QUALITY MANUAL Document Number: QMB0001 Revision: 31 __________________________________________________________________________________________________ Page 1 of 95 TABLE OF CONTENTS Introduction/Scope....................................................................................................................... 4 Quality Policy .............................................................................................................................. 5 Corporation Organizational Chart ............................................................................................... 6 Site Organizational Chart ............................................................................................................ 7 Nampa Quality Organizational Chart .......................................................................................... 8 4.1 General Requirements ................................................................................................................ 9 4.2 Documentation Requirement ................................................................................................... 10 Documentation Requirement .............................................................................................. 10 Documentation Matrix ........................................................................................................ 11 4.2.2 Process Interaction ................................................................................................................... 12 Flowchart ............................................................................................................................ 12 Process Interaction .............................................................................................................. 14 Documentation Matrix ........................................................................................................ 16 4.2.3 Control of Documents .............................................................................................................. 17 Flowchart ............................................................................................................................ 17 Control of Documents ......................................................................................................... 19 Documentation Matrix ........................................................................................................ 20 4.2.4 Control of Records ................................................................................................................... 21 Flowchart ............................................................................................................................ 21 Control of Records .............................................................................................................. 22 Documentation Matrix ........................................................................................................ 23 5.1-5.6 Management ............................................................................................................................ 24 Flowchart ............................................................................................................................ 24 Management ........................................................................................................................ 25 Documentation Matrix ........................................................................................................ 27 6.1 Provision of Resources............................................................................................................. 28 Flowchart ............................................................................................................................ 28 Provision of Resources........................................................................................................ 29 Documentation Matrix ........................................................................................................ 30 6.2 Human Resources .................................................................................................................... 31 Flowchart ............................................................................................................................ 31 Human Resources ............................................................................................................... 32 Documentation Matrix ........................................................................................................ 33 6.3-6.4 Infrastructure and Work Environment ................................................................................... 34 Flowchart ............................................................................................................................ 34 Infrastructure and Work Environment ................................................................................ 35 Documentation Matrix ........................................................................................................ 36 7.1 Planning Product Realization .................................................................................................. 37 Flowchart ............................................................................................................................ 37
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QUALITY MANUAL
Document Number: QMB0001 Revision: 31
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TABLE OF CONTENTSIntroduction/Scope.......................................................................................................................4Quality Policy ..............................................................................................................................5Corporation Organizational Chart ...............................................................................................6Site Organizational Chart ............................................................................................................7Nampa Quality Organizational Chart ..........................................................................................8
4.1 General Requirements................................................................................................................94.2 Documentation Requirement ...................................................................................................10
Documentation Requirement ..............................................................................................10Documentation Matrix ........................................................................................................11
4.2.2 Process Interaction ...................................................................................................................12Flowchart ............................................................................................................................12Process Interaction ..............................................................................................................14Documentation Matrix ........................................................................................................16
4.2.3 Control of Documents..............................................................................................................17Flowchart ............................................................................................................................17Control of Documents.........................................................................................................19Documentation Matrix ........................................................................................................20
4.2.4 Control of Records ...................................................................................................................21Flowchart ............................................................................................................................21Control of Records ..............................................................................................................22Documentation Matrix ........................................................................................................23
5.1-5.6 Management ............................................................................................................................24Flowchart ............................................................................................................................24Management........................................................................................................................25Documentation Matrix ........................................................................................................27
6.1 Provision of Resources.............................................................................................................28Flowchart ............................................................................................................................28Provision of Resources........................................................................................................29Documentation Matrix ........................................................................................................30
6.2 Human Resources ....................................................................................................................31Flowchart ............................................................................................................................31Human Resources ...............................................................................................................32Documentation Matrix ........................................................................................................33
6.3-6.4 Infrastructure and Work Environment...................................................................................34Flowchart ............................................................................................................................34Infrastructure and Work Environment ................................................................................35Documentation Matrix ........................................................................................................36
7.1 Planning Product Realization..................................................................................................37Flowchart ............................................................................................................................37
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Planning Product Realization..............................................................................................38Documentation Matrix ........................................................................................................39
7.2 Customer Related Processes ...................................................................................................40Flowchart ............................................................................................................................40Customer Related Processes ...............................................................................................43Documentation Matrix ........................................................................................................44
7.3 Design And Development......................................................................................................45Flowchart ............................................................................................................................45Design And Development...................................................................................................46Documentation Matrix ........................................................................................................47
7.4 Purchasing..............................................................................................................................48Flowchart ............................................................................................................................48Purchasing...........................................................................................................................49Documentation Matrix ........................................................................................................50
7.5.1 Control of Production and Service Provision .........................................................................51Flowchart ............................................................................................................................51Control of Production and Service Provision .....................................................................52Documentation Matrix ........................................................................................................53
7.5.2 Validation of Processes for Production and Service Provision...............................................547.5.3 Identification and Traceability ..............................................................................................55
Flowchart ............................................................................................................................55Identification and Traceability ............................................................................................56Documentation Matrix ........................................................................................................57
7.5.4 Customer Property .................................................................................................................58Flowchart ............................................................................................................................58Customer Property ..............................................................................................................59Documentation Matrix ........................................................................................................60
7.5.5 Preservation of Product...........................................................................................................61Flowchart ............................................................................................................................61Preservation of Product.......................................................................................................62Documentation Matrix ........................................................................................................63
7.6 Control of Monitoring and Measuring Devices ......................................................................64Flowchart ............................................................................................................................64Control of Monitoring and Measuring Devices ..................................................................65Documentation Matrix ........................................................................................................66
8.1 Measurement, Analysis, and Improvement.............................................................................67Flowchart ............................................................................................................................67Measurement, Analysis, and Improvement.........................................................................68Documentation Matrix ........................................................................................................69
8.2.1 Customer Satisfaction .............................................................................................................70Flowchart ............................................................................................................................70
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Customer Satisfaction .........................................................................................................71Documentation Matrix ........................................................................................................72
8.2.2 Internal Quality Audits..........................................................................................................73Flowchart ............................................................................................................................73Internal Quality Audits........................................................................................................74Documentation Matrix ........................................................................................................75
8.2.3 Monitoring and Measuring of Processes..................................................................................76Monitoring and Measuring of Processes.............................................................................76Documentation Matrix ........................................................................................................77
8.2.4 Monitoring and Measuring of Product Requirements..............................................................78Flowchart ............................................................................................................................78Monitoring and Measuring of Product Requirements.........................................................79Documentation Matrix ........................................................................................................80
8.3 Control of Nonconforming Product ........................................................................................81Flowchart ............................................................................................................................81Control of Nonconforming Product ....................................................................................82Documentation Matrix ........................................................................................................83
8.4 Analysis of Data.......................................................................................................................84Flowchart ............................................................................................................................84Analysis of Data..................................................................................................................85Documentation Matrix ........................................................................................................86
8.5 Improvement ...........................................................................................................................87Flowchart ............................................................................................................................87Improvement .......................................................................................................................88Documentation Matrix ........................................................................................................90
Glossary .....................................................................................................................................91Quality Manual Review/Change Record ...................................................................................95
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Introduction/Scope
ZiLOG Nampa Manufacturing Facilities scope of operation is the design and manufacture of application specific standardprodusts (ASSP) integrated circuits.
The facility has one exclusion to the ISO9001:2000 standard, 7.5.2 as the plant produces and sells no services.
It is the intent of this manual to summarize the key elements of Nampa's quality system. Each section of the manual isorganized with a flowchart or outline of key points, where applicable, followed by a brief textual explanation and adocument matrix associating the applicable ISO section with Nampa operating procedures.
Detailed Nampa procedures are developed from corporate policy for use within the Nampa facilities.Nampa's Quality department is chartered to assure implementation of requirements and lead the quality system activity.
This activity includes assurance that ISO standards are correctly interpreted and followed.
In certain cases ZiLOG products may be manufactured by other facilities known as External Foundries. These organizationsare an integral part and extension of ZiLOG Corporation, which are controlled by ZiLOG specifications. Quality Assuranceat these facilities has dotted line responsibility to Nampa's Quality Systems Department Director.
In other cases, ZiLOG may choose to manufacture products for other facilities. This process is referred to as InternalFoundry. These products are processed per ZiLOG's standard practices and other customer specific requirements. TheZiLOG Nampa Quality Systems Department interfaces with the customer's Quality department to insure the customer'sexpectations are met. Process change notifications are communicated between the two Quality organizations.
While it is rarely done there are circumstances where outsourcing may be utilized, in these cases the company providing theservice to ZiLOG is qualified through our current equipment and process qualification specifications and added to the AVLas approved contracted services.
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Quality Policy
ZiLOG is committed to deliveringquality products to our customers
through systematic achievement ofestablished objectives based on a
Quality Management Systemthat drives continual improvement
throughout the organization.QCB1434
.
