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29 Aug 1997

Service Manual: BSC/RXCDR

68P02901W38-O

GMR-04GMR Page 1

Manual RevisionGMR-0429 Aug 1997

68P02901W38-O

GSM-100-030

Motorola manualaffected

This Manual Revision is applicable only to the manual number and version listed below:

68P02901W38-O Service Manual

Service requests

This revision provides a fix to the following service requests:

N/A

Reason forrevision

This revision provides additional and updated information as follows:

Category 333, Chapter 2. Sections added for DSW2, GDP2 and DSWX modules.

Various categories. Detailed comments are added as necessary to indicaterequirements and constraints when using AMR hardware retrospectively in BSSC2cabinets.

Action

Remove and replace pages in the Manual as follows:

Remove Insert

All pages between the clear acetatefront sheet and the blank backingsheet, remove from binder.

All pages of the GMR between thefront sheet and the blank backingsheet, insert into binder.

Destroy all obsolete pages. Do not destroy this page.

Insert this Manual Revision sheet in the front of the manual for future reference.

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Cellular Infrastructure Group

SERVICE MANUALBSC/RXCDR

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29 Aug 1997


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Service ManualBSC/RXCDR

E Motorola 1993–2003All Rights ReservedPrinted in the U.K.

GSM-100-030

29 Aug 1997ii


GMR-0468P02901W38-O

Copyrights, notices and trademarks

CopyrightsThe Motorola products described in this document may include copyrighted Motorola computerprograms stored in semiconductor memories or other media. Laws in the United States and othercountries preserve for Motorola certain exclusive rights for copyright computer programs, including theexclusive right to copy or reproduce in any form the copyright computer program. Accordingly, anycopyright Motorola computer programs contained in the Motorola products described in this documentmay not be copied or reproduced in any manner without the express written permission of Motorola.Furthermore, the purchase of Motorola products shall not be deemed to grant either directly or byimplication, estoppel or otherwise, any license under the copyrights, patents or patent applications ofMotorola, except for the rights that arise by operation of law in the sale of a product.

RestrictionsThe software described in this document is the property of Motorola. It is furnished under a licenseagreement and may be used and/or disclosed only in accordance with the terms of the agreement.Software and documentation are copyright materials. Making unauthorized copies is prohibited bylaw. No part of the software or documentation may be reproduced, transmitted, transcribed, storedin a retrieval system, or translated into any language or computer language, in any form or by anymeans, without prior written permission of Motorola.

AccuracyWhile reasonable efforts have been made to assure the accuracy of this document, Motorolaassumes no liability resulting from any inaccuracies or omissions in this document, or from the useof the information obtained herein. Motorola reserves the right to make changes to any productsdescribed herein to improve reliability, function, or design, and reserves the right to revise thisdocument and to make changes from time to time in content hereof with no obligation to notify anyperson of revisions or changes. Motorola does not assume any liability arising out of the applicationor use of any product or circuit described herein; neither does it convey license under its patentrights of others.

Trademarks

and MOTOROLA are registered trademarks of Motorola Inc. M-Cell and Taskfinder are trademarks of Motorola Inc.All other brands and corporate names are trademarks of their respective owners.

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Issue status of this manual 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

General information 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

First aid in case of electric shock 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Reporting safety issues 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Warnings and cautions 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

General warnings 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Human exposure to radio frequency energy (PCS1900 only) 9 . . . . . . . . . . . . . . . . . . . . . .

Beryllium health and safety precautions 12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

General cautions 14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Devices sensitive to static 15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Motorola GSM manual set 16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GMR amendment 19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GMR amendment record 20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Category 131System Information i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 1Introduction i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cabinet types 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BSSC cabinet configuration 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Configuration options 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Location 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Equipment 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Cabinet description external 1–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External view 1–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Dimensions 1–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External features 1–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Cabinet description internal 1–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal view 1–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal units 1–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 2Specification i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Specification 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Overview 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Environment 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Dimensions 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Weights 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power consumption 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power requirements 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Positive earth BSSC cabinets 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Negative earth BSSC cabinets 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Back-up power 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overcurrent protection 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Category 333Technical Description i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 1General Information i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


BSSC2 cabinet configuration 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Configuration options 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Location 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Equipment 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Cabinet description external 1–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External view 1–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External features 1–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Base station unit shelf assembly 1–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSC numbering 1–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSU shelf 1–9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Shelf module fit 1–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ventilation 1–12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Backplane connectors 1–12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Remote transcoder unit shelf assembly 1–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RXU numbering 1–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RXU shelf 1–14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Shelf module fit 1–15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ventilation 1–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Backplane connectors 1–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power distribution unit components 1–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input power 1–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Circuit breakers 1–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fan cooling system 1–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Location 1–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 1–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Interconnect panel 1–20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Panel layout 1–20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connectors 1–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BSSC Cabinet labels 1–22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSSC labels 1–22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Key to BSSC labels 1–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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BSSC2 Cabinet labels 1–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Labelling diagrams 1–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Labelling tables 1–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BSSC2 cabinet cabling 1–27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diagram 1 1–28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diagram 2 1–29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diagram 3 1–30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diagram 4 1–31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BSSC differences 1–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Types of PDU 1–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PDB 1–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AIB 1–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PAB 1–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Circuit breakers 1–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BSSC cabinet cabling (PAB) 1–33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diagram 1 1–34 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diagram 2 1–35 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BSSC cabinet cabling (PDB/AIB) 1–36 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–36 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diagram 1 1–37 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 2Digital modules i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . In this chapter 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BSU and RXU shelf diagrams 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSU shelf 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RXU shelf 2–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Module front panels 2–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Full-size modules 2–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The modules 2–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BTC 2–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BTC module 2–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DSW2 2–9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timeslot interchange 2–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Local highway 2–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Remote TDM highway 2–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Expansion TDM highways 2–12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Three party conference 2–14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self-diagnostics 2–14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Serial interface 2–15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Slot position 2–15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-030

29 Aug 1997vi


GMR-0468P02901W38-O

GCLK 2–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GCLK module 2–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Brief description 2–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reference oscillator 2–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reference dividers 2–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reference encoders 2–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reference fail detect 2–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock control/alarm logic 2–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Buffered test ports 2–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GCLK diagram 2–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GDP2 2–20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GDP2 module 2–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Brief description 2–22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Architecture 2–22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MCU subsystem 2–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP subsystem 2–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Multiplexer 2–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E1 Line interface 2–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CRC-4 Error checking 2–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digital crosspoint switch 2–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MCAP interface 2–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TDM interface 2–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GDP2 diagram 2–25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GPROC 2–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Communication 2–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GPROC module 2–27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Brief description 2–27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory 2–27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Troubleshooting and diagnostics 2–27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Software 2–28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BTS and BSC GPROC functions 2–28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RXCDR GPROC functions 2–29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flash EPROM daughter card 2–30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GPROC diagram 2–31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GPROC2 2–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Brief description 2–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GPROC2 module 2–33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Communication 2–33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory 2–33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Troubleshooting and diagnostics 2–34 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Software 2–34 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSC GPROC2 functions 2–34 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RXCDR GPROC2 functions 2–35 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GPROC2 diagram 2–36 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-030

29 Aug 1997


68P02901W38-O

GMR-04vii

KSW 2–37 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–37 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–37 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . KSW module 2–37 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Architecture 2–38 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timing reference 2–38 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Switchbound TDM interface structure 2–38 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Expansion switchbound highways 2–39 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timeslot interchange (TSI) 2–39 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connection RAM control 2–39 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Three-party conference (TPC) memory 2–40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fixed/dynamic pattern registers 2–40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Outbound selection MUX 2–40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Highway monitor 2–40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Watchdog timer 2–40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt logic 2–41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Serial interface logic 2–41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . KSW switching 2–41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . KSW in a BSC 2–41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . KSW in a RXCDR 2–41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . KSW diagram 2–42 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interconnected KSWs 2–43 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MSI 2–44 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–44 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–44 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MSI module 2–45 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General features 2–45 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Transcoded environment 2–46 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional description 2–46 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MSI diagram 2–48 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MSI-2 2–49 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–49 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–49 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MSI-2 module 2–50 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General features 2–50 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Transcoded environment (E1) 2–51 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Transcoded environment (T1/JT1) 2–51 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional description 2–51 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MSI-2 diagram 2–54 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

XCDR 2–55 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–55 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–55 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . XCDR module 2–56 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Brief description 2–56 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Architecture 2–56 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Processor 2–57 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP 2–57 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Subrate multiplexer modes 2–57 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Line interface 2–58 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Switching 2–58 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MCAP interface 2–58 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TDM interface 2–58 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . XCDR diagram 2–59 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-030

29 Aug 1997viii


GMR-0468P02901W38-O

GDP 2–60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–61 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GDP module 2–61 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Brief description 2–61 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Architecture 2–62 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MCU subsystem 2–62 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP subsystem 2–62 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Subrate multiplexer modes 2–62 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E1/T1 Line interface 2–63 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CRC-4 Error checking 2–63 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digital crosspoint switch 2–64 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MCAP interface 2–64 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TDM interface 2–64 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GDP diagram 2–65 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NVM board description 2–66 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose of the NVM board 2–66 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mechanical design 2–66 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional description 2–67 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrogating the NVM board 2–67 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Half-size modules 2–68 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–68 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The modules 2–68 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BBBX 2–69 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–69 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–69 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BBBX module 2–69 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BBBX diagram 2–70 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CLKX 2–71 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–71 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–71 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GCLK module 2–71 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CLKX diagram 2–72 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DSWX 2–73 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–73 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–73 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSWX module 2–74 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Brief description 2–74 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSWX Block diagram 2–76 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

KSWX 2–77 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–77 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–77 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . KSWX module 2–78 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Brief description 2–78 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . KSWX diagram 2–79 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-030

29 Aug 1997


68P02901W38-O

GMR-04ix

LANX 2–80 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–80 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–80 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LANX module 2–81 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Brief description 2–81 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Local LAN data switching 2–81 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Extended LAN data switching 2–82 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bus arbiter 2–83 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Redundant LAN 2–83 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Shelf ID 2–83 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Front panel 2–83 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LANX diagram 2–84 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PIX 2–85 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 2–85 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 2–85 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PIX module 2–85 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PIX diagram 2–86 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 3Power, fans and interconnections i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Power supply modules 3–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 3–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cabinet power requirements 3–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DPSM 3–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 3–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DPSM view 3–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional description 3–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DPSM diagram 3–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

EPSM 3–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 3–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EPSM view 3–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional description 3–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EPSM diagram 3–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

IPSM 3–9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 3–9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IPSM view 3–9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional description 3–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IPSM diagram 3–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PDU 3–12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 3–12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input power 3–12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DAB 3–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 3–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Requirements 3–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DAB diagram 3–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fuses and LEDs (BSSC2) 3–14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Switch settings (BSSC2) 3–15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Alarm functions 3–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Visual warnings 3–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Communications 3–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-030

29 Aug 1997x


GMR-0468P02901W38-O

PAB 3–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 3–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diagram 3–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSSC cabinet 3–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fuses and LEDs (BSSC) 3–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Jumpers 3–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Alarm functions 3–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Visual warnings 3–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input signals 3–20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Serial bus 3–20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reset 3–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timing 3–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSSC status inputs 3–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Signal routeing 3–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Signal timing 3–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PDB and AIB 3–22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 3–22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AIB description 3–22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AIB view 3–22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PDB description 3–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PDB diagram 3–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Circuit breakers 3–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 3–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSSC with PAB 3–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSSC with PDB/AIB 3–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSSC2 3–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fan cooling system 3–25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 3–25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power 3–25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Interconnect panel 3–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Location 3–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 3–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSSC 3–27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSSC2 3–28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Type 43 interconnect board 3–29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Location 3–29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 3–29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T43 diagram 3–29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T43 connectors 3–30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Balanced line interconnect board 3–31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Location 3–31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 3–31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BIB diagram 3–31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BIB connectors 3–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Category 433Installation and Configuration i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 1Site preparation i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Torque values 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . In this chapter 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-030

29 Aug 1997


68P02901W38-O

GMR-04xi

Tool kits for installing GSM cellular equipment 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tool kit one 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tool kit two 1–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Site requirements and considerations 1–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Structural requirements 1–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cabinet dimensions 1–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating environment 1–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage environment 1–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diagram 1–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power requirements 1–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Positive earth BSSC cabinets 1–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Negative earth BSSC cabinets 1–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Back up power 1–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overcurrent protection 1–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Handling optical fibres 1–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Protection of fibres and connectors 1–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cleaning of fibres and connectors 1–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fibre connection 1–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Minimum bend radius 1–9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Visiting the site 1–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Before the visit 1–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Arriving at the site 1–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Leaving the site 1–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Rubbish 1–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Rural sites 1–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Safety on site 1–12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 2Installing the equipment i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Overview 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . In this chapter 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Before starting 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cabinet types 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Delivery 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packaging 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lifting cabinets 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Site earthing 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Transient/ lightning protection 2–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Torque values 2–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Optical fibres 2–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Unpacking the equipment 2–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 2–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Shipping crate 2–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-030

29 Aug 1997xii


GMR-0468P02901W38-O

Anchoring the cabinet 2–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 2–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Installing the cabinet air deflector 2–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSSC2 2–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSSC 2–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diagram 2–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Preparing to connect dc power and earth cables 2–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PAB 2–9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DAB 2–9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSSC2 interconnect panel 2–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Negative earth BSSC interconnect panel 2–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Positive earth BSSC interconnect panel 2–12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connecting dc power cables between cabinets and external equipment 2–13 . . . . . . . . . . . . Introduction 2–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 2–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connecting dc input power and earth cables to the cabinet 2–14 . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power and earth cables 2–14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power cables for –ve earth cabinets 2–15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power cables for +ve earth cabinets 2–15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connecting dc input power and earth cables to the main power source 2–16 . . . . . . . . . . . . . Safety 2–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 2–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Installing power supply modules 2–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 2–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Installing digital modules 2–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Factory installation 2–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Installing BBBX modules 2–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 2–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSU shelf 2–20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . RXU shelf 2–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Installing the NVM board 2–22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Installation options 2–22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Installing the NVM board in a BSC 2–22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Installing the NVM board in an RXCDR 2–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NVM board installation procedure 2–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Installing the control signal cabling 2–25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Inter-cabinet fibre optic connections 2–25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E1/T1 line connections 2–25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . End user I/O device cabling 2–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PIX connector 2–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PIX connector details 2–27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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29 Aug 1997


68P02901W38-O

GMR-04xiii

T43 to backplane connections 2–28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS0 to BSU 2–28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS1 to BSU 2–29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS2 to BSU 2–29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS3 to BSU 2–30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS0 to RXU 2–30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS1 to RXU 2–31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS2 to RXU 2–31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS3 to RXU 2–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BIB to backplane connections 2–33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS0 to BSU 2–34 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS1 to BSU 2–35 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS2 to BSU 2–36 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS3 to BSU 2–37 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS0 to RXU 2–38 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS1 to RXU 2–39 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS2 to RXU 2–40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MS3 to RXU 2–41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 3Decommissioning the equipment i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisite 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lifting cabinets 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Decommissioning a BSSC cabinet 3–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 3–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Before starting 3–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 3–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BSSC checklist 3–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Category 533Maintenance Information i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 1Introduction i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Overview 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audience 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose of the manual 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisites 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Structure 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Related documentation 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 2General procedures i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General procedures 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Test and Repair equipment lists 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Repair equipment list 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Test equipment list 2–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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General repair procedures 2–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 2–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Site configuration 2–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Man machine interface (MMI) 2–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Definition 2–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MMI uses 2–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Locating faulty cabinets 2–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 2–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisites 2–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 2–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connecting a local maintenance terminal (LMT) 2–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 2–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Required tools and equipment 2–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisites 2–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connecting the LMT to a GPROC 2–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Setting up the MMI 2–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Changing the security level 2–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Identifying the faulty devices 2–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisites 2–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Equipment safety 2–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Checking the alarm status 2–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Resetting and re–initializing a site 2–15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 2–15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 2–15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 3Maintenance Procedures i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Maintenance procedures 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisites 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Air filter replacement 3–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 3–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacement procedure 3–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Air filter cleaning 3–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Cleaning cabinet air filters 3–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 3–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tools and equipment 3–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cleaning cabinet air filters 3–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Performing a physical inspection 3–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General information 3–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Safety 3–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cable tray 3–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power System 3–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cabling 3–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Grounding 3–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Annual physical inspection checklist 3–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose of the annual physical inspection 3–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Using the checklist 3–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 4Replacement procedures i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacement procedures 4–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Purpose 4–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Description 4–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Chapter structure 4–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-030

29 Aug 1997


68P02901W38-O

GMR-04xv

Air filter replacement 4–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 4–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tools and equipment 4–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing the air filter 4–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Interface board replacement 4–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 4–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustrations 4–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing an interface board 4–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Redundant clock extender (CLKX) module replacement 4–5 . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration 4–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing CLKXA 4–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing CLKXB 4–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Non-redundant CLKX replacement 4–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration 4–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing the CLKX 4–7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Replacing a fan unit 4–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Removing the fan 4–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Installing the fan 4–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Redundant GCLK module replacement 4–9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration 4–9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing a redundant GCLK 4–9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Non-redundant GCLK replacement 4–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisite 4–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration 4–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Conditions 4–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing a single shelf configuration GCLK 4–12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing a multi-shelf configuration GCLK 4–12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Calibrating the GCLK 4–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 4–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Test equipment 4–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Commands 4–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Process 4–14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GCLK calibration record form 4–15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GPROC/GPROC2 replacement 4–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Redundant GPROC considerations 4–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Non–redundant GPROC considerations 4–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Before going to the site 4–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Locating the faulty GPROC 4–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Removing the GPROC 4–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Installing the GPROC 4–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration 4–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Redundant KSW/DSW2 replacement 4–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisites 4–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration 4–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 4–20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-030

29 Aug 1997xvi


GMR-0468P02901W38-O

Non-redundant KSW module replacement 4–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisites 4–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration 4–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 4–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Redundant KSWX module replacement 4–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration 4–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LED indications 4–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing KSWX A and B 4–25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Non-redundant KSWX module replacement 4–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration and indications 4–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 4–26 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Redundant LANX replacement 4–27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisites 4–27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing the LANX associated with the active LAN 4–27 . . . . . . . . . . . . . . . . . . . . . . . Replacing the LANX associated with the standby LAN 4–28 . . . . . . . . . . . . . . . . . . . . .

Non-redundant LANX replacement 4–29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 4–29 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MSI and MSI-2 replacement 4–30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Non-redundant systems 4–30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Redundant systems 4–30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration 4–30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 4–31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

XCDR replacement 4–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Non-redundant Systems 4–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Redundant Systems 4–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration 4–32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 4–33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GDP/GDP2 replacement 4–34 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–34 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Non-redundant Systems 4–34 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Redundant Systems 4–34 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration 4–35 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 4–35 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NVM replacement 4–37 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–37 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diagnosing faults on the NVM board 4–37 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing the NVM board 4–37 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Front panel controls and indicators 4–38 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PIX replacement 4–39 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–39 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration 4–39 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing the PIX 4–39 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-030

29 Aug 1997


68P02901W38-O

GMR-04xvii

Power supply module replacement 4–40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 4–40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications 4–40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Illustration 4–40 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing a non-redundant power supply module 4–41 . . . . . . . . . . . . . . . . . . . . . . . . . . Replacing a redundant power supply module 4–41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 5Miscellaneous repair i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Miscellaneous repair procedures 5–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 5–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Obtaining replacement authorization 5–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Removing and replacing a circuit breaker 5–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 5–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indications 5–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Removing a circuit breaker 5–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Installing a circuit breaker 5–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Replacing a bus terminator card (BTC) 5–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 5–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Obtaining replacement authorization 5–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Non-redundant KSWs 5–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Conditions 5–4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 1 5–5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 2 5–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 3 5–6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 4 5–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Redundant KSWs 5–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 5 5–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Replacing the alarm board (DAB/PAB) 5–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 5–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Background 5–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Precautions 5–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Removing the board 5–11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Installing a new board 5–12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Replacement of PDB and AIB boards 5–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 5–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Background 5–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Precautions 5–13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PDB removal 5–14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PDB installation 5–15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AIB removal 5–15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AIB installation 5–16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Replacing the BSU digital cage 5–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 5–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisites 5–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tools and equipment 5–17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Obtaining replacement authorization 5–18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Removing the cage 5–19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Installing the cage 5–21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fan replacement procedure 5–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 5–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tools and equipment 5–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 1 5–23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Procedure 2 5–24 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Index I–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-030 Issue status of this manual

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GMR-041

Issue status of this manual

Introduction

The following shows the issue status of this manual since it was first released.

Versioninformation

The following lists the versions of this manual in order of manual issue:

Manualissue

Date of issue Remarks

O 29 Aug 1997 Original issue

Resolution ofService Requests

The following Service Requests are now resolved in this manual:

ServiceRequest

GMRNumber

Remarks

N/A

GSM-100-030General information

29 Aug 19972


GMR-0468P02901W38-O

General information

Important notice

If this manual was obtained when you attended a Motorola training course, it will not beupdated or amended by Motorola. It is intended for TRAINING PURPOSES ONLY. If itwas supplied under normal operational circumstances, to support a major softwarerelease, then corrections will be supplied automatically by Motorola in the form ofGeneral Manual Revisions (GMRs).

Purpose

Motorola Global System for Mobile Communications (GSM) manuals are intended toinstruct and assist personnel in the operation, installation and maintenance of theMotorola GSM equipment and ancillary devices. It is recommended that all personnelengaged in such activities be properly trained by Motorola.

Failure to comply with Motorola’s operation, installation and maintenanceinstructions may, in exceptional circumstances, lead to serious injury or death.

WARNING

These manuals are not intended to replace the system and equipment training offered byMotorola, although they can be used to supplement and enhance the knowledge gainedthrough such training.

About thismanual

The manual contains information about the base station system control (BSSC) cabinetand remote transcoder (RXCDR). This issue includes details of hardware modulesintroduced for use in the later BSC2/RXCDR2 cabinet, but which may also be used in theBSSC/RXCDR cabinet.

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GMR-043

Cross references

Throughout this manual, cross references are made to the chapter numbers and sectionnames. The section name cross references are printed bold in text.

This manual is divided into uniquely identified and numbered chapters that, in turn, aredivided into sections. Sections are not numbered, but are individually named at the top ofeach page, and are listed in the table of contents.

Text conventions

The following conventions are used in the Motorola GSM manuals to represent keyboardinput text, screen output text and special key sequences.

Input

Characters typed in at the keyboard are shown like this.

Output

Messages, prompts, file listings, directories, utilities, and environmentalvariables that appear on the screen are shown like this.

Special key sequences

Special key sequences are represented as follows:

CTRL–c Press the Control and c keys at the same time.

ALT–f Press the Alt and f keys at the same time.

| Press the pipe symbol key.

CR or RETURN Press the Return (Enter) key. The Return key is identi-fied with the ↵ symbol on both the X terminal and theSPARCstation keyboards. The SPARCstation keyboardReturn key is also identified with the word Return.

GSM-100-030First aid in case of electric shock

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GMR-0468P02901W38-O

First aid in case of electric shock

Warning

Do not touch the victim with your bare hands until the electric circuit isbroken.Switch off. If this is not possible, protect yourself with dry insulatingmaterial and pull or push the victim clear of the conductor.

WARNING

Artificialrespiration

In the event of an electric shock it may be necessary to carry out artificial respiration.Send for medical assistance immediately.

Burns treatment

If the patient is also suffering from burns, then, without hindrance to artificial respiration,carry out the following:

1. Do not attempt to remove clothing adhering to the burn.

2. If help is available, or as soon as artificial respiration is no longer required, coverthe wound with a dry dressing.

3. Do not apply oil or grease in any form.

GSM-100-030 Reporting safety issues

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Reporting safety issues

Introduction

Whenever a safety issue arises, carry out the following procedure in all instances.Ensure that all site personnel are familiar with this procedure.

Procedure

Whenever a safety issue arises:

1. Make the equipment concerned safe, for example, by removing power.

2. Make no further attempt to tamper with the equipment.

3. Report the problem directly to GSM Customer Network Resolution Centre+44 (0)1793 565444 (telephone) and follow up with a written report by fax+44 (0)1793 430987 (fax).

4. Collect evidence from the equipment under the guidance of the Customer NetworkResolution Centre.

GSM-100-030Warnings and cautions

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GMR-0468P02901W38-O

Warnings and cautions

Introduction

The following describes how warnings and cautions are used in this manual and in allmanuals of the Motorola GSM manual set.

Warnings

Definition

A warning is used to alert the reader to possible hazards that could cause loss of life,physical injury, or ill health. This includes hazards introduced during maintenance, forexample, the use of adhesives and solvents, as well as those inherent in the equipment.

Example and format

Do not look directly into fibre optic cables or optical data in/out connectors.Laser radiation can come from either the data in/out connectors orunterminated fibre optic cables connected to data in/out connectors.

WARNING

Cautions

Definition

A caution means that there is a possibility of damage to systems, or individual items ofequipment within a system. However, this presents no danger to personnel.

Example and format

Do not use test equipment that is beyond its calibration due date when testingMotorola base stations.

CAUTION

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General warnings

Introduction

Observe the following warnings during all phases of operation, installation andmaintenance of the equipment described in the Motorola GSM manuals. Failure tocomply with these warnings, or with specific warnings elsewhere in the Motorola GSMmanuals, violates safety standards of design, manufacture and intended use of theequipment. Motorola assumes no liability for the customer’s failure to comply with theserequirements.

Warning labelsPersonnel working with or operating Motorola equipment must comply with any warninglabels fitted to the equipment. Warning labels must not be removed, painted over orobscured in any way.

Specificwarnings

Warnings particularly applicable to the equipment are positioned on the equipment andwithin the text of this manual. These must be observed by all personnel at all times whenworking with the equipment, as must any other warnings given in text, on the illustrationsand on the equipment.

High voltageCertain Motorola equipment operates from a dangerous high voltage of 230 V ac singlephase or 415 V ac three phase supply which is potentially lethal. Therefore, the areaswhere the ac supply power is present must not be approached until the warnings andcautions in the text and on the equipment have been complied with.

To achieve isolation of the equipment from the ac supply, the ac input isolator must beset to off and locked.

Within the United Kingdom (UK) regard must be paid to the requirements of theElectricity at Work Regulations 1989. There may also be specific country legislationwhich need to be complied with, depending on where the equipment is used.

RF radiationHigh RF potentials and electromagnetic fields are present in the base station equipmentwhen in operation. Ensure that all transmitters are switched off when any antennaconnections have to be changed. Do not key transmitters connected to unterminatedcavities or feeders.

Refer to the following standards:

S ANSI IEEE C95.1-1991, IEEE Standard for Safety Levels with Respect to HumanExposure to Radio Frequency Electromagnetic Fields, 3kHz to 300GHz.

S CENELEC 95 ENV 50166-2, Human Exposure to Electromagnetic Fields HighFrequency (10kHz to 300GHz).

Laser radiationDo not look directly into fibre optic cables or optical data in/out connectors. Laserradiation can come from either the data in/out connectors or unterminated fibre opticcables connected to data in/out connectors.

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Liftingequipment

When dismantling heavy assemblies, or removing or replacing equipment, the competentresponsible person must ensure that adequate lifting facilities are available. Whereprovided, lifting frames must be used for these operations. When equipments have to bemanhandled, reference must be made to the Manual Handling of Loads Regulations1992 (UK) or to the relevant manual handling of loads legislation for the country in whichthe equipment is used.

Do not ...... substitute parts or modify equipment.

Because of the danger of introducing additional hazards, do not install substitute parts orperform any unauthorized modification of equipment. Contact Motorola if in doubt toensure that safety features are maintained.

Battery supplies

Do not wear earth straps when working with standby battery supplies.

Toxic material

Certain Motorola equipment incorporates components containing the highly toxic materialBeryllium or its oxide Beryllia or both. These materials are especially hazardous if:

S Beryllium materials are absorbed into the body tissues through the skin, mouth, ora wound.

S The dust created by breakage of Beryllia is inhaled.

S Toxic fumes are inhaled from Beryllium or Beryllia involved in a fire.

See the Beryllium health and safety precautions section for further information.

GSM-100-030 Human exposure to radio frequency energy (PCS1900 only)

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GMR-049

Human exposure to radio frequency energy (PCS1900 only)

IntroductionThis equipment is designed to generate and radiate radio frequency (RF) energy. Itshould be installed and maintained only by trained technicians. Licensees of the FederalCommunications Commission (FCC) using this equipment are responsible for insuringthat its installation and operation comply with FCC regulations designed to limit humanexposure to RF radiation in accordance with the American National Standards InstituteIEEE Standard C95.1-1991, IEEE Standard for Safety Levels with Respect to HumanExposure to Radio Frequency Electromagnetic Fields, 3kHz to 300GHz.

DefinitionsThis standard establishes two sets of maximum permitted exposure limits, one forcontrolled environments and another, that allows less exposure, for uncontrolledenvironments. These terms are defined by the standard, as follows:

Uncontrolled environment

Uncontrolled environments are locations where there is the exposure of individuals whohave no knowledge or control of their exposure. The exposures may occur in livingquarters or workplaces where there are no expectations that the exposure levels mayexceed those shown for uncontrolled environments in the table of maximum permittedexposure ceilings.

Controlled environmentControlled environments are locations where there is exposure that may be incurred bypersons who are aware of the potential for exposure as a concomitant of employment, byother cognizant persons, or as the incidental result of transient passage through areaswhere analysis shows the exposure levels may be above those shown for uncontrolledenvironments but do not exceed the values shown for controlled environments in thetable of maximum permitted exposure ceilings.

Maximumpermittedexposures

The maximum permitted exposures prescribed by the standard are set in terms ofdifferent parameters of effects, depending on the frequency generated by the equipmentin question. At the frequency range of this Personal Communication System equipment,1930-1970MHz, the maximum permitted exposure levels are set in terms of powerdensity, whose definition and relationship to electric field and magnetic field strengths aredescribed by the standard as follows:

Power density (S)

Power per unit area normal to the direction of propagation, usually expressed in units ofwatts per square metre (W/m2) or, for convenience, units such as milliwatts per squarecentimetre (mW/cm2). For plane waves, power density, electric field strength (E) andmagnetic field strength (H) are related by the impedance of free space, 377 ohms. Inparticular,

S � E2

377� 377� H2

where E and H are expressed in units of V/m and A/m, respectively, and S in units ofW/m2. Although many survey instruments indicate power density units, the actualquantities measured are E or E2 or H or H2.

GSM-100-030Human exposure to radio frequency energy (PCS1900 only)

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GMR-0468P02901W38-O

Maximumpermittedexposureceilings

Within the frequency range, the maximum permitted exposure ceiling for uncontrolledenvironments is a power density (mW/cm2) that equals f/1500, where f is the frequencyexpressed in MHz, and measurements are averaged over a period of 30 minutes. Themaximum permitted exposure ceiling for controlled environments, also expressed inmW/cm2, is f/300 where measurements are averaged over 6 minutes. Applying theseprinciples to the minimum and maximum frequencies for which this equipment is intendedto be used yields the following maximum permitted exposure levels:

Uncontrolled Environment Controlled Environment

1930MHz 1970MHz 1930MHz 1970MHz

Ceiling 1.287mW/cm2 1.313mW/cm2 6.433mW/cm2 6.567mW/cm2

If you plan to operate the equipment at more than one frequency, compliance should beassured at the frequency which produces the lowest exposure ceiling (among thefrequencies at which operation will occur).

Licensees must be able to certify to the FCC that their facilities meet the above ceilings.Some lower power PCS devices, 100 milliwatts or less, are excluded from demonstratingcompliance, but this equipment operates at power levels orders of magnitude higher, andthe exclusion is not applicable.

Whether a given installation meets the maximum permitted exposure ceilings depends, inpart, upon antenna type, antenna placement and the output power to which thisequipment is adjusted. The following example sets forth the distances from the antennato which access should be prevented in order to comply with the uncontrolled andcontrolled environment exposure limits as set forth in the ANSI IEEE standards andcomputed above.

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Examplecalculation

For a base station with the following characteristics, what is the minimum distance fromthe antenna necessary to meet the requirements of an uncontrolled environment?

Transmit frequency: 1930 MHz

Base station cabinet output power, P: +39.0 dBm (8 watts)

Antenna feeder cable loss, CL: 2.0 dB

Antenna input power Pin: P–CL = +39.0–2.0 = +37.0 dB (5watts)

Antenna gain, G: 16.4 dBi (43.65)

Using the following relationship:

G � 4pr2WPin

Where W is the maximum permissible power density in W/m2 and r is the safe distancefrom the antenna in metres, the desired distance can be calculated as follows:

r � GPin4pW

� � 43.65� 54p� 12.87

� � 1.16m

where W = 12.87 W/m2 was obtained from table listed above and converting frommW/cm2 to W/m2.

The above result applies only in the direction of maximum radiation of theantenna. Actual installations may employ antennas that have defined radiationpatterns and gains that differ from the example set forth above. The distancescalculated can vary depending on the actual antenna pattern and gain.

NOTE

Power densitymeasurements

While installation calculations such as the above are useful and essential in planning anddesign, validation that the operating facility using this equipment actually complies willrequire making power density measurements. For information on measuring RF fields fordetermining compliance with ANSI IEEE C95.1-1991, see IEEE Recommended Practicefor the Measure of Potentially Hazardous Electromagnetic Fields - RF and Microwave,IEEE Std C95.3-1991. Copies of IEEE C95.1-1991 and IEEE C95.3-1991 may bepurchased from the Institute of Electrical and Electronics Engineers, Inc., Attn:Publication Sales, 445 Hoes Lane, P.O. Box 1331, Piscattaway, NJ 08855-1331,(800) 678-IEEE or from ANSI, (212) 642-4900. Persons responsible for installation of thisequipment are urged to consult these standards in determining whether a giveninstallation complies with the applicable limits.

Other equipmentWhether a given installation meets ANSI standards for human exposure to radiofrequency radiation may depend not only on this equipment but also on whether theenvironments being assessed are being affected by radio frequency fields from otherequipment, the effects of which may add to the level of exposure. Accordingly, the overallexposure may be affected by radio frequency generating facilities that exist at the timethe licensee’s equipment is being installed or even by equipment installed later.Therefore, the effects of any such facilities must be considered in site selection and indetermining whether a particular installation meets the FCC requirements.

GSM-100-030Beryllium health and safety precautions

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GMR-0468P02901W38-O

Beryllium health and safety precautions

Introduction

Beryllium (Be), is a hard silver/white metal. It is stable in air, but burns brilliantly inOxygen.

With the exception of the naturally occurring Beryl ore (Beryllium Silicate), all Berylliumcompounds and Beryllium metal are potentially highly toxic.

Health issues

Beryllium Oxide is used within some components as an electrical insulator. Captive withinthe component it presents no health risk whatsoever. However, if the component shouldbe broken open and the Beryllium Oxide, which is in the form of dust, released, thereexists the potential for harm.

Inhalation

Inhalation of Beryllium Oxide can lead to a condition known as Berylliosis, the symptomsof Berylliosis are similar to Pneumonia and may be identified by all or any of thefollowing:

Mild poisoning causes fever, shortness of breath, and a cough that producesyellow/green sputum, or occasionally bloodstained sputum. Inflammation of the mucousmembranes of the nose, throat, and chest with discomfort, possibly pain, and difficultywith swallowing and breathing.

Severe poisoning causes chest pain and wheezing which may progress to severeshortness of breath due to congestion of the lungs. Incubation period for lung symptomsis 2-20 days.

Exposure to moderately high concentrations of Beryllium in air may produce a veryserious condition of the lungs. The injured person may become blue, feverish with rapidbreathing and raised pulse rate. Recovery is usual but may take several months. Therehave been deaths in the acute stage.

Chronic response. This condition is more truly a general one although the lungs aremainly affected. There may be lesions in the kidneys and the skin. Certain featuressupport the view that the condition is allergic. There is no relationship between thedegree of exposure and the severity of response and there is usually a time lag of up to10 years between exposure and the onset of the illness. Both sexes are equallysusceptible. The onset of the illness is insidious but only a small number of exposedpersons develop this reaction.

First aid

Seek immediate medical assistance. The casualty should be removed immediately fromthe exposure area and placed in a fresh air environment with breathing supported withOxygen where required. Any contaminated clothing should be removed. The casualtyshould be kept warm and at rest until medical aid arrives.

GSM-100-030 Beryllium health and safety precautions

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Skin contact

Possible irritation and redness at the contact area. Persistent itching and blisterformations can occur which usually resolve on removal from exposure.

First aid

Wash area thoroughly with soap and water. If skin is broken seek immediate medicalassistance.

Eye contact

May cause severe irritation, redness and swelling of eyelid(s) and inflammation of themucous membranes of the eyes.

First aid

Flush eyes with running water for at least 15 minutes. Seek medical assistance as soonas possible.

Handlingprocedures

Removal of components from printed circuit boards (PCBs) is to take place only atMotorola approved repair centres.

The removal station will be equipped with extraction equipment and all other protectiveequipment necessary for the safe removal of components containing Beryllium Oxide.

If during removal a component is accidently opened, the Beryllium Oxide dust is to bewetted into a paste and put into a container with a spatula or similar tool. The spatula/toolused to collect the paste is also to be placed in the container. The container is then to besealed and labelled. A suitable respirator is to be worn at all times during this operation.

Components which are successfully removed are to be placed in a separate bag, sealedand labelled.

Disposalmethods

Beryllium Oxide or components containing Beryllium Oxide are to be treated ashazardous waste. All components must be removed where possible from boards and putinto sealed bags labelled Beryllium Oxide components. These bags must be given to thesafety and environmental adviser for disposal.

Under no circumstances are boards or components containing Beryllium Oxide to be putinto the general waste skips or incinerated.

Product life cycleimplications

Motorola GSM and analogue equipment includes components containing Beryllium Oxide(identified in text as appropriate and indicated by warning labels on the equipment).These components require specific disposal measures as indicated in the preceding(Disposal methods) paragraph. Motorola will arrange for the disposal of all suchhazardous waste as part of its Total Customer Satisfaction philosophy and will arrangefor the most environmentally ‘friendly’ disposal available at that time.

GSM-100-030General cautions

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GMR-0468P02901W38-O

General cautions

Introduction

Observe the following cautions during operation, installation and maintenance of theequipment described in the Motorola GSM manuals. Failure to comply with thesecautions or with specific cautions elsewhere in the Motorola GSM manuals may result indamage to the equipment. Motorola assumes no liability for the customer’s failure tocomply with these requirements.

Caution labels

Personnel working with or operating Motorola equipment must comply with any cautionlabels fitted to the equipment. Caution labels must not be removed, painted over orobscured in any way.

Specific cautions

Cautions particularly applicable to the equipment are positioned within the text of thismanual. These must be observed by all personnel at all times when working with theequipment, as must any other cautions given in text, on the illustrations and on theequipment.

Fibre optics

The bending radius of all fibre optic cables must not be less than 30 mm.

Static discharge

Motorola equipment contains CMOS devices that are vulnerable to static discharge.Although the damage caused by static discharge may not be immediately apparent,CMOS devices may be damaged in the long term due to static discharge caused bymishandling. Wear an approved earth strap when adjusting or handling digital boards.

See Devices sensitive to static for further information.

GSM-100-030 Devices sensitive to static

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GMR-0415

Devices sensitive to static

Introduction

Certain metal oxide semiconductor (MOS) devices embody in their design a thin layer ofinsulation that is susceptible to damage from electrostatic charge. Such a charge appliedto the leads of the device could cause irreparable damage.

These charges can be built up on nylon overalls, by friction, by pushing the hands intohigh insulation packing material or by use of unearthed soldering irons.

MOS devices are normally despatched from the manufacturers with the leads shortedtogether, for example, by metal foil eyelets, wire strapping, or by inserting the leads intoconductive plastic foam. Provided the leads are shorted it is safe to handle the device.

Special handlingtechniques

In the event of one of these devices having to be replaced observe the followingprecautions when handling the replacement:

S Always wear an earth strap which must be connected to the electrostatic point(ESP) on the equipment.

S Leave the short circuit on the leads until the last moment. It may be necessary toreplace the conductive foam by a piece of wire to enable the device to be fitted.

S Do not wear outer clothing made of nylon or similar man made material. A cottonoverall is preferable.

S If possible work on an earthed metal surface. Wipe insulated plastic work surfaceswith an anti-static cloth before starting the operation.

S All metal tools should be used and when not in use they should be placed on anearthed surface.

S Take care when removing components connected to electrostatic sensitivedevices. These components may be providing protection to the device.

When mounted onto printed circuit boards (PCBs), MOS devices are normally lesssusceptible to electrostatic damage. However PCBs should be handled with care,preferably by their edges and not by their tracks and pins, they should be transferreddirectly from their packing to the equipment (or the other way around) and never leftexposed on the workbench.

GSM-100-030Motorola GSM manual set

29 Aug 199716


GMR-0468P02901W38-O

Motorola GSM manual set

Introduction

The following manuals provide the information needed to operate, install and maintain theMotorola GSM and GSM Packet Radio Service (GPRS) equipment.

Generic GSMmanuals

The following are the generic manuals in the GSM manual set, these manuals arerelease dependent:

Classificationnumber Name Order number

GSM-100-101 System Information: General 68P02901W01. . . . . . . . . . . . . . . . . . . GSM-100-201 Operating Information: GSM System Operation 68P02901W14. . . GSM-100-202 Operating Information: OMC-R System

Administration 68P02901W19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GSM-100-311 Technical Description: OMC-R in a GSM System 68P02901W31. . GSM-100-313 Technical Description: OMC-R Database Schema 68P02901W34. GSM-100-320 Technical Description: BSS Implementation 68P02901W36. . . . . . . GSM-100-321 Technical Description: BSS Command Reference 68P02901W23. GSM-100-403 Installation & Configuration: GSM System

Configuration 68P02901W17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GSM-100-423 Installation & Configuration: BSS Optimization 68P02901W43. . . . GSM-100-413 Installation & Configuration: OMC-R Clean Install 68P02901W47. . GSM-100-501 Maintenance Information: Alarm Handling at

the OMC-R 68P02901W26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GSM-100-520 Maintenance Information: BSS Timers 68P02901W58. . . . . . . . . . . GSM-100-521 Maintenance Information: Device State Transitions 68P02901W57GSM-100-523 Maintenance Information: BSS Field

Troubleshooting 68P02901W51. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GSM-100-503 Maintenance Information: GSM Statistics

Application 68P02901W56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GSM-100-721 Software Release Notes: BSS/RXCDR 68P02901W72. . . . . . . . . . GSM-100-712 Software Release Notes: OMC-R System 68P02901W74. . . . . . . .

GSM-100-030 Motorola GSM manual set

29 Aug 1997


68P02901W38-O

GMR-0417

Related GSMmanuals

The following are related Motorola GSM manuals:


GSM-001-103 System Information: BSS Equipment Planning 68P02900W21. . . . GSM-002-103 System Information: DataGen 68P02900W22. . . . . . . . . . . . . . . . . . GSM-002-703 Software Release Notes: DataGen 68P02900W76. . . . . . . . . . . . . . GSM-005-103 System Information: GSM Advance Operational

Impact 68P02900W25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GSM-008-103 System Information: Network Health Analyst 68P02900W36. . . . . . GSM-008-703 Software Release Notes: Network Health Analyst 68P02900W77. GSM-TOOLS-001 System Information: Cell Optimization (COP) 68P02900W90. . . . . GSM-TOOLS-002 System Information: Motorola Analysis and

Reporting System (MARS) 68P02900W94. . . . . . . . . . . . . . . . . . . . . GSM-TOOLS-701 Software Release Notes: Cell Optimization (COP) 68P02900W69. GSM-TOOLS-702 Software Release Notes: Motorola Analysis and

Reporting System (MARS) 68P02900W68. . . . . . . . . . . . . . . . . . . . . GSM-006-202 Operating Information: OMC-R System

Administration (OSI) 68P02901W10. . . . . . . . . . . . . . . . . . . . . . . . . . GSM-006-413 Installation & Configuration: OSI Clean Install 68P02901W39. . . . . GSM-006-712 Software Release Notes: OMC-R OSI System 68P02901W70. . . .

Generic GPRSmanuals

The following are the generic manuals in the GPRS manual set, these manuals arerelease dependent:


GPRS-300-101 System Information: GPRS Overview 68P02903W01. . . . . . . . . . . . GPRS-300-202 Operating Information: OMC-G System

Administration 68P02903W03. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GPRS-300-222 Operating Information: GSN System Administration 68P02903W37GPRS-300-311 Technical Description: OMC-G in a GPRS System 68P02903W29. GPRS-300-313 Technical Description: OMC-G Database Schema 68P02903W46. GPRS-300-321 Technical Description: GSN Command Reference 68P02903W18. GPRS-300-423 Installation & Configuration: GSN Clean Install 68P02903W47. . . . GPRS-300-413 Installation & Configuration: OMC-G Clean Install 68P02903W04. GPRS-300-501 Maintenance Information: Alarm Handling at

the OMC-G 68P02903W19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GPRS-300-503 Maintenance Information: GSN Statistics

Application 68P02903W20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GPRS-300-722 Software Release Notes: GSN System 68P02903W76. . . . . . . . . . GPRS-300-712 Software Release Notes: OMC-G System 68P02903W70. . . . . . . .

Related GPRSmanuals

The following are related Motorola GPRS manuals:

GPRS-001-103 System Information: GPRS Equipment Planning 68P02903W02. . GPRS-005-103 System Information: GSN Advance Operational

Impact 68P02903W38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-030Motorola GSM manual set

29 Aug 199718


GMR-0468P02901W38-O

BSS servicemanuals

The following are the Motorola Base Station service manuals, these manuals are notrelease dependent. The internal organization and makeup of service manual sets mayvary, they may consist of from one to four separate manuals, but they can all be orderedusing the overall catalogue number shown below:


GSM-100-020 Service Manual: BTS 68P02901W37. . . . . . . . . . . . . . . . . . . . . . . . . . GSM-100-030 Service Manual: BSC/RXCDR 68P02901W38. . . . . . . . . . . . . . . . . . GSM-105-020 Service Manual: M-Cell2 68P02901W75. . . . . . . . . . . . . . . . . . . . . . . GSM-106-020 Service Manual: M-Cell6 68P02901W85. . . . . . . . . . . . . . . . . . . . . . . GSM-201-020 Service Manual: M-Cellcity and M-Cellcity+ 68P02901W95. . . . . . . GSM-202-020 Service Manual: M-Cellaccess 68P02901W65. . . . . . . . . . . . . . . . . . GSM-203-020 Service Manual: Horizonmicro 68P02902W36. . . . . . . . . . . . . . . . . . GSM-206-020 Service Manual: Horizoncompact 68P02902W15. . . . . . . . . . . . . . . GSM-205-020 Service Manual: Horizonmacro Indoor 68P02902W06. . . . . . . . . . . GSM-204-020 Service Manual: Horizonmacro Outdoor 68P02902W12. . . . . . . . . . GSM-207-020 Service Manual: Horizonoffice 68P02902W46. . . . . . . . . . . . . . . . . . GSM-209-020 Service Manual: Horizonmicro2 Horizoncompact2 68P02902W61. GSM-208-020 Service Manual: Horizonmacro 12 Carrier Outdoor 68P02902W66GSM-101-SERIES ExCell4 Documentation Set 68P02900W50. . . . . . . . . . . . . . . . . . . . GSM-103-SERIES ExCell6 Documentation Set 68P02900W70. . . . . . . . . . . . . . . . . . . . GSM-102-SERIES TopCell Documentation Set (GSM900) 68P02901W80. . . . . . . . . . . GSM-104-SERIES TopCell Documentation Set (DCS1800) 68P02902W80. . . . . . . . . . GSM-200-SERIES M-Cellmicro Documentation Set 68P02901W90. . . . . . . . . . . . . . . . .

