Report on CMS 3D sensor tests Enver Alagoz 1 On behalf of CMS 3D collaboration 1 Physics Department, Purdue University, West Lafayette, IN 47907- 2036.

Report on CMS 3D sensor tests

Enver Alagoz1

On behalf of CMS 3D collaboration1Physics Department, Purdue University, West Lafayette, IN 47907-

2036 US

26 April 2012

• Pre- and post-irradiation lab and beam tests (@ FNAL) performed for SINTEF and FBK 3D sensors– CNM sensors only tested in testbeams

• Irradiation– 800 MeV protons/cm2 at Los Alamos– Fluences: 3.5E14, 0.7E15, and 3.5E15 neq/cm2

• All ROCs work after irradiation– Except SINTEF case: 1 out of 6 ROCs worked

• Post-irradiation lab measurements carried out in the thermal chamber– Leakage current– Noise– Source data

Introduction

Cold setup

Purdue cold test setup

• Environmental chamber• -35 °C < T < 200 °C• Humidity control

• Works with CAPTAN and PSI DAQ systems• Good for sensor IV measurements and ROC calibrations at cold• Manual temperature control

Cold setup for irradiated 3D sensor testing

Cold setup

Purdue cold test setup

Sr-90 source

Linear actuator

SensorHV

Temperature sensor

Thermal measurements in the chamber

Purdue cold test setup

• Infrared camera placed in the chamber to measure the sensor temperature

Thermal image of sensor at emissivity = 1 Thermal image of sensor at emissivity = 1 Thermal chamber at 10 °C

Thermal measurements in the chamberThermal chamber at 10 °C

ROC is ON

--- temperature sensor

pcb

ROC is OFF

ΔT = 13 °C

FBK 3D PIXEL SENSORS

Sensors Full 3D

200 μm thickness

ATLAS08 batch

(2010)

SensorROC

Bump bonds

VHDIBase

plateAdhesive

Wire

bond

Bias wire

FBK 3D plaquette

IV measurementsThermal chamber at -20 °C

Noise scan

Thermal chamber at -20 °C

Source testing• Sr-90 source: 1 mCi, Eβ = 0.546 ΜeV• Random trigger used Thermal chamber at -20 °C

1 Vcal = 65 e- MP = 10.6 ke- (Thickness: 200 μm)

4E_14_W8 @ -15V Φ = 1E15 p/cm2

Source charge collection scan• Sr-90 source: 1 mCi, Eβ = 0.546 ΜeV• Random trigger used

Landau convoluted Gaussian fit

Thermal chamber at -20 °C

4E_14_W8 @ -15V Φ = 1E15 p/cm2

Charge collection scans

Thermal chamber at -20 °C

Source testing: pre- and post-irradiation

Signal LOSS:1E 43% after 1E15 p/cm2 (0.7E15 neq/cm2)1E 50% after 5E15 p/cm2 (3.5E15 neq/cm2)

2E 14% after 1E15 p/cm2 (0.7E15 neq/cm2)4E 14% after 1E15 p/cm2 (0.7E15 neq/cm2)

Beam test results (1E_2) Vbias = -15V : 20o tiltP

relim

ina

ry

Beam spot

98.5% efficiency

62% size 1 pixel 37% size 2 pixels

Unirradiated sensor

Beam test results (2E_9) Vbias = -5V : 20o tiltP

relim

ina

ry

Beam spot

94.6% efficiency

77% size 1 pixel 22% size 2 pixels

Unirradiated sensor

SINTEF 3D PIXEL SENSORS

Sensors

Plastic protection

Cooling tubes

SINTEF 3D plaquette

2E Configuration 4E Configurationn+ (readout) p+ (bias)

100

μm

150 μm

SINTEF 3D Plaquette

Al fixture VHDI Adhesive

ROC

Sensor

Bump bonds

Support wafer

HV bias wirebond

Au plated Ceramic

Bias pad

Chamber @ -20 °C

Sensor: 4E_B2-10_1ϕ = 1E15 neq/cm2

Noise scan

Vbias = -90VThickness = 200 µmMPV = 9600 electrons

Chamber @ -20 °CSensor: 4E_B2-10_1ϕ = 1E15 neq/cm2

• Sr-90 source: 1 mCi, Eβ = 0.546 ΜeV• Random trigger used

Charge collection

Chamber @ -20 °C

Sensor: 4E type200 μm thickϕ = 1E15 neq/cm2

Charge collection scan

CNM 3D PIXEL SENSORS

CNM 3D sensors• Columns etched from opposite sides of substrate• Columns don't pass through full thickness• 1E type only

Hole aspect ratio 25:1 10µm diameter, 250µm deep P- and N-type substrates, 285µm thick

Giulio Pellegrini et al (CNM)

Beam test results (12-3_62A) Vbias = -15V : 0o tiltP

relim

ina

ry

Beam spot

93.4% efficiency

99% size 1 pixel 1% size 2 pixels

Unirradiated sensor

Sensor: 1E type200 μm thick

Summary & Outlook• All irradiated ROCs work (CNM, FBK) except SINTEF• Lab measurements performed in the thermal chamber at -20 °C• Thermal measurements suggest sensor temperature is -7 °C

(ROC ON) when thermal chamber at -20 °C due to ΔT = 13 °C • IV, noise scan, and source testing done

– Negligible increase in noise– Leakage current increased– Not much increase in depletion voltage

• Post- and post-irradiation beam test results will be ready in few months

• More 3D sensors will be irradiated with fluences up to 1E16 neq/cm2

• Search for a testbeam facility since FNAL will have no beam for sometime starting from May 2012

BACKUP SLIDES

BEAM

CONTROL ROOM

DUT

PIXEL DETECTORS

SCINTILLATORS

3.7V POWER SUPPLY

ACELLERATOR CLOCK

CLOCK AND TRIGGER

DISTRIBUTION

FNAL testbeam• 120 GeV protons• No B field

Meson Area

FNAL testbeam layout