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Corporation Organizational Chart
FinanceFinance
CorporateMarketing
CorporateMarketing
SystemDevelopment
SystemDevelopment
HRHR
ITIT
StrategyStrategy
SupplyChain
SupplyChain Customer
Applications & Sales
CustomerApplications
& Sales
LegalLegal
CEOCEO
PresidentPresident
MCUsMCUs MPUsMPUs WirelessWirelessStandardProducts
StandardProducts
QUALITY MANUAL
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Site Organizational Chart
IT ControllerAccounting
Executive Assistant
DirectorQuality & Reliability
Sustaining Product Eng & Test
DirectorExternal Foundry &Device Intergration
DirectorInternal Foundry
Vice PresidentStandard Product Marketing
Operations
EVP & COOSupply Chain
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DirectorHR
DirectorExternal Foundry &
Process/Yield
Director OperationsSite Services
DirectorMOD II Engineering
Director Operations
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Nampa Quality Organizational C
Administrative Assistant
Incoming Quality Assessment
QUALITY ASSURANCENAMPA
DOCUMENT CONTROLNAMPA
DIRECTOR O& RELIA
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hart
RELIABILITYCORPORATE
QUALITY ASSURANCEZEPI
F QUALITYBILITY
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General Requirements 4.1
ZiLOG has established and maintained it's quality management system in accordance with ISO9001:2000 standard.Within this manual and it's documented processes, the organization
a) identifies the processes needed for the QMS and their application throughout the organization,b) determines the sequence and interaction of these processes,c) determines criteria and methods needed to ensure that both the operation and control of these processes areeffective,d) ensures the availability of resources and information necessary to support the operation and monitoring of theseprocesses,e) monitors, measures, and analyze the processes,f) implements actions necessary to achieve planned results and continual improvement of the processes.
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Documentation Requirement 4.2
FLOWCHART NA
Every employee plays an active role in implementing and evaluating the effectiveness of ZiLOG's quality system.
Documented Quality System procedures and instructions meet the requirements of all pertinent standards includingISO9001 and ISO14001.
The Quality Manual is reviewed, revised (when applicable) and approved annually. The Quality Systems department isresponsible for establishing, maintaining and implementation of the Quality Manual. The manual is available internallyonline and externally through the web page www.zilog.com Requests may also be addressed to the Quality Systemsdepartment.
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Documentation Requirement 4.2
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa ProceduresManagement Responsibility 4.1General Requirements 4.1 QCB1434, Quality Policy
QMB0001, Quality ManualQCB0402, Quality and EnvironmentalManagement SystemEMB0001, Environmental ManagementSystemQuality Objectives
Documentation Requirements 4.2, 4.2.1 QCB1434, Quality PolicyQMB0001, Quality ManualQCB0402, Quality and EnvironmentalManagement SystemEMB0001, Environmental ManagementSystemQuality Objectives
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Process Interaction 4.2.2
Flowchart
Planning identifies Process flow and assigns lot numbers towafer lots
Wafers are processed using established specifications
Equipment set up per specifications.Measuring and Test equipment calibrated to NIST.
In fab inspectionsaccomplished using applicable
specification requirements.Critical parameters measured.
Appropriate section of dispatch ticket completed at conclusionof each process
Critical data collected through a computerized tracking system.
Applicable logs are maintained throughout the processing
WorkEnvironment
Training-Audits-Management
ZiLOGDesign
Foundry Purchasing
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No
Process Interaction 4.2.2
FLOWCHART
Wafers are processed using establishedspecifications
Testing usingestablished procedures.
Critical parametersmonitored.
Critical data collected through a computerizedtracking system
Wafers Shipped
Wafers acceptable? Hold for Engineering or Qualitydisposition
Wafers acceptable?Hold for Engineering or Quality
disposition
Yes
Yes
No
CustomerSatisfaction
Improvement
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Process Interaction 4.2.2
Training, Management, and Audit interact throughout the entire process. Planning defines wafer starts, ROM issues andpulls, STR's and various special product expedites to meet customer demands. Production prepares wafers for starts basedon the schedule supplied by planning. Production accesses WFN1500 to determine the process flow and material type to beused based on engineering released process flows. After wafer starts have been defined a lot number is issued fortraceability through production and starting material is assigned. The wafer lots are released into the WIP tracking system.
Prior to wafer lots being processed the following are verified:a. Equipment set-up is performed by trained technicians - calibrations per NISTb. Lot number on wafer, wafer box and dispatch ticket agreec. Recipe on tool matches recipe on dispatch ticket
Purchasing buys the raw material needed and process wafers. ZiLOG Design and Foundry set the requirements needed forproduct realization. Certain work environment conditions are needed in order to achieve product realization.
When a lot has completed processing on a tool the following occurs:a. Visual and operational inspections occur throughout processingb. Outputs (thickness, CD measurements, etc) are logged into the WIP tracking system or on hard copy logs per
operation procedures.c. Production logs the wafer lot into the WIP tracking system and physically moves it to the next operation.
Wafer lots are put on hold and a Notice of Product Variance written for planning and/or engineering disposition whendiscrepancies with the lot, equipment or outputs are noted. Prior to being shipped foundry lots which have been releasedare verified or waiver issued and attached, by Quality.
Process Evaluations are performed on each lot. Lots that fail are placed on hold for engineering verification. Failing wafersare pulled from the lot and held for engineering to disposition. The wafers are either scrapped or the customer issues awaiver. Process and Yield engineering determines if improvements are needed for both customer satisfaction or to increaseyields.
The WIP tracking system contains the necessary data for processing product as defined by ZiLOG specifications. Systemcontains product, process, critical data collection and monitoring of information. The WIP system is capable of providingcritical limit checking as specified by ZiLOG documentation.
The WIP tracking system maintains information for processing product. If changes are made to the process flow a CN issubmitted by responsible person and routed through appropriate signature loop. Once the CN is approved, a date is affixedwhen the changes will become valid. A copy of the approved CN is distributed to the Dispatch Bench Managers who willactivate the changes on the desired date. Once changes have been made the Dispatch Bench Manager signs off the CN ascompleted and return it to DC.
Dispatch Bench supplies a ticket for each operation that lists out manufacturing steps and associated ZiLOG documents tofollow for each processing point. Once the process step is completed, the ticket is annotated with the data and whenapplicable information is entered in to the WIP Tracking system.
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Process Interaction 4.2.2
Production wafers are verified to ensure that the wafer quantity and lot numbers are accurate and correspond with WIPtracking. Wafers are logged into the WIP tracking system then routed to wafer pack for shipment preparation. Prior toshipment the packed jars and invoice information are verified for accuracy. In the event a discrepancy is found theshipment is put on hold and noted in the WIP tracking system. All discrepancies must be corrected prior to shipment. Allwafer shipments are invoiced and logged for traceability.
Customer Satisfaction is monitored both at process evaluation/shipment and after shipment with customer satisfactionsurvey's sent and summarized by quality. These results are discussed and evaluated at Quality and Environmental SystemsReview meetings. Actions to improve customer satisfaction are an output of the meeting.
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Process Interaction 4.2.2
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa ProceduresGeneral Requirements:Wafer Starts 4.1 SON4502, MOD II Planning Procedures
WFN1500, Released Products andStarting Material Assignment
Wafer Processing WFN0XXXX, Process FlowchartsWFNXXXX, Operational ProceduresWFNXXXX-SIDx, Operational StationInformation Documents
Equipment set up/Calibration QCB1200, Calibration ProceduresMPNXXXX, Maintenance ProceduresWFNXXXX, Operational ProceduresWFNXXXX-SIDx, Operational StationInformation Documents
Fab Inspections WFN4500, Develop InspectWFN4800, Final InspectWFNXXXX, Operational Procedures
Logging Procedures WFNXXXX, Operational ProceduresWFNXXXX-Formx, Operational (standalone) forms
Engineering Hold/Quality Disposition QCB1003, Notice of Product VarianceSON1005, Logging and Support
Process Evaluation WFN5000, Process Electrical ParametricTest LimitsWFN5001, HP4062 Process ElectricalEvaluation Procedure
Electronic tracking & critical datacollection
WIP tracking system
Wafer Shipment WFN7000, Wafer Pack and Transfer
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Copy the latest revisionor template from ZiDOC
Submit the documentand Change Notice for
Approval
Reject back to DC forcorrection/resolution
Initial/Date ChangeHistory page
Create or update thedocument. Obtainappropriate input.
Obtain and complete theNampa Change Notice
Return to Originator toobtain missing approvals
Submit approved documentand Change Notice to DC
Return rejected documentand Change Notice to
originator forcorrection/resubmission
Return to or resolve withOriginator
Receive CN withapprovals
Verify Approvals
Issue Control Numberand release date. Final
type and stage fororiginator proofing.
Correct document &resubmit for originator
proofing
Distribute,History, File
STOP
Reject AcceptAccept
Reject
Reject
Accept
Proof finaltyped
document
ReviewDocument/CN
Review CNfor format and
content
Control of Documents 4.2.3
FLOWCHART
DOCUMENT INITIATION/REVISION FLOWCHART FOR HARD COPY CN'S
Originator Approvers Document Control
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Control of Documents 4.2.3
FLOWCHART
DOCUMENT INITIATION/REVISION FLOWCHART FOR WORKFLOW Originator Approvers Document Control
Reject
Accept
Reject
Check out the latestrevision or template
from ZiDOC
Create or update thedocument. Obtainappropriate input.
Check in document toZiDOC:� Complete all
required DocInfofields
� Assure correctWorkflow hasbeen selected
ReviewDocument
Approved documents
Received at DCedit/approval step
Review documentper DCB0009
Work with originatorto resolve minor
issues
Provide instruction theoriginator in the
ZiDOC rejection box.
Publish document inZiDOC.
STOP
Provide instruction to theoriginator in the ZiDOC
rejection box.
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Control of Documents 4.2.3
Document Control maintains a system to control documents with established guidelines for initiation, modification,approval, distribution, removal, archival and traceability.
