Detector R&D to complete Detector optimization to be carried out Technology choices to be made Site specific issues to settle TDR to writeExpand the SiD Consortium Obtain support on a rising profile at the required level

SiD General Meeting

Agenda

– News from Japan (Harry Weerts)

– ILC Parameters Working Group (Jim Brau)

– Kitakami Site News (Tom Markiewicz)

– Spokepersons’ question time