In order to support its recently registered trademark ‘Make & Play 3D’, Samsung is equipping its smartphones with 3D sensing modules. The Galaxy Note 10+ has one in the back side. Samsung is using the latest generation of Sony Depth sensing Solutions’ Time-of-Flight (ToF) camera, which is unveiled in this report. The rear optical hub is packaged in one metal enclosure and features several cameras and a flood illuminator. The complete system features a main red/green/blue camera, a Telephoto, a Wide-angle Camera Module and a 3D Time of Flight Camera. The 3D Depth sensing module has a unique compact packaged near infrared (NIR) flood illuminator with the Vertical Cavity Surface Emitting Laser (VCSEL) driver placed on bottom using a flex printed circuit board (PCB). This report is focused on the analysis of the 3D depth sensing module. It includes a backside illumination (BSI) Time of Flight Image Sensor array featuring 5μm size pixels and 323 kilopixel VGA resolution developed by Sony Depth sensing Solutions. It has one VCSEL for the flood illuminator coming from a major supplier. Along with the complete 3D depth sensing system teardown, this report includes a cost analysis and price estimation for the module. It also includes a physical and technical comparison with another 3D sensing system from Oppo Rx17 pro as well as the 3D sensing solution for the Samsung Galaxy S10. The comparison looks at module integration, the NIR ToF camera module and the Flood Illuminator architecture. COMPLETE TEARDOWN WITH • Detailed photos • Precise measurements • Materials analysis • Manufacturing process flow • Supply chain evaluation • Manufacturing cost analysis • Estimated sales price • Comparison with front and rear ToF Cameras in Samsung S10 and rear ToF Camera in Oppo RX17 Deep analysis of the rear 3D sensing module with Sony’s 2nd Generation CIS. REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT Title: Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module Pages: 127 Date: January 2020 Format: PDF & Excel file Price: EUR 3,990 Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
Welcome message from author
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
In order to support its recently registered
trademark ‘Make & Play 3D’, Samsung is
equipping its smartphones with 3D
sensing modules. The Galaxy Note 10+ has
one in the back side. Samsung is using the
latest generation of Sony Depth sensing
Solutions’ Time-of-Flight (ToF) camera,
which is unveiled in this report.
The rear optical hub is packaged in one
metal enclosure and features several
cameras and a flood illuminator. The
complete system features a main
red/green/blue camera, a Telephoto, a
Wide-angle Camera Module and a 3D
Time of Flight Camera. The 3D Depth
sensing module has a unique compact
packaged near infrared (NIR) flood
illuminator with the Vertical Cavity Surface
Emitting Laser (VCSEL) driver placed on
bottom using a flex printed circuit board
(PCB).
This report is focused on the analysis of
the 3D depth sensing module. It includes a
backside illumination (BSI) Time of Flight
Image Sensor array featuring 5µm size
pixels and 323 kilopixel VGA resolution
developed by Sony Depth sensing
Solutions.
It has one VCSEL for the flood illuminator
coming from a major supplier.
Along with the complete 3D depth sensing
system teardown, this report includes a
cost analysis and price estimation for the
module. It also includes a physical and
technical comparison with another 3D
sensing system from Oppo Rx17 pro as
well as the 3D sensing solution for the
Samsung Galaxy S10. The comparison
looks at module integration, the NIR ToF
camera module and the Flood Illuminator
architecture.