GPRS servicemanuals

The following are the Motorola GPRS service manuals, these manuals include thePacket Control Unit (PCU) service manual which becomes part of the BSS for GPRS:


GPRS-301-020 Service Manual:GPRS Support Nodes (GSN) 68P02903W05. . . . . GPRS-302-020 Service Manual: Packet Control Unit (PCU) 68P02903W10. . . . . . .

Classificationnumber

The classification number is used to identify the type and level of a manual. For example,manuals with the classification number GSM-100-2xx contain operating information.

Order number

The Motorola 68P order (catalogue) number is used to order manuals.

Orderingmanuals

All orders for Motorola manuals must be placed with your Motorola Local Office orRepresentative. Manuals are ordered using the order (catalogue) number. Remember,specify the manual issue required by quoting the correct suffix letter.

GSM-100-030 GMR amendment

29 Aug 1997


68P02901W38-O

GMR-0419

GMR amendment

Introduction toGMRs

Changes to a manual that occur after the printing date are incorporated into the manualusing General Manual Revisions (GMRs). GMRs are issued to correct Motorola manualsas and when required. A GMR has the same identity as the target manual. Each GMR isidentified by a number in a sequence that starts at 01 for each manual at each issue.GMRs are issued in the form of loose leaf pages, with a pink instruction sheet on thefront.

GMR procedure

When a GMR is received, check on the GMR amendment record page of this manualthat previous GMRs, if any, have been incorporated. If not, contact your administrator orMotorola Local Office to obtain the missing GMRs. Remove and replace pages in thismanual, as detailed on the GMR pink instruction sheet.

GSM-100-030GMR amendment record

29 Aug 199720


GMR-0468P02901W38-O

GMR amendment record

Instructions

When a GMR is inserted in this manual, the amendment record below must be filled in torecord the insertion. Retain the pink instruction sheet that accompanies each GMR andinsert it in a suitable place in this manual for future reference.

Amendmentrecord

Record the insertion of GMRs in this manual in the following table:

GMR number Incorporated by (signature) Date

01 Incorporated 17 Dec 1997

02 Incorporated 10 Aug 2001

03 Incorporated 31 Aug 2002

04 Incorporated (this GMR) 29 Aug 2003

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Category 131

System Information

GSM-100-131

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Category 131System Information i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 1Introduction i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Overview 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cabinet types 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .




Chapter 2Specification i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Specification 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Environment 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Dimensions 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Weights 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power consumption 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


GSM-100-131

29 Aug 1997iv System Information: BSC/RXCDR

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Chapter 1

Introduction

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Overview 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cabinet types 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .




GSM-100-131


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GSM-100-131 Overview


68P02901W06-O

GMR-04

1–1

Overview

Introduction

This chapter is a mechanical and electrical description of the base station system control(BSSC) cabinet.

A BSSC cabinet can be configured as:

S A base station controller (BSC) containing digital hardware modules configured tocontrol the radio subsystem.

S A remote transcoder (RXCDR) containing digital hardware modules configured toprovide an interface between the BSC and mobile switching centre (MSC).

S A combination of the BSC and RXCDR functions.

The difference between the BSC and RXCDR configurations is in the complement ofdigital modules on the backplane.

The information in this chapter applies to all three of the above configurations and, unlessotherwise indicated, to GSM, GSM850, extended GSM (EGSM), DCS1800 andPCS1900 systems.

Cabinet types

The earlier BSSC cabinet is the same as the BSSC2 except in its handling of powerdistribution and alarms. The differences are described in the BSSC differences sectionof this chapter.

The BSSC and BSSC2 cabinets can be powered by a positive earth (–48 V or –60 V) ornegative earth (+27 V) supply. The only difference in the cabinets is the inclusion of fanpower converters in the –48/–60 V versions of the BSSC to derive +27 V power for thecooling fans.

Where the BSSC and BSSC2 are the same, only the BSSC is mentioned.

NOTE

GSM-100-131BSSC cabinet configuration

29 Aug 19971–2 System Information: BSC/RXCDR

GMR-0468P02901W06-O

BSSC cabinet configuration

Configurationoptions

BSC configuration

The BSSC cabinet configured as a BSC contains at least one base station unit (BSU)shelf assembly. This assembly is in the lower portion of the cabinet; the upper portion ofthe cabinet can contain a second BSU configured either as a separate BSC or as anexpansion of the BSU on the lower shelf.

Transcoding can be performed at the BSC. In this case, the upper portion of the cabinetcontains a separate transcoder unit (RXU) shelf assembly instead of a second BSU.

The top shelf contains the power distribution unit (PDU) which consists of a distributionalarm board and a dc circuit breaker panel.

RXCDR configuration

The BSSC2 cabinet configured as an RXCDR contains at least one RXU shelf assembly,located in the lower portion of the cabinet. A second RXU can be located in the upperportion of the cabinet. The top shelf contains the PDU, which consists of a distributionalarm board and a dc circuit breaker panel.

BSU and RXU shelves

Each shelf in a cabinet can be configured as a separate network element.

The BSU and RXU shelf assemblies consist of:

S A backplane.

S Two vertical slot module shelves.

S A three compartment shelf.

The lower portion of the two vertical slot shelves holds 26 full size digital modules in slotsnumbered L0 to L28. The upper portion of the shelf holds 28 half size digital modules inslots numbered U0 to U28.

There are three compartments at the bottom of the BSU/RXU shelf assembly, withslide-in mountings for power supply modules. The left compartment is for an optionalredundant power supply module.

LocationThe BSC can be located at the same site as the radio (collocated). They can also sharethe same cabinet. Alternatively, the BSC at one site can control several radio subsystemsat remote sites.

The transcoding function of the BSS can be located either:

S With the BSC.

S Remotely between the BSC and the MSC.

Locating the transcoding function between the BSC and the MSC is the most commonoption and is referred to as the RXCDR.

EquipmentThe exact digital hardware module equipment in the cabinet depends on the BSSapplication. Chapter 2 of this manual contains descriptions of the digital hardwaremodules used in the BSSC cabinet.

GSM-100-131 Cabinet description external


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Cabinet description external

Introduction

This section describes the external appearance of a typical BSSC cabinet.

External view

Figure 1-1 shows an external view of a typical BSSC cabinet:

INTERCONNECT PANEL

INTAKE AIR VENTS

INTAKE AIR VENTS

EXHAUST AIR VENTS

EXHAUST AIR VENTS

DOOR HINGES

Figure 1-1 BSSC cabinet (external view)

GSM-100-131Cabinet description external


GMR-0468P02901W06-O

Dimensions

The cabinet has the following dimensions:

Height 2100mm excluding lifting eyelets

Width 711 mm excluding isolation strips

Depth 416 mm excluding isolation strip

External features

The cabinet door is hinged on the left side of the cabinet, and has four air vents withgrilles:

S Intake vents have air filters.

S Exhaust vents have exhaust fans fitted behind the vents.

All connections to the cabinet are at the interconnect panel, which is on top of thecabinet. This panel also has feed-through tubes for routeing fibre optic inter-cabinetcables in and out of the cabinet. All cabinets are RF/EMI shielded.

GSM-100-131 Cabinet description internal


68P02901W06-O

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Cabinet description internal

Introduction

This section describes the internal appearance of a typical BSSC cabinet.

Internal view

Figure 1-2 shows an internal view of a typical BSSC cabinet:

FANSPOWER SUPPLYMODULES

POWER SUPPLYMODULES

POWERDISTRIBUTION UNIT

(PDU)

HALF-SIZE DIGITALBOARD SHELF


FULL-SIZE DIGITALBOARD SHELF


EXTERIOR DOORS REMOVED TO SHOW DETAIL

Figure 1-2 BSSC cabinet (internal view)

GSM-100-131Cabinet description internal


GMR-0468P02901W06-O

Internal units

As shown in Figure 1-2, the BSSC can contain two card cages, each with one full-sizeand one half-size digital board shelf. A card cage can contain either a BSU or an RXU.All cabinets contain a power distribution unit PDU and a fan cooling system.

Card cages are equipped according to the required function of the cabinet, as shown inthe Table 1-1:

Table 1-1 Cabinet type cage equippage

Cabinet type BSU RXU PDU Fans

BSC Lower card cage – � �

RXCDR – Lower card cage � �

CombinedBSC andRXCDR

Lower card cage Upper card cage � �

The upper card cage of a BSC or RXCDR can be used to increase capacity by fitting asecond BSU or RXU as appropriate.


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Chapter 2

Specification

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Chapter 2Specification i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Specification 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Environment 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Dimensions 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Weights 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power consumption 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


GSM-100-131


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Specification

Overview

The BSSC cabinet specifications, including frequency band characteristics are tabulatedin this chapter.

Environment

The environmental limits are shown in Table 2-1.

Table 2-1 Environmental limits

Environment Temperature Humidity

Operating –5 _C to +45 _C 5% to 95% non-condensing

Storage –45 _C to +70 _C 8% to 100% non-condensing

Dimensions

The dimensions are shown in Table 2-2.

Table 2-2 Dimensions

Height Width Depth

BSSC 2100 mm 711 mm 416 mm

Weights

The weight figures are shown in Table 2-3.

Table 2-3 Weights

Weight Weight

BSSC 136 kg (unequipped) 230 kg (with two BSU cages)

Powerconsumption

Maximum power consumption figures are theoretical values derived underextreme conditions and are affected by variables such as temperature,component tolerances, transmission power and supply voltage. Although thesefigures must be considered when planning site power requirements, typicalmeasured consumption values will be lower.

NOTE

Table 2-4 shows the nominal and maximum power consumption figures for the cabinet.

Table 2-4 BSSC cabinet power consumption

Ambient temperature Nominal powerconsumption

Maximum powerconsumption

0 to +50 °C 1500 W 2400 W

GSM-100-131Power requirements


GMR-0468P02901W06-O

Power requirements

Introduction

BSSC cabinets can operate from either positive or negative earth supplies (determinedby customer request and configured during initial build) at various voltages.

Positive earthBSSC cabinets

Positive earth BSSC cabinets operate from a –48 V or –60 V dc supply. The maximumpower requirements are:

S (–48 V) = 50 A.

S (–60 V) = 40 A.

Negative earthBSSC cabinets

Negative earth BSSC cabinets operate from a nominal +27 V dc (+3 V, –5 V dc) supply.The maximum power requirement is:

S (+27 V) = 90 A.

Back-up power

BSSC cabinets can be connected to an external battery to provide a dc input powerback-up for dynamic random access memory (DRAM) devices.

The DRAM backup maximum power requirement for each cabinet is:

S 4 A (maximum) at +27 V dc.

An adequate means of routeing cables from the power source to theequipment, for example a cable trough, must be provided (BS 7671 ReferenceMethod 11).

NOTE

Overcurrentprotection

The cabinet overcurrent protection device can be:

S a fuse conforming to BS88 (IEC 51-3).

S a main circuit breaker conforming to BS EN 60898 (IEC 898).

The device must be of the following rating:

S +27 V cabinets: 100 A.

S –48 V cabinets: 63 A.


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Category 333

Technical Description

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Chapter 3Power, fans and interconnections i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .








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General Information

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Overview

Introduction

This chapter is a mechanical and electrical description of the base station system control(BSSC) cabinet.

A BSSC cabinet can be configured as:

S A base station controller (BSC) containing digital hardware modules configured tocontrol the radio subsystem.

S A remote transcoder (RXCDR) containing digital hardware modules configured toprovide an interface between the BSC and mobile switching centre (MSC).

S A combination of the BSC and RXCDR functions.

The difference between the BSC and RXCDR configurations is in the complement ofdigital modules on the backplane.

The information in this chapter applies to all three of the above configurations and, unlessotherwise indicated, to GSM, extended GSM (EGSM), DCS1800 and PCS1900 systems.

The BSSC and BSSC2 cabinet are similar, the BSSC2 cabinet is described.Where there are differences these are described in the text.

NOTE

Cabinet types

The earlier BSSC cabinet is the same as the BSSC2 except in its handling of powerdistribution and alarms. The differences are described in the BSSC differences sectionof this chapter.

The BSSC and BSSC2 cabinets can be powered by a positive earth (–48 V or –60 V) ornegative earth (+27 V) supply (this is requested by the customer and configured duringinitial installation). The only difference in the cabinets is the inclusion of fan powerconverters in the –48/–60 V versions of the BSSC to derive +27 V power for the coolingfans.

GSM-100-333BSSC2 cabinet configuration

29 Aug 19971–2 Technical Description: BSC/RXCDR

GMR-0468P02901W07-O

BSSC2 cabinet configuration

Configurationoptions

BSC configuration

The BSSC2 cabinet configured as a BSC contains at least one base station unit (BSU)shelf assembly. This assembly is in the lower portion of the cabinet; the upper portion ofthe cabinet can contain a second BSU configured either as a separate BSC or as anexpansion of the BSU on the lower shelf.

Transcoding can be performed at the BSC. In this case, the upper portion of the cabinetcontains a separate transcoder unit (RXU) shelf assembly instead of a second BSU.

The top shelf contains the power distribution unit (PDU) which consists of a distributionalarm board and a dc circuit breaker panel.

RXCDR configuration

The BSSC2 cabinet configured as an RXCDR contains at least one RXU shelf assembly,located in the lower portion of the cabinet. A second RXU can be located in the upperportion of the cabinet. The top shelf contains the PDU, which consists of a distributionalarm board and a dc circuit breaker panel.

BSU and RXU shelves

Each shelf in a cabinet can be configured as a separate network element.

The BSU and RXU shelf assemblies consist of:

S A backplane.

S Two vertical slot module shelves.

S A three compartment shelf.

The lower portion of the two vertical slot shelves holds 26 full size digital modules in slotsnumbered L0 to L28. The upper portion of the shelf holds 28 half size digital modules inslots numbered U0 to U28.

There are three compartments at the bottom of the BSU/RXU shelf assembly, withslide-in mountings for power supply modules. The left compartment is for an optionalredundant power supply module.

LocationThe BSC can be located at the same site as the radio (collocated). They can also sharethe same cabinet. Alternatively, the BSC at one site can control several radio subsystemsat remote sites.

The transcoding function of the BSS can be located either:

S With the BSC.

S Remotely between the BSC and the MSC.

Locating the transcoding function between the BSC and the MSC is the most commonoption and is referred to as the RXCDR.

EquipmentThe exact digital hardware module equipment in the cabinet depends on the BSSapplication. Chapter 2 of this manual contains descriptions of the digital hardwaremodules used in the BSSC2 cabinet.

GSM-100-333 Cabinet description external


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Cabinet description external

Introduction

This section describes the external appearance of the BSSC2 cabinet.

External view

Figure 1-1 shows an external view of the BSSC2 cabinet:

INTERCONNECT PANEL

INTAKE AIR VENTS

INTAKE AIR VENTS

EXHAUST AIR VENTS

EXHAUST AIR VENTS

DOOR HINGES

Figure 1-1 BSSC2 cabinet - external view

GSM-100-333Cabinet description external


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External features

The cabinet door is hinged on the left side of the cabinet, and has four air vents withgrilles:

S Intake vents have air filters.

S Exhaust vents have exhaust fans fitted behind the vents.

All connections to the cabinet are at the interconnect panel, which is on top of thecabinet. This panel also has feed-through tubes for routeing fibre optic inter-cabinetcables in and out of the cabinet. All cabinets are RF/EMI shielded.



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Cabinet description internal

Introduction

This section describes the internal appearance of the BSSC2 cabinet.

GSM-100-333Cabinet description internal


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Internal view

Figure 1-2 shows an internal view of the BSSC2 cabinet:

FANSPOWER SUPPLY

MODULES

POWER SUPPLYMODULES

POWERDISTRIBUTION UNIT

(PDU)





EXTERIOR DOORS REMOVED TO SHOW DETAIL

Figure 1-2 BSSC2 cabinet - internal view



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Internal units

As shown in the internal view on the previous page, the BSSC2 can contain two cardcages, each with one full-size and one half-size digital board shelf. A card cage cancontain either a BSU or an RXU. All cabinets contain a power distribution unit PDU and afan cooling system.

Card cages are equipped according to the required function of the cabinet, as shown inthe Table 1-1:

Table 1-1 Cabinet type cage equippage

Cabinet type BSU RXU PDU Fans

BSC Lower card cage – � �

RXCDR – Lower card cage � �

CombinedBSC andRXCDR

Lower card cage Upper card cage � �

The upper card cage of a BSC or RXCDR can be used to increase capacity by fitting asecond BSU or RXU as appropriate.

GSM-100-333Base station unit shelf assembly


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Base station unit shelf assembly

Overview

A base station unit (BSU) shelf assembly consists of:

S A backplane.

S Two vertical-slot module shelves containing the required digital modules:

– The upper shelf holds half size digital modules.

– The lower shelf holds full size digital modules.

S A three-compartment shelf for the power supply modules.

Every cabinet must be fitted with the following digital cards:

S Two bus termination cards (BTC).

S One local area network extender (LANX) module.

All other digital modules are optional, and their inclusion depends upon the cabinetconfiguration.

BSC numbering

In a BSC, BSUs are numbered from 0 forward using the sixteen position (0 to F hex) rotary switch on the LANX module. This rotary switch sets the BSU LANaddress.

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BSU shelf

Figure 1-3 shows a base station unit shelf:

AI0AI1AI2

MS0

MS1

MS2

MS3

KS1

GK0

KS0

DR5DR4

DR3DR2

DR1DR0

PART OF BSU BACKPLANE

FULL SIZEMODULES

HALF SIZEMODULES

BLANKINGPLATE

DPSM, IPSM, OR EPSM

Figure 1-3 BSU shelf



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Shelf module fit

Table 1-2 shows the module positions in a fully-equipped BSU shelf assembly:

If AMR hardware modules are installed, in Table 1-2, where appropriate: Read KSW as DSW2 Read XCDR as GDP2 Read GPROC as GPROC3

NOTE

Table 1-2 BSU shelf module positions

Slot Half size modules Slot Full size modules

U0 KSWXL L0 BTC

U1 KSWXL L1 KSW

U2 KSWXR or CLKX L2

U3 KSWXR or CLKX L3 GCLK (note 1)

U4 KSWXR or CLKX L4

U5 KSWXR or CLKX L5 GCLK (note 1)

U6 KSWXR or CLKX L6 MSI or XCDR (note 2)

U7 KSWXR or CLKX L7 MSI or XCDR (note 2)

U8 KSWXE L8 MSI or XCDR (note 2)

U9 KSWXE L9 MSI or XCDR (note 2)

U10 Not used in this cabinet L10 MSI or XCDR (note 2)






U16 PIX or BBBX L16 MSI or XCDR (note 2)

U17 PIX or BBBX L17 MSI or XCDR (note 2)

U18 PIX or BBBX L18 GPROC

U19 LANX L19 GPROC

U20 LANX L20 GPROC

U21 KSWXE L21 GPROC

U22 KSWXE L22 GPROC

U23 KSWXE L23 GPROC

U24 KSWXR L24 GPROC

U25 KSWXR L25 GPROC

U26 KSWXR L26 Spare

U27 KSWXR L27 KSW

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U28 KSWXR L28 BTC

Notes: 1. GCLK modules take up two slots: L2 and L3, or L4 and L5.2. Maximum six XCDR modules in any MSI slot positions.3. GDP modules will use XCDR slot positions.



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Ventilation

Blanking plates are inserted in all unused full size and power supply module slots toassist with the correct airflow and ventilation.

Backplaneconnectors

Table 1-3 shows the function of each connector fitted at the top of the BSU backplane:

Table 1-3 BSU backplane connectors

Connector Function

AI0 Serial bus primary (lower BSU only), to DAB

AI1 Serial bus redundant (lower BSU only), to DAB

AI2 +5 V DRAM power, from BBBX

KS0 TTY test connector, to KSW/DSW2 in slot L27

KS1 TTY test connector, to KSW/DSW2 in slot L1

GK0 GPS receiver connector, to interconnect panel on top ofcabinet

MS0 MSI connector, to interconnect panel T43/BIB on top ofcabinet




DR0 Not used

DR1 Not used

DR2 Not used

DR3 Not used

DR4 Not used

DR5 Not used

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Remote transcoder unit shelf assembly

Overview

A remote transcoder unit (RXU) shelf assembly consists of:

S A backplane.

S Two vertical-slot module shelves containing the required digital modules:

– The upper shelf holds half size digital modules.

– The lower shelf holds full size digital modules.

S A three-compartment shelf for the power supply modules.

Every cabinet must be fitted with:

S Two bus termination cards (BTC).

S One local area network extender (LANX) module.

All other digital modules are optional, and their inclusion depends upon the cabinetconfiguration.

RXU numbering

In a RXCDR, RXUs are numbered 0 or 1 using the sixteen position (0 to F hex) rotaryswitch on the LANX module. This rotary switch sets the RXU LAN address.

GSM-100-333Remote transcoder unit shelf assembly


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RXU shelf

Figure 1-4 shows a remote transcoder unit shelf:

FULL SIZEMODULES

HALF SIZEMODULES

AI0

AI1AI2

MS0KS0

PART OF RXU BACKPLANE

MS1

MS2

MS3

KS1

BLANKING PLATE

DPSM, IPSM OR EPSM

Figure 1-4 RXU shelf



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Shelf module fit

Table 1-4 shows the module positions in a fully-equipped RXU shelf assembly:

If AMR hardware modules are fitted retrospectively in BSSC installations, forthe purpose of Table 1-2: For KSWX, read DSWX as relevant. For KSW, read DSW2 as relevant. For GDP, read GDP2 as relevant

NOTE

Table 1-4 BSU shelf module positions

Parameter Valid Input Default Default

U0 KSWXL L0 BTC

U1 KSWXL L1 KSW

U2 KSWXR or CLKX L2

U3 KSWXR or CLKX L3 GCLK *

U4 KSWXR or CLKX L4

U5 KSWXR or CLKX L5 GCLK *

U6 KSWXR or CLKX L6 XCDR, GDP or MSI

U7 KSWXE or CLKX L7 XCDR, GDP or MSI

U8 KSWXE L8 XCDR, GDP or MSI

U9 KSWXE L9 XCDR, GDP or MSI

U10 Not used in this cabinet L10 XCDR, GDP or MSI

U11 Not used in this cabinet L11 XCDR, GDP





U16 PIX or BBBX L16 XCDR, GDP



U19 LANX L19 XCDR, GDP

U20 LANX L20 XCDR, GDP

U21 KSWXE L21 XCDR, GDP



U24 KSWXR L24 XCDR, GDP or NVM

U25 KSWXR L25 GPROC

U26 KSWXR L26 GPROC

U27 KSWXR L27 KSW

GSM-100-333Remote transcoder unit shelf assembly


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Parameter DefaultDefaultValid Input

U28 KSWXR L28 BTC

* GCLK boards take up two slots: L2 and L3, or L4 and L5



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Ventilation

Blanking plates are inserted in all unused full size and power supply module slots toassist with the correct airflow and ventilation.

Backplaneconnectors

Table 1-5 shows the function of each connector fitted at the top of the RXU backplane:

Table 1-5 RXU backplane connectors

Connector Function

AI0 Serial bus primary (lower RXU shelf only), to DAB

AI1 Serial bus redundant (lower RXU shelf only), to DAB

AI2 +5 V DRAM power, from BBBX

KS0 TTY test connector, to KSW in slot L27

KS1 TTY test connector, to KSW in slot L1





GSM-100-333Power distribution unit components


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Power distribution unit components

Introduction

This section describes the cabinet dc power distribution arrangements.

Overview

The power distribution unit (PDU) is located on the top shelf of the cabinet and:

S Distributes dc power throughout the cabinet.

S Provides an alarm interface.

It consists of:

S A distribution alarm board (DAB).

S A circuit breaker panel containing seven dc circuit breakers.

Input power

DC input power is applied at the interconnection panel on top of the cabinet and is routedto:

S The VIN bus bar.

S The earth (GND) bus bar in the PDU.

A second bus bar obtains +27 V power from:

S The integrated power supply modules (IPSMs) in the lower BSU in positive earth(–48/–60 V) cabinets.

S The VIN and GND busbars, via busbar links, in negative earth (+27 V) cabinets.

Circuit breakers

The seven circuit breakers distribute power to units within the cabinet.

S CB1 (30 A) provides +27 V to the DAB.

S CB5 to CB10 (60 A) provide:

– –48/–60 V to the IPSMs in a positive earth cabinet.

– +27 V to the EPSMs in a negative earth cabinet.

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Fan cooling system

Overview

Each fan tray assembly contains three exhaust fans. Cabinet baffling divides the cabinetcooling system into upper and lower cabinet cooling sub-systems.

The cooling system, in conjunction with the correct use of shelf airflow deflectors,provides adequate cooling for all cabinet equipment.

Each fan has a fan stall sensor which is connected to alarm circuits in the DAB throughconnector PC5.

Location

The fan cooling system is mounted directly below each BSU/RXU shelf assembly.

Requirements

Power for the fans is derived from the +27 V busbar and is routed to the +27 V terminalon the DAB, then from connector PC9 on the DAB to the fans.

GSM-100-333Interconnect panel


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Interconnect panel

Overview

The interconnect panel is mounted on the top of the cabinet and provides connectionsfor:

S DC input power.

S E1/T1 line interconnect modules.

S Customer defined alarm equipment input/output.

S +27 V battery backup input for DRAM.

The Interconnect panel has feed-through tubes for routeing fibre optic inter-cabinetcables into and out of the cabinet.

The E1/T1 line interconnection modules are:

S Type 43 (T43) interconnect boards.

S Balanced line interconnect boards (BIB).

Panel layout

Figure 1-5 shows the interconnect panel:

PIX 1

PIX 0

GKO

BATTERYBACKUP

EARTH STUD

V IN

–48/60 V dcor+27 V dc

0 V

FIBRE OPTIC CABLESFEED THROUGH TUBE

Figure 1-5 Interconnect panel

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Connectors

Table 1-6 shows the interconnect panel connector functions:

Table 1-6 |Interconnect panel connectors

Connector Function Internal destination External destination

+27 VBatteryBack-up

DRAM back-upbattery

PAB connector PC4 andBBBX connector PC2

+27 V back-up battery

MS0 to MS3 Multiple serialinterface ports (up tosix E1/T1 circuits at

h t i

MS0 to MS3 connectorson lower BSU/RXUbackplane

E1/T1 circuits source ortermination equipment(via a T43 or BIB)

MS4 to MS7 each connector; sixTx and six Rxcircuits)

MS4 to MS7 connectorson upper BSU/RXUbackplane

PIX0 andPIX1

Customer alarminput/output ports

Front edge connector ofPIX modules

Customer alarmequipment

GSM-100-333BSSC Cabinet labels


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BSSC Cabinet labels

Introduction

This section details the warning, advisory and other labels on the BSSC cabinet.

BSSC labels

Figure 1-6 shows the position of labels on the BSSC cabinet:

Motorola 12

34

56

78

9

10

1112

1314

151617

18

19

20

21

22

2324

2526

FRONT OF DOOR

Figure 1-6 BSSC cabinet labels

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Key to BSSClabels

Table 1-7 details the labels on the BSSC cabinet:

Table 1-7 BSSC cabinet labels

Key Description Part Number Comments

1 Safety glasses 5402275W01

2 Fuse map 5402347W01

3 Circuit breaker 5402349W035402349W04

4 CE mark 5402470W01

5 Safety EN60 950 5402489W01

6 T43 connection 5402401W01

7 Rating label 5402284W035402284W04

8 Danger energy hazard 5402192W01

9 Earth label 5402098W01

10 Serial number N/A Factory marked

11 Warning live terminals 5409954E01

12 Panel must be in place 5409816E01

13 Warning possible laser radiation 5402274W01

14 Caution isolate 5402374W01

15 Warning disconnect fuse N/A Part of fan

16 Panel must be in place 5409816E01

17 Warning live terminals 5409954E01 -48/-60V cabinetsonly

18 ESD 5409951E01

19 Half–size module laser hazard 5402281W01



22 ESD and card map 5402305W01


24 Open door handle 5402471W01



GSM-100-333BSSC2 Cabinet labels


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BSSC2 Cabinet labels

Overview

The following diagrams and tables show the location of the warning, advisory andspecific labels applied to the BSSC2 equipment cabinet. Refer to the labelling table forthe key to the numbers on the diagrams.

Labellingdiagrams

Figure 1-7 and Figure 1-8 show the location of labels on the BSSC2 cabinet.

Table 1-8 and Table 1-9 give details of the information displayed on the indicated label.

Door front

1

Figure 1-7 BSSC2 cabinet labels - door front

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Internal labelling

12

3

4

56

78

9

10

11

12

13

14

15

16

17

18

21

20

19

Figure 1-8 BSSC2 cabinet labels

GSM-100-333BSSC2 Cabinet labels


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Labelling tables

Table 1-8 explains the label on the door front diagram:

Table 1-8 BSSC2 cabinet door front label details

Key Description Part number Comments


Table 1-9 explains the labels on the internal labelling diagram:

Table 1-9 BSSC2 cabinet internal labelling details

Key Description Part number Comments

1 Fuse map 5402347W01

2 Circuit breaker 5402349W035402349W04

3 CE mark 5402470W01

4 Safety EN60 950 5402489W01

5 T43 connection 5402401W01

6 Rating label 5402284W035402284W04

7 Danger energy hazard 5402192W01

8 Earth label 5402098W01

9 Serial number N/A

10 Warning live terminals 5409954E01

11 Warning possible laser 5402274W01


13 Warning live terminals 5409954E01 –48/–60 Vcabinet only


15 Half size module laser hazard 5402281W01

16 ESD 5409951E01






GSM-100-333 BSSC2 cabinet cabling


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BSSC2 cabinet cabling

Overview

This section contains the following cabinet cabling diagrams for a BSSC2 with a DABtype PDU:

Diagram 1

BSSC2 cabinet (–48/–60 V) dc power and alarm cabling diagram.

Diagram 2

BSSC2 cabinet (+27 V) dc power and alarm cabling diagram.

Diagram 3

BSSC2 cabinet digital cabling diagram.

Diagram 4

Example of BSU and RXU module to T43 or BIB connections.

GSM-100-333BSSC2 cabinet cabling


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Diagram 1

BSSC2 cabinet (–48/–60 V) dc power and alarm cabling diagram.



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Diagram 2

BSSC2 cabinet (+27 V) dc power and alarm cabling.

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Diagram 3

BSSC2 cabinet digital cabling diagram



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Diagram 4

Example of BSU and RXU module to T43 or BIB connections.

GSM-100-333BSSC differences


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BSSC differences

Introduction

The BSSC cabinet is the same as the BSSC2 except in terms of its power distributionand alarm handling arrangements. This section describes these differences; it must beread with reference to the rest of this chapter.

This section does not apply to DCS1800 and PCS1900 systems.NOTE

Types of PDU

The BSSC PDU is available in two forms that are functionally the same. These two typescomprise:

S A power distribution board (PDB), an alarm interface board (AIB) and a circuitbreaker panel.

S A power alarm board (PAB) and a circuit breaker panel.

The PAB combines the PDB and AIB functions.

The distribution alarm board (DAB), as used by the BSSC2, supersedes both of thesetypes.

PDB

The power distribution board distributes +27 V and +5 V to units in the cabinet via 25fuses. The PDB is described in chapter 3.

AIB

The alarm interface board monitors alarm lines, passes individual alarms to the GPROCand provides a signal for the cabinet alarm LED. The AIB is described in chapter 3.

PAB

The power alarm board distributes +27 V and +5 V to units in the cabinet via 30 fuses,monitors alarm lines, passes individual alarms to the GPROC and provides a signal forthe cabinet alarm LED. The PAB is described in chapter 3.

Circuit breakers

Power from the VIN bus bar is distributed to power supplies within the cabinet via thecircuit breaker panel described in chapter 3.

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BSSC cabinet cabling (PAB)

Overview

This section contains the following cabinet cabling diagrams for a BSSC with PAB typePDU:

Diagram 1

BSSC cabinet (–48/–60 V) dc power and alarm cabling.

Diagram 2

BSSC cabinet (+27 V) dc power and alarm cabling.


GSM-100-333BSSC cabinet cabling (PAB)


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Diagram 1

BSSC cabinet (–48/–60 V) dc power and alarm cabling.

GSM-100-333 BSSC cabinet cabling (PAB)


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Diagram 2

BSSC cabinet (+27 V) dc power and alarm cabling.

SURGECAPACITOR

VIN 0V

GK0

GSM-100-333BSSC cabinet cabling (PDB/AIB)


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BSSC cabinet cabling (PDB/AIB)

Overview

This section contains the cabinet cabling diagram for a BSSC with PDB/AIB type PDU:

Diagram 1

BSSC cabinet dc power and alarm cabling.


GSM-100-333 BSSC cabinet cabling (PDB/AIB)


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Diagram 1

BSSC cabinet dc power and alarm cabling.

UPPER BSU BA CKPLANE(OPTIONAL)

LO WER BSU BA CKPLANE

CB4 (RED)

CB5 (RED)

CB3 (RED)

CB1 (RED)

CB2 (RED)

CB0 (RED)

GBB (BLK)

GBB (BLK)

GBB (BLK)

GBB (BLK)

GBB (BLK)

GBB (BLK)

SURGECAPACITOR

VIN 0V

GK0

PC1

PC2PC9

+27V

PC3 PC6

PC4

GND

5PS29

PS29PS19PS19

PS9

PS9

GDN BUSBAR (GBB)

4

3

2

1

0

PCB

PDBPC7

PC5

PC2CIRCUITBREAKERS

PC

5P

C6

PC

8

PS

28

PS

18

CB

5

CB

4

CB

3

CB

2

CB

1

CB

0

PS

8

PS

28

PS

18

PS

8

PC

1

PC

7PC3

AIB

CABINETDOORLED

ig.196.rh

GSM-100-333BSSC cabinet cabling (PDB/AIB)


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Chapter 2

Digital modules

GSM-100-333


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GSM-100-333


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GSM-100-333

29 Aug 1997vi Technical Description: BSC/RXCDR

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Overview

Introduction

This chapter describes the digital modules used in BSS equipment cabinets (BSC andRXCDR).

The digital modules fit into the base station unit (BSU) and remote transcoder unit (RXU)shelves.

In this chapter

Do not fit digital modules in any equipment for which they are not suitable.CAUTION

Some AMR hardware modules can be installed retrospectively in BSSCinstallations (non-AMR). Technical details of these modules are included in thischapter, but it important to note the performance constraints indicated fornon-BSSC3 installations.

NOTE

All information given is valid for GSM, EGSM, DCS1800 and PCS1900 systems unlessotherwise indicated.

GSM-100-333BSU and RXU shelf diagrams


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BSU and RXU shelf diagrams

Introduction

This section contains BSU and RXU shelf module assignments and associatedinformation. Subsequent sections in this chapter describe each module.

BSU shelf

Figure 2-1 shows the BSU shelf slot assignment and backplane connectors:

Figure 2-1 BSU shelf layout

BSU Module slots

S Slots are numbered from 0 to 28 from right to left.

S Half-size modules are fitted in the upper row.

S Full-size modules are fitted in the lower row.

S Master slots must be equipped first for initialization purposes:

– Slot L5 GCLK.

– Slot L20 GPROC.

– Slot L16 MSI/2.

– Slot L27 KSW.

S All unused slots must be fitted with a blanking plate.

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BSU backplane connectors

S AI0 and AI1 are 10-pin headers.

S AI2 is a 4-pin power connector to the back up supply (BBBX).

S KS0 and KS1 are 20-pin headers and provide TTY access to serial ports forKSW/DSW2 boards.

S DR0 to DR5 are 20-pin headers and provide TTY access to serial ports forDRI/MSI boards.

S GK0 is a 9-pin D-type and provides a GCLK synchronization input.

S MS0 to MS3 are 37-pin D-types for connecting E1/T1 circuits.

RXU shelf

Figure 2-2 shows the RXU shelf slot assignment and backplane connectors:

Figure 2-2 RXU shelf layout

GSM-100-333BSU and RXU shelf diagrams


GMR-0468P02901W07-O

RXU module slots

S Slots are numbered from 0 to 28 from right to left.

S Half-size modules are fitted in the upper row.

S Full-size modules are fitted in the lower row.

S Master slots must be equipped first for initialization purposes.

– Slot L5 GCLK.

– Slot L25 GPROC.

– Slot L10 MSI/2, XCDR, GDP / GDP2

– Slot L27 KSW/DSW2.

S All unused slots must be fitted with a blanking plate.

Backplane connectors.

S AI0 and AI1 are 10-pin headers.

S AI2 is a 4-pin power connector to the back up supply (BBBX).

S KS0 and KS1 provide TTY access to serial ports for KSWs / DSW2s.

S MS0 to MS3 are 37-pin D-types for connecting E1/T1 lines.

GSM-100-333 Module front panels


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Module front panels

Introduction

This section is a quick reference guide to the status indicators and switches on the frontpanels of the digital modules in BSU and RXU shelves. Subsequent sections in thischapter describe each module. The reset switch on a module will not return a Disabled orLocked module to service. If the module was B–U or E–U before the module was resetthen it will return to an in–service state either Busy or Enabled. Once a module is lockeddisabling the module will have no effect on the status of the module as displayed viaMMI, disabling a module results in isolating the module from the cage. Modules not listedbelow have no status indicators or front panel switches.

Table 2-1 gives details of the status indicators found on module front panels, and whatgiven indications mean.

Table 2-1 Module front panel status indicators

Module Status indicators Front panel switches

GCLK Green LED on only =Master, no alarmsRed LED on only =Alarms, not MasterBoth LEDs on =Master and alarmsBoth LEDs off =Not Master, no alarms

(or no power)(alarms: oscillator or PLL failure, ref. counter overflow)

Toggle switch (three position)Up (momentary) =Reset boardMiddle =Normal operationDown =Disable board for extraction

Potentiometer =Adjustment for the VCXO**

GPROC Green LED on only =Processor running, no alarmsRed LED on only =Processor halted or in resetBoth LEDs on =Processor running, board is

disabled or other alarmBoth LEDs off =No power to boardBoth LEDs flashing =Bootstrap reprogram in

progress

Toggle switch (three position)Up (momentary) =Reset board, download codeMiddle =Normal operationDown =Disable board for extraction

KSW/DSW2 Green LED on only =Processor running, no alarmsRed LED on only =Processor halted or in resetBoth LEDs on =Processor running, board is

disabled or other alarmBoth LEDs off =No power to board


MSI Green LED on only =Processor running, no alarmsRed LED on only =Processor halted or in resetBoth LEDs on =Processor running, board is



XCDR andGDP

Green LED on only =Processor running, no alarmsRed LED on only =Processor halted or in resetBoth LEDs on =Processor running, board is



KSWX/DSWX Green LED on =Master, no alarmsGreen LED blinking =Slave, no alarmsGreen LED off =TDM bus or Clock alarms

(or no power)


GSM-100-333Module front panels


GMR-0468P02901W07-O

Module Front panel switchesStatus indicators

NVM Board status LEDs:Green LED on only =Processor running, no alarmsRed LED on only =Alarms, board reset or board

awaiting initializationBoth LEDs off =Total power failureCard status LEDs:Green LED on only =PCMCIA card operationalRed LED on only =Fault on PCMCIA cardBoth LEDs flashing =Software writing data to the cardBoth LEDs off =Card slot not in use


Card swap switch:Operation not currently supported

Card eject:Operation not currently supported

LANX None Rotary switch (16 position)For setting shelf ID number

PIX Green LED on =No alarmsGreen LED off =Customer alarm detected

None

GSM-100-333 Full-size modules


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Full-size modules

Introduction

Full-size modules fit into slots in the lower card cage of a BSU or RXU shelf. The slotsare numbered, right to left, from L0 to L28.

The following sections describe the full-size modules that can be mounted in a BSU orRXU.

The quantity fitted depends upon the specific configuration of the BSU or RXU.

The modules

The following full-sized modules are described:

S Bus terminator card (BTC).

S Digital radio interface extended memory (DRIM).

S Generic clock (GCLK).

S Generic processor (GPROC/2).

S Kiloport switch (KSW) Double Kiloport switch (DSW2)

S Multiple serial interface (MSI/2).

S Transcoder (XCDR).

S Generic DSP Processor (GDP and GDP2).

S Non Volatile Memory (NVM).

GSM-100-333BTC


GMR-0468P02901W07-O

BTC

Purpose

The bus termination card (BTC) terminates the backplane to keep signals on a BSU orRXU shelf at the proper TTL level.

The BTC terminates:

S Both MCAP buses.

S Both BSS serial buses.

S Both reference clocks.

S All TDM buses (Expansion, Remote and Local).

Requirements

Two BTC modules must be fitted in each BSU or RXU shelf, in slot L0 and slot L28, at alltimes.

While a faulty BTC is being replaced, another BTC must be fitted in a KSW slot tomaintain the above requirement.

BTC module

Figure 2-3 shows a BTC module:

ig.199.rh

BACKPLANE CONNECTOR

Figure 2-3 BTC module

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DSW2

Purpose

The double kiloport switch 2 (DSW2) module is a time division multiplex (TDM), multipleaccess digital switch designed to support a non-blocking switching fabric. The DSW2 iscompatible with legacy software, and can be used in place of the KSW in BSSC2installations.

When installed retrospectively in BSSC installations, the DSW2 operates in aKSW mode. In this situation the full DSW2 performance detailed in this sectionwill be constrained as indicated in the text.

NOTE

The DSW2:

S Performs timeslot interchange for the active TDM highway.

S Communicates with the controlling GPROC2 via the MCAP bus.

S At a BSC, routes logical channels dynamically, on a per-call basis.

S At an RXCDR provides fixed switching for traffic between the BSC and MSC.

S Supports 3-party conferencing (TPC).

S Provides a range of diagnostic features.

S Provides expanded capacity via multiple-DSW2 configurations.

The DSW2 is shown in Figure 2-4.

GSM-100-333DSW2


GMR-0468P02901W07-O

Figure 2-4 DSW2 module

Backplane connectorAlarm (Red) LED.Normally OFF

Active (Green) LED.Normally ON

RESET/DISABLE switch

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Timeslotinterchange

The primary function of the DSW2 is to switch data from a given timeslot on the activeinbound (switchbound) ) TDM highway, to a given timeslot on the active outbound TDMhighway. DSW2 switching at the BSC is variable; physical channel mapping on theA interface is performed for each call, and at every handover. DSW2 switching in anRXU3 shelf is fixed; it provides one-to-one physical mapping between the traffic to andfrom the BSC and the traffic to and from the MSC.

The DSW2 can be configured to use the following TDM highways, according torequirements:

S Local TDM highway.

S Remote TDM highway.

S Three Expansion TDM highways.

These are described in the following sections.

Local highway

The Local TDM inbound highway uses the Local Highway 0 port on the DSW2. This portis used for Highway 0 traffic within the same physical cage as the DSW2.

Remote TDMhighway

The Remote TDM inbound highway uses the Remote Highway 0 port on the DSW2. Thisport is used to extend the switching functions of a local DSW2 to other cages. Sincethere is no increase in the number of DSW2s, there is no expansion or increase in theswitching capacity. Each remote cage is linked to the primary cage by a fibre optic cable,via DSW extender modules. In the primary cage a Remote DSW extender (DSWXR)module interfaces the fibre optic to the Remote TDM Highway. At each remote cage aLocal DSWX module (DSWXL), provides a Local TDM Highway within the cage. Anexample of a DSW2 extended to a second cage is shown in Figure 2-5.

GSM-100-333DSW2


GMR-0468P02901W07-O

Figure 2-5 DSW2 extended connection

PRIMARYBSU/RXU SHELF

REMOTEBSU/RXU SHELF

Inbound local Outbound highwayTSI

DSWXR

DSWXL

DSW2

Fibre optic cables

Local TDMhighway

Expansion TDMhighways

Highways 1-3 are Expansion inbound TDM highways. These highways allow multipleDSW2s located in different cages to be configured in parallel, via Expansion DSWextender (DSWXE) modules. Because the number of DSW2s is increased, the availableswitching capacity is expanded accordingly. The three highways enable up to fourDSW2s to be connected in this way, including the DSW2 in the primary cage. Anexample of three DSW2s connected in parallel is shown in Figure 2-6.

GSM-100-333 DSW2


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Figure 2-6 DSW2 expansion

BSU/RXU SHELF

BSU/RXU SHELF

Fibre optic cables

BSU/RXU SHELF

Each DSW2 routes inbound datato the TSI section and to theexpansion outbound highway

Inbound local

2048 ports

Inbound local

2048 ports

Inbound local

2048 ports

TDM data is sentto/from DSWXE toDSWXE

All expansioninbound data issent (along with theinbound local) tothe TSI forswitching to theoutbound highway

Outbound highway

2048 ports

Outbound highway

2048 ports

Outbound highway

2048 ports

Expansionoutbound highwayis sent to eachDSWXE

Data from otherDSW2s is sent tothe TSI section(2048 each)

DSWXE

DSWXE

DSWXE

DSWXE

DSWXE

DSWXE

TSITSI

TSITSI

TSITSI

DSW2

DSW2

DSW2

GSM-100-333DSW2


GMR-0468P02901W07-O

Outbound TDM highwaysThe RAM based Timeslot Assigner (TSA) generates output enables to select the inbounddata for each outbound timeslot. In this way the correct data to be sent outbound fromthe DSW2 is captured by selectively enabling the outputs of all possible data sources.

The possible data sources encompass:

S Timeslot Interchange (TSI) data. This is the normal operating mode.

S Three-party Conference data.

S Fixed patterns for A-law and u-law idle channel codes.

S Dynamic and static patterns generated by the DSP for test purposes.

The DSW2 outbound highway interface itself comprises:

S Remote outbound highway. Used to extend the switching capacity to other cages,via DSWX cards. Note that the switching capacity is extended, not expanded orincreased.

S Local outbound highway. Used for traffic within the same physical cage as theDSW2. A 12-timeslot delay is introduced on this path to maintain timing alignmentwith the remote outbound highway, which is subject to various TDM delays.

Double-rate TDM bus:The maximum outbound TDM highway bandwidth is 131.072Mb/s, partitioned into 2048 timeslots. This double rate TDM bus can be used when theDSW2 is configured in extended mode, which allows the capacity to be shared betweencages. Note that the backplane clock frequency is not changed. Supported channeltypes include 64, 32, 16 and 8 kbit/s. The DSW2 therefore supports a maximum of 204864kbit/s channels, 4096 32 kbit/s channels, 8192 16kbit/s channels, or 16384 8 kbit/schannels. One TDM frame can contain any combination of these channels.

