Shared Investment. Shared Success. - Remap Network€¦ · Shared Investment. Shared Success. ReMAP 2.0 2018 Call for Proposals by Expression of Interest. What’s a BL-NCE? • Refined

Shared Investment.Shared Success.

ReMAP 2.02018 Call for Proposals by Expression of Interest

What’s a BL-NCE?

• Refined Manufacturing Acceleration Process (ReMAP) is an innovation accelerator focused on smart manufacturing, high-reliability electronics and hardware optimization

• ReMAP is made possible through joint funding from the Government of Canada’s Business-Led Networks of Centres of Excellence (BL-NCE) program matched by contributions from our network partners

• The BL-NCE program funds large-scale collaborative research networks that bring a wide range of research expertise to bear on specific challenges identified by an industrial sector

• Led by a not-for-profit consortium of industrial partners, networks enhance private sector innovation by blending academic expertise with the private sector’s drive to respond to real-world challenges

• BL-NCEs increase private sector investments in Canadian research, support training of skilled researchers, and accelerate the transfer of ideas from the laboratory into solutions needed by the private sector

WE ARE IN THE BUSINESS OF TECHNOLOGY

Through shared resources, ReMAP accelerates the commercialization of products developed in Canada for the global market

Product Enablement Value Chain

Accelerating Commercialization

Today’s Trends • Smart Products - electronics in everything• Connectivity everywhere with anything• Ease of use / access• Impact of Disruptive Technologies• Lateral innovation

Industry Challenges• Pressure to innovate and commercialize faster • Monitoring disruptive technologies• Shrinking R&D budgets and product development cycles• Ensuring product reliability and security

ReMAP 2.0• Vision 2024 incorporates a strategy for Canadian start-ups,

scale-ups, and SMEs to navigate the digital economy, accelerate growth, improve ease of doing business and the adoption of smart manufacturing

Current Environment

Industry

Social Innovation

Education & Research

Smart Cities

Government & VC

Leveraging the strengths of an innovation ecosystem

Industry

Social Innovation

Education & Research Smart Cities

Government & VC

Collaborative model toaccelerate commercialization

Product-to-Market Strategy

Financial Security Public Transit ID Computer Security Healthcare Sensor

When failure is not an option

Lateral Innovation

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Product Enablement

Technology is advancing at exponential rates, product development needs to accelerate at the same pace

PRODUCT REALIZATION

Globalization

Partnering with 22 organizations around the world

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Product Enablement Ecosystem

Accelerating Commercialization

ReMAP 2.0

VISION 2024ReMAP will advance Canadian global

leadership in smart manufacturing for a connected world. We define smart

manufacturing as the rapid transfer of science and technology into digital

manufacturing, product design, optimized supply chains, new business

models, globalization and speed-to-market. Electronics will be at the heart

of new digital technologies that will transform how we work, live and play.

MISSIONOur mission is to help Canadian companies compete in the global

market with advanced manufacturing, hardware integration and high-reliability

electronics that will attract foreign investment, enhance a highly skilled &

talented workforce and create economic prosperity. ReMAP will

continue to commercialize Canadian innovations but will also play a

significant role in the expansion of smart manufacturing across Canada.

Smart Manufacturing 

High‐reliability Electronics

Hardware Optimization 

AerospaceDefense

ICTHealthcareIndustrial CleantechAutomotive

Lateral InnovationProduct Enablement

Global Commercialization

Manufacturing Materials

Optics/PhotonicsEnergy/Storage

ReMAP 2.0

Call for Proposals byExpression of Interest

Eligibility CriteriaProjects jointly funded under the ReMAP program must demonstrate the ability to advance innovations in commercial products.

Bring us your new ideas in:• Electronification: New Materials, Photonics, RF, Packaging• Cleantech: Generation, Conversion, Storage• Smart Manufacturing: Industry 4.0, IoT, M2M, Robotics,

Automation Platforms, AI

Project Selection Criteria

Benefit to Canada Impact on Canadian manufacturing and global commercializationWorking Prototype Technology Readiness Level Maturity (TRL) 4+ (minimum)Aligned to ReMAP research themes, feasibility and technical merit Source of Funding Matching cash/in-kind contributions 1:1 per group. The expected amount of funding will be $1-2M over a 5-year period commencing September 2018Project Group Two or more strategic partners per group i.e. research institution, start-up, small-medium enterprise, large multinational, supplier, manufacturer and/or potential user

How to ApplyLetter of Support• To be considered in the first project cohort in the next funding cycle,

applicants will provide a Letter of Support by March 16, 2018. Letters of Support will confirm expression of interest and anticipated support in the form of cash and in-kind contributions

Registration http://remapnetwork.org/call-for-proposals-2/• Register your organization to receive the Letter of Support guidelinesTalk to us about your idea• ReMAP provides support and mentoring to help you understand how

to leverage BL-NCE fundingAdditional Support• In addition to matching funding, you will have access to world-class

project mentoring, global contacts and networking, industry subject matter experts and commercial advisors