COMPLETE TEARDOWN WITH
• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated sales price
• Comparison with front and rear ToF Cameras in Samsung S10 and rear ToF Camera in Oppo RX17
Deep analysis of the rear 3D sensing module with Sony’s 2nd Generation CIS.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module
Pages: 127
Date: January 2020
Format: PDF & Excel file
Price: EUR 3,990
Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
• Executive Summary
• Reverse Costing Methodology
Company Profile
• Sony, SEMCO and Trumpf
• Samsung Galaxy Note10+ Teardown
Market Analysis
• Ecosystem and Forecast
Physical Analysis
• Summary of the Physical Analysis
• 3D Sensing System Assembly
Module views and opening
System cross-section
• NIR Camera Module
Module view, dimensions and cross-section
• NIR ToF Image Sensor
Die overview and dimensions
Die process and cross-section
• Flood Illuminator
Module view and dimensions and cross-section
• NIR VCSEL Die
Die view and dimensions
Die process and cross-section
AUTHOR
Manufacturing Process
• NIR ToF Image Sensor Die Front-End Process and Fabrication Unit
• Flood Illuminator NIR VCSEL Process Flow and Fabrication Unit
• Summary of the Main Parts
Cost Analysis
• Summary of the Cost Analysis
• Yield Explanations and Hypotheses
• NIR Camera Module
Pixel Array, BSI and optical front-end cost
NIR ToF image sensor wafer and die cost
• Flood Illuminator Module
NIR VCSEL FE cost and probe test, thinning and dicing
NIR VCSEL die wafer cost
Component cost
• 3D ToF Module
Lens module and component cost
Complete system price
Technical & Cost Comparison
• Galaxy S10 vs. Galaxy Note 10+ 3D sensing
• Oppo Rx17 Pro vs. Galaxy Note 10+ 3D sensing
Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module+
Panasonic’s 3D Time-of-Flight Depth Sensing Camera ModuleMay 2019 - EUR 3,990*
Sony’s 3D Time-of-Flight Depth Sensing Camera ModuleMarch 2019 - EUR 3,990*
Huawei Mate 20 Pro’s 3D Depth-Sensing SystemFebruary 2019 - EUR 3,990*
RELATED REPORTS
Audrey Lahrach is in charge ofcosting analyses for Cameras, LCD& OLED Displays and MEMSDevices. She holds a Master degreein Microelectronics from theUniversity of Nantes.
Taha Ayari, PhD is involved inanalyzing compound semiconductordevices within Power Electronicsand Compound Semiconductorsteam. Taha holds a PhD in Electricaland Computer Engineering fromGeorgia Tech Lorraine.
Véronique Le Troadec has joinedSystem Plus Consulting as alaboratory engineer.She holds a Master degree in Micro-electronics from the University ofNantes.
COSTING TOOLS
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Process-BasedCosting Tools
ParametricCosting Tools
WHAT IS A REVERSE COSTING®?
Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.
IC Price+
MEMS CoSim+
MEMS Price+
Power CoSim+
Power Price+
LED CoSim+
3D PackageCoSim+
DisplayPrice+
PCBPrice+
SYSCost+
Our analysis is performed with our costing tools IC Price+ and LED CoSim+.
System Plus Consulting offers powerful costing tools to evaluate any process or device, the production cost
and selling price, from single chip to complex structures. All these tools are on sale under corporate
license.
CONTACTS
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting is specialized
in the cost analysis of electronics
from semiconductor devices to
electronic systems.
A complete range of services and
costing tools to provide in-depth
production cost studies and to
estimate the objective selling price of
a product is available.
Our services:
• STRUCTURE & PROCESS
ANALYSES
• TEARDOWNS
• CUSTOM ANALYSES
• COSTING SERVICES
• COSTING TOOLS
• TRAININGS
www.systemplus.fr
IC Price+The tool performs the necessary cost simulation of anyIntegrated Circuit: ASICs, microcontrollers, memories,DSP, smartpower…
Headquarters22, bd Benoni GoullinNantes Biotech44200 NantesFrance+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGermany+49 151 23 54 41 [email protected]
America Sales OfficeSteven LAFERRIEREWestern USA & Canada+1 [email protected]
Chris YOUMANEastern USA & Canada+1 919-607-9839 [email protected]
Asia Sales OfficeTakashi ONOZAWAJapan & Rest of Asia+81 80 4371 [email protected]
Mavis WANGGreater ChinaTW +886 979 336 809CN [email protected]
Peter OKKorea+82 10 4089 [email protected]
LED CoSim+Process-based costing tool to design andevaluate the cost of any LED process flow.