The originator generates a change notice when modifications are required to the current specification. The nature of thechange(s) and reason for change is written on the change notice form. The CN is presented at a CN Signing meeting orrouted by the originator for proper signature. No changes can be implemented without signature authorization.
The originator submits the change notice (CN) to Document Control for review of content and proper signature. AcceptedCN’s are assigned a control number and revision number for traceability. Rejected CN’s are returned to the originator forrework and/or completion.
Document release notification queries are made available in the ZiDOC library and final only hard copies are distributed tothe operational locations.
Document Control reviews and/or modifies procedures per the change notice.Current revisions of documents are available in the electronic management system, ZiDOC.
Document Control distributes the updated index and a copy of the new revision of the documents to the proper operationallocations, and electronically releases.
Obsolete documents and indexes are removed. The original document is maintained in ZiDOC and Change Notice historiesmaintained by Document Control for traceability.
Document archives are maintained per retention requirements at an off-site commercial storage facility. The informationtechnology group provides site-wide backups, disaster recovery, and virus protection. The procedure is maintained inZiDOC.
Reference Document Matrix for applicable procedures.
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Control of Documents 4.2.3
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa ProceduresControl of Documents 4.2.3 DCB0001 - Document Control
ProcedureDCB0009 - Change Notice ReviewProcedureDCB0020 - File Set-Up ProceduresDCB0031 - DC Review and Release ofDocuments into ZiDOCDCB0045 - Distribution ProceduresDCB0065 - DC or ZAN NumberedDocument ProcedureDCB0075 - Document Control UserGuideDCB0076 - Internal Foundry ZANNumber RequestSOB0011 - Off Site StorageSOB6032 – Site-wide Backups, DisasterRecovery, and Virus Protection - IdahoSOP0914 - Controlled DocumentsInformation Retention Schedule
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Control of Records 4.2.4
FLOWCHART
Department Records
Document Control
Files
Offsite Storage
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Control of Records 4.2.4
Individual departments maintain, file and store quality reports/records.
Records are generated in a clear and legible manner.
Quality records are accessible for reference in accordance to record retention requirements .
Departments maintaining records include:
a. Document Controlb. Quality Systemsc. Purchasingd. Planninge. Trainingf. Manufacturingg. Receiving/IQA,DMSR, Supplier Test, C of C's, Temperature Monitors, MRB minutes, Thermocouple calibration.
Reports are stored by specific departments or at an off site commercial storage facility in compliance with retentionrequirements.
Reference Document Matrix for appropriate procedures.
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Control of Records 4.2.4
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa ProceduresQuality Records 4.2.4 SOP0914, Controlled Documents
Information Retention ScheduleSON1005, Logging and SupportSOB0011, Off Site Document Storage
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INPUT
Top ManagementFeedback
Customer Feedback Site EnvironmentalSystems Feedback
Quality Objectives Communications toSite
Action Items
Site Performance
Quality &EnvironmentalSystems Review
OUTPUT
Site Quality SystemsFeedback
Management 5.1 thru 5.6
Flowchart
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Management 5.1 thru 5.6
Quality Systems department provides guidance and recommendations to top management staff in defining, developing,implementing and maintaining a Quality Management System.
Top management at ZiLOG-Nampa is defined as:
a. Top level fabrication operation position (typically a Director title)b. Top level site Human Resources position (typically a Director title)c. Top level fabrication engineering position (typically a Director title)d. Top Product-Test Engineering position (typically a Director title)e. Top level finance position (typically a Director title)f. Top level facility position (typically a Director title)g. Top level quality position (typically a Director title)
The Top Level Management Group is responsible for and represents all functional groups at the Nampa site
Top management is responsible for providing evidence of its commitment to the development and implementation of thequality management system and continually improving its effectiveness by:
a. Communicating to the organization the importance of meeting customer as well as statutory and regulatoryrequirements
b. Establishing the quality policyc. Ensuring that quality objectives are establishedd. Conducting management reviewse. Ensuring the availability of resources
Top management shall ensure that customer requirements are determined and are met with the aim of enhancing customersatisfaction
Top management shall ensure that the quality policy:
a. Is appropriate to the purpose of the organizationb. Includes a commitment to comply with requirements and continually improve the effectiveness of the quality
management systemc. Provides a framework for establishing and reviewing quality objectivesd. Is communicated and understood within the organizatione. Is reviewed for continuing suitability
Top management shall ensure that quality objectives, including those needed to meet requirements for product areestablished at relevant functions and levels within the organization. The quality objectives shall be measurable andconsistent with the quality policy
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Management 5.1 thru 5.6
Top management shall ensure that:
a. The planning of the quality management system is carried out so that the organization establishes, documentsand maintains a quality management system and continually improves its effectiveness in accordance with therequirements of this International Standard
b. Meets the requirements given in the quality objectivesc. Ensures that the integrity of the quality management system is maintained when changes to the quality
management system are planned and implemented
Top management shall ensure that the responsibilities and authorities are defined, communicated within the organization
Top management shall appoint a member of management who, irrespective of other responsibilities, shall haveresponsibility and authority that includes:
a. Ensuring that processes needed for the quality management system are established, implement andmaintained, reporting to top management on the performance of the quality management system and anyneed for improvement, and ensuring the promotion of awareness of customer requirements throughout theorganization
b. The responsibility of a management representative can include liaison with external parties on matters relatingto the quality management system
Top management shall ensure that appropriate communication processes are established within the organization and thatcommunication takes place regarding the effectiveness of the quality management system
Top management shall review the organization’s quality and environmental management systems, at defined intervals toensure its continuing suitability, adequacy and effectiveness. The review will be held in accordance to the QCB0402requirements.
Reference Document Matrix for appropriate procedures.See Section 7.2 for Customer Requirements
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Management 5.1 thru 5.6
DOCUMENTATION MATRIX
Functional Elements IS09001 Nampa ProceduresManagement Commitment 5.1 QCB0402 Quality and Environmental
Management SystemCustomer Focus 5.2 SOB6031Customer Interaction and
SatisfactionEnvironmental Management System ISO14001 EMB0001 Environmental Management
PolicyQuality Policy 5.3 QCB1434 Nampa Quality PolicyPlanning-Quality Objectives, QualityManagement system planning
5.4 QCB0402 Quality and EnvironmentalManagement System
Responsibility, authority andcommunication – Managementrepresentative, Internal communications
5.5 QCB0402 Quality and EnvironmentalManagement System
Management Review – Input, Output,Agenda
5.6 QCB0402 Quality and EnvironmentalManagement System
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Department IdentifiesResource/Infrastructure Need
Management
CustomerSatisfaction Needs
Quality and Environmental Systems Review
Inputs
Action Items
Output
Provision of Resources 6.1
Flowchart
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Provision of Resources 6.1
The organization shall determine and provide the resources needed :a. To implement and maintain the quality management system and continually improve its effectivenessb. To enhance customer satisfaction by meeting customer requirements
Personnel performing work affecting product quality shall be competent on the basis of appropriate education, training,skills and experience.
The organization shall:a. Determine the necessary competence for personnel performing work affecting product qualityb. provide training or take other actions to satisfy these needsc. evaluate the effectiveness of the actions taked. Ensure that its personnel are aware of the relevance and importance of their activities and how they contribute
to the achievement of it's quality objectives.e. Maintain appropriate records of education, training, skills, and experience.
The organization shall determine, provide and maintain the infrastructure needed to achieve conformity to productrequirements. Infrastructure includes, as applicable:
a. Buildings, workspace and associated utilitiesb. Process equipment (both hardware and software)c. Supporting services (such as transport or communication)
The organization shall determine and manage the work environment needed to achieve conformity to product requirements.
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Provision of Resources 6.1
DOCUMENTATION MATRIX
Functional Elements IS09001 Nampa ProceduresProvision of Resources 6.1 QCB0402 Quality and
Environmental ManagementSystem
Human ResourcesCompetence, Awareness and TrainingInfrastructure
6.26.2.2.
6.3
HRN1000HRN2000HRN3000
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Human Resources 6.2
Flowchart
Organizational Need IdentifiedManager Initiates Personnel Requisition
Where app., job description andobjectives are generated and attached to
requisition.
Recruitment procedures performed byHuman Resources.
Qualified candidates are proposed to therequestor
Job interviews are handled through therequesting manager
Individual(s) are trained according toestablished procedures
Training needs are identified based on theskill and knowledge of candidate chosen
Where applicable, certification testing forDL and IDL is administered by the
Training Department
Academic reimbursement is offered foremployee’s wanting to develop or
enhance their careers.
Upon passing and signing effectiveness oftraining statement, the tested DL or IDLindividual is certified to run operation
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Human Resources 6.2
ZiLOG's greatest asset is its people; ZiLOG provides opportunities to learn new skills and to become more knowledgeablein the company's technology.
The responsibility for training is with the Human Resource Department. This includes recruiting, hiring, training,performance, and personnel records.
Recruiting is based on organizational needs. Management initiates a personnel requisition based on job requirements.
Candidates are selected using resume reviews and personal interviews. They are qualified on the basis of appropriateeducation, training and/or experience. Offer letters are written to the chosen individuals.
Upon acceptance from the chosen candidate, training needs are identified and provided. Where applicable, certificationtesting is administered for DL and IDL employees by the training department. After passing the certification test, andsigning the Effectiveness of Training Statement on the Audit the DL or IDL individuals are certified to run the operation.
