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The RAK833 is a family of LoRa concentrator cards with mini PCIe form factor based onSX1301, which enables an easy integration into an existing routers and others network equipmentwith Lora Gateway capabilities.
The card can be used in any embedded platform offering a free mini-PCIe slot with USB andSPI connectivity.RAK833 are a complete and cost efficient LoRa gateway solution offering up to 10programmable parallel demodulation paths. It targeted at smart metering fixed networks andInternet of Things applications with up to 500 nodes per km2 in moderately interferedenvironment. The modules have the industry standard PCI Express Mini Card form factor, whichenables easy integration into an application board and is also ideal for manufacturing of smallseries.
1.2. Product ParametersModule Frequency
Protocol LoRaWAN 1.0.2Lora Chipset SX1301Dual-Band 863-870MHz,915-923MHzFrequency Range EU 863-870MHz,
US 902-928 MHz,AU 915-928MHzAS 923MHzSouth Korea 920-923MHz
Power Input DC 3.3 ± 5%Hardware Interface Mini-PCIESoftware Interface USB/SPIMultichannel 8uplinks、1downlinkLEDs 2*LEDs for PA_EN and LNA_ENUSB USB2.0, USB-to-SPI bridge FT2232HNode Numbers 500 nodes/km2
Range Urban2~4km/Subur5~10km/Open Area>15kmPower Consumption TX (max): 135 mA
RX(all channels):260mALdle:71mA
RX Sensitivity Up to -136.5dBm@SF12, BW 125KHzMax RF Output Up to +25 dBmMean RF Output Up to +23 dBmOperation Temperature -48 to +85° CSize 50.95 x 30 x 4.5 mm (PCB)
As described in Figure 1, the RAK833 card integrates one SX1301 chip and two SX1255/7and other chip for RF signal, which represents the core of the device, providing the related LoRamodem and processing functional lilies. Additional signal conditioning circuitry is implemented forPCI Express Mini Card compliance, and one U. FL connectors are available for external antennasintegration.
36 USB_D- USB_D- USB I/O USB Data Line D- 90-ohm nominal differentialimpedance.Pull-up, pull-down and series resistorsas required by USB 2.0 specificationsare part of the USB pin driver and neednot be provided externally.
37 GND GND GND N/A Ground Connect to ground
38 USB_D+ USB_D+ USB I/O USB Data Line D+ 90-ohm nominal differentialimpedance.Pull-up, pull-down and series resistorsas required by USB 2.0 specificationsare part of the USB pin driver and neednot be provided externally.
39 3.3Vaux 3.3Vaux 3.3Vaux I RAK833 supply input Connect to 3.3 V40 GND GND GND N/A Ground Connect to ground
41 3.3Vaux 3.3Vaux 3.3Vaux I RAK833 supply input Connect to 3.3 V42 LED_WWAN# NC N/A Internally not connected43 GND GND GND N/A Ground Connect to ground
44 LED_WLAN# NC N/A Internally not connected
45 Reserved PCIe_SCK I/O Host SPI CLK Max 10MHz clock
46 LED_WPAN# NC N/A Internally not connected
47 Reserved PCIe_MISO I/O Host SPI MISO
48 1.5V NC N/A Internally not connected
49 Reserved PCIe_MOSI I/O Host SPI MOSI
50 GND GND GND N/A Ground Connect to ground
51 W_DISABLE2# PCIe_CSN I/O Host SPI CS
52 3.3Vaux 3.3Vaux 3.3Vaux I RAK833 supply input Connect to 3.3 VTable 3: Pin Definition
2.3.1.Module supply input
RAK833 card must be supplied through the 3.3Vaux pins by a DC power supply. The voltagemust be stable, because during this operation the current drawn from 3.3Vaux can varysignificantly, based on the power consumption profile of the SX1301 chip (see SX1301 DS).
2.3.2.Antenna RF interfaces
The modules have one RF interfaces over a standard U. FL connectors (Hirose U. FL-R-SMT)with a characteristic impedance of 50. The RF port (ANT1) supports both Tx and Rx, providing theantenna interface.
2.3.3.SPI interface
A SPI interface is provided on the PCIe_SCK, PCIe_MISO, PCIe_MOSI, PCIe_CSN pins ofthe system connector. The SPI interface gives access to the configuration register of SX1301 via asynchronous full-duplex protocol. Only the slave side is implemented.
