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12. Turn‐on delay time from either a step application of input power or a logic low to a logic high transition on the inhibit pin (pin 3) to the point where VOUT = 90% of nominal.
13. Load Regulation relative to output voltage at 50% rated load.
14. Line Regulation relative to output voltage at 120Vdc input.
15. For operation at temperatures between +85°C and +125°C, derate power linearly from 50 watts to zero. Parameter limits are not guaranteed.
5.Unless otherwise specified, “Rated” load is 20W on the main (+5 volt) output and 15 watts each on the auxiliary (±15 volt) outputs. Load currents of up to 5A and ±1.5A on the main
and auxiliary outputs respectively are acceptable as long as the total output power does not to exceed 50 watts. Values in { } brackets reflect “‐L" option TID Light version
performance. Values in [ ] brackets reflect “‐H" option SEE hardened version performance. The "‐H" option incorporates alternative FET technologies providing a >82 MeV•cm2 /mg
(Gold Ion) SEE capability to the design.
7. Capacitive load may be any value from 0 to the maximum limit without compromising dc performance. A capacitive load in excess of the maximum limit may interfere with the
proper operation of the converter’s overload protection, causing erratic behavior during turn‐on.
8. Overload power dissipation is defined as the device power dissipation with the load set such that VOUT = 90% of nominal.
9. Load step transition time ? 10 μs.
6. Guaranteed for a D.C. to 20MHz bandwidth. Tested using a 20kHz to 10MHz bandwidth.
10. Recovery time is measured from the initiation of the transient to where VOUT has returned to within ±1% of its steady state value.
1. Parameter guaranteed by design.
2. Parameter verified during line and load regulation tests. Regulation is specified for 10% to 100% loading on all outputs.
3. Auxiliary output regulation is not maintained if main output load is less than 10%.
4. Auxiliary outputs require at least 10% loading for specified regulation. Voltage may increase at lighter loads and is ultimately limited by overvoltage zener diodes.
Input voltage is applied to the input EMI filter. This filter consists of differential and common mode components that attenuate the internal converter switching noise. The internal EMI filter attenuates conducted emissions to ensure compliance to MIL-STD-461 levels.
Internal controller bias is supplied during power up and in over-current scenarios via Darlington startup transistors off the input line. The controller power supply ramps up to the turn on point where it starts to supply drive to the main power converter MOSFET Q1. Under normal load condi-tions the output voltage will come up and a “Bootstrap” voltage is fed back to stabilize the Bias sup-ply eliminating power loss in the start-up transistors.
Main power conversion occurs in the forward converter Q1 and associated Transformer. The sec-ondary windings develop the required output voltages in parallel. A coupled inductor promotes good output cross regulation. Elimination of secondary side post regulators promotes high efficiency per-formance.
Output voltages are regulated on the main output secondary side. A TL1431 reference develops a current mode error signal which is chopped by the main forward transformer voltage and the summed with the primary side converter current in a patented magnetic feedback approach. The combined “V + I” error signal is applied to the primary controller’s ramp control input to complete the regulation loop.
The primary ON OFF command disables internal switch-mode action when pulled low.
The SYNC input is fully transformer isolated to allow operation from primary or secondary refer-
The output current is limited by the built in current limit circuit, to protect the Power Supply and the load from overstress. The weighted sum of main and auxiliary output currents is controlled. The maximum current of any one of the outputs can be calculated using the following relationship:
5.5×I15A + 5.5× I15B + 2 × I5 = 27 amps
Where,
I15A is the 15V A output current in amperes
I15B is the 15V B output current in amperes
I5 is the 5V output current in amperes
For example, if all outputs are fully loaded and the 5V output load impedance is further reduced to the current limit threshold, the resulting maximum 5V output load current is:
(27 amp - 5.5×1amp - 5.5×1amp) ×1/2 = 8 amps
The converter continues to regulate its output voltage under this loading condition. If the load impedances of any of the outputs are further decreased, the converter turns off and attempts to restart after a delay.
1. Electrical test at +25°C shall be performed unless otherw ise specif ied after each Environmental test (Shock, Vibration, Temperature cycle, EMI and Life)
Test 1 Custom Qualification
Method
Reference
External Visual Inspection Test Report
Electrical Test Test Report
Shock, Non-OperatingSimilarity QTR996 Appendix B
Vibration, OperatingSimilarity QTR996 Appendix C
Thermal Vacuum
Similarity QTR996 Appendix D
Temperature Cycling
Similarity QTR996 Appendix D
EMI - Unit to be characterized to theserequirements (Not pass/fail)
MIL-STD-883, Meth 1001, Cond G, 3 cycles w ith base plate temperature of -55 °C to +85 °C. Outputs monitored during TVAC cycles, record at temperatures noted under Electrical.
