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o Antenna SiP active dies 107 Die View & Dimensions Delayering & main Blocs Die Process: On Board Isolation, Transceiver
Die Cross-Section Die Process Characteristic
Physical Comparison 144 5G technology: Sub-6 GHz vs. mmWave Connectivity mmWave Solution: WiGig vs. 5G
Manufacturing Process 147o Synthesis of the main partso Baseband Processor, Transceiver, PMIC Die Front-End Process & Fabrication Unito SiP process & Fabrication Unit
Cost Analysis 161o Synthesis of the cost analysiso Yields Explanation & Hypotheses 164
o Baseband Processor Module 166 Dies Front-End Cost Dies Wafer and Die Cost
Baseband SiP Packaging and Component Cost
o Antenna SiP Packaging 175 Dies Front-End Cost Dies Wafer and Die Cost
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Qualcomm SDX50M and QTM052.
The complete solution has been specially designed for smartphone application, starting with Samsung but quickly spread with Motorola, Xiaomi, … The module in the Samsung Galaxy S10 5G USA, comes with four systems spread in the smartphone. The first SiP is the baseband processor using a standard BGA SiP packaging coupling Flip-Chip and Wire bonding integration. The other systems are the antenna module that are spread at the corner of the smartphone in order to provide a spherical coverage. The modules are placed in the smartphone in order to provide a full coverage without any hand blocking constraint.
Two generation of the antenna module are integrated in the flagship. The first generation come with dipole antenna coupled with patch antenna. The patch antenna is designed in order to provide a wide band radiating system. Among the innovation in the antenna design, Qualcomm seems to integrate Aperture coupling patch, Dual Polarized Antenna, and Dual band Antenna. In the second generation, the component has been shrunk by almost 30 % in order to fit in the smartphone’s z-height.
This report includes a full investigation of the system, featuring a detailed study of the SiPs including die analyses, processes and board cross-sections. It contains a complete cost analysis and a selling price estimation of the system. Finally, it features an exhaustive comparison with the structure of the Sub-6 GHz chipset and the Qualcomm’s WiGig Chipset dedicated to handset.
Physical Analysis o Synthesiso Moduleo Board Cross-Sectiono Baseband SiP
Package SiP Cross-Section SiP Active Dies
o Antenna SiP Overview X-Ray Overview Package Antenna SiP Cross-Section Transceiver and PMIC Dies
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Antenna Module – Package Overview – X-Ray View
• Tomographic X-Ray view has been made on both generation of AoP to reveal the differences and the similarity. This analysis isnondestructive and allows us to virtually made cross section of the board. In this view, the silicon dies aren’t visible.
With the integration of the first mmWavechipset in a handset, Qualcomm hasstarted the 5G revolution early. We haveseen a first glimpse of how compatible thesystem could be to very high frequencyconnectivity. This year, we have seen theintroduction of real 5G connectivity, ledby Samsung. Starting with the Sub-6GHzapplication, Samsung launched its flagshipat the beginning of this year in SouthKorea. The second step was to release themmWave version in America inpartnership with Qualcomm, whichsupplies the complete chipset for thisversion.
The complete solution has been especiallydesigned for smartphone applications,starting with Samsung but soon to spreadto other designs from companies such asMotorola and Xiaomi. The module in theSamsung Galaxy S10 5G USA, comes withfour systems spread throughout thesmartphone. The first System-in-Package(SiP) is the baseband processor, whichuses standard Ball Grid Array (BGA) SiPpackaging, coupled with Flip-Chip andWire Bonding integration. The othersystems are the antenna module, whichare spread around the corner of thesmartphone in order to provide sphericalcoverage. The modules are placed in thesmartphone in order to provide fullcoverage without any hand-blockingconstraints.
Two generations of antenna modules areintegrated in the flagship. The firstgeneration comes with a dipole antennacoupled with a patch antenna.