2.3.4.USB interfaceNote: RAK833-SPI don’t have this feature
RAK833 card can support the high speed USB to SPI by FT2232H, it includes a high-speedUSB 2.0 compliant interface with maximum 480 Mb/s data rate, representing the interface for anycommunication with an external host application processor. The module itself acts as a USB deviceand can be connected to any USB host equipped with compatible drivers. For more information,please refer to the data sheet of FT2232H.
2.3.5.RESET
RAK833 card includes the RESET active-high input signal to reset the radio operations asspecified by the SX1301 Specification.
2.3.6. SPDT_SEL
RAK833 card includes the SPDT_SEL input for selecting SPI or USB interface.SPDT_SEL="H", USB Port Enable, SPDT_SEL="L", SPI Port Enable. Internal Pull UP, DefaultUSB Port.
2.3.7. GPS_PPS
RAK833 card includes the GPS_PPS input for received packets time-stamped.
3. Electrical specificationsStressing the device above one or more of the ratings listed in the Absolute Maximum
Rating section may cause permanent damage. These are stress ratings only. Operating themodule at these or at any conditions other than those specified in the Operating Conditionssections (chapter 4.1) of the specification should be avoided. Exposure to Absolute MaximumRating conditions for extended periods may affect device reliability.
The Operating condition range define those limit within which the functionality of the device isguaranteed.
Where application information is given, it is advisory only and does not form part of the specification.
3.1. Absolute maximum rating
Limiting values given below are in accordance with the Absolute Maximum Rating System (IEC 134).
Symbol Description Condition Min. Max. Unit
3.3Vaux Module supply voltage Input DC voltage at 3.3Vaux pins –0.3 3.6 V
USB USBD+/D-pins Input DC voltage at USB interface pins 3.6 VSPDT_SEL Port select Input DC voltage at SPDT_SEL input pins –0.3 3.6 VRESET RAK833 reset input Input DC voltage at RESET input pin –0.3 3.6 VSPI SPI interface Input DC voltage at SPI interface pin –0.3 3.6 VGPS_PPS GPS 1 pps input Input DC voltage at GPS_PPS input pin –0.3 3.6 VRho_ANT Antenna ruggedness Output RF load mismatch ruggedness at ANT1 10:1 VSWRTstg StorageTemperature –40 85 °C
Table 4: Absolute maximum ratingsThe product is not protected against overvoltage or reversed voltages. If necessary, voltage spikes
exceeding the power supply voltage specification, given in table above, must be limited to values withinthe specified boundaries by using appropriate protection devices.
3.2. Maximum ESD
Parameter Min Typical Max Unit Remarks
ESD sensitivity for all pinsexcept ANT1
1000 V Human Body Model according to JESD22-A114
ESD sensitivity for ANT1 1000 V Human Body Model according to JESD22-A114ESD immunity for ANT1 4000 V Contact Discharge according to IEC 61000-4-2
8000 V Air Discharge according to IEC 61000-4-2
Table 5: MaximumESD ratings
RAK833 card are Electrostatic Sensitive Devices and require special precautions whenhandling. See section 7.2 for ESD handling instructions.
3.3. Operating Conditions
Unless otherwise indicated, all operating condition specifications are at an ambient temperature of 25°C.
Operation beyond the operating conditions is not recommended and extendedexposure beyond them may affect device reliability.
3.3.1. Operating temperature range
Parameter Min. Typical Max. Unit Remarks
Normal operating temperature –20 +25 +65 °C Normal operating temperature range(fully functional and meet 3GPP specifications)
Extended operating temperature –40 +85 °C Extended operating temperature range(RF performance may be affected outside normaloperating range, though module is fully functional)
Table 6: Environmental conditions
3.3.2. Supply/power pins
Symbol Parameter Min. Typical Max. Unit
3.3Vaux Module supply operating input voltage14 3.00 3.30 3.60 V
Table 7: Input characteristics of Supply/Power pins
4. Mechanical specificationsRAK833 card are fully compliant to the 52-pin PCI Express Full-Mini Card Type F2 form factor,
with top-side and bottom-side keep-out areas, with 50.95 mm nominal length, 30 mm nominalwidth and all the other dimensions as defined by the PCI Express Mini Card ElectromechanicalSpecification [9] except for the card thickness (nominal value is 3.7 mm), as described in Figure 2.The weight of the RAK833 card is about 9.7 g.
6. Reference ApplicationFigure 4 shows the minimum application schematic of RAK833 card. Uses at lest 3.3V/1A
DC power, connect SPI interface or USB interface to the main processor. If use SPI interfaceSPDT_SEL should be tied to GND otherwise just let this pin open.