100 cycles from base plate temperature, MIL-STD-883, Method 1010.8, Cond A, -55 °C to +90 °C, 10-15 C°/min, 10 min dw ell at temperature limits. Outputs monitored during thermal cycles.
CE101, CE102, CE106, CS101, CS103, CS104, CS105, CS109, CS116, RE101, RE102, RE103, RS103, Radiated Susceptibility Magnetic Field 10 nT Magnetic Moment 300 A-m2. MIL-STD-461 setup per MIL-STD-462
No Damage
Read & Record at +25 °C
1000 Hours@ Tc= +105 °C
QUALIFICATION TESTSTest Method/Condition
Yes per O&M – dimensions and mass or std 883 2009
Read & Record (-55 °C, +25 °C, +85 °C)
MIL-STD-202, Method 213B, Test Condition F, 1500 gpk, 0.5 msec ½ sine pulse. Three pulses in each direction of each axis, 18 pulses total.
MIL-STD-202, Method 214A, Cond. II-F, 24.06 grms random vibration, 50-2000 Hz, 3 minutes/axis, 9 min total. Outputs monitored.
Extended Screening: Microsemi PMG can perform additional tests as defined by customer requirements. Please contact the PMG sales contact shown on the last page of this datasheet for a quote on your specif-
RequirementExternal VisualInitial Electrical
Vibration
Post Vibration Electrical
Temperature Cycle
Burn-inFinal ElectricalExternal Visual
RequirementExternal VisualInitial Electrical
Vibration
Post Vibration Electrical
Temperature Cycle
Burn-inFinal ElectricalExternal Visual
RequirementExternal VisualElectrical
VibrationTemperature CycleBurn-inExternal Visual
Test Method /ConditionO&M –dimensions and massFull performance at +85°C, +25°C, -55°C for initial first article of
Full Performance at +25°C for previously qualified variation of the SA50.
ATP Testing - Standard Screening Prototypes
NoneNoneNoneNo Damage
MIL-STD-883, Method 1010, Cond. A, 1 cycle, +85°C to -55°C, operating.Outputs monitored during Thermal cycles
40 Hrs @ 105°C, 50% of rated load (outputs monitored)Full performance at +25°C (deliverable data)No Damage
ATP Testing - Standard ScreeningTest Method /Condition
O&M –dimensions and massFull performance at +25°CWorkmanship non-operating vibrationMIL-STD-202, Method 214, 6 grms (50 Hz-2 kHz)1 minute perpendicular to the boardFull performance at +25°C
Workmanship operating vibration (outputs monitored) MIL-STD-202, Method 214 6 grms (50 Hz-2 kHz)1 minute perpendicular to the board
Full performance at +25°C
MIL-STD-883, Method 1010, Cond. A, 10 cycles, +85°C to -55°C, operating.Outputs monitored during Thermal cycles
160 Hrs @ 105°C, 50% of rated load (outputs monitored)Full performance at -55°C +25°C +85°C (deliverable data)No Damage
ATP Testing - Extended ScreeningTest Method /Condition
The surface on which an SA50 power supply is mounted is recommended to be flat to .005 in or less, with a surface roughness of 32 microinches or less. The mounting hole pattern and housing footprint for SA50 pow-er supplies is shown in Figure 1.
The fasteners recommended for mounting of SA50 power supplies are 4-40 size fasteners, made from A-286 steel, used with NAS620C4 washers. Representative fasteners include NAS1101, NAS1352, or equivalent. The recommended torque is 6-8 in-lb.
The surface on which an SA50 power supply is mounted is recommended to be flat to .005 in or less, with a surface roughness of 32 microinches or less. The mounting hole pattern and housing footprint for SA50 power supplies is shown in Figure 1.
The fasteners recommended for mounting of SA50 power supplies are 4-40 size fasteners, made from A-286 steel, used with NAS620C4 washers. Representative fasteners include NAS1101, NAS1352, or equivalent. The recommended torque is 6-8 in-lb.
The products described in this datasheet may be subject to the International Traffic in Arms Regulations (ITAR). They may require an ap-proved export license prior to export from the United States depending on end use application. An export includes release of product or description of technology to foreign national inside or outside of United States.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communica-tions, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power manage-ment products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Micro-semi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.
Microsemi makes no warranty, representation, or guarantee regard-ing the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any li- ability whatsoever arising out of the application or use of any product or circuit. The products sold here- under and any other prod-ucts sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reli-able but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Mi-crosemi. It is the Buyer's responsibility to independently determine suitability of any products and to test and verify the same. The infor-mation provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the entire risk associated with such infor-mation is entirely with the Buyer. Microsemi does not grant, ex-plicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information pro-vided in this document is proprietary to Microsemi, and Mi-crosemi reserves the right to make any changes to the infor-mation in this document or to any products and services at any time without notice.