Standard-rate TDM bus: The DSW2 also supports a KSW mode of operation, for whichthe outbound highway is partitioned into 1024 timeslots to provide a standard rate TDMbus. The potential bandwidth of the outbound highway is thus halved in this mode ofoperation.

The usable switching capacity of each DSW2 depends on site hardware and softwareconfigurations because certain modules require a number of ports for their own use. TheDSW2 is controlled by the local GPROC2 or GPROC3 via the MCAP bus.

Three partyconference

Three party conference mode is effected by decoding and summing the timeslots of twoA-law or two u-law PCM-encoded channels. The summed data is thenre-encoded/compressed, and selected as the data source for the active outboundhighway. A-law or u-law selection is not intended to change on a timeslot basis. TheDSW2 supports any number of three party conference calls, within its maximum channelcapacity.

Self-diagnosticsTimeslot interchange: Fixed/dynamic pattern generation is used in conjunction withtimeslot monitoring to provide extensive self-diagnostics for the timeslot interchangesection.

DSP: The DSP is monitored by a watchdog timer. The DSP writes to a memory-mappedaddress that periodically resets the watchdog timer, ensuring that it does not time out. Ifthe DSP stops running, the watchdog timer times out and causes the red LED on thefront panel to illuminate. An interrupt is also generated and sent to the GPROC3 via theMCAP bus. If a DSP fails, the TSI section of the DSW2 still switches data, but no newpath connections are implemented. This results in existing calls being held while thesystem is reconfigured around the failed DSW2.

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Serial interface

The serial interface logic supports the TTY interface. This interface is connected to adedicated backplane connector port. This port is a buffered RS232 type. The TTY can beused to control the DSW2, monitor DSW2 status, and support DSW2 diagnostics.

Slot position

The DSW2 is located in the following slots in a BSU or RXU3 shelf assembly:

S L1 for TDM highway B.

S L27 for TDM highway A.

GSM-100-333GCLK


GMR-0468P02901W07-O

GCLK

Purpose

The generic clock (GCLK) module generates all the timing reference signals that theBSU or RXU requires. The master TDM clock is normally synthesized from a 16.384MHz ±0.05 ppm stable reference (temperature stabilized crystal oscillator) and a2.048 MHz or 1.544 MHz clock recovered from one of the E1 or T1 lines.

Requirements

The GCLK module fits in slots L3 and L5 in the BSU and RXU shelf assemblies. Themodule is two slots wide and covers L2/L3 and L4/L5.

There must be a GCLK module in slot L5 of all BSU and RXU shelf assemblies.

A second GCLK module in slot L3 provides n + 1 redundancy.

Mutually redundant GCLKs must reside in the same BSU or RXU.

GCLK module

Figure 2-7 shows a GCLK module:

ALARM LED (RED)

ACTIVE LED (GREEN)

E1/T1 IN

16.384 MHz OUT

6.12S OUT60mS OUT

125uS OUT

GROUND

FREQUENCY ADJUST

RESET/DISABLE SWITCHUP (MOMENTARY) = RESET

MIDDLE = NORMAL OPERATIONDOWN = DISABLE

BACKPLANECONNECTOR

Figure 2-7 GCLK module

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Brief descriptionRefer to the functional block diagram at the end of this section.

The GCLK module generates all timing reference signals required by the BSS:

S 16.384 MHz TDM clock.

S 125 ms frame reference.

S 60 ms synchronization reference.

S 6.12 s superframe reference.

The GCLK is phase-locked to the recovered clock of a selected E1/T1 line from an MSIor XCDR module. If the recovered clock signal is lost, and no long term average (LTA) isavailable upon which to synchronize, then the GCLK free-runs, providing referencestability better than 0.05 ppm. The module incorporates self-diagnostics to detect andisolate board faults and to select a redundant board in the event of module failure.

When a redundant GCLK is present, the GCLKs operate in a master/slave configurationwith the slaved outputs synchronized to the master. If an error is detected, the clockcontrol circuit reverses the master/slave status of the two GCLKs. Fault status isreported to the main processor via the MCAP bus.

Referenceoscillator

The reference oscillator uses a phase lock loop (PLL) and a frequency multiplier tosynthesize 16.384 MHz from a E1/T1 line. The PLL consists of:

S A digital phase detector.

S A loop filter.

S A voltage controlled crystal oscillator (VCXO).

S A divide by eight loop divider.

If a fault is detected on the signal from both E1/T1 lines, the oscillator either uses the LTA(if available) or free runs with stability being maintained by the VCXO.

Referencedividers

The 125 ms, 60 ms, and 6.12 s reference dividers consist of cascaded programmablebinary counters to divide the input signal to the correct output frequency. The referencedividers are synchronized to the master clock. The output of each reference counter isrouted to a multiplexer, which is used to switch the reference output from the master orthe slave GCLK. The output of each reference counter is also routed to the referenceencoder.

Referenceencoders

The reference encoder encodes the reference signals together while maintaining phaserelationships. The encoded clock signals are routed via the backplane to a CLKX to betransmitted to other shelves at the site, via fibre optic cables.

Reference faildetect

The reference fail detect circuit monitors the signal on the two E1/T1 lines. Failures arereported to the clock control/alarm logic. In the event of a reference failure, the GCLKeither uses the LTA (if available) or selects the secondary E1/T1 line reference. In eithercase an alarm is reported to the controlling GPROC via the MCAP bus.

GSM-100-333GCLK


GMR-0468P02901W07-O

Clockcontrol/alarmlogic

The clock control/alarm logic determines the GCLK master/slave status based on modulefaults and GPROC commands, and reports the operational status to the GPROC.

Buffered testports

Buffered test ports are supplied on the front of the GCLK module for test andmeasurement of the input reference signal and output clock and reference signals. Thetest jacks are recessed.

GSM-100-333 GCLK


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GCLK diagram

Figure 2-8 is a block diagram of the GCLK module:

Figure 2-8 GCLK block diagram

GSM-100-333GDP2


GMR-0468P02901W07-O

GDP2

PurposeThe Generic DSP Processor 2 (GDP2) module is a transcoder board that supportsAdaptive Multi Rate (AMR) speech, as well as data transcoding and rate adaption. Theboard supports 60 traffic channels, which can be dynamically switched between half rate,full rate and enhanced full rate (EFR) speech. The board can also be used to replace theGDP in an existing RXU backplane.

This section describes the full design performance for the GDP2. If the GDP2is installed retrospectively in BSSC installations (which do not have AMRspeech capability), its performance will be constrained accordingly. Inparticular, its AMR capabilities are not used and it supports a single E1 lineinterface only.

NOTE

The GDP2 supports a redundant DSP block, which is transparently switched in the eventof a single DSP block failure. This significantly increases availability compared to theoriginal GDP board.

The GDP2 module can be used only with systems running GSR7 software orlater releases, as this contains the necessary software support to allowoperation. For a BSC the transcoder boards it connects to must all be GDP2,not XCDR.

NOTE

The GDP2 module:

S Provides the transcoding interface to the MSC. The GDP2 module is located atthe RXCDR, or at a BSC where transcoding is integrated within the BSC.

S Interfaces two E1 serial lines to the internal cabinet TDM highway, which is in aparallel format.

S Transcodes 64 kbit/s data from the E1 lines, into 16 kbit/s or 8 kbit/s data., andvice versa.

Each GDP2 supports 60 compressed voice and data channels, using 8 + 1 DSPs.These channels, and the synchronization and link control signalling channels, can beplaced in any of the 1024 channels on the TDM highway under control of the GPROC3.

TerminologyOne wire pair (balanced or unbalanced) equals one E1 serial data stream.

Two E1 serial data streams (transmit and receive) equal one E1.

RequirementsThe GDP2 module is fitted in:

S Slots L6 to L17 (but maximum 6 modules in total) in the BSU shelf assembly.

S Slots L6 to L24 (maximum 19 modules) in the RXU3 shelf assembly.

An MSI-2 or GDP2 must be located in at least one of the BSU locations below for BSCinitialization purposes.

S Shelf 0 slot 16 (Software communicates via either group A or group B).

S Shelf 0 slot 14 (Software communicates via group A).

S Shelf 1 (if second BSU in BSC) slot 16 (Software communicates via group A).

An RXU3 initialization uses slot 10 instead of slot 16, and slot 8 instead of slot 14.

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GDP2 module

Figure 2-9 shows a GDP2 module, with the front panel interface shown in Figure 2-10.

Figure 2-9 GDP2 module.

Alarm (Red) LED.Normally OFF

Active ( Green) LED.Normally ON

RESET/DISABLEswitch

BackplaneConnector

GSM-100-333GDP2


GMR-0468P02901W07-O

Figure 2-10 Front panel interface

Reset

Disable

GDP2 Fail LED

GDP2 Operational LED

Ethernet (RJ45)

Brief description

Refer to the GDP2 block diagram at the end of this section.

The GDP2 module contains a digital signal processor (DSP) unit that performs:

S GSM-defined speech encoding.

S GSM-defined speech decoding.

S Submultiplexing functions.

The speech transcoder bi-directionally interfaces the 64 kbit/s E1 line in the land networkto the 13 kbit/s vocoder format used on the air interface.

Signalling channels pass through the transcoder transparently.

Architecture

The GDP2 module contains the following major systems:

S MCU subsystem.

S DSP subsystem.

S E1 Line interface.

S Digital crosspoint switch.

S MCAP interface.

S TDM interface.

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MCU subsystemThe main component of the processor system is the microcontroller unit (MCU), which

S Controls and interfaces the other major systems on the GDP2 module.

S Performs self-diagnostics and error monitoring.

Other components of the processor system are:

S A watchdog timer.

S 256 kbytes of RAM.

S 512 kbytes of Flash EPROM.

S 1 kbyte of dual port RAM for MCAP messaging.

S 1 kbyte of dual port RAM for TDM interface.

S A power monitor circuit.

The watchdog timer is periodically strobed by the MCU; an alarm is generated if it is notstrobed before a pre-set timeout.

DSP subsystemThe DSP subsystem consists of 8 identical blocks plus one redundant, each with:

S One 275 MHz DSP processor

S 256kB x 32 dedicated SDRAM for program and data storage.

S Two Enhanced Synchronous Serial Interfaces (ESSIs) for traffic.

S On-board phase-locked loops (PLL) to maintain a clock in the event that the16.384 clock input is lost. The PLL is designed to be stable enough to remainwithin range when the clock input is restored.

DSP firmware is downloadable. The MCU uses the host port to connect to the parallelbus of all DSPs for control, monitoring and download purposes. All the ESSI signals tothe DSPs are buffered by tristate devices.

MultiplexerThere is a multiplexer within the serial data formatter. The multiplexer converts data fromthe DSP subsystem ESSI format to the digital crosspoint switch, ST Bus Format. Thismultiplexes four data streams from the switch into a single datastream for the DSPs.Each DSP receives the same timeslot data . The software running on the DSP mapswhich timeslot is to be transcoded by that DSP.

E1 Line interfaceThe line interface systems perform:

S Impedance matching.

S Secondary surge protection from high voltage transients (such as lightning strikes),which may come down the E1 lines.

The impedance matching and isolation circuits consist of isolation transformers andZener diodes.

After impedance matching and isolation each E1 line receive signal is input into a lineinterface unit/framer., which performs the clock recovery, data conversion, and framing.

The clock extraction section extracts the E1 clock to which all BSU/RXU3 shelves can besynchronized. The framer performs frame decoding law CCITT recommendation G.704for digital multiplex equipment. Traffic is then routed to the switching system.

The GDP2 provides a loopback from each line input to line output, for E1 linktroubleshooting.

GSM-100-333GDP2


GMR-0468P02901W07-O

CRC-4 Errorchecking

A GDP2 module configured for use with an E1 serial line supports CRC-4 error checking.This is set by default to the on state 0. All associated switches (MSCs) must also haveCRC-4 error checking set to the on state, so allowing communication across theA-interface

To check if the GDP2 board CRC-4 state is set, use the MMS_config_type CMdatabase command.

disp_element MMS_config_type <location>

Refer to Technical Description: BSS Command Reference (68P02901W23) forinformation on the above CM database command.

To ensure the correct setting of CRC-4 error checking at the MSC, consult the vendorsupplied equipment manual.

Digitalcrosspointswitch

The switching system consists of a digital switch, which performs the following functions:.

S Transmission of E1 line data and TDM data streams.

S Connection between the processor section and the E1 line interface system.

MCAP interface

The MCAP interface system supports two redundant MCAP buses to the GDP2. TheGDP2 communicates with the GPROC3 in the same way as all other full-size modules.

TDM interface

The TDM interface system takes traffic data from the TDM bus and converts it fromparallel data to serial data. The serial data is then sent to the switching system.

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GDP2 diagram

Figure 2-11 shows a block diagram of the GDP2 module:

Figure 2-11 GDP2 block diagram

BACKPLANE

E1 LineInterface

E1 LineInterface

Digital CrosspointSwitch

MCAPInterface

ESSITest Port

Serial Data Formatters

ESSITest Port

ESSI

DSPSub–System

SCI Mix

MCUSub–System

TTY A

TTY B

ESSI

Traffic channel signalling & data 2048 kbit/sTraffic channel data 8192 kbit/sData/Control

Host Bus

SCI

TDMInterface

GSM-100-333GPROC


GMR-0468P02901W07-O

GPROC

Purpose

The generic processor (GPROC) module provides the processing power to control aBSC, RXCDR or BTS.

GPROCs in a BSU or RXU exchange control signalling via several links:

S A token ring local area network (LAN). The LAN can link processors in severalshelves via fibre optic cable.

S A Motorola cellular advanced processor (MCAP) bus, which extends theprocessor’s address, data and control buses to peripheral modules in the sameshelf.

S A serial bus, which communicates alarm information between GPROCs andhalf-size modules. This serial bus extends to the PDU.

S The active time division multiplex (TDM) highway.

GPROC modules can be used in a BSU or RXU shelf assembly runningsoftware up to and including GSR3. GSR4 and later software releases requirethe use of GPROC2 modules.

NOTE

Requirements

The GPROC module fits into:

S Slots L18 to L25 in a BSU shelf assembly.

S Slot L25 and slot L26 in an RXU shelf assembly.

Each BSU/RXU requires at least one GPROC.

A GPROC must be fitted in slot L20 of BSU 0, and slot L25 of RXU 0, for use ininitialization.

Communication

The GPROC communicates with other full-size modules via the MCAP bus, and withhalf-size modules (and modules not on the module shelf) via the BSS serial bus. Thereare two other serial ports which are not currently used.

The LAPD processor and the TDM interface controller communicate via a high-speedprivate bus. The private bus arbiter is the interface between the MC68030 address/databus and the high-speed private bus.

The parallel port controls output signals to the front panel LEDs, and receives inputsignals (via the register ports) from the backplane. These contain:

S Shelf ID.

S Slot ID.

S Backplane type.

S Backplane revision level.

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GPROC moduleFigure 2-12 shows a GPROC module.

ig.202.rh

ALARM LED (RED)

ACTIVE LED (GREEN)

GREEN LED ON, RED LED =PROCESSOR RUNNING, NO FAILURES

GREEN LED OFF, RED LED ON =PROCESSOR HALTED, OR IN RESET

BOTH LEDS ON = PROCESSOR RUNNING,MODULE IS DISABLED OR OTHER ALARM

RESET/DISABLE SWITCH

UP (MOMENTARY) = RESETMIDDLE = NORMAL OPERATION

DOWN = DISABLE

TTY CONNECTOR(OPTICALLY ISOLATED TEST PORT)

BACKPLANECONNECTOR

Figure 2-12 GPROC module

Brief descriptionRefer to the functional block diagram at the end of this section.

The GPROC module contains:

S A Motorola MC68030 16-bit processor operating at 25 MHz.

S The LAN processor, which is the interface between the GPROC and the token ringLAN.

S The COMM processor which, in conjunction with the TDM interface controller, isthe interface between the GPROC and the TDM highway.

MemoryThe GPROC module is equipped with 16 Mbytes of DRAM. There is also 512 kbytes ofEPROM (expandable to 1 Mbyte). The EPROM contains the bootstrap code.

Troubleshootingand diagnostics

A fully buffered TTY maintenance port is available on the front panel, to which a personalcomputer (PC) can be connected. The TTY can be used for monitoring and controllingsoftware when performing maintenance or troubleshooting.

The maintenance port meets the requirements of the EIA RS232C and CCITT V.24specifications.

The GPROC runs on-board self-diagnostics during initial power-up and on commandfrom the maintenance TTY.

GSM-100-333GPROC


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SoftwareEvery GPROC is identical in terms of hardware; its function depends upon the softwareloaded into it.

The processor functions for BTS and BSC applications are different from those for anRXCDR application and are described separately in the following sections.

BTS and BSCGPROCfunctions

The GPROC performs the following processor functions:

S Fault Manager (FM).

S Configuration Manager (CM).

S Message Transfer Protocol (MTP).

S Signalling Connection Control Part (SCCP) State Machine (SSM).

S Radio Resource State Machine (RRSM).

S Cell Resource Machine (CRM).

S Switch Manager (SM).

S Connectionless Manager (CLM).

S Radio Subsystem (RSS).

S Operations and Maintenance System (OMS).

S Maintains a copy of the application code for collocated peripheral modules.

GPROC task groups and device typesThe processor functions can be grouped into six task groups depending on the softwareloaded into a given GPROC.

When a group of tasks is assigned to a GPROC, it is considered to be a unique GPROCdevice type. The exception to this is the code storage facility processor (CSFP), which isnot considered to be a unique device type.

Table 2-2 shows the device types and task groups:

Table 2-2 GPROC device types

GPROC device BSCtask groups

BTStask groups

BSC/BTSinterface

Type 0 N/A Base TransceiverProcessor (BTP)

Motorolaproprietary

Type1 Base Site ControlProcessor (BSP)

Link ControlProcessor (LCP)

Base TransceiverProcessor (BTP)

Digital Radio HostProcessor (DHP)

Motorolaproprietary

Type 2 Base Site ControlProcessor (BSP)


Operations andMaintenanceProcessor (OMP)

Base TransceiverProcessor (BTP)

Digital Radio HostProcessor (DHP)

Radio System LinkProcessor (RSLP)

Motorolaproprietary

NOTEA code storage facility processor (CSFP) can also be equipped.

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RXCDR GPROCfunctions

The RXCDR GPROC processor functions are similar to the BSC and BTS GPROCs andcomprise:




These processor functions:

S Maintain the switch database for the KSWs.

S Maintain a copy of the application code for collocated peripheral modules.

S Initialize the RXCDR network element.

S Maintain the configuration database.

S Communicate with other network elements via a 64 kbit/s LAPD serial data link.

S Communicate with the OMC via an X.25 link.

S Communicate with the local monitor via a man-machine interface (MMI).

S Communicate with collocated digital modules.

S Handle redundancy between duplicated modules.

S Control operational software downloads to digital highway modules such as MSIs,KSWs, and XCDRs.

Fault manager

The RXCDR FM communicates with the BSS FM function via the optional transcoderBSC link (XBL), a dedicated 64 kbit/s channel.

Switch manager

The SM:

S Makes connections between the terrestrial links on the A interface (MSC to BSS)and the radio (traffic) channels on the air interface.

S Interacts with the call processing and fault management functions.

S Provides switching functionality for the BSS distributed within the BSC and BTS.

Configuration manager

The CM maintains and updates a configuration database which contains all parametersand operational software currently in use.

Changes to the database are restricted to the highest level password protection, due tothe potential for down time caused by incorrect changes to the configuration database.

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Flash EPROMdaughter card

The flash EPROM (flash memory) feature allows GPROCs equipped to reprogram to thelatest bootstrap code automatically. This feature eliminates the need to visit every site tomanually replace EPROMs every time the bootstrap code changes.

Reprogramming is an automatic part of code downloading and requires no GSM networkoperator interaction.

One flash EPROM GPROC daughter card is needed for each upgraded GPROC module.

HardwareThe flash EPROM contains four 256 kbyte flash EPROMs that contain the bootstrapcode for a total of 1 Mbyte of code space.

The upper 4 kbytes of this address space accesses control logic on the daughter card toenable and disable the programming voltage. This portion of memory is thereforeunavailable for program storage.

The contents of the flash EPROM can be loaded in the field with the required softwareload. The flash EPROM daughter card resides in the address range $0 to $FFFFF on theGPROC.

Control circuitsThe flash EPROM contains control circuits that the software uses to enable and disablethe application of the programming voltage to the flash EPROMs, to provide protectionfrom accidental writes.

The programming voltage is enabled by a write to a specific address and disabled by aread to another specific address. The address range $FF000 to $FFFFF is unavailablefor program storage.

The control circuits on the card provide sufficient programming current to program all fourflash EPROMs simultaneously.

SoftwareThe downloadable bootstrap flash EPROM works in all GPROC configurations.

The new bootstrap software is downloaded as a new code object and distributed to allGPROCs using the current code object download and distribution scheme.

The RAM code programs the new bootstrap code into place. Having transitioned fromROM to RAM code, the software must determine if the new bootstrap code object is thesame as that currently programmed into EPROM. If it is not, and if the GPROC has beenreworked to use flash EPROMs, the GPROC updates its flash EPROM to the codecontained in the new bootstrap code object.

ProgrammingAll four flash EPROMs are programmed simultaneously. This minimizes the totalreprogramming time of the flash EPROMs, to reduce the possibility of resetting the cardin the middle of the reprogramming cycle and thus rendering the bootstrap (and theGPROC) useless.

On startup, the ROM code provides the memory management unit write protection overthe flash EPROM area. This helps guard against accidental writes to the bootstrap code.

When the bootstrap reprogramming cycle is in progress, both the red and green LEDs onthe GPROC’s front panel flash in unison. This is a visual sign to an onsite technician thatthe reprogramming cycle is in progress.

An MMI command is available to verify that the bootstrap programming has beensuccessful. If the technician operates from the OMC, the GPROC(s) are monitored withprinted messages via the “rlogin” capability from the OMC.

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GPROC diagram

Figure 2-13 shows a block diagram of the GPROC module:

Figure 2-13 GPROC block diagram

GSM-100-333GPROC2


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GPROC2

Purpose

The GPROC2 generic processor module provides the processing power to control a BSCor RXCDR.

A GPROC2 cannot be used with software version less than GSR2 and mustbe used for software version GSR4 and above.

NOTE

A GPROC2 in a BSU or RXU exchange control signalling in several ways:

S A token ring local area network (LAN). The LAN can link processors in severalshelves via fibre optic cable.

S A Motorola cellular advanced processor (MCAP) bus, which extends the processoraddress, data and control buses to peripheral modules in the same shelf.

S A serial bus, which communicates alarm information between GPROC2s andhalf-size modules. This serial bus extends to the power distribution unit.

S The active time division multiplex (TDM) highway.

Requirements

The GPROC2 module fits into:

S Slots L18 to L25 in a BSU shelf assembly.

S Slot L25 and slot L26 in an RXU shelf assembly.

Each BSU/RXU requires at least one GPROC2.

A GPROC2 must be fitted in slot L20 or L24 in a BSC.

Brief description

The GPROC2 module contains:

S A Motorola MC68040 32-bit processor operating at 33 MHz.

S The LAN processors which are the interface between the GPROC2 and the tokenring LAN.

S The COMM processor which in conjunction with the TDM interface controller is theinterface between the GPROC2 and the TDM highway.

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GPROC2 module

Figure 2-14 shows a GPROC2 module.

ig.202.rh

ALARM LED (RED)

ACTIVE LED (GREEN)

GREEN LED ON, RED LED =PROCESSOR RUNNING, NO FAILURES

GREEN LED OFF, RED LED ON =PROCESSOR HALTED, OR IN RESET

BOTH LEDS ON = PROCESSOR RUNNING,MODULE IS DISABLED OR OTHER ALARM



DOWN = DISABLE

TTY CONNECTOR(OPTICALLY ISOLATED TEST PORT)

BACKPLANECONNECTOR

Figure 2-14 GPROC2 module

Communication

The GPROC2 communicates with other full-size modules via the MCAP bus, and withhalf-size modules (and modules not on the module shelf) via the BSS serial bus.

The LAPD processor and the TDM interface controller communicate via a high-speedprivate bus. The private bus arbiter is the interface between the MC68040 address/databus and the high-speed private bus.

The parallel port controls output signals to the front panel LEDs, and receives inputsignals (via the register ports) from the backplane. These contain:

S Shelf ID.

S Slot ID.

S Backplane type.

S Backplane revision level.

Memory

The GPROC2 module is equipped with 32 Mbytes of DRAM and 1 Mbyte of EPROM.The EPROM contains the bootstrap code.

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Troubleshootingand diagnostics

A fully buffered TTY maintenance port is available on the front panel, to which a personalcomputer (PC) can be connected. The TTY can be used for monitoring and controllingsoftware when performing maintenance or troubleshooting.

The maintenance port meets the requirements of the EIA RS232C and ITU–TSS V.24specifications.

The GPROC2 runs on-board self-diagnostics during initial power-up and on commandfrom the maintenance TTY connection.

Software

Every GPROC2 is identical in terms of hardware; its function depends upon the softwareloaded into it.

The processor functions for BSC applications are different from those for an RXCDRapplication and are described separately in the following sections.

BSC GPROC2functions

The GPROC2 performs the following processor functions:



S Message Transfer Protocol (MTP).

S Signalling Connection Control Part (SCCP) State Machine (SSM).

S Radio Resource State Machine (RRSM).

S Cell Resource Machine (CRM).


S Connectionless Manager (CLM).

S Radio Subsystem (RSS).

S Operations and Maintenance System (OMS).

S Maintains a copy of the application code for collocated peripheral modules.

GPROC2 task groups and device types

The processor functions can be grouped into six task groups depending on the softwareloaded into a given GPROC2.

When a group of tasks is assigned to a GPROC2, it is considered to be a uniqueGPROC2 device type. The exception to this is the code storage facility processor(CSFP), which is not considered to be a unique device type.

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Table 2-3 shows the device types and task groups:

Table 2-3 GPROC2 device types

GPROC2device

BSCtask groups

BSC/BTSinterface

Type 0 N/A Motorolaproprietary

Type1 Base Site ControlProcessor (BSP)


Motorolaproprietary

Type 2 Base Site ControlProcessor (BSP)


Operations andMaintenanceProcessor (OMP)

Motorolaproprietary

NOTEA code storage facility processor (CSFP) can also beequipped.

RXCDR GPROC2functions

The RXCDR GPROC2 processor functions are similar to the BSC GPROC2s andcomprise:




These processor functions:

S Maintain the switch database for the KSWs.

S Maintain a copy of the application code for collocated peripheral modules.

S Initialize the RXCDR network element.

S Maintain the configuration database.

S Communicate with other network elements via a 64 kbit/s LAPD serial data link.

S Communicate with the OMC via an X.25 link.

S Communicate with the local monitor via a man-machine interface (MMI).

S Communicate with collocated digital modules.

S Handle redundancy between duplicated modules.

S Control operational software downloads to digital highway modules such as MSIs,KSWs, and XCDRs.

Fault manager

The RXCDR FM communicates with the BSS FM function via the optional transcoderBSC link (XBL), a dedicated 64 kbit/s channel.

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Switch manager

The SM:

S Makes connections between the terrestrial links on the A interface (MSC to BSS)and the radio (traffic) channels on the air interface.

S Interacts with the call processing and fault management functions.

S Provides switching functionality for the BSS distributed within the BSC.

Configuration manager

The CM maintains and updates a configuration database which contains all parametersand operational software currently in use.

Changes to the database are restricted to the highest level password protection, due tothe potential for down time caused by incorrect changes to the configuration database.

GPROC2 diagram

Figure 2-15 shows a block diagram of the GPROC2 module:

Figure 2-15 GPROC2 block diagram

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KSW

Purpose

The kiloport switch (KSW) module is a time division digital switch, and:

S Performs timeslot interchange for the active TDM highway.

S Communicates with the controlling GPROC via the MCAP bus.

S At a BSC the KSW routes logical channels dynamically, on a per-call basis.

Requirements

The KSW module fits in the following slots in a BSU or RXU shelf assembly:

S L1 for TDM highway B.

S L27 for TDM highway A.

KSW module

Figure 2-16 shows a KSW module:

ig.205.rh

ALARM LED (RED)

ACTIVE LED (GREEN)



DOWN = DISABLE

BACKPLANECONNECTOR

Figure 2-16 KSW module

GSM-100-333KSW


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Architecture

Refer to the KSW block diagram at the end of this section.

A Motorola MC56001 digital signal processor (DSP) controls the KSW internally. TheDSP:

S Executes port connects between the switchbound TDM highway and the outboundTDM highway.

S Controls the timeslot interchange (TSI) section via the connection RAM controlsection.

S Performs on-line and off-line self diagnostics, including:

– Internal (KSW-related) tests.

– External (TDM bus-related) tests.

S Controls inbound and outbound multiplexers.

S Processes alarms.

S Updates the dynamic pattern registers.

The DSP communicates via the MCAP bus interface logic, the DSP data/address bus,and the serial interface logic.

Timing reference

The timing reference section generates various clock signals, timeslot counts, and framecounts required by other sections of the KSW.

The TDM counters section is an offset counter that adds a fixed offset to the master TDMtimeslot counter.

The GSM counters section contains four separate counters:

S GSM sub-timeslot counter.

S GSM sequence counter.

S GSM timeslot counter.

S GSM frame counter.

SwitchboundTDM interfacestructure

The switchbound TDM highway interface consists of a series of multiplexers that areused to select one of four switchbound highways (numbered 0 to 3). The DSP controlsthe switchbound multiplexers via highway control logic.

Switchbound highway 0 and the outbound highway are split into local and remote parts.

Local

The local switchbound highway 0 and local outbound highways are active when the KSWis communicating with highway interface modules in the same shelf.

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RemoteThe remote switchbound highway 0 and remote outbound highways are active when theKSW is communicating with highway interface modules in remote shelves. Thiseffectively extends the TDM bus to multiple shelves. In the remote case, the KSW sendsand receives TDM data to and from a remote KSW Extender (KSWXR) in the same shelfas the KSW.

The remote KSWXR communicates via fibre optic links with a local type KSWXL in theremote shelf. Local switchbound highway 0 has a delay circuit which adds a fixed 12timeslot delay. This delay is equal to the delay associated with the KSWX extensionoperation, and keeps the local and remote switchbound highways in phase.

The modules on the TDM bus are:

S DRIM.

S MSI.

S XCDR.

S GPROC/GPROC2.

Expansionswitchboundhighways

Expansion switchbound highway 1, 2 and 3 data originates from highway interfacemodules associated with other KSWs. These remote highway interface modules sendand receive data between their respective KSWs. Each KSW re-transmits data receivedon its switchbound highway 0 (local or remote) to other KSWs via dedicated KSWXE fibreoptic links.

Data is received on switchbound highways 1, 2 and 3 of remote KSWs. This architectureresults in each KSW receiving data from all 1024 timeslots of all expansion highwaysconnected to the KSW and retransmitting that data on the 1024 timeslots associated withits own highway interface modules to the other KSWs.

The DSP can write data to any of the four switchbound highways. This allows knownstatic data patterns to be inserted into any switchbound timeslot, and data can be loopedback to switchbound highway 0 from the TSI section, enabling self diagnostics. When theKSW is performing self diagnostics, data is compared at two highway monitors, onebefore the TSI section and one after the TSI section.

Timeslotinterchange (TSI)

The TSI section is the main section of the KSW. It switches data from a given timeslot onone of the four switchbound TDM highways to a given timeslot on the outbound TDMhighway. The TSI section consists of four independent TSI blocks operating in parallel tosupport sub-rate switching. Each TSI block switches 16 kbit/s of data.

If a particular timeslot is associated with a 64 kbit/s channel, then one TSI block containsthe same path connection for that timeslot. Conversely, if a timeslot is associated withtwo 32 kbit/s channels, two TSIs contain a similar path connection and the other twocontain a different path connection. When a timeslot contains four 16 kbit/s channels,each TSI section has a different path connection.

Connection RAMcontrol

The connection RAM control is the interface between the DSP and the TSI section. Theconnection RAM control isolates the DSP from strict timing constraints associated withthe TSI section.

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Three-partyconference (TPC)memory

After traffic data leaves the TSIs, it is sent to either the TSI mode multiplexer, whichselects full-rate or sub-rate switching as required, or to the three party conference (TPC)memory section. The TPC memory operates in real time allowing the KSW to supportany number of three party conference calls.

Fixed/dynamicpattern registers

The fixed/dynamic pattern registers can generate fixed patterns and a variety of dynamicpatterns that generate tones, data sequences, or dynamic test patterns.

Outboundselection MUX

The outbound selection multiplexer selects the correct source data to be sent to theoutbound highway. Although referred to as a multiplexer, this section does not contain aphysical multiplexer. Instead, multiplexing is implemented by connecting the outputs of allthe possible data sources together and selectively enabling one of these sources duringeach timeslot.

After data is sent from the outbound selection multiplexer, a parity bit is added to the databefore it is placed on the outbound TDM highway. Output from the outbound multiplexeris sent directly to the remote outbound highway, but data for the local outbound highwayis sent through a delay circuit to keep the remote and local outbound highways in phase.This delay is 12 timeslots.

Highway monitor

The KSW has two highway monitor sections:

S The switchbound monitor logic which selectively monitors one of the fourswitchbound TDM highways at the inputs of the TSI section.

S The outbound monitor logic which monitors the output of the outbound selectionMUX.

The DSP uses these monitors for monitoring inbound and outbound data on any timeslot.When used in conjunction with the various DSP controlled data sources andfixed/dynamic pattern selection, these monitors allow the KSW to perform extensive selfdiagnostics on the TSI section.

Watchdog timer

The watchdog timer ensures that the DSP is functioning normally. The DSP writes to amemory address that resets the watchdog timer, ensuring that it does not time out. If theDSP stops running, the watchdog timer times out and causes the red LED on the frontpanel to illuminate. An interrupt is also generated and sent to the GPROC via the MCAPbus. If a DSP fails, the TSI section of the KSW still switches data, but no new pathconnections are implemented. This results in existing calls being held while the system isreconfigured around the failed KSW.

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Interrupt logic

The interrupt logic generates two interrupts to the DSP:

S Interrupt-A prompts the DSP to perform certain periodic tasks such as updatingthe watchdog timer and the dynamic pattern registers.

S Interrupt-B, processes alarms such as clock and reference alarms, and parityalarms.

Serial interfacelogic

The serial interface logic supports the TTY interface. This interface is connected to adedicated backplane connector port. This port is a buffered RS232 type. The TTY can beused to control the KSW, monitor KSW operation status, and support KSW diagnostics.

KSW switching

The usable switching capacity of each KSW depends on site hardware and softwareconfigurations because certain modules require a number of ports for their own use. TheKSW is controlled by the local GPROC via the MCAP bus.

Each KSW can switch connections between 1024 inputs and 1024 outputs. However,total switching capacity can be expanded by interconnecting up to three additional KSWsvia KSWXs.

In this configuration, each KSW has the ability to switch data between 2048 (2 x 1024), 3072 (3 x 1024) or 4096 (4 x 1024) 64 kbit/s input ports and its 1024outbound ports. Each KSW has access to all 2, 3 or 4 switchbound highways, althougheach KSW only drives its own 1024 port outbound TDM highway.

KSW in a BSC

KSW switching at the BSC is variable. Physical channel mapping on the A interface isperformed for each call, and at every handover.

KSW in a RXCDR

KSW switching in an RXU shelf is fixed. It provides one to one physical mappingbetween the traffic to and from the BSC and the traffic to and from the MSC.

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KSW diagram

Figure 2-17 shows a block diagram of the KSW module:

Figure 2-17 KSW block diagram

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InterconnectedKSWs

Figure 2-18 shows three interconnected KSWs:

Figure 2-18 KSW interconnection diagram

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MSI

Purpose

The Multiple Serial Interface (MSI) module drives two separate interface lines to and fromthe TDM bus.

MSI module

The MSI module can drive two European 2.048 Mbit/s (E1) data lines.

One of the E1 lines is referred to as group A, the other E1 line is known as group B.

The E1 lines can come from either:

S A balanced-line interconnect board (BIB).

S Type 43 (T43) interconnect board.

The MSI can also extract the clock synchronization from the E1 line data stream.

An RS232 maintenance port, to which a personal computer (PC) can be connected fortesting and debugging, is provided at the top of the BSU or RXU shelf.

Terminology

One wire pair (balanced or unbalanced) equals one E1 serial data stream.

Two E1 serial data streams (transmit and receive) equal one E1 line.

Requirements

The MSI module is fitted in:

S Slots L6 to L17 of the BSU shelf assembly.

S Slots L6 to L10 of the RXU shelf assembly.

An MSI, MSI2, XCDR or GDP must be located in at least one of the BSU locations belowfor BSC initialization purposes.

S Shelf 0 slot 16 (Software communicates via either group A or group B)

S Shelf 0 slot 14 (Software communicates via group A)

S Shelf 1 (if second BSU in BSC) slot 16 (Software communicates via group A)

An RXU initialization uses slot 10 instead of slot 16, and slot 8 instead of slot 14.

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MSI module

Figure 2-19 shows an MSI module:

ALARM LED (RED)

ACTIVE LED (GREEN)



DOWN = DISABLE

BACKPLANECONNECTOR

Figure 2-19 MSI module

General features

The MSI converts signals from the E1 lines from serial format to the parallel format thatthe TDM highway requires, and converts signals transmitted to the E1 lines from parallelto serial. The MSI also provides surge protection and frame alignment.

Each serial line can carry the following to and from the active TDM highway in the BSU:

S One 64 kbit/s channel for synchronization.

S One 64 kbit/s channel for control signalling.

S Thirty 64 kbit/s channels that can each be used as follows:

– Traffic (four 16 kbit/s compressed voice/data channels each).

– Additional control channels.

If all 30 channels are allocated to traffic, 120 traffic channels are possible.

These channels can be placed in any of the 1024 channels on the TDM highway underthe control of the GPROC/GPROC2.

The interfaces provided by MSIs depend upon the transcoding location:

S If transcoding is integrated with the BSC, the MSI provides the BSC to BTSinterface.

S If transcoding is not integrated with the BSC, the MSI provides the RXCDR to BSCand BSC to BTS interfaces.

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Transcodedenvironment

The MSI can support 240 x 16 kbit/s traffic channels in a transcoded environment, asdefined by GSM. To accomplish this, four 16 kbit/s channels are multiplexed into one 64kbit/s timeslot, as shown in the following example:

30 64 kbit/s timeslots of a serial data stream

x 4 Submultiplexed 16 kbit/s traffic channels

x 2 E1 lines

= 240 16 kbit/s traffic channels

Functionaldescription

Refer to the MSI block diagram at the end of this section.

MC68000 processorA Motorola MC68000 processor, operating at 8 MHz, controls:

S The E1 line to TDM interface function.

S A multiplexer that selects the extracted clock to be routed to the GCLK.

The processor reports the following to the controlling GPROC on the MCAP bus:

S Extracted clock failures.

S Frame alignment errors.

S Multiframe alignment errors.

S Bipolar violations.

S CRC4 errors.

S Transmit or receive failures.

EPROMThe EPROM contains 128 kbytes of bootstrap program code. At power-up the bootstrapprogram sends a request message to the GPROC to download the MSI operatingprogram into the SRAM. The SRAM also stores program variables, and can bepermanently saved in EEPROM.

E1 line to TDM interface circuitsThere are two identical E1 lines to TDM interface circuits on the MSI module. Thisfunctional description applies to both.

The TDM interface section converts incoming data from E1 line serial to TDM parallel.The two E1 lines are interleaved onto the TDM bus in groups of two and are spaced outby 32 timeslots. The sequence is as follows:

S Group A timeslot 0, group B timeslot 0.




Outgoing traffic data is converted from parallel to serial. The serial data is then sent tothe E1 line transmitter which converts it to standard E1 line levels. The E1 line data isthen HDB3 and CRC4 encoded. After encoding, the data is routed to the loopbackmultiplexer and to a level converter. The level converter converts from split-phase, TTLlevel unipolar to bipolar.

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Table 2-4 illustrates the E1 line to TDM Interface circuit actions:

Table 2-4 TDM interface circuit actions

Stage Action

1 The system matches impedance and isolates the signal

2 The E1 line receive signal is applied to a level converter

3 The level converter converts the signal from bipolar to split-phase TTL levelunipolar

4 The signal passes to the HDB3 decoder and clock extraction circuit

5 The signal goes through a crosspoint switch for:

S Diagnostic purposes.

S Distance measurements.

S Drop and insert feature utilization.

The impedance matching circuits consist of isolation transformers and Zener diodes,which:

S Impedance match the two sides of the interface.

S Provide secondary surge protection from high voltage transients, such as lightningstrikes, which may come down the E1 lines.

The “drop and insert” feature allows a timeslot coming in on group A, which is meant foranother BTS, to be routed back out on group B.

Clock extraction

The clock extraction section extracts the E1 clocks, to which the entire site (either BTS orBSC) can be synchronized. The two extracted clocks are routed to a multiplexer thatselects which clock signal (if any) is routed to the GCLK.

Frame decoding

The HDB3 and CRC4 decoding section performs frame decoding according to CCITTrecommendation G.704 for digital multiplex equipment.

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MSI diagram

Figure 2-20 shows a block diagram of the MSI module.

Figure 2-20 MSI block diagram

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MSI-2

Purpose

The Multiple Serial Interface (MSI-2) module is the interface between the inter-sitecommunication lines and the TDM highway.

MSI-2 module

The MSI-2 module is a software configured board and has the following drive capability:

S North American 1.544 Mbit/s (T1).

S European 2.048 Mbit/s (E1).

S Japanese 1.544 Mbit/s (JT1).

One of the E1/T1/JT1 lines is referred to as group A, the other E1/T1/JT1 line is knownas group B.

The E1/T1/JT1 lines are connected at the interconnect panel via either:

S A balanced-line interconnect board (BIB).

S Type 43 (T43) interconnect board.

The MSI-2 can also extract the clock synchronization data from the E1/T1/JT1 line datastream in order to phase lock the GCLK to the line.

An RS232 maintenance port, to which a personal computer (PC) can be connected fortesting and debugging, is provided at the top of the BSU or RXU shelf.

Terminology

One wire pair (balanced or unbalanced) equals one E1/T1/JT1 serial data stream.

Two E1/T1/JT1 serial data streams (transmit and receive) equal one E1/T1/JT1 line.

Requirements

The MSI-2 module is fitted in:

S Slots L6 to L17 of the BSU shelf assembly.

S Slots L6 to L10 of the RXU shelf assembly.

An MSI, MSI-2, XCDR or GDP must be located in at least one of the BSU locationsbelow for BSC initialization purposes.





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MSI-2 moduleFigure 2-21 shows an MSI-2 module:

ALARM LED (RED)

ACTIVE LED (GREEN)



DOWN = DISABLE

BACKPLANECONNECTOR

Figure 2-21 MSI-2 module

General featuresThe MSI-2 converts signals from the E1/T1/JT1 lines from serial format to the parallelformat that the TDM highway requires, and converts signals transmitted to the E1/T1/JT1lines from parallel to serial.

E1 Data


S One 64 kbit/s timeslot for synchronization.

S One 64 kbit/s timeslot for control signalling.

S Thirty 64 kbit/s timeslots that can each be used as follows:


– Additional control timeslots.

If all 30 timeslots are allocated to traffic, 120 traffic channels are possible.

T1 Data


S Twenty-four 64 kbit/s timeslots that can each be used as follows:


– Additional control timeslots.

If all 24 timeslots are allocated to traffic, 96 traffic channels are possible.

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Transcodedenvironment (E1)

The MSI-2 can support 240 x 16 kbit/s traffic timeslots in a transcoded environment, asdefined by GSM. To accomplish this, four 16 kbit/s timeslots are multiplexed into one 64kbit/s timeslot, as shown in the following example:


x 4 Submultiplexed 16 kbit/s traffic timeslots

x 2 E1 lines

= 240 16 kbit/s traffic timeslots

Transcodedenvironment(T1/JT1)

The MSI-2 can support 192 x 16 kbit/s traffic timeslots in a transcoded environment, asdefined by GSM. To accomplish this, four 16 kbit/s timeslots are multiplexed into one 64kbit/s timeslot, as shown in the following example:


x 4 Submultiplexed 16 kbit/s traffic timeslots

x 2 T1/JT1 lines

= 192 16 kbit/s traffic timeslots


Refer to the MSI-2 block diagram at the end of this section.

MC68302 processor

A Motorola MC68302 processor, operating at 16.384 MHz, controls:

S The E1/T1/JT1 line to TDM interface function.

S A multiplexer that selects the extracted clock signal to be routed to the GCLK.

The processor reports the following to the controlling GPROC/GPROC2 on the MCAPbus:

S Extracted clock failures.

S Frame alignment errors.

S Multiframe alignment errors.

S Bit errors.

S Transmit or receive failures.

EPROM

The EPROM contains 64 kbytes of bootstrap program code memory, 256 kbytes ofnonvolatile operational code memory (Flash EPROM) and 128 kbytes of volatile programand data memory (SRAM). At power-up the bootstrap program sends a request messageto the GPROC/GPROC2 to download the MSI2’s operating program into the SRAM.

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E1/T1/JT1 line to TDM interface circuits

There are two identical E1/T1/JT1 line to TDM interface circuits on the MSI-2 module.This functional description applies to both.

The TDM interface section converts incoming data from E1/T1/JT1 line from serial toTDM parallel.

E1 lines are interleaved onto the TDM bus in groups of two and are spaced out by 32timeslots. The sequence is as follows:



..........



T1/JT1 lines are interleaved onto the TDM bus in groups of two and are spaced out by 24timeslots. The sequence is as follows:



..........



Outgoing traffic data is converted from parallel to serial. The serial data is then sent tothe E1/T1/JT1 line transmitter which converts it to standard E1/T1/JT1 line levels.

E1/T1/JT1 data uses Alternate Mark Inversion (AMI) format and line encoding/errorchecking can be used.

Table 2-5 gives details on line encoding and error checking available for use with E1, T1and JT1 lines.

Table 2-5 Line encoding & error checking information

Line format Line Encoding Error Checking

E1 HDB3 CRC4

T1/JT1 B8ZS CRC6

After encoding, the data is routed to the loopback multiplexer and to a level converter.The level converter converts from split-phase, TTL level unipolar to bipolar.

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Table 2-6 illustrates the E1/T1/JT1 line to TDM Interface circuit actions:

Table 2-6 Line to TDM interface circuit actions

Stage Action

1 The system matches impedance and isolates the signal

2 The E1/T1/JT1 line receive signal is applied to a level converter

3 The level converter converts the signal from bipolar to split-phase TTL levelunipolar

4 The signal passes to the HDB3 decoder (E1) or B8ZS decoder (T1) and clockextraction circuit

5 The signal goes through a crosspoint switch for:

S Diagnostic purposes.

S Distance measurements.

S Drop and insert feature utilization.

