SAMSUNG FOUNDRY PUSHES FOUNDRY TECHNOLOGY EXPERTISE TO NEW LEVELS LOGIC AND MEMORY TSV ... , Samsung foundry customers can …

SAMSUNG FOUNDRY32/28nm Low-Power High-K Metal Gate Logic Process and Design Ecosystem

Design Enablement

SamsungFoundryofferscustomersaccesstoacomprehensiveecosystemofdesignenablementandimplementationbusinesspartnersfromtheEDA,IP,packaginganddesignservicesindustries.Customerscantapintoservicesrequiredtosolvetheirmostcriticaldesignissues.Theseinclude:

• Best-in-class reference flowsfrommajorEDAvendorsviatheCommonPlatformallianceofIBM®,Samsung®andGLOBALFOUNDRIES®

• An extensive IP portfoliofromSamsungandtheCommonPlatformallianceecosystemincludingmixedsignal/analog,logicandmemory

• Comprehensive libraries ofstandardcells,memorycompilersandI/Os

• Predictive DFM solutionstoaddressyieldupstreaminthedesignflow

High-k Metal Gate

High-kdielectricmaterialswithmetalgateinthetransistor’sgatestackextendstheCMOSprocesstechnologywellbeyond32/28nm.SamsungFoundry,inconjunctionwiththe

InternationalSemiconductorDevelopmentAlliance(ISDA),tunedits32/28nmLow-Power(LP)High-kMetalGate(HKMG)Gate-Firstprocessnodetoachieveanarrayofbenefitsandimprovementsover45nmLPPoly-Sion,including:

• 2xgatedensityincrease(SuperiorareascalingwithGate-FirstHKMG)

• >100xlowergateleakage

• >40%delayimprovementatfixedleakage

• ~10xleakagereductionatfixedspeed

Immersion Lithography

Firstintroducedat45nm,immersionlithographyisacriticalfeatureofSamsungFoundry’s32/28nmprocessflow.Samsunghasthelargestinstallationofimmersionlithographytoolsintheindustry,andextensiveexperienceusingtheminitshighlysuccessfulmemoryfabrication.

3D Packaging Technology

SavvychipcompaniesarecloselyinvestigatingnewpackagingsolutionsasawaytostayaheadofMoore’sLaw.Alsoknownas3Dorverticalpackaging,throughsiliconvia(TSV)allowschipmakerstoincreasefunctionalitybyverticallyconnectingcomponentsusingsiliconviasinthepackagingprocess.

Thedynamicaspectsoftheconsumerelectronicsmarketmakeitoneofthemostchallenginginthesemiconductorindustry.Predictingconsumers’interestscoupledwiththeneedtoprovidepowerefficientproductsthatofferPC-likeexperiencesonahandheldproductisenoughtotestanydesigner’sfortitudeandcreativity.Samsung’sexpertiseindeepsub-micronmanufacturingisenablingcustomerstoquicklydesignexcitingnewproductsatthemostadvancedprocessnodes.

SAMSUNG PUSHES FOUNDRY TECHNOLOGY EXPERTISE TO NEW LEVELS

LOGIC AND MEMORY TSV

HKMG ENAbLES PERFORMANCE bOOST

Unequaled Customer Benefits

• Advanced process technology InadditiontoitsownsignificantprocessR&Dinvestments,Samsungisactivelyinvolvedinmanyjointresearchanddevelopmentalliances,includingISDA.Asaresult,Samsungfoundrycustomerscandesigninnovativeproductsbuiltonthe

mostadvancedprocessplatforms.

• Design IPSamsunghasanextensiveportfoliooflibrariesandIPthatisavailabletocustomers,particularlyintheembeddedmemoryandmixedsignalareas,includinglicensedIPfromleadingcompaniessuchasARM®,Snowbush®,andSynopsis®.

• Manufacturing plantMaintainsadvanced90,65,45,32/28nmproductionequipment.TheGiheung,SouthKoreafoundryservescustomerswithleading-edge,high-volume

manufacturingservices.

• Partnerships for multi-sourcingAlongwithIBMandGLOBALFOUNDRIES,SamsungisamemberoftheCommonPlatformalliance.Thethreecompaniesprovideworldwidemulti-sourcingofthesameproductdesigntomeetcustomerneeds,withoutany

redesignrequired.