The first generation comes with a dipoleantenna coupled with a patch antenna.The patch antenna is designed in order toprovide a wide-band radiating system.Among the innovations in the antennadesign, Qualcomm seems to integrate anAperture Coupling Patch, Dual PolarizedAntenna, and Dual-Band Antenna. In thesecond generation, the component hasbeen shrunk by almost 30% in order to fitin the smartphone’s z-height.
This report includes a full investigation ofthe system, featuring a detailed study ofthe SiPs, including die analyses, processesand board cross-sections. It contains acomplete cost analysis and a selling priceestimation of the system. Finally, itfeatures a technical comparison with thestructure of the Sub-6GHz chipset and theQualcomm’s WiGig chipset dedicated tohandsets.
COMPLETE TEARDOWN WITH
• Detailed photos and cross-sections
• Precise measurements
• Material analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated sales price
• Comparison with WiGig chipset for handset application
A study from modem to antenna of the very first compact-form 5G millimeter-wave chipset (AiP + BaseBand) for handset applications.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Qualcomm 5G mmWave Chipset
Pages: 194
Date: September 2019
Format: PDF & Excel file
Price: EUR 3,990
Qualcomm’s First 5G mmWave Chipset: SDX50M and QTM052
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
IntroductionCompany Profile and 5G TechnologySamsung Galaxy S10 5G USA TeardownMarket AnalysisPhysical Analysis
o Module view: dimensions, marking, integration and block diagram
• Main board analysiso Board overview and cross-section
• Baseband processor SiP analysiso Package view and dimensionso Package opening and bill of materialo Package cross-section: PCB, dimensionso Package process analysis
• Antenna SiP analysis: Gen. 1 and Gen. 2o Package view and dimensionso Package X-Ray: overall view, PCB
routing, antenna structure, cross-sections
o Package opening and bill of materialo Package cross-section: PCB, dimensionso Package process analysis
• Die analysis: Baseband processor, transceiver, PMIC
o Die view and dimensionso Die delayering and main block IDs
o Die cross-section and process• Physical analysis comparison
o Sub-6 vs. mmWaveo WiGig System vs. 5G system for
handsetsManufacturing Process Flow
• Die fabrication unit: Baseband processor, transceiver, PMIC
• Overview of the cost analysis• Supply chain description• Yield hypotheses• Die cost analyses: Baseband processor,
transceiver, PMICo Front-end costo Wafer and die costs
• Baseband and antenna SiP package cost analysis
o Baseband and antenna SiP front-end cost
o Baseband and antenna SiP ost by process step
• Final test cost• Final assembly• Component cost
Estimated Price Analysis
QUALCOMM'S FIRST 5G MMWAVE CHIPSET: SDX50M AND QTM052
RELATED REPORTS
AUTHORS
Dr. Stéphane Elisabeth has joinedSystem Plus Consulting's team in 2016.He has a deep knowledge of Materialscharacterizations and Electronicssystems. He holds an EngineeringDegree in Electronics and NumericalTechnology, and a PhD in Materials forMicroelectronics.
Nicolas Radufe is in charge of physicalanalysis at System Plus Consulting. Hehas a deep knowledge in chemical andphysical analyses. He previouslyworked in microelectronics R&D forCEA/LETI in Grenoble and forSTMicroelectronics in Crolles.
Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone EditionEarly glimpse of very compact form millimeter-wave chipset commercially available for handset applications.July 2018 - EUR 3,490*
RF Front-End Module Technical Comparison 2019Extensive overview of 100 RF Front-End modules and components found in eight leading flagship smartphones from Apple, Samsung, Huawei, Xiaomi, and Oppo.July 2018 - EUR 3,490*
Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/Xr SeriesSecond generation of mid/high band Front-End module with advanced and innovative packaging.February 2019 - EUR 3,990*
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REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTQUALCOMM'S FIRST 5G MMWAVE CHIPSET: SDX50M AND QTM052
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