The “drop and insert” feature allows a timeslot coming in on group A, which is meant foranother BTS, to be routed back out on group B.

Clock extraction

The clock extraction section extracts the E1/T1/JT1 clocks, to which the entire site (eitherBTS or BSC) can be synchronized. In the case of T1/JT1, the extracted clock is fedthrough a clock adaptor to convert the 1.544 MHz signal to a 2.048 MHz signal. The twoextracted clocks are routed to a multiplexer that selects which clock signal (if any) isrouted to the GCLK.

Frame decoding

The HDB3 (E1) and B8ZS (T1) decoding section performs frame decoding according toCCITT recommendation G.704 for digital multiplex equipment.

GSM-100-333MSI-2


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MSI-2 diagram

Figure 2-22 shows a block diagram of the MSI-2 module.

Figure 2-22 MSI-2 block diagram

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XCDR

Purpose

The transcoder (XCDR) module:

S Interfaces an E1/T1 serial line to the internal cabinet TDM highway, which is in aparallel format.

S Transcodes thirty 64 kbit/s channels into 120 compressed voice/data channels, inaccordance with the GSM recommendations:

– Channel zero of each E1/T1 line is reserved for synchronization.

– Channel sixteen is reserved for link control signalling.

If the BSC performs the transcoding function, XCDRs interface the BSU or RXU to theMSC in place of MSI modules.

The XCDR transcodes the remaining 30 channels into 120 x 16 kbit/s compressedchannels. The synchronization and signalling channels and the 120 compressedvoice/data channels are applied to the active TDM highway in the BSU or RXU.

These channels can be placed in any of the 1024 channels on the TDM highway undercontrol of the GPROC/GPROC2.

Terminology

One wire pair (balanced or unbalanced) equals one E1/T1 serial data stream.

Two E1/T1 serial data streams (transmit and receive) equal one E1/T1 line.

Requirements

The XCDR module is fitted in:


S Slots L6 to L24 (maximum 19 modules) in the RXU shelf assembly.






GSM-100-333XCDR


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XCDR moduleFigure 2-23 shows an XCDR module:

ALARM LED (RED)

ACTIVE LED (GREEN)



DOWN = DISABLE

BACKPLANECONNECTOR

Figure 2-23 XCDR module

Brief description

Refer to the XCDR block diagram at the end of this section.

The XCDR module contains a digital signal processor (DSP) unit that performs:




The speech transcoder bi-directionally interfaces the 64 kbit/s E1/T1 line in the landnetwork to the 13 kbit/s vocoder format used on the air interface.

Signalling channels are passed straight through the transcoder.

Architecture

The XCDR module contains the following major systems:

S Processor system.

S DSP system.

S Line interface system.

S Switching system.

S MCAP interface system.

S TDM interface system.

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ProcessorThe main component of the processor system is the microcontroller unit (MCU), which:

S Controls and interfaces the five major systems (listed below) on the XCDRmodule.



S A watchdog timer.

S 16 kbytes of RAM.

S 64 kbytes of EEPROM.

S 1 kbyte of dual port RAM.



DSPThe DSP system consists of:

S 30 mask programmed DSP units.

S A subrate multiplexer.

S A serial port timing generator.

S A parallel host interface.

Each DSP unit has its own internal memory (2 kbytes of RAM and 12 kbytes of ROM)and serial interface. The DSP units are arranged into four banks (three banks of eightand one bank of six).

The serial port timing generator keeps all DSPs synchronized. The parallel host interfaceis used to transfer status and control data between the MCU and DSP units.

Subratemultiplexermodes

The subrate multiplexer can operate in three modes. Table 2-7 lists the modes anddetails what happens.

Table 2-7 Subrate multiplexer modes

Mode Functions

DSP loop back The DSP output is logically connected to its input, enabling a selftest function.

16 kbytesmultiplexed

Each DSP receives 16 bits of data:

The first 8 bits are from a 16 kbytes/s subrate channel from theTDM highway Two bits at a time are expanded into PCM.The last eight bits are from the E1/T1 line data stream. The PCMis processed into 16 kbit/s TRAU frames.

64 kbytesnon-multiplexed


The first eight bits are from the TDM bus, and are passed to theE1/T1 line.The second eight bits are from the E1/T1 line, and are passed tothe TDM bus.

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Line interface

The line interface system performs:


S Secondary surge protection from high voltage transients (such as lightning strikes),which may come down the E1/T1 lines.

The impedance matching circuit consists of isolation transformers and Zener diodes.

After impedance matching and isolation the E1/T1 line receive signal is applied to a levelconverter that converts the signal from bipolar to split-phase TTL level unipolar.

After level conversion the received E1/T1 line data is sent to the clock extraction circuitand a HDB3 decoder. The clock extraction section extracts the E1/T1 clock to which allBSU/RXU shelves can be synchronized. The HDB3/CRC4 decoding section performsframe decoding law CCITT recommendation G.704 for digital multiplex equipment. Trafficis then routed to the switching system.

Switching

The switching system consist of two separate digital switches, each performing adifferent function.

S The first switch has the E1/T1 line data stream and TDM data streams passingthrough it.

S The second switch is used as an interface between the processor section and theframer of the line interface system.

MCAP interface

The MCAP interface system supports two redundant MCAP buses to the XCDR. TheXCDR communicates with the GPROC in the same manner as all other full-sizemodules.

TDM interface


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XCDR diagram

Figure 2-24 shows a block diagram of the XCDR module:

Figure 2-24 XCDR block diagram

GSM-100-333GDP


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GDP

Purpose

The Generic DSP Processor (GDP) module can be used as an enhanced XCDR, withadditional features, including Enhanced Full Rate (EFR) speech and uplink/downlinkaudio volume control. The GDP DSP firmware is downloadable whereas the XCDRDSP firmware is mask programmed.

The description in the following pages assumes the GDP is being used as an enhancedXCDR.

The GDP module can only be used with systems running GSR3 or laterreleases, as this contains the necessary software support to allow operation.

For a BSC which will operate the EFR speech option, all transcoder boards itconnects to must be GDP, not XCDR.

The GDP has two configured types, one for E1 serial line use and one for T1serial line use. Each GDP type has a different framer/transceiver withaccompanying crystal oscillator, and two associated resistors. This means thata GDP used for E1 serial line use cannot be used for T1, and a GDP used forT1 serial line use cannot be used for E1.

NOTE

The GDP module:

S Provides the transcoding interface to the MSC. The GDP module is located at theRXCDR, or at a BSC where transcoding is integrated within the BSC.

S Interfaces an E1/T1 serial line to the internal cabinet TDM highway, which is in aparallel format.

S Transcodes thirty E1(twenty-four T1) 64 kbit/s channels, inserting them as part of120 E1 (96 T1) compressed voice/data channels, in accordance with the GSMrecommendations:

– Channel zero of each E1 line is reserved for synchronization.

– Channel sixteen of each E1 line is reserved for link control signalling.

– The 30 remaining E1 channels are transcoded.

Each GDP supports thirty compressed voice and data channels, using 15 DSPs. Thesechannels, and the synchronization and link control signalling channels, can be placed inany of the 1024 channels on the TDM highway under control of the GPROC/GPROC2.

Terminology

One wire pair (balanced or unbalanced) equals one E1/T1 serial data stream.

Two E1/T1 serial data streams (transmit and receive) equal one E1/T1 line.

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RequirementsThe GDP module is fitted in:


S Slots L6 to L24 (maximum 19 modules) in the RXU shelf assembly.






GDP moduleFigure 2-25 shows a GDP module:

ALARM LED (RED)

ACTIVE LED (GREEN)



DOWN = DISABLE

BACKPLANECONNECTOR

Figure 2-25 GDP module

Brief descriptionRefer to the GDP block diagram at the end of this section.

The GDP module contains a digital signal processor (DSP) unit that performs:




The speech transcoder bi-directionally interfaces the 64 kbit/s E1/T1 line in the landnetwork to the 13 kbit/s vocoder format used on the air interface.

Signalling channels are passed straight through the transcoder.

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Architecture

The GDP module contains the following major systems:

S MCU subsystem.

S DSP subsystem.

S E1/T1 Line interface.

S Digital crosspoint switch.

S MCAP interface.

S TDM interface.

MCU subsystem

The main component of the processor system is the microcontroller unit (MCU), which:

S Controls and interfaces the other major systems on the GDP module.



S A watchdog timer.

S 256 kbytes of RAM.

S 512 kbytes of Flash EPROM.

S 1 kbyte of dual port RAM for MCAP messaging.

S 1 kbyte of dual port RAM for TDM interface.



DSP subsystem

The DSP subsystem consists of 15 identical blocks each with:

S One 80 MHz DSP processor

S 128k x 24 dedicated SRAM for program and data storage.

S Two Enhanced Synchronous Serial Interfaces (ESSIs).

S On-board phase-locked loops to multiply input from subsystem 16.384 MHz clock.

DSP firmware is downloadable. The MCU uses one of its Serial CommunicationsControllers (SCC1) to connect to the SCI of all DSPs, for control, monitoring anddownload purposes. All the ESSI signals to the DSPs are buffered by tristate devices.

Subratemultiplexermodes

There is a subrate multiplexer within the serial data formatter, converting data from theDSP subsystem ESSI format to the digital crosspoint switch ST bus format.

The subrate multiplexer can operate in three modes.

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Table 2-8 lists the subrate multiplexer modes and shows what happens:

Table 2-8 Multiplexer modes

Mode Functions

DSP loop backThe DSP output is logically connected to its input, enabling a selftest function.

16 kbytesmultiplexed


The first 8 bits are from a 16 kbytes/s subrate channel from theTDM highway Two bits at a time are expanded into PCM.The last eight bits are from the E1/T1 line data stream. The PCMis processed into 16 kbit/s TRAU frames.

64 kbytesnon-multiplexed


The first eight bits are from the TDM bus, and are passed to theE1/T1 line.The second eight bits are from the E1/T1 line, and are passed tothe TDM bus.

E1/T1 Lineinterface

The line interface system performs:


S Secondary surge protection from high voltage transients (such as lightning strikes),which may come down the E1/T1 lines.

The impedance matching circuit consists of isolation transformers and Zener diodes.

After impedance matching and isolation the E1/T1 line receive signal is applied to a levelconverter that converts the signal from bipolar to split-phase TTL level unipolar.

After level conversion the received E1/T1 line data is sent to the clock extraction circuitand a decoder. The clock extraction section extracts the E1/T1 clock to which allBSU/RXU shelves can be synchronized. The decoding section performs frame decodinglaw CCITT recommendation G.704 for digital multiplex equipment. Traffic is then routedto the switching system.

CRC-4 Errorchecking

A GDP module configured for use with an E1 serial line supports CRC-4 error checking.This is set by default to the on state 0. All associated switches (MSCs) must also haveCRC-4 error checking set to the on state, so allowing communication across theA-interface

To check if the GDP board CRC-4 state is set, use the MMS_config_type CM databasecommand.

disp_element MMS_config_type <location>

Refer to Technical Description: BSS Command Reference (GSM-100-321) forinformation on the above CM database command.

To ensure the correct setting of CRC-4 error checking at the MSC, consult the vendorsupplied equipment manual.

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Digitalcrosspointswitch

The switching system consist of a digital switch, which performs the following functions:.

S Transmission of E1/T1 line data stream and TDM data streams.

S Connection between the processor section and the E1/T1 line interface system.

MCAP interface

The MCAP interface system supports two redundant MCAP buses to the GDP. TheGDP communicates with the GPROC2 in the same manner as all other full-size modules.

TDM interface


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GDP diagram

Figure 2-26 shows a block diagram of the GDP module:

Figure 2-26 GDP block diagram

GSM-100-333NVM board description


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NVM board description

Purpose of theNVM board

The NVM board provides the BSC or RXCDR with an improved recovery facility followinga total power loss.

In current BSC and RXCDR systems, a total power loss causes configuration data heldat the site to be lost. This data is normally recovered by downloading from the OMC-Ronce power is restored.

If an NVM board is installed, data is retrieved from the NVM board rather than from theOMC-R during recovery from a total power loss.

Mechanicaldesign

The NVM board is a full height digital board, designed for installation in the BSU cage 0of a BSC, or the RXU cage 0 of the RXCDR.

Figure 2-27 shows the NVM board in detail.

BACKPLANECONNECTOR

FRONT PANEL

NVM BOARDSTATUS LEDs

NVM BOARDRESET/DISABLE

SWITCH

PCMCIA CARDSTATUS LEDs

PCMCIA CARDSLOTS

PCMCIA CARD SWAPSWITCH

EJECT BUTTON

Figure 2-27 The NVM board

The PCMCIA cards used with the NVM board are NOT the same type as usedin M-Cell equipment.

NOTE

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Software ascertains if the NVM board is present during RAM initialization of a BSC orRXCDR site. If the board is present, software begins loading objects to the NVM board. Ifthe board is not present then the software continues to check for its existence. A lowpriority software task is responsible for loading the NVM board with a copy of the BSSsoftware objects that currently reside on the master GPROC. The transfer is achieved viathe MCAP bus.

Two synchronized copies of the database are stored. This ensures that if a power outageoccurs during loading to the NVM board, then a usable copy of the database is stillavailable. Only one copy is updated at a time, and is marked as the current version whenthe update is complete.

The object list and the database on the NVM board and the master GPROC are auditedat regular intervals. If any differences between these objects on the NVM board and themaster GPROC are detected, the NVM board is updated automatically from the masterGPROC.

During ROM initialization, the NVM board is used as a BSS software source only if allGPROCs at the site have no BSS software (for example, after restoration of powerfollowing a power failure). If the NVM board is not present, or fails during BSS softwarecrossload to the master GPROC, ROM initialization continues as normal.

The NVM board can only be used with systems running GSR5 or laterreleases. These releases contain the necessary software support to allowoperation.

NOTE

Interrogating theNVM board

Object header information of the objects stored on the NVM board can be viewed usingthe following EMON command from an LMT at the master GPROC:

nvm objects

Table 2-9 shows the possible output string results of using the above EMON command,depending on the configuration of the BSU or RXU cage.

Table 2-9 EMON command results, depending on configuration

Configuration Output String

NVMpresent?

PCMCIA cardpresent?

BSS codeobjects

present?

No – – NVM Board not present ornot available

Yes No – PCMCIA Card not presentor not available

Yes Yes No No load informationavailable

Yes Yes Yes Object headers of objectspresent on the PCMCIA card are

displayed.

GSM-100-333Half-size modules


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Half-size modules

Introduction

Half-size digital modules provide interface extension for the full-size modules, enablingunit interconnection (for example BSU to BSU, RXU to RXU) and external alarmconnection.

The modules fit into slots in the upper card cage of a BSU or RXU shelf. The slots arenumbered, right to left, from U0 to U28.

The following sections describe the half-size modules that can be mounted in a BSU orRXU.

The quantity fitted depends upon the specific configuration of the BSU or RXU.

The modules

The following half-size modules are mounted in a BSU or RXU shelf:

Do not fit a digital module in any equipment for which it is not suitable.CAUTION

S Battery back up board (BBBX).

S Clock extender (CLKX).

S Digital radio interface extender (DRIX).

S Kiloport switch extender (KSWX).

S Double kiloport switch extender (DSWX).

S Local area network extender (LANX).

S Parallel interface extender (PIX).

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BBBX

Purpose

If the main supply fails, the battery back up board (BBBX) provides a back up supply of+5 V at 8 A.

The +5 V DRAM battery back up supply maintains power to the:

S Optical circuit on the LANX module.

S DRAM memory located on the GPROC.

Normally, the PSMs supply +5 V DRAM voltage to the BSU or RXU backplane. If thePSMs fail to deliver this due to cabinet input power failure or PSM failure, the BBBXconverts an external back up supply to a fused +5 V DRAM supply.

Requirements

The BBBX module is normally positioned in slots U16, U17 or U18 of the BSU or RXUshelf assembly, but can be fitted in any spare half-size card slot.

All connections are made at the front of the module.

BBBX module

Figure 2-28 shows a BBBX module:

CONNECTOR PC1 IS CABLED TO A12ON THE DIGITAL CAGE BACKPLANE

CONNECTOR PC2 IS CABLED TO TOPOF CABINET FOR CONNECTION TO PC4

ON THE DAB AND BATT BACKUP

Figure 2-28 BBBX module

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BBBX diagram

Figure 2-29 shows a block diagram of the BBBX:

Figure 2-29 BBBX block diagram

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CLKX

Purpose

Laser radiation could be emitted when fibre optic cables are disconnected.Do not look directly into beams with or without the use of any optical aids.Radiation can come from either the data in/out connectors or unterminatedfibre optic cables connected to data in/out connectors.

WARNING

The clock extender (CLKX) module optically distributes the clock and reference signalsgenerated by the GCLK in the parent shelf to all other shelves at a site.

The extended clock signals are received by a KSWXL in the remote BSU/RXU.

RequirementsThe CLKX module is fitted in slots U2 to U7 of the BSU or RXU shelf assembly.

A maximum of six remote shelves can be supported.

In a multishelf site, the shelf containing the GCLK must also receive its clocks via aCLKX and a KSWXL to maintain synchronization integrity.

Fibre optic cables extending clock reference signals, from the parent shelf to all othershelves at a site, must be of the same length to maintain site synchronization integrity.

GCLK moduleFigure 2-30 shows a CLKX module:

FIBRE OPTIC CLOCKOUTPUTS TO LOCAL

KSWXsBACKPLANECONNECTOR

Figure 2-30 CLKX module

GSM-100-333CLKX


GMR-0468P02901W07-O

CLKX diagram

Figure 2-31 shows a block diagram of the CLKX module:

Figure 2-31 CLKX block diagram

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DSWX

Purpose

This section provides information relevant to DSWX performance when themodule is installed retrospectively in a BSSC2 installation.

NOTE

The DSWX uses an LED as the fibre optic light source, not a laser.The DSWX fibre optics are therefore not hazardous. Since othermodules in the cabinet may emit hazardous laser radiation when fibreoptic cables are disconnected, to eliminate the possibility of mistakesdo not look directly into any beams with or without the use of opticalaids. Radiation can come from either the data in/out connectors orunterminated fibre optic cables connected to data in/out connectors.

WARNING

The double kiloport switch extender (DSWX) module extends the 1024/2048 ports of aKSW/DSW2 respectively, in one BSU or RXU type cage to the TDM highways in anotherBSU or RXU type cage. It is used when the number of required peripherals exceeds thecapacity of a BSU or RXU shelf.

S A DSWX in expansion mode (DSWXE) connects the KSW/DSW2 to theKSW/DSW2 in a another BSU or RXU type cage.

S A DSWX in remote transmit mode (DSWXR) accepts the highway data from aKSW/DSW2 and sends it to a local receiver.

S A DSWX in local receive mode (DSWXL) accepts the highway data and drives theTDM bus in the local BSU or RXU, and also provides a clock reference inmultishelf configurations.

Although a KSW/DSW2 is located in a particular BSU/RXU, it is logically connected tothe TDM bus in that BSU/RXU and to the TDM buses in up to 13 other shelves, which itcan be driving. For each BSU or RXU that a KSW/DSW2 is driving, two KSWXs/DSWXsare required; one acting as a remote transmitter attached to the KSW/DSW2, the otheras a local receiver attached to the TDM highway in the remote shelf.

Requirements

The DSWX is fitted in slots U0 to U9 and slots U21 to U28 of the BSU or RXU type shelfassembly, with the following limitations:

S DSWXR must be fitted in slots U2 to U6 and U24 to U28.

S DSWXL must be fitted in slots U0 and U1.

S DSWXE must be fitted in slots U7 to U9 and U21 to U23.

The fibre optic cables used to extend/expand the TDM highway from one BSU/RXU toanother BSU/RXU must be of the same length. This allows correct operation of the TDMhighway to be maintained.

GSM-100-333DSWX


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DSWX module

Figure 2-32 DSWX module

Fibre opticinput from

clock

Fibre opticoutput to another

DSWX/KSWX

Red/GreenLEDs show

alarm/normalstatus RESET/DISABLE

switch

Fibre optic inputfrom another

DSWX/KSWX

Brief descriptionThe DSWX is a multi-function module responsible for optically transmitting and receivingall TDM bus information between shelves, and for distributing the TDM bus informationand TDM clock and reference pulses in the BSS shelves.

The DSWX is required for all installations if it is used for clock distribution. In a BSSC2installation using more than one cabinet, it also extends the 1024 ports of a KSW/DSW2to other shelves and/or interconnects up to four KSW/DSW2 modules via fibre opticcable. In a TDM switch highway extended between two module shelves, a KSWX/DSWXmodule is required in each shelf.

There are three modes in which the DSWX may operate. These modes are dependenton where in the shelf the DSWX module is placed. The three modes are:

Expansion (DSWXE)In a BSSC2 installation, expands the standard or double rate TDM bus between up tofour KSW/DSW2 respectively to expand switching capacity. DSWXE modules areoptically connected to other DSWXE modules.

Remote (DSWXR)In a BSSC2 installation, extends the standard or double rate TDM bus to a shelf with noKSW/TSW/DSW2. This allows a KSW/DSW2 to switch data to and from highwayinterface modules (MSIs and DRIMs) in a shelf with no KSW/DSW2. DSWXR modulesare optically connected to DSWXL modules.

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Local (DSWXL)

The DSWXL distributes the TDM bus within a shelf and this is received optically from aDSWXR/KSWXR in another shelf, and distributes clock and reference signals receivedfrom a CLKX. DSWXL modules are optically connected to CLKX modules and can alsobe connected to DSWXR/KSWXR modules.

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DSWX Blockdiagram

Figure 2-33 shows a block diagram of the DSWX.

Figure 2-33 Block diagram of DSWX

TDM RXData OpticalI/F. FromanotherDSWX orKSWX

TDM TXdata OpticalI/F. To anotherDSWX orKSWX

ClockOpticalInterface

Serial toParallel

Parallelto Serial

Decode10B/9B

Encode9B/10B

ElasticBuffer backplane

interface

backplaneinterface

FrameCounter/TDMControlLogic

10

10

9

9

9

9

9

TDM Data Path

OE

CLK

Recovered Clock

Writ

e

Rea

dR

ead

TDM_O

TDM_I

RMTENA

TDM Clock Select

CLK16A

REF125A

CLK16B

REF125B

Clock/ReferenceSelectClock Multiply

Front Panel Interface

Clock Recovery and

Clock/EncodedReferenceRecovery

ReferenceDecode

Clock/ReferenceDistributionbackplanebuffer

ClockControlLogic/

Clock Fail

Clock Fail

Clock/Data Status

16 MHz clock (board)Encoded reference (board)

16 MHz clock (mate)Encoded reference (mate)

to MA

TE

TDM VLTN

MRQ (mate)

MRQ (board)FLT (mate)

FLT (board)

System ClockSystem

DIAG StatusLEDControlLogic

REF125*REF60*REF612*

CLK16Ux

REFxxxU

from M

AT

E

Serial BusInterface SLOTID7

Diagnostics

DiagnosticTest/ControlLogic

9

Diag Data InDiag Control

SER–BSER–A

Status0Status1Control0Control1

RevLevelBoard ID

7777

34

Serial

Reset

Add

r

Reset

Reset

Toggle

Reset

Reset

backplanebuffer

backplanebuffer

Add

r

Switch

Diag Data Lpbk9

Distribution

and

TD

M C

lock

16

TD

M C

lock

32

TD

M C

lock

64

TD

M R

ef 1

25

Sync

Dia

gD

ata

Out

9

Status0

Status0

Status0

Status1

Status0

Encoded Clock

Reference

SELECT A/B

LEDs

green

red

xclk pres

KSW pres

MODE1–02

MODE1

MODE1

CLK16Lx

REFxxxL

JTAG port4

ControllerBus

GSM-100-333 KSWX


68P02901W07-O

GMR-04

2–77

KSWX

Purpose

Possible laser radiation when fibre optic cables are disconnected. Do not lookdirectly into beams with or without the use of any optical aids. Radiation cancome from either the data in/out connectors or unterminated fibre optic cablesconnected to data in/out connectors.

WARNING

The kiloport switch extender (KSWX) module extends the 1024 ports of a KSW in oneBSU or RXU to the TDM highways in another BSU or RXU. It is used when the numberof required peripherals exceeds the capacity of a BSU or RXU shelf.

S A KSWX in expansion mode (KSWXE) connects the KSW to the KSW in a remoteBSU or RXU.

S A KSWX in remote transmit mode (KSWXR) accepts the highway data from aKSW and sends it to a local receiver.

S A KSWX in local receive mode (KSWXL) accepts the highway data and drives theTDM bus in the local BSU or RXU, and also provides a clock reference inmultishelf configurations.

Although a KSW is located in a particular BSU/RXU, it is logically connected to the TDMbus in that BSU/RXU and to the TDM buses in up to 13 other shelves, which it can bedriving. For each BSU or RXU that a KSW is driving, two KSWXs are required; oneacting as a remote transmitter attached to the KSW, the other as a local receiverattached to the TDM highway in the remote shelf.

Requirements

The KSWX is fitted in slots U0 to U9 and slots U21 to U28 of the BSU or RXU shelfassembly, with the following limitations:

S KSWXR must be fitted in slots U2 to U6 and U24 to U28.

S KSWXL must be fitted in slots U0 and U1.

S KSWXE must be fitted in slots U7 to U9 and U21 to U23.

The fibre optic cables used to extend/expand the TDM highway from one BSU/RXU toanother BSU/RXU must be of the same length. This allows correct operation of the TDMhighway to be maintained.

GSM-100-333KSWX


GMR-0468P02901W07-O

KSWX moduleFigure 2-34 shows a typical KSWX module:

FIBRE OPTIC INPUTFROM ANOTHER KSWX

FIBRE OPTIC INPUTFROM CLKX

FIBRE OPTIC OUTPUTTO ANOTHER KSWX

ACTIVE/ALARM LED

RESET/DISABLESWITCH

BACKPLANECONNECTOR

Figure 2-34 KSWX module

Brief descriptionThe KSWX is a multi-function module responsible for optically transmitting all TDM businformation between shelves, and for distributing the TDM bus information and TDMclock and reference pulses in the BSS shelves.

The KSWX is required when a site has more than one cabinet. It extends the 1024 portsof a KSW to other shelves and/or interconnects up to four KSW modules via fibre opticcable. In a TDM switch highway extended between two module shelves, a KSWX moduleis required in each shelf.

There are three modes in which the KSWX may operate. These modes are dependenton where in the shelf the KSWX module is placed. The three modes are:

Expansion (KSWXE)Expands the TDM bus between up to four KSW to expand switching capacity. KSWXEmodules are optically connected to other KSWXE modules.

Remote (KSWXR)Extends the TDM bus to a shelf with no KSW/TSW. This allows a KSW to switch data toand from highway interface modules (MSIs and DRIMs) in a shelf with no KSW. KSWXRmodules are optically connected to KSWXL modules.

Local (KSWXL)The KSWXL distributes the TDM bus within a shelf and this is received optically from aKSWXR in another shelf, and distributes clock and reference signals received from aCLKX. KSWXL modules are optically connected to CLKX modules and can also beconnected to KSWXR modules.

GSM-100-333 KSWX


68P02901W07-O

GMR-04

2–79

KSWX diagram

Figure 2-35 shows a block diagram of the KSWX module:

Figure 2-35 KSWX block diagram

GSM-100-333LANX


GMR-0468P02901W07-O

LANX

Purpose

Possible laser radiation when fibre optic cables are disconnected. Do not lookdirectly into beams with or without the use of any optical aids. Radiation cancome from either the data in/out connectors or unterminated cablesconnected to data in/out connectors.

WARNING

The local area network extender (LANX) module is required for each BSU or RXU shelf.The LANX:

S Connects one of the LAN interfaces of each GPROC/GPROC2 in a BSU or RXUshelf to the local shelf token ring LAN via the shelf backplane.

S Allows optical LAN extension from one BSU or RXU to another.

S Switches empty module slots or faulty GPROC/GPROC2s out of the LAN.

S Sets the cage (BSU or RXU shelf) ID.

S Performs on-board MCAP bus arbitration.

S Provides shelf active/standby redundant LAN control.

Shelf to shelf extension is via a LANX module in each shelf, interconnected with fibreoptic cabling.

The LANX supports up to eight GPROC/GPROC2s on the local LAN in one BSU or RXUshelf.

Requirements

LANX modules must be fitted in slots U19 and U20 of the BSU or RXU shelf assembly atall times.

A sixteen position (0 to F hex) rotary switch on the LANX module sets the BSU or RXULAN address (shelf ID number).

GSM-100-333 LANX


68P02901W07-O

GMR-04

2–81

LANX moduleFigure 2-36 shows a LANX module:

FIBRE OPTIC INPUT FROMANOTHER LANX IN ANOTHER

SHELF AT THE SITE

FIBRE OPTIC OUTPUT TOANOTHER LANX IN ANOTHER

SHELF AT THE SITE

ROTARY SWITCH FORSETTING SHELF ID

NUMBER

BACKPLANECONNECTOR

Figure 2-36 LANX module

Brief descriptionRefer to the block diagram at the end of this section.

Each LANX receives LAN data from another shelf via optical fibre cables and:

1. Routes the LAN data to the first GPROC/GPROC2.

2. Receives the LAN data back from the first GPROC/GPROC2.

3. Routes the LAN data to the second GPROC/GPROC2.

4. Receives the LAN data back from the second GPROC/GPROC2.

And so on until all GPROC/GPROC2s in the shelf have received the LAN data.

The LAN data received back from the last GPROC/GPROC2 in the shelf is sent via fibreoptics to the next shelf (if LAN extension is used). If a GPROC/GPROC2 is not present inthe shelf or has failed, the LANX bypasses it and passes the LAN data to the nextGPROC/GPROC2.

Local LAN dataswitching

Each GPROC/GPROC2 using the LANX uses the following signals to route LAN data:

S LAN DATA IN.

S LAN DATA OUT.

S INSERT.

GSM-100-333LANX


GMR-0468P02901W07-O

GPROC/GPROC2 present

When the GPROC/GPROC2 is present and operating with no faults, the INSERT line islogic 1, causing LANX multiplexers to switch the GPROC/GPROC2 signals as follows:

S LAN DATA OUT signal of this GPROC/GPROC2 is switched to the LAN DATA INsignal of the next GPROC/GPROC2 slot. In the case of shelf extension, the LANDATA OUT signal of GPROC/GPROC2 7 is switched to the fibre optic transmitterstage.

S LAN DATA OUT signal from the previous GPROC/GPROC2 slot is switched to theLAN DATA IN signal of this GPROC/GPROC2. In the case of shelf extension, thesignal from the fibre optic receiver stage is switched to the LAN DATA IN signal ofGPROC/GPROC2 0.

GPROC/GPROC2 not present

If the GPROC/GPROC2 is not present or operating with faults, the INSERT line is logic 0causing LANX multiplexers to switch the GPROC/GPROC2 signals as follows:

S LAN DATA OUT signal of this GPROC/GPROC2 is switched (looped back) to theLAN DATA IN signal of the same GPROC/GPROC2.

S LAN DATA OUT signal of the previous GPROC/GPROC2 is switched to the LANDATA IN signal of the next GPROC/GPROC2.

This removes the GPROC/GPROC2 from the LAN ring, and subsequent LAN databypasses the GPROC/GPROC2.

Extended LANdata switching

In configurations of more than one shelf, the LANX allows the local LAN data to beextended to another shelf via optical fibre connected to a LANX in the other shelf.

Any of the GPROC/GPROC2s in the shelf controls local LAN data switching betweenshelves. Control is via the serial bus connected to the LANX signal, LANLOCAL/EXTERNAL.

Logic 1

A logic 1 on the LAN LOCAL/EXTERNAL line causes multiplexers on the LANX to switchsignals as follows:

S LAN DATA IN signal of GPROC/GPROC2 7 is switched to the fibre optictransmitter stage. The optical transmitter provides a Tx data signal, consisting ofthe local LAN data of this shelf, which is transmitted via fibre optic to a LANX inanother shelf.

S Rx data signal from the fibre optic receiver stage is switched to the LAN DATAOUT signal of GPROC/GPROC2 0.

Logic 0

A logic 0 on the LAN LOCAL/EXTERNAL line causes multiplexers on the LANX to switchsignals from LAN DATA IN signal of GPROC/GPROC2 7 is switched to the LAN DATAOUT signal of GPROC/GPROC2 0.

This bypasses the LANX fibre optic transmitter and receiver stages consequentlydisabling local LAN extension to another shelf.

Power loss

If the local LANX loses dc power, the Rx data signal from the fibre optic receiver stage isswitched (looped back) to the optical transmitter, providing a Tx data signal via fibre opticto the LANX in another shelf.

GSM-100-333 LANX


68P02901W07-O

GMR-04

2–83

Bus arbiter

The LANX bus arbiter decides which GPROC/GPROC2 is allowed to write data to theMCAP bus via the LAN DATA IN line. Each GPROC/GPROC2, 0 to 7, can assert itsrespective BUS REQUEST line. The bus arbiter starts by monitoring GPROC/GPROC20 slot.

If GPROC/GPROC2 0 has an active BUS REQUEST line, the bus arbiter asserts theGPROC/GPROC2 0 BUS GRANT line. GPROC/GPROC2 0 seizes the MCAP bus andwrites data to the bus. When GPROC/GPROC2 0 has finished writing data to the MCAPbus, it deactivates the BUS REQUEST line. This frees the bus and the bus arbiteractivates the BUS GRANT line of the next higher numbered GPROC/GPROC2 with anactive BUS REQUEST line.

Redundant LAN

If the redundant GPROC/GPROC2 LAN interface is used, a redundant LANX is required.Each LANX has two serial bus interfaces for communications with theGPROC/GPROC2. The selection of which LAN interface is to be used is determined bythe GPROC/GPROC2.

Shelf ID

The shelf ID is a unique hexadecimal number assigned to each BSU or RXU shelf. TheLANX is fitted with a 16-position (hexadecimal encoded) rotary switch, which defines theshelf ID number of the shelf containing the LANX. The shelf ID is read by theGPROC/GPROC2 via the serial bus interface. The ID number is used by the BSSsoftware when configuring the BSU or RXU.

No two shelves at a site can have the same shelf ID. When a redundant LANX is presentin a shelf, it must have the same ID number as the primary LANX.

The following rules apply:

S A BSU shelf in a BSC is numbered 0 to D (hexadecimal).

S An RXU shelf in a BSC is numbered 0 or 1 (hexadecimal).

Front panel

The front panel of the LANX incorporates:

S Rx fibre optic input connector. This connects to the Tx fibre optic output of a LANXin another shelf.

S Tx fibre optic output connector. This connects to the Rx fibre optic input of a LANXin another shelf.

S Rotary switch for setting the BSU/RXU shelf ID number.

GSM-100-333LANX


GMR-0468P02901W07-O

LANX diagram

Figure 2-37 shows a block diagram of the LANX module:

Figure 2-37 LANX block diagram

GSM-100-333 PIX


68P02901W07-O

GMR-04

2–85

PIX

Overview

Refer to the block diagram in Figure 2-39.

The parallel interface extender (PIX) module provides:

S An input/output (I/O) interface for customer site equipment.

S The interface logic between the GPROC and external customer alarm devicessuch as relays and switches.

S Eight optically isolated inputs and four relay outputs.

Requirements

PIX modules can be fitted in the following slots of a BSU or RXU shelf assembly:

S BSSC2:

S BSSC:

slots U16, 17 and U18.

slots U15 and U16.

PIX module

Figure 2-38 shows a PIX module:

ig.240.rh

ALARM LED (GREEN)ON = NO ALARMS

OFF = CUSTOMERALARM DETECTED

CONNECTOR ISCABLED TO TOP OF

CABINET FORCONNECTION TOCUSTOMER SITE

EQUIPMENT

BACKPLANECONNECTOR

Figure 2-38 PIX module

GSM-100-333PIX


GMR-0468P02901W07-O

PIX diagram

Figure 2-39 shows a block diagram of the PIX module:

Figure 2-39 PIX block diagram


68P02901W07-O

GMR-04

i

Chapter 3

Power, fans and interconnections

GSM-100-333


GMR-0468P02901W07-O

GSM-100-333


68P02901W07-O

GMR-04

iii

Chapter 3Power, fans and interconnections i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Overview 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . In this chapter 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .








GSM-100-333


GMR-0468P02901W07-O









68P02901W07-O

GMR-04

3–1

Overview

Introduction

This chapter describes the following cabinet equipment:

S Power supplies.

– Digital power supply module (DPSM).

– Enhanced power supply module (EPSM).

– Integrated power supply module (IPSM).

– Power converter unit (PCU).

S Power distribution units (PDUs).

– Distribution alarm board (DAB).

– Power alarm board (PAB).

– Power distribution board (PDB) and alarm interface board (AIB).

– Circuit breaker panel.

S Fan cooling systems.

– Fan power converter unit (FPCU).

S Interconnect panels.

In this chapter

Do not fit equipment in any cabinet for which it is not suitable.CAUTION

All information given is valid for GSM, extended GSM (EGSM), DCS1800 and PCS1900systems unless otherwise indicated.

GSM-100-333Power supply modules


GMR-0468P02901W07-O

Power supply modules

Introduction

Ensure that the correct power supply module is fitted for the input used.CAUTION

There are three compartments at the base of the BSU/RXU shelf assembly with slide-inmountings for plug-in power supply modules (PSMs):

These cabinets ... Use this type of power supply ...

BSSC Digital power supply modules (DPSMs)

Positive earth BSSC2 Integrated power supply modules (IPSMs)

Negative earth BSSC2 Enhanced power supply modules (EPSMs)

The left compartment is for an optional redundant PSM. If the configuration of a particularcabinet does not require a redundant PSM, a blanking plate is fitted over thecompartment. The redundant PSM must be compatible with the other cabinet powerunits.

Cabinet powerrequirements

Table 3-1 shows the power requirements of the cabinet:

Table 3-1 Cabinet power requirements

Supply Cabinet type

Earth Voltage BSSC2

Negative +27 V 90 A

Positive –48 V 50 A

–60 V 40 A

GSM-100-333 DPSM


68P02901W07-O

GMR-04

3–3

DPSM

Overview

The digital power supply (DPS) system for each BSU consists of up to three plug-inenhanced power supply modules (DPSMs).

The DPSM is a switching type dc - dc power converter that converts the cabinet dc inputpower to the following dc outputs:

S +5 V (� 2% at 85.5 A).

S �12 V (� 5% at 2.5 A).

The BSU or RXU backplane connects the outputs of each DPSM in parallel.

The DPSMs in the DPS system load-share:

S Two of the DPSMs provide sufficient power for a fully equipped BSU or RXU.

S The third DPSM (if fitted) provides n+1 redundancy.

A DPSM in an alarm condition sends an alarm message to the GPROC/GPROC2 via theserial bus.

DPSM view

Figure 3-1 shows the DPSM:

ig.242.rh

REAR VIEW

RTN (EARTH FOR +5 V OUTPUT)RTN (EARTH FOR +5 V OUTPUT)

+5 V+5 V

25-PIN D-TYPE CONNECTOR(FEMALE)

C GND (CHASSIS EARTH)V RTN (0 V INPUT)V IN (+27 V INPUT)

ACTIVE LED (GREEN): ON WHEN ALL OUTPUT

VOLTAGES ARE PRESENTAND WITHIN TOLERANCE

ALARM LED (RED):ON WHEN ONE OR MORE

ALARM CONDITIONSEXIST.

OFF WHEN NO ALARMCONDITION EXISTS.

Figure 3-1 DPSM module

GSM-100-333DPSM


GMR-0468P02901W07-O

25-pin D-type connections

The 25-pin D-type connector provides connections for:

S +12 V power output.

S –12 V power output.

S Backplane slot ID input.

S Loss of dc input voltage alarm.

S Serial data bus.

S +5 V sense input.


Normal operation

During normal operation, the DPSMs share the load current demand of the BSU or RXUshelf modules:

S Half of the load current supplied by each DPSM in a two-DPSM system.

S One third of the load current supplied by each DPSM in a three-DPSM system.

Regulated dc power is applied to the backplane to power the BSU or RXU shelf modules.

Redundancy

Two DPSMs can provide adequate operating power for all modules in a BSU or RXUshelf. A third DPSM can be added for redundancy.

When plugged into the backplane, all DPSM power outputs are connected in parallel, sothat the DPS system current capacity is twice that of the individual DPSM; any thirdDPSM is redundant (n+1).

Power supply shutdown

During a shutdown condition caused by a faulty DPSM, the output circuits of themalfunctioning DPSM are isolated from the backplane output line, and the DPSM alarmLED is switched on. The malfunctioning DPSM informs the GPROC/GPROC2 of theshutdown condition.

Monitoring circuits

Parallel output connections allow each DPSM to sense its own output lines for:

S Output voltage regulation.

S Over-voltage protection to shut the DPSM down if the output voltage exceeds 1.2to 1.3 times the rated output.

S Over-current protection to latch the power supply off (after a short delay for largeoverloads) if the output current exceeds:

– 1.15 to 1.5 times the full-load rating of the +5 V output.

– 1.15 to 2 times the full-load rating of the +12 V and –12 V outputs.

The BSU or RXU shelf’s GPROC/GPROC2 also monitors the status of each DPSM, viaa serial alarm link on the backplane, for:

S Loss of dc input voltage.

S Loss of output voltage.

S Overtemperature.

S Loss of serial link.

GSM-100-333 DPSM


68P02901W07-O

GMR-04

3–5

Circuit protection

Additional internal DPSM circuit protection includes:

S Input dc reverse polarity protection to prevent DPSM damage using an input seriesdiode to block reverse voltages.

S Thermal protection to send an alarm message to the GPROC/GPROC2 via theserial port, and shut the DPSM down, if the DPSM ambient temperature exceeds asafe level.

After an alarm condition has ceased, normal DPSM operation is automatically restored.

Serial link

The serial link carries the following information and flags an alarm if an unexpected stateor failure occurs:

Address Device location

Slot 0 – 2

Revision DPSM Alarms

I/P FailO/P FailOvertemp

LED display

Two LEDs are mounted on the front of the DPSM to indicate the following:

S Active (Green): on when all output voltages are present and within specified limits.

S Alarm (Red): on when one or more alarm conditions exist.

DPSM diagram

Figure 3-2 shows a functional block diagram of the DPSM:

Figure 3-2 DPSM block diagram

GSM-100-333EPSM


GMR-0468P02901W07-O

EPSM

Overview

The enhanced power supply (EPS) system for each BSU in a negative earth (+27 V)system consists of up to three plug-in enhanced power supply modules (EPSMs). TheEPSM can only be used in a negative earth cabinet.

The EPSM is a switching type dc - dc power converter that converts the cabinet dc inputpower to the following dc outputs:

S +5 V (� 2% at 85.5 A).

S �12 V (� 5% at 2.5 A).

The BSU or RXU backplane connects the outputs of each EPSM in parallel.

When three EPSMs are fitted in the EPS system, they load-share as follows:

S Two EPSMs provide sufficient power for a fully equipped BSU or RXU.

S The third EPSM (if fitted) provides n+1 redundancy.

An EPSM in an alarm condition sends an alarm message to the GPROC/GPROC2 viathe serial bus.

EPSM view

Figure 3-3 shows the EPSM:


+5 V+5 V


C GND (CHASSIS EARTH)V RTN (0 V INPUT)V IN (+27 V INPUT)

ACTIVE LED (GREEN):ON WHEN OUTPUT

VOLTAGES AREPRESENT AND WITHIN

TOLERANCE.

ALARM LED (RED):ON WHEN ONE OR

MORE ALARMCONDITIONS EXISTS.

OFF WHEN NO ALARMCONDITION EXISTS.

Figure 3-3 EPSM module

GSM-100-333 EPSM


68P02901W07-O

GMR-04

3–7







S Serial data bus.

S +5 V sense input.


Normal operation

During normal operation, the EPSMs share the load current demand of the BSU or RXUshelf modules:

S Half of the load current supplied by each EPSM in a two-EPSM system.

S One third of the load current supplied by each EPSM in a three-EPSM system.

Regulated dc power is applied to the backplane to power the BSU or RXU shelf modules.

Redundancy

Two enhanced power supply modules (EPSMs) can provide adequate operating powerfor all modules in a BSU or RXU shelf. A third EPSM can be added for redundancy.

When plugged into the backplane, all EPSM power outputs are connected in parallel, sothat the EPS system current capacity is twice that of the individual EPSM; any thirdEPSM is redundant (n+1).


During a shutdown condition caused by a faulty EPSM, the output circuits of themalfunctioning EPSM are isolated from the backplane output line, and the EPSM alarmLED is switched on. The malfunctioning EPSM informs the GPROC/GPROC2 of theshutdown condition.

Monitoring circuits

Parallel output connections allow each EPSM to sense its own output lines for:


S Over-voltage protection to shut the EPSM down if the output voltage exceeds 1.2to 1.3 times the rated output.


– 1.15 to 1.5 times the full-load rating of the +5 V output.


The BSU or RXU shelf’s GPROC/GPROC2 also monitors the status of each EPSM, via aserial alarm link on the backplane, for:



S Overtemperature.


GSM-100-333EPSM


GMR-0468P02901W07-O

Circuit protection

Additional internal EPSM circuit protection includes:

S Input dc reverse polarity protection to prevent EPSM damage using an input seriesdiode to block reverse voltages.

S Thermal protection to send an alarm message to the GPROC/GPROC2 via theserial port, and shut the EPSM down, if the EPSM ambient temperature exceeds asafe level.

After an alarm condition has ceased, normal EPSM operation is automatically restored.

Serial link



Slot 0 – 2

Revision EPSM Alarms


LED display

Two LEDs are mounted on the front of the EPSM to indicate the following:



EPSM diagram

Figure 3-4 shows a functional block diagram of the EPSM:

Figure 3-4 EPSM block diagram

GSM-100-333 IPSM


68P02901W07-O

GMR-04

3–9

IPSM

Overview

The integrated power supply (IPS) system for each BSU or RXU in a positive earth(–48 V/–60 V) system consists of up to three plug-in integrated power supply modules(IPSMs). The IPSM can only be used in positive earth cabinets.

The IPSM is a switching type dc – dc power converter that converts the cabinet dc inputpower to the following dc outputs:

S +27.5 V ± 5 % at 45 A (full-load current).

S +5.1 V ± 2 % at 87.5 A (full-load current).

S +12 V ± 5 % at 2.5 A (full-load current).

S –12 V ± 5 % at 2.5 A (full-load current).

The BSU or RXU backplane connects the outputs of each IPSM in parallel.

When three IPSMs are fitted in the IPS system, they load-share as follows:

S Two IPSMs provide sufficient power for a fully equipped BSU or RXU.

S The third IPSM provides n + 1 redundancy.

An IPSM in an alarm condition sends an alarm message to the GPROC/GPROC2 via theserial bus.

IPSM view

Figure 3-5 shows the IPSM:


+5 V+5 V


+27.5 V (RTN)+27.5 V (OUTPUT)

C GND (CHASSIS EARTH)V RTN (0 V INPUT)

V IN (–48 V/–60 V INPUT)

ACTIVE LED (GREEN):ON WHEN ALL OUTPUT

VOLTAGES ARE PRESENTAND WITHIN TOLERANCE

ALARM LED (RED):ON WHEN ONE OR MORE

ALARM CONDITIONS EXIST.OFF WHEN NO ALARM

CONDITION EXISTS.

