ELECTRONIC MATERIALS CONFERENCE June 25-27, 2008 • University of California Santa Barbara, California CALL FOR PAPERS EMC Electronic Materials Conference 50th Anniversary 2008 Sponsored by Electronic Materials Committee www.tms.org/EMC.html The Premier Annual Forum on the Preparation and Characterization of Electronic Materials for 50 Years
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Santa Barbara, California CALL FOR PAPERS · Susanne Stemmer, University of California (805) 893-6128 • [email protected] Edward Yu, University of California (858) 534-6619 •
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ELECTRONIC MATERIALS CONFERENCE
June 25-27, 2008 • University of CaliforniaSanta Barbara, California
CALL FOR PAPERS
EMCElectronic Materials Conference
50thAnniversary
2008
Sponsored by
Electronic Materials Committee
www.tms.org/EMC.html
The Premier Annual Forum on the Preparation and Characterization of Electronic Materials for 50 Years
June 25-27, 2008 • Santa Barbara, California
For 50 years, the Electronic Materials Conference (EMC) has been presenting research and developments to advance the field as well as our attendees, who include:
ScientistsEngineersProfessorsResearchersTechniciansResearch and Development ManagersProduct ManagersStudents
You are invited to participate in this year’s event by submitting an abstract for any of the more than 30 topics being presented.
About the TopicsElectronic materials are defined as relating to, produced or operated by the controlled flow of electrons through a semiconductor, gas or free space along with those relating to devices, systems or circuits that employ components such as vacuum tubes, integrated circuits or transistors in their design. In practice, the field is much broader as we have tried to capture in the topics covered.
See the following pages for information on the technical topics and submit your abstract before February 1, 2008.
EMC and DRCEMC is being coordinated with the Device Research Conference (DRC),
June 23-25, 2008, at the University of California. The coordinated efforts are made in recognition of the strong interaction between electronic materials and device research. This provides for maximum exchange of information
between attendees of both conferences.
DRC InquiriesSteven Koester, IBM TJ Watson Research Center
Table of ContentsInformation for Prospective Authors ...................................... 4Technical Program Topics ..................................................... 6
LEARN • NETWORK • ADVANCE�
Information for Prospective Authors
Abstract Submission
ABSTRACT DEADLINE: FEBRUARY 1, 2008
How to Submit an AbstractSubmit your 450-word abstract by February 1, 2008, using CMS-Plus, the online TMS conference management system, at http://cmsplus.tms.org. Conference organizers receive electronic notification of abstract submissions upon entry. Log in to CMS-Plus to begin.
Author RequirementsAbstracts submitted must reveal and demonstrate reasonable scientific content. Do not submit abstracts describing work that has not been released for public disclosure.Students should clearly mark abstracts as “Student Paper” and must also satisfy format guidelines.Authors are expected to present their papers in person at the conference. If an author must be absent or withdraw a paper, the author must notify the program chair well in advance.
Extended AbstractA one-page, additional abstract is also required to assist organizers in considering the material planned for presentation. The additional page (referred to as “extended abstract” in CMS-Plus) should be uploaded as a Microsoft Word or Portable Document Format (PDF) attachment when your initial abstract is submitted. (Only the required 450-word abstract will be printed in the program book).
“Late News” PapersLate news papers will be considered between February 2 and June 2, 2008. They should be submitted online at http://cmsplus.tms.org by selecting “Late News.” The same formatting instructions for abstract submission apply.
Questions about submitting your abstract? Contact TMS.Christina Raabe Eck, Technical Programming and Publications Manager(724) 776-9000, ext. 212 • (800) 759-4TMS • [email protected]
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www.tms.org/EMC.html 5
Student Awards and AssistanceThe top 5 percent of student presentations, as voted upon by the EMC committee, will receive the EMC Best Student Paper Award at the 2009 conference. Papers are judged on both written abstract and oral presentation.
The EMC committee has allocated funds to assist students to attend the 2008 conference in order to make oral presentations. Those wishing to be considered to receive funds should e-mail Robert Biefeld at [email protected] no later than Monday, June 2, 2008.
Publication of PapersSelected technical sessions will be published in the Journal of Electronic Materials. You also are strongly encouraged to submit manuscripts of your work to the journal. Details on eligibility and manuscript submission will be included in the EMC advance program and are available on the Web at http://www.tms.org/jem.html.
LEARN • NETWORK • ADVANCE�
Technical Program Topics
ISSUES FOR WIDE BANDGAP MATERIALS
Group III-Nitrides: Growth, Processing, Characterization, Theory and Devices
Andrew Allerman, Sandia National Laboratories(505) 845-3697 • [email protected]
Russell Dupuis, Georgia Institute of Technology(404) 385-6094 • [email protected]
Randy Feenstra, Carnegie Mellon University(412) 268-6961 • [email protected]