Personnel and Training files are ZiLOG's records of education, training and personal growth.Personnel employed in the technical staff will be provided with necessary continuing education and training and have anawareness of ZiLOG's quality system.
Upon Request The Training Department will provide a list of personal development courses.
The company is committed to the recruitment, training, and retention of its employees in order to achieve and maintain thequality standards and objectives of the company.
Reference Document Matrix for appropriate procedures.
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Human Resources 6.2
DOCUMENTATION MATRIX
FunctionalElements
ISO9001 Nampa Procedures
Training 6.2 HRN1000 Technician Training andCertificationHRN2000 Exempt/Non-Exempt IDLTraining and CertificationHRN3000 All Employee Training andCertification
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Infrastructure and Work Environment 6.3 thru 6.4
Flowchart
During Quality and EnvironmentalManagement Review meeting, work
environment and resources, includinginfrastructure are reviewed to determine if
additional are required.
Changes to work environment and /orinfrastructure item added to action items for
Management review meeting.
After item has been implemented, item ismarked as completed on action items for
Management review meeting.
Appropriate specifications for operation andmaintenance are created and approved
Are changes toenvironment/or
additionalinfrastructure
required?
No
Yes
IssueClose
IssueClosed
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Infrastructure and Work Environment 6.3 thru 6.4
To determine the organizations required infrastructure, (including buildings, workspace, associated utilities, processequipment and supporting services) discussions are held in management review as specified in Figure 1 of QCB0402, ISOReview Agenda Items.
To determine if the organizations work environment is adequate to achieve conformity to product requirements,discussions are held in management review as specified in Figure 1 of QCB0402, ISO Review Agenda Items.
To ensure that the organization provides the required infrastructure and/or modifies the work environment as determined inmanagement review sessions, action items are documented in the Action Items from ISO Management Review Meeting.
To ensure that the organization maintains the required infrastructure, maintenance procedures have been documented forkey portions of infrastructure.
To ensure that the organization maintains the required work environment, maintenance procedures have been documentedfor key portions of the work environment.
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Infrastructure and Work Environment 6.3 thru 6.4
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsInfrastructure and WorkEnvironment
6.3/6.4 QCB0402 Quality and EnvironmentalManagement SystemQCB0218 Quality Monitoring Procedure –Deionized WaterQCN0221 Cleanroom Controlled EnvironmentMonitoring, M2QCB1200 Calibration ProcedureSOB0020 Operation and Monitoring of theDeionized Water SystemSOB1080 Wastewater OperationsSOB3006 Facility RecordsSOB3550 Equipment Qualification on ReleasedProcessesSOB5000 Process/Material Change ProceduresSON1010 Clean Room OperationsMPNXXX Equipment Maintenance SpecsWFNXXXX Equipment Operation Specs
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Planning Product Realization 7.1
Flowchart
ZiLOG ProductRequirements
Foundry CustomerRequirements
Quality Objectives
Process EvaluationLimits and Records
Fabrication/ LimitsMonitoring/Records
Shipment toCustomer
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Planning Product Realization 7.1
ZiLOG plans and develops processes for product realization in the same way it plans it's QMS processes. ZiLOGestablishes quality objectives yearly and monitors them on an ongoing basis with postings and communications occurring atleast quarterly. These objectives may be tied to customer needs by way of trying to meet a difficult process requirement.
Product requirements are set before production begins, either by ZiLOG's internal design process or by the customer.These are monitored closely throughout manufacture. The product requirements determine which process the part will bemanufactured on for each customer. Records of the monitoring are tracked through a computer system known asWorkstream and various logs/records throughout the fabrication area. Before product ships from Nampa to it's customers,they must meet the process evaluation parameters. Process evaluation tests each specified known parameter needed for thatproduct. This verifies the product and serves as the final test in Nampa.These files can be accessed by our customers and are either downloaded electronically for customers use or printed and sentto the customer with the outgoing product.
These requirements are more closely detailed in the following section 7 of this manual.
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Planning Product Realization 7.1
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsPlanning of Product Realization 7.1 SON4503-Planning Procedures for
Manufacturing Partners (MP)SOB5020-Foundry Process TechnologyDevelopment ProcedureSOB5021-Customer Owned Product –Contracted Processing Order ControlProcedureSOP0904-Standard Process and Design RuleDesignation SystemWFN5000 - Process Electrical ParametricTest LimitsSOP0933-Oracle Item Master QA/DocumentControl ChecklistDCB0076-Internal Foundry DocumentControl ProcedureQCB2002-Final Inspection for InternalFoundryQCB1003-Notice of Product VarianceQCB1004-Incoming Inspection ProcedureWFNXXXX-Processing InstructionsSOB0012-Shipping ProcedureMFGXXXX-Product Plate 1's
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Customer Related Processes 7.2
FlowchartFoundry Products Only
YES
YES
Customer NotifiesZiLOG Of New
Device andRequirements
Device Starts
Planning NotifiesPricing of New Device
Price
Corporate DCGenerates Oracle Item
Master
Planning GeneratesPlate 1
Planning CompletesChecklist andEngineering to
Establish Process
Customer/EngInitiates Reticle
Eng. Approves ReticleGeneration and
Notifies Planning
ExistingProcess?
NO
Corporate DC OrderEnables the New
Device
PO/Releasein place?
NO Planning Reject Backto Customer for POupdate or Generation
Reticlesonline? Hold Wafer Starts and
Notify Customer
Reticles Received andReleased to Production
NO
Final Review
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FlowchartAll ProductsF=FoundryZ=ZiLOG
Start ScheduleGenerated
F Z
Planning Requests/ReceivesOrder Entry
F
WAFERS AREPROCESSED
THROUGH THEMODULE
F Z
NOPV Lots and Requestsfor Waivers Reported
Electronically to Qualityfor Approval
F
Quality Approves andReleases Lots
F
Planning Schedules/ Re-Schedules and Releases
Backlog in OracleF
Planning Sets PremiumAttribute for Pricing
(if Applicable)
F
PEVAL and OutgoingInsp. (if applicable)
F
Electronic NOPV CheckF
Electronic C of C/Waiveris Generated
F
Ship to ZSHIPF
Unapproved Material Haltsand Waits for Approval
F
Ship to FSHIPZ
ScrapF
FGIDAF
Ship to Subcon'sZ
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FlowchartFoundry Products Only
FGIDA
TechniciansDeliver Lots toShipping with a
Copy ofInspections
Sheet (if app)
Shipping PrintsC of C or Waiver
From NampaMaterials GroupShared OutlookAccount. Sends1 with Lot and
One to QS
Oracle Auto picksor Traffic DispatchRequest Pick Slip
by Device andPremium (if app)
OracleGenerates the
Pack Slip
Shipping PacksLots with C ofC/ Waiver and
InspectionSheet (if app)
Pre-Alert toCustomer
Ship off Dock!
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Customer Related Processes 7.2
ZiLOG, Nampa acknowledges the existence of external customers or end users of ZiLOG's products. ZiLOG CorporateHeadquarters deals with all communication and correspondence with end user customers. All contracts (orders,requirements, etc.) pertaining to ZiLOG designed and manufactured products are handled through direct communicationwith our internal customer, ZiLOG Corporate Headquarters.
Additionally, Foundries interact and notify Process Engineering of new devices needed and their requirements. If theprocess is developed, Process Engineering notifies Planning and approves reticle generation. If not, the process isestablished Planning completes the checklist and generates the Plate 1.
Document Control in Corporate is responsible to generate the Oracle Item Master. Nampa Planning is responsible tonotify pricing at corporate of the new device price. At this time corporate document control order enables the device inOracle Item Master.
The next step is the Purchase order. If it has not been generated and agreed upon at this time planning will request to thecustomer that this be completed before proceeding. When the purchase order is in place planning submits the release tocustomer service group. When the order is entered planning schedules and releases the order in Oracle. When foundrymasks are in house, planning requests the starts from Corporate planning. Upon receipt of the OP07 from corporateplanning the Nampa planning group generates the module starts schedule. The OPO7 Report contains the quantity andproduct type(s) being requested Prior to wafers being started, conduct a final review to insure all customer requirements arebeing met and that ZiLOG has made all necessary preparations.
As wafers are processed through the fabrication area, any lots receiving Notice of Product Variance are electronicallyreported to Quality via a morning report that is automatically generated in workstream. This is sent via email by the system.Quality approves or disapproves the NOPV by releasing the halts in workstream. Unapproved wafers do not have the haltsremoved and thus are prevented from shipment from fab. While wafers are being processed throughout the module,planning schedules and releases the backlog in Oracle and sets the premium attribute for any material ran for a premiumprice.
Wafers will go through Peval and if applicable to the customer, an outgoing inspection and an electronic NOPV checkbefore leaving fab. Any material not yet approved by Quality will stop at this point and await disposition, which mayinclude scrap. Technicians do a 2COC function in workstream, which generates an electronic Certificate of Conformance(C of C), or waiver. This is automatically mailed out to a mailing list, which includes Shipping, Planning and the QualitySystems department. The technician completes the ship function for all products.
Foundry wafers electronically move into Finished Goods Idaho (FGIDA) and the technician delivers all lots to Shippingwith a copy of the outgoing inspection sheet (if applicable). For foundry wafers shipping will print C of C or waiver.Oracle autopicks or traffic dispatch requests a pick slip by device. Upon confirmation Oracle generates the pack slip. If alldocumentation is correct, lots are approved to ship and Shipping packs lots with C of C or Waiver and any requiredInspection sheet.