Figure 3-5 IPSM module

GSM-100-333IPSM


GMR-0468P02901W07-O







S Serial data bus.

S +5 V sense input.


Normal operation

During normal operation, the IPSMs equally share load current demand of the BSU orRXU shelf modules:

S Half of the load current supplied by each IPSM in a two-IPSM system.

S One third of the load current supplied by each IPSM in a three-IPSM system.

Redundancy

Two IPSMs can provide adequate operating power for all modules in a BSU or RXUshelf. A third IPSM can be added for redundancy.

When plugged into the backplane, all IPSM power outputs are connected in parallel, sothat the IPS system current capacity is twice that of the individual IPSM; any third IPSMis redundant (n+1).


During a shutdown condition caused by a faulty PSM, the output circuits of themalfunctioning PSM are isolated from the backplane output line and the PSM alarm LEDis on. The malfunctioning PSM informs the GPROC/GPROC2 of the shutdown condition.

Monitoring circuits

Parallel output connections allow each IPSM to sense its own output lines for:


S Over-voltage protection to shut the IPSM down if the output voltage exceeds 1.2 to1.3 times the rated output.


– 1.05 to 1.3 times the full-load rating of the +5.1 V output.


The BSU or RXU shelf’s GPROC/GPROC2 monitors the status of each IPSM via a serialalarm link on the backplane for:



S Overtemperature.


GSM-100-333 IPSM


68P02901W07-O

GMR-04

3–11

Circuit protection

Additional internal IPSM circuit protection includes:

S Input dc reverse polarity protection to prevent IPSM damage using an input seriesdiode that blocks reverse voltages.

S Thermal protection to send an alarm message to the GPROC/GPROC2 via theserial port, then shut the IPSM down, if the IPSM ambient temperature exceeds asafe level.

After an alarm condition has ceased, normal IPSM operation is automatically restored.

Serial link



Slot 0 – 2

Revision IPSM Alarms


LED display

Two LEDs are mounted on the front of the IPSM to indicate the following:



IPSM diagram

Figure 3-6 shows a functional diagram of the IPSM:

Figure 3-6 IPSM block diagram

GSM-100-333PDU


GMR-0468P02901W07-O

PDU

Overview

The power distribution unit (PDU) is located on the top shelf of the cabinet and:

S Distributes dc power throughout the cabinet.

S Provides an alarm interface.

It consists of a circuit breaker panel and one of the following:

S A distribution alarm board (DAB).

S A power alarm board (PAB).

S A power distribution board (PDB) with an alarm interface board (AIB).

Input power

DC input power is applied at the interconnection panel on top of the cabinet and is routedto:

S The VIN bus bar.

S The earth (GND) bus bar in the PDU.

A second bus bar obtains +27 V power from:

S The power supply modules (PSMs) in the lower BSU or RXU in positive earth(–48/–60 V) cabinets.

S The VIN and GND busbars via busbar links in negative earth (+27 V) cabinets.

GSM-100-333 DAB


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DAB

Purpose

The distribution alarm board (DAB):

S Distributes +27 V dc to units within the cabinet via 25 fuses.

S Monitors alarm lines.

S Passes individual alarms to the GPROC/GPROC2.

The DAB processes operational failure signals from:

S Ruptured fuses.

S The fan stall sense line from each cooling fan.

Two bi-coloured LEDs (D43 and D8) are mounted on the DAB to indicate DAB andcabinet-based faults. The other LEDs indicate fuse failures according to the tables in thissection. The DAB can be used in a BSSC2 cabinet.

Requirements

The DAB is fitted in the PDU shelf.

DAB diagram

Figure 3-7 shows a DAB:

Figure 3-7 DAB module

GSM-100-333DAB


GMR-0468P02901W07-O

Fuses and LEDs(BSSC2)

Table 3-2 details the functions of the DAB fuses and LEDs used in the BSSC2:

Table 3-2 DAB fuses and LEDs (BSSC2)

Fuse Rating Power to LED

F4 0.5 A Not used D27








F12 4A Not used D28

F13 4A Not used D26

F14, F15 4A Not used D30

F18 2A Not used D42

F19 0.5 A DAB supply N/A

F20 2A Not used D40

F21 2A Upper fan 5 D33



F24 2A Lower fan 2 D38



F27 2A Not used D36

F28 2A Not used D39

F29, F30 4A Not used D34

GSM-100-333 DAB


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3–15

Switch settings(BSSC2)

Table 3-3 shows the settings of DAB switches S1 and S2, which can be configured asrequired in the BSSC2:

Table 3-3 S1 and S2 switch settings (DAB BSSC2)

Function Switch Position Setting

VSWR1 (Sector 1) S1 1 OFF



Spare S1 4 OFF

Battery backup O/P 2 S1 5 OFF (if battery backup installed)ON (if battery backup not installedor installed but not selected)

Battery backup O/P 1 S1 6 ON (if battery backup installed in acabinet fitted with a lower cageonly, or if battery backup notinstalled or installed but not used)OFF (if battery backup installed ina cabinet fitted with both upperand lower cages)

Battery backup I/P 2 S1 7 ON

Battery backup I/P 1 S1 8 ON

DRCU5 S2 1 OFF

DRCU2 S2 2 OFF

DRCU4 S2 3 OFF

DRCU1 S2 4 OFF

DRCU3 S2 5 OFF

DRCU0 S2 6 OFF

Spare S2 7 OFF

BBB ID S2 8 OFF

Note

A site reset is required for changes to the DAB switch settings to take full effect.Failure to do this may result in incorrect/inaccurate alarm conditions being generated.

GSM-100-333DAB


GMR-0468P02901W07-O

Alarm functions

The DAB produces alarms for several different devices and modules:

S 25 fuses.

S Battery backup input and output alarms.

S Multicoupler.

S Six circuit breakers.

S Six fan alarms.

Each signal from the fuse alarms is at a nominal +27 V level and is brought to a TTL highlevel. Under no-fault conditions, the TTL output is held at a high level. If one or morefuses fail on the multicoupler fuse panel the TTL level is low.

The addressable asynchronous receiver/transmitter (AART) has eight status inputs,which are multiplexed to obtain the required alarm functionality.

Visual warnings

Each +27 V (nominal) fuse protected branch circuit that powers cabinet equipment has acorresponding LED indicator on the DAB. The LED lights if the fuse is ruptured by a faultcondition, and the associated alarm line goes low.

The DAB also provides visual warnings for alarms via two bi-coloured LEDs:

S D43 indicates any internal cabinet or multicoupler and combiner failure.

S D8 indicates a fuse failure on the DAB only.

Both LEDs are driven by the master GPROC/GPROC2 in response to alarms generatedby the DAB; red indicates an alarm, otherwise the LEDs remain green. If the masterGPROC/GPROC2 is not running then both LEDs default to red.

Communications

The DAB communicates with the master GPROC/GPROC2 via the serial bus link. Themaster GPROC/GPROC2 always initiates connections, in which all modules respondwith status reports on the serial bus.

The DAB processes operational failure reports from the following:

S Ruptured fuses.

S Protected side of circuit breakers (except DPS circuit breakers, which aremonitored by the master GPROC/GPROC2 directly).

S Fan stall sense line from each cooling fan.

S Hardware failures reported directly to the DAB are individually sent to the masterGPROC/GPROC2 via the serial bus.

The serial bus circuitry is powered by the same +5 V that powers each digital card shelf.The power supplies that provide this +5 V (as well as ±12 V) deliver isolated outputs.Thus all devices in the serial bus circuit have a return that is floating (digital) earthrelative to the cabinet (main) earth. However, many of the signals being alarmed arereferenced to cabinet earth.

GSM-100-333 PAB


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PAB

Purpose

The power alarm board (PAB) located in the PDU processes operational failure reportsfrom the following:

S Ruptured fuses.

S Protected side of circuit breakers (except DPS circuit breakers).

S Fan stall sense line from each cooling fan.

S Hardware failures that are reported directly to the PAB, are individually sent to theGPROC via the serial bus.

The PAB provides +27 V (nominal) fuse-protected branch circuits for cabinet equipmentand fuse-protected +5 V DRAM back up power for the digital modules in the BSU andRXU shelves. Each fused branch has a corresponding LED indicator on the PAB, whichlights when the fuse is ruptured.

The PAB also has a bi-coloured LED which turns red to indicate a PAB-based fault. ThePAB maintains the bicoloured LED on the cabinet front door at green to indicate that thesystem has power applied. The PAB can be used in BSSC cabinets.

Diagram

Figure 3-8 shows a PAB:

Figure 3-8 PAB module

BSSC cabinet

The BSSC cabinet has fuse-protected branch circuits for the following internal andexternal cabinet equipment:

S +5 V DRAM back up to lower and upper BSU/RXU.

S Each cabinet cooling fan.

S +27 V DRAM back up battery (external).

GSM-100-333PAB


GMR-0468P02901W07-O

Fuses and LEDs(BSSC)

Table 3-4 details the functions of the PAB fuses and LEDs used in the BSSC:

Table 3-4 PAB fuse and LED functions

Fuse Rating Power to LED

F1, F2 4 A +5 V DRAM battery back up (lower shelf) 1

F3 4 A 27 V battery back up input (internal/external) 2

F4 0.5 A Not used 3

F5 0.5 A Not used 4

F6 0.5 A Not used 5

F7 0.5 A Not used 6

F8 0.5 A Not used 7

F9 0.5 A Not used 8

F10 0.5 A Not used 9

F11 0.5 A Not used 10

F12 4 A Not used 11

F13 4 A Not used 12

F14, F15 4 A Not used 13

F16, F17 4 A +5 V DRAM battery back up (upper shelf) 14

F18 2 A Not used 15

F19 0.5 A PAB Supply 16

F20 2 A Not used 17

F21 2 A Upper Fan 5 18



F24 2 A Lower Fan 2 21



F27 2 A Not used 24

F28 2 A Not used 25

F29, F30 4 A Not used 26

GSM-100-333 PAB


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Jumpers

Jumper JU1 must be fitted on POS, as shown in the diagram, for +27V cabinets, or toNEG for –48/60V cabinets.

Normally, the +5 V DRAM voltage is supplied to the BSU backplane by the DPSMs. Ifthe DPSMs fail to deliver the +5 V DRAM supply, due to cabinet input power failure orDPSM failure, the PAB converts either an external +27 V back up supply (input powerprotection) or the +27 V cabinet supply (DPSM failure protection) to a fused +5 V DRAMsupply. The desired option is selected using jumpers JU2 and JU3, as shown below.

Connect pins 1–2 on both jumpers for INTERNAL power conversionINT EXT

JU2

JU3

1

1

Connect pins 2–3 on both jumpers for EXTERNAL backup power

Set to POS (JU1 pins 2 – 3) JU1POSNEG 1

Alarm functions

The PAB alarms several different devices and modules:

S 26 fuses.

S Four +5 V DRAM back up fuses.

S –48/–60 V converter alarms.

S The multicoupler alarm.

S Eight circuit breakers.

S Six fan alarms.

The addressable asynchronous receiver/transmitter (AART) has seven status inputsavailable. To obtain the required alarm functionality, the inputs to the status pins aremultiplexed.

The serial bus circuitry is powered by the same +5 V that powers each digital card shelf.The power supplies that provide this +5 V (as well as ±12 V) deliver isolated outputs.Thus all devices in the serial bus circuit have a return that is floating (digital) earthrelative to the cabinet (main) earth. However, many of the signals being alarmed arereferenced to cabinet earth.

In order to preserve the isolation between the two earths present in the PAB,opto-isolators between the multiplexer/data selector outputs and status inputs are usedwhere needed.

Visual warnings

Each +27V (nominal) fuse-protected branch circuit that powers cabinet equipment has acorresponding LED indicator on the PAB. The LED lights if the fuse is ruptured by a faultcondition, and the associated alarm line goes low.

The PAB also provides visual warnings for alarms through two bicoloured LEDs.

S The first LED is mounted on the cabinet door. This LED indicates failures in:

– An internal cabinet function.

– External multicoupler and combiner.

S The second LED (LED27) is on the lower left corner of the PAB and signals a fusefailure on the PAB only.

GSM-100-333PAB


GMR-0468P02901W07-O

Input signals

Fuse alarm levels

Each of the signals from the fuse alarms is at a nominal +27 V level and is brought to aTTL high level.

Circuit breaker alarms

Depending on the cabinet fit, the following signals from circuit breakers are fed to thePAB:

S BSSC:

– Two signals to sense the –48/–60 V dc to dc fan power converter inputvoltages. The output from each converter circuit breaker, at a nominal–48 V or –60 V level, is brought to a TTL high level.

Multicoupler alarm

Under no-fault conditions the TTL level output is held at a high level. If one or morefuses fail on the multicoupler fuse panel the TTL level is low.

Converter alarms

Two –48 V or –60 V dc to dc converter alarm signals are detected. One signal is an overtemperature indication, the other a low voltage failure. Under no-fault conditions the TTLlevel output is held high. If one or both failures occur the TTL level is low.

+5 V back up supply

The PAB also supplies current to the digital shelves for the purpose of a back up supply.The device used to perform this function is a 150 W dc to dc converter which delivers anoutput of 16 A at a nominal +5 V. The converter is configured to give a +4.85 V output.This back up power, which is for the GPROC and LANX modules, is switched in only inthe event of a loss of the primary base station cabinet input power.

Serial bus

The serial bus allows the GPROC bus master to connect to, and communicate with, thePAB.

Status word

The function of the status word is to report any alarms that occur to the master GPROC.Under normal (no alarm) operating conditions, bits S0–S2 and S4–S6 are high while bitsS3 and S7 are low.

Transmit enable

As the serial bus communication link is bidirectional, allowing the PAB to receive andtransmit information along the same signal path, a one-shot serial bus access circuit isused to provide an 10 ms access/transmit window. The command strobe (CS) pulse isgenerated by the addressable asynchronous receiver/transmitter ( AART) after itreceives a valid command word. The CS pulse signals the one-shot to send the 10 mspulse to the receive and transmit circuitry, allowing data transmission.

Transmit and receive

When the transmit enable 10 ms pulse is active, the PAB can send data (input data andstatus words) on the serial bus. The A/B select line decides on which serial data line theinformation is to be received from the GPROC.

GSM-100-333 PAB


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Reset

The ART could enter an unknown state at switch–on, therefore its reset is tied to anundervoltage sensing circuit. This allows the AART to receive power before it is reset.

Timing

A MC406 crystal oscillator provides the 307.2 kHz clock frequency. This frequency isthen internally divided by 64 to derive the receive data strobe and the data clock rate(4800 Hz).

BSSC statusinputs

The status inputs S0–S7 respond to the following alarms on the BSSC cabinet:

Status input ... Responds to alarms from ...

S0 Not used.

S1 Not used.

S2 Fan 0 (F26), fan 1 (F25), fan 2 (F24), fan 3 (F23), fan 4 (F22) andfan 5 (F21) power supplies; –48/–60 V fan power convertertemperature fail and +27 V DRAM back up input supply.

S3 +27 V PAB supply (F19); –48/–60 V fan power converter 1 (CB4),fan power converter 2 (CB5) and –48/–60 V fan power converterfail.

S4 +5 V DRAM supply (lower shelf) (F1 and 2) and (upper shelf) (F16and 17).

S5 Fans 0–5 stall alarms.

S6 +27 V PAB supply (F19).

S7 Not used.

Signal routeing

Each of the above signals, with the exception of the +5 V DRAM supply, are first broughtto a TTL level before being fed to a data selector, which selects the appropriate input.The input is passed through an opto-isolator to ensure the signal is isolated between themain and digital earths. The output of the opto-isolator is routed to the appropriate statusinput of the AART.

Signal timing

Since the data selectors that drive the status inputs S0–S3 and S5 are referenced tomain earth, the clocking signals, and output from the AART, are opto-isolated beforeclocking the data selectors. The status input S4 is driven from a data selector that isreferenced to digital earth and is clocked directly from the AART.

GSM-100-333PDB and AIB


GMR-0468P02901W07-O

PDB and AIB

OverviewThe PDU in BSSC cabinet comprises an Alarm Interface Board (AIB) and a PowerDistribution Board (PDB).

AIB description

The AIB circuits operate from:

S +27 V and optional +27 V DRAM back up from the PDB.

S +5 V from digital power supplies via the BSU backplane.

Normally the +5 V DRAM voltage for a GPROC/GPROC2 dynamic RAM is supplied tothe BSU backplane by the DPSM. If the primary +27 V is removed from the cabinet, theAIB converts the +27 V DRAM back up to a fused +5 V DRAM voltage, which is suppliedto the BSU backplane.

+5 V DRAM voltage fuses and usage are as follows:

S F1 (60 V, 10 A) supplies +27 V to the upper BSU shelf backplane.

S F2 (60 V, 10 A) supplies +27 V to the lower BSU shelf backplane.

The AIB monitors alarm lines, passes individual alarms to the GPROC/GPROC2 andprovides a composite alarm signal for the cabinet alarm LED.

The AIB combines all alarms into one common alarm output which is routed to thecabinet alarm LED mounted on the cabinet front door. When the LED is on, a hardwareand/or software failure condition exists within the cabinet. There is also a bi-colouredLED mounted on the AIB which indicates an AIB based fault.

The AIB processes operational failure signals from:

S Ruptured fuses.

S The protected side of circuit breakers (except DPSM circuit breakers).

S The fan stall sense line from each cooling fan.

AIB viewFigure 3-9 shows an AIB:

ig.249.rh

JU4

JU3

JU2

PC9

PC8

PC7

JU5

PC3

PC6PC1

PC2

F2 F1

DS1

PC3Serialchip

JU1

Figure 3-9 AIB module

GSM-100-333 PDB and AIB


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PDB description

The PDB distributes +27 V and +5 V to units within the cabinet through 25 fuses. ThePDB reports fuse failures to the AIB and also provides a fused circuit for the optional27 V DRAM back up battery which connects to the DRAM port on top of cabinet.

Table 3-5 shows the functions of the PDB fuses:

Table 3-5 PDB Fuse functions

Fuse Voltage Rating Power to

1 to 5 60 25 A Not used (May or may not be installed)

6 to 10 60 0.5 A Not used (May or may not be installed)

11 & 12 60 5 A Not used (May or may not be installed)



17 60 2 A Lower Fan 0



20 60 2 A Upper Fan 0 (If installed)



23 60 2 A Spare

24 60 2 A DRAM Back-up

25 60 2 A Alarm Interface Board

PDB diagram

Figure 3-10 shows a PDB:

Figure 3-10 PDB module

GSM-100-333Circuit breakers


GMR-0468P02901W07-O

Circuit breakers

Purpose

Power is distributed within the cabinet via the circuit breakers. This section details thefunction of each circuit breaker in each cabinet.

BSSC with PAB

Eight circuit breakers distribute power to units in a BSSC cabinet with a PAB-type PDU.

S CB4 and CB5 provide -48/–60 V power to the fan power converters in positiveearth cabinets only.

S CB6, CB7 and CB8 provide power to the DPSMs in the upper BSU or RXU shelf:

– In a positive earth cabinet, the circuit breakers supply –48/–60 V.

– In a negative earth cabinet, the circuit breakers supply +27 V.

S CB9, CB10 and CB11 provide power to the DPSMs in the lower BSU or RXU shelf:

– In a positive earth cabinet, the circuit breakers supply –48/–60 V.

– In a negative earth cabinet, the circuit breakers supply +27 V.

BSSC withPDB/AIB

Six circuit breakers distribute power to units in a BSSC cabinet with a PDB/AIB-typePDU.

S CB0, CB1, CB2, CB3, CB4 and CB5 provide +27 V power to the DPSMs in bothBSU or RXU shelves.

BSSC2

Seven circuit breakers distribute power to units within the BSSC2 cabinet.

S CB1, at 30 A, provides +27 V power to the DAB.

S CB5 to CB10, at 60 A, provide power to the PSMs:

– In a positive earth cabinet, the circuit breakers supply –48/–60 V power tothe IPSMs.

– In a negative earth cabinet, the circuit breakers supply +27 V power to theEPSMs.

GSM-100-333 Fan cooling system


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Fan cooling system

Overview

The fan cooling system comprises two fan tray assemblies mounted directly below eachBSU or RXU shelf. Each fan tray assembly contains three exhaust fans.

Cabinet baffling divides the cabinet cooling system into upper and lower cabinet coolingsubsystems. The cooling system, in conjunction with the correct use of shelf airflowdeflectors, provides adequate cooling for all cabinet equipment.

Each fan has a fan stall sensor, which is connected to alarm circuits in the PDU.

Power

In negative earth cabinets, power for the fans is derived from the +27 V bus bar via thePDU.

In positive earth BSSC cabinets, a Fan Power Converter Unit (FPCU) is required toderive +27 V from the -48/60 V supply.

The FPCU is mounted above the lower BSU or RXU shelf in positive earth BSSCcabinets.

Figure 3-11 shows the FPCU module.

ig.251.rh

FAN POWERCONVERTERMODULE 1

FAN POWERCONVERTER UNIT

INTERFACE

FAN POWERCONVERTER

MODULE 2

Figure 3-11 FPCU module



GMR-0468P02901W07-O

Interconnect panel

Location

The interconnect panel is on top of the cabinet.

Purpose

This panel provides connections for:

S DC input power.

S 2.048 Mbit/s E1 line interconnect modules.

S Customer defined alarm equipment input and output.

S +27 V battery back up input for DRAM.

S +27 V power/alarm for external receiver multicoupler and external remotelytuneable combiner (BTS only).

The interconnect panel has feed-through tubes for routing fibre optic intercabinet cablesinto and out of the cabinet. Feed-through tubes do not compromise the cabinet’s EMCscreening, as the tubes operate below their waveguide cut off frequency.

The 2.048 Mbit/s E1 line interconnection modules are:

S Type 43 interconnect boards (T43), used for unbalanced lines.

S Balanced-line interconnect boards (BIB), used for balanced lines.

GSM-100-333 Interconnect panel


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BSSC

Diagram

Figure 3-12 shows the interconnect panel for the –48/60 V BSSC:

PIX 1

PIX 0

GKO

BATTERYBACK UP

EARTH STUD

V IN

–48/60 V dc

0 V


X21-0 X21-1


Connectors

Table 3-6 details the interconnect panel connectors for the BSSC.

Table 3-6 BSSC interconnect panel connectors

Connector Function Internal destination Externaldestination

+27 V BattBack up

DRAM back-upbattery

PAB connector PC6 +27 V back-upbattery

MS0 to MS3 Multiple serialinterface ports (upto six E1/T1circuits at each


E1/T1 circuitssource orterminationequipment (via BIB

MS4 to MS7circuits at eachconnector; six Txand six Rxcircuits)


equipment (via BIBor T43)

PIX0 and PIX1 Customer alarminput/output ports



GKO Not used in thisconfiguration

GKO connector on lowerBSU backplane

X21-0 andX21-1

Not used in thisconfiguration



GMR-0468P02901W07-O

BSSC2

Diagram

Figure 3-13 shows the interconnect panel for the BSSC2:

PIX 1

PIX 0

GKO

BATTERYBACK UP

EARTH STUD

V IN

–48/60 V dcor+27 V dc

0 V



Connectors

Table 3-7 details the interconnect panel connectors for the BSSC2.

Table 3-7 BSSC2 Interconnect panel connectors

Connector Function Internal destination Externaldestination

+27 V batterybackup

DRAM backupbattery

DAB connector PC4 andBBBX connector PC2

+27 V backupbattery

MS0 to MS3 Multiple serialinterface ports (upto six E1/T1circ its at each


E1/T1 circuitssource orterminationeq ipment ( ia a

MS4 to MS7circuits at eachconnector; six Txand six Rx circuits)


equipment (via aT43 or BIB)

PIX0 and PIX1 Customer alarminput and outputports




GKO connector on lowerBSU backplane

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Type 43 interconnect board

Location

The T43 interconnect board plugs into the interconnect panel via a 37-pin D-typeconnector.

Purpose

The T43 interconnect board matches the impedance between the pulse code modulation(PCM) circuit lines and the BSU/RXU backplanes. The board interfaces up to six inputand six output unbalanced coaxial 75 ohm 2.048 Mbit/s E1 lines to the BSU/RXUbackplane through twelve type 43 coaxial connectors.

The T43 uses 12 transformers to provide impedance matching between the PCM circuitlines and the multiple serial interface (MSI) modules. Each transformer has a 1:1.25 turnsratio to match the external 75 ohm and backplane 120 ohm connections. Each input andoutput is isolated by up to 1500 V from the backplane.

Use the T43 for unbalanced lines.NOTE

T43 diagram

Figure 3-14 shows the T43 interconnect board:

J1

J2

J5

J4

J7

J8

J10

J13 J11

J14

J16

J17

J0

Figure 3-14 T43 module

GSM-100-333Type 43 interconnect board


GMR-0468P02901W07-O

T43 connectors

Table 3-8 details the T43 connectors.

Table 3-8 T43 Connectors

D-TypePin no.

Function CoaxialPin no.

D–TypePin no.

Function CoaxialPin no.

J0-1 MSI_MEGA_Tx1+

J1 Centre J0-20 MSI_MEGA_Tx1–(AC coupled to earth)

J1 Shield

J0-2 MSI_MEGA_Rx1+

J2 Centre J0-21 MSI_MEGA_Rx1–(Earth)

J2 Shield

J0-4 MSI_MEGA_Tx4+


J4 Shield

J0-5 MSI_MEGA_Rx4+


J5 Shield

J0-7 MSI_MEGA_Tx2+


J7 Shield

J0-8 MSI_MEGA_Rx2+


J8 Shield

J0-10 MSI_MEGA_Tx5+


J10Shield

J0-11 MSI_MEGA_Rx5+


J11Shield

J0-13 MSI_MEGA_Tx3+


J13Shield

J0-14 MSI_MEGA_Rx3+


J14Shield

J0-16 MSI_MEGA_Tx6+


J16Shield

J0-17 MSI_MEGA_Rx6+


J17Shield

Connector J0 pins 3, 6, 9, 12, 15, 18, 19, 22, 25, 28, 31, 34, and 37 are not used

GSM-100-333 Balanced line interconnect board


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Balanced line interconnect board

Location

The BIB plugs into the interconnect board via two 37-pin D-type connectors.

Purpose

The balanced-line interconnect board (BIB) matches the impedance between the pulsecode modulation (PCM) circuit lines and the BSU backplanes. The board providesinterfaces for six input and six output balanced 120 ohm E1/T1 lines.

The board uses 12 transformers to match the impedance between the PCM circuit linesand the multiple serial interface (MSI) modules. Each transformer has a 1:1 turns ratio tomatch the external and backplane 120 ohm connections.

Use the BIB for balanced lines.NOTE

BIB diagram

Figure 3-15 shows the BIB module.

J1

J0

Figure 3-15 BIB module

GSM-100-333Balanced line interconnect board


GMR-0468P02901W07-O

BIB connectors

Table 3-9 details the BIB connectors:

Table 3-9 BIB Connectors

Pinno.

Function Pinno.

Pinno.

Function Pinno.

J0–1 MSI_MEGA/EXT_MEGA_Tx1+

J1–1 J0–20 MSI_MEGA/EXT_MEGA_Tx1–

J1–20

J0–2 MSI_MEGA/EXT_MEGA_Rx1+

J1–2 J0–21 MSI_MEGA/EXT_MEGA_Rx1–

J1–21

J0–3 Earth J1–3 J0–22 Earth J1–22



J1–23



J1–24




J1–26



J1–27




J1–29



J1–30




J1–32



J1–33




J1–35



J1–36


J0–19 Earth J1–19

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29 Aug 1997 Installation and Configuration: BSC/RXCDR

68P02901W08-O

GMR-04

i

Category 433

Installation and Configuration

GSM-100-433

29 Aug 1997ii Installation and Configuration: BSC/RXCDR

GMR-0468P02901W08-O

GSM-100-433


68P02901W08-O

GMR-04

iii

Category 433Installation and Configuration i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 1Site preparation i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Torque values 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . In this chapter 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .






Chapter 2Installing the equipment i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . In this chapter 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Before starting 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cabinet types 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Delivery 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packaging 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lifting cabinets 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Site earthing 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Transient/ lightning protection 2–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Torque values 2–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Optical fibres 2–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Chapter 3Decommissioning the equipment i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Overview 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisite 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lifting cabinets 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


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Chapter 1

Site preparation

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Chapter 1Site preparation i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Overview 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Torque values 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . In this chapter 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .






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Overview

Introduction

This manual contains installation and configuration procedures for Motorola BSSC andBSSC2 equipment cabinets, used as a BSC or RXCDR.

Hazardous voltages in excess of 50 V dc exist inside –48 V and –60 Vcabinets. Use extreme caution when working on a cabinet with powerapplied. Remove all rings, watches and other jewellery.

WARNING

Torque values

Table 1-1 lists the torque values to be used when tightening corresponding bolts.

Table 1-1 Bolt torque values

Size Torque

Nm lbf

M4 5.4 4

M5 8.2 6

M6 14.8 11

M8 34 22

M10 66 49

M12 126 93

In this chapter

Read this chapter before beginning the installation. It covers installation tool kits, siterequirements, power requirements, optical fibre handling precautions, site visits andcabinet labelling.

GSM-100-433Tool kits for installing GSM cellular equipment

29 Aug 19971–2 Installation and Configuration: BSC/RXCDR

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Tool kits for installing GSM cellular equipment

Introduction

Two tool kits are recommended for use when installing GSM cellular sites. Cellular toolkit number one is for installation, and number two is for commissioning. Equipmentrequired for optimization is listed in Chapter 3.

Tool kit one

Table 1-2 lists the contents of cellular tool kit number one.

Table 1-2 Tool kit number one contents

Quantity Description

1 pair Safety goggles

1 Hard hat

1 Dust mask

1 pair Ear defenders

1 Antistatic wrist strap with coiled lead

1 Antistatic mat

1 Torch

1 5-Tray cantilever tool box (22 in)

1 Padlock to fit cantilever tool box

1 Zipped tool case

1 Socket set (A/F/Metric 1/2 in drive)

1 10 in adjustable spanner

1 8 in adjustable spanner

1 each2

Combination spanners A/F:1/4 in, 5/16 in, 3/8 in, 7/16 in, 1/2 in, 9/16 in, 5/8 in, 11/16 in, 7/8 inand 1 in3/4 in

1 Ratchet spanner (9/16 in x 1/2 in)

1 Torque wrench (10-150 ft/lb)

1 Torx driver set (T10 to T30)

1 Allen key set A/F

1 Claw hammer

1 Pipe cutter

1 Cone cutter (up to 1 in)

1 Cone cutter (up to 2 in)

1 Junior hacksaw

10 Replacement blades for junior hacksaw

1 300 mm hacksaw

10 Replacement blades for 300 mm hacksaw

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1 pair 6 in side cutters

1 pair 6 in heavy-duty side cutters

1 pair Wire cutters

1 pair Cable shears

1 Knife with retractable blade

1 pair 8 in combination pliers

1 pair General purpose pliers

1 pair Snipe nose pliers

1 each Screwdrivers 0pt, 1pt and 2pt

1 each Screwdrivers 4 in, 6 in and 8 in

1 Set of jeweller’s screwdrivers

1 Screwdriver set (including flat and cross-head blades)

1 Transpower 110 V (twin outlet)

1 Kango 501 110 V

1 M20 drill bit to fit Kango 501

1 Pistol drill P221 115V

1 24-piece drill bit set 1/16 in to 1/2 in

2 110 V plugs

1 6 m 240 V extension cable (twin outlet)

1 Soldering iron

1 Soldering iron stand

1 Hand crimp tool

1 Crimp tool for type 43 connectors

1 BNC crimp tool with inserts

1 Telephone plug crimp tool

1 50 mm crimp tool

1 Cable tie gun

1 4 ft wooden step ladder

1 Table vice

1 10 in vice grips

1 7.5 m tape measure

1 12 in steel rule

1 Spirit level (3 ft)

1 Centre punch

1 Pocket scriber

1 10 in half round file

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Tool kit twoTable 1-3 lists the contents of cellular tool kit number two.

Table 1-3 Tool kit number two contents


1 Antistatic wrist strap with coiled lead

1 Antistatic mat

1 Marker pen

1 Zipped tool pack case

1 Large sectioned storage box

1 Torx driver set including sizes T10 to T30

1 pair Flush cut wire cutters

1 pair Light duty cable cutters

1 pair Industrial scissors

1 pair GP serrated jaw pliers

1 pair Snipe nose pliers

1 pair Straight point tweezers

1 Screw/nut driver set

1 Screw gripping driver

1 Null modem

1 RS232 mini tester

1 Soldering iron (dual temperature) with holder

1 Cable tie gun

1 M to M gender changer

1 Co-ax cable stripper for 2002 (75 ohm coaxial cable)

GSM-100-433 Site requirements and considerations


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Site requirements and considerations

Introduction

The base site must meet the following criteria.

Structuralrequirements

There must be:

Clearance of at least 775 mm (30.5 in) in front of the equipment for operation andmaintenance purposes.

An overhead cable trough, mounted at least 150 mm (6 in) above the top of the tallestcabinet.

Cabinetdimensions

BSSC and BSSC2 cabinets both have the following dimensions:

Height 2096 mm

Width 711 mm

Depth (with door) 416 mm

Depth (without door) 400 mm

Operatingenvironment

Temperature –5 _C to +45 _C.

Humidity 20 % to 80 % non-condensing relative humidity(maximum 0.024 gram of water/m# of dry air).

Airborne particulate matter < 5 milligrams/1000 cubic feet of air.

The BSSC cabinet dissipates a maximum of 3100 watts when fully equipped.

Storageenvironment

Temperature –45 _C to +70 _C .

Humidity 10 % to 90 % non-condensing relativehumidity

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Diagram

Figure 1-1 shows the cabinet dimensions and mounting foot details:

Figure 1-1 Cabinet dimensions and mounting foot details

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Power requirements

Introduction

BSSC cabinets can operate from either positive or negative earth supplies (requested bythe customer and configured at initial installation) at various voltages.

Positive earthBSSC cabinets

Positive earth BSSC cabinets operate from a –48 V or –60 V dc supply. The maximumpower requirements are:

S (–48 V) = 50 A.

S (–60 V) = 40 A.

Negative earthBSSC cabinets

Negative earth BSSC cabinets operate from a nominal +27 V dc (+3 V, –5 V dc) supply.The maximum power requirement is:

S (+27 V) = 90 A.

Back up power

BSSC cabinets can be connected to an external battery to provide a dc input power backup for dynamic random access memory (DRAM) devices.

The DRAM back up maximum power requirement for each cabinet is:

S 4 A (maximum) at +27 V dc.

An adequate means of routeing cables from the power source to theequipment, for example a cable trough, must be provided (BS 7671Reference Method 11).

NOTE

Overcurrentprotection

The cabinet overcurrent protection device can be:

S A fuse conforming to BS88 (IEC 51–3).

S A main circuit breaker conforming to BS EN 60898 (IEC 898).

The device must be of the following rating:

S +27 V cabinets: 100 A.



GSM-100-433Handling optical fibres


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Handling optical fibres

Introduction

The section details the precautions necessary for the handling of both glass and polymeroptical fibres.

Optical fibre cables contain an inner core, which is a strand of polymer or glass, coatedby a cladding (sometimes in two layers), and an outer sheath providing mechanicalprotection.

The optical fibre acts as a light waveguide. In order for the link to work correctly lightmust be propagated with minimal loss from end-to-end of the fibre. A number of causescan prevent this from happening, resulting in the potential for the link to become faulty.

Protection offibres andconnectors

To maintain good light transmission through the optical fibre link it is essential theconnector end surfaces and/or bare fibre ends are kept clean at all times. Dust or dirtmust not be allowed to contaminate either the ends of the fibres, or enter the emitters ordetectors on the circuit board.

When an optical fibre is not connected, the protective caps must be fitted at all times tothe ends of the fibre and to all unused connectors on the modules.

Cleaning offibres andconnectors

When cleaning of contaminated optical connectors is deemed necessary, all areas mustbe wiped gently with a lint-free cloth soaked in a suitable cleaning solution.

Care must be taken to ensure the ends of optical fibres are not damaged inany way.

CAUTION

Lint free cloth is the preferred medium for cleaning, since the risk ofcontamination or damage due to the cleaning process is minimal. In extremecircumstances the use of soft clean cotton may be acceptable.The use of cotton buds soaked in cleaning solution is not recommended, sincelint is frequently left on the fibre and the connectors may be wet when thecables are inserted into the connectors.

NOTE

Fibre connection

Fibre–SMA connectors are used at both ends of the glass fibre optic cables. Theseshould be tightened to hand–tight only when connecting – under no circumstances should any tools, such as pliers or spanners be used to tighten the connectors.

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Minimum bendradius

All optical fibres have a minimum bend radius. This represents the smallest circle thatcan be formed, without damage, from a loop of fibre, that is how tight it can be coiled,looped or bent.

Under NO circumstances should fibres be bent tighter than the minimum bendradius

CAUTION

The minimum bend radius for the optical fibres used in Motorola BSS equipment cabinetsis 30 mm. Refer to Figure 1-2.

Double the bend radius value stated above if the fibre is under tension.

NOTE

As a rule of thumb, the ‘natural’ bend radius of the fibre can be determined by allowingthe fibre to bend under its own weight. This radius will normally be greater than thatspecified above, and it is recommended that this is not exceeded. If in doubt, check bymeasuring accurately.

If a fibre is bent tighter than the minimum bend radius, two effects are possible:

S Excessive light loss from the outside of the bend.

S Fibre fracture due to microscopic imperfections caused by bending. Light isscattered and reflected by the fracture. The damage is permanent and is notrepaired by straightening the fibre.

ig.270.rh

Minimumbendradius

Fibre optic cable

Figure 1-2 Minimum bend radius of 30 mm (at size)

GSM-100-433Visiting the site


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Visiting the site

Introduction

Follow these instructions when preparing to work at a site and upon arrival.

Before the visit

Before going to the site:

Step Action

a. Ensure that all team members have adequate testequipment, tools and hardware to carry out their tasks.Check the site folder for any special requirements.

b. Contact the person in charge of the building to advise of theteam’s estimated time of arrival and the expected duration oftheir stay on the site. This will usually have been dealt withpreviously, but it is always advisable to make sure that theinformation has been passed on.

c. Check with the engineer in charge of the project to see ifanything needs to be taken to the site and collect anyoutstanding work for the site to be visited.

d. Ensure that the team read the site access details on eachvisit to a site as local regulations may change.

Arriving at thesite

When entering any site:

Step Action

a. Contact the local OMC and MSC to announce the team’sarrival, indicate your expected time of departure, andarrange for the 2 Mbit/s links to be checked, before enteringthe site. Do not enter the site until you have made contactwith its OMC or MSC.

b. Enter the site and check for any building alarms, forexample intruder alarms, that may have been activated byentry.

c. Disable the Halon gas systems (if fitted) and any entryalarms.

d. Read any local instructions.

Occupied sites

In any exchange or occupied building, contact the caretaker or person in charge, who willexplain local regulations and may advise on parking, rubbish disposal and cateringfacilities.

Be as polite and helpful as possible; colleagues may well have to go back to the site at alater date.

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Leaving the site

When leaving a site during the installation or optimization period:

Step Action

a. At the end of the working day enable the Halon gas system(if fitted) and any alarm systems disabled on entry.

b. Contact the local OMC or MSC to announce the team’sdeparture.

c. Out of hours, if an alarm is fitted and the local MSC is notstaffed, contact the network control centre or OMC andinform them of the team’s departure.

d. Sign out of the building as necessary.

Never leave vehicles parked on site overnight.NOTE

Rubbish

At the end of the job, clear all rubbish from the site unless otherwise indicated by thecustomer.

DO NOT burn rubbish. Packaging can give off toxic gasses.

WARNING

Rural sites

The senior engineer must:

S Ensure that all personnel on site are aware of the country code and the healthregulations relating to water authority sites.

All personnel must:

S Guard against all risk of fire.

S Fasten all gates.

S Drive carefully on country roads and observe all speed restrictions.

S Keep to the paths and tracks across farm land.

S Not leave litter.

Remember that site visits can be traced back if a complaint is made.

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Safety on site

The senior engineer must:

S Advise all staff on site of safety requirements before any work takes place.

S Ensure that cabinets are safely positioned at all times.

Do not move a cabinet without assistance. Cabinets must be safely positionedat all times.

WARNING

All personnel must:

S Wear the safety helmets supplied when antenna or overhead work is in progress,and when local regulations require them.

S Wear the safety goggles, ear protectors and dust masks supplied when drilling.This is particularly important when drilling overhead ironwork.

S Wear approved safety footwear when moving heavy equipment.

S Stop work if any person in the team is not properly protected.

S Cut cable tie tails to remove sharp edges.


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Chapter 2

Installing the equipment

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Chapter 2Installing the equipment i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . In this chapter 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Before starting 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cabinet types 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Delivery 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packaging 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lifting cabinets 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Site earthing 2–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Transient/ lightning protection 2–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Torque values 2–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Optical fibres 2–3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .










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Overview

Introduction

Follow the procedures and guidelines in this chapter to install BSS equipment cabinetsand their internal and external interfaces.

To install equipment not supplied by Motorola, for example battery chargers and powersupplies, refer to the site specific documentation and the vendor instructions.

Hazardous voltages in excess of 50 V dc exist inside –48 V and –60 Vcabinets. Extreme caution must be used when working on a cabinet withpower applied. Remove all rings, watches and other jewellery.

WARNING

In this chapter

Installation consists of the following steps, all of which are described in this chapter:

S Unpacking the equipment and inspecting for visible damage.

S Positioning and securing the cabinets as shown on the floor plan.

S Earthing the cabinets.

S Connecting dc power to the cabinets.

S Inserting modules into the cabinets.

S Connecting external equipment cabling such as transmit and receive antennacables and E1/T1 lines.

S Connecting the inter-cabinet fibre optic cables.

Before starting

Before starting an installation, prepare the site as described in chapter 1 of this categoryand in the site specific documentation.

Cabinet types

This chapter describes the installation procedure for BSSC cabinets. The procedure isthe same for all cabinets except where otherwise indicated.

Delivery

Before the the BSSC equipment is delivered, designate an area of the site where theheavy freight and/or moving company can unload the equipment. The equipment must becarefully delivered to the site with the dollies and padding required to move it from theunloading area to the installation point.

GSM-100-433Overview


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PackagingThe cabinets are shipped in wooden crates.

Cabinets are shipped with the following items already installed:

S Cabinet interconnect panel.

S DC power distribution and alarm interface equipment.

S Module mounting shelves.

S Cooling fan assemblies.

S All intra-cabinet cabling.

S Digital modules.

The following items are shipped in separate cartons:

S Power supply modules (PSMs).

Lifting cabinets

An unequipped BSSC cabinet can weigh up to 136 kg (300 lb). Handlecabinets with extreme caution to avoid tipping.

WARNING

BSSC cabinets are fitted with four lifting points, designed to accommodate M12 eyebolts,built in to the top panels. These lifting points are fitted with plastic inserts to protect thethreads. Motorola kit number SWLN4648A contains four M12 eyebolts manufactured toC.E. conformity, each with a safe weight load of 400 kg and individually numbered. Onlyeyebolts supplied in this kit must be used.

Before attempting to insert the eyebolts, visually check each one for any damage thatmay have occurred in transit. If any damage is apparent, DO NOT USE; contactMotorola for replacement.

1. Carefully remove the plastic insert from the M12 threaded lifting point.

2. Insert the eyebolt into the thread, ensuring that no cross-threading occurs.

The eyebolts must not be overtightened; hand tight is sufficient. Screw theeyebolt fully into the lifting point so that no thread is left exposed.

WARNING

3. Repeat the procedure until all four eyebolts have been correctly fitted.

4. When the lifting operation is complete, remove the eyebolts and refit the plasticinserts.

For continued use of eyebolts, there may be local regulations that govern the use oflifting equipment and stipulate a test and/or examination regime. If the eyebolts are to beused, ensure that all such regulations are met.

Site earthingThis manual summarizes general procedures. For detailed earthing information, refer toGrounding Guidelines For Cellular Radio Installations (68P81150E62).

The cell site equipment must be earthed at the same common earth point as its powersource. Provision must be made for routeing earthing lines into the site and to thecabinet before installing the system cabinets. An earthing terminal (stud) is located onthe interconnect panel on top of each cabinet. Each cabinet must be earthed separately(not daisy chained). For detailed site earthing information, refer to the site specificdocumentation.



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Transient/lightningprotection

E1/T1 lines connected to Motorola equipment have secondary transient protection aspart of the balanced-line interconnect board (BIB) or T43 board. The receive and transmitantenna connections to the building must be fed through coaxial electromagneticprotection (EMP) devices.

Torque values

Table 2-1 lists the torque values to be used when tightening corresponding bolts.

Table 2-1 Bolt torque values

Size Torque

Nm lbf

M4 5.4 4

M5 8.2 6

M6 14.8 11

M8 34 22

M10 66 49

M12 126 93

Optical fibres

Refer to Handling optical fibres in chapter 1 before installing fibre optic cables.

GSM-100-433Unpacking the equipment


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Unpacking the equipment

IntroductionCarry out the following procedure with reference to the diagram on the next page.

ProcedureTo unpack a cabinet from its shipping crate:

1. Cut the plastic banding used to secure the wooden crate. Put the banding in aplace where it will not be lost.

2. Remove the eight metal clips that secure the lid of the crate using a claw hammeror a similar levering device. Put the clips in a place where they will not be lost ordamaged.

3. Lift the lid free of the crate. Place the lid where it will not be damaged.

4. Remove the 12 metal clips that secure the sides of the crate using a claw hammer.Put the clips in a place where they will not be lost or damaged.

5. Lift the sides free of the crate. Place the sides where they will not be damaged.

Take care not to scratch or otherwise damage the cabinet.CAUTION

6. Carefully cut open the sealed barrier bag containing the cabinet.

7. Lift or slide the cabinet off the base of the crate.

8. Remove the desiccant bag from the cabinet.

9. Put all the clips in a bag and tie them together with the banding, desiccant bag,barrier bag and the lid, sides and base of the cabinet.

10. Return the dismantled crate as advised by the in-country project manager.

11. Immediately after unpacking the equipment, inspect it for damage and report theextent of any damage to the transport company.

Shipping crateFigure 2-1 shows a cabinet shipping crate.

ig.271.rh

LID

SIDE

SIDE

SIDE

SIDE

BASE

METALCLIP

Figure 2-1 Cabinet shipping crate

GSM-100-433 Anchoring the cabinet


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Anchoring the cabinet

Introduction

Mounting procedures must conform to local building codes and regulations. Consult thesite authorities before beginning an installation.

Procedure

To secure a cabinet to the floor:

1. Open the cabinet door.

2. For access to the bottom of the cabinet, remove the lower fan housing/air baffleassembly (below the BSU shelf) by removing the four screws that secure it to thecabinet frame; retain the screws for reassembly.

