ACCRETECH / TSK UF2000 Tri-Temp Wafer Probing Machine, 5-8” • Temperature Range: -40°C to +150°C • Main Control System: Pentium 4, 2.0 Ghz. • Hard Disk Drive: 40 Gig. VX Works O/S • UF2000 O/S Rev: S5.13.08 or higher • Magneto-Optical Disk Drive or USB • Head Stage for NEXTEST Magnum / TERADYNE J750 Adapter Ring • First Cassette Loader for 25 Wafers (5- to 8-inch Wafers) • Cognex 8500 Vision System (included in PC Unit) • Align & PMI (Included in PC Unit) • Second Cassette Loader for 25 Wafers (5- to 8-inch Wafers) • Manual Wafer Inspection Transfer Unit • Dual Robotic Wafer Transport Arms • Pre-Alignment Stage Unit • Capacitive Non-Contact Displacement Sensor • Advanced Wafer Alignment Unit • Dual (X & Y) Moire Scales • High Rigidity Z Stage • Color LCD Control Panel with Touch Panel Switches • Alarm Lamp Pole • 8” Nickel Plated Cold Chuck • ARTS-HS Chiller Unit (ACCRETECH RAPID THERMAL SYSTEM HIGH SPEED) • Wafer ID Recognition Option - Type 6 OCR (Top Side Only) • Needle Cleaning Option (Block Type 100mm x 200mm & Brush) • Probe-Mark Inspection Option • Multi-Site Parallel Probing Option (128 DUT) • GP-IB Interface Option (Standard ACCRETECH Commands) • Light Vega Network Management Option for Product Recipe Management (Ethernet Interface Included) • S2-93 Compliance: Yes • Smart PMI Option • Remote Terminal Option: Full Remote Control • System Level Change Log Option: Yes • Automatic PC Changer • Vintage: 2011 [email protected]
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ACCRETECH / TSK UF2000 Tri-Temp Wafer Probing Machine, 5-8”• Temperature Range: -40°C to +150°C• Main Control System: Pentium 4, 2.0 Ghz.• Hard Disk Drive: 40 Gig. VX Works O/S• UF2000 O/S Rev: S5.13.08 or higher• Magneto-Optical Disk Drive or USB• Head Stage for NEXTEST Magnum / TERADYNE J750 Adapter Ring• First Cassette Loader for 25 Wafers (5- to 8-inch Wafers)• Cognex 8500 Vision System (included in PC Unit)• Align & PMI (Included in PC Unit)• Second Cassette Loader for 25 Wafers (5- to 8-inch Wafers)• Manual Wafer Inspection Transfer Unit• Dual Robotic Wafer Transport Arms• Pre-Alignment Stage Unit• Capacitive Non-Contact Displacement Sensor• Advanced Wafer Alignment Unit• Dual (X & Y) Moire Scales• High Rigidity Z Stage• Color LCD Control Panel with Touch Panel Switches• Alarm Lamp Pole• 8” Nickel Plated Cold Chuck• ARTS-HS Chiller Unit (ACCRETECH RAPID THERMAL SYSTEM HIGH SPEED)• Wafer ID Recognition Option - Type 6 OCR (Top Side Only)• Needle Cleaning Option (Block Type 100mm x 200mm & Brush)• Probe-Mark Inspection Option• Multi-Site Parallel Probing Option (128 DUT)• GP-IB Interface Option (Standard ACCRETECH Commands)• Light Vega Network Management Option for Product Recipe Management (Ethernet Interface Included)• S2-93 Compliance: Yes• Smart PMI Option• Remote Terminal Option: Full Remote Control• System Level Change Log Option: Yes• Automatic PC Changer• Vintage: 2011
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