Lots with documentation issues are reported to the appropriate group for resolution. Shipping sends a pre-alert to thecustomer and ships the wafers.
See also Section 5.1 through 6 for Customer Communication, and 8.5 Continual Improvement/Corrective Actions.
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Customer Related Processes 7.2
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa ProceduresCustomer Related Processes 7.2 DCB0076 Internal Foundry Document Control
ProcedureWFNXXXX Processing InstructionsWFN0055 STR Operating ProcedureMFGXXXX Plate 1 as applicableWFN1500 Released Products and Starting MaterialAssignmentWFN5000 PEVALWFN7000 Wafer Pack and ShipSOB0012 ShippingSON4503 Planning Procedures for ManufacturingPartners (MP)SON4501 MOD II Planning OperationsSON4502 Mod II Planning ProceduresProcedureSOP0933 Oracle Item Master QA/Document ControlChecklistQCB1003 Notice of Product VarianceQCB1004 Incoming Inspection ProcedureQCB2002 Final Wafer Inspection for InternalFoundryQCB5000 C of C Generation for ManufacturingPartner Shipments
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Design And Development 7.3
Flowchart
ProductConcept
MarketAnalysi
s
EngAnalysis
ProductBrief
SystemArchSpec
FunctDesignSpec
S/WFunctSpec
Definition &Feasibility
Spec &Planning
Libraries
ToolsIP
DesignImplementation
DesignVerification
Plan Plate1 & 2
RomPicmt
PG
FactoryRequirements
Tooling
WaferFab
MICSOC
Probe
Concept
Design
TestPatts
Test ProgDevelopment
Assm
SiliconValidation
Validation
Samples Characterization
Qualification
Release
Release
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Design And Development 7.3
The product design process consists of five distinct stages: Concept/definition, Planning, Design, Verification andValidation.
The cycle begins with the Concept/definition phase that culminates in a Product Concept Review to decide if the ideashould be investigated. If approved, the Definition & Feasibility phase is conducted to complete an assessment of theopportunity and to produce a Product Proposal Document. Then, the Product Proposal Review is held to decide if thecompany should make the initial investment in a development program. These first two phases are marketing-driven(MRA), and engineering contributes an Engineering Requirements Analysis (ERA), as feedback to marketing on thetechnical feasibility and to provide initial development cost projections
During the planning phase, the complete solution to the product requirements identified in the Definition & Feasibilityphase is described in order that the entire development team clearly understands the program objectives. The intent is toensure that ample planning work is completed before the design implementation begins. This should include the analysiswork to fully specify what the final product will do, without constraining how it will do it. The Development Plan is to bepresented at the Development Plan Review meeting (DPR) at the close of the Specification & Planning phase. This eventshould be considered the “Commitment Phase Review” in that it is the opportunity for the development team to setexecution expectations for the rest of the program. These objectives are the basis for the Project Evaluation Report thatassesses project metrics at the end of the Validation phase.
The design phase initially extends the specifications into detailed implementation plans, and then executes those plans.During the Design phase, documentation is produced on how the design is implemented. The Final Design Review (FDR) isa special review that serves to confirm the completion of all intended implementation and verification steps of the Designphase. For an IC product, final approval of the FDR is the gate for Pattern Generation (PG) Release to produce masktooling and start the first engineering wafer lots. Release documentation and approval signatures are required.
The validation phase incorporates all activities involved in the confirmation of engineering prototypes. This commonlyincludes functional, performance, compatibility and compliance testing. Production test programs, such as Production Sortand Final Test ATE programs are debugged and completed during this phase in preparation for Manufacturing Release. Inaddition to the manufacturing test programs, various system-level validations may be performed and evaluation boards aredebugged using the prototypes. Based on the overall testing results, a determination is made whether the prototypes areeligible for Engineering Release. For IC products, the Product Confirmation-IC Report (PCC) is completed during theValidation phase to summarize the product evaluation and to assess the development metrics of the project. Manufacturingrelease is approved at this time.
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Design And Development 7.3
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsDesign and Development Planning 7.3.1 CPD0005 Product Life Cycle – Product
Development and Release ProcessDPRXXXX
Design and Development Inputs 7.3.2 MRAXXXXERAXXXX
Design and Development Outputs 7.3.3 PCDXXXX
Design and Development Review 7.3.4 DPCXXXX
Design and Development Verification 7.3.5 PCCXXXXDesign and Development Validation 7.3.6 PCCXXXXControl of Design and Development Changes 7.3.7 SOP0901 Procedure for Submitting a Change
Notice Form
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Purchasing 7.4
Flowchart
Yes
Purchasing Material/Service Needs areIdentified
Specific Requirements are identified
Purchase Requisition (PR) is completedand submitted to the PurchasingDepartment with DocumentedRequirements and Approvals
Material/Service Contract is awardedand item is delivered, or service is
performed
Material is released to Stores or serviceis performed
Vendor is selected and contractnegotiated and agreed upon by both
parties
Incoming Quality Assessment verifiesdocuments for materials designated asZ1 for conformance to requirements
When no qualified vendor exists, avendor qualification is performed
Approved VendorsList consulted, if
applicable
Material that fails tomeet requirements isheld for disposition
No
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Purchasing 7.4
Purchase requisitions with specific requirements are completed by the requestor and submitted to the PurchasingDepartment for review. The Purchasing Department ensures the requirements on the requisition conforms to applicablepurchasing agreements and/or material specifications.
The purchasing requisition must clearly describe the product/service, including:
a. the type, class, style, grade or other precise informationb. the title or other positive identification, applicable specifications, drawings, scope of work and/or relevant
technical information,c. and delivery date
An Approved Vendors List (AVL) is referenced by the Purchasing Department for selection of a qualified vendor(s).Approved Vendors List is applicable only for Z1 material purchases, which have an impact on production and theenvironment.
Vendor Qualification is performed when a vendor is not listed on the Approved Vendors List. Selection and approval ofvendors are based on the ability to meet quality, delivery, service and cost requirements. The Requestor, Purchasing, andQuality Systems perform vendor Qualification. Key vendor performance is monitored by the Material Review Board(MRB) using the Supplier Rating System.
Vendor disqualification is performed when a vendor has a severe or repeated quality problem. The documenteddisqualification process shall be the responsibility of the Material Review BoardDisqualified vendors shall be removed from the AVL.
A qualified vendor is selected. Upon arrival of Z1 material from the vendor, Incoming Quality Assessment (IQA) confirmsthat the purchased product meets specific requirements defined in the procurement specification by reviewing theCertificate of Conformance.
Accepted material is released to stores inventory. Disposition of nonconforming material is documented on a DiscrepantMaterial Service Report (DMSR) which is submitted to the MRB for approval. If necessary, the vendor is formallycontacted for return of material and for a corrective action response. Corrective actions are tracked to closure anddocumented. The vendor's response and timeliness in closing the corrective action is part of the Supplier Rating System.
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Purchasing 7.4
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsPurchasing 7.4 SOB2103 Purchasing and Contract Review
SOB5018 Equipment Selection, Procurement and InstallationOversight ProcedureSOB0013 Receiving ProcedureSOB0050 Supplier Rating SystemQCB1004 Incoming Inspection ProcedureAVL0006 Nampa Materials ListAVL0005 Nampa Contractor ListQCB1008 Vendor Qualification ProcedureMSB6020 Procurement Specification Approval by SuppliersSOP0828 Procedure for Procurement Card Holders
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Control of Production and Service Provision 7.5.1
Flowchart
PRODUCTION AREA
Reference: 7.1 and 2 for more flow information
DI Water
Monitoring andmeasuring devices
Equipment andassociated preventive
maintenance
Electronic WorkInstructions
Environmental Controls
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Control of Production and Service Provision 7.5.1
The device is identified with the proper flow and recorded on the Dispatch ticket for processing through the manufacturinglocations. The dispatch ticket references the operational specifications for Work instructions, data collection and requireddocumentation.
The one step card and bare silicon wafers are issued to wafer manufacturing for processing under controlled conditions.