3. Carefully place the cabinet at its anchoring point as shown in the site plan.

Ensure that cabinets are electrically insulated from each other. Cabinets canbe secured to adjacent cabinets or support structure using insulating bolts.

CAUTION

4. Use the mounting foot of the cabinet as a template to mark the location of the fourmounting holes. All four anchoring positions must be used.

Wear safety glasses while drilling holes.

WARNING

Cement dust from drilling concrete flooring is harmful to equipment and wiring.Make sure that the cabinet and any nearby equipment are protected. Use atarpaulin, cloth, or plastic sheeting to cover exposed equipment. Carefullyclean up any accumulated debris from the anchor installation before exposingthe equipment.

CAUTION

5. Move the cabinet away from the installation point. Drill holes for concretemounting anchors and fit them (Motorola suggests the RAWLNUT 1275).

6. Move the cabinet back to the installation point. Place an insulating shoulderwasher and then a flat washer onto each bolt. Loosely secure each cabinet to theanchors using the bolts with washers (Motorola suggests M12 x 100 bolts for usewith the RAWLNUT 1275 anchors).

7. Tighten the bolts, ensuring that the cabinet remains vertical and level.

8. Replace the lower fan housing/air baffle assembly removed in step 2.

GSM-100-433Installing the cabinet air deflector


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Installing the cabinet air deflector

Introduction

The SHN4757 air deflector unit is supplied with each cabinet. Installation isrecommended, but is left to the customer’s discretion.

The air deflector mounts on the cabinet door in front of the upper exhaust vent, which isapproximately at the height of a person’s eye when standing in front of the cabinet. Itdirects the airflow upwards without adversely affecting cabinet equipment cooling.

BSSC2

The unit comprises a deflector and four mounting screws.

Temporary installation

1. Clip the air deflector on to the cabinet door upper exhaust vent.

Permanent installation

1. Remove the protective caps from the four pre-drilled holes in the door around theupper exhaust vent.


3. Secure the air deflector to the door using four M5 screws.

BSSC

The unit comprises a deflector and three mounting screws.

Temporary installation


Permanent installation


2. Using the pre-drilled holes in the bottom flange of the deflector, mark the locationsfor screw mounting holes on the door.

3. Remove the air deflector.

4. Open the door and cover the internal units.

Wear safety glasses while drilling holes.

WARNING

Ensure that the interior of the cabinet is protected from possible swarfingestion.

CAUTION

5. Drill three 3.5 mm diameter holes through the door.

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6. Repeat step 1.

7. Secure the air deflector to the door using three M4 x 8 self tapping screws.

Diagram

Figure 2-2 shows the air deflector mounted on a BSSC cabinet:

ig.272.rh

CLIPS(2 EACH END)

M4 X 3TAPPING

AIR DEFLECTOR

EXHAUST VENT

DRILL THREE3.5 mm HOLES

(OPTIONAL)

Figure 2-2 BSSC cabinet air deflector mounting points

GSM-100-433Preparing to connect dc power and earth cables


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Preparing to connect dc power and earth cables

Introduction

The external converter used to supply the cabinet must have double orreinforced insulation between its primary and secondary circuits and must alsoconform to safety standard EN60 950.Do not make dc input power connections at the main dc power source at thispoint in the procedure.

WARNING

To protect unused connectors on the cabinet interconnect panel from damageby static electricity or foreign matter, ensure that the covers supplied are fitted.

CAUTION

Before connecting input dc power cables to the main dc power source, performany adjustment procedures on the main power supply equipmentrecommended by the manufacturer. Input to the cabinet, under all loadconditions, must remain between 22 V and 30 V dc for nominal +27 V dcoperation and between –40 V and –75 V dc for –48/60 V dc operation.

CAUTION

The dc power distribution system within each cabinet, including all internal power cablingand fuses, is factory assembled and tested.

The power requirements for the cabinets are listed in Chapter 1.

The power input and earth connectors are secured with M10 nuts.

Adequate means, for example a cable trough, must be provided for routeing cables fromthe main power source to the cabinet.

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PAB

Configure the power alarm board (PAB) jumpers JU1 to JU3 for the power supply polarityand the external +27 V backup supply as shown below:

(JU1 pins 2, 3) NEG 1 POS JU1

(JU2 pins 2, 3)INT EXT

JU2

JU3

1

1(JU3 pins 2,3)

JU1, set for negative earth (+27 Vdc) supply

JU2 and JU3 set to external supply

(JU1 pins 1, 2) NEG 1 POS JU1JU1, set for positive earth (–48/60 Vdc) supply

DAB

Configure the distribution alarm board (DAB) switches S1 and S2 for the cabinetequipment configuration. Each switch comprises eight switches in a line.

Table 2-2 lists the alarms that the switches S1 and S2 enable.

Table 2-2 S1 and S2 enabled alarms

Label Switch Position Circuit monitored On/Off

VSWR1 (Sector 1) S1 1 Power to VSWR1 monitor As required



Spare S1 4 OFF

BB O/P2 S1 5 BBBX lower shelf output ON

BB O/P1 S1 6 BBBX upper shelf output ON

BB I/P2 S1 7 BBBX lower shelf input ON

BB I/P1 S1 8 BBBX upper shelf input ON

DRCU5 S2 1 Power to DRCU5 ON if fitted






Spare S2 7 OFF

BBB ID S2 8 Backup battery fitted ON if fitted

The battery backup input and output alarms (switch S1 positions 5 to 8) areenabled when the switch is set to OFF.

NOTE



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BSSC2interconnectpanel

Figure 2-3 shows the BSSC2 interconnect panel.

PIX 1

PIX 0


GKO

BATTERYBACKUP

EARTH STUD

V IN

–48/60 V dcor+27 V dc

0 V

Figure 2-3 BSSC2 interconnect panel

Table 2-3 lists the BSSC2 interconnect panel connectors.

Table 2-3 BSSC2 interconnect panel connectors


20 to 75 V dcbatterybackup

DRAM backup battery PAB connector PC6 20 to 75 V dc backupbattery

MS0 to MS3 MSI ports (maximumsix E1/T1 perconnector – six Tx andsix Rx)

Corresponding MSconnector on lowerBSU/RXU backplane

E1/T1 line source ortermination equipment(via a T43 or BIB)


Corresponding MSconnector on upperBSU/RXU backplane


PIX0 andPIX1

End user alarminput/output ports

Edge connector of PIXmodules

End user alarmequipment


GKO connector onlower BSU backplane

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Negative earthBSSCinterconnectpanel

Figure 2-4 shows the negative earth BSSC interconnect panel.

GK0

PIX 0

PIX 1

EARTH STUD

FIBRE OPTIC CABLESFEED–THROUGH TUBE

+27 VBATTERYBACKUP

+27 V

Figure 2-4 BSSC interconnect panel (negative earth)

Table 2-4 lists the negative earth BSSC interconnect panel connectors.

Table 2-4 BSSC interconnect panel connectors (negative earth)


+27 V dcbatterybackup

DRAM backup battery PAB connector PC6 +27 V dc backupbattery







GK0 Not used

PIX0 andPIX1






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Positive earthBSSCinterconnectpanel

Figure 2-5 shows the positive earth BSSC interconnect panel.

PIX 1

PIX 0


X21-0 X21-1

GKO

BATTERYBACKUP

EARTH STUD

V IN

–48/60 V dc

0 V

Figure 2-5 BSSC intreconnect panel (positive earth)

Table 2-5 lists the positive earth BSSC interconnect panel connectors.

Table 2-5 BSSC interconnect panel connectors (positive earth)


+27 V dcbatterybackup

DRAM backup battery PAB connector PC6 +27 V dc backupbattery







PIX0 andPIX1





GKO connector onlower BSU backplane

X21-0 andX21-1

Not used in thisconfiguration

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Connecting dc power cables between cabinets and externalequipment

Introduction

Protect unused connectors on the cabinet interconnect panel from damage bystatic electricity or foreign matter by ensuring that the covers supplied arefitted.

CAUTION

The procedure below describes how to install dc power cabling from the cabinet to theDRAM battery back up equipment.

All cables and connectors must be supplied by the end user.

NOTE

Procedure

1. For BSSC2 cabinets, construct the required cables with reference to Table 2-6.

Table 2-6 DRAM battery back up cable requirements

Cable Cable type Connector: cabinet end Connector: externalend

Type Pin function Type Pinfunction

DRAMbackupbattery

Shieldedtwisted pair(red/black)1mm2

9 wayfemaleshieldedD type

1 (upper cage) and 2(lower cage): Battery–ve (black)7 (lower cage) and 6(upper cage) : Battery+ve (red)

End user’schoice

End user’schoice

2. Connect the cable shield to the connector shell at the cabinet end.

3. Make sure that no cable has short or open circuit conductors.

4. Locate the connector(s) on the top of the cabinet interconnect panel.

5. Connect the cabinet end of the cable to the cabinet mating connector.

6. Connect the other end of the cable to the external equipment mating connector.

GSM-100-433Connecting dc input power and earth cables to the cabinet


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Connecting dc input power and earth cables to the cabinet

Introduction

The location and details of the BSSC cabinet input power terminals and the earth studare shown in the diagrams and tables in Preparing to connect dc power and earthcables. earlier in this chapter.

Power and earthcables

Earth each cabinet using the earth stud on the interconnect panel on the top ofthe cabinet. Each cabinet must be individually connected to the master earthbar (MEB). Do not daisy chain cabinet earths.

CAUTION

The maximum cable lengths for BSSC(2) cabinets must observe the following rules:

S If the required length falls between two values of cross sectional area (CSA),round up to the next biggest cable.

S The earth cable must be the same size as the power cable.

S The cabinet overcurrent protection device must be a BS88 (IEC 51–3) fuse or aBS EN 60898 (IEC 898) main circuit breaker.

S Maximum ambient temperature +50 _C.

S Cables must be routed parallel and touching each other on a perforated tray(BS7671 method 11).

S The maximum length given is based on a 4% voltage drop at nominal voltage(BS7671 section 525–01–02).

Table 2-7 lists the maximum BSSC(2) cabinet cable lengths.

Table 2-7 BSSC(2) cabinet cable lengths

CSA (mm2) Maximum cable length (m)

+27 Vcabinet

–48 Vcabinet

–60 Vcabinet

16 –– –– ––

25 –– 21.6 27.0

35 16.1 30.3 37.8

50 21.7 40.7 50.9

70 32.0 60.1 75.1

95 43.8 82.3 102.9

120 56.0 105.2 131.5

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Power cables for–ve earthcabinets

Use the correct cable specified in the previous tables for the dc input power cable fromthe main dc power source.

Do not make dc input power connections at the main dc power source at thispoint in the procedure.The positive cable must be red and the negative cable must be black. Theblack cable is at earth potential.

WARNING

To connect dc power cables to a negative earth cabinet:

1. Ensure that the main power source output is switched off.

2. Connect the earth from the MEB to the earth stud on top of the cabinet.

3. Connect the red positive dc power cable from the main dc power source to thecabinet dc power connector assembly terminal marked VIN.

4. Connect the black negative dc power cable from the main dc power source to thecabinet dc power connector assembly terminal marked 0 V.

5. Tighten the dc power and earth terminal set screws (M10).

Power cables for+ve earthcabinets

Use the correct cable specified in the tables for the dc input power cable from the maindc power source.

Do not make dc input power connections at the main dc power source at thispoint in the procedure.The negative power cable must be blue and the positive cable must be black.The black cable is at earth potential.

WARNING

To connect dc power cables to a positive earth cabinet:

1. Ensure that the main power source output is switched off.

2. Connect the earth from the master earth bar to the earth stud on top of thecabinet.

3. Connect the blue negative (–) dc power cable from the main dc power source tothe cabinet dc power connector assembly terminal marked VIN.

4. Connect the black positive (+) dc power cable from the main dc power source tothe cabinet dc power connector assembly terminal marked 0V.

5. Tighten the dc power and earth terminal set screws (M10).

GSM-100-433Connecting dc input power and earth cables to the main power source


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Connecting dc input power and earth cables to the main powersource

Safety

Do not wear an antistatic wrist strap when servicing the power supplies orpower distribution cabling. Serious personal injury can result.The external converter used to supply the cabinet must have double orreinforced insulation between its primary and secondary circuits and must alsoconform to safety standard EN60 950.

WARNING

Procedure

To connect the dc power cables to the main power source:

Before connecting input dc power cables to the main dc power source, performany adjustment procedures on the main power supply equipmentrecommended by the manufacturer. Input to the cabinet, under all loadconditions, must remain between 22 V and 30 V dc for nominal +27 V dcoperation and between –40 V and –75 V dc for –48/60 V dc operation.

CAUTION

1. Ensure that all main dc power source output switches are switched off.

2. Ensure that all circuit breakers in the cabinet are switched off.

3. Use a digital voltmeter to ensure that power is not present.

4. Connect the positive lead of the input dc power cable to the positive terminal of themain dc power supply.

5. Connect the negative lead of the input dc power cable to the negative terminal ofthe main dc power supply.

Ensure that all power connections are secure.

WARNING

6. Do not apply power to the cabinet at this point in the procedure.

GSM-100-433 Installing power supply modules


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Installing power supply modules

Introduction

The following types of power supply modules (PSMs) are fitted:

S BSSC: Digital power supply module (DPSM).

S –ve earth BSSC2: Enhanced power supply module (EPSM).

S +ve earth BSSC2: Integrated power supply module (IPSM).

Before installing power supply modules, refer to the site specific documentation todetermine the following:

S The number of power supply modules to be installed.

S The positions in which the power supply modules are to be installed.

Procedure

To install the power supply modules:

1. Locate and unpack the power supply modules.

Switch the appropriate circuit breakers OFF to ensure that the supply to thePSMs is isolated.

CAUTION

Refer to the label on the power supply module to ensure that the correctmodule is fitted for the input power (–48V, –60V or +27V) used.

CAUTION

2. If the cabinet is delivered with the digital modules already installed, twotransportation panel fillers are fitted to the digital shelf to prevent the modules fromfalling out of the shelf in transit. Remove these by releasing the clips at the top andbottom, and replace them with blanking plates, before proceeding.

3. Mount each power supply module (and power converter if fitted) in the BSU/RXUshelf assembly according to the configuration information in the site specificdocumentation.

4. Pull each PSM forward by about 25 mm (1 in) to unseat it.

GSM-100-433Installing digital modules


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Installing digital modules

Introduction

Do not look directly into a fibre optic cable or data in/out connector with orwithout the use of optical aids. Laser radiation can come from either the datain/out connectors or unterminated fibre optic cables connected to data in/outconnectors.

WARNING

BSSC cabinets use circuitry that is sensitive to static discharge. Avoid handlingthe modules in a high-static environment. Do not touch connector contacts.Wear an earthed high-impedance wrist strap when handling modules.

CAUTION

Bus terminator cards (BTCs) are fitted in all BSU/RXU shelves at the factory.The BTC ejectors have a protective plastic cover over the ejector tabs, whichis held in place by a crosshead screw. The plastic cover must be removedbefore installing or replacing a BTC module.

NOTE

Before installing digital modules, refer to the site specific documentation to determine thefollowing:

S The number of digital modules to be installed.

S The positions in which the digital modules are to be installed.

Factoryinstallation

Some cabinets are delivered with all digital modules already installed. If this is the case,perform only those steps in the procedure that relate to cabling.

If a digital module is found to be unserviceable, return it to Motorola in the containerprovided in the PCB transportation boxes kit (SWBN4831A).

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Installing BBBXmodules

The battery back up board (BBBX) module has no backplane connections, and cantherefore be installed in any available slot, provided that the associated cables can reachit.

The cables are factory installed in the cabinet, but must be connected to the BBBXmodule on site.

Table 2-8 details the BBBX cabinet cabling.

Table 2-8 BBBX cable connectors

BBBXconnector

Type Pin Function Connectsto

Input 9-way male D-type 1 Input return DAB

4 Input good signal

5 Output good signal

6 Input voltage

7 Earth

9 Signal return (0 Vdigital)

Output 4-way 1 0 V ConnectorAI2 on

4 +5 VAI2 onbackplane

NOTEPins not listed are not used.

Procedure

Refer to Handling optical fibres in chapter 1 before connecting fibre opticcables.

CAUTION

To install the digital modules:

1. Locate and unpack the full-size and half-size digital modules. Place the moduleson an antistatic bench mat. If an antistatic bench mat is not available place eachmodule on the antistatic bag from which it was removed.

2. Locate a PIX module. If no PIX module is present go to step 6.

3. Locate the PIX interconnect cables that are tie-wrapped to the BSU/RXU shelf. Ifone PIX module is present, cut the tie-wrap for the cable labelled PIX0. If two PIXmodules are present, cut the tie-wraps for both cables (labelled PIX0 and PIX1).

4. Insert the first PIX module into slot 16, ensuring that the module is firmly seated inthe backplane connector. Insert the second PIX module (if present) into slot 15,making sure that the module is firmly seated in the backplane connector.

5. Connect the cable PIX0 to the PIX module in slot number 16 and tighten the twocaptive screws to secure the cable to the PIX module. Connect the cable PIX1 tothe PIX module in slot 15 (if present) and tighten the two captive screws to securethe cable to the PIX module.

GSM-100-433Installing digital modules


GMR-0468P02901W08-O

6. Insert the remaining modules in the BSU/RXU shelf assembly according to theconfiguration information in the site specific documentation and the diagrams onthe next two pages.

7. Make sure that the switch on the front of each digital module is set to the down(disabled) position.

8. Using a non-permanent marker, note the module arrangement used for this BSUshelf on the label affixed to the inside of the cabinet door.

BSU shelf

Figure 2-6 shows the BSU shelf module arrangement.

DRI and DRX modules are not used in a BSSC cabinet.XCDR modules may be replaced by an enhanced transcoder, GDP/GDP2.The GDP is compatible only with GSR3 or later software releases. The GDP2is compatible only with GSR7 or later software releases.

NOTE

Figure 2-6 BSU shelf

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RXU shelf

Figure 2-7 shows the RXU shelf module arrangement.

XCDR modules may be replaced by an enhanced transcoder, GDP/GDP2.The GDP is compatible only with GSR3 or later software releases. The GDP2is compatible only with GSR7 or later software releases.

NOTE

Figure 2-7 RXU shelf

GSM-100-433Installing the NVM board


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Installing the NVM board

Introduction

This section provides the information required to install the NVM board in either a BSC oran RXCDR site.

Installationoptions

The installation options for the NVM board are as follows:

S Installation in the BSU cage 0 in a BSC.

S Installation in the RXU cage 0 in an RXCDR.

Installation procedures for both of these options are described in the following pages.

Installing theNVM board in aBSC

The NVM board must be installed in slot 26 (SPARE) in the BSU cage 0 (master) of theBSC. Figure 2-8 shows the location of slot 26 in the BSU cage.

LOCATION OFSLOT 26

Figure 2-8 Location of slot 26 in the BSU cage

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Installing theNVM board in anRXCDR

The NVM board must be installed in slot 24 (XCDR 0) in the RXU cage 0 (master) of theRXCDR. Figure 2-9 shows the location of slot 24 in the RXU cage.

An XCDR will be lost if all the XCDR slots are used. However, if slot 24 (XCDR0) is currently being used and there is another spare XCDR slot, the XCDRboard and associated interface cabling can be moved from slot 24 to the spareslot.

NOTE

LOCATION OFSLOT 24

Figure 2-9 Location of slot 24 in the RXU cage

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NVM boardinstallationprocedure

This procedure assumes that the BSC/RXCDR is already initialized.

Proceed as follows to install the NVM board in either the BSU or the RXU cage:

The NVM board contains devices that are sensitive to static. A suitable earthstrap must be worn when handling the module.

CAUTION

1. Unclip the protective cover from the appropriate slot. If an XCDR board is alreadyinstalled in slot 24 in the RXU cage, refer to the note in the previous sectionInstalling the NVM board in an RXCDR.

2. Set the RESET/DISABLE switch on the front panel of the NVM board to theDISABLE position.

3. Insert the NVM board into the slot, ensuring that it locks firmly into the backplane.

4. Move the RESET/DISABLE switch up to the RESET position and release.

The red ALARM LED above the RESET/DISABLE switch illuminates to indicate aboard reset has occurred. Once the software detects the NVM board, the red LEDextinguishes and the green ACTIVE LED illuminates to show that the board isoperational.

When the software detects the PCMCIA card in slot 1, the green CARD 1 STATUSLED illuminates to show that the PCMCIA card is operational.

The red and green CARD 2 STATUS LEDs are currently not used.

NOTE

The procedure for installing the NVM board is now complete.

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Installing the control signal cabling

Introduction

The internal control signal cabling within each BSSC cabinet is factory fitted and tested.This section deals with external connections.

Inter-cabinetfibre opticconnections

Do not look directly into a fibre optic cable or data in/out connector with orwithout the use of optical aids. Laser radiation can come from either the datain/out connectors or unterminated fibre optic cables connected to data in/outconnectors.

WARNING

Refer to the site specific documentation for information on the following inter-cabinet fibreoptic interconnections:

S BSSC cabinet to BTS cabinet.

S BSSC cabinet to other BSSC cabinet.

E1/T1 lineconnections

Transient protection of the E1/T1 lines connected to Motorola equipment is theresponsibility of the end user. All E1/T1 lines brought in from outside thebuilding must be spark-gap (three-anode gas tube) protected at the buildingentry point. Where this is not practical, an optional transient-protection boardcan be purchased from Motorola. Consult Motorola about transient protectionfor the BSSC sites.

CAUTION

E1/T1 line connections are made by one of the following methods:

S 120 ohm twisted pair through a BIB mounted on top of the BSSC cabinet.

S 75 ohm coaxial cable through a T43 board mounted on top of the BSSC cabinet.

See T43 to backplane connections and BIB to backplane connections at the end ofthis chapter for the connections between the T43 or BIB and the cabinet backplane.

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End user I/Odevice cabling

A maximum of two PIX modules per cabinet allows for a total of eight sets of outputcontrol contacts and 16 input sense contacts at the BSSC site.

Relay-closure outputs

If connectors PIX0 and/or PIX1 on the cabinet interconnect panel are unused,they should be protected from damage by static electricity or foreign matter byensuring that the covers supplied are fitted.

CAUTION

The PIX module includes four relays controlled by a GPROC. There are both normallyopen and normally closed contacts for each of the four relays. The contacts are rated for1A at 30 V and can be used to control external equipment at the site such as fans oraudible alarms. The external equipment is connected to the BSSC at the 62-pin D-typeconnector marked PIX0 or PIX1 on the interconnect panel.

Dry-contact inputs

The PIX module includes eight inputs which can be used to connect external sensors.These inputs cause alarms to be reported at the BSC, which forwards the alarm to theOMC.

The external sensors are supplied by the end user. Each sensor is connected across apair of PIX inputs (SEN Dn and SEN Sn, where n corresponds to a PIX opto-coupler 1 to8). For correct operation, all sensors must be of the dry-contact type with the followingspecification:

S 10 kohms or greater across sense inputs is required for a logic 1 (PIX opto-coupleroff).

S 1 kohm or less across sense inputs is required for a logic 0 (PIX opto-coupler on).

These inputs are available at the 62-pin D-type connectors marked PIX0 and PIX1 on theinterconnect panel. Ensure that the connector being used is terminated at a PIX modulein the cabinet.

PIX connector

Figure 2-10 shows the PIX connector:

ig.279.rh

43 62

22 42

1 21

(MATING SIDE OF FEMALE CONNECTOR VIEWED FROMTOP OF CABINET)

Figure 2-10 PIX connector

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PIX connectordetails

Table 2-9 lists the PIX connector details:

Table 2-9 PIX connector details

PIN no. Function PIN no. Function PIN no. Function

1 Sense S7 22 Not used 43 Not used

2 Sense D7 23 Not used 44 Sense S8

3 Not used 24 Not used 45 Sense D8










13 Not used 34 Not used 55 Not used

14 Common 4 35 Not used 56 NC4

15 Not used 36 NO4 57 Not used






21 Not used 42 NO1

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T43 to backplane connections

Introduction

The following tables show the mapping between a single backplane and the fourassociated T43 positions (MS0 to MS3). Equipment containing two card cages will havefour T43 positions associated with each cage. Some equipment, for example the BTS,may not equip all four T43 positions.

The following mappings are listed:

S MS0 to BSU.

S MS1 to BSU.

S MS2 to BSU.

S MS3 to BSU.

S MS0 to RXU.

S MS1 to RXU.

S MS2 to RXU.

S MS3 to RXU.

MS0 to BSU

Table 2-10 lists T43 MS0 to BSU backplane card slot mapping:

Table 2-10 MS0 to BSU card slot mapping

MSI no. Card slot T43 conn. PINno.

4 L13 J1, Tx

4 L13 J2, Rx

4 L13 J4, Tx

4 L13 J5, Rx

2 L15 J7, Tx

2 L15 J8, Rx

2 L15 J10, Tx

2 L15 J11, Rx

0 L17 J13, Tx

0 L17 J14, Rx

0 L17 J16, Tx

0 L17 J17, Rx

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MS1 to BSU




5 L12 J1, Tx

5 L12 J2, Rx

5 L12 J4, Tx

5 L12 J5, Rx

3 L14 J7, Tx

3 L14 J8, Rx

3 L14 J10, Tx

3 L14 J11, Rx

1 L16 J13, Tx

1 L16 J14, Rx

1 L16 J16, Tx

1 L16 J17, Rx

MS2 to BSU




10 L7 J1, Tx

10 L7 J2, Rx

10 L7 J4, Tx

10 L7 J5, Rx

8 L9 J7, Tx

8 L9 J8, Rx

8 L9 J10, Tx

8 L9 J11, Rx

6 L11 J13, Tx

6 L11 J14, Rx

6 L11 J16, Tx

6 L11 J17, Rx



GMR-0468P02901W08-O

MS3 to BSU




11 L6 J1, Tx

11 L6 J2, Rx

11 L6 J4, Tx

11 L6 J5, Rx

9 L8 J7, Tx

9 L8 J8, Rx

9 L8 J10, Tx

9 L8 J11, Rx

7 L10 J13, Tx

7 L10 J14, Rx

7 L10 J16, Tx

7 L10 J17, Rx

MS0 to RXU

Table 2-14 lists T43 MS0 to RXU backplane card slot mapping:

Table 2-14 MS0 to RXU card slot mapping

MSI/XCDR/GDP

Card slot T43 conn.PIN no.

XCDR 5 L19 J1, Tx

XCDR 5 L19 J2, Rx

XCDR 4 L20 J4, Tx

XCDR 4 L20 J5, Rx

XCDR 3 L21 J7, Tx

XCDR 3 L21 J8, Rx

XCDR 2 L22 J10, Tx

XCDR 2 L22 J11, Rx

XCDR 1 L23 J13, Tx

XCDR 1 L23 J14, Rx

XCDR 0 L24 J16, Tx

XCDR 0 L24 J17, Rx

GSM-100-433 T43 to backplane connections


68P02901W08-O

GMR-04

2–31

MS1 to RXU



MSI/XCDR/GDP


XCDR 11 L13 J1, Tx

XCDR 11 L13 J2, Rx

XCDR 10 L14 J4, Tx

XCDR 10 L14 J5, Rx

XCDR 9 L15 J7, Tx

XCDR 9 L15 J8, Rx

XCDR 8 L16 J10, Tx

XCDR 8 L16 J11, Rx

XCDR 7 L17 J13, Tx

XCDR 7 L17 J14, Rx

XCDR 6 L18 J16, Tx

XCDR 6 L18 J17, Rx

MS2 to RXU



MSI/XCDR/GDP


XCDR 1 L9 J1, Tx

XCDR 1 L9 J2, Rx

XCDR 1 L9 J4, Tx

XCDR 1 L9 J5, Rx

XCDR 0 L10 J7, Tx

XCDR 0 L10 J8, Rx

XCDR 0 L10 J10, Tx

XCDR 0 L10 J11, Rx

XCDR 13 L11 J13, Tx

XCDR 13 L11 J14, Rx

XCDR 12 L12 J16, Tx

XCDR 12 L12 J17, Rx



GMR-0468P02901W08-O

MS3 to RXU


Table 2-17 MS3 to RXU cardslot mapping

MSI/XCDR/GDP


XCDR 4 L6 J1, Tx

XCDR 4 L6 J2, Rx

XCDR 4 L6 J4, Tx

XCDR 4 L6 J5, Rx

XCDR 3 L7 J7, Tx

XCDR 3 L7 J8, Rx

XCDR 3 L7 J10, Tx

XCDR 3 L7 J11, Rx

XCDR 2 L8 J13, Tx

XCDR 2 L8 J14, Rx

XCDR 2 L8 J16, Tx

XCDR 2 L8 J17, Rx

GSM-100-433 BIB to backplane connections


68P02901W08-O

GMR-04

2–33

BIB to backplane connections

Introduction

The following tables show the mapping between a single backplane and the fourassociated BIB positions (MS0 to MS3). Equipment containing two card cages will havefour BIB positions associated with each cage.

The mappings listed are:

S MS0 to BSU.

S MS1 to BSU.

S MS2 to BSU.

S MS3 to BSU.

S MS0 to RXU.

S MS1 to RXU.

S MS2 to RXU.

S MS3 to RXU.

GSM-100-433BIB to backplane connections


GMR-0468P02901W08-O

MS0 to BSU

Table 2-18 lists the BIB MS0 to BSU backplane card slot mapping:


MSI no. Cardslot

PCM signal(MSI board)

BIB conn.PIN no.

Signal(BIB board)

BIB no.& MS no.

4 L13 MEGATX+ J1–1 EXT_MEGA_RX1+ 0

4 L13 MEGATX– J1–20 EXT_MEGA_RX1– 0

4 L13 MEGARX+ J1–2 EXT_MEGA_TX1+ 0

4 L13 MEGARX– J1–21 EXT_MEGA_TX1– 0

4 L13 MEGBTX+ J1–4 EXT_MEGA_RX4+ 0

4 L13 MEGBTX– J1–23 EXT_MEGA_RX4– 0

4 L13 MEGBRX+ J1–5 EXT_MEGA_TX4+ 0

4 L13 MEGBRX– J1–24 EXT_MEGA_TX4– 0



















68P02901W08-O

GMR-04

2–35

MS1 to BSU



MSI no. Cardslot


BIB conn.PIN no.

Signal(BIB board)

BIB no.& MS no.



























GMR-0468P02901W08-O

MS2 to BSU



MSI no. Cardslot


BIB conn.PIN no.

Signal(BIB board)

BIB no.& MS no.



























68P02901W08-O

GMR-04

2–37

MS3 to BSU



MSI no. Cardslot


BIB conn.PIN no.

Signal(BIB board)

BIB no.& MS no.



























GMR-0468P02901W08-O

MS0 to RXU

Table 2-22 lists the BIB MS0 to RXU backplane card slot mapping:


MSI/XCDR/GDP

Cardslot

PCM signal(MSI/XCDR

board)

BIBconn.

PIN no.

Signal(BIB board)

BIB no.& MS no.

XCDR 5 L19 MEGATX+ J1–1 EXT_MEGA_RX1+ 0

XCDR 5 L19 MEGATX– J1–20 EXT_MEGA_RX1– 0

XCDR 5 L19 MEGARX+ J1–2 EXT_MEGA_TX1+ 0

XCDR 5 L19 MEGARX– J1–21 EXT_MEGA_TX1– 0

XCDR 4 L20 MEGBTX+ J1–4 EXT_MEGA_RX4+ 0

XCDR 4 L20 MEGBTX– J1–23 EXT_MEGA_RX4– 0

XCDR 4 L20 MEGBRX+ J1–5 EXT_MEGA_TX4+ 0

XCDR 4 L20 MEGBRX– J1–24 EXT_MEGA_TX4– 0



















68P02901W08-O

GMR-04

2–39

MS1 to RXU



MSI/XCDR /GDP

Cardslot

PCM signal(MSI/XCDR

board)

BIBconn.

PIN no.

Signal(BIB board)

BIB no.& MS no.



























GMR-0468P02901W08-O

MS2 to RXU



MSI/XCDR/GDP

Cardslot

PCM signal(MSI/XCDR

board)

BIBconn.

PIN no.

Signal(BIB board)

BIB no.& MS no.



























68P02901W08-O

GMR-04

2–41

MS3 to RXU



MSI/XCDR/GDP

Cardslot

PCM signal(MSI/XCDR

board)

BIBconn.

PIN no.

Signal(BIB board)

BIB no.& MS no.



























GMR-0468P02901W08-O


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GMR-04

i

Chapter 3

Decommissioning the equipment

GSM-100-433


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iii

Chapter 3Decommissioning the equipment i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Overview 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisite 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lifting cabinets 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


GSM-100-433


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68P02901W08-O

GMR-04

3–1

Overview

Introduction

This chapter describes how to decommission BSSC cabinets. To decommissionequipment not supplied by Motorola, for example battery chargers, power supplies andantennas, refer to the vendor’s instructions.

Hazardous voltages in excess of 50 V dc exist inside –48 V and –60 Vcabinets.

WARNING

Use extreme caution when working on a cabinet with power applied. Removeall rings, watches and other jewellery.

WARNING

Prerequisite

Read Chapter 1 of this manual before attempting to decommission a base site.

Lifting cabinets

BSSC cabinets are fitted with four lifting points, designed to accommodate M12 eyebolts,built in to the top panels. These lifting points are fitted with plastic inserts to protect thethreads. Motorola kit number SWLN4648A contains four M12 eyebolts manufactured toC.E. conformity, each with a safe weight load of 400 kg and individually numbered. Onlyeyebolts supplied in this kit must be used.

Before attempting to insert the eyebolts, visually check each one for any damage thatmay have occurred in transit. If any damage is apparent, DO NOT USE; contactMotorola for replacement.

To use the eyebolts correctly:

1. Carefully remove the plastic insert from the M12 threaded lifting point.

2. Insert the eyebolt into the thread, ensuring that no cross-threading occurs.

The eyebolts must not be overtightened; hand tight is sufficient. Screw theeyebolt fully into the lifting point so that no thread is left exposed.

WARNING

3. Repeat the procedure until all four eyebolts have been correctly fitted.

4. When the lifting operation is complete, remove the eyebolts and refit the plasticinserts.

For continued use of eyebolts, there may be local regulations that govern the use oflifting equipment and stipulate a test and/or examination regime. If the eyebolts are to beused, ensure that all such regulations are met.

GSM-100-433Decommissioning a BSSC cabinet


GMR-0468P02901W08-O

Decommissioning a BSSC cabinet

Introduction

Use the following procedure to decommission a BSSC, and use the checklist to check offeach action as it is completed. Photocopy the checklist as often as required; do not writeon the original.

Before starting

Before starting to decommission a BSSC ensure that:

S The main power source is switched off and that no power is connected to theBSSC cabinet.

S Sufficient packing crates and cartons are available to pack the decommissionedequipment.

Procedure

To decommission a BSSC cabinet:

1. Check the cabinet and its contents for signs of damage.

2. Use a digital voltmeter to ensure that power is not present in the cabinet.

Stow disconnected cables so that they do not constitute a hazard to personnelusing the site.

WARNING

3. Disconnect the positive and negative leads, of the cabinet input dc power cable,from the main power source. Do not remove the earth lead. Put the cables insuitable packaging.

4. Disconnect the E1/T1 link cables from the cabinet and secure them to theoverhead racking.

BSSC cabinets use circuitry which is sensitive to static discharge. Avoidhandling the modules in a high-static environment. When handling themodules, do not touch connector contacts. An earthed high-impedance wriststrap must be worn when handling modules.

CAUTION

5. Remove the fibre optic cables from the LANX modules and put them into suitablepackaging.

GSM-100-433 Decommissioning a BSSC cabinet


68P02901W08-O

GMR-04

3–3

6. Using a suitable screwdriver remove:

– The T43 or BIB boards including covers.

– The PIX modules from shelf 0.

– The BTC modules (from both shelves), take care not to damage the threadson the extractor lever covers.

– The remaining half size modules (from both shelves).

7. Ensure that the optical ports on the LANX modules are protected by dust caps.Put the boards and modules into antistatic bags then carefully pack them in theboxes provided.

8. Remove the following full-size modules from both shelves:

– The KSW modules.

– The GPROC/GPROC2 modules.

– The MSI modules.

– The GCLK modules.

9. Put the modules into antistatic bags then carefully pack them in the boxesprovided.

10. Remove the PSMs. Put the modules into antistatic bags then carefully pack themin the boxes provided.

11. Disconnect the power leads from the cabinet and the earth lead from the cabinetand the main power source.

12. If the BSSC is mounted on a plinth, remove the bottom fittings (bolts and washers)then carefully pack them in suitable bags.

13. Remove the overhead cable trough and supports and put them into suitablepackaging.

An unequipped BSSC cabinet can weigh up to 136 kg (300 lb). Handlecabinets with extreme caution to avoid tipping.

WARNING

14. Move the cabinet to a location where it can be safely packed into its woodentransit case.

GSM-100-433Decommissioning a BSSC cabinet


GMR-0468P02901W08-O

BSSC checklist

ENGINEER’S NAME DATE

SIGNATURE

SITE NAME

EQUIPMENT TYPE

NAT ID

All fibre optic cables disconnected

ACTION YES NO N/A

PSU decommissioned

Packing material (including anti�static bags) on site

Are cabinets damaged? If yes detail in comments box.

Cables disconnected from top of cabinet and stowed

PIX/ T43/ BIB/ BTC and modules removed and packed

Remaining half size modules removed and packed

GPROC/GPROC2 modules removed and packed

MSI/ KSW modules removed and packed

GCLK modules removed and packed

PSMs removed and packed

All loose cables in the cabinet stowed and secured

Earth cable disconnected from cabinet

Air deflector removed and packed

Cabinet bottom fittings removed and packed

Cabinet packed in transit case

Cable trough and supports removed and packed

COMMENTS

CH

AP

TE

R 2

GE

NE

RA

L P

RO

CE

DU

RE

SC

HA

PT

ER

3M

AIN

TE

NA

NC

EP

RO

CE

DU

RE

S

CH

AP

TE

R 4

RE

PL

AC

EM

EN

TP

RO

CE

DU

RE

S

CH

AP

TE

R 5

MIS

CE

LL

AN

EO

US

RE

PAIR

CH

AP

TE

R 1

INT

RO

DU

CT

ION

29 Aug 1997 Maintenance Information: BSC/RXCDR

68P02901W09-O

GMR-04

i

Category 533

Maintenance Information

GSM-100-533

29 Aug 1997ii Maintenance Information: BSC/RXCDR

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GSM-100-533


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iii

Category 533Maintenance Information i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Introduction 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audience 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose of the manual 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisites 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Structure 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Related documentation 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 2General procedures i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

General procedures 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .








Chapter 3Maintenance Procedures i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maintenance procedures 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisites 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-533

29 Aug 1997iv Maintenance Information: BSC/RXCDR

GMR-0468P02901W09-O





Chapter 4Replacement procedures i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Replacement procedures 4–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose 4–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Description 4–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Chapter structure 4–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .







GSM-100-533


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v










GSM-100-533

29 Aug 1997vi Maintenance Information: BSC/RXCDR

GMR-0468P02901W09-O







Chapter 5Miscellaneous repair i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Miscellaneous repair procedures 5–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction 5–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Obtaining replacement authorization 5–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .



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vii





GSM-100-533

29 Aug 1997viii Maintenance Information: BSC/RXCDR

GMR-0468P02901W09-O


68P02901W09-O

GMR-04

i

Chapter 1

Introduction

GSM-100-533


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GSM-100-533


68P02901W09-O

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iii


Introduction 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audience 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purpose of the manual 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisites 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Structure 1–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Related documentation 1–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

GSM-100-533


GMR-0468P02901W09-O

GSM-100-533 Introduction


68P02901W09-O

GMR-04

1–1

Introduction

Overview

This chapter:

S Gives the purpose of the maintenance category.

S Lists prerequisites for using the maintenance category.

S Lists documents related to this category.

Audience

This category is for technical staff who work at Base Station System (BSS) sites.

The category assumes a degree of familiarity with Motorola BSS hardware and software.Technical staff may use this manual to diagnose and repair the BSSC/2 cabinets.

Purpose of themanual

Use the procedures contained within this category to remove and replace variouscomponents in the cabinet.

Prerequisites

This category assumes the reader knows:

S How to operate a local maintenance terminal (LMT).

S How the BSS system works.

Structure

The manual contains the following:

S General procedures

This chapter contains general information, including information on:

– Resetting and reinitializing a site.

– Connecting a local maintenance terminal (LMT) to a cabinet.

– Locating and identifying faulty cabinets and devices.

S Maintenance procedures

This chapter contains information on the maintenance procedures to be carried outon the BSC/RXCDR cabinets.

S Replacement procedures

This chapter contains detailed replacement procedures for components within theBSC/RXCDR cabinet.

S Miscellaneous repair

This chapter contains replacement/repair procedures for cabinet components notincluded in the Replacement procedures chapter.

GSM-100-533Introduction

29 Aug 19971–2 Maintenance Information: BSC/RXCDR

GMR-0468P02901W09-O

Relateddocumentation

There are two types of reference documentation, required reference and generalreference.

S Required reference documentation consists of books which supplement theinformation contained within this manual. The required reference documentationfor this manual is the Technical Description: BSS Command Reference(GSM-100-321).

S General reference documentation contains background information to this manual.General reference documents to this manual are Maintenance Information: GSMAlarm Handling at the OMC-R and Operating Information: GSM System Operation(GSM-100-201).


68P02901W09-O

GMR-04

i

Chapter 2

General procedures

GSM-100-533


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iii

Chapter 2General procedures i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

General procedures 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 2–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .








GSM-100-533


GMR-0468P02901W09-O

GSM-100-533 General procedures


68P02901W09-O

GMR-04

2–1

General procedures

Introduction

This chapter contains general repair information. This information applies to allmaintenance and repair procedures.

Motorola recommends reading this chapter before:

S Leaving for a site.

S Beginning a repair procedure.

Table 2-1 lists the different sections in this chapter.

Table 2-1 General procedures sections

Section entitled Information contained

Test and Repair equipment lists

S A list of required testing equipment.

S A list of required repair equipment.

General repair procedures Site configuration overview information.

Man Machine Interface Information on the uses of MMI.

Locating faulty cabinets Instructions for isolating a fault to a cabinet

Connecting the LocalMaintenance Terminal (LMT)

Instructions for:

– Connecting the LMT.

– Setting up the MMI interface.

– Changing the security level.

Identifying the faulty devices The procedure for displaying alarms at the LMT.

Resetting and re-initializing asite

The procedure for resetting and re-initializing a sitefor power distribution unit module replacement.

GSM-100-533Test and Repair equipment lists


GMR-0468P02901W09-O

Test and Repair equipment lists

Repairequipment list

Table 2-2 lists the tools Motorola recommends for repairing cabinets.

Table 2-2 Repair equipment


1 Torque wrench, calibrated in newton meters or foot–pounds

1 Torx driver, size T–30





1 Nut driver, size 3/8ths inch

1 Nut driver, size 5/16ths inch

1 Flat blade screwdriver

1 Phillips screwdriver

1 Tamper-proof Allen key for loosening and tightening thecovers on external cabinet locks

1 Motorola approved wrist strap

1 Anti-static pad

May vary, dependingon the number ofboards beingremoved.

Anti-static containers or bags

1 Set, jewellers screwdrivers, both Phillips and flat blade

1 Bucket

Mild dishwashing soap or detergent

GSM-100-533 Test and Repair equipment lists


68P02901W09-O

GMR-04

2–3

Test equipmentlist

Table 2-3 lists the test equipment Motorola recommends for diagnosing and testingBSSC cabinets.

Table 2-3 GSM test equipment


1 IBM compatible personal computer (PC) with the followingminimum specifications:

– Intel 486 processor.

– 170 MB hard drive.

– 8 MB RAM.

– ODS Local Area Network (LAN) card.

NOTESome software tools require a PC with these specifications. Ifthe only purpose of the PC is to monitor alarms and enterMMI commands , a PC with the following specificationsshould suffice:

– Intel 386 processor.

– 60MB hard drive.

– 4 MB RAM.

– ODS Local Area Network (LAN) card.

1 RS–232 cable. 9-way female to 25-way male

1 ESD protection kit

GSM-100-533General repair procedures


GMR-0468P02901W09-O

General repair procedures

Overview

The Operations and Maintenance Centre (OMC) uses Base Station System (BSS) FaultManagement software to determine whether or not a site is in a fault condition. If it is, theOMC sends a technician to the site to fix the problem.

The rest of this section contains general steps to follow to isolate the fault.

Siteconfiguration

A site may include either or both of the following:

S Base station controller (BSC).

S Remote transcoder (RXCDR).

This manual assumes familiarity with these components. Refer to the appropriate servicemanuals for detailed descriptions.

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Man machine interface (MMI)

Definition

The MMI is the interface between the user and the software.

The MMI may run on:

S A terminal at the Operations and Maintenance Centre (OMC).

S A Local Maintenance Terminal (LMT).

MMI uses

Use the MMI to :

S Obtain information from the system:

– Display alarm reports.

– Retrieve device status.

S Control the system:

– Take modules out of service (OOS).

– Put modules into service (INS).

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Locating faulty cabinets

Purpose

This section contains instructions for isolating a particular fault to a particular cabinet.

Prerequisites

These steps assume that:

S The OMC requested a visit to the site.

S The OMC knew the site locations, and which cabinet was generating the alarm.

Procedure

Follow these steps to isolate the fault to a cabinet.

1. Enter the site if it is safe to do so.

2. Determine whether the BSC or RXCDR cabinets have alarm LEDs in the door.

Some older cabinets have an LED in the upper left corner. Later generations ofcabinets do not have this LED.

The cabinet LED indicates that the cabinet is receiving power.

If the cabinet... Then...

has an LED in the door... continue with step 3.

does not have an LED in thedoor...

skip ahead to step 4.

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3. Check the LED on each BSC and RXCDR cabinet.

If the doorLED is...

Thecabinet...

Therefore...

lit... has power... continue with step 4.

off... does nothave

power...

investigate the power failure to this cabinet.

i. Check the rectifiers for correctoperation. Refer to the documentationsupplied by the rectifier manufacturer.

– If the rectifiers are working correctly,continue with step ii, below.

– If the rectifiers are working incorrectly,repair or replace them according tothe manufacturer’s instructions.

Check back with the OMC to see ifthe alarm is cleared.

If the alarm is cleared, the condition isfixed. No further action is necessary.

If the alarm has not cleared, continuewith step ii, below.

ii. Check the top of the cabinet to see ifthere is voltage present.

– If there is no voltage present, checkfor an auto disconnect.

– If voltage is present, check for aninternal failure.

4. Open the door of the faulty cabinet.

The OMC should be able to identify the faulty cabinet, getting the information fromvarious alarm messages sent by the system.

If the OMC has not identified the faulty cabinet, open each cabinet at the site untilone with a fault indication is found. Such an indication would be a lit Alarm (red)LED.

5. Note the status of the LED indicators on the front panel of each module equippedwith them.

6. Continue with Connecting a local maintenance terminal (LMT)

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Figure 2-1 and Figure 2-2 show BSU and RXU module location within a shelf.

