RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday October 9, 2009 11:30 to 1:00pm.

RIT Senior Design Project 10662D3 Engineering Camera Platform

Friday October 9, 2009 11:30 to 1:00pm

Team Members

• Gregory Hintz (EE)• Samuel Skalicky (CE)• Jeremy Greene (EE)• Jared Burdick (EE)• Michelle Bard (ME)• Anthony Perrone (ME)

Power Distribution

FPGA DDR2OEM Board

Flash MEM SSD INS D3 CamerasConnector

Board

1.2V 1.8V 5V 3.3V3.3V, 5V,

12V15V 3.3V 9-36V

Power Distribution(cont.)

-Schematic Using LT1933 taken from Linear Technology

Camera: MT9J003 CMOS Digital Image SensorWhy This Camera?

Imaging Array 3664(H) x 2748(V)

Speed/Output• Frame Rate:

15 fps (HiSPi serial I/F) 7.5 fps (parallel I/F)

• Data Rate: 2.8 Gb/s (HiSPi serial I/F) 80 Mp/s (parallel I/F)

• Data Format: 12-bit RAW

Temperature Range• –30°C to +70°C

Power• Supply: 1.8V – 2.8V

638mW @ full resolution

Interfaces

D3 Camera Interface-16-bit parallel output-6 Miscellaneous positions-Two wire I²C bus interface-Several clock and control positions

CameraLink -LVDS to achieve theoretical transmission

rate of 1.923Gbps-Not dependent on a particular supply

voltage because of low signal voltage swing

GigE-High bandwidth for high-speed, and high

resolution cameras-Downward compatible with 10/100 Mhz

Ethernet-Operates at a fast frame rate

The Connector Board

• Speculation of finished product:

• Ports for data I/O.

Where We Started

Initial Concept

• Specifications call for external ports:– (2) CameraLink (LVDS)– (2) Gigabit Ethernet– Power in (9V to 36V)– Sync– Serial (RS-232)

Courtesy D3 Engineering

Things to Consider• Q: What does this do beyond wire connectors?

– Will include some IC's that might otherwise be on the main, FPGA board.

• Q: Do all of these connectors need to be on a circuit board?

– Probably not

• Q: Is there anything else that needs an I/O port?

– The Inertial Navigation System (INS) will be housed separately

– An external Serial ATA (SATA) will be included

• Q: How will data be transferred from the connector board to the FPGA board and vice-versa?

– A ribbon cable to carry data signals

– CameraLink & GigE interfaces adapted to D3

After Initial Brainstorming

The Inertial Navigation System

Provides location and directional data. Location determined by a Global

Positioning System (GPS) device. Direction determined by an

Inertial Measurement Unit (IMU). Important information to have

for this kind of camera system.

Considering the Options

MicroStrain 3DM

Both can be used with RS232 port.

NovAtel SPAN

Enclosure Consideration

Some models contain the GPS and IMU in a single unit, others separate them.

May have noteworthy impact on size and design of the system enclosure.

Digital Operations

FPGA Board

Camera/INS Speeds

• 10 MP Visual Band Image Sensor– 1 image/sec– 1 image approx 32MB

• VGA IR Band Image Sensor– 30 images/sec– 1 image approx 1MB

• INS Sensor– 1 capture/image (30/sec)– 1 capture approx 2MB

FPGA Hardware Requirements

• Flash Based (SPI) Configuration Memory– 64MB covers all Spartan 6 LXT packages

• DDR2 Ram– Image Data: RGB 24 bits, upto 30 bits per

pixel• Dual Modules -> 32bits wide

– Density 2Gb total• Approx 62MB image data/sec• Approx 60MB INS data/sec

FPGA I/O Pin Requirements

Spartan 6 FPGA Family

End of Electrical Discussion

Needs Considerations Approach

• Maintain optimal temperature range required by components

• Prevent the heat produced by the electronics from interfering with the operation of cameras

• Maintain an air/water tight environment

Heat Mitigation

• External environment• Temperature on ground : assume 40-70 °F• Temperature at 30,000 ft (5.7 miles):

-66.8°F to -36.8°F

Image ID: wea00041, NOAA's National Weather Service (NWS) Collection Photographer: Ralph F. Kresge #1059

•Internal environment• External temperature plus

temperature of heat generated by electronic components

Needs Considerations ApproachHeat Mitigation

• 2 Thermally isolated enclosures

• Conductive heat transfer methods inside the chassis

• Passive convective heat transfer

methods outside

Needs Considerations ApproachHeat Mitigation

• Ensure imaging system is securely attached to airframe

• Reduce vibration of system

Image from: www.airamericafc.com/imaging/

Needs Considerations Approach

Airframe Mounting

• Pre-existing bolt patterns in aircraft• Pre-existing opening in aircraft for imaging

systems• Does not interfere with other components of

imaging system

Needs Considerations Approach

Airframe Mounting

• Utilize airplane’s pre-existing bolt pattern in vibration damping mount to attach vibration damping mount directly to airframe

Initial sketch for vibration damping airframe-mount

Needs Considerations ApproachAirframe Mounting

Needs

• Stabilize Image• Prevent Hardware Damage/Malfunctioning

Considerations

• Frequencies of Aircraft• Allowable Vibration in Image• Component Resonant Frequencies

Approach

Mechanical isolation of chassis

Stock Hardware

• Interchangeable as needs change• Large body of established data

Chassis DesignPhase 1: Individual Compartments

Separate Enclosures Thermally Isolated

ModularMinimal Leak Paths

Chassis DesignPhase 2: Scale

Chassis DesignPhase 3: Detail

RIT Senior Design Project 10662D3 Engineering Camera Platform

Friday October 9, 2009