Sources of Funding

50% ReMAP 50% Industry Cash/In-Kind Contribution

100% Project Funding

Project Selection

chain

Letters of Support received by March 16th will have first mover-advantage in project selection

Letter of Support 

submitted with BL‐NCE Renewal

Leads complete detailed form stage: Project 

Proposal 

Peer Review Panel Formed

Board Approval Funds Released

AdjudicatedJoint Steering Committee Review 

Projects Recommended by the JSC Presented to the 

Board for consideration 

Project Evaluation

Assessment Criteria 1.Technical Merit2.IP Potential 3.Industry Readiness &

Commercialization Potential4.Market Assessment5.Team Expertise & Project

Management

Evaluation ScoresFundable4.5 – 5.0 Outstanding4.0 – 4.4 Excellent 3.5 – 3.9 Very Good3.0 – 3.4 SolidNot Fundable2.5 – 2.9 Needs Revision2.0 – 2.4 Needs Major Revision1.0 – 1.9 Seriously Flawed.0 Not Acceptable

FAQs

1. How many partners should there be in a project? A minimum of 2 collaborators in project group. Ideal project groups have a

research partner, a development partner, and a commercial partner that will take the product to market.

2. What about IP? Ownership of intellectual property develop in the project remains with the

project group, not ReMAP. Pre-existing IP, licensing and specific issues of ownership are to be negotiated between the project partners and outlined in the signed Project Agreement.

3. What is the project timeline? Selected projects will run up to 5 years, from Fall 2018 through March 2024

4. What is the average project size? Approximately $1-2M over five years ($200k/year)

5. What is the 1:1 funding model? ReMAP grant is equally matched by cash/in-kind contributions

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ReMAP 2.0 Call for Proposals by Expression of Interest

Now

Letter of Support March 16, 2018ReMAP 2.0 Renewal Application April 9, 2018Funding Announcement Summer 2018Full Proposal Invitation Summer-Fall 2018Project Adjudication, Funding and Kick-off Fall 2018

Schedule

Project Portfolio Sample Projects

MaterialsM3 Aging The introduction of environmental legislation such as the European Union’s Restriction of Hazardous Substances (RoHS) directive has led to the use of new tin-based solder alloys in electronics manufacturing. These alloys have shown a susceptibility to solder cracks due to aging. Over time, this may cause catastrophic field failures in high-reliability applications such as aerospace, medical and automotive electronics.

This project focuses on developing new alloys and test methods to increase reliability for applications exposed to various environmental conditions, such as an extended lifespan (20+ years).

Solder Crack Due to Aging, Celestica

High-Reliability Product Enablement

Optics & Photonics03 Monolithically Integrated Laser Materials on Silicon Global mobile internet use is creating a traffic tsunami affecting both mobile and fixed communications networks. Managing exponential internet data growth requires innovative, smaller components with lower power dissipation. One solution is silicon photonics (SiP).

This project focuses on developing a robust and effective process to grow laser sources on a silicon wafer using semiconductor technologies. This will enable higher performance and cost-effective solutions for the next generation of photonic integrated circuits (PICs).

GaAs Quantum Dots (QD), University of Toronto

Miniaturizing Optical Technologies

Optics & Photonics07 Optically Guided Laser Ablation with Integrated Surgical Navigation System Patients undergoing neurosurgery may be at risk for spinal cord injury, repetitive corrective surgery or other complications.

Image-guided surgical procedures using optical technologies combined with traditional medical imaging modalities (CT and MRI) enables new surgical techniques that increase surgeon confidence, reduce operating time and improve patient safety.

This project focuses on the advancement of optical technologies for image-guided surgery. The integrated surgical lighting and 3D imaging system utilizes sensors, machine vision cameras and advanced computational algorithms to allow pinpoint surgical guidance during neurosurgery.

Miniaturizing Optical Technologies

Spinal Surgical Screws

Optics & PhotonicsO8 Indium PhosphideHigh Speed Modulator In response to the increasing demand for bandwidth, telecommunication systems operating at 100 Gb/s are now deployed in long-haul links. In particular, larger bandwidth is achieved by not only using higher data rates but also using increased spectral efficiency. A critical element of these solutions is 100 Gb/s dual polarization IQ modulators.

This project focuses on developing next-generation optical modulators for high-speed optical communication applications using indium phosphide technology. The resulting modulators will provide smaller form factor packages at a lower cost, improving the scalability of 100Gb/s and future 400Gb/s systems.

Miniaturizing Optical Technologies

Optical Modulator

Renewable EnergyS3 Smart Electronics Today’s energy infrastructure is evolving into adaptive, intelligent networks. Powering these networks requires unique smart energy products that can meet industry’s rapidly evolving requirements.

Increasing the deployment of distributed generation systems based on solar photovolatics (PV) is driving demand for reliable, networked power conversion and optimization technologies. Pricing pressures are adding an additional driver for solar installations; impact panel and inverter manufacturers and solar power developers.

This project focuses on developing smart electronics in solar module manufacturing.

Power Optimizer Reference Design, Solantro

Next Generation Solar Solutions