Select Connect 3D-MID Summit 09 22 10

Designing Your Next Generation ProductUsing 3D-Molded Interconnect Devices to Reduce

Complexity, Size, Weight and Costs

SelectConnect Technologieswww.selectconnecttech.com

Presented by Jim Liddle

LDS 3-D MID

Laser Direct Structured 3-D Molded Interconnect

3D-Interconnects by DS / LDS

Double-Shot Single-Shot LDS

LDS 3-D MID

LDS Summary

LDS Summary

LDS Summary

LDS Summary

LDS Summary

LDS Technical Summary

Laser Direct Structuring – LDS

LDS Technical Summary

LDS Technical Summary

LDS Pitch for High Yield

6 mil lines

8 mil spaces

(14 mil pitch)

Business Drivers for 3D-MID

Business Drivers for 3D-MID

LDS Grade Materials

Reflow temperatures

• Pb Free 245 -260° C

• Sn/Pb 225 -235° C

LDS Design Rules

LDS Design Rules

LDS Design Rules

LDS Design Rules

Optimum cycle times

LDS Design Rules

Metallization

Electroless Copper Nickel Immersion Gold [Electroless Gold]

Typical builds:

SelectConnect™ Metallization

Copper 100 – 200 micro-inches (2.5 – 5.0 µm)

Nickel 50 – 100 micro-inches (1.2 – 2.5 µm)

Gold Immersion, ~ 8 micro-inches (0.2 µm)

Key Markets / Applications

Medical Devices

OmniPod® Insulin Management System

OEM: Insulet

Molder: Phillips Plastics

Plater: Arlington Plating

Material: PC, PC/ABS (doped)

Process: DS (Double Shot)

Medical Devices

3-dimensional PCB for Hearing Aids

Stereo hearing aid component:

Source: Harting / Siemens

process steps

Material: Vectra E820i LDS

Integrated Antenna

Medical Devices

Switch Ring for Caries Diagnostic Laser Pen

Features:

Reduction of assembly time (6s vs. 20s)

Increase of assembly yield

Reduction of parts (3 vs. 8)

Reduction of cost (78%)

Source: KaVo Dental

Material: Vectra E840i LDS

Military / Defense

Security Housing

Manufacturer: BournsMaterial: Pocan DP 7102 (PBT)

Automotive

Source: Kromberg & Schubert GmbH & Co. KGBMW K46 Superbike

Automotive

SMD Process Steps:

Source: Kromberg & Schubert GmbH & Co. KG

3D Pick and Place Electrical Components

Automotive

HMI

Tracability:

Source: Kromberg & Schubert GmbH & Co. KG

Data Matrix Code

Automotive

Potential Automotive-Applications

Tracability:

Source: Kromberg & Schubert GmbH & Co. KG

Data Matrix Code

Seat Module

Sensors and Actuators

In-Door Electronics

Lightning

Switches

LDS 3-D MID

Automotive

Automotive Steering Wheel

TRW’s “Base-Line” MID after assembly:

Source: I&T 3D-Produktionsgesellschaft mbH

Automotive

Former device, 10mm Dia. Flip Chip ® MID, 5mm Dia.

Source: Robert Bosch GmbH

Redesign of Rotation Automotive Brake Sensor

Automotive

ASIC deposited onto MID with LPKF-LDS®

technologyConventional Solution

Sensor ASIC

MID using LPKF-LDS® technology

Source: Robert Bosch GmbH

Rotation Sensor for Automotive Brake System (ESP)

Flipped

Positioned

SignalGround

Support bumps

Automotive

Qualification:

Temperature Shock

-40°C…150°C

Realized by Flip Chip on LPKF-LDS® MID

Source: Robert Bosch GmbH

Rotation Sensor for Automotive Brake System (ESP)

Automotive

Qualification:

Warm-Humidity

85°C/85% rel.H

300 pcs. - no defects after 1000hSource: Robert Bosch GmbH

Rotation Sensor for Automotive Brake System (ESP)

Automotive

Former device10mm Dia.

Prototype Sensor Dia.: 5mm

Flip Chip on LDS 3D-MID

Source: Robert Bosch GmbH

Rotation Sensor for Automotive Brake System (ESP)

Source: ZMD AG

AMR Sensor (Automotive)

Material: Vectra E840i LDS

Automotive

Source: Harting

Sensors

Automotive

LED Turn Indicator Light

Source: Kromberg & Schubert GmbH & Co. KG

before

after

Source: Harting Mitronics AG

RFID

RFID-Transponder

LDS 3D-MID

Company Overview

SelectConnect Technologies

Division of Arlington Plating Company

Palatine, Illinois

Jim Liddle 847.359.1490

www.selectconnecttech.com