R&D CIRCUITS Advanced Technology Products and Services Presented By: Sherri Sides & James Russell Presented By: Sherri Sides & James Russell.

R&D CIRCUITSR&D CIRCUITSAdvanced Technology Advanced Technology Products and ServicesProducts and Services

Presented By:

Sherri Sides & James Russell

Presented By:

Sherri Sides & James Russell

R&D Circuits, R&D Circuits, CorporateCorporate

• Founded in 1965, almost 40 years of excellence...Founded in 1965, almost 40 years of excellence...

• 7 million per year in sales, 21,000 sq. feet of 7 million per year in sales, 21,000 sq. feet of manufacturingmanufacturing

• Privately Owned CompanyPrivately Owned Company

• Dedicated Reinvestment in the Company and TechnologyDedicated Reinvestment in the Company and Technology

• Design, Fabrication & AssemblyDesign, Fabrication & Assembly

• Two Locations, Edison NJ and Allentown, PATwo Locations, Edison NJ and Allentown, PA

• Focused Market Based Customer BaseFocused Market Based Customer Base

Fabrication Product OfferingsFabrication Product Offerings

• Advanced Technology – Advanced Technology – Small VolumeSmall Volume

• A.T.E. IndustryA.T.E. Industry– Performance BoardsPerformance Boards

• DefenseDefense– Microwave / RFMicrowave / RF

• All MarketsAll Markets– HDI / Micro ViaHDI / Micro Via

• Medical /CommercialMedical /Commercial• Rigid FlexRigid Flex

Basic InformationBasic Information• Panel UtilizationPanel Utilization

– 12x18 (10x16) usable12x18 (10x16) usable– 18x24 (16x22) usable18x24 (16x22) usable– 20x26 (18x24) usable 20x26 (18x24) usable

• General Cost DriversGeneral Cost Drivers• Technology & DeliveryTechnology & Delivery• Holes (# & Sizes)Holes (# & Sizes)• Core thicknessCore thickness• High performance materialsHigh performance materials• Lines and spacesLines and spaces• Panel utilizationPanel utilization• Hole to copper internalHole to copper internal• A/R externalA/R external• Surface finishSurface finish

• Material TypesMaterial Types– High Temp FR4High Temp FR4– Rogers Full SeriesRogers Full Series– ArlonArlon– TaconicTaconic– Nelco Nelco – GetekGetek– PolyimidePolyimide– BT ExpoxyBT Expoxy– Cyanate EsterCyanate Ester– KaptonKapton

• Surface FinishesSurface Finishes– Immersion Tin & SilverImmersion Tin & Silver– HASL & OSPHASL & OSP– Electrolytic Gold HardElectrolytic Gold Hard– Electrolytic Gold Soft (wire bonding)Electrolytic Gold Soft (wire bonding)– Solder-able wire-bondable Solder-able wire-bondable

Electrolytic Gold on theElectrolytic Gold on the same same surfacesurface

– Immersion GoldImmersion Gold

CertificationsCertifications

• UL Certified UL Certified – (file #E47678(file #E47678

– .003 lines, 6 inch .003 lines, 6 inch un-pierced areaun-pierced area

• IPC MemberIPC Member– Active participant Active participant

of technical of technical committee’scommittee’s

• ASQ Certified ASQ Certified Quality LeadershipQuality Leadership– Quality Manager Quality Manager

CertificationCertification

– Quality Auditor Quality Auditor CertificationCertification

• ISO 9001-2000 ISO 9001-2000 CompliantCompliant– (meets applicable (meets applicable

requirements of, NOT requirements of, NOT certifiedcertified

Product Offerings, Product Offerings, Cu filled viasCu filled vias

• 2:1 aspect ratio for reliable void free fill• Panel, or Dot Shot• Refer to Paper

Photomicrographs of cross-sections of successfully plated shut micro-vias from R&D’s research program. Micro-vias range in size from 5.5mils - 3mils in diameter in 1/2 mil increments. These micro-vias were laser drilled and RPP pattern plated at 10ASF.

