PUBLIC PAUL HART SVP AND GM OF RADIO FREQUENCY NXP SEMICONDUCTORS 5G TECHNOLOGY SUMMIT SHANGHAI, CHINA JULY 21, 2016 RF POWER AMPLIFIER SOLUTIONS FOR 5G
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PAUL HARTSVP AND GM OF RADIO FREQUENCYNXP SEMICONDUCTORS
5G TECHNOLOGY SUMMITSHANGHAI, CHINAJULY 21, 2016
RF POWER AMPLIFIER SOLUTIONS FOR 5G
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FAST-TRACK 5G WITH NXPLEADER IN RF, PIONEER IN 5G
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Diversity of Applications on Radio Networks of the FutureThe end of ‘one size fits all’ solutions
Low
Pow
er
Wire
less
2G/3
G4G
Pre
5G
5G
Massive MTC
Low Power &Small signaling
overhead
MBBCapacity & Coverage
Critical MTC
Latency &ReliabilityeMBB
Ultra High Capacity
mmW RAN
Time
*eMBB: enhanced Mob BB*MTC: Machine Type Comm
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5G: Evolutionary Migration
4GRel 13
Pre 5GRel 14
5GRel 15
5GRel 16+
Mobile Broadband Advanced Mobile Broadband eMBB eMBB + cMTC + mMTC
2016 2017 2018 2019
Carrier Aggregation mMIMO Spectrum expansion Densified networks
App
sS
tand
ard
RA
N
evol
utio
n
Drivers for Network evolution Higher performance and capacity applicationsMobile HD videoLast mile connectivityConnected carsAugmented reality Real time controlMachine to machine connectivity
Toolkit for RAN evolution Single-User Massive MIMO: advanced antennas with beam steering for improved user experienceMulti-User MIMO: Transmit data to multiple users using same frequency resources Intelligent Connectivity: Overlay 4G and 5G resources for smart and efficient routing of data Latency Reduction: Shorten network access time to enable real-time communications Expanded spectrum: capacity augmentation with mm/cm wave spectrum
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Radio Network Evolution
2015 2019 2023
2013 2017 2021 2025
First LTE MU mMIMO deployments in 2017, first 5G MU mMIMO deployments in 2019
More frequency bands @ higher frequency will be added, old bands stay, larger SBW @ higher frequency bands
Continuous increase in antenna elements ► lower power per antenna element ► higher level of integration
Macro BTSLTE, MIMO2-8 Tx10-40 Watt per PA0.7-2.7 GHz
Macro BTSLTE Advanced ProMU massive MIMO (fully digital)32-64 Tx3-5 Watt per PA2.3-3.8 GHz, TDD
Macro BTS5GMU massive MIMO(fully digital)64-128 Tx1-3 Watt per PA1.8-6.0 GHz, TDD
Small CellsLTE, MIMO2 Tx100 mW to 10 W per PA0.7-2.7 GHz
Small CellsLTE, MIMO2-8 Tx100 mW to 10 W per PA0.7-6.0 GHz
Small Cells: mm-Wave 5G, beam forming, MIMO(hybrid beamforming)128, 256 and more antennasup to ~100 mW per PA> 6 GHz + < 6 GHz anchor, TDD
First LTE MU mMIMO Deployments, 2.6 GHz
First 5G Deployments, 3.5 GHz
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Pre-5GAdding Higher Frequencies, More Antennas, Smaller PAs
Waveform: LTE type signals
New bands up to 6 GHz, wider channels
Improved utilization of channel (spectral efficiency), with need to overcome adverse propagation characteristicsMIMO → massive MIMOMIMO takes advantage of multipath propagationMore throughput, i.e., more data over the same channel MIMO is already being used as part of 4G (2T, 4T, etc.)Each “TX” will use a single PAThe higher the frequency, the higher the order of MIMO
More antennas also allow for beamformingFocus energy on defined spatial area
0.00E+00
1.00E+09
2.00E+09
3.00E+09
4.00E+09
5.00E+09
6.00E+09
7.00E+0990
92
94
96
98
100
102
104
106
108
110Free Space Path Loss
1,000m
Frequency (Hz)
FSP
L (d
B)
9 dB
5 dB
1 GHz
2.7 GHz
4.5 GHz
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RF Components for Pre-5G
Higher frequency bandsSi LDMOS remains the workhorse in current cellular bandsIII-V expansion (GaN and GaAs) at >3.5GHzLarger parasitic impact require higher level of integration needed
Lower transmit power level for mMIMO & small cellsLower supply voltages Smaller PA footprint requirements require higher levels of integration
Continually increasing signal bandwidth
Continued push for higher efficiency PAsDoherty + DPD still best-in-classRe-evaluate linearization options for mMIMO and small cellsContinue research on alternate high η PA technologies
2G
3G
4G
5G
0.6 6 60
Frequency (GHz)
2020 |
2010 |
2000 |
1990 |*
2G 3G 4G 5G0.01
0.1
1
10
100
PA
Tra
nsm
it P
ower
(W)
1990 2000 2010 2020 *
Required expansion of scope
Current Focus of RF PA Vendors
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5G – cm & mm Wave Challenges and Questions
Use casesMassive bandwidth, but poor propagationIndoor vs. outdoor, path loss & building penetration
System ArchitectureSemiconductor technology, interconnects, packagingMonolithic vs. multi-chip integrationBeamforming vs. massive MIMO, digital vs. analog vs. hybrid amplitude and phase controlIntegrated PA/Antenna elements?
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5G Integration beyond the PA
BBProcessor
DUCCFRDPD
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NXP 5G Roadmap AlignmentPA Technology Leadership: Si-LDMOS, Gallium Nitride, Gallium Arsenide, SiGe BiCMOS, Advanced Packaging for Monolithic & Multi-Chip Integration
Thought Leadership: Driving 5G system integrationL1 functions in radio to reduce optical challenges
Pioneering high power integration to meet 5G radio size & cost challenges
Collaboration with industry partners to demonstrate new concepts
Performance & Quality: Striving to be the industry performance leader with highest total quality
System integration is becoming the biggest challenge
NXP is building a cohesive roadmap spanning frequency, power and functions – digital and analog
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Thank You.