If AMR hardware modules are fitted retrospectively in BSSC installations, forthe purpose of these figures: For KSWX, read DSWX as relevant. For KSW, read DSW2 as relevant.

NOTE

Figure 2-1 BSU shelf modules slot assignment layout and backplane connectors

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Figure 2-2 RXU shelf modules slot assignment layout and backplane connectors

GSM-100-533Connecting a local maintenance terminal (LMT)


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Connecting a local maintenance terminal (LMT)

Overview

Most of the diagnostic and repair procedures suggest connecting a Local MaintenanceTerminal (LMT) in order to enter MMI commands, lock and unlock devices, and viewalarms.

This section gives detailed instructions for connecting the LMT.

Required toolsand equipment

This procedure requires the following equipment:

S IBM - compatible Personal Computer (PC).

S RS-232 cable.

Refer to Table 2-2 for a list of repair equipment specifications and Table 2-3 for a list oftest equipment specifications.

Prerequisites

Before performing the steps in this procedure, determine which cabinet contains themaster processor.

Connecting theLMT to a GPROC

The following procedure details the steps required to connect a PC to a GPROC, orGPROC2, creating an LMT.

1. Open the cabinet containing the master GPROC.

2. Locate the master GPROC.

Motorola recommends connecting a PC to the master GPROC. However, a PCcan be connected to any GPROC that is not in an alarm state.

3. Connect one end of the RS-232 cable to the asynchronous communicationscontroller port of the PC, and the other end to the TTY port connector on the frontpanel of the master GPROC.

4. Power up the PC.

The PC is now a Local Maintenance Terminal (LMT).

5. Continue with Setting up the MMI.

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Setting up theMMI

Follow these steps to set up the Local Maintenance Terminal.

1. Set the LMT TTY port parameters as:

– 9600 baud.

– 8 data bits.

– 1 stop bit.

– 1 start bit.

– no parity.

2. Press the RETURN (or ENTER) key.

The LMT displays one of the following prompts:

– MMI-ROM 0115 –> (for GPROC running in ROM).

– MMI-RAM 0115 –> (for GPROC running in RAM).

Work from either prompt.

Connection to the master GPROC will result in the number 0115 beingdisplayed as above. Connection to a GPROC other than the master, will resultin a different number being displayed.

NOTE

Changing thesecurity level

Follow these steps to change the security level.

1. Enter the disp_level command at the prompt.

The system displays the current user security level, like this:

Current security level is 1

2. Enter the chg_level command at the prompt.

The system asks for the password to gain access to the next level. There are twopasswords available:

– One password changes the security level to Level 2.

– The second password changes the security level to Level 3.

Passwords must be entered in sequence. The system does not permit a jumpfrom security Level 1 to security Level 3. Security Level 2 must be accessedfirst, followed by security Level 3.The passwords to gain access to security Level 3 will be held by the OMC.

NOTE

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3. Enter the password to access the next level of security.

Enter thepassword...

And the system displays... Then continue with...

correctly inROM...

the new security level and thesystem prompt:

Current security level is x

MMI-ROM 0115 –>

Where x is the new securitylevel. Possible values are:

– 2.

– 3.

Identifying the faultydevices

correctly inRAM...

the new security level and thesystem prompt:

Current security level is x

MMI-RAM 0115 –>

Where x is the new securitylevel. Possible values are:

– 2.

– 3.

Identifying the faultydevices

incorrectly the old security level and systemprompt.

step 3 and step 4, until thesystem displays the newsecurity level.

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Identifying the faulty devices

Prerequisites

Before performing the steps in this procedure,:

S Locate the faulty cabinet.

S Connect the LMT.

Equipment safety

During replacement procedures, it may be possible to identify signs of damage causedby overheating, short circuits or sudden component failure. This may indicate a problemthat could repeat itself, cause additional damage, or be a symptom of a failureelsewhere. Analysis of the problem may identify common faults and make correctiveaction possible.

It is recommended that:

S The OMC is informed that an equipment safety problem has been identified.

S The steps for Reporting safety issues are followed. These are detailed in theintroductory section of this manual.

Checking thealarm status

Use the following steps to check the status of the device that is reporting the alarm.

Devices that are Out Of Service (OOS) report an operational state of“disabled”.

NOTE

1. To enable alarm reporting, enter the following command at the LMT:

enable_alarm <site>

Where: is:

site 0 or BSC if the site is aBSC site.

site 0 if the site is an XCDRsite

2. To display a list of the currently active Fault Management Initiated Cleared andOperator Initiated Cleared alarms, enter the following command at the LMT:

disp_act_alarm <site>

Where: is:

site 0 or BSC if the site is aBSC site.

site 0 if the site is an XCDRsite

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3. Observe the displayed alarm report and active alarm list.

The system now displays alarm reports as they occur. The module in the alarmreport is detecting the alarm.

4. Check to see if the module reporting the alarm, or that has an active alarm, is thesame as the module with a status LED indicating a fault.

This module may be the source of the fault. However, some other device, cable orshelf could be causing the fault.

5. Look up the Device Alarm in the Device Alarms tables, detailed in MaintenanceInformation: BSS Field Troubleshooting (GSM–100–523).

There is an Alarm table for each device or digital board.

6. Diagnose the problem by following the Fault Diagnosis procedure indicated in theDevice Alarm table.

7. If necessary, use the module replacement procedures detailed in this manual toreplace the suspect module.

Additional fault isolation may be necessary if the module reporting the failure is replaced,placed in service and new alarms are reported again. To perform this additional faultisolation, evaluate the actual alarm message that the module is reporting. Refer to theGSM event/alarm messages in Maintenance Information: Alarm Handling at the OMC(GSM-100-501) for a list of valid alarm reports and alarm information details.

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Resetting and re–initializing a site

Overview

BSS software commands cannot take BSSC cabinet power distribution unit modules Outof Service (OOS).

Procedure

Follow these steps to reset a site for power distribution unit module replacement.

Resetting the site takes the site out of service (OOS) and drops all calls. It isadvisable to perform this procedure during periods of low traffic.

CAUTION

1. Enter reset_bss at the local Maintenance Terminal (LMT).

2. Replace the faulty module using the appropriate procedure.

3. Activate the front panel RESET switch on each of the following modules tore–initialize the site and put it back In Service (INS).

– MSI

– KSW/TSW

– GPROC

4. Verify the site automatically re-boots and is INS.

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Chapter 3

Maintenance Procedures

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Chapter 3Maintenance Procedures i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maintenance procedures 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Prerequisites 3–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .





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Maintenance procedures

Introduction

This chapter contains the maintenance procedures for the BSSC/BSSC2 cabinet.

Prerequisites

These procedures assume that field personnel are competent to work on MotorolaBSSC/BSSC2 equipment.

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Air filter replacement

Introduction

As part of BSSC/BSSC2 cabinet maintenance, foam air filters should be replaced everysix months with new or previously washed filters.

Replacementprocedure

Follow the procedure detailed under Air filter replacement in chapter 4, to correctlyreplace cabinet foam air filters.

Air filter cleaning

Air filters removed from BSSC/BSSC2 cabinets during air filter replacement must bewashed prior to storing for reuse. Follow the procedure detailed under Cleaning cabinetair filters later in this chapter, to correctly clean used foam air filters.

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Cleaning cabinet air filters

Introduction

Follow these instructions to wash the foam air filters fitted to the cabinet after they havebeen removed and taken to a location were they are to be cleaned.

Tools andequipment

This procedure requires the following tools and equipment.

S A bucket, or similar container.

S A source of warm water.

S Mild soap, dishwashing soap or detergent.

Cleaning cabinetair filters

To clean the cabinet air filters proceed as follows:

1. Wash the filter in warm soapy water.

2. Squeeze the water out of the filter gently, and allow the filter to dry.

Do not wring the filter. Wringing may tear the material.CAUTION

3. Inspect the filter for splits and holes. If the filter is undamaged it should be storedfor reuse. Damaged filters are to be discarded in accordance with localguidelines.

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Performing a physical inspection

Generalinformation

A physical inspection of all Motorola equipment should take place annually.

Motorola supplied computer equipment has a minimum environmental requirement. Allindoor equipment is to be installed in dry, cool, dust free conditions with adequate accessand lighting. Temperature control will be maintained with reference to the equipment heatdissipation figures found in the relevant equipment documentation and the surroundingenvironment.

Overall handling specifications:

S Storage:

– Humidity 10 to 90% non-condensing relative

– Temperature –40 to +70 degrees C

S Operate:

– Humidity 20 to 80% non-condensing relative

– Temperature 0 to +50 degrees C

S Dust: < 5 milligrams / 1000 cubic feet of air

Equipment cabinets and most modules supplied by Motorola are protected by a paintedfinish. The surfaces of the cabinets are to be adequately protected from accidentaldamage at all times.

An Annual physical inspection checklist is supplied later in this chapter.

SafetyExhaust and ventilation vents are not to be obscured by installation of cabinets, particularcare should be taken not to divert or restrict air conditioning airflow to operatingequipment and any equipment present where the installation in progress may interfere orhamper the airflow or generate adverse particulate matter.

Installation of any equipment must minimise the risk of personal injury, i.e. burrsremoved, cable tie excess tails cut flush, no loose cables, stable and secure cabinetsand racks, no exposed conductors etc.

Protective blanks, bungs and shields are to be complete and in position at all times otherthan necessary for maintenance/installation.

Cable trayCable tray is to be of suitable size and specification for its intended purpose. Thereshould be sufficient free space on the tray to allow cables to flow around corners withoutkinks or excessive bunching of the runs. Correct fixtures and fittings are to be used asper manufacturers’ recommendations and as supplied by Motorola. Under floor or walltray is to be secured at a maximum of 1.5 metre intervals. Cable tray is to be grounded tothe MGB (Main Ground Bar) using a single ground cable and each section of tray is to bebonded to its neighbour using the correct bonding leads. End plates and blanks are to beused when cable tray ends are not to a terminated by a wall fixing.

Having equipment plumb and square increases the stability of units and reflects theamount of care that has gone into planning the installation. Spirit levels and plumb linesor similar tools should be used throughout. This directly demonstrates the quality andworkmanship of the installation teams.

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Power System

All exposed terminals are to be covered using adequate insulation materials, that is,heatshrink or blanks.

Equipment racks and stacks are to be securely bolted to the floor and if necessaryequipment racks are to be top supported.

All conductor surfaces, that is, busbars, terminals, and so, are to be protected againstcorrosion by the application of an anti-oxidant compound.

Where a hazard to health exists, whether in the distribution, generation or storage stagesof the power system, it is to be clearly labelled as such. These warning labels are to belocated at the hazard point and on all access doors into any equipment room where sucha hazard is present.

Power system distribution interconnections are to be made using stainless steel fixings.The use of any other fixing will introduce corrosion and reduce the efficiency and life ofthe system.

Distribution busbars and cables are to be clearly labelled at both ends with the correctcolour coding and circuit identification.

Circuit breakers are to be of the correct rating and clearly labelled with the user unitidentification.

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Cabling

All cables installed are to be of the correct size and specification for their intended use.They are to be run on appropriate cable tray, in suitable conduit or trunking, observingminimum bend radius restrictions and care is to be taken in the planning of routes toavoid cables crossing each other or the run containing twists or kinks. Where cables arerun in conduit, care must be taken that the heat generated by the cable is below theconduit/cable manufacturer’s max recommendations. Cables running in conduit ortrunking are not to be secured using cable ties for ease of maintenance. At intersectionsruns should be as close as possible to 90 degrees to prevent high electrical energy beinginduced from one cable to another. RF cables are to be run in neat square runs, dividedinto Cells and cabinets, that is, cables representing Cell A Cabinet 1 run together, Cell BCabinet 2 together, and so on, dependent on individual configuration.

Precautions should be taken to avoid any damage to cables and where appropriate,protective devices installed. Cables are not to be run over sharp edges or burrs. Wherecables pass through or around metal panels, grommets or edging is to be used toprevent damage to the cable insulation.

All cables are to be labelled at both ends, these being descriptive, unambiguous andpermanent, indicating where the cable should be connected. They are to be run instraight parallel runs with smooth flowing curves. Crossing, twisting and tangles are to beavoided.

Cable ties are to be used to support the cable when mounted on cable tray. Uniformity isto be observed throughout the installation, that is, all ties of the same type, colour andfixed in identical style, sized accordingly. Ties are to have the excess tail cut flush withthe locking eye so as to prevent possible injury. Care is to be taken that no cable isdamaged or distorted by cable ties.

Cable lugs are, as far as possible, to be of the permanent compression type to minimizethe possibility of connections coming loose. Lugs and Crimps are to be taped with theappropriate colour code but not as to obscure the inspection hole. All terminations are tobe tight.

Where cables enter or exit the equipment room they must be sealed to the wall.

Wire wrapping connections are to have a minimum of 5 turns and are not to beconnected to a previously soldered pin. Soldered connections are to be free from excesssolder, the finish to be clean and bright, vividly highlighting the outline of the connectingconductor.

Punch block connections are to have a maximum of 2 mm of wire protruding beyond thepunch block cutter.

Shielded cables are to be bonded at one end only. The other end cut or tied backsufficiently to avoid connection to ground. Screen foil is to be cut back far enough andprotected using heatshrink or self vulcanising tape to remove the risk of shorting signalpins. Unused wires are not to be cut back, but folded back neatly and secured.

Where co-axial cable crimps/splices are used there should be no visible braid or frays onthe finished connector.

Under no circumstances are cables to be “cut down” to fit connectors of incorrect size.

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Grounding

Grounding is to be completed in accordance with the Motorola Grounding Guideline.

Grounding of all equipment cabinets and racks reduces noise and circulating currents. Inthe equipment room this revolves around the Main Ground Bar (MGB), complemented byan External Ground Bar (EGB). The MGB is in turn bonded to the building ground,lightning protection devices and feeders are to be bonded to the EGB where determinednecessary by equipment manufacturer. Ground bars are to be wall / under floor mountedusing insulated fixings.

Ground bars and connections to them are to be clean, free from corrosion and treatedwith anti-oxidant compound. No more than one ground connection is to be made on thesame point of contact, each grounding connection to be made using stainless steel nuts,bolts and split spring washers.

Each ground bar connection is to be labelled identifying the user equipment. The point atwhich the bond is made is to be clean and free from paint, that is, to bare metal avoidingcontact with galvanised materials. Galvanized or plated finishes are to be removed at thepoint of contact.

All equipment racks are to be individually bonded to the MGB, no daisy chains. Theminimum bend radii for ground is eight inches. #2 awg or larger. Stressed #6 or largercable is to be secured using two hole lugs at the Ground Bar.

Lightning arrester equipment is to be no more than three feet inside the building.

Each individual section of metal cable tray is to be bonded to its neighbour, and then oneground run to the MGB. The bonding lead is to be made from minimum 35 square mmcable and 15cm long. Connection to the tray is to be made using correct gaugecompression type lugs, stainless steel nuts, bolts and washers.

Anti–oxidant compound is to be used on all ground connections to prevent the risk ofcorrosion.

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Annual physical inspection checklist

Purpose of theannual physicalinspection

The annual physical inspection is to reveal whether each point is in accordance withMotorola Installation Standards (Pass) or not (Fail). Where the equipment installation hasbeen installed by the customer or party not under the control of Motorola it is to beindicated by * (asterisk) in either the Pass or Fail column. If there in no such item thenindicate with N/A.

Using thechecklist

To perform the annual physical inspection, use the checklist in Table 3-1. Tick againstPass or Fail for each item checked. See Performing a physical inspection in thischapter for full details.

Table 3-1 Annual physical inspection checklist

Description of Check

1 Adequate clearance maintained for access, maintenanceand cooling

Pass Fail

2 Air conditioning is of adequate capacity and operatingcorrectly

Pass Fail

3 Burrs removed from all metalwork Pass Fail

4 Cabinets and racks are individually grounded to the MGB Pass Fail

5 Cable bridge grounded to external ground bar Pass Fail

6 Cable ends and terminations made up correctly with noexposed braid or conductor

Pass Fail

7 Cable runs are neat and straight Pass Fail

8 Cable ties are cut flush with locking eye to prevent injury Pass Fail

9 Cable ties are neat, evenly spaced and of uniform type,colour and style of attachment

Pass Fail

10 Cable ties do not compress, distort or damage any cables Pass Fail

11 Cable tray (internal) is grounded to MGB by single cable Pass Fail

12 Cable tray installed horizontal with respect to the floor Pass Fail

13 Cable tray is adequately supported to prevent movement Pass Fail

14 Cable tray is constructed and assembled using correctfixings

Pass Fail

15 Cable tray is of adequate specification and size Pass Fail

16 Cable tray physically undamaged Pass Fail

17 Cable tray sections are to be bonded to their neighboursection correctly

Pass Fail

18 Cables clearly labelled at both ends Pass Fail

19 Cables not cut down to fit. Pass Fail

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Description of Check

20 Cables observe minimum bend radii Pass Fail

21 Cables of correct type and specification Pass Fail

22 Cables run to prevent injury or hazards Pass Fail

23 Circuit breakers correctly and clearly labelled Pass Fail

24 Circuit breakers of correct type and specification Pass Fail

25 DDF cable excess folded back and secured usingheatshrink

Pass Fail

26 End plates and blanks are used where necessary Pass Fail

27 Equipment clean and free from dust Pass Fail

28 Equipment physically undamaged Pass Fail

29 Equipment racks clearly labelled Pass Fail

30 Exposed metal conductor surfaces treated with antioxidant compound

Pass Fail

31 Ground bars are protected against corrosion using antioxidant compound

Pass Fail

32 Ground bars have only one connection per contact point Pass Fail

33 Ground cables correctly and individually labelled Pass Fail

34 Grounding connections to be made using stainless steelfixings and anti oxidant compound

Pass Fail

35 Lightning arresters are of correct type and specification Pass Fail

36 No ground connection is made to galvanised or platedsurfaces

Pass Fail

37 Power cable lugs of correct type and size Pass Fail

38 Power cables are to be correctly colour coded at bothends

Pass Fail

39 Power cables connections tight and secured usingstainless fixings

Pass Fail

40 Protective covers, edging and grommets are fitted toprotect cables

Pass Fail

41 Punch block cables to not protrude more that 2mm beyondthe cutter

Pass Fail

42 Shielded cables grounded at one end only (donor end) Pass Fail

43 Soldered connections are correctly made Pass Fail

44 Spare bungs and blanks are to be on site Pass Fail

45 Wire wrap connections have minimum 5 turns Pass Fail

46 Wire wrap connections not made to a previously solderedpin

Pass Fail

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Chapter 4

Replacement procedures

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Chapter 4Replacement procedures i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Replacement procedures 4–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Purpose 4–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Description 4–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Chapter structure 4–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .










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GSM-100-533

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Replacement procedures

Purpose

This chapter contains procedures for replacing various components within the BSScabinets.

Description

The OMC-R can often diagnose problems at the BSS site. The OMC-R:

S Receives alarms and statistics from the system.

S Interprets the alarms and statistics to pinpoint the problem in the system.

S Uses MMI command to try to further diagnose and possibly repair the system.

Sometimes the only possible way to fix the problem is to send field personnel to the BSSsite to replace a component in the cabinet.

As the OMC-R tries to diagnose the cause of the problems at the site, it may also be ableto identify the specific component that needs replacement. In these cases furtherdiagnosis and testing may be unnecessary; all that is required is to replace thecomponent identified by the OMC-R.

The rest of this chapter contains instructions for replacing:

S The individual full size digital boards.

S The individual half size digital boards.

Chapter structure

The replacement procedures are listed alphabetically, by device name (for example,CLKX, or GPROC/GPROC2).

If there are different procedures for replacing a redundant device and a similarnon-redundant device (such as redundant and non-redundant CLKX modules) theinstructions for replacing the redundant device are given first.

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Air filter replacement

Introduction

Follow these instructions to replace the foam air filters in the BSSC cabinets.

The cabinet air filters should be replaced with new or clean filters every six months. It isrecommended that filters are not washed on site but replaced with new or previouslywashed filters.

Tools andequipment

This procedure requires the following tools and equipment.

S New or previously washed air filters.

Table 4-1 contains the details of the replacement air filter that can be ordered.

Table 4-1 Replacement air filters

Kit Number(10 Filters):

Filter PartNumber:

Description: ApproximateSize:

SWEN4007A 3509601F03 BSSC/2 air filter 172mm x 610mm

Replacing the airfilter

To replace the cabinet air filters proceed as follows:

1. Open the cabinet door.

2. Lift the bar securing the filter and carefully lift it free.

3. Remove the filter.

Do not install a wet filter. A wet filter will damage the equipment.CAUTION

4. Position the new or previously washed filter.

5. Refit the securing bar.

6. Repeat step 2 to step 5 for the second filter, as necessary.

7. Close and latch the cabinet door.

8. Filters can be washed off site using warm water and mild soap (dishwashing soapor detergent) for later installation at a site.

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Interface board replacement

Introduction

This section gives instructions for removing and replacing a balanced line interface board(BIB) or a T43 interface board (T43). Since the procedure for both boards is the same,this section refers to either board as an interface board.

All channel traffic associated with an interface board is lost during thereplacement procedure. If only one 2.048 Mbit/s link is affected by aninterface board fault, replacement of the interface board should beperformed during a period of low traffic so as not to interrupt service on theother 2.048 Mbit/s links connected to the interface board.

CAUTION

Illustrations

Figure 4-1 shows a sample of the balanced line interconnect board (BIB).

J1

J0

Figure 4-1 Balanced-line Interconnect Board

Figure 4-2 shows a sample of the T43 interconnect board.

J1

J2

J5

J4

J7

J8

J10

J13 J11

J14

J16

J17

J0

Figure 4-2 Type 43 interconnect board

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Replacing aninterface board

1. Enter the lock_device command to take the affected MMS device out-of-service(OOS).

MMS is the software name for the 2.048 Mbit/s links.

2. Note the order that the 2.048 Mbit/s links are connected to the interface board.

3. Disconnect the 2.048 Mbit/s links from the interface board.

4. Remove the four screws that secure the interface board to the cabinet interconnectpanels.

5. Lift the interface board free to disconnect the 37-pin D connector.

6. Fit the replacement interface board to the 37-pin D connector on the cabinetinterconnect panel.

7. Secure the interface board to the interconnect panel using the four screwsremoved in step 4.

8. Reconnect the 2.048 Mbit/s links to the replacement interface board.

9. Enter the unlock_device command to bring the MMS device back in-service(INS).

GSM-100-533 Redundant clock extender (CLKX) module replacement


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Redundant clock extender (CLKX) module replacement

OverviewThis section contains instructions for removing and replacing redundant clock extendermodules (CLKX).

Illustration Figure 4-3 shows a typical CLKX card.

Fibre opticclock outputs to

local KSWXs

Backplaneconnector

Figure 4-3 Clock Extender (CLKX) module

ReplacingCLKXA

Follow these steps to replace CLKX A.

Replacing redundant CLKX modules may cause a system glitch when theCLKXs are being switched.

NOTE

1. Pull the CLKX forward just enough to disconnect it from the module backplane.This forces a changeover to CLKX B modules.

2. Disconnect the fibre optic cables from the CLKX A module to be replaced.

3. Remove the CLKX A module and insert the replacement CLKX.

4. Reconnect all the fibre optic cables.

Fibre optic cables used in conjunction with a CLKX board to transfer clocksignals from a parent shelf to remote shelves, must be of the same length tomaintain site synchronization integrity.

NOTE

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5. Push the CLKX back into the shelf until it connects to the backplane.

ReplacingCLKXB

Follow these steps to replace CLKX B.

1. Pull the CLKX forward just enough to disconnect it from the module backplane.This forces a changeover to CLKX A modules.

2. Disconnect the fibre optic cables from the CLKX B module to be replaced.

3. Remove the CLKX B module and insert the replacement CLKX.


5. Push the CLKX back into the shelf until it connects to the backplane.

GSM-100-533 Non-redundant CLKX replacement


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Non-redundant CLKX replacement

Overview

This section contains instructions for removing and replacing non-redundant clockextender modules (CLKX)

Illustration

Figure 4-3 shows a typical CLKX card.

Replacing theCLKX

Follow these instructions to remove and replace the CLKX.

Replacing stand-alone CLKX modules causes system down-time.NOTE

1. Disconnect all the fibre optic cables from the CLKX to be replaced.

2. Remove the faulty CLKX.

3. Insert the replacement CLKX.


Fibre optic cables used in conjunction with a CLKX board to transfer clocksignals from a parent shelf to remote shelves, must be of the same length tomaintain site synchronization integrity.

NOTE

GSM-100-533Replacing a fan unit


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Replacing a fan unit

Removing thefan

Follow these steps to replace a faulty fan:

1. Locate the faulty fan.

2. Use a flat-blade screwdriver to release the four quarter-turn fasteners whichsecure the fan to the shelf assembly.

3. Grasp the fan and pull it outward away from the cabinet.

4. Disconnect the fan power cable connector and lift it free of the cabinet.

Installing the fan

Follow these steps to install a fan unit:

1. Connect the Fan Power cable connector to the new fan.

2. Install the new fan into the cabinet.

3. Using a flat blade screwdriver, tighten the four quarter-turn fasteners that securethe fan to the shelf assembly.

4. Advise the OMC that the repair is complete and check that fuse and fan alarms atthe OMC are cleared.

GSM-100-533 Redundant GCLK module replacement


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Redundant GCLK module replacement

Overview

This section contains instructions for replacing redundant generic clock (GCLK) modules.

Illustration

Figure 4-4 shows a GCLK board.

FREQUENCYADJUST

BACKPLANECONNECTOR

2.048 MHz In16.384 MHz OUT

6.12 S OUT

ALARM LED (RED) NORMALLY OFF

ACTIVE (GREEN) LEDMASTER = ON

125uS OUTGROUND

60mS OUT



LATER VERSIONS OF THE GCLKDO NOT HAVE THE 6.12 S, 60mS

AND 4.24uS OUTPUTS ON THEFRONT PANEL

TEST PORTS

Figure 4-4 GCLK board

Replacing aredundant GCLK

Follow these steps to replace the GCLK module

1. Connect a local maintenance terminal (LMT) at the TTY port of the masterGPROC.

Refer to Connecting a local maintenance terminal (LMT), in Chapter 2 forinstructions.

Motorola recommends connecting the LMT to the TTY port of the master GPROC.However, if the master is unavailable, an LMT can connect to any availableGPROC.

If an LMT is unavailable, the OMC must enter all MMI commands.NOTE

GSM-100-533Redundant GCLK module replacement


GMR-0468P02901W09-O

2. Determine which GCLK card needs replacement.

Use the following table to determine the next action to take.

If... Then...

the master GCLK card needsreplacement...

i. In a TTY window, enter theswap_devices command totell the software to make theredundant GCLK themaster.

ii. Continue on to step 3.

the stand-by GCLK card... Continue on to step 3.

3. In a TTY window, enter the lock_device command to take the faulty GCLK outof service (OOS).

4. Disable the faulty GCLK using the front panel switch.

5. Remove the faulty GCLK.

6. Insert the replacement GCLK.

7. Ensure front panel switch is set for normal operation.

8. In a TTY window, enter the unlock_device command to bring the replacementGCLK back in service (INS).

GSM-100-533 Non-redundant GCLK replacement


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Non-redundant GCLK replacement

Overview

This section contains instructions for replacing non-redundant Generic Clock (GCLK)modules.

Prerequisite

If one is not already connected, connect a local maintenance terminal (LMT) at the TTYport of the master GPROC.


Motorola recommends connecting the LMT to the TTY port of the master GPROC.However, if the master is unavailable, an LMT can connect to any available GPROC.


Illustration

Figure 4-4 shows a GCLK board.

Conditions

There are two configurations that may require GCLK replacement. The following tableshows the two configurations and which instructions apply.

If the cabinet contains: Follow the steps in:

A single BSU shelf Replacing a Single Shelf Configuration GCLK inthis section

More than one BSU shelf Replacing a Multi-Shelf Configuration GCLK inthis section.

Follow the appropriate procedure.

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Replacing asingle shelfconfigurationGCLK

Follow these steps to replace a GCLK in a single-shelf configuration cabinet.

If an LMT is unavailable, the OMC-R must enter all MMI commands.NOTE

1. Insert the replacement GCLK into the empty GCLK slot.

2. In a TTY window, enter the equip_device command to equip the replacementGCLK.

3. In a TTY window, enter the unlock_device command to bring the replacementGCLK in-service (INS).

4. Wait at least 30 minutes for the GCLK to stabilize.

5. In a TTY window, enter the state command to verify the operational andadministrative state of the GCLK.

6. In a TTY window, enter the lock_device command to take the faulty GCLKout-of-service (OOS).

7. Set the RESET/DISABLE switch down to the DISABLE position to disable thefaulty GCLK.


9. Secure a blanking plate to the empty GCLK slot..

Replacing amulti-shelfconfigurationGCLK

Follow these steps to replace a GCLK in a multi-shelf configuration cabinet.

If the system is operational, module replacement will cause down-time forthe entire system.

CAUTION

1. In a TTY window, enter the lock_device command to take the faulty GCLKout-of-service (OOS).

2. Disable the faulty GCLK using the front panel switch.


4. Insert the replacement GCLK.

5. In a TTY window, enter the unlock_device command to bring the replacementGCLK in-service (INS).

6. Wait at least 30 minutes for the GCLK to stabilize.

7. In a TTY window, enter the state command to verify the operational andadministrative state of the GCLK.

GSM-100-533 Calibrating the GCLK


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Calibrating the GCLK

Introduction

Follow this procedure to calibrate the GCLK in the field. The GCLK must be calibratedwhen more than one frame slip per hour is observed or when the GCLK is phase lockedto the E1/T1 serial data stream and the system requests calibration.

The GCLK must be calibrated only by fully trained GSM qualified staff. Donot attempt this procedure under any circumstances unless the testequipment listed below is available.

CAUTION

Test equipment

The following test equipment is required:

S An IBM-compatible personal computer (PC).

S An RS232 9 to 25-way cable.

S A Rubidium standard.

S Universal counter – Hewlett Packard Model HP5385A or equivalent.

S Screened coaxial cable – BNC to 2 mm multicontact AG connector.

S New calibration sticker(s).

S A non-ferrous tuning tool.

Commands

The following commands must be used to calibrate the GCLK:

Command Function

disp_equipment Displays the active equipment at a specifiedsite.

state Displays the status of specified devices orfunctions.

chg_elementphase_lock_gclk <value><location>

Turns the phase lock function on or off, where<value> is 0 for off and 1 for on, and <location>is the site id.

disp_elementphase_lock_gclk<location>

Shows the status of the phase lock function<location> is the site id.

clear_gclk_avgs<location> gclk_id>

Clears LTA values in memory for a specifiedGCLK.

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Process

To calibrate the GCLK follow procedures:

S Initial preparation.

S GCLK calibration.

Before attempting this process record the board serial number, date of last calibrationand present frequency on the calibration record shown at the end of this section, andremove the old calibration stickers from the GCLK front panels.

Initial preparation

1. Connect the serial A port on the PC to a GPROC TTY port using the 9 to 25-wayRS232 cable.

2. At the PC start the terminal emulator program.

3. Connect the output from the 10 MHz standard to the reference input of thefrequency counter, select external standard.

4. Set the frequency gate time to 10 second and set the display to give 10 significantdigits.

5. To check to see if phase lock is on, at the CUST MMI prompt type:

disp_element phase_lock_gclk <location>

Where: <location> is: 0 or bsc, for a BSC

0 for an XCDR

This gives the status of phase lock at the site, 0 is shown for phase lock off and 1is shown for phase lock on.

6. If phase lock is on, at the CUST MMI prompt type:

chg_element phase_lock_gclk 0 <location>


0 for an XCDR

This turns off the phase lock to the selected site.

7. At the CUST MMI prompt type:

disp_equip<site number>

This gives the device id of the GCLKs.


state<site number>GCLK<dev id><dev id><dev id>

This displays the status for the GCLK.


clear_gclk_avgs <location> <gclk_id>


0 for an XCDR

<gclk_id> 0 or 1

This clears the LTA values for the specified GCLK.

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GCLK calibration

1. Connect the frequency counter to the front panel 16.384 MHz connection of theGCLK.

2. Connect the cable to the input port of the frequency counter and the jack plug endto the front panel of the GCLK 16.384 MHz output and ground respectively.

3. Using a non-ferrous tuning tool, adjust the potentiometer labelled FREQ ADJUSTon the GCLK to 16.384 MHz. The GSM specified tolerance is +/– 0.8 Hz, althoughit is desirable (and should be possible) to adjust the frequency more accuratelythan this. This reads as 16.384 000 00 on the frequency counter. Adjusting thepotentiometer clockwise increases the frequency and anticlockwise decreases thefrequency.

4. Repeat step 7 to step 3 if the other GCLK is to be calibrated.

5. If phase locking of the GCLK(S) at the site is required type:

chg_element phase_lock_gclk 1 <location>

This turns the phase lock on for the specified site.

6. Place a new calibration sticker, indicating the date of calibration, over thepotentiometer labelled FREQ ADJUST on each calibrated GCLK.

GCLK calibrationrecord form

The GCLK calibration record form is shown below:

SITE NAME ........................................

SITE ID ..............................................

SERIALNUMBER

OFBOARD

DATE

DATEOF

LASTCALIBRATION

FREQUENCYBEFORE

CALIBRATION

TESTER’S NAMES

.....................................

.....................................

GSM-100-533GPROC/GPROC2 replacement


GMR-0468P02901W09-O

GPROC/GPROC2 replacement

Overview

This section provides the procedure for replacing redundant and non-redundant GeneralProcessor (GPROC) boards. The procedure for replacing the GPROC or GPROC2 is thesame, only the procedure for the GPROC is given.

RedundantGPROCconsiderations

If the processing capability of a GPROC in a redundant system fails, the redundantGPROC should be loaded automatically with the appropriate code and enabled. Thesystem then takes the failed GPROC Out Of Service (OOS). Therefore, no ill effectsshould be seen during GPROC replacement.

Non–redundantGPROCconsiderations

If a non-redundant system is still operational, GPROC replacement may cause atemporary system glitch when GPROCs are switched.

Before going tothe site

The OMC must determine the following:

S Site number.

S Device ID.

S Cage number.

S Slot number.

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Locating thefaulty GPROC

Use the information from the OMC together with the LED display on the GPROCs tolocate the faulty board.

The following table shows the various LED displays.

If theGreen

LED is...

And theRed LED

is...

The board is... Additional action...

on... off... either:

S operating normally

S may be unequipped

no further action isnecessary.

S may be unequipped

Use the site command toverify whether the board isequipped or not.

flashing... off... waiting for code to download...

flashing... flashing... undergoing normal ROMprogramming...

flashing... on... in an alarm condition... continue with Removingth GPROCoff... on...

gthe GPROC.

on... on...

off... off... not receiving dc power...

Removing theGPROC

Follow these steps to set up the GPROC replacement:

Do not exchange all GPROCs connected to one LAN simultaneously or allDTE addresses will be lost.

CAUTION

1. Set up a local maintenance terminal (LMT) at the TTY port of a GPROC.

Refer to Connecting a local maintenance terminal (LMT), beginning in Chapter2 for instructions.


If an LMT is unavailable the OMC must enter all the MMI commands.NOTE

2. Enter the lock_device command to lock the faulty GPROC.

3. Set the RESET/DISABLE switch of the faulty GPROC to the down (DISABLE)position and remove the faulty GPROC.

GSM-100-533GPROC/GPROC2 replacement


GMR-0468P02901W09-O

Installing theGPROC

Follow these steps to replace the GPROC.

Replacing the master GPROC will cause a site outage.CAUTION

1. Insert the replacement GPROC into the empty GPROC slot.

Make sure the GPROC locks firmly into the backplane.

2. Set the RESET/DISABLE switch of the replacement GPROC to the middle (normaloperation) position.

3. The DTE addresses of a replacement master GPROC must be checked to ensurethat it is correct for the site in which it is installed.

4. In a TTY window, enter the equip_device command to inform the software toload code into the replacement GPROC.

5. In a TTY window, enter the unlock_device command to bring the replacementGPROC back in-service (INS).

Illustration

Figure 4-5 shows a GPROC module.

ig.202.rh

ALARM LED (RED)NORMALLY OFF

ACTIVE LED (GREEN)NORMALLY ON

TTY CONNECTOR



THIS OPTICALLY ISOLATED TEST PORTALLOWS CONTROL OF ON BOARD SELF

DIAGNOSTICS.

BACKPLANECONNECTOR

Figure 4-5 GPROC module

GSM-100-533 Redundant KSW/DSW2 replacement


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Redundant KSW/DSW2 replacement

Overview

This section contains instructions for replacing redundant kiloport switches(KSWs/DSW2s).

The procedures given in this chapter can be applied to both KSW and DSW2module replacement. In the text, read KSW as DSW2 as appropriate.

NOTE

Prerequisites

Connect a local maintenance terminal (LMT) before performing this procedure.


Refer to Connecting a local maintenance terminal (LMT) in Chapter 2 forinstructions.


Illustration

Figure 4-6 shows a sample KSW board.

ig.205.rh





DOWN = DISABLE BACKPLANE CONNECTOR

Figure 4-6 KSW board

GSM-100-533Redundant KSW/DSW2 replacement


GMR-0468P02901W09-O

Procedure

Follow these steps to replace a redundant KSW.

Module replacement may cause system down time.CAUTION

If an LMT is unavailable, the OMC must enter this command.NOTE

1. In a TTY window, enter the swap_device command to tell the software to switchto the replacement KSW (A/B).

2. In a TTY window, enter the lock_device command to take the faulty KSWout-of-service (OOS).

3. Set the RESET/DISABLE switch down to the DISABLE position to disable thefaulty KSW.

4. Remove the faulty KSW.

5. Insert the replacement KSW.

6. Set the RESET/DISABLE switch to the NORMAL OPERATION (middle) position.

7. In a TTY window, enter the equip_device command to equip the replacementKSW.

8. In a TTY window, enter the unlock_device command to bring the replacementKSW in-service (INS).

GSM-100-533 Non-redundant KSW module replacement


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Non-redundant KSW module replacement

Overview

This section contains instructions for replacing non–redundant kiloport switches(KSWs/DSW2s).

The procedures given in this chapter can be applied to both KSW and DSW2module replacement. In the text, read KSW as DSW2 as appropriate.

NOTE

Prerequisites

Connect a local maintenance terminal (LMT) before performing this procedure.

Motorola recommends connecting the LMT to the TTY port of the masterGPROC/GPROC2. However, if the master is unavailable, an LMT can connect to anyavailable GPROC/GPROC2.


Illustration

Figure 4-6 shows a sample KSW board.

Procedure

Follow these steps to replace the KSW.

Module replacement may cause a short SITE outage when KSWs areswitched.

CAUTION

1. Insert the replacement KSW into an empty KSW slot.

If an LMT is unavailable, the OMC must enter the following commands.NOTE

2. In a TTY window, enter the equip_device command to equip the replacementKSW.

3. In a TTY window, enter the unlock_device command to bring the replacementKSW in-service (INS).

4. In a TTY window, enter the swap_device command to tell the software to switchto the replacement KSW (A/B).

5. In a TTY window, enter the lock_device command to take the faulty KSWout-of-service (OOS).

6. Set the RESET/DISABLE switch down to the DISABLE position to disable thefaulty KSW.

GSM-100-533Non-redundant KSW module replacement


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7. Remove the faulty KSW.

GSM-100-533 Redundant KSWX module replacement


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Redundant KSWX module replacement

Overview

This section contains instructions for replacing redundant kiloport switch and doublekiloport switch extender (KSWX and DSWX) modules

The procedures given in this chapter can be applied to both KSWX and DSWXmodule replacement. In the text, read KSWX as DSWX as appropriate.

NOTE

Module replacement will cause the site to self-reset. It is recommended thatnetwork appropriate action be implemented to minimize the effects of thereset when the KSWXs are switched.

CAUTION

Illustration

Figure 4-7 shows a typical KSWX module.


LED (GREEN)

FIBRE OPTIC INPUTFROM CLKX

FIBRE OPTIC OUTPUTTO ANOTHER KSWX

FIBRE OPTIC INPUTFROM ANOTHER KSWX

BACKPLANECONNECTOR

Figure 4-7 Kiloport switch extender (KSWX) module

GSM-100-533Redundant KSWX module replacement


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LED indications

The indications for the redundant and non-redundant KSWX are shown in Table 4-2.

Table 4-2 LED indications

LED (Green) Action

Lit KSWX in local slot andKSWX is master andKSWX is receiving clocks from the fibreport andNo GCLK alarms andNo TDM receive violations from the fibreport andKSW not present

or

KSWX in local slot andKSWX is master andKSWX is receiving clocks from the fibreport andNo GCLK alarms andKSW is present

or

KSWX in remote or expansion slot andNo GCLK alarms andNo TDM receive violations from the fibreport

Flashing KSWX in local slot andKSWX is slave andKSWX is receiving clocks from the fibreport andNo GCLK alarms andNo TDM receive violations from the fibreport andKSW not present

or

KSWX in local slot andKSWX is slave andKSWX is receiving clocks from the fibreport andNo GCLK alarms andKSW is present

OFF When any of the lit or flashing criteria arenot present or no power to the card

GSM-100-533 Redundant KSWX module replacement


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Replacing KSWXA and B

Follow these step to replace a KSWX A or KSWX B.

1. Take network appropriate actions to use KSWX B modules only or KSWX Amodules only. The set that do not contain the the faulty KSWX are to be used.

2. Disconnect the fibre optic cables from the faulty KSWX.

3. Remove the faulty KSWX.

4. Install the replacement KSWX in the slot from which the faulty KSWX wasremoved.

5. Reconnect all fibre optic cables.

6. If required, take network appropriate actions to restore KSWX usage back to theset from which the faulty module was removed.

The fibre optic cables used with the KSWX cards to extend/expand the TDMhighway, from one BSU/RXU to another BSU/RXU, must be of the samelength. This allows correct operation of the TDM highway to be maintained.

NOTE

GSM-100-533Non-redundant KSWX module replacement


GMR-0468P02901W09-O

Non-redundant KSWX module replacement

Overview

This section contains instructions for replacing non-redundant kiloport switch and doublekiloport switch extender (KSWX and DSWX) modules

The procedures given in this chapter can be applied to both KSWX and DSWXmodule replacement. In the text, read KSWX as DSWX as appropiate.

NOTE

Illustration andindications

A board view of the redundant module is shown in Figure 4-7 and the LED indications inTable 4-2

Procedure

Follow these steps to replace a non-redundant kiloport switch extender module.

1. Disconnect all fibre optic cables from the faulty KSWX.

2. Remove the faulty KSWX.

3. Install the replacement KSWX in the slot from which the fault KSWX was removed.


The fibre optic cables used with the KSWX cards to extend/expand the TDMhighway, from one BSU/RXU to another BSU/RXU, must be of the samelength. This allows correct operation of the TDM highway to be maintained.

NOTE

GSM-100-533 Redundant LANX replacement


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Redundant LANX replacement

Overview

This section contains instructions for replacing redundant local area network extender(LANX) cards.

There are two sets of instructions:

S Replacing the LANX associated with the active LAN.

S Replacing the LANX associated with the standby LAN.

Follow the instructions that fit the situation.

Prerequisites

Connect a local maintenance terminal (LMT) before replacing this module.


Refer to Connecting a local maintenance terminal (LMT) in Chapter 2 for instructions.


Replacing theLANX associatedwith the activeLAN

Follow these steps to replace the LANX card for the active LAN.

Module replacement will cause system down time.CAUTION

1. In a TTY window, enter the swap_device command to tell the software to use thestandby LAN.

2. Disconnect all fibre optic cables from the faulty LANX card.

3. Remove the LANX card.

4. Install the replacement LANX card in the slot from which the faulty LANX card wasremoved.


6. Wait about 30 seconds.

7. Enter the state command to verify that one LAN device is busy and unlocked(active) and one LAN is enabled and unlocked (standby).

8. Enter the swap_device command to swap the active LAN back to standby andthe replacement LAN to active.

GSM-100-533Redundant LANX replacement


GMR-0468P02901W09-O

Replacing theLANX associatedwith the standbyLAN

Follow these steps to replace the LANX card for the standby LAN.

1. Disconnect all the fibre optic cables from the faulty LANX card.

2. Remove the LANX card.



5. Wait about 30 seconds.

6. Enter the state command to verify that one LAN device is busy and unlocked(active) and one LAN is enabled and unlocked (standby)

It may take the system up to 30 seconds to bring the standby LAN backin-service (INS).

NOTE

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Non-redundant LANX replacement

Overview

This section contains instructions for replacing non-redundant local area networkextender (LANX) cards.

LAN–A bus is controlled by the local area network extender module (LANX) module inupper slot 20 of the digital module shelf. LAN–B bus is controlled by the LANX module inupper slot 19 of the digital module shelf.

Procedure

Follow these steps to replace a non-redundant LANX module.

Module replacement will cause system down time.CAUTION

1. Disconnect all fibre optic cables from the faulty LANX card.

2. Remove the faulty LANX card.



GSM-100-533MSI and MSI-2 replacement


GMR-0468P02901W09-O

MSI and MSI-2 replacement

Overview

This section contains instructions for replacing the Multiple Serial Interface (MSI) moduleand the Multiple Serial Interface 2 (MSI2) module.

The term MSI is used generically for MSI and MSI-2 modules, except where indicated.

Non-redundantsystems

The following table shows the effects of replacing MSI boards in non-redundant systems.

If the MSI being replaced... Then...

can still carry some channeltraffic

capacity for all associated 2.048/1.544 Mbit/slinks is lost during MSI replacement.

cannot carry any channel traffic no other ill effects will be noticed

Redundantsystems

MSI replacement should be transparent to the user in a redundant system.

Illustration

Figure 4-8 shows a typical MSI board.





DOWN = DISABLE BACKPLANECONNECTOR

Figure 4-8 Multiple serial interface (MSI) module

GSM-100-533 MSI and MSI-2 replacement


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Procedure

Follow these steps to replace an MSI board.

1. Set up a local maintenance terminal (LMT) at the TTY port of a GPROC.



If an LMT is unavailable the OMC must invoke all MMI commands.NOTE

2. Enter the lock_device command to take the MSI out of service (OOS).

3. Set the RESET/DISABLE switch down to the DISABLE position to disable thefaulty MSI board.

4. Remove the faulty MSI board.

5. Install the replacement MSI board in the slot from which the faulty MSI board wasremoved.

6. Set the RESET/DISABLE switch to reset, then back to the NORMAL OPERATIONposition to bring the board into normal operating mode.

7. In a TTY window, enter the unlock_device command to bring the MSI boardback in-service (INS).

GSM-100-533XCDR replacement


GMR-0468P02901W09-O

XCDR replacement

Overview

This section contains instructions for replacing a transcoder module (XCDR).

Non-redundantSystems

The following table shows the effects of replacing XCDR boards in non-redundantsystems.

If the XCDR being replaced... Then...

can still carry some channeltraffic...

capacity for all E1/T links is lost during XCDRreplacement.

cannot carry any channel traffic... no other ill effects will be noticed

RedundantSystems

XCDR replacement should be transparent to the system in a redundant system.