Aspect ratio = 1.96/1 Aspect ratio = 1.78/1 Aspect ratio = 1.61/1

Aspect ratio = 1.43/1 Aspect ratio = 1.25/1 Aspect ratio = 1.07/1

Product Offerings,Product Offerings,Periodic reverse pulse platePeriodic reverse pulse plate

• Even distribution of Cu across panel• Even distribution of Cu across hole wall• .9 : 1, Plating aspect surface to Hole

Photomicrographs of cross-sections of a PTH that was RPP pattern plated at 10ASF for 180 minutes. Micrograph A shows the PTH at low magnification and micrographs B and C show the side wall and surface respectively at high magnification. Copper thickness measures 1.1 mils at the surface and 1.3 mils at the hole wall. In addition, image C shows the plating thickness as a function of 1/2 hour plating increments. Average plating rate measures 6.1x10-3mils/min at the surface and 7.1x10-3mils/min at the hole wall.

R&D Circuits Proprietary

Photomicrographs of cross-sections of a PTH that was RPP panel plated at 15ASF for 180 minutes. Micrograph A shows the PTH at low magnification and micrographs B and C show the side wall and surface respectively at high magnification. Copper thickness measures 1.8 mils at the surface and 1.6 mils at the hole wall. Average plating rate measures 10.0x10-3mils/min at the surface and 8.9x10-3mils/min at the hole wall.

R&D Circuits Proprietary

PANEL PLATING (Plating Rate in micro-inches/minute)

10ASF 15ASF Panel Position Panel Position PLATING

LOCATION Top Left

Center Bottom Right

Top Left

Center Bottom Right

Surface 6.5 (+/-0.3)

4.8 (+/-0.5)

6.3 (+/-0.4)

9.3 (+/-0.6)

7.8 (+/-1.0)

10.3 (+/-1.0)

Edge of Hole

6.0 (+/-0.4)

4.9 (+/-0.6)

5.7 (+/-0.3)

8.7 (+/-0.4)

7. 5 (+/-0.7)

9.0 (+/-0.6)

Center of Hole

6.4 (+/-0.3)

4.8 (+/-0.5)

5.8 (+/-0.3)

9.1 (+/-0.4)

7.9 (+/-1.0)

9.6 (+/-0.2)

Average plating rate surface = 5.9@10ASF and 9.1@15ASF Average plating rate in PTH = 5.6@10ASF and 8.6@15ASF

R&D Circuits Proprietary

PATTERN PLATING (Plating Rate in micro-inches/minute)

10ASF 15ASF Panel Position Panel Position PLATING

LOCATION Top Left

Center Bottom Right

Top Left

Center Bottom Right

Surface 6.7 (+/-0.5)

5.8 (+/-0.2)

6.1 (+/-0.3)

9.0 (+/-0.6)

8.9 (+/-0.2)

9.9 (1.2)

Edge of Hole

6.9 (+/-0.5)

6.4 (+/-0.3)

6.2 (+/-0.5)

9.7 (+/-0.3)

9.2 (+/-1.0)

10.8 (+/-0.8)

Center of Hole

7.3 (+/-0.3)

6.4 (+/-0.3)

6.6 (+/-0.2)

10.3 (+/-0.4)

9.6 (+/-0.2)

10.8 (+/-0.6)

Average plating rate surface =6.2 @ 10 ASF, and 9.3 @15 ASFAverage plating rate hole = 6.6 @10 ASF, and 10.1 @15 ASF

R&D Circuits Proprietary

•RPP plating scales well with current density

•Plating rates are slightly higher at the corners of the panel

•Pattern Plating yields a more consistent plating rate across the panel (10-15%pattern Vs. 20-25%panel)

•Hole wall plating is uniform (+/- 5%) and is within standard deviation of measurements

•Pattern plating rates at the surface are 90-93%of those inside the hole

RPP PLATING SUMMARY

www.rdcircuits.comwww.rdcircuits.com9 Olsen Avenue9 Olsen Avenue

Edison, NJ 08820Edison, NJ 08820732-549-4554 phone 732-549-4554 phone

732-549-1388 fax732-549-1388 fax

Sherri SidesSherri SidesSales ManagerSales Manager

[email protected]@rdcircuits.com

9 Olsen Avenue9 Olsen AvenueEdison, NJ 08820Edison, NJ 08820

732-549-4554 phone 732-549-4554 phone 732-549-1388 fax732-549-1388 fax

Sherri SidesSherri SidesSales ManagerSales Manager

[email protected]@rdcircuits.com