Applied Chemistry, Vol. 12, No.1 , May 2008, 181-184 Manis Kumar Jha . · · · ([email protected]t) Separation of Metal and Plastic in waste PCBs by Layer Separation Manis Kumar Jha, Jae-Min Yoo, Jae-Chun KIGAM, Minerals and materials Processing Research Di vision ([email protected]T) Abstract A novel pre-treatment process for the liberation of metals from waste printed circuit boards(PCBs) by layer separation has been developed. The invention particularly relates to the liberation of metallic constituents by the separation of the layers of metallic and non-metallic components from the PCBs. The novelty of the process is the liberation of metal from the PCBs using organic, which is effective, economical and energy saving. In present study, the pieces of PCBs are tested for the separation of the layers of epoxy resins and other non-metallic constituents from the thin metallic plates wires. The process is compatible in comparison to existing mechanical pre-treatment process. The separated thin metal plates and wire could be effectively processed for the hydrometallurgical extraction, in comparison to the metallic fraction coated or encapsulated with plastic and ceramic material. The mixture of liberated resins metals from the PCBs were filtered, then dried to remove liquid. The mixture of liberated thin layers of metals and epoxy resins are finally separated and by using corona electrostatic separator. The of metal was found 99.99%. 1. 90% Circuit Boards, 30%, 40%, TV, VTR, PC, 181
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Separation of Metal and Plastic in waste PCBs by Layer Separation · 2008. 11. 18. · Separation of Metal and Plastic in waste PCBs by Layer Separation Manis Kumar Jha, Jae-Min Yoo,
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Applied Chemistry,Vol. 12, No.1 , May 2008, 181-184
KIGAM, Minerals and materials Processing Research Division([email protected] T)
Abstract
A novel pre-treatment process for the liberation of metals from waste printed circuitboards(PCBs) by layer separation has been developed. The invention particularly relates tothe liberation of metallic constituents by the separation of the layers of metallic andnon-metallic components from the PCBs. The novelty of the process is the liberation ofmetal from the PCBs using organic, which is effective, economical and energy saving. Inpresent study, the pieces of PCBs are tested for the separation of the layers of epoxy resinsand other non-metallic constituents from the thin metallic plates 없ld wires. The process iscompatible in comparison to existing mechanical pre-treatment process. The separated thinmetal plates and wire could be effectively processed for the hydrometallurgical extraction,in comparison to the metallic fraction coated or encapsulated with plastic and ceramicmaterial. The mixture of liberated resins 하ld metals from the PCBs were filtered, thendried to remove 허] liquid. The mixture of liberated thin layers of metals and epoxy resinsare finally separated and an려ysed by using corona electrostatic separator. The recoveπ ofmetal was found 99.99%.
1. 서 론
정보화사회로접어들면서 사용자의 확대로 인하여 정보의 전달을 위한 전자기기의 보급이 증가일로
에 있다. 그리고 장치의 성능이 급속히 발전할 뿐 아니라 디자인의 변화 둥으로 제품의 교환 주기도 짧아