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1 Visual Computing Group Senior Mechanical Engineering Project Definition Mike MacGregor
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Senior Mechanical Engineering Project Definition

Jan 01, 2016

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Senior Mechanical Engineering Project Definition. Mike MacGregor. Problem Statement & Scope. Problem Statement: Need to enable Larrabee PCI graphics card by designing a cooling solution that meets - PowerPoint PPT Presentation
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Page 1: Senior Mechanical Engineering Project Definition

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Visual Computing

Group

Senior Mechanical Engineering Project Definition

Mike MacGregor

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Problem Statement & Scope

Problem Statement: Need to enable Larrabee PCI graphics card by designing a cooling solution that meets– Volumetric/dimensional constraints of the PCI card form factor as well as

the chip and circuit board that it cools– PCI Express™ x16 Graphics 150W-ATX Specification Revision 1.0 & PCIe 2.0 Spec Compliant– Card form factor: 2 slot, Full height, 240mm length

– Thermal performance requirements of the Graphics Processor Unit (GPU) under a worst-case use condition

– Structural performance requirements driven by shipping and handling use condition

Scope– Fan & thermal test vehicle to be supplied by Intel

– Competitive research, feasibility analysis, quantitative evaluation of multiple design concepts, identification of final design concept, detailed design and design analysis, validation through laboratory testing

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Thermal & Acoustic Requirements

GPU Thermal Design Power (TDP) 70 Watts Fan max. power 8 Watts Max. T ambient 35 °C Typical T ambient 25 °C T rise to card inlet 10 °C GPU T case max. 85 °C

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Constraint #1: Fan

5 fans to be supplied by Intel Fan supplier: AVC Fan model series: BA10033

Adobe Acrobat Document

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Constraint #2 Thermal Test Vehicle (TTV)

Heater to be spec’d from Omega supplier catalog– KHR-3/10 (3 cm diameter, 70 W max.)

– http://www.omega.com/pptst/KHR_KHLV_KH.html

PCI card with assembled heater and heat spreader to be supplied by Intel

3cm3cmTTVTTV

PCI CardPCI Card

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Structural Requirements

Design must pass shock test– PCI card assembled with ATX MB to rigid plate with rear panel I/O bracket

(see backup slides)

– Hockey stick max retention force: 29 lbf

– Shock test input in all 6 directions: trapezoid, 30g amplitude

Expectations – derivation of worst-case DAF for HS mass

– disposition of which shock directions pose the greatest risk to SJR as well as RM component loading

– estimation of max stress and deflection of RM

(0,0)(0,0)

acce

lera

tion in

g’s

acce

lera

tion in

g’s

msecmsec

(3,30)(3,30) (16,30)(16,30)

(19,0)(19,0)

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BACKUP

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Starting Materials: S&V Fixture and MB (not pictured)

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Step 1: Install MB

Install the MB onto the fixture with qty 10, 6-32 screws torqued between 6 to 10 in-lbf

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Step 2: Install Card

Seat the card into the PCI x16 connector and check that the hockey stick feature is engaged Install the qty 2, 6-32 screws torqued between 6 to 10 in-lbf to secure card to I/O bracket