Controlled conditions shall include the following:
a. Environmental controls for humidity and particles,b. Working environment,c. Use of suitable and approved production equipment, compliant to NIST reference standards when applicable,d. Approved process,e. Employee training and awareness,f. Documented work instructions defining the manner of production and accept/reject criteria,g. Monitoring and control of process and product during manufacturing,h. Preventive maintenance of equipmenti. Monitoring DI water
Operational specifications define equipment set-ups, required data collection and specific locations for inspections. Theinspections have defined accept/reject criteria. Accepted wafers are released from one manufacturing operation to the nextwith the following documentation completed:
a. Each location on the dispatch ticket must have the appropriate information,
b. Critical data is entered into the work in-process (WIP) tracking system, with an operational move in/out entries,
c. Applicable manufacturing logs
Rejected wafers are segregated and held for Engineering disposition at the rejected locations. In cases of ManufacturingPartner's the wafers go on Hold for Quality.The accepted wafers from manufacturing are transferred to wafer sort for circuit testing.Wafer probe continues to track and log critical data.The accepted product is released to controlled inventory for shipment. Rejected wafers at wafer probe are held in Eng. Holdfor Engineering evaluation
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Control of Production and Service Provision 7.5.1
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsControl of Production and ServiceProvision
7.5.1 MPNXXXX-Maintenance SpecsQCB0218-Quality Monitoring Procedure –Deionized WaterQCN0221 Cleanroom ControlledEnvironment Monitoring M2SOB0020- Operation and Monitoring ofthe Deionized Water SystemSON1010-Cleanroom OperationsWFNXXXX-Process Flowcharts/SpecsWFN2014-Statistical Process Control
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Validation of Processes for Production and Service Provision 7.5.2
EXCLUDED
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Identification and Traceability 7.5.3
Flowchart
Nampa Planning is notified ofproduct and quantity required to fill
order
Fabrication module identifies thewafers by lot number, device and
layer
Planning informs Manufacturing ofrequired quantity of wafers to
process
Lot location is monitored through aWIP tracking system
Accepted product released fromwafer fab maintains product type
and lot identification
Lots are shipped only afteracceptance of identification and
traceability
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Identification and Traceability 7.5.3
Corporate Planning and/or Director of Operations or the Manufacturing Partner notifies Nampa Planning of the producttype and the quantity of die required to fill the customer order. Nampa Planning uses the MFG, with product type and dieidentification, to inform manufacturing of the required quantity of wafers to process.
Nampa Planning or designated manufacturing personnel identifies the wafers by assigning lot numbers and issuing properidentification paperwork. Manufacturing scribes each wafer and processes each lot per device flow. Test programs areidentified by the die number, revision, and program number. The location of the lot can be tracked by WIP reports, andprocess logs.
Traceability is maintained throughout the entire process by utilizing the Workstream system. Workstream and the dispatchticket track each lot at their exact location, and it's status with respect to measuring and monitoring. Unique identities ofeach lot include the specific measurements, which are recorded throughout the process.
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Identification and Traceability 7.5.3
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsIdentification and Traceability 7.5.3 WFN1500 Released Product and Starting Material Assignment
SON1005 Logging and SupportSON4501 MOD II Planning OperationsSON4502 MOD II Planning ProceduresSOB0015 Dispatch Bench Procedures
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Customer Property 7.5.4
Flowchart
Customer Property
Intellectual Property
Controlled InventorySystem
Materials
Document Control
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Customer Property 7.5.4
ZiLOG exercises great care with customer property while under our control. Materials are identified, verified, protected,and safeguarded by following documented procedures. Customer property that is lost, damaged, or otherwise unsuitable foruse is reported to the customer. Records of such transactions are maintained.
Customer intellectual property is carefully guarded by being entered into ZiLOG’s Document Control System. Intellectualproperty includes processing flow, pricing and communications from the customer.
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Customer Property 7.5.4
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsCustomer Property 7.5.4 SOB5021-Customer Owned Product -
Contracted Processing Order ControlProcedureDCB0076-Internal Foundry DocumentControl ProcedureQCB1004-Incoming Inspection ProcedureSOB0013-Receiving Procedure
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Preservation of Product 7.5.5
Flowchart
Materials / Supplies are handled,stored and preserved to prevent
damage or deterioration
Storage areas provided formaterial pending use or delivery
and monitored for shelf life
Only authorized personnel issuematerials from restricted areas
Storage requirements areestablished and ensure
segregation by location ofprocessing
Unacceptable raw material isrejected and returned to the
supplier
Inline wafer handling isestablished by specification
requirements
Product destined for shipping ispackaged to requirements and
provided protection duringdelivery
Raw material isreleased for
production use?
No
Yes
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Preservation of Product 7.5.5
The product is handled, stored, and packaged, in such a way to prevent damage or deterioration through all processesincluding delivery of the product to the final destination.
Material requiring inspection is released/accepted at Incoming Quality Assessment (IQA) and can then be released forproduction use. The material pending use is stored in a controlled area and shelf life monitored to prevent damageThe rejected material is identified and labeled for disposition.
In-line wafer handling procedures include established methods to prevent damage and contamination. Processinginspections prevent damaged wafers from being released. Wafer damage is prevented by the use of an automatic transfermachine or a slide transfer machine. Vacuum wand or tweezers may be used when applicable. Manufacturing Partner'sproduct is protected in the same manner.
All mid-process ROM devices are processed up to a rom designation point and held in a "ROM Bank", which is adesignated controlled area located in the fab, until Corporate advises specific ROM code and quantity to be processed. Theprocessing environment is monitored to control the temperature/humidity and clean room requirements.
Storage requirements include:a) part numberb) lot numberc) segregation by device
Authorized shipping personnel verify all quantities of items to be shipped against the shipping authorization. All items arepackaged to prevent damage in transit.
Reference Document Matrix for appropriate procedures.
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Preservation of Product 7.5.5
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsPreservation of Product 7.5.5 QCB1004-Incoming Inspection Procedures
SOB0012-Shipping ProcedureSOB0013-Receiving ProcedureSOB0166-Direct and Indirect MaterialInventorySON1010-Cleanroom OperationsWFN1150-Wafer HandlingWFN1500-Released Products & StartingMaterial AssignmentWFN7000-Wafer Pack and Transfer
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Control of Monitoring and Measuring Devices 7.6
Flowchart
Calibration procedures areestablished
Quality Systems maintains thecalibration recall system
Calibration results are forwarded toQS for record maintenance
Where appropriate, affixed stickersand labels are used to maintain
integrity of calibrations
Equipment with expired calibrationdates are appropriately identified as
not useable
Quality ensures equipmenttraceability to NIST
Calibration status is attached toequipment and entered electronically
into Workstream
Equipment found ‘out-of-tolerance’
Master listing is maintained in theWorkstream system
Becomes suspect for increasedcalibration and corrective action
Equipment is calibrated orverified to specification
requirements
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Control of Monitoring and Measuring Devices 7.6
The calibration procedure defines the calibration monitoring of tools and test equipment used in manufacture and testing ofproducts. This applies to areas using controlled tools, gauges and electrical test equipment.
The Quality Systems Organization is responsible for maintaining the calibration records and the administration of acalibration recall system. The records include: an electronic equipment list, calibration status, certifications and discrepancyreports.
The Quality Systems and Service Organization is responsible for all test and gauging equipment conforming to applicableequipment manufacturer's specifications and providing traceability to National Institute of Standards and Technology(NIST).
Calibration specifications for the individual equipment are used in calibration of inspection and test equipment. Calibrationsare performed within a controlled environment. IM&TE documentation is verified.
If a piece of test equipment is found to be out-of-tolerance, it is recorded in the calibration records. Corrective action will beimplemented, documented and calibration frequency increased if deemed necessary.
Calibration labels, with date of calibration and due date, are placed on every piece of calibrated equipment. Whennecessary, a calibration protective label is placed on the exterior of the equipment in locations that would void thecalibration label if adjustments were made. Red tags are placed on all equipment that is still housed online if it has anexpired calibration.
Reference Document Matrix for appropriate procedures.
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Control of Monitoring and Measuring Devices 7.6
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsControl of Monitoring and MeasuringDevices
7.6 QCB1200 Calibration ProceduresMPNXXXX- Maintenance SpecsQCB1431 ZiLOG Nampa 8DProcedure
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Measurement, Analysis, and Improvement 8.1
Flowchart
Periodic review of process capabilities forcontinual improvement
No
Dispositionaccording to
OCAP
Product or equipment qualifications aremeasured or inspected
Applicable parameters are plotted on SPCcharts and SPC point(s) are calculated
Is there an SPCviolation? Yes
Perform/Follow(OCAP)Out of Control
Action PlanOr Troubleshooting
Guide
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Measurement, Analysis, and Improvement 8.1
The Statistical Process Control (SPC) specification defines the requirements that all control charts must satisfy.
Parameters that are maintained on SPC charts are determined by engineering based on key product performance variables.Parameters may be product measurements or inspections, or equipment measurables critical to consistent processingperformance.
Parameters are plotted on the appropriate SPC chart, and an SPC point value is determined.
If an SPC violation occurs, the corrective action plan (OCAP or equivalent) is performed. Individual operational specs willdefine the corrective action plan. The plan directs the disposition of the product or process, and the actions needed, if any,to remedy the SPC violation.
Critical parameters are reviewed on a regular basis, and their process capabilities are calculated by engineering. Aparameter with low process capability may be assigned a corrective action plan to improve its process performance.
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Measurement, Analysis and Improvement 8.1
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsMeasurement, Analysis, andImprovement
8 WFN2014 Statistical ProcessControlWFNXXXX Operation Specs
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Customer Satisfaction 8.2.1
Flowchart
CustomerSatisfaction
OSD Report Customer Survey
Discussion andoutput from QM and
EMS Review
Personnel Interfacewith customer’s
daily.
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Customer Satisfaction 8.2.1
ZiLOG monitors and measures customer satisfaction with an OSD (Original Schedule Date) performance report.The report tracks lot shipments against due dates.
Product lot is assigned a due date upon wafer starts based on the committed cycle-time for each process flow.
OSD performance is reviewed daily and the performance is measured monthly by line item against the due date.A percentage of hits vs misses is reported monthly.
Personnel interface daily with customers supports Customer Satisfaction.
ZiLOG utilizes this information along with the Customer Interface and Satisfaction Survey to measure ourcompany and our customers perception of our performance. This information is summarized and presented fordiscussion in the Quality and Environmental Management System Review.