Illustration

Figure 4-9 shows a typical transcoder module.






Figure 4-9 XCDR module

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Procedure

Follow these steps to replace a transcoder board.

1. Set up a local maintenance terminal (LMT) and connect it to the TTY port of aGPROC.



If an LMT is unavailable the OMC must invoke all MMI commands.NOTE

2. In a TTY window, enter the lock_device command to take the XCDR card out ofservice (OOS).

3. Set the front panel switch down to the DISABLE position to disable the faultyXCDR card.

4. Remove the faulty XCDR card.

5. Install the replacement XCDR card in the slot from which the faulty XCDR cardwas removed.

6. Set the front panel switch to the NORMAL OPERATION (middle) position.

7. In a TTY window, enter the unlock_device command to bring the XCDR back inservice (INS).

If replacing an XCDR module with a GDP module, as an upgrade, the OMCrequires command changes to recognize and use the different module.Ensure the OMC has made these changes before upgrading an XCDR modulewith a GDP module.

NOTE

GSM-100-533GDP/GDP2 replacement


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GDP/GDP2 replacement

Overview

This section contains instructions for replacing a Generic DSP Processor (GDP/GDP2)module when used as an XCDR.

The procedures given in this section can be used for both GDP and GDP2replacement. In the text, read GDP as GDP2 where appropriate.

NOTE

The GDP has two configured types, one for E1 serial line use and one for T1serial line use. Each GDP type has a different framer/transceiver withaccompanying crystal oscillator, and two associated resistors. This means thata GDP used for E1 serial line use cannot be used for T1, and a GDP used forT1 serial line use cannot be used for E1.If a GDP2 is retrospectively installed in a BSSC2 installation, it supports asingle E1 line interface.

NOTE

Non-redundantSystems

The following table shows the effects of replacing GDP boards in non-redundantsystems.

If the GDP being replaced... Then...

can still carry some channeltraffic...

capacity for all E1/T1 links is lost during GDPreplacement.

cannot carry any channel traffic... no other ill effects will be noticed

RedundantSystems

GDP replacement should be transparent to the system in a redundant system, as long asall traffic has been routed away from the board to be replaced.

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Illustration

Figure 4-10 shows a typical GDP module.






Figure 4-10 GDP module

Procedure

Follow these steps to replace a GDP transcoder module.

1. Set up a local maintenance terminal (LMT) and connect it to the TTY port of aGPROC.



If an LMT is unavailable the OMC-R must invoke all MMI commands.

NOTE

2. In a TTY window, enter the lock_device command to take the GDP card out ofservice (OOS).

3. Set the front panel switch down to the DISABLE position to disable the faulty GDPcard.

4. Remove the faulty GDP card.

5. Install the replacement GDP card in the slot from which the faulty GDP card wasremoved.

GSM-100-533GDP/GDP2 replacement


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6. Set the front panel switch to the NORMAL OPERATION (middle) position.

7. In a TTY window, enter the unlock_device command to bring the replacementGDP card in-service (INS).

If replacing an XCDR module with a GDP module, as an upgrade, the OMCrequires command changes to recognize and use the different module.Ensure the OMC has made these changes before upgrading an XCDR modulewith a GDP module.

NOTE

GSM-100-533 NVM replacement


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NVM replacement

Overview

This section contains the information required to replace a faulty NVM board.

Do Not remove the PCMCIA card from faulty NVM boards being returned toMotorola for repair. The returned unit must comprise the NVM board withPCMCIA card installed.

CAUTION

Notify the OMC-R before carrying out the following replacement procedures.

NOTE

Diagnosingfaults on theNVM board

Fault diagnosis is limited to viewing the front panel LEDs and ensuring that the switchesare set to the correct positions for normal operation.

Replacing theNVM board

Carry out the following procedure to replace a faulty NVM board. This procedureassumes that the BSC/RXCDR is already initialized.

The NVM board contains devices that are sensitive to static. A suitable earthstrap must be worn when handling the module.

CAUTION

1. Set the RESET/DISABLE switch to the DISABLE position.

2. When the red ALARM LED illuminates, remove the NVM board from the slot in thecage.

3. Set the RESET/DISABLE switch on the new NVM board to DISABLE and theninsert the board into the slot, ensuring that it locks firmly into the backplane.

4. Move the RESET/DISABLE switch up to the RESET position and release. Oncethe software recognizes the NVM board, the the red ALARM LED extinguishes andthe green ACTIVE LED illuminates to show that the NVM board is operational.

When the software recognizes the PCMCIA card in slot 1, the green CARD 1STATUS LED illuminates to show that the PCMCIA card is operational.

The procedure for replacing the NVM board is now complete.

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Front panelcontrols andindicators

Figure 4-11 shows the detail of the front panel controls and indicators on the NVM board.

1. Do not use the PCMCIAcard eject button. Thisfeature is not currentlysupported.

2. Do not use the PCMCIACARD SWAP switch. Thisfeature is not currentlysupported.

NOTES

NVM BOARDSTATUS LEDs

NVM BOARDRESET/DISABLE

SWITCH

PCMCIA CARDSTATUS LEDs

PCMCIA CARDSWAP SWITCH

(See Note 2)

PCMCIA CARDSLOTS

PCMCIA CARD EJECTBUTTON

(See Note 1)

Figure 4-11 Front panel controls and indicators on the NVM board

GSM-100-533 PIX replacement


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PIX replacement

Overview

This section contains instructions for replacing a parallel interface extender (PIX) board inan external alarm system.

Illustration

Figure 4-12 shows a PIX board.

ig.240.rh

ALARM LED (GREEN)ON = NO ALARMS

DETECTEDOFF = CUSTOMER ALARM

DETECTED

CONNECTOR IS CABLEDTO TOP OF CABINET FOR

CONNECTION TOCUSTOMER SITE

EQUIPMENT

BACKPLANECONNECTOR

Figure 4-12 PIX board

Replacing thePIX

Follow these steps to replace a PIX board.

Replacing this module may trigger false customer alarms.CAUTION

1. Disconnect interconnect cable from the front of the faulty PIX card.

2. Remove the faulty PIX card.

3. Install the replacement PIX card in the slot from which the faulty PIX card wasremoved.

4. Reconnect the interconnect cable to the front of the PIX card.

GSM-100-533Power supply module replacement


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Power supply module replacement

Overview

This section contains instructions for replacing power supply modules.

These are two sets of instructions:

S Replacing a non-redundant power supply module.

S Replacing a redundant power supply module.

Applications

This procedure applies to all of the various power supply modules used in Motorola BSCcabinets, including:

S DPSMs.

S EPSMs.

S IPSMs.

Illustration

Figure 4-13 shows the DPSM:

ig.242.rh

ALARM LED (RED):ON WHEN ONE OR MOREALARM CONDITIONS EXIST.OFF WHEN NO ALARMCONDITION EXISTS.

ACTIVE LED (GREEN):ON WHEN ALL OUTPUT VOLTAGESARE PRESENT AND WITHINTOLERANCE.

25-PIN D-TYPECONNECTOR (FEMALE)

CGND (CHASSIS EARTH)VINA – (0 V INPUT)VINA + (+27 V INPUT)

GND (EARTH FOR +5 V OUTPUT)GND (EARTH FOR +5 V OUTPUT)+5 V+5 V

REAR VIEW

Figure 4-13 DPSM

The other power supply modules are very similar in outward appearance. LED positionmay differ.

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Replacing anon-redundantpower supplymodule

Follow these steps to replace a non-redundant power supply module

If the shelf served by the faulty power supply module is still operational,module replacement should be transparent to the system.

NOTE

Do not mix power supply modules; for example, if a cabinet is equipped withDPSMs, do not try to insert any other type of power supply module.Always replace a power supply module with the same type of module!

CAUTION

1. Remove the air baffle from the unused slot.

2. Install the replacement power supply module in the empty slot.

3. Remove the faulty power supply module.

4. Re-install the air baffle in the slot from which the faulty power supply module wasremoved.

Replacing aredundant powersupply module

Follow these steps to replace a redundant power supply module:

If the shelf served by the faulty power supply module is still operational,module replacement should be transparent to the system.

NOTE

1. Remove the faulty power supply module.

2. Install the replacement power supply module in the empty slot from which the faultDPSM was removed in the previous step.

GSM-100-533Power supply module replacement


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Chapter 5

Miscellaneous repair

GSM-100-533


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Chapter 5Miscellaneous repair i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Miscellaneous repair procedures 5–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction 5–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Obtaining replacement authorization 5–1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .







GSM-100-533


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GSM-100-533 Miscellaneous repair procedures


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Miscellaneous repair procedures

Introduction

This chapter contains instructions for removing and replacing various components,including:

S Circuit breakers.

S Bus terminator cards.

Failure of these items is unusual. Usually, replacement of any of these items is firstrecommended by Motorola, through its local offices, and may recommend theseprocedures. They also may require parts or supplies that are not part of the normalrepair equipment.

Obtainingreplacementauthorization

Several of these replacement procedures require authorization or special parts fromMotorola. The replaceable modules are not part of standard replacement kit.

Contact the local Motorola office BEFORE attempting to replace these modules.

GSM-100-533Removing and replacing a circuit breaker


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Removing and replacing a circuit breaker

Overview

This section contains instructions for:

S Removing a circuit breaker.

S Replacing a circuit breaker.

Indications

Circuit breakers are durable pieces of equipment. If a circuit breaker trips, it can usuallybe reset by setting it up to the ON position.

However, sometimes a circuit breaker may not be able to be reset. That is, the circuitbreaker switch will not click into the ON position, or will not engage. In these cases thecircuit breaker is broken. The broken circuit breaker must be removed and a new oneinstalled in its place.

Removing acircuit breaker

Follow these steps to remove a circuit breaker.

1. Reroute all traffic to an unaffected cabinet.

2. Switch off all dc power supplies to the cabinet before removing and replacingcircuit breakers.

The external dc power supplies must be OFF during circuit breaker removal orinstallation.

WARNING

3. Open the cabinet door and locate the Power Distribution Unit (PDU) at the top ofthe cabinet.

4. Open the PDU cover to expose the circuit breakers and the Distribution AlarmBoard (DAB).

The DAB is located on the right side of the PDU.

NOTE

5. Remove all four M4 x 8 screws, and remove the circuit breaker cover.

6. Grasp the faulty circuit breaker and pull it outward, away from the cabinet until thecircuit breaker disengages from the mounting buses.

GSM-100-533 Removing and replacing a circuit breaker


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Installing acircuit breaker

Follow these steps to install a circuit breaker.

1. Check the circuit breaker to make sure it is the correct type and rating.

2. Install the circuit breaker.

3. Verify the breaker engages the mounting buses correctly and push the circuitbreaker firmly into place.

4. Refit the circuit breaker cover.

Step Action

a. Install the four M4 x 8 screws that secure the circuit breakercover.

b. Torque the hex standoffs to 2.2 Nm.

5. Close the PDU cover.

6. Close the cabinet door.

7. Reconnect dc power to the cabinet if necessary.

8. Switch on all dc power supplies to the cabinet.

It may be necessary to re-initialized the site after installing new circuit breakers andre-applying power to the cabinet. Refer to Resetting and re-initializing a site inChapter 2 for more information.

GSM-100-533Replacing a bus terminator card (BTC)


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Replacing a bus terminator card (BTC)

Overview

If DSW2 modules have been installed retrospectively in a BSSC installation,read KSW, as DSW2 where appropriate throughout this section.

NOTE

There are only two bus terminator cards (BTC) fitted in a shelf. There are no redundantBTCs to come into service when a BTC is removed. However, a BTC can be fitted intothe KSW cards position, which is adjacent to the faulty BTC, to maintain the bus.Consequently BTC replacement procedures are split into two groups: non-redundantKSWs and redundant KSWs.


These procedures require authorization or special parts from Motorola. The replaceablemodules are not part of standard replacement kit.

Contact the local Motorola office BEFORE attempting to replace this module.

Non-redundantKSWs

Follow the appropriate procedure relating to, a particular situation with, conditions asstipulated in the table.

ConditionsThere are 5 sets of conditions producing variants of the procedure to replace a BTC in ashelf with a non-redundant KSW. Follow the appropriate procedure relating to thesituation and conditions, from procedures 1 to 5 inclusive.

Procedure 5 lists the steps required to replace a BTC in a shelf with a redundant KSW.

If these conditions apply: Follow the steps in:

S Replacing BTC 0 (left side).

S KSW A is in the shelf.

S Spare KSW and BTC are available

Procedure 1.

S Replacing BTC 0 (left side).

S KSW B is in the shelf.

S A spare BTC is available.

Procedure 2.

S Replacing BTC 1 (right side).


S Spare KSW and BTC are available.

Procedure 3.

S Replacing BTC 1 (right side).



Procedure 4.

S Replacing BTC 0 or BTC 1.

S A redundant KSW is in the shelf.

Procedure 5.

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Procedure 1

Follow these steps to replace BTC 0 when:


S A spare KSW and BTC are available.

This Procedure contains three sub-procedures:

S Preparing the cabinet

S Replacing the BTC

S Restoring the cabinet

Module replacement should be transparent to the system. The systemretains as much system functionality as possible.

NOTE

Preparing the cabinet

Follow these steps to prepare the cabinet for BTC replacement.

1. Insert a spare KSW into the empty slot 1 (KSW B).

2. Connect an LMT, if one is not already available.


3. In a TTY window, enter the equip_device command to equip the spare KSW.

4. In a TTY window, enter the unlock_device command to bring the spare KSWin-service (INS).

Replacing the BTC

Follow these steps to replace the BTC.

1. Enter the swap_device command to inform the software to switch to KSW B.

2. Disable KSW A in slot 27 using its front panel switch and remove KSW A.

3. Insert the spare BTC into slot 27.

4. Remove the covers from the module extractor tabs located on the front of BTC 0 inslot 28 and remove BTC 0.

5. Insert the replacement BTC into slot 28 (BTC 0) and refit the extractor tabs.



GMR-0468P02901W09-O

Restoring the cabinet

1. Remove the spare BTC from slot 27.

2. Re-insert KSW A into slot 27.

3. In a TTY window, enter the unlock_device command to bring KSW A in-service(INS).

4. In a TTY window, enter the swap_device command to inform the software toswitch back to KSW A.

5. Remove the spare KSW B from slot 1.

Procedure 2





NOTE

1. Insert a spare BTC into the empty slot 27 (KSW A).




Procedure 3



S A spare KSW and BTC are available.

This Procedure contains three sub-procedures:

S Preparing the cabinet.

S Replacing the BTC.

S Restoring the cabinet.


NOTE



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Follow these steps to prepare the cabinet for BTC replacement.

1. Insert a spare KSW into the empty slot 27 (KSW A).



3. In a TTY window, enter the equip_device command to equip the spare KSW.

4. In a TTY window, enter the unlock_device command to bring the spare KSWin-service (INS).

Replacing the BTC

Follow these steps to replace the BTC.

1. Enter the swap_device command to inform the software to switch to KSW A.

2. In a TTY window, enter the lock_device command to take KSW B out-of-service(OOS).

3. Disable KSW B in slot 1 using its front panel switch and remove KSW B.

4. Insert the spare BTC into slot 1.





2. Re-insert KSW B into slot 1.

3. In a TTY window, enter the unlock_device command to bring KSW B in-service(INS).

4. In a TTY window, enter the swap_device command to inform the software toswitch back to KSW B.

5. Remove the spare KSW A from slot 27.



GMR-0468P02901W09-O

Procedure 4





NOTE

1. Insert a spare BTC into the empty slot 1 (KSW B).




Redundant KSWs

The following procedure details the steps to follow when replacing a faulty BTC, in a shelfconfigured with a redundant KSW card.

Module replacement should be transparent to the system. The system retainsas much system functionality as possible.

NOTE

Procedure 5

Follow these steps to replace BTC 0 or BTC 1 when:

S Both KSW A and KSW B are installed and configured.


This procedure contains three sub-procedures:

S Preparing the cabinet.

S Replacing the BTC.

S Restoring the cabinet.




2. If necessary, in a TTY window enter the swap_devices command to make theKSW, adjacent to the faulty BTC card, redundant.

3. In a TTY window, enter the lock_devices command to take the redundant KSWcard out-of-service (OOS).



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Replacing the BTC

1. Disable the redundant KSW card using its front panel switch and remove it fromthe shelf.

2. Insert the spare BTC card into the vacant slot.

3. Remove the covers from the module extractor tabs located on the front of thefaulty BTC card and remove it from the shelf.

4. Insert the replacement BTC card and refit the extractor tabs.

5. Remove the spare BTC card installed in step 2.

6. Refit the KSW card removed in step 1, ensuring the front panel switch is set to theNORMAL OPERATING position.


1. In a TTY window, enter the unlock_device command to bring the KSWin-service (INS).

2. If necessary, enter the swap_devices command to make the refitted KSW themaster for the shelf.

3. Disconnect the LMT, connected in step 1 of Preparing the cabinetsub–procedure.

GSM-100-533Replacing the alarm board (DAB/PAB)


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Replacing the alarm board (DAB/PAB)

Introduction

This section explains how to replace a distribution alarm board (DAB). The removal andreplacement procedures are also applicable for replacing the power alarm board (PAB).

Background

Under some circumstances, the alarm board in a BSSC cabinet may fail. In thesecircumstances it is necessary to replace the faulty board.

Although alarm boards can be replaced in the field, they are not considered “fieldreplaceable” boards.

Replacing an alarm board is an extraordinary action which requires consultation with andauthorization from the local Motorola office and the CNRC.

Contact the local Motorola office before attempting to replace a DAB/PAB!

Precautions

Follow these precautions when removing or replacing the DAB and PAB:

S Contact the local Motorola office for advice and authorization BEFORE attemptingthis procedure.

Disconnect the external power supply from the cabinet before commencingthis procedure. Hazardous voltages may remain inside the cabinet afterpower is disconnected. Remove all watches, rings and other jewelry beforecommencing work.

WARNING

S Switch off all power to the cabinet. If possible, disconnect the power cables fromthe top of the cabinet.

S Do not cross input cables.

Some of the cable links use similar connectors and it is possible to cross thecables when reconnecting. Label the cables, if necessary, to prevent mistakesduring reconnection.

S Use care when connecting and disconnecting cables.

Some of the connectors are fragile. Note how the connectors fit, and pull or pushthem gently.

GSM-100-533 Replacing the alarm board (DAB/PAB)


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Removing theboard

Follow these steps to remove a DAB or PAB:

1. Switch off the power to the cabinet.


WARNING

2. Disconnect the various connectors from the board.

There are several different types of cable connectors.

A PAB will have the same physical dimensions as a DAB, securing to the cabinetin the same way and have similar connectors to remove.

A diagram of a PAB can be found in category 333 under PAB.

Figure 5-1 shows a DAB with cable connectors identified.

SCREW DIP SWITCHES SCREW

SCREWSCREW

Figure 5-1 Distribution alarm board

3. Loosen the screws that secure the board.

The alarm board is held in place by four black Phillips head captive screws(screws which do not come out of the board).

4. Pull the board GENTLY away from the cabinet.

The board may be firmly anchored to the cabinet. Make sure all the screws havebeen loosened fully.

Be careful when pulling on the alarm board. Try to pull from both ends,rather than from the middle of the board. If possible, try to rock the boardfree.

CAUTION

GSM-100-533Replacing the alarm board (DAB/PAB)


GMR-0468P02901W09-O

5. Place the removed board to one side.

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Installing a newboard

Follow these steps to install the new alarm board:

1. Set the DIP switches on the new board to reflect the settings of the DIP switcheson the removed faulty board.

DIP switches are only present on a DAB. A PAB is configured with jumpersettings. The jumpers must be configured on the replacement PAB to reflectthe settings on the removed faulty PAB.

NOTE

2. Line up the 0 V and +27 V posts on the new board with the input ports in thecabinet.

Make sure the various cables are not positioned behind the board or obstructingthe board.

0 V and +27 V posts are only found on the DAB.

NOTE

3. Press the board into the cabinet until it seats firmly into position.

4. Tighten the screws until they are firm, to secure the board in the cabinet.

5. Connect the cables removed in step 2 of Removing the board.

6. Restore power to the cabinet.

GSM-100-533Replacement of PDB and AIB boards


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Replacement of PDB and AIB boards

Introduction

This section explains how to remove and replace a power distribution board (PDB) andan alarm interface board (AIB). Removal and replacement procedures are detailedseparately.

Background

Under some extraordinary circumstances, the PDB board and/or AIB board in a BSSCcabinet may fail. In these circumstances it is necessary to replace the faulty board.

Although PDB and AIB boards can be replaced in the field, they are not considered “fieldreplaceable” boards.

Replacing PDB and AIB boards is an extraordinary action which requires consultationwith and authorization from the local Motorola office and the CNRC.

Contact the local Motorola office before attempting to replace a PDB or AIB board!

Precautions

Follow these precautions when replacing PDB and AIB boards:

S Contact the local Motorola office for advice and authorization BEFORE attemptingthis procedure.


WARNING

S Switch off all power to the cabinet. If possible, disconnect the power cables fromthe top of the cabinet.

S Do not cross input cables.

Some of the cable links use similar connectors and it is possible to cross thecables when reconnecting. Label the cables, if necessary, to prevent mistakesduring reconnection.

S Use care when connecting and disconnecting cables.

Some of the connectors are fragile. Note how the connectors fit, and pull or pushthem gently.

GSM-100-533 Replacement of PDB and AIB boards


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PDB removal

Follow these steps to remove a PDB board:

1. Switch off the power to the cabinet.


WARNING

2. Disconnect connectors PC1, PC3, PC5, PC6, PC7 and PC8.

There are several different types of cable connectors so correct reconnection isensured.

Figure 5-2 shows a PDB with cable connectors identified.

+ 27 V POSTS

GND POSTS

Figure 5-2 PDB board

3. Remove the plastic butterfly nuts from the + 27 V posts, and take off the plasticsafety cover and stand-offs.

The butterfly nuts attach to the stand-offs securing the plastic safety cover to theboard.

4. Loosen and remove the nuts that secure the board, and remove the metalretaining bracket from GND posts.

The PDB board is held in place by six nuts secured on to six brass threaded posts.The three uppermost posts provide the GND connection for the board, with thethree lower posts providing the + 27 V connection.

5. Remove the final two connectors, PC2 and PC4.



GMR-0468P02901W09-O


Be careful when pulling on the alarm board. Try to pull from both ends,rather than from the middle of the board. If possible, try to rock the boardfree.

CAUTION


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PDB installation

Follow these steps to install a replacement PDB board:

1. Line up the GND and + 27 V positions with the threaded brass posts on thecabinet.

2. Press the board into the cabinet until it seats firmly into position, being careful tomake sure no cables are positioned behind or are obstructing the board.

3. Fit connectors PC2 and PC4.

4. Position the metal retaining bracket over the brass GND posts, and fit and tightenthe six nuts on to the six brass posts, securing the board in to the cabinet.

5. Fit the plastic safety cover over the + 27 V posts using the stand-offs and butterflynuts to secure it.

6. Reconnect the connectors removed in step 2 of PDB removal (PC1, PC3, PC5,PC6, PC7, PC8).

7. Restore power to the cabinet.

AIB removal

Follow these steps to remove the AIB board:

1. Switch off power to the cabinet.

Do not continue with this procedure until the cabinet power is off!

WARNING

2. Disconnect all the connectors from the board.

There are several different types of cable connectors.

Figure 5-3 shows an AIB board with cable connectors identified.

ig.249.rh

JU

4

JU

3

JU

2

PC9

PC8

PC7

JU5

PC3

PC6PC1

PC2

F2 F1

DS1

PC3Serialchip

JU

1

Figure 5-3 Alarm interface board

3. Loosen the screws that secure the board.

The board is held in place by four Torx head screws.



GMR-0468P02901W09-O


The board may be firmly anchored to the cabinet. Make sure all the screws havebeen loosened or removed.


AIB installation

Follow these steps to install a replacement AIB board:

1. Ensure jumpers JU1 to JU5 are set to match the jumper settings on the AIB boardremoved in step 4 of AIB removal.

2. Align the board correctly with the screw holes for the four retaining screws andpress the board into the cabinet until it seats firmly into position.

Make sure the various cables are not positioned behind the board or areobstructing the board.

3. Tighten the screws until they are firm, to secure the board in the cabinet.

4. Connect the cables removed in step 2 of AIB removal.

5. Restore the power to the cabinet.

GSM-100-533 Replacing the BSU digital cage


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Replacing the BSU digital cage

Introduction

Under certain extraordinary circumstances, it may be necessary to replace the entireBSU cage/backplane assembly within a cabinet. This procedure explains how to replacethe digital cage.

The procedure takes the cabinet out of service for about four hours. Motorolarecommends performing this procedure during hours of low traffic if possible.

Prerequisites

Contact Motorola with any questions about this procedure.

NOTE

Replacing a cage is an extraordinary action. Therefore, these instructions assume theperson(s) performing this procedure are experienced in all aspects of site maintenance.

Motorola recommends reading through the entire procedure, including the various relatedtexts and references, before attempting to perform it.

Tools andequipment

The following tools and equipment are necessary to remove and replace the backplane:

S Torx drivers.

S Antistatic mat.

S Antistatic bags, or other containers suitable for storing digital boards, in quantitiessufficient to store all the boards in the cages(s).

S An approved earth strap.

S Labels and marking pens.

GSM-100-533Replacing the BSU digital cage


GMR-0468P02901W09-O


The digital cage is very reliable. Replacement is only necessary in certain limitedcircumstances.

Therefore, the Customer Network Resolution Centre (CNRC) Swindon must issue aService Request (SR) before Motorola will accept a cage or backplane for return. TheSR shows that CNRC agreed to the backplane replacement.

Do not attempt to remove or replace a cage until CNRC authorizes suchaction.

NOTE

Procedure

Follow these steps to obtain an SR number:

1. Call the CNRC on +44 (0)1793 565444.

This is a British telephone number (44 is the country code for the United Kingdom).

Prefix this number with the international access code if you are calling from outsidethe United Kingdom.

2. Describe the problem to the CNRC representative, and explain why cagereplacement is indicated.

Be prepared to describe:

– What alarms/events/SWFMs accompanied the problem.

– What diagnostic actions , if any, were taken, and the result of those actions.

– What repair actions, if any, were taken, and the result of those actions.

CNRC review

The CNRC will review the problem and the steps taken so far. Depending on this review,the CNRC may either:

S Suggest further tests or procedures before authorizing the cage replacement.

S Authorize replacing the cage, and issue an SR number.

Do not attempt to remove or replace a cage until CNRC authorizes suchaction.

NOTE

If CNRC issues an SR number authorizing the cage replacement:

S Write the number down.

S Quote the SR number, in addition to the normal returns number, in anycommunications with Motorola.

Motorola will not accept returned digital cages without an CNRC authorization.

NOTE



68P02901W09-O

GMR-04

5–21

Removing thecage

Overview

This section contains three separate procedures:

S Preparing the cabinet explains how to set up the cabinet so that it is safe to workon the digital cage.

S Disassembling the cage explains how to take the digital cage apart.

S Removing the cage explains how to take the cage out of the cabinet.

Perform these procedures in order, beginning with Preparing the cabinet.


Follow these steps to prepare the cabinet for cage replacement.

1. Determine which cage(s) need replacing.

It is probable that only one cage has a faulty backplane. Use the following table todetermine the appropriate actions.

If the faulty cage... Then:

does not contain theBSP...

continue with step 2.

contains the BSP...

i. Reset the BSC.

* CAUTIONResetting the site stops call processing.Determine whether call processing is occurringbefore deciding to reset the site. Disable callprocessing at the site before continuing with thisprocedure.

ii. Continue with step 2.

2. Use the circuit breakers to disconnect power to the cage(s).

Hazardous voltages exist inside a powered cabinet and may remain presentafter power is disconnected.. Exercise caution when working on theequipment and remove all watches, rings and other jewellery beforecommencing work.

WARNING

If both cages in a BSSC cabinet require replacement, proceed with step 3.

If only one cage of a BSSC cabinet requires backplane replacement, leave thepower connected to the other cage, and proceed with Disassembling the cage.

Disabling one cage lets call processing continue, providing the second cage isindependent of the first. However, it also means dc power is still present in thecabinet.

3. Remove the supply voltage from the cabinet.

The cage is ready for disassembly.



GMR-0468P02901W09-O

Disassembling the cage

Follow these steps to disassemble the cage.

Wear an approved earth strap when handling digital modules.Use the antistatic mat and antistatic containers to store the digital modules.

CAUTION

1. Remove all the power supply modules in the cage.

Follow the procedure in Power supply module replacement in Chapter 4.

2. Remove all digital full and half size modules from the cage.

Put the digital modules into suitable antistatic packaging or storage containers.These modules will go back into the new backplane.

3. Disconnect the dc supply to the fan assembly that corresponds to the cage beingreplaced.

Follow the procedure beginning in Chapter 4.

4. Unscrew the fan assembly and remove it from the BSU cage.

5. Disconnect the dc supply at the bottom of the BSU cage.

6. Disconnect the MSI and Alarm board cables, and label the cables so they can bereconnected properly.

The cables are at the top of the BSU cage.

Do not drop any of the nuts or washers into the lower BSU cage. Loosenuts or washers can damage the cage and the components if the cage is stillpowered up.

CAUTION

7. Note their respective positions and disconnect any fibre optic cables fitted to thecages.

The cage is ready for removal.

Removing the cage

Follow these steps to remove the cage.

1. Remove the eight front screws which attach the cage to the cabinet.

2. Lift the BSU cage out and set it aside.

The cage is heavy!S Lift the cage carefully, to avoid physical injury.

S Set the cage down carefully, to avoid further damage to the cage, orany damage to the site.

WARNING



68P02901W09-O

GMR-04

5–23

Installing thecage

Replacing the cage

Follow these steps to replace the cage.

The cage is heavy.S When heavy equipment is to be lifted, a responsible person must

ensure that adequate lifting facilities are available. Do not attempt to liftheavy equipment on your own.

S Set the cage down carefully, to avoid damage to the cage or site.

WARNING

1. Lift the new cage / backplane assembly into the cabinet.

2. Secure the cage in place with the eight front screws

Equipping the cage

Follow these steps to equip the new cage with power and digital modules.

1. Connect the MSI and Alarm board cables.

The cables are at the top of the BSU cage.

2. Reconnect any fibre optic cables if the cage is extended or expanded to to othercages.

3. Connect the dc supply at the bottom of the BSU cage.

4. Insert the fan assembly, and secure it to the cabinet with the front four screws.

5. Connect the dc supply to the fan assembly.

6. Choose an action from the following table:

If... Then...

The upper cage is beingreplaced...

secure the front cover plate below thefan assembly, and continue with step 7.

The lower cage is beingreplaced...


7. Insert all the digital full size and half size modules.

8. Insert the power supply modules.



GMR-0468P02901W09-O

Restoring power

Follow these steps to restore dc power to the cabinet.

1. Connect the power supply to the top of the cabinet.

2. Restore power to the cage(s) by resetting the circuit breakers.

3. Observe the LEDs on all the power supply modules, and choose an action fromthe following table.

Valid Input Default

the green LED is lit on all the powersupply modules...


the red LED is lit on all the powersupply modules...

use Power supply modulereplacement in Chapter 4 to diagnoseand correct the problem.

the red LED is lit on any powersupply module...

Continue with step 4 when all the greenLEDs are lit.

4. Hard reset all the digital cards.

IMPORTANTS Reset the GPROCs last.

S Reset the GPROC in slot 20 last of all.

Step Action: Result:

a. Flip the switch on each digitalcard up to the RESET position.

The board is taken out of service(OOS).

b. Release the switch. The card resets automatically.

Checking connections

Follow these steps to check the connections between the new backplane and the rest ofthe system.

1. Connect a Local Maintenance Terminal (LMT) to the TTY port on the masterGPROC.

2. Verify the connection to the OMC.

The site will take about one hour to code load and initialize.

NOTE

3. Verify that all site Message Transfer Links (MTLs) and Operations andMaintenance Links (OMLs) are operational.

– To verify the MTLs, type: state 0 MTL x 0 0, where x is the MTL identifier.

– To verify the OML, type: state 0 OML x y 0, where x and y are the OML identifiers.

The status for the MTL and the OML should be <busy, unlocked>. If it is not,further diagnosis is necessary.

GSM-100-533 Fan replacement procedure


68P02901W09-O

GMR-04

5–25

Fan replacement procedure

Purpose

This section explains how to replace the BSU/RXU cage fans.

Procedure 1 details the steps to replace older type fans (5901694E01) with the new(5902872W01) type fans.

The old type fans are not available as replacement parts.

NOTE

This procedure should only be used to replace an old style fan with the new style fan.

Procedure 2 details the steps to replace a BSU/RXU fan where only new type fans areinvolved.

Old fan assemblies can be identified as they have grey painted aluminium grills and fournickel plated quarter-turn captive screws fitted in the corners of the grill.

New fan assemblies have plastic grilles and four black plastic quarter-turn fixings.

Table 5-1 lists the new fan assembly components.

Table 5-1 Fan assembly components

Item Quantity Part number

Fan guard front 1 1502392W01

Fan and rear guard 1 5902872W01

Screw 4 0310907C72

Tools andequipment

The following tools and equipment are required:

S A T20 Torx driver.

S A cross head screwdriver.

S A flat blade screwdriver.

Procedure 1

Follow these steps to replace the older type fan unit, with the new fan unit:

Preparation


2. Identify and remove the correct fuse for the faulty fan (a chart on the inside of thePDU door identifies the fuses).

GSM-100-533Fan replacement procedure


GMR-0468P02901W09-O

Fan removal

1. Use a cross head screwdriver to release the four quarter-turn fasteners that securethe fan to the shelf assembly.


3. Disconnect the fan power cable and remove the fan from the cabinet.

4. Unscrew and remove the four M4 star head screws securing the grill onto the fan.

A T20 Torx driver is required.

5. Discard the old fan.

Fan replacement

1. Unscrew and remove the two M4 star head screws securing the plastic grill ontothe new fan.

2. Retain the fan, but discard the plastic grill and the fixing screws.

3. Fit the metal grill to the new fan using the original screws.

4. Connect the power cable to the new fan.

5. Install the new fan in the cabinet.

6. Using the cross head screwdriver, tighten the four quarter-turn fasteners thatsecure the fan to the shelf assembly.

Restoration

1. Insert the fuse removed in step 2 and check the fan works correctly.


Procedure 2

Follow these steps to replace the new type fan unit:

Preparation


2. Identify and remove the correct fuse for the faulty fan (a chart on the inside of theDAB door identifies the fuses).

Fan removal

1. Use a flat blade screwdriver to release the four black plastic quarter-turn fastenersthat secure the fan to the shelf assembly.


3. Disconnect the fan power cable and remove the fan from the cabinet.

4. Discard the old fan.

GSM-100-533 Fan replacement procedure


68P02901W09-O

GMR-04

5–27

Fan replacement

1. Connect the power cable to the new fan.

2. Install the new fan in the cabinet.

3. Using the flat blade screwdriver, tighten the four black plastic quarter-turnfasteners that secure the fan to the shelf assembly.

Restoration

1. Insert the fuse removed in step 2 and check the fan works correctly.


GSM-100-533Fan replacement procedure


GMR-0468P02901W09-O

29 Aug 1997


68P02901W38-O

GMR-04 I–1

Index

GSM-100-030

29 Aug 1997 I–2


GMR-0468P02901W38-O

GSM-100-030

29 Aug 1997


68P02901W38-O

GMR-04 I–3

Aair deflector

installing in BSSC, 2–6installing in BSSC2, 2–6

air filtercleaning procedure, 3–3replacement procedure, 3–2, 4–2

alarm interface board (AIB), 3–22arriving at a site, 1–10

Bbackplane, replacement procedure, 5–17

installing the cage, 5–21obtaining authorization, 5–18removing the cage, 5–19tools and equipment, 5–17

backplane connectionsBIB, 2–33T43, 2–28

backup power, consumption, 2–2, 1–7balanced line interconnect board (BIB), 3–31base station unit shelf

BSSC2, 1–8slot assignment, 2–2

battery backup board (BBBX), 2–69BBBX, installing, 2–19before visiting a site, 1–10bend radius, optical fibres, 1–9BIB, backplane connections, 2–33BSSC

cabinetdimensions, 1–4external view, 1–3internal view, 1–5

cabling diagramsPAB type PDU, 1–33PDB/AIB type PDU, 1–36

configuration, 1–2decommissioning, 3–2differences from BSSC2, 1–32interconnect panel, 3–27

BSSC2base station unit shelf, 1–8cabinet

external view, 1–3internal view, 1–6labelling, 1–24

cabling diagrams, 1–27configuration, 1–2fan cooling system, 1–19interconnect panel, 1–20, 3–28location, 1–2, 1–2overview, 1–1, 1–1power distribution unit, 1–18remote transcoder unit shelf, 1–13types, 1–1, 1–1

BSU, module plan, 2–20

BTC, replacement procedures, non–redundant cards,5–4

bus terminator card (BTC), 2–8

GSM-100-030

29 Aug 1997 I–4


GMR-0468P02901W38-O

Ccabinets

BSSCcabling diagrams (PAB type PDU), 1–33cabling diagrams (PDB/AIB type PDU), 1–36configuration, 1–2differences from BSSC2, 1–32dimensions, 1–4external view, 1–3interconnect panel, 3–27internal view, 1–5

BSSC2cabling diagrams, 1–27configuration, 1–2external view, 1–3fan cooling system, 1–19, 3–25interconnect panel, 1–20, 3–28internal view, 1–6location, 1–2, 1–2overview, 1–1, 1–1power distribution unit, 1–18types, 1–1, 1–1

BTS6, fan cooling system, 3–25delivery, 2–1dimensions, 1–5environmental limitations, 1–5labelling

BSSC, 1–22BSSC2, 1–24

lifting, 2–2, 3–1overcurrent protection, 2–2, 1–7packaging, 2–2power requirements, 3–2torque values, 1–1, 2–3types covered, 2–1weights, 2–2

cablesBBBX, 2–19control signal, 2–25earth, 2–14power, 2–14

cabling diagramsBSSC

PAB type PDU, 1–33PDB/AIB type PDU, 1–36

BSSC2, 1–27

calibrating, GCLK, 4–13record form, 4–15

catering, on site, 1–10

checklist, annual physical inspection, 3–8

circuit breakers, 3–24removing and replacing, 5–2

cleaning, optical fibres, 1–8

cleaning procedure, air filters, 3–3

clock extender (CLKX), 2–71

configurationsBSSC, 1–2BSSC2, 1–2

connecting, power cablesnegative earth cabinets, 2–15positive earth cabinets, 2–15

control signal cabling, installing, 2–25

DDAB, replacement procedure, 5–10

decommissioningBSSC, 3–2

checklist, 3–4prerequisite, 3–1

digital cagereplacement, authorization procedure, 5–18replacement procedure, 5–17

installing the cage, 5–21removing the cage, 5–19tools and equipment, 5–17

digital modulesBSU shelf slot assignments, 2–2double kiloport switch, 2–9factory installed, 2–18front panels, 2–5full size

BTC, 2–8DSW2, 2–9GCLK, 2–16GDP, 2–60GDP2, 2–20GPROC, 2–26GPROC2, 2–32KSW, 2–37MSI, 2–44MSI2, 2–49NVM, 2–66overview, 2–7XCDR, 2–55

half sizeBBBX, 2–69CLKX, 2–71DSWX, 2–73KSWX, 2–73, 2–77overview, 2–68PIX, 2–85

installing BBBXs, 2–19RXU shelf slot assignments, 2–3

GSM-100-030

29 Aug 1997


68P02901W38-O

GMR-04 I–5

digital power supply module (DPSM), 3–3

distribution alarm board (DAB), 3–13

double kiloport switch extender, 2–73

DPSMinstalling, 2–17replacement procedure, 4–40

non–redundant modules, 4–41redundant modules, 4–41

DSW2, 2–9double rate TDM bus, 2–14expansion TDM highways, 2–12local highway, 2–11purpose, 2–9remote TDM highway, 2–11standard rate TDM bus, 2–14

DSWX, 2–73expansion, 2–74local, 2–75remote, 2–74requirements, 2–73

E

earthingcable sizes, 2–14site, 2–2

enhanced power supply module (EPSM), 3–6

EPSMinstalling, 2–17replacement procedure, 4–40


external equipment, power cablingto DRAM backup battery, 2–13to external multicoupler, 2–13to external RTC, 2–13

eyebolts, inserting, 2–2, 3–1

Ffan cooling system

BSSC2, 1–19FPCU, 3–25overview, 3–25

fan power converter unit (FPCU), 3–25

Fan replacement procedure, 5–23

full size digital modulesBTC, 2–8GCLK, 2–16GDP, 2–60GPROC, 2–26GPROC2, 2–32KSW, 2–37MSI, 2–44MSI2, 2–49overview, 2–7XCDR, 2–55

GGCLK, calibrating, 4–13

record form, 4–15

GDPreplacement procedure, 4–34technical description, 2–60

GDP2CRC error checking, 2–24MCAP interface, 2–24purpose, 2–20

general procedures, 2–1

generic clock (GCLK), 2–16

generic processor (GPROC), 2–26

generic processor2 (GPROC2), 2–32

GPROC/GPROC2, replacement, 4–16

Hhalf size digital modules

BBBX, 2–69CLKX, 2–71KSWX, 2–73, 2–77overview, 2–68PIX, 2–85

GSM-100-030

29 Aug 1997 I–6


GMR-0468P02901W38-O

handling, optical fibres, 1–8

Iinstalling

air deflectorin BSSC,, 2–6in BSSC2, 2–6

control signal cablingfor E1/T1 line connections, 2–25for end user I/O devices, 2–26for inter cabinet fibre optics, 2–25

DPSM, 2–17EPSM, 2–17eyebolts, 2–2IPSM, 2–17PIX, 2–26tool kits for, 1–2

integrated power supply module (IPSM), 3–9

interconnect panelBIB, 3–31BSSC, 3–27

negative earth, 2–11positive earth, 2–12

BSSC2, 1–20, 3–28, 2–10overview, 3–26T43, 3–29

IPSMinstalling, 2–17replacement procedure, 4–40


Kkiloport switch extender (KSWX), 2–73, 2–77

kiloport switch (KSW), 2–37

KSW, replacement procedurenon–redundant modules, 4–21redundant modules, 4–19

KSWX, replacement procedurenon–redundant modules, 4–26redundant modules, 4–23

Llabelling, BSSC, 1–22

LANX, replacement procedurenon–redundant modules, 4–29redundant modules, 4–27

leaving a site, 1–11

Mmaintenance

annual physical inspection checklist, 3–8cleaning cabinet air filters, 3–3perfoming a physical inspection, 3–4procedures, 3–1

miscellaneous repair procedures, 5–1

module planBSU, 2–20RXU, 2–21

MSI, replacement procedure, 4–30

multiple serial interface (MSI), 2–44

multiple serial interface (MSI2), 2–49

NNPSM, replacement procedure, 4–40


NVMBSC installation, 2–22fault diagnosis, 4–37front panel, 4–38functional desription, 2–67installation, 2–22installation procedure, 2–24interrogating the board, 2–67mechanical design, 2–66replacement, 4–37RXCDR installation, 2–23technical description, 2–66

Oobtaining authorization, 5–18

MCSC review, 5–18

optical fibre, bend radius, 1–9

optical fibrescleaning, 1–8connection, 1–8handling, 1–8protection, 1–8

Pparallel interface extender (PIX), 2–85

periodic maintenance, air filters, 3–2, 4–2

GSM-100-030

29 Aug 1997


68P02901W38-O

GMR-04 I–7

Physical inspection, performing, 3–4

PIXconnector, 2–26definition, 4–39installing, 2–26replacement procedure, 4–39

powerBBBX connections, 2–19BSSC connections

negative earth, 2–11positive earth, 2–12

BSSC2 connections, 2–10cable sizes, 2–14connecting external equipment, 2–13connecting to main source, 2–16consumption

backup, 2–2, 1–7negative earth BSSC, 2–2, 1–7positive earth BSSC, 2–2, 1–7

DAB setup, 2–9input limits, 2–8PAB setup, 2–9preparing to connect, 2–8supply modules, installing, 2–17terminal sizes, 2–8

power alarm board, PAB, 3–17

power distribution board (PDB), 3–22

power distribution unitAIB, 3–22BSSC2, 1–18circuit breakers, 3–24DAB, 3–13overview, 3–12PAB, 3–17PDB, 3–22

power requirements, 3–2

power supply module, replacement procedure, 4–40non–redundant modules, 4–41redundant modules, 4–41

power supply modulesDPSM, 3–3EPSM, 3–6IPSM, 3–9overview, 3–2

protecting, optical fibres, 1–8

Rremote transcoder unit shelf

BSSC2, 1–13slot assignments, 2–3

replacement procedureGCLK, redundant, 4–9redundant GCLK, 4–9

replacement procedures, 4–1air filters, 3–2, 4–2backplane replacement, 5–17


circuit breakers, 5–2digital cage, obtaining authorization, 5–18digital cage replacement, 5–17


fans, 4–8GCLK

multi–shelf configuration, 4–12non–redundant, 4–11single shelf configuration, 4–12

GDP, 4–34GPROC/GPROC2, 4–16interface boards, 4–3MSI, 4–30non–redundant BTC, 5–4non–redundant CLKX, 4–7non–redundant GCLK, 4–11

multi–shelf configuration, 4–12single shelf configuration, 4–12

non–redundant KSW, 4–21non–redundant KSWX, 4–26non–redundant LANX, 4–29PIX, 4–39redundant CLKX, 4–5redundant KSW, 4–19redundant KSWX, 4–23redundant LANX, 4–27replacing an DAB, 5–10XCDR, 4–32

replacing digital cages, authorization procedure, 5–18

rubbish, disposal on site, 1–11

rural sites, visiting, 1–11

RXU, module plan, 2–21

GSM-100-030

29 Aug 1997 I–8


GMR-0468P02901W38-O

Ssafety

cabinet weights, 2–2connecting mains power, 2–16delivery, 2–1earth cable sizes, 2–14on site, 1–12overcurrent protection, 2–2, 1–7power cable sizes, 2–14site earthing, 2–2transient and lightning protection, 2–3

site requirementsdimensions, 1–5environmental, 1–5structural, 1–5

specification, specification, 2–1

systems covered, 1–1

TT43, backplane connections, 2–28

T43 interconnect board, 3–29

tool kits, installationone, 1–2two, 1–4

torque values, 1–1, 2–3

transcoder (GDP), 2–60

transcoder (XCDR), 2–55

transient and lightning protection, 2–3

transportation panel fillers, removing, 2–17

Uunpacking, cabinets, 2–4

Vvisiting sites

arriving, 1–10before, 1–10catering facilities, 1–10leaving, 1–11rubbish, 1–11rural sites, 1–11safety, 1–12

XXCDR

replacement procedure, 4–32technical description, 2–55

Service Manual

Documents

fixed dynamic pattern registers

addressable asynchronous receiver transmitter

pink instruction sheet

blank backing sheet

stainless steel fixings

dynamic pattern registers

multiframe alignment errors

base station controller