ORDER FORMPlease process my order for Samsung Galaxy Note 10+ 3D Time of Flight Depth Sensing Camera Module, Reverse Costing® – Structure, Process & Cost Report Ref: SP20484
Full Structure, Process & Cost Report : EUR 3,990* Annual Subscription offers possible from 3 reports, including this
report as the first of the year. Contact us for more information.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Each year System Plus Consultingreleases a comprehensive collectionof new reverse engineering andcosting analyses in various domains.You can choose to buy over 12months a set of 3, 4, 5, 7, 10 or 15Reverse Costing® reports.
Up to 47% discount!
More than 60 reports released eachyear on the following topics(considered for 2018):• MEMS & Sensors: Accelerometer
– Environment - Fingerprint - Gas - Gyroscope - IMU/Combo -Microphone - Optics - Oscillator -Pressure
• Power: GaN - IGBT - MOSFET - Si Diode - SiC
• Imaging: Camera - Spectrometer• LED and Laser: UV LED – VCSEL -
White/blue LED• Packaging: 3D Packaging -
Embedded - SIP - WLP• Integrated Circuits: IPD –
Memories – PMIC - SoC• RF: FEM - Duplexer• Systems: Automotive - Consumer
- Energy - Telecom
ANNUAL SUBSCRIPTIONS
SHIP TO
Name (Mr/Ms/Dr/Pr): .............................................................
Job Title: …….............................................................................
Company: ….............................................................................
Address: …….............................................................................
City: ………………………………… State: ..........................................
Postcode/Zip: ..........................................................................
Country: ……............................................................................
VAT ID Number for EU members: ..........................................
Tel: ……………….........................................................................
Email: .....................................................................................
Date: ......................................................................................
Signature: ..............................................................................
BILLING CONTACT
First Name : ............................................................................
Last Name: …….......................................................................
Email: …..................................................................................
Phone: ……..............................................................................
PAYMENT
By credit card:
Number: |__|__|__|__| |__|__|__|__| |__|__|__|__|
|__|__|__|__|
Expiration date: |__|__|/|__|__|
Card Verification Value: |__|__|__|
By bank transfer:HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St HerblainFranceBIC code: CCFRFRPP• In EUR
Bank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439
• In USDBank code : 30056 - Branch code : 00955 - Account : 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797
Return order by: FAX: +33 2 53 55 10 59MAIL: SYSTEM PLUS CONSULTING
22, bd Benoni GoullinNantes Biotech44200 Nantes – France
EMAIL: [email protected]
*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format*For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing date: January 2020
SONY'S 3D TOF Depth SENSING CAMERA MODULE GEN 2
1.INTRODUCTIONThe present terms and conditions apply to the offers, sales and deliveries of services managed by System PlusConsulting except in the case of a particular written agreement.Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.
2.PRICESPrices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros andworked out without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will becharged on these initial prices.System Plus Consulting may change its prices whenever the company thinks it necessary. However, the companycommits itself in invoicing at the prices in force on the date the order is placed.
3.REBATES and DISCOUNTSThe quoted prices already include the rebates and discounts that System Plus Consulting could have granted accordingto the number of orders placed by the Buyer, or other specific conditions. No discount is granted in case of earlypayment.
4.TERMS OF PAYMENTSystem Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in thecase of a particular written agreement.If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting apenalty for late payment the amount of which is three times the legal interest rate. The legal interest rate is thecurrent one on the delivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoicedeadline. This penalty is sent without previous notice.When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of thetotal invoice amount when placing his order.
5. OWNERSHIPSystem Plus Consulting remains sole owner of the delivered services until total payment of the invoice.
6.DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed.Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or tocancel the order.
7.ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost ordamage on the base of their real value, he must imperatively point it out to System Plus Consulting when theshipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carriercurrent ones (reimbursement based on good weight instead of the real value).
8.FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its dutiesdescribed in the current terms and conditions if these are the result of a force majeure case. Therefore, the forcemajeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French CodeCivil?
9.CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.
10.RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirectdamage, financial or otherwise, that may result from the use of the results of our analysis or results obtained usingone of our costing tools.
11.APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.
TERMS AND CONDITIONS OF SALES
Related Documents
