2018 is a turning point for 5G communications. All players have done several studies on huge data rates using millimeter wave (mmWave) compared to current technologies. Today, manufacturers are focusing on backhaul applications with high power and no voltage limitation. But the next steps – such as handset applications - are gaining attention as integration will have several issues to solve, including chip implementation, packaging technology, antennae placement and heat management. Using the 60GHz band, the IEEE has licensed a Wi-Fi 802.11 protocol, known as WiGig. Today, a few routers and only one commercially available smartphone use this protocol, providing an early glimpse of 5G mobile capability and using Qualcomm’s chipset. This complete solution has been designed for smartphones, especially for ASUS. The module, integrated in the ASUS ZenFone 4 Pro, comes with two systems linked by a coaxial connection. Both Systems-in-Packages (SiPs) use non-conventional double-sided molded packaging developed by Murata. One is integrated on the main board and the other features innovative antennae integrated into an organic PCB. The latter SiP integrates almost 20 antennae, a radio frequency integrated circuit (RFIC) die, thermal management and isolation solution, all in a single package smaller than 40mm². Developed by Wilocity, which has been a Qualcomm subsidiary since 2014, the RFIC fea- tures up to four transceivers controlling up to 32 antennas, both patch and dipole, for beamforming at 60GHz. Both SiPs have very thin confined PCB substrates and embedded copper pillars realizing the signal distribution structure. This first integration of such a mmWave device in a handset shows the full compatibility of this SiP technology that could answer 5G integration issues. This report includes a full investigation of the system, featuring a detailed study of the SiPs and the antenna board including die analyses, processes and board cross-sections. It contains a complete cost analysis and a selling price estimation of the system. Finally, it features an exhaustive comparison with the Qualcomm QCA9500, which is dedicated to routers or mobile computers. Title: Qualcomm WiGig Chipset Smartphone Edition Pages: 157 Date: July 2018 Format: PDF & Excel file Price: EUR 3,490 Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY Early glimpse of very compact form millimeter-wave chipset commercially available for handset applications. REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT COMPLETE TEARDOWN WITH • Detailed photos and cross-sections • Precise measurements • Material analysis • Manufacturing process flow • Supply chain evaluation • Manufacturing cost analysis • Comparison with QCA9500 chipset for router applications • Estimated sales price
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2018 is a turning point for 5G communications.All players have done several studies on hugedata rates using millimeter wave (mmWave)compared to current technologies. Today,manufacturers are focusing on backhaulapplications with high power and no voltagelimitation. But the next steps – such as handsetapplications - are gaining attention asintegration will have several issues to solve,including chip implementation, packagingtechnology, antennae placement and heatmanagement. Using the 60GHz band, the IEEEhas licensed a Wi-Fi 802.11 protocol, known asWiGig. Today, a few routers and only onecommercially available smartphone use thisprotocol, providing an early glimpse of 5Gmobile capability and using Qualcomm’schipset.
This complete solution has been designed forsmartphones, especially for ASUS. The module,integrated in the ASUS ZenFone 4 Pro, comeswith two systems linked by a coaxialconnection. Both Systems-in-Packages (SiPs)use non-conventional double-sided moldedpackaging developed by Murata. One isintegrated on the main board and the otherfeatures innovative antennae integrated into anorganic PCB. The latter SiP integrates almost 20antennae, a radio frequency integrated circuit(RFIC) die, thermal management and isolationsolution, all in a single package smaller than40mm².
Developed by Wilocity, which has been aQualcomm subsidiary since 2014, the RFIC fea-
tures up to four transceivers controlling up to32 antennas, both patch and dipole, forbeamforming at 60GHz. Both SiPs have verythin confined PCB substrates and embeddedcopper pillars realizing the signal distributionstructure. This first integration of such ammWave device in a handset shows the fullcompatibility of this SiP technology that couldanswer 5G integration issues.
This report includes a full investigation of thesystem, featuring a detailed study of the SiPsand the antenna board including die analyses,processes and board cross-sections. It containsa complete cost analysis and a selling priceestimation of the system. Finally, it features anexhaustive comparison with the QualcommQCA9500, which is dedicated to routers ormobile computers.Title: Qualcomm WiGig
Chipset Smartphone Edition
Pages: 157
Date: July 2018
Format: PDF & Excel file
Price: EUR 3,490
Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
Early glimpse of very compact form millimeter-wave chipset commerciallyavailable for handset applications.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
COMPLETE TEARDOWN WITH
• Detailed photos and cross-sections
• Precise measurements
• Material analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Comparison with QCA9500 chipsetfor router applications
• Estimated sales price
Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition
• Die analysis: Current and voltage regulator, memory
Die view and dimensions
AUTHORS
Die cross-section
Die process
• Physical analysis comparison
SiP vs discrete
Femtocell vs. smartphones application:
system, size and features, antennae
Manufacturing process flow
• Die fabrication unit: Baseband processor, RFIC
• Packaging fabrication unit
• SiP package process flow
Cost Analysis
• Overview of the cost analysis
• Supply chain description
• Yield hypotheses
• Die cost analyses: Baseband processor, RFIC
Front-end cost
Wafers and die costs
• Baseband and Antenna SiP Package cost analysis
Baseband and antenna SiP front-end cost
Baseband and antenna SiP cost by process step
• Final test cost
• Final assembly
• Component cost
Estimated Price Analysis
Qualcomm VIVE® QCA9500High Density WiGig/WiFi802.11ad Chipset for the 60GHz BandDisruptive double side moldedsystem-in-package-based chipset formillimeter-wave applications tar-geting consumer devices, includingintegrated antennae.January 2018 - EUR 3,990*
RF Front-End Module Comparison2018Extensive overview of 40 RF Front-End modules and components foundin 10 flagship products, includingthe Apple Watch Series 3, iPhone 8and X, Samsung Galaxy S8, HuaweiP10, Asus Zenfone4 Pro, Sony XZsand Xiaomi Mi6.May 2018 - Price: EUR 6,490*
Advanced RF SiPs for CellPhones: Reverse CostingOverviewPhysical analyses and cost estimationof radio-frequency Systems-in-Packages from Skyworks Solutions,Murata, TDK-Epcos, Qorvo andBroadcom/Avago.November 2017 - EUR 4,990*
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Dr Stéphane Elisabeth has joinedSystem Plus Consulting's team in2016. He has a deep knowledge ofMaterials characterizations andElectronics systems.He holds an Engineering Degree inElectronics and NumericalTechnology, and a PhD inMaterials for Microelectronics.
Yvon Le Goff has joined SystemPlus Consulting in 2011, in order tosetup the laboratory of SystemPlus Consulting. He previouslyworked during 25 years in AtmelNantes Technological AnalysisLaboratory as fab support inphysical analysis, and 3 years atHirex Engineering in Toulouse, in aDPA lab.
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REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTQualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition
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