• Extensive customer supportFromtheinitialengagementtovolumemanufacturing,Samsung’sbusiness,

engineeringandlogisticsteamsarefocusedonfullcustomersatisfaction.

• Customer IP protectionSamsunghasputfirewallsandstrictsecuritysystemsinplacetoensurethatnounauthorizedindividualshaveanyaccesstocustomerIP.Customerscan

auditthesystematanytime.

• Long-term commitmentSamsunghasmadetheinvestmentsinfacilities,personnelandtimeinorderforitsfoundrytosucceedoverthelongterm.Thecompany’sexecutive-levelcommitmentandfinancialstrengtharethebackboneenablingthisapproach.

START ENGAGEMENT

TECHNICAL REQUIREMENTS»Expert-leveltechnicaldiscussions»Clearunderstandingofcustomers’ detailedrequirements

DESIGN ENABLEMENT»Designkits»LibrariesandIP»DesignservicesandDFM

EXPEDITED PROTOTYPING & SHUTTLES»In-housemaskmakingforfastTAT»Superhotlotprototypingservice»Cost-effectiveprototypingandIP verificationshuttles

HIGH-VOLUME MANUFACTURING»300mmcapacity»High-volumeproduction experience»Aggressiveyield-improvementmethods

WAFER-LEVEL TESTING»Wafersort»Qualityandreliabilityexpertise»Fullyequippedfailureanalysislabs

BUMPING, ASSEMBLY & FINAL TEST»Turn-keymanagement

SHIP PRODUCTS

Samsung’sFull-ServiceFoundrySolution

SAMSUNG 65/45/32/28nm IP SOLUTIONS

Standard Cell Library

•HighDensity

•HighSpeed

•MultiVT

•PowerManagementKit

•MultiChannel

Memories

•Single-PortSRAM(HD,LP)

•Dual-PortSRAM(HD,LP)

•RegisterFile(1RW,1R1W)

•RedundancySRAM

•ROM(Via)

•OTP

Analog Cores

•ADC/DAC

• AudioDAC/CODEC

• PLL

• VoltageRegulator

CPUs

•ARM7

•ARM9

•ARM11

•Cortex-M/Cortex-A5/ Cortex-A8/Cortex-A9

High-Speed Interfaces (PHY)

•USB2.0/USB3.0

•8GUniversalSerDes (SAS/SATA/PCIExpress)

•3G/6GSerialATA

•DDR2,DDR3,mDDR,LPDDR2

•DDR3/2combo

•LVDS,subLVDS,mini-LVDS

•HDMI

•DisplayPort

•MIPI

High-Speed Interfaces (Link)

•USBHSOTG/Device/Host

•S-ATA

•10/100/1000MEthernet

•UniPro

•PCIDevice/Bridge

Multimedia

• MPEG4/H.264

•2D/3DEngine

•JPEGCodec

•NTSC/PALEncoder

General & Special-purpose I/O

•LVCMOS(In-Line,STG,CUP)

•SSTL2/SSTL18/SSTL15/SSTL12

•USB1.1Transceiver

AMBA-based Peripherals

•AMBA-2.0/3.0-basedPeripherals

•MemoryController (SDRAM/SRAM/NOR/NAND)

•MultimediaCardInterface (SDMMC/SDIO)

•ARMPrimeCell

www.samsung.com/us/business/foundry©2011.Theappearanceofallproducts,dates,figures,diagramsandtablesaresubjecttochangeatanytimewithoutnotice.SamsungandSamsungSemiconductor,Inc.aretrademarksofSamsungElectronicsCo.,Ltd.

BRO-11-FoundryPrinted03/11

Thefabislocatedona350-acresiteinGiheung,SouthKorea.Ithasaround-the-clockstaffthatincludesdedicatedresourcesforcustomerservice,design,DFM,productengineering,test,failureanalysisandreliability.TheplantproducesadvancedlogicchipsolutionsincludingthosewithembeddedmemoryRF-CMOSchipsandothersophisticatedICs.

Formoreinformation,visitSamsungFoundryat:www.samsung.com/us/business/foundry

Jointheconversation!Samsung’sblogat:www.voicesatsamsungsemiconductor.com

oratourSamsung’sFacebookpageat:www.facebook.com/SamsungUSATech