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Customer Satisfaction 8.2.1
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsCustomer Satisfaction 8.2.1 SON4501-Mod II Planning Operations
SOB6031-Customer Interface and SatisfactionSON4503-Planning Procedures forManufacturing Partners (MP)QCB0402, Quality and EnvironmentalManagement System
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~Internal Quality Audits 8.2.2
Flowchart
Internal Audit Schedule created for theupcoming year
ISO9000 ISO14000
Internal AuditScheduled
Internal AuditScheduled
Not Received within10 days
Response rejected
Applicable individualnotified for re-
submissionQS verifies closure or action
items
Response receivedwithin 10 days
10 calendar days areallowed for response
QCAR submitted toapplicable manager
QCAR submitted toapplicable manager
QCAR completed if auditscore is less than 2
QCAR completed ifdiscrepancies are found
Internal AuditCompleted
Internal AuditCompleted
Director of QS will be notified tofacilitate obtaining a satisfactory
response
Quality Systems reviews response for completeness
Response accepted
Target closure date logged for tracking
QS verifies effectiveness of corrective / preventive actions during thenext scheduled internal audit.
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Internal Quality Audits 8.2.2
Internal Quality Auditing is an established system of planned audits which verifies compliance to specifications anddetermines effectiveness of the quality system.
At the beginning of each calendar year the audit schedule is completed by QS and is updated periodically. The audit plantakes into consideration the status and importance of the process's and area's to be audited, as well as results from previousaudits.
Internal Audits shall be performed by trained auditors independent of the operation(s).
The management, having direct responsibility for the area being audited, is responsible for effective, timely and efficientcorrective action.
Documented audit results, with the objective evidence of noncompliance's, are maintained in the audit files in the QSdepartment. A summary of the audits are reviewed during the ISO Review Meetings.
QS reviews all responses for completeness and accuracy. If the response is rejected, the applicable individual is notified.
QS verifies effective implementation of corrective actions, normally during the next audit.
Reference Document Matrix for appropriate procedures.
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Internal Quality Audits 8.2.2
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa ProceduresInternal Quality Audits 8.2.2 QCB0401 Internal Audit Procedures
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Monitoring and Measuring of Processes 8.2.3
Flowchart NA
ZiLOG monitors and measures the Quality Management System by a commitment to keep all desired outputs bothachievable and measurable. When planned results are not achieved there are actions identified in each of the individualprocess specifications.
Requirements are traceable through the entire process.
See also 8.1 and 8.5
Reference Document Matrix for appropriate procedures.
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Monitoring and Measuring of Processes 8.2.3
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa ProceduresMonitoring and Measuring ofProcesses
8.2.3 QCBXXXX-Quality ProceduresWFNXXXX- Process ProceduresSONXXXX-Standard OperatingProcedures
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Monitoring and Measuring of Product Requirements 8.2.4
Flowchart
Nonconforming Materialidentified with Hold Stickers
Incoming Quality Assessmentcompares material to
established requirements
Lot issued to production on thecomputer system. One step
tickets print for each operationto be performed.
Wafers Transferred to ShipArea
Product requirementinformation completed and
verified by operators.Nonconforming Material is
Held.
EngineeringDispositions
GOOD BAD
Shipper Information is verifiedPrior to Shipment
Rework SCRAP
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Monitoring and Measuring of Product Requirements 8.2.4
ZiLOG monitors and measures the Characteristics of the product throughout processing. Status of the product is identifiedby one step cards, work-in-process tracking system and physical location.
Incoming Quality Assessment checks raw materials and the results are documented. Rejected materials are segregated andlabeled with QC hold tags. Accepted materials are released for production use.
One-step cards are issued to production with identification entered into the WIP system for wafer lot traceability. Entriesare made, by the operators, into the WIP system and on one step cards for validation of product conformity.
Accepted wafers/Wafers meeting the steps specification values are released to the next operation and nonconformingwafers are segregated to a hold area. The segregated wafers are dispositioned by Engineering.
Accepted wafers are released into the process evaluation step known as process evaluation. This is the last step inprocessing at Nampa manufacturing. Specified parameter testing is completed and results are documented in the computersystem. Unacceptable wafers are segregated to Engineering hold areas for evaluation by Engineering and Quality.
Accepted product is transferred to the ship area to prepare for shipment.
The shipper information is verified previous to shipping.
Requirements are traceable through the entire process.
See also 7.1,8.1 and 8.4
Reference Document Matrix for appropriate procedures.
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Monitoring and Measuring of Product Requirements 8.2.4
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa ProceduresMonitoring and Measuring ofProduct Requirements
8.2.4 QCB1004 Incoming Inspection General ProcedureWFNXXXX Process Flowcharts/One Steps/ProcessSpecificationsSON1005 Logging and SupportQCB1003 Notice of Product VarianceQCB5000 C of C Generation for Manufacturing PartnerShipments
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Control of Nonconforming Product 8.3
Flowchart
Control methods areestablished for product not
conforming to specifiedrequirements.
Material Review board outlinesmethod of recovery or
eliminates nonconformingincoming material
Corrective Action isdocumented
Substandard material orproduct is reported to
authorized personnel fordisposition
Material/Product is labeled andsegregated
Specifications providediscrepant material reports,Notice of Product Variance
and/or Material Review Boarddisposition.
Discrepancy is identified atdiscovered location
Product/Materialis dispositioned
ReworkAccept without Repair
RegradeScrap
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Control of Nonconforming Product 8.3
Nonconforming product is controlled to ensure that product which does not conform to specified requirements is preventedfrom being used in manufacturing and/or shipped to our customers.
Any employee detecting substandard material or fabrication of wafers outside operational specifications has theresponsibility of reporting it to the authorized personnel for disposition.
Nonconforming material or product:a) is identified at the location of discrepancy,b) is labeled and segregated, when applicable,c) is dispositioned by authorized personnel,d) is traceable to a wafer lot,e) has documented corrective action,f) is released for rework or is waived and must be re-inspected in accordance with appropriate requirements,g) scrapped.h) records are archived per quality records retention.
Procedures identify the following forms for documentation of nonconforming product: Discrepant Material Services Report(DMSR), Notice of Product Variance (NOPV), Process Eval Waivers, Notice of Material Variance (NOMV), MaterialReview Board (MRB).
Disposition of product may be:a) rework to meet the specified requirements or;b) accept without repair or;c) regrade or;d) scrap
The MRB consists of representatives from Quality Systems, Purchasing and Materials and other interested parties. TheMRB dispositions all incoming nonconforming materials that cannot be dispositioned by a preliminary review.
In fab non-conforming material is dispositioned by Engineering and documented. In cases of Manufacturing Partner'sQuality is notified of non-conforming product and has the responsibility for notification to the affected partner as needed.
Reference Document Matrix for appropriate procedures.
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Control of Nonconforming Product 8.3
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsControl of NonconformingProduct
8.3 QCB1003 Notice of Product VarianceQCB1004 Incoming Inspection ProcedureWFNXXXX For Specific RequirementsSON1005 Logging and SupportWFN5000 Process EvaluationQCB1005 Disposition of Discrepant MaterialSOB2350 Failure Analysis ProcedureQCB5000 C of C Generation for Manufacturing PartnerShipments
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Analysis of Data 8.4
Flowchart
Inline Metrics
Process Evaluation(Electrical Test)
Send Notification ofWaiver
Report Sent toNampa
Probe
Scrap
Nampa Review Fails
Yes Yes
No Scrap Product andGenerate Scrap
Report
Yes
Yes
Yes
No
OK
Unacceptable
Make ImprovementAction Plan
No
Customer Satisfied
MeetRequirements?
Q.A.ApprovesWaiver?
No
Ship to Customer
IncomingRequirements
Met?
Disposition
YieldExpectations
Met?
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Analysis of Data 8.4
Electrical testing is performed on all lots produced to ensure that they meet product specifications.
No product is allowed to leave the building without either passing the electrical test or having a written waiver by QualityAssurance. Waivers for non-conforming product are sent to the customer for review.
All customers have their own incoming product inspection requirements. When they receive wafers from ZiLOG’s Nampamanufacturing facility, they check the wafers using whatever criterion they have established. A report for all non-conforming product is sent back to Nampa manufacturing for review, and the affected product may either be scrapped orused by the customer, depending on the nature and extent of the problem. All customer incoming fail data is compiled in alot rejection report, which is reviewed weekly by ZiLOG management.
All internal (ZiLOG) customers and most outside customers provide feedback on die yield, which is reviewed by ZiLOGmanagement as well. ZiLOG products die yield is monitored via a report that is generated daily.
The characteristics of the process are monitored using the inline monitoring and measurement procedures outlined insection 8.2.1.
The quality of our suppliers is monitored with a quarterly supplier evaluation.
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Analysis of Data 8.4
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsMeasurement, Analysis, andImprovement
8.4 QCB0350 Quality EscapesQCB1431 ZiLOG Nampa 8D ProcedureQCB2002 Final wafer inspection for internalFoundryWFN5000 Process Electrical Parametric TestLimitsWFN5001 HP4062 Process ElectricalEvaluation ProcedureSOB0050 Supplier Rating System
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Improvement 8.5
Flowchart
INPUT
CustomersFabrication Module Internal Audits
Raw Materials
WHO’SRESPONSIBLE?
As identified by applicable
REVIEWED BY?As defined in applicable
procedure
Does the issue merit acomprehensive
corrective /preventive action?
NOYES
IssueClose
8-DCorrective Action Initiated
WHO’S RESPONSIBLE?Department/Module Manager
EXTERNALINTERNAL
QualitySystems
Customer
QUALITY AND ENVIRONMENTAL REVIEWMEETINGS:
8D Corrective and Preventive actions are reviewed.
8D action items drive continual improvement.
Individual managers of work teams present other continual improvementactivities at this meeting.
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Improvement 8.5ZiLOG continually improves the effectiveness of the QMS through the use of the quality policy, quality objectives, auditresults, analysis of data, corrective and preventive actions and management reviews
Continual improvement activities conducted by individual or cross-functional groups will be reviewed at scheduled Qualityand Environmental Systems Management meetings.
Customers are surveyed to identify areas for improvement to ensure customer satisfaction.
Wafer sort data from subcons/customers sites provides electrical test failure analysis as a method to improve final testyields.
Customer complaints are conveyed to the Quality Department through the customer interface. In the event the customerforwards their preferred corrective and preventive action format, this will be used for our response. If not, ZiLOG willinitiate an internal 8D to record and forward our response to the customer.
Raw Materials not meeting specified requirements are recorded via the Disposition of Discrepant Material procedure.Corrective actions are implemented by the supplier and preventive actions, whether external or internal to ZiLOG arerecorded on the Discrepant Material/Service Report (DMSR).
Variances of received materials will be reported on a Notice of Material Variance (NOMV).
Nonconformances in-line are reported using notice of product variance (NOPV), Process Evaluation waivers, Workstreamlogging, statistical process control (SPC) and out of control action plans (OCAP).
Wafers not meeting requirements at p-eval, may be analyzed by engineering to determine cause.
In the case of Manufacturing Partner's, notification is provided to Quality through the automated Workstream system,Quality then reviews the NOPV. Additionally, the lot is placed on QS HOLD before shipment for Quality disposition. Theresponsibility of customer notification is the Nampa Quality Department's, as needed.
Corrective actions on major problems or issues are documented using the 8D format.
Anyone detecting a need for corrective or preventive action is responsible for reporting the problem to the propersupervisor/manager. Corrective action procedures are established, documented, maintained and include:
a) Description of the problem,b) Investigation to determine the root cause which may include: analyzing the process, impact on
product/customer and failure analysis,c) Implementation and recording changes to procedures with management approval, resulting from investigation,d) Review for effectiveness of the corrective and/or preventive action
Preventive actions are taken based upon systematic review of quality systems' information on product and work processes,procedures, output, site facilities, quality systems, internal and external customers, line and die yields.
Changes to procedures resulting from corrective and preventive actions are approved by management and are consideredsystem improvements.
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Improvement 8.5
The effectiveness of implemented corrective and preventative actions are reviewed.
Quality Control Audit Reports (QCAR) are issued to the responsible managers/designates for corrective or preventiveactions to audit discrepancies.
Preventive Actions, though similar to Corrective Actions, are usually associated with information analysis over a longerperiod of time. This information encompasses product quality, manufacturing, audit results, quality records, workprocesses, feedback on product quality output, site facilities, quality systems, internal and external customers, line and dieyield.
Each department is accountable for initiating the steps required to address the appropriate preventive actions within theirarea of responsibility. The Quality and Environmental Management Review will include a Preventive Action section wherespecific Quality System performance metrics will be examined for potential preventive action activity. Also in this portion,any specific preventive actions taken will be reviewed for their effectiveness. These will include Internal Audit, plant dieyield improvement and Nampa Quality Escapes.
The 8-D Corrective Action Report is applicable for all major problems or issues affecting the product quality, reliability,yield or customer complaints that merit a comprehensive corrective action strategy. The 8-D can become part of, or asupplement to, any type of corrective action report.
Reference Document Matrix for appropriate procedures.
See also sections 8.2.1, 8.2.2, and 8.4.
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Improvement 8.5
DOCUMENTATION MATRIX
Functional Elements ISO9001 Nampa DocumentsContinual Improvement 8.5.1 QCB0402 Quality and Environmental
Management SystemSOB6031-Customer Interface andSatisfactionOP204 – CPK Reports
Corrective Action 8.5.2QCB0350 Quality EscapesQCB0401 Internal Audit ProceduresQCB1003 Notice of Product VarianceQCB1004 Incoming Inspection ProcedureQCB1005 Disposition of DiscrepantMaterialQCB1007 Notice of Material VarianceQCB1431 ZiLOG Nampa 8D ProcedureSOB0024 Material Review Board (MRB)RequirementsSOB2350 Failure Analysis ProcedureWFN5001 HP4062 Process ElectricalEvaluation ProcedureSON4503- Planning Procedures forManufacturing Partners (MP)LRR Defectives Report
Preventive Action 8.5.3 QCB1431 ZiLOG Nampa 8D ProcedureQCB1005 Disposition of DiscrepantMaterial
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Glossary
GLOSSARY
AR: Appropriation Request
ASSP: Application Specific Standard Product
AVL: Approved Vendors List
CFA: Customer Failure Analysis
CMOS: Complementary Metal Oxide Semiconductor
CN: Change Notice
COC: Certificate of Conformance
Cp: Capability Index: Ratio of allowable variation to natural process variation; an indication of theprocess's capability to meet specifications.
Cpk: Capability Index: Ratio of allowable variation to natural process variation after taking intoaccount where the process is centered. An indication of the process's capability to meetspecifications.
CPS: Customer's Procurement Specifications
DC: Document Control
DCBXXXX: Document Control Boise (Specifications)
DMSR: Discrepant Material Service Report
DPC: Design Plan Review
FA: Failure Analysis
FAB: Fabrication, wafer fabrication area or Wafer FAB
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Glossary
FDP: Final Design Presentation
FET: Field Effect Transistor
FIT: Failure in Time
FVT: Final Verification Testing
IAY: Inventory Activity and Yield
IC: Integrated Circuit
IQA: Incoming Quality Assessment
ISO: International Standards Organization
MFG: Manufacturing Specification Index, Plate 1
Mod: Nampa Fabrication Module
MOS: Metal Oxide Semiconductor
MP: Manufacturing Partner = Foundry
MRB: Material Review Board
MSB: Material Specification Boise (Specifications)
N/A: Not applicable
NIST: National Institute of Standards and Technology
NMOS: N channel MOS technology
NOMV: Notice of Material Variance
NOPV: Notice of Product Variance
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Glossary
OP: Operational Plan or Report
OCAP: Out of Control Action Plan
PA: Product Analysis
PG: Pattern Generation
POL: Procedural Specification that contains ZiLOG's Policies
PPM: Parts per Million
PO: Purchase Order
PR: Purchase Requisition
PSC: Process Parameter Specification
PSI: Product Specification Index, Plate 2
QA: Quality Assurance
QCAR: Quality Control Audit Report
QCBXXXX: Quality Control Boise (Specifications)
QE: Quality Engineer
QR: Qual Summary
Q&R: Quality and Reliability
QS: Quality Systems
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Glossary
R&QA: Reliability and Quality Assurance
RE: Reliability Engineer
RFQ: Request for Quote
Rev: Revision
RMA: Return Material Authorization
SOBXXXX: Standard Operating Boise (Specifications)
SPC: Statistical Process Control
STR: Special Test Request
STWR: Special Test Work Request
UPC: Unit Operation Objectives
VLSI: Very Large Scale Integration
VP: Vice President
WFNXXXX: Wafer Fabrication Nampa (Specifications)
WIP: Work In Process
ZEPI: ZiLOG Electronic Philippines, Inc
ZPI: ZiLOG Philippines, Inc
ZUS: ZiLOG, United States
8-D: 8-Discipline Corrective Action Report
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QUALITY MANUAL REVIEW/CHANGE RECORD
Rev ChangeNumber Date Description of Change Issued By
20 30606 04-06-00 Complete Rewrite and Formatting C. Dobbs
21 30711 04-24-00 Update for Internal Foundry C. Dobbs
22 31936 02-20-01 Changes in response to QCAR0010-0019:Chg Department to Quality Systems,Chg Incoming Quality Control to IncomingQuality Assessment,Chg Foundry to Manufacturing Partner’s, &Add Manufacturing Partner’s, Section T.
C. Dobbs
23 32239 05-03-01 Change reference from DCB0003 toDCB0001 in Section E and correct titles inSection G.
C. Johnston
24 32426 06-28-01 Delete TSB0500X references and replacewith Device Specific References and correcttitle of TSB1802, Section G.Remove Classification Code and updateLogo.
C. Johnston
25 33033 12-19-01 Update Site Organization Chart and ChangeWafer Foundry Planning Spec fromSOB5019 to SON4503.
C. Dobbs
26 33980 09-24-02 Complete Rewrite C. Dobbs
27 34001 10-03-02 Change Management 5.1 thru 5.6, CustomerRelated Processes 7.2, Purchasing 7.4, andSON1005’s title throughout the manual.
C. Dobbs
28 34034 10-08-02 Add Scope and Exclusion of 7.5.2. V. Tait
29 34108 10-31-02 Add Site backup, disaster recovery and virusprotection to records control for ISO9001;2000 audit finder.
C. Dobbs
30 ID-QMB 01-30-03 Delete all references to QCB0220, themodule checklist procedure.
C. Dobbs
31 ID-QMB 02-13-03 Remove Module Checklist from the Internalaudit flowchart.
C. Dobbs
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